This paper presents the process challenges for the fabrication of 0-level packages using chip cap... more This paper presents the process challenges for the fabrication of 0-level packages using chip capping with through silicon via's (TSV) in the capping chip/wafer. The key processing challenges addressed include the fabrication of TSVs on capping wafers that are thinned down to 100μm and further, the Cu/Sn/Cu diffusion soldering to make an intermetallic bond for the chip capping. Integration of the TSVs on the cap wafer enables the vertical interconnection, thus making the package with a small form factor and readiness for 3D integration. The Cu/Sn/Cu bond and seal process provides a hermetic package and at the same time provide electrical connection between the cap and the device wafer. Adequate processing conditions are proposed.
Please be patient while the object screen loads. Change Site View : Select a site… UCL FUNDP FUSL... more Please be patient while the object screen loads. Change Site View : Select a site… UCL FUNDP FUSL FUCaM. ...
2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018
Herein, we report about the monolithic integration of a unique photonic stack on top of a CMOS im... more Herein, we report about the monolithic integration of a unique photonic stack on top of a CMOS imager using a dedicated fabrication process. The system key components consists of silicon nitride (SiNy) optical waveguides, sloped input mirror, grating in/out-couplers, and copper-based vertical mirrors defining the resonator boundaries. The stack is optimized for operation in the NIR range (800–900nm). Up to the authors' knowledge, this is the first demonstration of a fully integrated photonic stack including a sloped metal mirror combined with SiNy waveguide technology. The photonic build-up can be used for various applications among them is absorption spectroscopy as demonstrated hereafter.
The paper deals with finite element analysis of damped modal vibrations Q-factor values determine... more The paper deals with finite element analysis of damped modal vibrations Q-factor values determined by thermal-elastic damping in micro-electrical-mechanical systems (MEMS). Mathematically the problem is formulated as a complex eigenvalue problem. Verification problems have been solved by using several computational environments and different presentations of model equations in order to comprehend and reduce the influence of rounding errors. The analysis of damped modal properties of selected real MEMS resonator revealed the main features of thermal-elastic damping by taking into account 3D geometry of the resonator and anchoring (clamping) structure.
2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015
This work presents the co-design and simulation of a self-excited MEMS-CMOS oscillator. The devic... more This work presents the co-design and simulation of a self-excited MEMS-CMOS oscillator. The device consists of an electrostatic MEMS actuator, a DC source and a resistive circuit switched by the actuator's displacement. The MEMS device is modeled after an existing device. A CMOS circuit is proposed for the displacement detection and the switching mechanism. The oscillator is capable of sustaining oscillations autonomously and exhibiting periodic and aperiodic behavior. The proposed oscillator can process electronic as well as nonelectronic information. The oscillator behavior is highly sensitive to stimuli which makes it a good candidate to be used as an enhanced sensor or in systems of coupled oscillators.
The influence of air damping on the mechanical response of MEMS devices is investigated in this p... more The influence of air damping on the mechanical response of MEMS devices is investigated in this paper, using capacitive RF-MEMS switches with perforated parallel-plate electrodes as test vehicles. A twofold approach is used to analyse the damping coefficient as a function of ambient pressure. First, the up-state damping coefficient is extracted from resonance frequency measurements. Next, the position-dependent damping coefficient is extracted from closing-time measurements on the RF-MEMS switches. With these measurements, a Simulink model is adjusted to correctly simulate the closing time and trajectory of the switch.
This paper presents the process challenges for the fabrication of 0-level packages using chip cap... more This paper presents the process challenges for the fabrication of 0-level packages using chip capping with through silicon via's (TSV) in the capping chip/wafer. The key processing challenges addressed include the fabrication of TSVs on capping wafers that are thinned down to 100μm and further, the Cu/Sn/Cu diffusion soldering to make an intermetallic bond for the chip capping. Integration of the TSVs on the cap wafer enables the vertical interconnection, thus making the package with a small form factor and readiness for 3D integration. The Cu/Sn/Cu bond and seal process provides a hermetic package and at the same time provide electrical connection between the cap and the device wafer. Adequate processing conditions are proposed.
Please be patient while the object screen loads. Change Site View : Select a site… UCL FUNDP FUSL... more Please be patient while the object screen loads. Change Site View : Select a site… UCL FUNDP FUSL FUCaM. ...
2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018
Herein, we report about the monolithic integration of a unique photonic stack on top of a CMOS im... more Herein, we report about the monolithic integration of a unique photonic stack on top of a CMOS imager using a dedicated fabrication process. The system key components consists of silicon nitride (SiNy) optical waveguides, sloped input mirror, grating in/out-couplers, and copper-based vertical mirrors defining the resonator boundaries. The stack is optimized for operation in the NIR range (800–900nm). Up to the authors' knowledge, this is the first demonstration of a fully integrated photonic stack including a sloped metal mirror combined with SiNy waveguide technology. The photonic build-up can be used for various applications among them is absorption spectroscopy as demonstrated hereafter.
The paper deals with finite element analysis of damped modal vibrations Q-factor values determine... more The paper deals with finite element analysis of damped modal vibrations Q-factor values determined by thermal-elastic damping in micro-electrical-mechanical systems (MEMS). Mathematically the problem is formulated as a complex eigenvalue problem. Verification problems have been solved by using several computational environments and different presentations of model equations in order to comprehend and reduce the influence of rounding errors. The analysis of damped modal properties of selected real MEMS resonator revealed the main features of thermal-elastic damping by taking into account 3D geometry of the resonator and anchoring (clamping) structure.
2015 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015
This work presents the co-design and simulation of a self-excited MEMS-CMOS oscillator. The devic... more This work presents the co-design and simulation of a self-excited MEMS-CMOS oscillator. The device consists of an electrostatic MEMS actuator, a DC source and a resistive circuit switched by the actuator's displacement. The MEMS device is modeled after an existing device. A CMOS circuit is proposed for the displacement detection and the switching mechanism. The oscillator is capable of sustaining oscillations autonomously and exhibiting periodic and aperiodic behavior. The proposed oscillator can process electronic as well as nonelectronic information. The oscillator behavior is highly sensitive to stimuli which makes it a good candidate to be used as an enhanced sensor or in systems of coupled oscillators.
The influence of air damping on the mechanical response of MEMS devices is investigated in this p... more The influence of air damping on the mechanical response of MEMS devices is investigated in this paper, using capacitive RF-MEMS switches with perforated parallel-plate electrodes as test vehicles. A twofold approach is used to analyse the damping coefficient as a function of ambient pressure. First, the up-state damping coefficient is extracted from resonance frequency measurements. Next, the position-dependent damping coefficient is extracted from closing-time measurements on the RF-MEMS switches. With these measurements, a Simulink model is adjusted to correctly simulate the closing time and trajectory of the switch.
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Papers by Harrie Tilmans