Matteo Fabbri

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Leonor Peña-Chocarro

CSIC (Consejo Superior de Investigaciones Científicas-Spanish National Research Council)

Tate Paulette

North Carolina State University

Juan Carlos Moreno Garcia

Centre National de la Recherche Scientifique / French National Centre for Scientific Research

António Faustino Carvalho

University of Algarve

Tymon de Haas

University of Groningen

Belén Luna

University of Castilla-La Mancha

Manuel Ñique_Alvarez

Universidad nacional de cañete

Agustin Garcia

Universidad Nacional Autónoma de México

Santiago Alberto Casas Luna

Universidad Nacional de San Martin

Javier Lario

Universidad Nacional de Educación a Distancia

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Papers by Matteo Fabbri

Heat Removal Using Narrow Channels, Sprays and Microjets

Microscale Heat Transfer Fundamentals and Applications

Electronic Circuit Board with a Thermal Capacitor

Microchip cooling module based on FC72 slot jet arrays without cross-flow

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

ABSTRACT In view of the rapid increase of microchip power densities, thermal management has becom... more ABSTRACT In view of the rapid increase of microchip power densities, thermal management has become considerably more challenging. This work presents the first results of an effort aimed at developing a liquid-based cooling module capable of handling high heat fluxes. Four modules 20 times 20 times 2 mm3 in size, containing as many as 120 planar (&quot;slot&quot;) jets and a drainage channel system that prevented any cross-flow effect, were tested using FC72 as test fluid. The jet hydraulic diameters were between 173 and 310 mum, with larger drainage channels, 701 to 955 mum in diameter, located between the inlet jets. A custom-made heater resembling an actual microchip was manufactured from silicon and equipped with temperature sensors. The effects of the flow rate, the inlet liquid temperature, the gap between impinged surface and nozzle plate, and different module geometries are discussed. A maximum of 92 W/cm2 was removed at a junction temperature of 85 degC using a coolant flow of 1.46 l/min and an inlet temperature of 20 degC

High heat flux flow boiling in silicon multi-microchannels – Part II: Heat transfer characteristics of refrigerant R245fa

International Journal of Heat and Mass Transfer, 2008

... Lyon 1 B View the MathML source t. Sadi Carnot, INSA-Lyon, F-69621 Villeurbanne Cedex, France... more

State of the Art of High Heat Flux Cooling Technologies

Heat Transfer Engineering, 2007

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Comparative Study of Spray and Multiple Micro Jets Cooling for High Power Density Electronic Applications

Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 2003

Direct cooling by means of jets and sprays has been considered a solution to the problem of cooli... more Direct cooling by means of jets and sprays has been considered a solution to the problem of cooling high power density electronic devices. Although both methods are capable of very high heat removal rates it is necessary to be able to decide which one is more convenient than the other when designing a cooling system for electronic applications. In this work the results of an investigation of the performances of sprays and arrays micro jets are reported. Experiments have been conducted using HAGO nozzles and orifice plates to create droplet sprays and arrays of micro jets, respectively. The liquid jets had diameters ranging from 50 to 150 µm and the pitches between the jets were 1, 2, and 3 mm. The test fluid was deionized water and the jet Reynolds number ranged between 90 and 2600. A comparison of the results obtained employing both sprays and jets has been carried out. The micro jets have dimensions of the same magnitude or smaller than those of the electronic components. The micro jet arrays give better heat transfer rates than the large diameter ones studied in the past and they use liquid mass flow rates similar to those used by the sprays.

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Heat Removal Using Narrow Channels, Sprays and Microjets

Microscale Heat Transfer Fundamentals and Applications

Electronic Circuit Board with a Thermal Capacitor

Microchip cooling module based on FC72 slot jet arrays without cross-flow

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium

High heat flux flow boiling in silicon multi-microchannels – Part II: Heat transfer characteristics of refrigerant R245fa

International Journal of Heat and Mass Transfer, 2008

... Lyon 1 B View the MathML source t. Sadi Carnot, INSA-Lyon, F-69621 Villeurbanne Cedex, France... more

State of the Art of High Heat Flux Cooling Technologies

Heat Transfer Engineering, 2007

Download

Comparative Study of Spray and Multiple Micro Jets Cooling for High Power Density Electronic Applications

Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 2003

Download

Matteo Fabbri

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