PROBLEM TO BE SOLVED: To provide an electrical circuit material which exhibits improved dissipati... more PROBLEM TO BE SOLVED: To provide an electrical circuit material which exhibits improved dissipation factor and low tackiness and is of low cost, and whose incombustibility, improved CTE and dielectric constant are adjustable in accordance with the requirement. SOLUTION: The electrical circuit material comprises (a) 25-50 vol.% of a thermosetting composition comprising a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene-containing polymer which can participate in the crosslinking with the polybutadiene or polyisoprene resin, (b) 10-40 vol.% of a woven fabric, (c) 5-60 vol.% of a particulate, preferably ceramic filler and (d) a peroxide cure initiator. COPYRIGHT: (C)1996,JPO
L'invention concerne un procede de fabrication d'un tissu presentant des motifs ou des de... more L'invention concerne un procede de fabrication d'un tissu presentant des motifs ou des dessins de couleurs differentes distincts et precis. Ce procede comprend plusieurs etapes consistant (a) a produire un premier et un second polyamide, ces polyamides presentant des concentrations differentes de groupes d'amine, (b) a produire un premier et un second polyamides presentant des concentrations differentes de groupes terminaux de carboxyl et de groupes de sulfonate ; (c) a produire un premier fil a partir du premier polyamide et un second fil a partir du second polyamide ; (d) a fabriquer un tissu presentant des premieres zones de surface definies par le premier fil et des secondes zones de surface definies par le second fil ; et (e) a colorer chimiquement ledit tissu dans un bain de coloration contenant au moins une teinture anionique (acide) et au moins une coloration cationique (basique), le premier fil et, par consequent, les premieres zones de surface etant colorees pr...
ON PROPOSE UN STRATIFIE FLEXIBLE POUR CIRCUITS COMPORTANT UNE COUCHE DE POLYMERE FLUORE RENFORCE ... more ON PROPOSE UN STRATIFIE FLEXIBLE POUR CIRCUITS COMPORTANT UNE COUCHE DE POLYMERE FLUORE RENFORCE PAR VERRE INTERPOSEE ENTRE UN SUBSTRAT DE POLYIMIDE ET UN TRACE DE CUIVRE CONDUCTEUR. LE POLYMERE FLUORE RENFORCE PAR VERRE JOUE LE ROLE DE COLLE A HAUTE RESISTANCE D'ADHESION ENTRE LE POLYIMIDE ET LE TRACE CONDUCTEUR DE CUIVRE. LE POLYMERE FLUORE RENFORCE PAR VERRE CONTRIBUE EGALEMENT A AMELIORER LA STABILITE DIMENTIONNELLE AINSI QUE LES CARACTERISTIQUES ELECTRIQUES. LA TENEUR EN MICROVERRE EST COMPRISE, DE PREFERENCE, ENTRE ENVIRON 4 ET ENVIRON 30 EN POIDS ET, DE PREFERENCE ENCORE, EST D'ENVIRON 20 EN POIDS DE VERRE. DANS UN PROCEDE POUR FABRIQUER LE STRATIFIE FLEXIBLE POUR CIRCUITS, LE SUBSTRAT DE POLYIMIDE SUBIT, DE PREFERENCE, UN TRAITEMENT DE SURFACE AVEC MICRODECAPAGE ALCALIN SUIVI PAR UN RINCAGE, UN SECHAGE ET UN ASSEMBLAGE PAR STRATIFICATION AU POLYMERE FLUORE RENFORCE PAR MICROVERRE ET AUX COUCHES DE CUIVRE.
L'INVENTION CONCERNE UN MATERIAU DE CIRCUIT LAMIFIE. LE MATERIAU DE CIRCUIT LAMIFIE DE L'... more L'INVENTION CONCERNE UN MATERIAU DE CIRCUIT LAMIFIE. LE MATERIAU DE CIRCUIT LAMIFIE DE L'INVENTION COMPREND UNE PREMIERE COUCHE28 D'UNE PELLICULE D'UN POLYIMIDE; UNE PREMIERE COUCHE30 D'UNE PELLICULE D'UN FLUOROPOLYMERE DEPOSEE SUR CETTE PREMIERE COUCHE28 DE PELLICULE DE POLYIMIDE; AINSI QU'UNE PELLICULE32 D'UN FLUOROPOLYMERE RENFORCE DE VERRE DEPOSEE SUR CETTE PREMIERE COUCHE DE PELLICULE DE FLUOROPOLYMERE30. LE MATERIAU DE L'INVENTION EST UTILISE POUR DES CIRCUITS LAMIFIES FLEXIBLES EN VUE DE LA TRANSMISSION DE SIGNAUX ELECTRONIQUES A GRANDE VITESSE.
The increasing use of high switching speed systems in both microwave electronics and high speed l... more The increasing use of high switching speed systems in both microwave electronics and high speed logic devices has created the need for printed circuit boards which are based on low dielectric constant and low loss materials. In addition, these circuit materials must be capable of withstanding elevated temperatures typical of hostile service environments and of board fabrication processes. Such low dielectric constant rigid boards are commercially available from a few sources. However, there is a growing demand for low dielectric constant flexible printed circuit boards for interconnecting rigid boards or in rigid/flex applications where high speed, fast rise times, controlled impedance and low crosstalk are important. A new family of thin laminates which are suitable for fabrication of flexible low dielectric constant printed circuit boards have been developed by Rogers Corporation. These circuit materials are called ROhyphen;2500 laminates and offer flexible interconnections in hig...
An open-cell network of 99-33 weight % of a microfibrous, inert inorganic oxide (silicon, alumini... more An open-cell network of 99-33 weight % of a microfibrous, inert inorganic oxide (silicon, aluminium ortitanium)is strengthened by acoating of 1-70 weight % of a polymer (vinyl homopolymers, copolymers of polystyrene). The composition contains 30-99% open cells by volume.
A silver/nylon 6,6 nanocomposite containing 1 wt % metallic silver has been produced from an aque... more A silver/nylon 6,6 nanocomposite containing 1 wt % metallic silver has been produced from an aqueous solution of silver nitrate in the presence of ammonia and ethylene glycol by an ultrasound-assisted reduction method. The structure and properties of nylon 6,6 coated with silver have been characterized with X-ray diffraction, transmission electron microscopy, scanning electron microscopy, energy-dispersive X-ray, X-ray photoelectron spectroscopy, Raman spectroscopy, and diffused reflection spectroscopy measurements. The nanocrystals of pure silver, 50-100 nm in size, are finely dispersed on the polymer surface without damaging the nylon 6,6 structure. This silver-nylon nanocomposite is stable to many washing cycles and thus can be used as a master batch for the production of nylon yarn by melting and spinning processes. The fabric knitted from this yarn has shown excellent antimicrobial properties. 2007 Wiley Period-
PROBLEM TO BE SOLVED: To provide an electrical circuit material which exhibits improved dissipati... more PROBLEM TO BE SOLVED: To provide an electrical circuit material which exhibits improved dissipation factor and low tackiness and is of low cost, and whose incombustibility, improved CTE and dielectric constant are adjustable in accordance with the requirement. SOLUTION: The electrical circuit material comprises (a) 25-50 vol.% of a thermosetting composition comprising a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene-containing polymer which can participate in the crosslinking with the polybutadiene or polyisoprene resin, (b) 10-40 vol.% of a woven fabric, (c) 5-60 vol.% of a particulate, preferably ceramic filler and (d) a peroxide cure initiator. COPYRIGHT: (C)1996,JPO
L'invention concerne un procede de fabrication d'un tissu presentant des motifs ou des de... more L'invention concerne un procede de fabrication d'un tissu presentant des motifs ou des dessins de couleurs differentes distincts et precis. Ce procede comprend plusieurs etapes consistant (a) a produire un premier et un second polyamide, ces polyamides presentant des concentrations differentes de groupes d'amine, (b) a produire un premier et un second polyamides presentant des concentrations differentes de groupes terminaux de carboxyl et de groupes de sulfonate ; (c) a produire un premier fil a partir du premier polyamide et un second fil a partir du second polyamide ; (d) a fabriquer un tissu presentant des premieres zones de surface definies par le premier fil et des secondes zones de surface definies par le second fil ; et (e) a colorer chimiquement ledit tissu dans un bain de coloration contenant au moins une teinture anionique (acide) et au moins une coloration cationique (basique), le premier fil et, par consequent, les premieres zones de surface etant colorees pr...
ON PROPOSE UN STRATIFIE FLEXIBLE POUR CIRCUITS COMPORTANT UNE COUCHE DE POLYMERE FLUORE RENFORCE ... more ON PROPOSE UN STRATIFIE FLEXIBLE POUR CIRCUITS COMPORTANT UNE COUCHE DE POLYMERE FLUORE RENFORCE PAR VERRE INTERPOSEE ENTRE UN SUBSTRAT DE POLYIMIDE ET UN TRACE DE CUIVRE CONDUCTEUR. LE POLYMERE FLUORE RENFORCE PAR VERRE JOUE LE ROLE DE COLLE A HAUTE RESISTANCE D'ADHESION ENTRE LE POLYIMIDE ET LE TRACE CONDUCTEUR DE CUIVRE. LE POLYMERE FLUORE RENFORCE PAR VERRE CONTRIBUE EGALEMENT A AMELIORER LA STABILITE DIMENTIONNELLE AINSI QUE LES CARACTERISTIQUES ELECTRIQUES. LA TENEUR EN MICROVERRE EST COMPRISE, DE PREFERENCE, ENTRE ENVIRON 4 ET ENVIRON 30 EN POIDS ET, DE PREFERENCE ENCORE, EST D'ENVIRON 20 EN POIDS DE VERRE. DANS UN PROCEDE POUR FABRIQUER LE STRATIFIE FLEXIBLE POUR CIRCUITS, LE SUBSTRAT DE POLYIMIDE SUBIT, DE PREFERENCE, UN TRAITEMENT DE SURFACE AVEC MICRODECAPAGE ALCALIN SUIVI PAR UN RINCAGE, UN SECHAGE ET UN ASSEMBLAGE PAR STRATIFICATION AU POLYMERE FLUORE RENFORCE PAR MICROVERRE ET AUX COUCHES DE CUIVRE.
L'INVENTION CONCERNE UN MATERIAU DE CIRCUIT LAMIFIE. LE MATERIAU DE CIRCUIT LAMIFIE DE L'... more L'INVENTION CONCERNE UN MATERIAU DE CIRCUIT LAMIFIE. LE MATERIAU DE CIRCUIT LAMIFIE DE L'INVENTION COMPREND UNE PREMIERE COUCHE28 D'UNE PELLICULE D'UN POLYIMIDE; UNE PREMIERE COUCHE30 D'UNE PELLICULE D'UN FLUOROPOLYMERE DEPOSEE SUR CETTE PREMIERE COUCHE28 DE PELLICULE DE POLYIMIDE; AINSI QU'UNE PELLICULE32 D'UN FLUOROPOLYMERE RENFORCE DE VERRE DEPOSEE SUR CETTE PREMIERE COUCHE DE PELLICULE DE FLUOROPOLYMERE30. LE MATERIAU DE L'INVENTION EST UTILISE POUR DES CIRCUITS LAMIFIES FLEXIBLES EN VUE DE LA TRANSMISSION DE SIGNAUX ELECTRONIQUES A GRANDE VITESSE.
The increasing use of high switching speed systems in both microwave electronics and high speed l... more The increasing use of high switching speed systems in both microwave electronics and high speed logic devices has created the need for printed circuit boards which are based on low dielectric constant and low loss materials. In addition, these circuit materials must be capable of withstanding elevated temperatures typical of hostile service environments and of board fabrication processes. Such low dielectric constant rigid boards are commercially available from a few sources. However, there is a growing demand for low dielectric constant flexible printed circuit boards for interconnecting rigid boards or in rigid/flex applications where high speed, fast rise times, controlled impedance and low crosstalk are important. A new family of thin laminates which are suitable for fabrication of flexible low dielectric constant printed circuit boards have been developed by Rogers Corporation. These circuit materials are called ROhyphen;2500 laminates and offer flexible interconnections in hig...
An open-cell network of 99-33 weight % of a microfibrous, inert inorganic oxide (silicon, alumini... more An open-cell network of 99-33 weight % of a microfibrous, inert inorganic oxide (silicon, aluminium ortitanium)is strengthened by acoating of 1-70 weight % of a polymer (vinyl homopolymers, copolymers of polystyrene). The composition contains 30-99% open cells by volume.
A silver/nylon 6,6 nanocomposite containing 1 wt % metallic silver has been produced from an aque... more A silver/nylon 6,6 nanocomposite containing 1 wt % metallic silver has been produced from an aqueous solution of silver nitrate in the presence of ammonia and ethylene glycol by an ultrasound-assisted reduction method. The structure and properties of nylon 6,6 coated with silver have been characterized with X-ray diffraction, transmission electron microscopy, scanning electron microscopy, energy-dispersive X-ray, X-ray photoelectron spectroscopy, Raman spectroscopy, and diffused reflection spectroscopy measurements. The nanocrystals of pure silver, 50-100 nm in size, are finely dispersed on the polymer surface without damaging the nylon 6,6 structure. This silver-nylon nanocomposite is stable to many washing cycles and thus can be used as a master batch for the production of nylon yarn by melting and spinning processes. The fabric knitted from this yarn has shown excellent antimicrobial properties. 2007 Wiley Period-
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