In this work the development and characterisation of a very thin flexible substrate, with thickne... more In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module.
A free standing Co3O4 nanowire/nanoflower hybrid structure on flexible carbon fibre cloth (CFC) w... more A free standing Co3O4 nanowire/nanoflower hybrid structure on flexible carbon fibre cloth (CFC) was designed via a facile hydrothermal approach followed by thermal treatment in air.
The potential of using nanometallic wires inside a matrix as new generation of thermal interface ... more The potential of using nanometallic wires inside a matrix as new generation of thermal interface material led us to study the thermal diffusivity of nickel nanowires embedded inside porous alumina template. Thermal diffusivity measurements using a laser flash method showed size dependence for nickel nanowires inside nanochannel alumina (NCA) templates having nominal pore diameters of 200, 100, and 20 nm. Nickel nanowires embedded inside these templates showed decreasing diffusivity values of 10.7×10-6, 8.5×10-6, and 6.5×10-6 m2 s-1 at 300 K with decreasing wire diameter when deposited at 40 °C. Nanowires fabricated at 60 °C showed similar decreasing diffusivity with wire diameter, and a further 42%-48% reduction was observed when compared to 40 °C samples. The modified effective medium theory (MEMT) was employed to evaluate the experimental thermal diffusivity. Calculations based on MEMT resulted in mean thermal conductivities of 70.7 and 36.2 W m-1 K-1 for nickel nanowires fabricated at 40 and 60 °C respectively. These values are ~20% and 60% lower than the thermal conductivity value of bulk nickel. A strong grain size dependence of thermal diffusivity in the nanowires was observed. It is believed that the decrease in diffusivity in lower temperature wires is associated with defects/dislocations in large single crystals and reduction in wire diameters according to pore diameters of NCA. Whereas in higher temperature wires, the drastic reduction in diffusivity is believed to arise from self-similar fractal morphology composed of nanogranules, close to the dimension of electron mean free path.
Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation ha... more Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation have opened-up the possibility of constructing materials that directly include considerable computing power. We present an architecture for the hardware/software co-design of such “augmented” materials that allows designers to address the links between the physical and informational properties of artefacts. The architecture is highly modular in terms of sensor, communications, power and processing capabilities, and utilises an advanced semantically well-founded software model.
ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication di... more ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication discusses the prospect of using NMRC's 25mm wireless sensor node in conjunction with other sensor motes. The NMRC node is the Institute's specification for future autonomous ...
This paper reports on the development of a 3D interconnection process leading to the successful a... more This paper reports on the development of a 3D interconnection process leading to the successful assembly of a five-layer 3-D 1 mm cube module. This proof of concept module demonstrates the capability for successful integration and interconnection of commercial off the shelf components to fabricate functional modules in 1 mm cube dimensions. It also demonstrates that use of established volume scale technologies like flip-chip dicing and patterning techniques are viable for fabricating these 1 mm modules. The demonstrator consists of LED's bonded to the six sides of the 1 mm cube, interconnected and powered up. The work particularly report on two different processes to fabricate the interconnection pattern using direct focused ion beam (FIB) assisted Pt deposition and electroless metal deposition, which again patterned by FIB. Uniform thickness of the deposit and excellent coverage on all six sides is achieved by electroless nickel deposition. Voltage current characterisation of the deposited Pt shows a resistivity value of 1864 plusmn 100 muOmega cm, whereas electroless Ni film shows a resistivity of 25 muOmega cm due to boron inclusion. 100 nm Au layer is deposited by chemical displacement reaction to enhance the conductivity and solderability of the film
Journal of Micromechanics and Microengineering, 2006
This paper investigates the effects of thinning on different properties of silicon test die. Sili... more This paper investigates the effects of thinning on different properties of silicon test die. Silicon test wafers of different thicknesses (525, 250, 100 and 50 µm) were thinned using a mechanical grinding process. The wafers were diced by using a specialized dicing saw and by a laser to study the effect of singulation. The laser dicing adversely affected the mechanical
... The authors would like to thank Eoin O'Reilly and Orla Slattery both from Tyndall Nationa... more ... The authors would like to thank Eoin O'Reilly and Orla Slattery both from Tyndall National Institute for useful dis-cussion. 1B. Majeed, K. Delaney, J. Barton, and C. O'Mathuna, J. Electron. Packag. to be published. 2K. ... Phys. 92, 7658 2002. 4C. Herring and E. Vogt, Phys. Rev. ...
The strength of silicon is a statistical property and can differ significantly between specimens ... more The strength of silicon is a statistical property and can differ significantly between specimens processed under similar conditions. This necessitates the development of different statistical distribution models, which, amongst others, includes Weibull and log-normal models to determine the statistical fracture strength of material like silicon. This paper describes the development of statistical approach to model fracture strength of silicon of
Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation ha... more Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation have opened-up the possibility of constructing materials that directly include considerable computing power. We present an architecture for the hardware/software co-design of such “augmented” materials that allows designers to address the links between the physical and informational properties of artefacts. The architecture is highly modular in terms of sensor, communications, power and processing capabilities, and utilises an advanced semantically well-founded software model.
ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication di... more ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication discusses the prospect of using NMRC's 25mm wireless sensor node in conjunction with other sensor motes. The NMRC node is the Institute's specification for future autonomous ...
This paper reports on the development of a 3D interconnection process leading to the successful a... more This paper reports on the development of a 3D interconnection process leading to the successful assembly of a five-layer 3-D 1 mm cube module. This proof of concept module demonstrates the capability for successful integration and interconnection of commercial off the shelf components to fabricate functional modules in 1 mm cube dimensions. It also demonstrates that use of established volume scale technologies like flip-chip dicing and patterning techniques are viable for fabricating these 1 mm modules. The demonstrator consists of LED's bonded to the six sides of the 1 mm cube, interconnected and powered up. The work particularly report on two different processes to fabricate the interconnection pattern using direct focused ion beam (FIB) assisted Pt deposition and electroless metal deposition, which again patterned by FIB. Uniform thickness of the deposit and excellent coverage on all six sides is achieved by electroless nickel deposition. Voltage current characterisation of the deposited Pt shows a resistivity value of 1864 plusmn 100 muOmega cm, whereas electroless Ni film shows a resistivity of 25 muOmega cm due to boron inclusion. 100 nm Au layer is deposited by chemical displacement reaction to enhance the conductivity and solderability of the film
In this work the development and characterisation of a very thin flexible substrate, with thickne... more In this work the development and characterisation of a very thin flexible substrate, with thickness ranging from 3 microns to 25 microns, was presented. The work analyses the stress generated in thin flexible substrate and determines the critical thickness to avoid wrinkling in the substrate. This substrate is then used to package test chips into a highly miniaturised 3D module.
A free standing Co3O4 nanowire/nanoflower hybrid structure on flexible carbon fibre cloth (CFC) w... more A free standing Co3O4 nanowire/nanoflower hybrid structure on flexible carbon fibre cloth (CFC) was designed via a facile hydrothermal approach followed by thermal treatment in air.
The potential of using nanometallic wires inside a matrix as new generation of thermal interface ... more The potential of using nanometallic wires inside a matrix as new generation of thermal interface material led us to study the thermal diffusivity of nickel nanowires embedded inside porous alumina template. Thermal diffusivity measurements using a laser flash method showed size dependence for nickel nanowires inside nanochannel alumina (NCA) templates having nominal pore diameters of 200, 100, and 20 nm. Nickel nanowires embedded inside these templates showed decreasing diffusivity values of 10.7×10-6, 8.5×10-6, and 6.5×10-6 m2 s-1 at 300 K with decreasing wire diameter when deposited at 40 °C. Nanowires fabricated at 60 °C showed similar decreasing diffusivity with wire diameter, and a further 42%-48% reduction was observed when compared to 40 °C samples. The modified effective medium theory (MEMT) was employed to evaluate the experimental thermal diffusivity. Calculations based on MEMT resulted in mean thermal conductivities of 70.7 and 36.2 W m-1 K-1 for nickel nanowires fabricated at 40 and 60 °C respectively. These values are ~20% and 60% lower than the thermal conductivity value of bulk nickel. A strong grain size dependence of thermal diffusivity in the nanowires was observed. It is believed that the decrease in diffusivity in lower temperature wires is associated with defects/dislocations in large single crystals and reduction in wire diameters according to pore diameters of NCA. Whereas in higher temperature wires, the drastic reduction in diffusivity is believed to arise from self-similar fractal morphology composed of nanogranules, close to the dimension of electron mean free path.
Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation ha... more Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation have opened-up the possibility of constructing materials that directly include considerable computing power. We present an architecture for the hardware/software co-design of such “augmented” materials that allows designers to address the links between the physical and informational properties of artefacts. The architecture is highly modular in terms of sensor, communications, power and processing capabilities, and utilises an advanced semantically well-founded software model.
ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication di... more ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication discusses the prospect of using NMRC's 25mm wireless sensor node in conjunction with other sensor motes. The NMRC node is the Institute's specification for future autonomous ...
This paper reports on the development of a 3D interconnection process leading to the successful a... more This paper reports on the development of a 3D interconnection process leading to the successful assembly of a five-layer 3-D 1 mm cube module. This proof of concept module demonstrates the capability for successful integration and interconnection of commercial off the shelf components to fabricate functional modules in 1 mm cube dimensions. It also demonstrates that use of established volume scale technologies like flip-chip dicing and patterning techniques are viable for fabricating these 1 mm modules. The demonstrator consists of LED's bonded to the six sides of the 1 mm cube, interconnected and powered up. The work particularly report on two different processes to fabricate the interconnection pattern using direct focused ion beam (FIB) assisted Pt deposition and electroless metal deposition, which again patterned by FIB. Uniform thickness of the deposit and excellent coverage on all six sides is achieved by electroless nickel deposition. Voltage current characterisation of the deposited Pt shows a resistivity value of 1864 plusmn 100 muOmega cm, whereas electroless Ni film shows a resistivity of 25 muOmega cm due to boron inclusion. 100 nm Au layer is deposited by chemical displacement reaction to enhance the conductivity and solderability of the film
Journal of Micromechanics and Microengineering, 2006
This paper investigates the effects of thinning on different properties of silicon test die. Sili... more This paper investigates the effects of thinning on different properties of silicon test die. Silicon test wafers of different thicknesses (525, 250, 100 and 50 µm) were thinned using a mechanical grinding process. The wafers were diced by using a specialized dicing saw and by a laser to study the effect of singulation. The laser dicing adversely affected the mechanical
... The authors would like to thank Eoin O'Reilly and Orla Slattery both from Tyndall Nationa... more ... The authors would like to thank Eoin O'Reilly and Orla Slattery both from Tyndall National Institute for useful dis-cussion. 1B. Majeed, K. Delaney, J. Barton, and C. O'Mathuna, J. Electron. Packag. to be published. 2K. ... Phys. 92, 7658 2002. 4C. Herring and E. Vogt, Phys. Rev. ...
The strength of silicon is a statistical property and can differ significantly between specimens ... more The strength of silicon is a statistical property and can differ significantly between specimens processed under similar conditions. This necessitates the development of different statistical distribution models, which, amongst others, includes Weibull and log-normal models to determine the statistical fracture strength of material like silicon. This paper describes the development of statistical approach to model fracture strength of silicon of
Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation ha... more Recent advances in materials, sensing, power harvesting, context-awareness and miniaturisation have opened-up the possibility of constructing materials that directly include considerable computing power. We present an architecture for the hardware/software co-design of such “augmented” materials that allows designers to address the links between the physical and informational properties of artefacts. The architecture is highly modular in terms of sensor, communications, power and processing capabilities, and utilises an advanced semantically well-founded software model.
ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication di... more ABSTRACT A robust hybrid intelligent system architecture is being proposed. This communication discusses the prospect of using NMRC's 25mm wireless sensor node in conjunction with other sensor motes. The NMRC node is the Institute's specification for future autonomous ...
This paper reports on the development of a 3D interconnection process leading to the successful a... more This paper reports on the development of a 3D interconnection process leading to the successful assembly of a five-layer 3-D 1 mm cube module. This proof of concept module demonstrates the capability for successful integration and interconnection of commercial off the shelf components to fabricate functional modules in 1 mm cube dimensions. It also demonstrates that use of established volume scale technologies like flip-chip dicing and patterning techniques are viable for fabricating these 1 mm modules. The demonstrator consists of LED's bonded to the six sides of the 1 mm cube, interconnected and powered up. The work particularly report on two different processes to fabricate the interconnection pattern using direct focused ion beam (FIB) assisted Pt deposition and electroless metal deposition, which again patterned by FIB. Uniform thickness of the deposit and excellent coverage on all six sides is achieved by electroless nickel deposition. Voltage current characterisation of the deposited Pt shows a resistivity value of 1864 plusmn 100 muOmega cm, whereas electroless Ni film shows a resistivity of 25 muOmega cm due to boron inclusion. 100 nm Au layer is deposited by chemical displacement reaction to enhance the conductivity and solderability of the film
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