Wire Vibration Measurement Technique in WEDM
Wire Tool Vibration
Measurement
Techniques In WEDM
Debkumar Ruidas
Roll - 001411701040
4th Year
Guided By
Dr. B. Bhattacharyya
Production Engineering
JADAVPUR UNIVERSITY
Debkumar Ruidas
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Wire Vibration Measurement Technique in WEDM
Acknowledgement
I would like to take this opportunity to express my profound gratitude and deep
regard to my Professor Dr. B. Bhattacharya, for his exemplary guidance,
valuable feedback and constant encouragement throughout the duration of the
report. His valuable suggestions were of immense help throughout my work. His
perceptive criticism kept me working to make this report in a much better way.
Working under him was an extremely knowledgeable experience for me.
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Wire Vibration Measurement Technique in WEDM
Content
1. Introduction
2. Parametric influence on average wire amplitude .
2.1Running Speed
2.2 Dielectric flow rate
2.3 Servo voltage
2.4 Wire Tension
3. Wire Vibration measurement
4. Mathematical Model
5. Mechanical Method:
6. Electronic Method:
6.1 Free Vibration condition
6.2 Wire vibration during cutting
6.3 Low Frequency Wire Vibrations during Cutting
6.4 Real time application
7. Using High Speed Video Camera
7.1 Evaluation of wire movement
8. Proposed measurement technique
9. Comparison between measurement methods
10.Practical Approach of Minimising the Wire Vibration
11.Conclusion
12.References
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Wire Vibration Measurement Technique in WEDM
1. INTRODUCTION
WEDM is a thermo-electrical process in which material is eroded from the workpiece
through a series of discrete sparks occurring between the workpiece and the wire electrode
(tool). The latter is separated by a thin film of dielectric fluid (deionised water) which is
continuously force-fed to the area being machined in order to flush away the eroded
particles. The movement of the wire is numerically controlled to achieve the desired threedimensional shape and accuracy of the workpiece. Although the average cutting speed,
relative machining costs, accuracy, and surface finish have been improved several times
over since the commercial introduction of the machine, further improvement is still
required by different industries to meet the increasing demand of precision and accuracy.
Figure 1: Schematic diagram of working of wireEDM [1]
The wire electrode is supported by two guides and is moving down or up the guides at a
uniform velocity. Some external forces are exerted on the wire, which include: an axial
tension, an electro-static force produced by the electric field between the workpiece and
the wire electrode, an electro-dynamic and explosion force caused by spark discharge,
and the damping force caused by the dielectric medium.
FIG 2. Reasons of wire vibration[2]
In actual wire cut machining, vibrations of the wire electrode can be divided into two
components: vibrations along or perpendicular to the cutting direction. As far as the latter
is concerned, due to the constrains of the cutting kerf, vibration is relatively small and
symmetrical.
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Wire Vibration Measurement Technique in WEDM
Fig. 3. Schematic diagram of workpiece positions and wire movements [3]
2. Parametric influence on average wire amplitude
The influence of wire tension, wire running speed, flow rate and servo voltage on
average wire amplitude can be shown in Fig. 3. Average wire amplitude decreases with
the increase of wire tension and wire running speed. However, it increases with
dielectric flow rate. Servo
voltage has a weak influence on
average wire amplitude. One of
the most effecting parameters of
wire vibration amplitude in wire
EDM process is wire tension.
Figure 4 shows wire shape
difference under wire tension
0.5 and 4.0 N. Within
considerable range, an increase
in wire tension significantly
increases the cutting speed and
Fig. 4 Relationship between average wire amplitude and wire
tension,wire running speed, flow rate and servo voltage [4]
accuracy due to the sharp straightness of the wire. [4]
2.1 Running Speed
When the wire running speed has a lower value, the amplitude slightly increases. The
debris exclusion from the discharge gap is a little difficult at lower wire running speed
because there is no high-speed flow of working fluid around the wire. Then, the debris
stagnation occurs around the wire, which causes unstable machining and larger
amplitude of wire vibration. When the wire running speed is higher, the debris is
smoothly excluded. [4]
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Wire Vibration Measurement Technique in WEDM
2.2 Dielectric flow rate
Dielectric flow rate is the rate at which the dielectric fluid is circulated. Flow rate of the
working fluid from jet nozzles is important for efficient machining. One of the forces
exerted on the wire is the dielectric flow such that as the flow rate increases around the
wire, the movement of the wire speeds up and thus the average wire amplitude
increases. [4]
2.3 Servo voltage
Servo voltage acts as the reference voltage to control the wire advances
and retracts. Figure 4shows that there is little decrease of average wire
amplitude with change of servo voltage from 50 to 70 V. After that, the
average wire amplitude increases slightly. [4]
2.4 Wire Tension
Wire tension is one of the most
dominant factors that affect wire
vibration.
When tension is low
wire amplitude become high and
high wire tension results lower
amplitude. But, if tension is too high
then wire get broken. To avoid wire
breakage tension must be increased
to a certain limit.
Fig. 5 Wire shape difference under wire tension 0.5 and 4.0 N[4]
3. Wire Vibration measurement
The main functions which feature the developed wire vibration detection and analysis
system are: To be able to measure the wire position and displacement during machine
idling as well as during EDM cutting. To perform a vibration analysis, based on the
gathered data during the wire vibration measurements. This also in both modes,
machining and idling. The vibration analysis includes, graphical output of the wire
displacement data in a 2-D plane, Past Fourier Transform calculation (PFT),
calculation of wire damping ratios, and frequency spectrum analysis. [5]
Vibration measurement model and method
1.
2.
3.
4.
5.
Debkumar Ruidas
Mathematical Model,
Mechanical Method,
Electronic Method and
Using High Speed video Camera
Proposed Measurement Method
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Wire Vibration Measurement Technique in WEDM
4. Mathematical Model
vibration of a stretched wire supported by the two wire guides at opposite ends
satisfying the standard vibration theories of vibrating strings, has been
mathematically modelled by several researchers with the following assumptions:
i) the wire mass is uniformly spread
along its length;
(ii) the axial tension remains constant
between the wire guides;
(iii) the wire is static (not moving);
(iv) the wire is perfectly flexible; and
(v) the disturbing forces acting per
unit length of the wire perpendicular
to the axial force, varies as a function
of time and space.
Therefore, the general partial
differential equation of motion
(Newton’s second law of motion) for
a stretched vibrating string of length
L in a plane (along Z-axis) may be
expressed as follows:
FIG. 6. A schematic diagram of wire-tool vibration in
WEDM process [6]
...............................1
Multi-discharge modelling of wire vibration and approach for solution
From the geometry of the wire shape (Fig. 7),
the displacement function y(z, t) may be
determined by the following initial conditions
(ICs
Thus
y(z, t) = e−βt/2ρ0
∞
{An cos(ωn t)
n=1
with
nπ
z
L
nπ
8a0 L
nπ H
cos
sin
An = 2 2
2
2 L
n π (L − H)
β 1
Bn = An
,
2ρ0 ωn
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ωn =
2
FIG 7. Action of the body force before
the wire is set to vibration [12]
,
β2
4n2 π2 F
− 2 + 4α
2
ρ0 L
ρ0
..................................................................................................2
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Wire Vibration Measurement Technique in WEDM
5. Mechanical Method:
Using Probe:
As shown in Fig.8, the wire is surrounded by four probes, Pl,P2,P3 and P4. Each
probe is moved back and forth along L-axis or M-axis by
means of the mechanism shown in Fig.11.
The
probe
is
fixed mechanically to a
micro-meter screw which is driven by a
stepping motor, but is isolated electrically
from the screw. Each pulse supplied to the
stepping motor shift the probe 0.48 micron.
Assuming the probe is fixed on some
adequate position in LM-plane, the vibrating
wire comes into contact intermittently with
it. This mechanical
Fig.8 Schematic View[7]
Fig.9 Area of Wire-Vibration ( XY-Plane )[7]
Fiq.10 Area of W-V.( FZ-Plane[7]
having peak value of 5V to the probe during Ts sec, it is checked up for every
pulse whether an electrical short circuit between the wire and the probe is built up
or not. If for n pulses among N “short” is detected,
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Wire Vibration Measurement Technique in WEDM
C = (n/N) x 100 ( % ) (1) is
calculated with micro processor,
TK-85 connected to the detecting
circuits. As a matter of course the
closer the probe is located to the wire,
the higher he value of the contact
ratio, C is. Monitoring the above
mentioned contact ratio on every
probe, a micro computer, FM-8,
supplies control pulses to the
stepping motor of probe unit (Fig.11)
Fig.11 Probe Unit[7]
Therefore, if the contact ratio, C, is greater than a constant, Co, the probe is retreated
from the wire. On the contrary, if C is smaller than Co, the probe is advanced to
the wire.[13] Repeating preliminary experiments the value of Ts and Co were
selected at 0.1 sec and 0 %, respectively. And it was confirmed that the boundary
of the area of wire-vibration could be detected both on L-axis and M-axis
through the controlled location of the probe without disturbing the motion of wire.
Fig.12 shows the location of each probe
at two different times, tl and t2, on LMplane. Two ellipses represent the
corresponding areas of wire-vibration.
Counting the number of pulses sent to
the stepping motor during a period, (t2tl), each shift of the four probes, AL1 or
AL2 or AM3 or AM4 is calculated.
Here, the following four values are
defined:
Fig.12 Probe vs. Area of Wire-Vibration (LM-Plane)[7]
ΔEL = 0.5 X (ΔL1 - ΔL2) ……………………………...….. (3)
ΔEM = 0.5 x (ΔM3 - ΔM4) …………………………………... (4)
ΔAL = 0.5 x (ΔL1 + ΔL2) …………………………………... (5)
ΔAM = 0.5 x (ΔM3 + ΔM4) …………………………………...(6)
having peak value of 5V to the probe during Ts sec, it is checked up for every pulse
whether an electrical short circuit between the wire and the probe is built up or not. If
for n pulses among N “short” is detected, relations are true, too. On the contrary, if
the coordinates of the ellipse are not parallel to L, M-coordinates, the above relations
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Wire Vibration Measurement Technique in WEDM
are not guaranteed. Fortunately in wire- EDM the eccentricity of the ellipse is close
to 1.0, therefore it is possible to consider that ΔEL=m, and that Δ E M - m In this
case, according to the same reason, ΔAL and ΔAM in equations (5) and (6) are
nearly equal to L-component and M-component of the increment of the amplitude
of wire-vibration, respectively, on LM-plane.[1]
Using ΔEL and ΔEM the area of wire-vibration is estimated approximately on
work-surface defined as XY-plane in Fig.8 through the following equations:
Shift of the center(X-component);
ΔEX = (l/L) x ΔEL…………………..(7)
Shift of the center (Y-component);
ΔEY= (l/L) x ΔEM
Increment of the amplitude (X-component);
ΔAX= (sin(Ln/S)/sin(Pn/S)) x ΔAL…. ......(8)
Increment of the amplitude (Y-component);
ΔAY= (sin(Ln/S)/sin(pn/S)) x ΔAM…. ....(9)
Where l, L and S were already defined in Fig.10.[7]
6. Electronic Method:
Using light emitting diode and light detecting diode:
Fig.13 shows the general system set-up. The wire displacement device is mounted
between the upper wired guide head and the workpiece. The system is built to
operate in a water based dielectric, such that real cutting conditions can be analyzed
Fig.13. Main system setup[8]
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Wire Vibration Measurement Technique in WEDM
The measured analog data is then digitalized and transmitted to a parallel dual port
interface which strobes this data into a Personal Computer (PC) for further analysis.
After data analysis, control actions required are fed back to the EDM machine trough
a serial interface.
The measurement principles are explained in Fig.14. The wire position is
instantaneously and optically measured in the x-y plane. Indeed, two light emitting
diodes (x and y) transmit a small light beam which is partially interfered by the wire
towards the opposite light detecting diodes. One must be aware that EDM wires may
vary from some 25μm to 300μm in diameter and hence, the light beam accuracy and
diameter are of very importance.
One of the basic reasons why optical
diode components were used in our
design is that this measuring device must
be reliable and more accurate when
functioning in a dielectric fluid. The
major reason why we did not applied
"Charged Coupled Device" sensors
(CCD's) is due to the fact that they hardly
perform in humid and dirty environments.
Fig.14. Wire displacement measurement principle.[8]
The system described so far is able to keep track peak to peak wire displacements and
vibrations. Initialization and calibration is made when no wire vibration is detected.
In this position, half of the light beam diameter passes along the wire, the other part
of the beam is cut off by the wire. See fig.14.[8]
6.1 Free Vibration condition:
wire is put into excitation by several sources: the unwinding system, internal friction
of driving belts, friction at the wire guiding heads etc.
This
picture
shows
wire
displacements in X and Y
direction versus time. Both
graphs on the picture illustrate
that wire displacements of some
200 micro-meter peak to peak
can be reached.
6.2 Wire vibration during cutting:
Fig. 15. Wire position along X and Y direction versus time [8]
Including th forces in free vibration, force due to spark generation and dielectric
flow are seen in this case
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Wire Vibration Measurement Technique in WEDM
Fig. 16. X and Y wire position versus time. Cutting
direction along the X axis.[8]
Fig. 17. FFT of the data of Fig. 16.[8]
6.3 Low Frequency Wire Vibrations during Cutting
Low frequency vibrations of the order of 1 Hz have also been observed during
cutting, as given in Fig. 18.
6.4 Real time application:
Fig. 18. Low power frequency spectrum for wire vibration [8]
The X, Y, wire position is measured regularly when machining goes on. This data is
digitalized and fed into a PC-AT where a FFT is executed. This allows to receive wire
vibration data during cutting. Based on the frequency analysis and the position
information, control actions can be fed back to the EDM machine's interface for a
better and more accurate machining execution.
7. Using High Speed Video Camera:
High-speed observation system of fine wire EDM is used in this work as shown in
Fig. 19. The wire movements during the process are observed by a high-speed video
camera. The digital high-speed video camera system (KEYENCE VW-6000) is used
for the recording with the aid of a Halogen light source. The recording conditions are
listed in Table 1.
Table.1 Digital video camera recording condition
Recording condition
Value
Recording speed
Shutter speed
Recording time
view size
8000fps
1/40,000 s
20 s
0.4 x 0.2 mm
The wire vibration during the process is analyzed with the motion analysis program
(DITECT DIPP Motion Pro). This software is used for the analysis of recorded
images obtained using a high-speed video camera (DIPP Motion Pro User s Manual).
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Wire Vibration Measurement Technique in WEDM
Fig. 19 Experimental setup of the developed high-speed observation
system of WEDM[2]
Average wire amplitude, which is simply the arithmetic average of the signal level over a certain
length of time.
7.1 Evaluation of wire movement:
The observed area is above the upper edge of workpiece. The wire is observed from
the rear side for machining direction. The observation area is 1.0 mm above the top
edge of workpiece, and the view size is 0.4×0.2 mm. The wire vibration during the
process is analysed with the motion analysis program (DITECT DIPP Motion Pro)
(DIPP-Motion Pro user’s manual). This software is used for the analysis of recorded
images obtained using a high-speed video camera. In order to clearly catch the wire
vibration in the image analysis process, the recording process is started after the kerf
of 0.1 mm in length is machined. The recording speed is set to both 8000 and 24,000
fps.[2]
This can be carried out during wire movements during process and during only wire
running without machining.
Result look like
Fig. 20. Wire movements during process and
during only wire running without machining.
[9]
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Wire Vibration Measurement Technique in WEDM
8. Proposed measurement technique
Fig.21 shows wire at distance of m from
the workpiece
,
can
be
measure
using Vernier calliper.
Workpiece
wire
m
Fig. 21
wire moving direction
w/p
d
Sg
n
Fig.22 shows wire is moving towards
the Workpiece. Now wire movement
is Controlled manually. After a distance of
n travel spark will strart. So the Spark
gape
Sg = m – n – d…………………............10
Here, d = diameter of the wire
Fig. 22
Fig. 23 shows wire inside the
the work piece. Here a is
amplitude of the wire vibrating
with a fixed frequency. Now
thikness of the cut can be measure
with microscope if thickness is x,
then
x = 2Sg + 2a + d...............................11
Now we know Sg, d and x so
amplitude a can be measure from
the equation 11.
Debkumar Ruidas
Sg a
d
a Sg
Fig. 23
26
Electronic Method
Using High Speed Video Camera
Proposed method
Tool
Neel
Requirement
Probe, micrometer,
stepper motor,
Light emitting diode, light
detecting diode,
Analog to digital converter
High speed video camera, photo
analysing software, computer
Vernier caliper, microscope,
Set-up
No external
setup require
Setup is very
complex
Not so difficult
Easier than other
Easiest than other
Cost
Neel
In the range of Rs.
20,000 – 30,000
In the range Rs. 5,000 –
6,000
More than lacs.
Less than using high speed
video camera
Time
Time taken for
calculation only
Too much time for
setup and
experiment
Lesser time than
mechanical method
Quite same to the electronic
method
Minimum time taken than any
other method
Output
estimated
accurate
More accurate
Most accurate
Not measured
Use as a real
time
feedback
system to
the machine
Can’t be use
Can’t be use
Can be use
Can be use
Can’t be use
Wire Vibration Measurement Technique in WEDM
Mechanical Method
9.Comparison between measurement methods
Debkumar Ruidas
Mathematical
Model
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Wire Vibration Measurement Technique in WEDM
10. PRACTICAL APPROACHES
THE WIRE VIBRATION
OF
MINIMISING
a) Optimizing the machining parameters
It can be found that the machining parameters have a great impact on the wire
vibration, so seeking a good parameter combination is an effective measure to
suppress the wire vibration phenomenon.
(1) The smaller discharge energy per pulse (decreasing pulse-on time, increasing
pulse-off time, decreasing peak discharge voltage) produces the smaller discharge
impulsive force. While, the discharge energy per pulse cannot be too small to satisfy
the material removal rate;
(2) Increasing tension means increased stiffness of wire electrode;
(3) Medium wire speed (v¼0.12 m/s) may make the wire vibration frequency away
from wire natural frequency. Finally, in machining 1 mm-thickness steel process, the
optimal parameter combination may be as follows: tON =4μs, toff =12μs, Tf=20N,
v=0.12m/s, U=30 V. [10]
b) Improving wire transportation system
According to the multi-physics coupling model, wire tension and velocity are
important factors on wire vibrational character. While, the wire tension and velocity
always fluctuate within some range due to the inertia of wire reel, disturbance load,
non-uniformity of unreeling wire. Hence, improving the wire transportation system
mainly aims to keep the wire speed and tension constant. In this paper, two
improvements have been applied in wire transportation system.
(1) A closed-loop wire tension control system is developed by importing a tension
sensor. Through comparison of responsive tension and control signal, tension motor
is real-timely adjusting the wire tension to agree with control signal.
(2) Two dynamic absorbers are designed to absorb fluctuation of wire tension and
velocity from the source. [10]
c) Applying external vibrational excitation on work piece
The wire vibration characteristic (period, amplitude and phase position) can be
calculated. An external vibrational excitation can be applied on work piece, and the
lateral vibration can be significantly restrained under the following two aspects:
(1) The frequency of external vibrational excitation is the same as the lateral
vibrations;
(2) The differences of two phase positions are maintained as half period. [10]
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Wire Vibration Measurement Technique in WEDM
11. Conclusion
1. From mathematical model, amplitude and frequency of the wire tool vibration
are estimated using some assumptions and avoiding some negligible forces.
2. Mechanical method is a primitive technique to measure wire vibration amplitude
with good accuracy. But it gives no idea of frequency and relatively costlier and
complex.
3. Electronic method is simpler and better in accuracy for measuring amplitude as
well as frequency. Optical diodes are designed to work in actual working
condition during machining.
4. High speed video camera is the latest technique to measure vibration with best
accuracy but it requires huge cost involvement.
5. Above Proposed method is yet to be tested practically, but it can be practically
helpful to study wire tool vibration with certain equipment which can be easily
arranged. This method can find easy way to measure vibration with some
research and advancements
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Wire Vibration Measurement Technique in WEDM
12.Reference
1. Kalyani S. Kanekar, Diwesh B. Meshram, 2015, IJRET: International Journal of
Research in Engineering and Technology eISSN: 2319-1163 | pISSN: 2321-7308.
2. Sameh Habib, Akira Okada. Experimental investigation on wire vibration
during fine wire electrical discharge machining process, The International Journal
of Advanced Manufacturing Technology, Volume 84, Issue 9–12, pp 2265–
2276(2016)
3. Sameh Habib, Akira Okada. Study on the movement of wire electrode during
fine wire electricaldischarge machining process, Journal of Materials Processing
Technology 227 (2016) 147–152
4. Sameh Habib. Optimization of machining parameters and wire vibration in
wire electrical discharge machining process, Mechanics of Advanced Materials and
Modern Processes (2017) 3:3
5. Dauw, D. F., Sthioul, H., Delpretti, R., Tricarico, C. Wire analysis and control for
precision EDM cutting, Ann. CIRP 38 (1),pp. 191–194 (1989).
6. A.B. Puri, B. Bhattacharyya. Modelling and analysis of the wire-tool vibration in
wire-cut EDM, Journal of Materials Processing Technology 141 (2003) 295–301
7. Kinoshita, N.,Fukui, M., Kimura, Y. Study on wire-EDM: inprocess measurement
of mechanical behaviour of electrode-wire, Ann. CIRP 33 (1), pp 89 – 92 (1984).
8. Dauw, D. F., Beltrami, I.High-precision wire- EDM by online wire positioning
control, Ann. CIRP 43 (1) pp. 193–197, (1989).
9. Sameh Habib, Akira Okada. Study on the movement of wire electrode during
fine wire electricaldischarge machining process, Journal of Materials Processing
Technology 227 (2016) 147–152
10. Zhi Chen, Yu Huang, Hao Huang, Zhen Zhang, Guojun Zhang. Threedimensional characteristics analysis of the wire-tool vibration considering
spatial temperature field and electromagnetic field in WEDM, International
Journal of Machine Tools & Manufacture 92 (2015) 85–96
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