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This paper explores advanced welding techniques and heat transfer mechanisms for thermoelectric modules (TEMs) operating at 1000°C. It presents methodologies for optimizing ceramic-to-metal interfaces, assessing surface energy and wettability, and developing microwave welding as an efficient fabrication process. Through experimental investigations and modeling, the research aims to enhance TEM performance by improving joining technologies and material diffusion processes.

ENGINEERING RESEARCH EXAMPLES Dr. Adonyi SUMMARY • Can you walk, think and chew gum at the same time? Categories of research mixed • TE module R&D examples • How is R&D being performed? (“modus operandi”) • Is R&D a business or a non-profit endeavor? • Conclusions Types of Research, reminder 1. Fundamental: Thinking General: No specific industry Blue-sky, mostly analytical No clear deliverables, only ‘impact’ 2. Applied: Walking Specific industry targeted Mostly experimental Clear deliverables 3. Industrial/commercial: Chewing gum Company specific, implementation Timing of Engineering Research, TE elements 1. Strategic, long-term, PhD - II-VI: high temperature stability of interfaces, improved Figure of Merit 2. Tactical, medium-term, MSc - Marlow/II-VI: microwave welding, improve life 3. Immediate, short-term, BSc - Marlow: NDE of modules Example: TE Research Methodology Surface Energy Calculations Wettability 1000°C Test Metal Flow Microwave Operating Contact Optimal Characteristics Welding Temperature Angle Coatings, Welded Interface Surface Atmosphere Roughness and Test Roughness PROBLEM STATEMENT: BSc+MSc+PhD Project Goal JOINT GEOMETRIES • Raise operating temperature of Thermoelectric Modules (TEM’s) to 1000°C • Improve the efficiency and performance for all TEM’s • Replace soldered & brazed joints • Model and validate ceramic-to- metal interface phenomena • Optimize joining technology for future Example PhD level: Wettability Test • Samples prepped using methanol • Surface roughness recorded using profilometer • Heated in Gleeble at 300 °C for 30 seconds • Data collected using optical and thermal cameras • Contact angle found using imaging software Young’s Equation • γSG=γSL+γLGcosθ – γSG= Interfacial energy between solid and gas – γSL = Interfacial energy between solid and gas – γLG = Interfacial energy between solid and gas Diffusion Background • Material transport by atomic motion • Types – Interdiffusion – Self-diffusion – Impurity diffusion • Mechanisms – Vacancy diffusion – Interstitial diffusion • Fick’s second2 law 𝜕𝜑 𝜕 𝜑 =𝐷 2 𝜕𝑡 𝜕𝑥 COMSOL Modeling Verification Diffusion of Ni into n-type Bi2Te3 0.50 0.40 Concentration Ni 0.30 Diffusion Equation 0.20 COMSOL Experimental Data 0.10 0.00 0.00 2.00 4.00 6.00 Distance from Interface (µm) Example: Level MSc Microwave Welding Outline Purpose • Dielectric Heating • Develop Microwave Welding as a viable process for • High Frequency Induction fabrication of thermoelectric Heating devices • Theory • Heat Transfer Equations – Simultaneous heating methods • Filler Metal Selection to account for varying material properties • Waveguide • Dielectric Heating in TE material • High Frequency heating in metallic coating\filler metal – Significantly shorter period at elevated temperature than oven soldering Verifying Heating in Waveguide • Both Al paste and Ni coated TE elements heated • No arcing occurred • Demonstrated the need for optimizing waveguide – Heating rate too low – Damage to TE elements Dielectric Heating Ionic Polarization of Sodium Principles Chloride • Ionic Polarization – Electric field causes displacement between ions – Movement in oscillating field generates heat • q̇ E=2πfε0ε”effE2 High Frequency Heating Principles • Lenz’s Law – Current opposes changing emf • Joule effect – P=I2R • Heat Generation – q̇ H=2πfμ0μ”effE2 • Skin Effect 𝜌 𝑑 = 503 𝜇𝑟 𝑓 Frequency • Skin Depth at 2.5GHz – 1.7µm • Average particle size Skin Depth vs Frequency – 22.2µm 3.0 Skind Depth (μm) 2.5 2.0 Aluminum 1.5 Nickel 1.0 Cobalt 0.5 Copper 0.0 Gold 1 10 100 Frequency (GHz) Heat Transfer • Heat Generation – Dielectric Heating q” • q̇ E=2πfε0ε”effE2 Metallic Filler q̇ H – HFI Heating Metallic • q̇ H=2πfμ0μ”effH2 Coating q̇ H • Heat Transfer Out – q”conv=h(Ts -T∞) q̇ E – q“rad=εσ[(Ts)4-(T∞)4] TE Material Short Term Projects May 20, 2011 NVG TEM Eddy Current Testing • Orientation of Elements within Module – Elements not oriented in the same direction – Scanning is difficult due to orientation NVG TEM Eddy Current Testing • Semi-Automated Setup – Simple G-code written – 2 in/min velocity – 1 MHz probe Impedance scan, “Bad” module NVG TEM Destructive Testing, “Bad” module Solder overflow PRELIMINARY CONCLUSIONS • The three levels of R&D can (and should be) performed simultaneously • There is a continuous improvement cycle and interaction between them • Funding mechanism varies: academic credit, retainer, unrestricted accounts, dedicated accounts How is R&D being perfomed? • Networking, RFP (Request for 1 Proposal) listing, NSF, THECB • Writing Proposal, peer review, 2 gnashing of teeth, budgets • Initial approval, budget and 3 deadline adjustments. Managing R&D Deliver on time and within budget Setting up Stage teams, training, etc Hiring researchers, purchasing equipment Time Spent CONCLUSIONS • R&D is like any other business: if it does not grow, it dies! • R&D has to be led and managed like any other business • R&D does not produce profit, but generates overhead • R&D has two outputs: quality research and quality graduates