Scribd Logo
Upload

Welcome to Scribd!

  • 261 views

    Ball Grid Array

    Uploaded by

    yogeshleostar
    This document discusses ball grid array (BGA) technology as a replacement for through-hole technology in printed circuit boards. It notes that BGA uses solder balls instead of leads, allowing for smaller footprints and greater reliability. BGA packages are classified based on whether the die is up or down, and come in different ball array configurations. The manufacturing process involves applying solder paste to the board, placing the BGA component, and reflow soldering to join the balls to pads. BGA components are more easily replaced if defective since they do not use leads. The document provides illustrations of BGA components and the mounting/rework process.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd

    Ball Grid Array

    Uploaded by

    yogeshleostar
    261 views29 pages
    This document discusses ball grid array (BGA) technology as a replacement for through-hole technology in printed circuit boards. It notes that BGA uses solder balls instead of leads, allowing for smaller footprints and greater reliability. BGA packages are classified based on whether the die is up or down, and come in different ball array configurations. The manufacturing process involves applying solder paste to the board, placing the BGA component, and reflow soldering to join the balls to pads. BGA components are more easily replaced if defective since they do not use leads. The document provides illustrations of BGA components and the mounting/rework process.

    Original Description:

    yogesh singh engg student, made this for my seminar, brief descrition ofb BGS and Its rework

    Original Title

    ball grid array

    Copyright

    © Attribution Non-Commercial (BY-NC)

    Available Formats

    PPT, PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    This document discusses ball grid array (BGA) technology as a replacement for through-hole technology in printed circuit boards. It notes that BGA uses solder balls instead of leads, allowing for smaller footprints and greater reliability. BGA packages are classified based on whether the die is up or down, and come in different ball array configurations. The manufacturing process involves applying solder paste to the board, placing the BGA component, and reflow soldering to join the balls to pads. BGA components are more easily replaced if defective since they do not use leads. The document provides illustrations of BGA components and the mounting/rework process.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    261 views29 pages

    Ball Grid Array

    Uploaded by

    yogeshleostar
    This document discusses ball grid array (BGA) technology as a replacement for through-hole technology in printed circuit boards. It notes that BGA uses solder balls instead of leads, allowing for smaller footprints and greater reliability. BGA packages are classified based on whether the die is up or down, and come in different ball array configurations. The manufacturing process involves applying solder paste to the board, placing the BGA component, and reflow soldering to join the balls to pads. BGA components are more easily replaced if defective since they do not use leads. The document provides illustrations of BGA components and the mounting/rework process.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    of 29
    At a glance
    Powered by AI
    Key takeaways are that BGA packages are replacing leaded packages due to their smaller size and better thermal properties. BGA stands for Ball Grid Array and consists of an IC bonded to a substrate with solder balls on the bottom.

    Advantages of BGA packages over leaded packages are smaller footprint, better thermal stability, more reliable, easier to replace, and less damage to logic circuits. BGA packages do not have fragile leads.

    The steps involved in mounting a BGA component are: applying solder paste as flux on pads of the PCB, placing the BGA component, and passing it through a reflow process for soldering.

    BALL GRID ARRAY

    Made by – Yogesh Singh


    Btech final year
    College of engg. Technology , moradabad
    Today’s PCB

     PCB’s getting smaller


     Increased population and
    I/O density
     Thermally sensitive
    materials
    THROUGH HOLE TECHNOLOGY
    ( THT )
    Leaded Components Getting Replaced
    By BGA

    Leaded IC replaced by BGA IC


    Today’s PCB Concerns

     Maximum I/O density


     Smallest footprint
     Component Manufacturers
    slowly replacing leaded
    devices with BGA’s
    Why BGA ???
     Smaller footprints
     Fragile leads absent
     Better thermal stability
     More reliable
     Easily replaced
     Less damage to logic network ckt
    What is BGA ???
     Consist of wire bonded die on
    substrate
     Substrate made of Copper Clad
    Bismalemide Triazine
     2 to 4 metal layers
    LEADED IC vs BGA IC

    LEADED IC

    BGA IC
    BGA Classification
     PBGA - die up cross section
    BGA Classification
     H-PBGA – die up cross section
    BGA Classification
     HL–PBGA – die down cross section
    Package Dimension
    PBGA ball array configurations
    HL-PBGA & H-PBGA ball array
    Configuration
    Manufacturing Of BGA

    REFLOW

    Solder balls Balls Pass


    picked Balls through
    placed on
    through dipped in oven &
    ICs
    vacuum flux inspection
    nozzles is done
    BGA Board Design
    BGA Mounting Process
     Pads are present on PCB
     Solder paste used as flux is applied
    on pads
     BGA component are placed
     Plate move for Reflow process
    Advantage of Using Paste
     It act as Flux
     Paste is sticky so hold component
    during reflow
     Paste contribute to final volume of
    solder in joints
    BGA component mounting

    BEFORE REFLOW AFTER REFLOW


    Self Centering Of BGA
    Pick n Place Machines
    Ball To Pad Placement

    Alignment of solder balls with solder pads on PCB using


    Pick n Place machine
    BGA Routing
    If BGA ICs fail Then ???
     When BGA IC get fail then it can
    be easily removed from PCB
     Steps involved
    1) Heating surface of Ic Using Hot Air
    2) Sucking the component using
    vacuum pipe
    3) New BGA placed
    What Happen If BGA solder balls have
    some defects ???

     Defects like Crack In solder ball,


    Ball alignment get disturbed
    REWORK With BGA
    Lets see this clip to understand
    Rework process
    Advantages
     BGA packages are smaller
     No fragile leads
     Board assembly improved
     Board inspection reduce
     Better thermal properties
    Thank You
    QUERIES

    You might also like