TEA1523P

INTEGRATED CIRCUITS
DATA SHEET
TEA152x family
STARplugTM
Product specification
File under Integrated Circuits, IC11
2000 Sep 08
Philips Semiconductors
STARplugTM
TEA152x family
FEATURES
A dedicated circuit for valley switching is built in (not

implemented in TEA152xAJM versions), which makes a
very efficient slim-line electronic powerplug concept
possible.
Designed for general purpose supplies up to 50 W

Integrated power switch:
TEA1520: 48 ; 650 V
In its most basic version of application, the TEA152x family

acts as a voltage source. Here, no additional secondary
electronics are required. A combined voltage and current
source can be realized with minimum costs for external
components. Implementation of the TEA152x family
renders an efficient and low cost power supply system.
TEA1521: 24 ; 650 V
TEA1522: 12 ; 650 V
TEA1523: 6.5 ; 650 V
TEA1524: 3.4 ; 650 V.
Operates from universal AC mains supplies
(80 to 276 V)
Table 1
Adjustable frequency for flexible design

RC oscillator for load insensitive regulation loop
constant
Valley switching for minimum switch-on loss (not
implemented in TEA152xAJM versions)
Frequency reduction at low power output makes low
standby power possible (<100 mW)
Available type numbers
RDS(on)
DIP8
SO14
DBS9P
48
TEA1520P
TEA1520T
24
TEA1521P
TEA1521T
12
TEA1522P
TEA1522T
TEA1522AJM
6.5
TEA1523P
TEA1523T
TEA1523AJM
3.4
TEA1524P
TEA1524AJM
Adjustable overcurrent protection

Under voltage protection
APPLICATIONS
Temperature protection
Typical application areas for the STARplugTM are:
Short circuit winding protection
Chargers
Simple application with both primary and secondary

(opto) feedback
Adapters
Available in 8-pin DIP, 14-pin SO and 9-pin DBS

packages.
DVD
STB (Set Top Box)

CD(R)
TV/monitor standby supplies
GENERAL DESCRIPTION
PC peripherals
The TEA152x family is a Switched Mode Power

Supply (SMPS) controller IC that operates directly from
the rectified universal mains. It is implemented in the high
voltage EZ-HV SOI process, combined with a low voltage
BICMOS process. The device includes a high voltage
power switch and a circuit for start-up directly from the
rectified mains voltage.
2000 Sep 08
Microcontroller supplies in home applications and small

portable equipment, etc.
STARplugTM
TEA152x family
QUICK REFERENCE DATA

SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Vdrain(max)
maximum voltage at the DRAIN

pin
Tj > 0 C
650
RDS(on)
drain-source on-state resistance

of TEA1520
Tj = 25 C; Isource = 0.06 A
48
55.2
Tj = 100 C; Isource = 0.06 A
68
78.2

of TEA1521
Tj = 25 C; Isource = 0.125 A
24
27.6
Tj = 100 C; Isource = 0.125 A
34
39.1
12
13.8

of TEA1522
of TEA1523
of TEA1524
Tj = 100 C; Isource = 0.25 A
17
19.6
6.5
7.5
9.0
10.0
3.4
3.9
4.8
5.5
40
VCC(max)
maximum supply voltage
fosc
frequency range of oscillator
10
100
200
kHz
Idrain
supply current drawn from DRAIN no auxiliary supply

pin
1.5
mA
Tamb
ambient temperature
20
+85
ORDERING INFORMATION
TYPE
NUMBER
TEA152xP
TEA152xT
TEA152xAJM
2000 Sep 08
PACKAGE
NAME
DESCRIPTION
VERSION
DIP8
plastic dual in-line package; 8 leads (300 mil)
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
plastic DIL-bent-SIL power package; 9 leads (lead length

12/11 mm); exposed die pad
SOT523-1
DBS9P
SOT97-1
STARplugTM
TEA152x family
BLOCK DIAGRAM
handbook, full pagewidth
VCC
SUPPLY
DRAIN
VALLEY
TEA152x
GND
LOGIC
n.c.
100 mV
PWM
stop
RC
OSCILLATOR
low freq
THERMAL
SHUTDOWN
PROTECTION
LOGIC
POWER-UP
RESET
1.8
SOURCE
blank
overcurrent
REG
0.5 V
2.5 V
10x
short circuit winding
0.75 V
MGT419
The valley switching circuit is not implemented in the TEA152xAJM versions.

The pinning shown in this diagram is the pinning of the DIP8 package. For the pinning of
the other packages, see the relevant pinning tables and pin configurations.
Fig.1 Block diagram.
2000 Sep 08
AUX
STARplugTM
TEA152x family
PINNING
PIN
SYMBOL
DESCRIPTION
TEA152xP
TEA152xT
TEA152xAJM
2, 3, 4, 5,
9 and 10
RC
frequency setting
REG
regulation input
SGND
signal ground; connected to exposed die pad; must be

connected to pin 2
input for voltage from auxiliary winding for timing

(demagnetization)
SOURCE
11
source of internal MOS switch
n.c.
12 and 13
not connected
14
drain of internal MOS switch; input for start-up current

and valley sensing
VCC
GND
AUX
DRAIN
supply voltage
ground
handbook, halfpage
VCC 1
8 DRAIN
GND 2
n.c.
handbook, halfpage
TEA152xP
RC
SOURCE
REG
AUX
MGT420
Fig.2 Pin configuration of TEA152xP.
VCC
GND
RC
REG
SGND
AUX
SOURCE
n.c.
DRAIN
TEA152xAJM
handbook, halfpage
VCC
14 DRAIN
GND
13 n.c.
GND
12 n.c.
GND
GND
10 GND
RC
REG
8 AUX
MGT422
Fig.4 Pin configuration of TEA152xAJM.
TEA152xT 11 SOURCE
GND
MGT421
Fig.3 Pin configuration of TEA152xT.
2000 Sep 08
STARplugTM
TEA152x family
FUNCTIONAL DESCRIPTION
Duty factor control
The TEA152x family is the heart of a compact flyback

converter, with the IC placed at the primary side. The
auxiliary winding of the transformer can be used for
indirect feedback to control the isolated output. This
additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be
implemented with an additional secondary sensing circuit
and optocoupler feedback.
The duty factor is controlled by the internal regulation

voltage and the oscillator signal on pin RC. The internal
regulation voltage is equal to the external regulation
voltage (minus 2.5 V) multiplied by the gain of the error
amplifier (typical 20 dB (10 )).
The TEA152x family uses voltage mode control. The

frequency is determined by the maximum transformer
demagnetizing time and the time of the oscillator. In the
first case, the converter operates in the Self Oscillating
Power Supply (SOPS) mode. In the latter case, it operates
at a constant frequency, which can be adjusted with
external components RRC and CRC. This mode is called
Pulse Width Modulation (PWM). Furthermore, a primary
stroke is started only in a valley of the secondary ringing.
This valley switching principle minimizes capacitive
switch-on losses.
A new cycle is started when the primary switch is switched

on (see Fig.5). After a certain time (determined by the
oscillator voltage RC and the internal regulation level), the
switch is turned off and the secondary stroke starts. The
internal regulation level is determined by the voltage on
pin REG. After the secondary stroke, the drain voltage
shows an oscillation with a frequency of approximately
1
---------------------------------------------------( 2 ( Lp Cp ) )
Start-up and under voltage lock-out

Initially, the IC is self supplying from the rectified mains
voltage. The IC starts switching as soon as the voltage on
pin VCC passes the VCC(start) level. The supply is taken
over by the auxiliary winding of the transformer as soon as
VCC is high enough and the supply from the line is stopped
for high efficiency operation.
When for some reason the auxiliary supply is not sufficient,
the high voltage supply also supplies the IC. As soon as
the voltage on pin VCC drops below the VCC(stop) level, the
IC stops switching and restarts from the rectified mains
voltage.
Oscillator
The frequency of the oscillator is set by the external
resistor and capacitor on pin RC. The external capacitor is
charged rapidly to the VRC(max) level and, starting from a
new primary stroke, it discharges to the VRC(min) level.
Because the discharge is exponential, the relative
sensitivity of the duty factor to the regulation voltage at low
duty factor is almost equal to the sensitivity at high duty
factors. This results in a more constant gain over the duty
factor range compared to PWM systems with a linear
sawtooth oscillator. Stable operation at low duty factors is
easily realized. For high efficiency, the frequency is
reduced as soon as the duty factor drops below a certain
value. This is accomplished by increasing the oscillator
charge time.
2000 Sep 08
Valley switching (not implemented in TEA152xAJM

versions)
where Lp is the primary self inductance and Cp is the

parasitic capacitance on the drain node.
As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for a low
drain voltage before starting a new primary stroke.
Figure 5 shows the drain voltage together with the valley
signal, the signal indicating the secondary stroke and the
RC voltage.
The primary stroke starts some time before the actual
valley at low ringing frequencies, and some time after the
actual valley at high ringing frequencies. Figure 6 shows a
typical curve for a reflected output voltage N Vo of 80 V.
This voltage is the output voltage Vo (see Fig.7)
transferred to the primary side of the transformer with the
factor N (determined by the turns ratio of the transformer).
Figure 6 shows that the system switches exactly at
minimum drain voltage for ringing frequencies of 480 kHz,
thus reducing the switch-on losses to a minimum.
At 200 kHz, the next primary stroke is started at 33 before
the valley. The switch-on losses are still reduced
significantly.
Demagnetization
The system operates in discontinuous conduction mode all
the time. As long as the secondary stroke has not ended,
the oscillator will not start a new primary stroke. During the
first tsuppr seconds, demagnetization recognition is
suppressed. This suppression may be necessary in
applications where the transformer has a large leakage
inductance and at low output voltages.
STARplugTM
TEA152x family
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
A
B
regulation level
RC
oscillator
MGT423
A: Start of new cycle with valley switching.

B: Start of new cycle in a classical PWM system.
Fig.5 Signals for valley switching.
MGT424
40
handbook, halfpage
phase
()
20
20
40
200
400
600
800
f (kHz)
Fig.6 Typical phase of drain ringing at switch-on (at N Vo = 80 V).
2000 Sep 08
STARplugTM
TEA152x family
Minimum and maximum duty factor
Output characteristics of complete powerplug
The minimum duty factor of the switched mode power

supply is 0%. The maximum duty factor is set to 75%
(typical value at 100 kHz oscillation frequency).
OUTPUT POWER
A wide range of output power levels can be handled by
choosing the RDS(on) and package of the TEA152x family.
Power levels up to 50 W can be realised.
Overcurrent protection
ACCURACY
The cycle-by-cycle peak drain current limit circuit uses the

external source resistor to measure the current. The circuit
is activated after the leading edge blanking time tleb. The
protection circuit limits the source voltage to VSRC(max),
and thus limits the primary peak current.
The accuracy of the complete converter, functioning as a

voltage source with primary sensing, is approximately 8%
(mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the
accuracy of the external components. For safety
requirements in case of optocoupler feedback loss, the
primary sensing remains active when an overvoltage
circuit is connected.
Short circuit winding protection

The short circuit winding protection circuit is also activated
after the leading edge blanking time. If the source voltage
exceeds the short circuit winding protection voltage Vswp,
the IC stops switching. Only a Power-on reset will restart
normal operation. The short circuit winding protection also
protects in case of a secondary diode short circuit.
EFFICIENCY
An efficiency of 75% at maximum output power can be
achieved for a complete converter designed for universal
mains.
Overtemperature protection
An accurate temperature protection is provided in the
device. When the junction temperature exceeds the
thermal shutdown temperature, the IC stops switching.
During thermal protection, the IC current is lowered to the
start-up current. The IC continues normal operation as
soon as the overtemperature situation has disappeared.
RIPPLE
A minimum ripple is obtained in a system designed for a
maximum duty factor of 50% under normal operating
conditions, and a minimized dead time. The magnitude of
the ripple in the output voltage is determined by the
frequency and duty factor of the converter, the output
current level and the value and ESR of the output
capacitor.
Overvoltage protection
Overvoltage protection can be achieved in the application
by pulling pin REG above its normal operation level. The
current primary stroke is terminated immediately, and no
new primary stroke is started until the voltage on pin REG
drops to its normal operation level. Pin REG has an
internal clamp. The current feed into this pin must be
limited.
2000 Sep 08
Input characteristics of complete powerplug

INPUT VOLTAGE
The input voltage range comprises the universal AC mains
(80 to 276 V).
STARplugTM
TEA152x family
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to
ground; positive currents flow into the device; pins VCC and RC are not allowed to be current driven, pins REG and AUX
are not allowed to be voltage driven.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX. UNIT
Voltages
0.4
+40
oscillator input voltage
0.4
+3
source of the DMOS power transistor voltage
0.4
+5
drain of the DMOS power transistor voltage
0.4
+650
IREG
regulation input current
mA
IAUX
auxiliary winding input current
10
+5
mA
Isource
source current of
TEA1520
0.25
+0.25 A
TEA1521
0.5
+0.5
VCC
low supply voltage
VRC
Vsource
Vdrain
continuous
Currents
Idrain
TEA1522
+1
TEA1523
+2
TEA1524
+3
TEA1520
0.25
+0.25 A
TEA1521
0.5
+0.5
drain current of
A
TEA1522
+1
TEA1523
+2
TEA1524
+3
General
Ptot
total power dissipation

TEA152xP
Tamb < 45 C
1.0
TEA152xT
Tamb < 50 C
1.0
TEA152xAJM
Tamb < 45 C without heatsink
1.5
Tstg
storage temperature
55
+150
Tamb
ambient temperature
20
+85
Tj
junction temperature
20
+145
Vesd
electrostatic discharge voltage
human body model; note 1
2500
machine model; note 2
200
Notes
1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. All pins are
2500 V maximum, except pin DRAIN, which is 1000 V maximum.
2. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 series resistor.
2000 Sep 08
STARplugTM
TEA152x family
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
VALUE
UNIT
note 1
TEA152xP
in free air
100
K/W
TEA152xT
in free air
91
K/W
TEA152xAJM
in free air
65
K/W
Note
1. Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the
printed-circuit board. See the TEA152x application notes for details.
QUALITY SPECIFICATION
In accordance with SNW-FQ-611 part E.
CHARACTERISTICS
Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing
into the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
normal operation
1.3
1.9
mA
start-up supply current
start-up
180
400
supply current drawn from DRAIN

pin
no auxiliary supply; Vdrain > 60 V
1.5
mA
with auxiliary supply; Vdrain > 60 V
30
125
Vdrain > 60 V
ICC(operate)
supply current
ICC(startup)
Idrain
ICC(ch)
VCC pin charging current
mA
VCC(start)
VCC start voltage
9.5
10
VCC(stop)
VCC stop voltage (under voltage

lock-out)
7.0
7.5
8.0
75
Pulse width modulator

min
minimum duty factor
max
maximum duty factor
f = 100 kHz
SOPS
Vdemag
demagnetization recognition
voltage level
50
100
150
mV
tsuppr
suppression of transformer ringing

at start of secondary stroke
1.0
1.5
2.0
RC oscillator
VRC(min)
minimum voltage of RC oscillator

setting
60
75
90
mV
VRC(max)
maximum voltage of RC oscillator

setting
2.4
2.5
2.6
tRC(ch)
RC charging time
fosc
frequency range of oscillator
10
100
200
kHz
2000 Sep 08
10
STARplugTM
SYMBOL
TEA152x family
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Duty factor regulator (pin REG)

VREG
input voltage
2.4
2.5
2.6
GV(erroramp)
voltage gain of error amplifier
20
dB
VREG(clamp)
clamping voltage at pin REG
7.5
102
102
V/s
200
550
800
kHz
150
ns
IREG = 6 mA
Valley switching (not implemented in TEA152xAJM versions)

dV/dtvalley
dV/dt for valley recognition
fvalley
ringing frequency for valley

switching
N Vo = 100 V
td(valley-swon) delay from valley recognition to

switch-on
Current and short circuit winding protection
Vsource(max)
maximum source voltage
td(propagation) delay from detecting VSRC(max) to

switch-off
Vswp
short circuit winding protection

voltage
tleb
blanking time for current and short

circuit winding protection
dV/dt = 0.1 V/s
0.47
0.50
0.53
dV/dt = 0.5 V/s
160
185
ns
dV/dt = 0.5 V/s
0.7
0.75
0.8
250
350
450
ns
Output stage (FET)

IL(drain)
drain leakage current
Vdrain = 650 V
125
V(BR)drain
drain breakdown voltage
Tj > 0 C
650
RDS(on)

of TEA1520
48
55.2
Tj = 100 C; Isource = 0.06 A
68
78.2

of TEA1521
Tj = 25 C; Isource = 0.125 A
24
27.6
Tj = 100 C; Isource = 0.125 A
34
39.1

of TEA1522
12
13.8
Tj = 100 C; Isource = 0.25 A
17
19.6
6.5
7.5

of TEA1523
of TEA1524
tdrain(f)
drain fall time
9.0
10.0
3.4
3.9
4.8
5.5
Vi = 300 V; no external capacitor at

drain
75
ns
Temperature protection
Tprot(max)
maximum temperature threshold
150
160
170
Tprot(hys)
hysteresis temperature
2000 Sep 08
11
STARplugTM
TEA152x family
APPLICATION INFORMATION
LF
D5
Z1
CF1
C5
D1
CF2
mains
R1
D2
R2
CVCC
VCC
GND
RRC
RC
R4
CRC
REG
7
TEA152xP
DRAIN
C6 - Ycap
n.c.
RI
SOURCE
AUX
RAUX
R3
MGT425
Fig.7 Primary sensed application; configuration for TEA152xP.
Further application information can be found in the TEA152x application notes.
2000 Sep 08
12
Vo
STARplugTM
TEA152x family
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
ME
seating plane
A2
A1
c
Z
w M
b1
e
(e 1)
MH
b2
5
pin 1 index
E
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b1
b2
D (1)
E (1)
e1
ME
MH
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.020
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
EIAJ
SOT97-1
050G01
MO-001
SC-504-8
2000 Sep 08
13
EUROPEAN
PROJECTION
ISSUE DATE
95-02-04
99-12-27
STARplugTM
TEA152x family
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
A
X
c
y
HE
v M A
Z
8
14
Q
A2
(A 3)
A1
pin 1 index
Lp
1
7
e
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (1)
HE
Lp
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.35

0.014 0.0075 0.34
0.16
0.15
0.050
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
Note
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
2000 Sep 08
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-22
99-12-27
14
8
0o
STARplugTM
TEA152x family
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
q1
non-concave
x
Eh
Dh
D
D1
view B: mounting base side
A2
q2
L2
L3
L1
9
e1
Z
e
w M
bp
0
5
scale
DIMENSIONS (mm are the original dimensions)

UNIT A2(2) bp
mm
D(1) D1(2) Dh E(1) Eh
2.7 0.80 0.58 13.2

2.3 0.65 0.48 12.8
10 mm
v M
c
e2
e1
e2
L1
L2
L3
6.2
14.7
3.0 12.4 11.4 6.7
3.5
3.5 2.54 1.27 5.08
5.8
14.3
2.0 11.0 10.0 5.5
4.5
3.7
2.8
q1
q2
3.4 1.15 17.5

4.85 3.8
3.1 0.85 16.3
3.6
v
0.8
0.3 0.02
Z(1)
1.65
1.10
Notes
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
98-11-12
00-07-03
SOT523-1
2000 Sep 08
EUROPEAN
PROJECTION
15
STARplugTM
TEA152x family
Typical reflow peak temperatures range from
215 to 250 C. The top-surface temperature of the
packages should preferable be kept below 230 C.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering

method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE
For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is

260 C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the

downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45 angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages

REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 C.
Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
2000 Sep 08
When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between
270 and 320 C.
16
STARplugTM
TEA152x family
Suitability of IC packages for wave, reflow and dipping soldering methods

SOLDERING METHOD
MOUNTING
PACKAGE
WAVE
suitable(2)
Through-hole mount DBS, DIP, HDIP, SDIP, SIL

Surface mount
REFLOW(1) DIPPING
suitable
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
suitable
suitable
suitable
recommended(4)(5)
LQFP, QFP, TQFP
not
SSOP, TSSOP, VSO
not recommended(6)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Sep 08
17
STARplugTM
TEA152x family
DATA SHEET STATUS

DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Production
This data sheet contains final specifications. Philips Semiconductors

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Sep 08
18
STARplugTM
TEA152x family
NOTES
2000 Sep 08
19
Philips Semiconductors a worldwide company

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,

Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 70
Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/01/pp20
Date of release: 2000
Sep 08
Document order number:
9397 750 07242

TEA1523P

Uploaded by

Copyright:

Available Formats

TEA1523P

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

TEA1523P

Uploaded by

Copyright:

Available Formats

INTEGRATED CIRCUITS

A dedicated circuit for valley switching is built in (not

Designed for general purpose supplies up to 50 W

In its most basic version of application, the TEA152x family

Adjustable frequency for flexible design

Available type numbers

Adjustable overcurrent protection

Typical application areas for the STARplugTM are:

Short circuit winding protection

Simple application with both primary and secondary

Available in 8-pin DIP, 14-pin SO and 9-pin DBS

STB (Set Top Box)

The TEA152x family is a Switched Mode Power

Microcontroller supplies in home applications and small

QUICK REFERENCE DATA

maximum voltage at the DRAIN

drain-source on-state resistance

Tj = 100 C; Isource = 0.06 A

drain-source on-state resistance

Tj = 100 C; Isource = 0.125 A

drain-source on-state resistance

Tj = 100 C; Isource = 0.25 A

Tj = 100 C; Isource = 0.5 A

Tj = 100 C; Isource = 1.0 A

maximum supply voltage

frequency range of oscillator

supply current drawn from DRAIN no auxiliary supply

plastic dual in-line package; 8 leads (300 mil)

plastic small outline package; 14 leads; body width 3.9 mm

plastic DIL-bent-SIL power package; 9 leads (lead length

handbook, full pagewidth

The valley switching circuit is not implemented in the TEA152xAJM versions.

Fig.1 Block diagram.

signal ground; connected to exposed die pad; must be

input for voltage from auxiliary winding for timing

source of internal MOS switch

drain of internal MOS switch; input for start-up current

Fig.2 Pin configuration of TEA152xP.

Fig.4 Pin configuration of TEA152xAJM.

Fig.3 Pin configuration of TEA152xT.

Duty factor control

The TEA152x family is the heart of a compact flyback

The duty factor is controlled by the internal regulation

The TEA152x family uses voltage mode control. The

A new cycle is started when the primary switch is switched

Start-up and under voltage lock-out

Valley switching (not implemented in TEA152xAJM

where Lp is the primary self inductance and Cp is the

handbook, full pagewidth

A: Start of new cycle with valley switching.

Fig.5 Signals for valley switching.

Fig.6 Typical phase of drain ringing at switch-on (at N Vo = 80 V).

Minimum and maximum duty factor

Output characteristics of complete powerplug

The minimum duty factor of the switched mode power

The cycle-by-cycle peak drain current limit circuit uses the

The accuracy of the complete converter, functioning as a

Short circuit winding protection

Input characteristics of complete powerplug

oscillator input voltage