Data Sheet No. PD60043 Rev.

IR2101(S)/IR2102(S) &(PbF)
HIGH AND LOW SIDE DRIVER
Features
Floating channel designed for bootstrap operation
Fully operational to +600V Tolerant to negative transient voltage dV/dt immune Gate drive supply range from 10 to 20V Undervoltage lockout 3.3V, 5V, and 15V logic input compatible Matched propagation delay for both channels Outputs in phase with inputs (IR2101) or out of phase with inputs (IR2102) Also available LEAD-FREE

Product Summary
VOFFSET IO+/VOUT ton/off (typ.) Delay Matching 600V max. 130 mA / 270 mA 10 - 20V 160 & 150 ns 50 ns

Packages

Description
The IR2101(S)/IR2102(S) are high voltage, high speed power MOSFET and IGBT drivers with independent high and low side referenced output channels. Pro8-Lead SOIC 8-Lead PDIP prietary HVIC and latch immune CMOS technologies IR2101S/IR2102S IR2101/IR2102 enable ruggedized monolithic construction. The logic input is compatible with standard CMOS or LSTTL output, down to 3.3V logic. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 600 volts.

Typical Connection
up to 600V VCC

VCC
HIN LIN

VB HO VS LO
TO LOAD

HIN LIN COM

IR2101
VCC

up to 600V

VCC
HIN

VB HO VS LO
TO LOAD

HIN LIN COM

(Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.

LIN

IR2102

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Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.

Symbol
VB VS VHO VCC VLO VIN dVS/dt PD RthJA TJ TS TL

Definition
High side floating supply voltage High side floating supply offset voltage High side floating output voltage Low side and logic fixed supply voltage Low side output voltage Logic input voltage (HIN & LIN) Allowable offset supply voltage transient Package power dissipation @ TA +25C Thermal resistance, junction to ambient Junction temperature Storage temperature Lead temperature (soldering, 10 seconds) (8 lead PDIP) (8 lead SOIC) (8 lead PDIP) (8 lead SOIC)

Min.
-0.3 VB - 25 VS - 0.3 -0.3 -0.3 -0.3 -55

Max.
625 VB + 0.3 VB + 0.3 25 VCC + 0.3 VCC + 0.3 50 1.0 0.625 125 200 150 150 300

Units

V/ns W C/W

Recommended Operating Conditions

The input/output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. The VS offset rating is tested with all supplies biased at 15V differential.

Symbol
VB VS VHO VCC VLO VIN TA

Definition
High side floating supply absolute voltage High side floating supply offset voltage High side floating output voltage Low side and logic fixed supply voltage Low side output voltage Logic input voltage (HIN & LIN) (IR2101) & (HIN & LIN) (IR2102) Ambient temperature

Min.
VS + 10 Note 1 VS 10 0 0 -40

Max.
VS + 20 600 VB 20 VCC VCC 125

Units

Note 1: Logic operational for VS of -5 to +600V. Logic state held for VS of -5V to -VBS. (Please refer to the Design Tip DT97-3 for more details).

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Dynamic Electrical Characteristics
VBIAS (VCC, VBS) = 15V, CL = 1000 pF and TA = 25C unless otherwise specified.

Symbol
ton toff tr tf MT

Definition
Turn-on propagation delay Turn-off propagation delay Turn-on rise time Turn-off fall time Delay matching, HS & LS turn-on/off

Min. Typ. Max. Units Test Conditions

160 150 100 50 220 220 170 90 50 ns VS = 0V VS = 600V

Static Electrical Characteristics

VBIAS (VCC, VBS) = 15V and TA = 25C unless otherwise specified. The VIN, VTH and IIN parameters are referenced to COM. The VO and IO parameters are referenced to COM and are applicable to the respective output leads: HO or LO.

Symbol
VIH VIL VOH VOL ILK IQBS IQCC IIN+ IINVCCUV+ VCCUVIO+

Definition
Logic 1 input voltage (IR2101) Logic 0 input voltage (IR2102) Logic 0 input voltage (IR2101) Logic 1input voltage (IR2102) High level output voltage, VBIAS - VO Low level output voltage, VO Offset supply leakage current Quiescent VBS supply current Quiescent VCC supply current Logic 1 input bias current Logic 0 input bias current VCC supply undervoltage positive going threshold VCC supply undervoltage negative going threshold Output high short circuit pulsed current

Min. Typ. Max. Units Test Conditions

3 30 150 3 V 0.8 100 100 50 55 270 10 A mV VCC = 10V to 20V IO = 0A IO = 0A VB = VS = 600V VIN = 0V or 5V VIN = 0V or 5V VIN = 5V (IR2101) VIN = 0V (IR2102) 8 7.4 130 8.9 8.2 210 1 9.8 9 mA V VIN = 0V (IR2101) VIN = 5V (IR2102) VCC = 10V to 20V

VO = 0V VIN = Logic 1 PW 10 s VO = 15V VIN = Logic 0 PW 10 s

IO-

Output low short circuit pulsed current

270

360

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Functional Block Diagram
VB Q PULSE FILTER R S VS HO

HV LEVEL SHIFT

HIN

PULSE GEN UV DETECT

VCC

LIN

LO

COM

IR2101

VB Q PULSE FILTER R S VS HO

Vcc
HIN

HV LEVEL SHIFT

PULSE GEN

Vcc
LIN

UV DETECT

VCC

LO

COM

IR2102

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IR2101(S)/IR2102(S) & (PbF)

Lead Definitions
Symbol
HIN HIN LIN LIN VB HO VS VCC LO COM

Description
Logic input for high side gate driver output (HO), in phase (IR2101) Logic input for high side gate driver output (HO), out of phase (IR2102) Logic input for low side gate driver output (LO), in phase (IR2101) Logic input for low side gate driver output (LO), out of phase (IR2102) High side floating supply High side gate drive output High side floating supply return Low side and logic fixed supply Low side gate drive output Low side return

Lead Assignments

8 Lead PDIP

8 Lead SOIC

IR2101

IR2101S

8 Lead PDIP

8 Lead SOIC

IR2102
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IR2102S
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IR2101(S)/IR2102(S) & (PbF)

HIN LIN

50%

50%

HIN LIN HIN LIN

HIN LIN
ton 50% 50%

tr 90%

toff 90%

tf

HO LO
Figure 1. Input/Output Timing Diagram

HO LO

10%

10%

Figure 2. Switching Time Waveform Definitions

HIN LIN

50%

50%

HIN LIN

50%

50%

LO

HO
10%

MT 90%

MT

LO

HO

Figure 3. Delay Matching Waveform Definitions

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IR2101(S)/IR2102(S) & (PbF)

500 Turn-On Delay Time (ns) 400 300 200 100 Max. Turn-On Delay Time (ns) 500 400 300 200

Max.

Typ.
100 0

Typ.

0 -50

-25

25

50

75

100

125

10

12

14

16

18

20

Temperature (C)

VBIAS Supply Voltage (V)

Figure 6A. Turn-On Time vs Temperature

Figure 6B. Turn-On Time vs Supply Voltage

500 Turn-On Delay Time (ns 400 300 200 100 0 0 2 4 6 8 10 12 14 16 18 20

Turn-Off Delay Time (ns)

5 00 4 00 3 00 2 00 1 00 T yp . 0 -50 -25 0 25 50 75 Temperature (C) 1 00 1 25 M ax .

Input Voltage (V)

Figure 6C. Turn-On Time vs Input Voltage

500

Figure 7A. Turn-Off Time vs Temperature

500 Turn-Off Delay Time (ns 400 300 200 100 0 Typ. Max.

Turn-Off Delay Time (ns)

400 300 200 Typ. 100 0 10 12 14 16 VBIAS Supply Voltage (V) 18 20 Max.

10

12

14

16

18

20

Input Voltage (V)

Figure 7B. Turn-Off Time vs Supply Voltage

Figure 7C. Turn-Off Time vs Input Voltage

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500 500

Turn-On Rise Time (ns)

400 300 200 100 Typ. 0 -5 0 -2 5 0 25 50 75 100 125

Turn-On Rise Time (ns)

400 300 M ax. 200 100 Typ. 0 10 12 14 16 18 20

M ax.

Temperature (C)

VBIAS Supply Voltage (V)

Figure 9A. Turn-On Rise Time vs Temperature

Figure 9B. Turn-On Rise Time vs Voltage

20 0

200

Turn-Off Fall Time (ns)

15 0

Turn-Off Fall Time (ns)

150 M a x. 100

10 0 M ax. 50 Ty p. 0 -50 -25 0 25 50 75 10 0 12 5

50 Typ. 0 10 12 14 16 18 20

Temperature (C)

VBIAS Supply Voltage (V)

Figure 10A. Turn-Off Fall Time vs Temperature

8 7
I pu t V ol g e (V ) n ta

Figure 10B. Turn-Off Fall Time vs Voltage

8 7 6 5 4 3 2 1 0 Mi n.

I ut V ol np tage (V )

6 5 4 3 2 1 0 -50 -25 0 25 50 75 10 0 12 5
Temperature (C)

Mi. n

10

12

14

16

18

20

Vcc Supply Voltage (V)

Figure 12A. Logic "1" Input Voltage (IR2101) Logic "0" Input Voltage (IR2102) vs Temperature 8

Figure 12B. Logic "1" Input Voltage (IR2101) Logic "0" Input Voltage (IR2102) vs Voltage www.irf.com

IR2101(S)/IR2102(S) & (PbF)

4 3 .2 I p u t V o l g e (V ) n ta 2 .4 1 .6 M ax. 0 .8 0 -5 0 -2 5 0 25 50 75 100 125
Temperature (C)

4 3.2 I nput V o l e (V ) tag 2.4 1.6 M ax . 0.8 0 10 12 14 16 18 20

Vcc Supply Voltage (V)

Figure 13A. Logic "0" Input Voltage (IR2101) Logic "1" Input Voltage (IR2102) vs Temperature
1

Figure 13B. Logic "0" Input Voltage (IR2101) Logic "1" Input Voltage (IR2102) vs Voltage
1

High Level Output Voltage (V)

High Level Output Voltage (V)

0 .8 0 .6 0 .4 M ax. 0 .2 0 -5 0 -2 5 0 25 50 75 100 125

0 .8 0 .6 0 .4 0 .2 0 10 12 14 16 18 20 M ax.

Temperature (C)

Vcc Supply Voltage (V)

Figure 14A. High Level Output vs Temperature

1

Figure 14B. High Level Output vs Voltage

Low Level Output Voltage (V)

0 .8 0 .6 0 .4 0 .2 0 -5 0 -2 5 0 25 50 75 100 125

Low Level Output Voltage (V)

0 .8 0 .6 0 .4 0 .2 M ax. 0 10 12 14 16 18 20

M ax.

Temperature (C)

Vcc Supply Voltage (V)

Figure 15A. Low Level Output vs Temperature www.irf.com

Figure 15B. Low level Output vs Voltage

IR2101(S)/IR2102(S) & (PbF)

Offset Supply Leakage Current (A)
500 400 300 200 100 M ax. 0 -5 0 -2 5 0 25 50 75 100 125

500

Offset Supply Leakage Current (A)

400 300 200 100 0 0 100 200 300 400 500 600

Max.

Temperature (C)

VB Boost Voltage (V)

Figure 16A. Offset Supply Current vs Temperature

1 50
150

Figure 16B. Offset Supply Current vs Voltage

VBS Supply Current (A)

1 20 90 60 M ax . 30 T yp . 0 -50 -25 0 25 50 75 1 00 1 25

VBS Supply Current (A)

120 90 60 30 Ty p. 0 10 12 14 16 18 20

Max .

Temperature (C)

VBS Floating Supply Voltage (V)

Figure 17A. VBS Supply Current vs Temperature

700 700

Figure 17B. VBS Supply Current vs Voltage

Vcc Supply Current (A)

600 500 400 300 200 100 0 -5 0 -2 5 0 25 50 75 100 125 Typ. M ax.

Vcc Supply Current (A)

600 500 400 300 200 100 Typ. 0 10 12 14 16 18 20 M ax.

Temperature (C)

Vcc Supply Voltage (V)

Figure 18A. Vcc Supply Current vs Temperature 10

Figure 18B. Vcc Supply Current vs Voltage www.irf.com

IR2101(S)/IR2102(S) & (PbF)

30

30

Logic 1 Input Current (A)

Logic 1 Input Current (A)

25 20 15 10 M ax. 5 Typ. 0 -5 0 -2 5 0 25 50 75 100 125

25 20 15 10 5 0 10 12 14 16 18 20 M ax. Typ.

Temperature (C)

Vcc Supply Voltage (V)

Figure 19A. Logic"1" Input Current vs Temperature

5
Logic "0" Input Current (uA)
Logic 0 Input Current (A)

Figure 19B. Logic"1" Input Current vs Voltage

5 4 3 2 Max. 1 0

4 3 2 Max. 1 0 -50

-25

25 50 75 Temperature (C)

100

125

10

12

14 16 VCC Supply Voltage (V)

18

20

Figure 20A. Logic "0" Input Current vs Temperature

11
VCC UVLO Threshold - (V) VCC UVLO Threshold +(V)

Figure 20B. Logic "0" Input Current vs Voltage

11

M ax. 10 9 8 7 6 -50 -25 0 25 50 75 100 125

Temperature (C)

10 Max. 9 Typ. 8 7 Min.

Typ. Mi n.

6 -50

-25

25

50

75

100

125

Temperature (C)

Figure 21A. Vcc Undervoltage Threshold(+) vs Temperature www.irf.com

Figure 21B. Vcc Undervoltage Threshold(-) vs Temperature 11

IR2101(S)/IR2102(S) & (PbF)

500
Output Source Current (mA) Output Source Current (mA)

500 400 300 200 Typ. 100 Min. 0

-25 0 25 50 75 Temperature (C) 100 125

400 300 200 100 Min. Typ.

0 -50

10

12

14 16 18 VBIAS Supply Voltage (V)

20

Figure 22A. Output Source Current vs Temperature

7 00
Output Sink Current (mA) Output Sink Current (mA)

Figure 22B. Output Source Current vs Voltage

70 0 60 0 50 0 40 0 30 0 20 0 Mi n. 10 0 0 10 12 14 16 18 20 Ty p.

6 00 5 00 4 00 3 00 Mi. n 2 00 1 00 0 -50 -25 0 25 50 75 1 00 1 25

Temperature (C)

T yp .

VBIAS Supply Voltage (V)

Figure 23A. Output Sink Current vs Temperature

Figure 23B. Output Sink Current vs Voltage

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Case outlines

8 Lead PDIP
D A 5 B
FOOTPRINT 8X 0.72 [.028]

01-6014 01-3003 01 (MS-001AB)

INCHES MIN .0532 .013 .0075 .189 .1497 MAX .0688 .0098 .020 .0098 .1968 .1574 MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 4.00

DIM A b c D

A1 .0040

6 E

5 H 0.25 [.010] A

E
6.46 [.255]

e e1 H K L
8X 1.78 [.070]

.050 BASIC .025 BASIC .2284 .0099 .016 0 .2440 .0196 .050 8

1.27 BASIC 0.635 BASIC 5.80 0.25 0.40 0 6.20 0.50 1.27 8

6X

e e1

3X 1.27 [.050]

A C 0.10 [.004] y

K x 45

8X b 0.25 [.010]
NOTES:

A1 C A B

8X L 7

8X c

1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994. 2. CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE C ONFORMS TO JEDEC OUTLINE MS-012AA.

5 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006]. 6 DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE.

8 Lead SOIC
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01-6027 01-0021 11 (MS-012AA)

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IR2101(S)/IR2102(S) & (PbF)

LEADFREE PART MARKING INFORMATION

Part number

IRxxxxxx YWW? ?XXXX

Lot Code (Prod mode - 4 digit SPN code) IR logo

Date code

Pin 1 Identifier ? P MARKING CODE Lead Free Released Non-Lead Free Released

Assembly site code Per SCOP 200-002

ORDER INFORMATION
Basic Part (Non-Lead Free) 8-Lead PDIP IR2101 order IR2101 8-Lead SOIC IR2101S order IR2101S 8-Lead PDIP IR2102 order IR2102 8-Lead SOIC IR2102S order IR2102S Leadfree Part 8-Lead PDIP IR2101 order IR2101PbF 8-Lead SOIC IR2101S order IR2101SPbF 8-Lead PDIP IR2102 order IR2102PbF 8-Lead SOIC IR2102S order IR2102SPbF

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245 Tel: (310) 252-7105 This product has been qualified per industrial level Data and specifications subject to change without notice. 4/2/2004

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