Lectures on

MEMS and MICROSYSTEMS DESIGN AND MANUFACTURE

Tai-Ran Hsu, ASME Fellow, Professor Microsystems Design and Packaging Laboratory Department of Mechanical and Aerospace Engineering San Jose State University San Jose, California, USA
E-mail: Tai-Ran.Hsu@sjsu.edu

Textbook: MEMS and Microsystems: design , manufacture, and nanoscale engineering, 2nd Edition, by Tai-Ran Hsu, John Wiley & Sons, Inc., Hoboken, New Jersey, 2008
(ISBN 978-0-470-08301-7)

CONTENT
Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5 Chapter 6 Chapter 7 Overview of MEMS and Microsystems Working Principles of Microsystems Engineering Science for Microsystems Design and Fabrications Engineering Mechanics for Microsystems Design Thermofluid Engineering and Microsystems Design Scaling Laws in Miniaturization Materials for MEMS and Microsystems

CONTENT Contd
Chapter 8 Chapter 9 Chapter 10 Chapter 11 Chapter 12 Microsystems Fabrication Processes Overview of Micromanufacturing Microsystems Design Assembly, Packaging, and Testing of Microsystems Introduction to Nanoscale Engineering

Chapter 1 Overview of MEMS and Microsystems

Hsu 2008

WHAT IS MEMS?
MEMS = MicroElectroMechanical System
Any engineering system that performs electrical and mechanical functions with components in micrometers is a MEMS. (1 m = 1/10 of human hair) Available MEMS products include: Micro sensors (acoustic wave, biomedical, chemical, inertia, optical, pressure, radiation, thermal, etc.) Micro actuators (valves, pumps and microfluidics; electrical and optical relays and switches; grippers, tweezers and tongs; linear and rotary motors, etc.) Read/write heads in computer storage systems. Inkjet printer heads. Micro device components (e.g., palm-top reconnaissance aircrafts, mini robots and toys, micro surgical and mobile telecom equipment, etc.)

HOW SMALL ARE MEMS DEVICES? in plain English please!

They can be of the size of a rice grain, or smaller! Two examples: - Inertia sensors for air bag deployment systems in automobiles - Microcars

Inertia Sensor for Automobile Air Bag Deployment System

Micro inertia sensor (accelerometer) in place:

Sensor-on-a-chip: (the size of a rice grain)

(Courtesy of Analog Devices, Inc)

Micro Cars
(Courtesy of Denso Research Laboratories, Denso Corporation, Aichi, Japan)

Rice grains

MEMS = a pioneer technology for Miniaturization

A leading technology for the 21st Century, and an inevitable trend in industrial products and systems development

Miniaturization of Digital Computers

- A remarkable case of miniaturization!

Size: 106 down Power: 106 up

The ENIAC Computer in 1946

A Lap-top Computer in 1996

Size: 108 down Power: 108 up

A Palm-top Computer in 2001

This spectacular miniaturization took place in 50 years!!

MINIATURIAZATION The Principal Driving Force for the 21st Century Industrial Technology
There has been increasing strong market demand for: Intelligent, Robust, Multi-functional,

and

Low-cost
market demand

industrial products.

Miniaturization is the only viable solution to satisfy such

Market Demand for Intelligent, Robusting, Smaller, Multi-Functional Products - the evolution of cellular phones
Mobil phones 10 Years Ago: Current State-of-the Art:

Size reduction

Palm-top Wireless PC

Transceive voice only

Transceive voice+ multi-media + others (Video-camera, e-mails, calendar,

and access to Internet, GPS and a PC with key pad input)

The only solution is to pack many miniature function components into the device

Miniaturization Makes Engineering Sense!!!

Small systems tend to move or stop more quickly due to low mechanical inertia. It is thus ideal for precision movements and for rapid actuation. Miniaturized systems encounter less thermal distortion and mechanical vibration due to low mass. Miniaturized devices are particularly suited for biomedical and aerospace applications due to their minute sizes and weight. Small systems have higher dimensional stability at high temperature due to low thermal expansion. Smaller size of the systems means less space requirements. This allows the packaging of more functional components in a single device. Less material requirements mean low cost of production and transportation. Ready mass production in batches.

Enabling Technologies for Miniaturization

Microsystems Technology
(MST) (1 m - 1 mm)* A top-down approach Initiated in 1947 with the invention of transistors, but the term Micromachining was coined in 1982

Miniature devices (1 nm - 1 mm)

A bottom-up approach

Nanotechnology (NT)
(0.1 nm 0. 1 m)**

Inspired by Richard Feynman in 1959, with active R&D began in around 1995 There is a long way to building nano devices!

* 1 m = 10-6 m one-tenth of human hair ** 1 nm = 10-9 m span of 10 H2 atoms

The Lucrative Revenue Prospects for Miniaturized Industrial Products

Microsystems technology: $43 billion - $132 billion* by Year 2005
( *High revenue projection is based on different definitions used for MST products)

Source: NEXUS http://www.smalltimes.com/document_display.cfm?document_id=3424

The Lucrative Revenue Prospects for Miniaturized Industrial Products Contd

Nanotechnology: $50 million in Year 2001 $26.5 billion in Year 2003
(if include products involving parts produced by nanotechnology)

$1 trillion by Year 2015 (US National Science Foundation) An enormous opportunity for manufacturing industry!! There has been colossal amount of research funding to NT by governments of industrialized countries around the world b/c of this enormous potential.

MEMS Products

MEMS as a Microsensor:
Power Supply

Input Signal

Micro Sensing Element

Transduction Unit

Output Signal

Micro pressure sensors

MEMS as a Microactuator- motor:

Power Supply

Output Action

Micro Actuating Element

Transduction Unit

Rotor Stators Torque Transmission Gear

Micro motor produced by a LIGA Process

Components of Microsystems
Power Supply

Signal Transduction & Processing Unit Sensor Actuator

Microsystem

Typical Microsystems Products

Inertia Sensor for Air Bag Deployment System

(Courtesy of Analog Devices, Inc.)

Inertia Sensor for Automobile Air Bag Deployment System

Micro inertia sensor (accelerometer) in place:

Sensor-on-a-chip: (the size of a rice grain) Collision

(Courtesy of Analog Devices, Inc)

Unique Features of MEMS and Microsystems

- A great challenge to engineers

Components are in micrometers with complex geometry using silicon, si-compounds and polymers:

25 m

A micro gear-train by Sandia National Laboratories 25 m

Capillary Electrophoresis (CE) Network Systems for Biomedic Analysis

A simple capillary tubular network with cross-sectional area of 20x30 m is illustrated below:
Buffer Reservoir,B Analyte Reservoir,A Injection Channel
Separation Channel

Analyte Waste Reservoir,A

Plug

Waste Reservoir,B

Silicon Substrate

Work on the principle of driving capillary fluid flow by applying electric voltages at the terminals at the reservoirs.

Commercial MEMS and Microsystems Products

Micro Actuators:
Grippers, tweezers and tongs Motors - linear and rotary Relays and switches Valves and pumps Optical equipment (switches, lenses &
mirrors, shutters, phase modulators, filters, waveguide splitters, latching & fiber alignment mechanisms)

Micro Sensors:
Acoustic wave sensors Biomedical and biosensors Chemical sensors Optical sensors Pressure sensors Stress sensors Thermal sensors

Microsystems = sensors + actuators + signal transduction: Microfluidics, e.g. Capillary Electrophoresis (CE) Microaccelerometers (inertia sensors)

Intelligent Microsystems - Micromechatronics systems

Package on a single Chip

INPUT: Desired Measurements or functions

Sensing and/or actuating element

Transduction unit

MEMS

Signal Conditioner & Processor

OUTPUT:

Controller

Actuator

Measurements or Actions

Signal Processor Comparator Measurements

Evolution of Microfabrication
There is no machine tool with todays technology can produce any device or MEMS component of the size in the micrometer scale (or in mm sizes). The complex geometry of these minute MEMS components can only be produced by various physical-chemical processes the microfabrication techniques originally developed for producing integrated circuit (IC) components.

Significant technological development towards miniaturization was initiated with the invention of transistors by three Nobel Laureates, W. Schockley, J. Bardeen and W.H. Brattain of Bell Laboratories in 1947. This crucial invention led to the development of the concept of integrated circuits (IC) in 1955, and the production of the first IC three years later by Jack Kilby of Texas Instruments. ICs have made possible for miniaturization of many devices and engineering systems in the last 50 years. The invention of transistors is thus regarded as the beginning of the 3rd Industrial Revolution in human civilization.

Comparison of Microelectronics and Microsystems

Microelectronics
Primarily 2-dimensional structures Stationary structures Transmit electricity for specific electrical functions IC die is protected from contacting media Use single crystal silicon dies, silicon compounds, ceramics and plastic materials Fewer components to be assembled Mature IC design methodologies Complex patterns with high density of electrical circuitry over substrates Large number of electrical feed-through and leads Industrial standards available Mass production Fabrication techniques are proven and well documented Manufacturing techniques are proven and well documented Packaging technology is relatively well established Primarily involves electrical and chemical engineering

Microsystems (silicon based)

Complex 3-dimensional structure May involve moving components Perform a great variety of specific biological, chemical, electromechanical and optical functions Delicate components are interfaced with working media Use single crystal silicon dies and few other materials, e.g. GaAs, quartz, polymers, ceramics and metals Many more components to be assembled Lack of engineering design methodology and standards Simpler patterns over substrates with simpler electrical circuitry Fewer electrical feed-through and leads No industrial standard to follow in design, material selections, fabrication processes and packaging Batch production, or on customer-need basis Many microfabrication techniques are used for production, but with no standard procedures Distinct manufacturing techniques Packaging technology is at the infant stage Involves all disciplines of science and engineering

The Multi-disciplinary Nature of Microsystems Engineering

Natural Science:
Physics & Biochemistry Electrochemical Processes Quantum physics Solid-state physics Scaling laws Mechanical Engineering Machine components design Precision machine design Mechanisms & linkages Thermomechanicas: (solid & fluid mechanics, heat transfer, fracture mechanics) Intelligent control Micro process equipment design and manufacturing Packaging and assembly design Material Science

Electrical Engineering Power supply Electric systems for electrohydrodynamics and signal transduction Electric circuit design Integration of MEMS and CMOS

Materials Engineering Materials for substrates & package Materials for signal mapping and transduction Materials for fabrication processes

Chemical Engineering Micro fabrication processes Thin film technology

Industrial Engineering Process design Production control Micro assembly

Commercialization of MEMS and Microsystems

Major commercial success: Pressure sensors and inertia sensors (accelerometers) with worldwide market of: Airbag inertia sensors at 2 billion units per year. Manifold absolute pressure sensors at 40 million units per year. Disposable blood pressure sensors at 20 million units per year. Recent Market Dynamics
Old MEMS
Pressure sensors Accelerometers Other MEMS

New MEMS
BioMEMS IT MEMS for Telecommunication: (OptoMEMS and RF MEMS)

Application of MEMS and Microsystems in Automotive Industry

52 million vehicles produced worldwide in 1996 There will be 65 million vehicle produced in 2005 Principal areas of application of MEMS and microsystems: Safety Engine and power train Comfort and convenience Vehicle diagnostics and health monitoring Telematics, e.g. GPS, etc.

Principal Sensors
(7) (4) (3) (6)(1)

(2) (10) (9) (5) (8)

(6) Gasoline direct injection pressure sensor (7) Fuel tank evaporative fuel pressure sensor (8) Engine oil sensor (9) Transmission sensor (10) Tire pressure sensor (1) Manifold or Temperature manifold absolute pressure sensor (2) Exhaust gas differential pressure sensor (3) Fuel rail pressure sensor (4) Barometric absolute pressure sensor (5) Combustion sensor

Silicon Capacitive Manifold Absolute Pressure Sensor

Application of MEMS and Microsystems in Aerospace Industry

Cockpit instrumentation. Sensors and actuators for safety - e.g. seat ejection Wind tunnel instrumentation Sensors for fuel efficiency and safety Microsattellites Command and control systems with MEMtronics Inertial guidance systems with microgyroscopes, accelerometers and fiber optic gyroscope. Attitude determination and control systems with micro sun and Earth sensors. Power systems with MEMtronic switches for active solar cell array reconfiguration, and electric generators Propulsion systems with micro pressure sensors, chemical sensors for leak detection, arrays of single-shot thrustors, continuous microthrusters and pulsed microthrousters Thermal control systems with micro heat pipes, radiators and thermal switches Communications and radar systems with very high bandwidth, low-resistance radio-frequency switches, micromirrors and optics for laser communications, and micro variable capacitors, inductors and oscillators.

Application of MEMS and Microsystems in Biomedical Industry

Disposable blood pressure transducers: Lifetime 24 to 72 hours; annual production 20 million units/year, unit price $10 Catheter tip pressure sensors Sphygmomanometers Respirators Lung capacity meters Barometric correction instrumentation Medical process monitoring Kidney dialysis equipment Micro bio-analytic systems: bio-chips, capillary electrophoresis, etc.

Application of MEMS and Microsystems in Consumer Products

Scuba diving watches and computers Bicycle computers Sensors for fitness gears Washers with water level controls Sport shoes with automatic cushioning control Digital tire pressure gages Vacuum cleaning with automatic adjustment of brush beaters Smart toys

Application of MEMS and Microsystems in the Telecommunication Industry

Optical switching and fiber optic couplings RF relays and switches Tunable resonators
Microlenses: Microswitches:

Projected Market for OptoMEMS

Unit: $million

Micro Optical Switches

2-Dimensional 3-Dimensional

Concluding Remarks
1. Miniaturization of machines and devices is an inevitable trend in technological development in the new century. 2. There is a clear trend that microsystems technology will be further scaled down to the nano level. (1 nm = 10-3 m = 10 shoulder-to-shoulder H2 atoms). 3. Despite the fact that many microelectronics technologies can be used to fabricate silicon-based MEMS components, microsystems engineering requires the application of principles involving multidisciplines in science and engineering. 4. Team effort involving multi-discipline of science and engineering is the key to success for any MEMS industry.

End of Chapter 1