INTEGRATED CIRCUITS

DATA SHEET

TDA1519 2 x 6 W stereo car radio power amplifier

Product specication File under Integrated Circuits, IC01 May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

GENERAL DESCRIPTION

TDA1519

The TDA1519 is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic medium power package. The device is primarily developed for car radio applications. Features Requires very few external components High output power Fixed gain Good ripple rejection Mute/stand-by switch Load dump protection AC and DC short-circuit-safe to ground and VP QUICK REFERENCE DATA PARAMETER Supply voltage range operating non-operating load dump protected Repetitive peak output current Total quiescent current Stand-by current Switch-on current Input impedance Output power THD = 0,5%; 4 THD = 10%; 4 Channel separation Noise output voltage Supply voltage ripple rejection f = 100 Hz f = 1 kHz to 10 kHz Crystal temperature VP VP VP IORM Itot Isb Isw |ZI| Po Po Vno(rms) SVRR SVRR Tc 6,0 50 40 40 48 14,4 40 0,1 5 6 150 18,0 30 45 2,5 80 100 40 150 V V V A mA A A k W W dB V dB dB C CONDITIONS SYMBOL MIN. TYP. MAX. UNIT Thermally protected Reverse polarity safe Capability to handle high energy on outputs (VP = 0 V) No switch-on/switch-off plop Protected against electrostatic discharge Compatible with TDA1517 (except gain).

PACKAGE OUTLINE 9-lead SIL-bent-to-DIL; plastic (SOT110B); SOT110-1; 1996 July 19.

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

TDA1519

Fig.1 Block diagram.

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

PINNING 1 2 3 4 5 6 7 8 9 INV1 GND1 SVRR OUT1 GND2 OUT2 VP M/SS INV2 non-inverting input 1 ground (signal) supply voltage ripple rejection output 1 ground (substrate) output 2 supply voltage mute/stand-by switch non-inverting input 2

TDA1519

FUNCTIONAL DESCRIPTION The TDA1519 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB. A special feature of this device is the mute/stand-by switch which has the following features: low stand-by current (< 100 A) low mute/stand-by switching current (low cost supply switch) mute condition. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage operating non-operating load dump protected during 50 ms; tr 2,5 ms AC and DC short-circuit-safe voltage Reverse polarity Energy handling capability at outputs Non-repetitive peak output current Repetitive peak output current Total power dissipation Crystal temperature Storage temperature range see Fig.2 VP = 0 V IOSM IORM Ptot Tc Tstg VP VPSC VPR 55 45 18 6 200 4 2,5 15 150 + 150 V V V mJ A A W C C VP VP 18 30 V V CONDITIONS SYMBOL MIN. MAX. UNIT

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

TDA1519

Fig.2 Power derating curve.

DC CHARACTERISTICS (note 1) VP = 14,4 V; Tamb = 25 C; unless otherwise specied PARAMETER Supply Supply voltage range Quiescent current DC output voltage Mute/stand-by switch Switch-on voltage level Mute condition Output signal in mute position VI = 1 V (max.); f = 20 Hz to 15 kHz Stand-by condition DC current in stand-by condition Switch-on current VO Vsb Isb Isw 0 12 20 2 100 40 mV V A A see Fig.3 VON Vmute 8,5 3,3 6,4 V V note 3 note 2 VP IP VO 6,0 14,4 40 6,95 18,0 80 V mA V CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

AC CHARACTERISTICS (note 1) VP = 14,4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; unless otherwise specied PARAMETER Output power CONDITIONS note 4; THD = 0,5% THD = 10% Total harmonic distortion Low frequency roll-off Po = 1 W note 5; 3 dB High frequency roll-off Closed loop voltage gain Supply voltage ripple rejection ON ON mute stand-by Input impedance Noise output voltage ON ON mute Channel separation Channel balance Notes to the characteristics 1. All characteristics are measured using the circuit shown in Fig.4. 2. The circuit is DC adjusted at VP = 6 V to 18 V and AC operating at VP = 8,5 V to 18 V. 3. At 18 V < VP < 30 V the DC output voltage VP/2. 4. Output power is measured directly at the output pins of the IC. 5. Frequency response externally fixed. note 7; RS = 0 RS = 10 k note 8 RS = 10 k Vno(rms) Vno(rms) Vno(rms) |Gv| 40 150 250 120 0,1 500 1 note 6 f = 100 Hz f = 10 Hz to 10 kHz SVRR SVRR SVRR SVRR |Zi| 40 48 48 80 50 60 75 1 dB fL fH Gv 20 39 45 40 41 Po Po THD 4 5,5 5 6,0 0,1 SYMBOL MIN. TYP.

TDA1519

MAX.

UNIT

W W %

Hz kHz dB

dB dB dB dB k V V V dB dB

6. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V) and a frequency between 100 Hz and 10 kHz. 7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 8. Noise output voltage independent of RS (VI = 0 V).

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

TDA1519

Fig.3 Stand-by, mute and ON conditions.

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

APPLICATION INFORMATION

TDA1519

Fig.4 Application circuit diagram.

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads

TDA1519

SOT110-1

D1 q P P1 A2

A3 q1 q2

A A4 seating plane E pin 1 index

L 1 Z b2 e b b1 w M 9 Q

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-02-25

May 1992

Philips Semiconductors

Product specication

2 x 6 W stereo car radio power amplier

SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IC Package Databook (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values

TDA1519

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.

This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

May 1992

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