Datasheet 74153
Datasheet 74153
Datasheet 74153
1. General description
The 74LV153 is a low-voltage Si-gate CMOS device that is pin and function compatible with 74HC153 and 74HCT153. The 74LV153 provides a dual 4-input multiplexer which selects 2 bits of data from up to four sources selected by common data select inputs (S0, S1). The two 4-input multiplexer circuits have individual active LOW output enable inputs (1E, 2E) which can be used to strobe the outputs independently. The outputs (1Y, 2Y) are forced LOW when the corresponding output enable inputs are HIGH. The 74LV153 is the logic implementation of a 2-pole, 4-position switch, where the position of the switch, is determined by the logic levels applied to S0 and S1. The logic equations for the outputs are: 1Y = 1E (1I0 S1 S0 + 1I1 S1 S0 + 1I2 S1 S0 + 1I3 S1 S0) 2Y = 2E (2I0 S1 S0 + 2I1 S1 S0 + 2I2 S1 S0 + 2I3 S1 S0) The 74LV153 can be used to move data to a common output bus from a group of registers. The state of the select inputs would determine the particular register from which the data came. An alternative application is a function generator. The device can generate two functions or three variables. This is useful for implementing highly irregular random logic.
NXP Semiconductors
74LV153
Dual 4-input multiplexer
3. Ordering information
Table 1. Ordering information Package Temperature range 74LV153N 74LV153D 74LV153DB 74LV153PW 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C Name DIP16 SO16 SSOP16 TSSOP16 Description plastic dual in-line package; 16 leads (300 mil) plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT38-4 SOT109-1 SOT338-1 SOT403-1 Type number
4. Functional diagram
1 2E 1Y
1I0 1I1 1I2 1I3 S0 S1 2I0 2I1 2I2 2I3 MUX MUX
10 11 12 13
2Y
2E 15
001aal844
Fig 1.
Logic symbol
Fig 2.
Functional diagram
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1E
1I3
1I2
1I1
1I0
S0
S1
2I3
2I2
2I1
2I0
2E
1Y
2Y
001aal845
Fig 3.
Logic diagram
5. Pinning information
5.1 Pinning
74LV153
1E S1 1I3 1I2 1I1 1I0 1Y GND 1 2 3 4 5 6 7 8
001aal846
16 VCC 15 2E 14 S0 13 2I3 12 2I2 11 2I1 10 2I0 9 2Y 1E S1 1l3 1l2 1l1 1l0 1Y GND 1 2 3 4 5 6 7 8
001aal847
74LV153
16 VCC 15 2E 14 S0 13 2l3 12 2l2 11 2l1 10 2l0 9 2Y
Fig 4.
Fig 5.
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Dual 4-input multiplexer
6. Functional description
Table 3. Function table H = HIGH voltage level; L = LOW voltage level; X = dont care. select Inputs S0 X L L H H L L H H S1 X L L L L H H H H data inputs nI0 X L H X X X X X X nI1 X X X L H X X X X nI2 X X X X X L H X X nI3 X X X X X X X L H output enable nE H L L L L L L L L output nY L L H L H L H L H
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Parameter supply voltage input clamping current output clamping current output current supply current ground current storage temperature VI < 0.5 V or VI > VCC + 0.5 V VO < 0.5 V or VO > VCC + 0.5 V VO = 0.5 V to (VCC + 0.5 V)
[1] [1]
Conditions
Min 0.5 50 65
Unit V mA mA mA mA mA C
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Table 4. Limiting values continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Ptot Parameter total power dissipation DIP16 package SO16 package (T)SSOP16 package
[1] [2] [3] [4]
Min -
Unit mW mW mW
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. Ptot derates linearly with 12 mW/K above 70 C. Ptot derates linearly with 8 mW/K above 70 C. Ptot derates linearly with 5.5 mW/K above 60 C.
Conditions
[1]
Min 1.0 0 0 40 -
The static characteristics are guaranteed from VCC = 1.2 V to VCC = 5.5 V, but LV devices are guaranteed to function down to VCC = 1.0 V (with input levels GND or VCC).
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Dual 4-input multiplexer
9. Static characteristics
Table 6. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH HIGH-level input voltage Conditions VCC = 1.2 V VCC = 2.0 V VCC = 2.7 V to 3.6 V VIL LOW-level input voltage VCC = 1.2 V VCC = 2.0 V VCC = 2.7 V to 3.6 V VOH HIGH-level output voltage VI = VIH or VIL lO = 100 A; VCC = 1.2 V lO = 100 A; VCC = 2.0 V lO = 100 A; VCC = 2.7 V lO = 100 A; VCC = 3.0 V lO = 6 mA; VCC = 3.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 100 A; VCC = 1.2 V IO = 100 A; VCC = 2.0 V IO = 100 A; VCC = 2.7 V IO = 100 A; VCC = 3.0 V IO = 6 mA; VCC = 3.0 V II ICC ICC CI
[1]
40 C to +85 C Min 0.9 1.4 2.0 1.8 2.5 2.8 2.4 Typ[1] 1.2 2.0 2.7 3.0 2.82 0 0 0 0 0.25 3.5 Max 0.3 0.6 0.8 0.2 0.2 0.2 0.40 1.0 20.0 500 -
40 C to +125 C Unit Min 0.9 1.4 2.0 1.8 2.5 2.8 2.2 Max 0.3 0.6 0.8 0.2 0.2 0.2 0.50 1.0 160 850 V V V V V V V V V V V V V V V V A A A pF
input leakage current supply current additional supply current input capacitance
VI = VCC or GND; VCC = 3.6 V VI = VCC or GND; IO = 0 A; VCC = 3.6 V per input; VI = VCC 0.6 V; VCC = 2.7 V to 3.6 V
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Unit
85 29 21 14 16 90 31 23 14 17 60 20 15 10 11 30
56 41 33 58 43 34 39 29 23 -
66 49 39 70 51 41 46 34 27 -
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF
All typical values are measured at Tamb = 25 C. tpd is the same as tPLH and tPHL. Typical values are measured at nominal supply voltage (VCC = 3.3 V) unless otherwise stated. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz, fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in V N = number of inputs switching (CL VCC2 fo) = sum of the outputs.
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11. Waveforms
VI 1In, 2In input GND tPHL VOH nY output VOL VM
001aal848
VM
tPLH
Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6.
VM
tPLH
Measurement points are given in Table 8. VOL and VOH are typical voltage output levels that occur with the output load.
The input (Sn, nE) to output (nY) propagation delays Measurement points Input VM 0.5VCC 1.5 V Output VM 0.5VCC 1.5 V
Supply voltage
2.7 V to 3.6 V
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VO
001aaa663
Test data is given in Table 9. Definitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. RL = Load resistance. CL = Load capacitance including jig and probe capacitance.
Test circuit for measuring switching times Test data Input VI VCC 2.7 V tr, tf 2.5 ns 2.5 ns
Supply voltage
2.7 V to 3.6 V
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D seating plane
ME
A2
A1
c Z e b1 b 16 9 b2 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.03
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
Fig 9.
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SOT109-1
A X
c y HE v M A
Z
16 9
Q A2 A1 pin 1 index Lp
1 8
(A 3)
L w M detail X
bp
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 8o o 0
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION
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SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A
X
c y HE v M A
Z
16 9
Q A2 pin 1 index Lp L
1 8
A1
(A 3)
detail X w M
bp
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8o o 0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
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TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
c y HE v M A
16
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8o o 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
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13. Abbreviations
Table 10. Acronym CMOS DUT ESD HBM MM TTL Abbreviations Description Complementary Metal Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model Transistor-Transistor Logic
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Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Definitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customers sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). Customer is responsible for doing all necessary testing for the customers applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.
NXP B.V. 2011. All rights reserved.
15.3 Disclaimers
Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or
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NXP Semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications.
Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
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17. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 December 2011 Document identifier: 74LV153