Tda 8172
Tda 8172
Tda 8172
BLOCK DIAGRAM
October 2003
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TDA8172
THERMAL DATA
Symbol Rth(j-c) Parameter Thermal Resistance Junction-case Value 3 Unit C/W
ELECTRICAL CHARACTERISTICS
Parameter Pin 2 Quiescent Current Pin 6 Quiescent Current Amplifier Input Bias Current Pin 3 Saturation Voltage to GND Quiescent Output Voltage Output Saturation Voltage to GND Output Saturation Voltage to Supply Junction Temperature for Thermal Shutdown Test Conditions I3 = 0, I5 = 0 I3 = 0, I5 = 0 V1 = 1 V, V7 = 2 V V1 = 2 V, V7 = 1 V I3 = 20 mA VS = 35V, Ra = 39 k I5 = 1.2 A I5 = 0.7 A V5H Tj - I5 = 1.2 A - I5 = 0.7 A Min. Typ. Max. Unit Fig. 8 16 - 0.1 - 0.1 1 18 1 0.7 1.6 1.3 140 1.4 1 2.2 1.8 16 36 -1 -1 1.5 mA mA 1 1 1 1 3 4 3 3 2 2
(refer to the test circuits, VS = 35V, Tamb = 25C unless otherwise specified)
Symbol I2 I6 I1 V3L V5 V5L
A A
V V V V V V C
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TDA8172
Figure 1. Measurement of I1, I2, I6 Figure 2. Measurement of V5H
TDA8172
TDA8172
Figure 4. Measurement of V5
TDA8172
2V
7 4
TDA8172
V7 5 7 V7 4 V3L V5L 5.6k
V5
Ra
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TDA8172
1N4001
VS
C1 0.1F
C2 470F
D1
C3 220F
tfly
2 VREF
GND t0 RT1 Vi R1 10k 4.7k
3
V7
Ly
TDA8172
1 4
5
C4 0.22F R7 1.5 R6 330
to
Ly 24.6mH Ry 9.6
R5 8.2
t0
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TDA8172
MOUNTING INSTRUCTIONS
The power dissipated in the circuit is removed by adding an external heatsink. With the HEPTAWATT package, the heatsink is simply attached with a screw or a compression spring (clip). A layer of silicon grease inserted between heatsink and package optimizes thermal contact ; no electrical isolation is needed between the two surfaces since the tab is connected to Pin 4 which is ground. Figure 6. Mounting examples
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TDA8172
L1
M1 A
D1
L2 L5 L3
G1
H3
Dia.
F
F1
L7 L6
Dimensions A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia.
Min.
Millimeters Typ.
H2
2.4 1.2 0.35 0.6 2.41 4.91 7.49 10.05 16.97 14.92 21.54 22.62 2.6 15.1 6 2.8 5.08 3.65 2.54 5.08 7.62
Max. 4.8 1.37 2.8 1.35 0.55 0.8 0.9 2.67 5.21 7.8 10.4 10.4
Min.
Inches Typ.
G2
0.094 0.047 0.014 0.024 0.095 0.193 0.295 0.396 0.668 0.587 0.848 0.891 0.100 0.200 0.300
Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409
3 15.8 6.6
3.85
0.144
0.152
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TDA8172
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. www.st.com
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