lm2596 Power Supply Driver
lm2596 Power Supply Driver
lm2596 Power Supply Driver
LM2596 SIMPLE SWITCHER Power Converter 150 kHz 3A Step-Down Voltage Regulator
Check for Samples: LM2596
1
FEATURES
3.3V, 5V, 12V, and Adjustable Output Versions Adjustable Version Output Voltage Range, 1.2V to 37V 4% Max Over Line and Load Conditions Available in TO-220 and TO-263 Packages Ensured 3A Output Load Current Input Voltage Range Up to 40V Requires Only 4 External Components Excellent Line and Load Regulation Specifications 150 kHz Fixed Frequency Internal Oscillator TTL Shutdown Capability Low Power Standby Mode, IQ Typically 80 A High Efficiency Uses Readily Available Standard Inductors Thermal Shutdown and Current Limit Protection
DESCRIPTION
The LM2596 series of regulators are monolithic integrated circuits that provide all the active functions for a step-down (buck) switching regulator, capable of driving a 3A load with excellent line and load regulation. These devices are available in fixed output voltages of 3.3V, 5V, 12V, and an adjustable output version. Requiring a minimum number of external components, these regulators are simple to use and include internal frequency compensation , and a fixed-frequency oscillator. The LM2596 series operates at a switching frequency of 150 kHz thus allowing smaller sized filter components than what would be needed with lower frequency switching regulators. Available in a standard 5-lead TO-220 package with several different lead bend options, and a 5-lead TO-263 surface mount package. A standard series of inductors are available from several different manufacturers optimized for use with the LM2596 series. This feature greatly simplifies the design of switch-mode power supplies. Other features include a ensured 4% tolerance on output voltage under specified input voltage and output load conditions, and 15% on the oscillator frequency. External shutdown is included, featuring typically 80 A standby current. Self protection features include a two stage frequency reducing current limit for the output switch and an over temperature shutdown for complete protection under fault conditions. (1)
(1) Patent Number 5,382,918.
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APPLICATIONS
Simple High-Efficiency Step-Down (Buck) Regulator On-Card Switching Regulators Positive to Negative Converter
Typical Application
(Fixed Output Voltage Versions)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SIMPLE SWITCHER is a registered trademark of Texas Instruments. All other trademarks are the property of their respective owners.
Copyright 19992013, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
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Connection Diagrams
Figure 1. 5-Lead Bent and Staggered Leads, Through Hole TO-220 (T) Package See Package Number NDH0005D
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
(1) (2)
Output Voltage to Ground (Steady State) Power Dissipation Storage Temperature Range ESD Susceptibility Human Body Model Lead Temperature DDPAK/TO-263 Package Vapor Phase (60 sec.) Infrared (10 sec.) TO-220 Package (Soldering, 10 sec.) Maximum Junction Temperature (1) (2) (3)
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin.
Operating Conditions
Temperature Range Supply Voltage 40C TJ +125C 4.5V to 40V
LM2596
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Conditions
Typ
(1)
Limit
(2)
Units (Limits)
Test Circuit Figure 20 4.75V VIN 40V, 0.2A ILOAD 3A 3.3 3.168/3.135 3.432/3.465 V V(min) V(max) %
Output Voltage
Efficiency
73
Typical numbers are at 25C and represent the most likely norm. All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be as shown in system parameters of Electrical Characteristics section.
Conditions
Typ
(1)
Limit
(2)
Units (Limits)
Test Circuit Figure 20 7V VIN 40V, 0.2A ILOAD 3A 5.0 4.800/4.750 5.200/5.250 V V(min) V(max) %
Output Voltage
Efficiency
80
Typical numbers are at 25C and represent the most likely norm. All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be as shown in system parameters of Electrical Characteristics section.
Conditions
Typ
(1)
Limit
(2)
Units (Limits)
Test Circuit Figure 20 15V VIN 40V, 0.2A ILOAD 3A 12.0 11.52/11.40 12.48/12.60 V V(min) V(max) %
Output Voltage
Efficiency
90
Typical numbers are at 25C and represent the most likely norm. All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be as shown in system parameters of Electrical Characteristics section. Submit Documentation Feedback Product Folder Links: LM2596 3
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Conditions
Typ
(1)
Limit
(2)
Units (Limits)
Test Circuit Figure 20 4.5V VIN 40V, 0.2A ILOAD 3A VOUT programmed for 3V. Circuit of Figure 20 1.230 1.193/1.180 1.267/1.280 73 V V(min) V(max) %
Feedback Voltage
Efficiency
Typical numbers are at 25C and represent the most likely norm. All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). External components such as the catch diode, inductor, input and output capacitors, and voltage programming resistors can affect switching regulator system performance. When the LM2596 is used as shown in the Figure 20 test circuit, system performance will be as shown in system parameters of Electrical Characteristics section.
Limit
(2)
Units (Limits)
DEVICE PARAMETERS Ib fO Feedback Bias Current Oscillator Frequency Adjustable Version Only, VFB = 1.3V See
(3)
nA nA (max) kHz kHz(min) kHz(max) V 1.4/1.5 V(max) % A 3.6/3.4 6.9/7.5 A(min) A(max) A(max) mA 30 mA(max) mA 10 mA(max)
VSAT DC ICL
Saturation Voltage Max Duty Cycle (ON) Min Duty Cycle (OFF) Current Limit
(4) (5)
1.16 100 0
Peak Current
(4) (5)
4.5
IL
Output = 0V
50 2 5
Typical numbers are at 25C and represent the most likely norm. All limits specified at room temperature (standard type face) and at temperature extremes (bold type face). All room temperature limits are 100% production tested. All limits at temperature extremes are ensured via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). The switching frequency is reduced when the second stage current limit is activated. No diode, inductor or capacitor connected to output pin. Feedback pin removed from output and connected to 0V to force the output transistor switch ON. Feedback pin removed from output and connected to 12V for the 3.3V, 5V, and the ADJ. version, and 15V for the 12V version, to force the output transistor switch OFF. VIN = 40V. Submit Documentation Feedback Product Folder Links: LM2596
Copyright 19992013, Texas Instruments Incorporated
LM2596
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Typ
(1)
Limit
(2)
Units (Limits) A
80 200/250 2 50 50 30 20
TO-220 or TO-263 Package, Junction to Case TO-220 Package, Junction to Ambient TO-263 Package, Junction to Ambient TO-263 Package, Junction to Ambient TO-263 Package, Junction to Ambient
(8) (9) (10) (11)
Junction to ambient thermal resistance (no external heat sink) for the TO-220 package mounted vertically, with the leads soldered to a printed circuit board with (1 oz.) copper area of approximately 1 in2. (9) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single printed circuit board with 0.5 in2 of (1 oz.) copper area. (10) Junction to ambient thermal resistance with the TO-263 package tab soldered to a single sided printed circuit board with 2.5 in2 of (1 oz.) copper area. (11) Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in2 of (1 oz.) copper area on the LM2596S side of the board, and approximately 16 in2 of copper on the other side of the p-c board. See Application Information in this data sheet and the thermal model in Switchers Made Simple version 4.3 software.
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Figure 3.
Efficiency
Figure 7.
Figure 8.
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Figure 12.
Switching Frequency
Figure 13.
Figure 14.
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Figure 15. Discontinuous Mode Switching Waveforms VIN = 20V, VOUT = 5V, ILOAD = 500 mA L = 10 H, COUT = 330 F, COUT ESR = 45 m
A: Output Pin Voltage, 10V/div. B: Inductor Current 1A/div. C: Output Ripple Voltage, 50 mV/div. Figure 16. Horizontal Time Base: 2 s/div. Load Transient Response for Continuous Mode VIN = 20V, VOUT = 5V, ILOAD = 500 mA to 2A L = 32 H, COUT = 220 F, COUT ESR = 50 m
A: Output Pin Voltage, 10V/div. B: Inductor Current 0.5A/div. C: Output Ripple Voltage, 100 mV/div. Figure 17. Horizontal Time Base: 2 s/div.
A: Output Voltage, 100 mV/div. (AC) B: 500 mA to 2A Load Pulse Figure 18. Horizontal Time Base: 100 s/div.
Load Transient Response for Discontinuous Mode VIN = 20V, VOUT = 5V, ILOAD = 500 mA to 2A L = 10 H, COUT = 330 F, COUT ESR = 45 m
A: Output Voltage, 100 mV/div. (AC) B: 500 mA to 2A Load Pulse Figure 19. Horizontal Time Base: 200 s/div.
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CIN 470 F, 50V, Aluminum Electrolytic Nichicon PL Series COUT 220 F, 25V Aluminum Electrolytic, Nichicon PL Series D1 5A, 40V Schottky Rectifier, 1N5825 L1 68 H, L38 Adjustable Output Voltage Versions
Select R1 to be approximately 1 k, use a 1% resistor for best stability. CIN 470 F, 50V, Aluminum Electrolytic Nichicon PL Series COUT 220 F, 35V Aluminum Electrolytic, Nichicon PL Series D1 5A, 40V Schottky Rectifier, 1N5825 L1 68 H, L38 R1 1 k, 1% CFF See Application Information Section
Figure 20. Standard Test Circuits and Layout Guides As in any switching regulator, layout is very important. Rapidly switching currents associated with wiring inductance can generate voltage transients which can cause problems. For minimal inductance and ground loops, the wires indicated by heavy lines should be wide printed circuit traces and should be kept as short as possible. For best results, external components should be located as close to the switcher lC as possible using ground plane construction or single point grounding. If open core inductors are used, special care must be taken as to the location and positioning of this type of inductor. Allowing the inductor flux to intersect sensitive feedback, lC groundpath and COUT wiring can cause problems. When using the adjustable version, special care must be taken as to the location of the feedback resistors and the associated wiring. Physically locate both resistors near the IC, and route the wiring away from the inductor, especially an open core type of inductor. (See Application Information section for more information.)
Copyright 19992013, Texas Instruments Incorporated
LM2596
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PROCEDURE (Fixed Output Voltage Version) 3. Catch Diode Selection (D1) A. The catch diode current rating must be at least 1.3 times greater than the maximum load current. Also, if the power supply design must withstand a continuous output short, the diode should have a current rating equal to the maximum current limit of the LM2596. The most stressful condition for this diode is an overload or shorted output condition. B. The reverse voltage rating of the diode should be at least 1.25 times the maximum input voltage. C. This diode must be fast (short reverse recovery time) and must be located close to the LM2596 using short leads and short printed circuit traces. Because of their fast switching speed and low forward voltage drop, Schottky diodes provide the best performance and efficiency, and should be the first choice, especially in low output voltage applications. Ultra-fast recovery, or High-Efficiency rectifiers also provide good results. Ultra-fast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such as the 1N5400 series are much too slow and should not be used. 4. Input Capacitor (CIN) A low ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground pin to prevent large voltage transients from appearing at the input. This capacitor should be located close to the IC using short leads. In addition, the RMS current rating of the input capacitor should be selected to be at least the DC load current. The capacitor manufacturers data sheet must be checked to assure that this current rating is not exceeded. The curve shown in Figure 25 shows typical RMS current ratings for several different aluminum electrolytic capacitor values. For an aluminum electrolytic, the capacitor voltage rating should be approximately 1.5 times the maximum input voltage. Caution must be exercised if solid tantalum capacitors are used (see Application Information on input capacitor). The tantalum capacitor voltage rating should be 2 times the maximum input voltage and it is recommended that they be surge current tested by the manufacturer. Use caution when using ceramic capacitors for input bypassing, because it may cause severe ringing at the VIN pin. For additional information, see section on input capacitors in Application Information section.
EXAMPLE (Fixed Output Voltage Version) 3. Catch Diode Selection (D1) A. Refer to the table shown in Table 6. In this example, a 5A, 20V, 1N5823 Schottky diode will provide the best performance, and will not be overstressed even for a shorted output.
4. Input Capacitor (CIN) The important parameters for the Input capacitor are the input voltage rating and the RMS current rating. With a nominal input voltage of 12V, an aluminum electrolytic capacitor with a voltage rating greater than 18V (1.5 VIN) would be needed. The next higher capacitor voltage rating is 25V. The RMS current rating requirement for the input capacitor in a buck regulator is approximately the DC load current. In this example, with a 3A load, a capacitor with a RMS current rating of at least 1.5A is needed. The curves shown in Figure 25 can be used to select an appropriate input capacitor. From the curves, locate the 35V line and note which capacitor values have RMS current ratings greater than 1.5A. A 680 F/35V capacitor could be used. For a through hole design, a 680 F/35V electrolytic capacitor (Panasonic HFQ series or Nichicon PL series or equivalent) would be adequate. other types or other manufacturers capacitors can be used provided the RMS ripple current ratings are adequate. For surface mount designs, solid tantalum capacitors can be used, but caution must be exercised with regard to the capacitor surge current rating (see Application Information on input capacitors in this data sheet). The TPS series available from AVX, and the 593D series from Sprague are both surge current tested.
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Table 1. LM2596 Fixed Voltage Quick Design Component Selection Table (continued)
Conditions Output Voltage (V) 5 Load Current (A) 3 Max Input Voltage (V) 8 10 15 40 9 2 12 3 20 40 15 18 30 40 15 2 20 40 Inductor Panasonic HFQ Series (F/V) 470/25 560/25 330/35 330/35 470/25 180/35 180/35 470/25 330/25 180/25 180/35 330/25 180/25 82/25 Output Capacitor Through Hole Electrolytic Inductance (H) Inductor (#) Nichicon PL Series (F/V) 560/16 560/25 330/35 270/35 560/16 180/35 180/35 470/25 330/25 180/25 180/35 330/25 180/25 82/25 Surface Mount Tantalum AVX TPS Series (F/V) 220/10 220/10 220/10 220/10 220/10 100/10 100/10 100/16 100/16 100/16 100/16 100/16 100/16 68/20 Sprague 595D Series (F/V) 330/10 330/10 330/10 330/10 330/10 270/10 270/10 180/16 180/16 120/20 120/20 180/16 120/20 68/25
22 L41 22 L41 33 L40 47 L39 22 L33 68 L38 68 L38 22 L41 33 L40 68 L44 68 L44 33 L32 68 L38 150 L42
1. Programming Output Voltage (Selecting R1 and R2, as shown in 1. Programming Output Voltage (Selecting R1 and R2, as shown in Figure 20 ) Figure 20 ) Use the following formula to select the appropriate resistor values. Select R1 to be 1 k, 1%. Solve for R2.
(1)
Select a value for R1 between 240 and 1.5 k. The lower resistor R2 = 1k (16.26 1) = 15.26k, closest 1% value is 15.4 k. values minimize noise pickup in the sensitive feedback pin. (For the R = 15.4 k. 2 lowest temperature coefficient and the best stability with time, use 1% metal film resistors.)
(3)
(2)
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2. Inductor Selection (L1) 2. Inductor Selection (L1) A. Calculate the inductor Volt microsecond constant E T (V s), A. Calculate the inductor Volt microsecond constant from the following formula: (E T),
where
VSAT = internal switch saturation voltage = B. E T = 34.2 (V s) 1.16V C. ILOAD(max) = 3A VD = diode forward voltage drop = 0.5V (4)
(5)
D. From the inductor value selection guide shown in Figure 24, the inductance region intersected by the 34 (V s) horizontal line and B. Use the E T value from the previous formula and match it with the 3A vertical line is 47 H, and the inductor code is L39. the E T number on the vertical axis of the Inductor Value Selection E. From the table in Table 3, locate line L39, and select an inductor Guide shown in Figure 24. part number from the list of manufacturers part numbers. C. on the horizontal axis, select the maximum load current. D. Identify the inductance region intersected by the E T value and the Maximum Load Current value. Each region is identified by an inductance value and an inductor code (LXX). E. Select an appropriate inductor from the four manufacturer's part numbers listed in Table 3.
3. Output Capacitor Selection (COUT) A. In the majority of applications, low ESR electrolytic or solid tantalum capacitors between 82 F and 820 F provide the best results. This capacitor should be located close to the IC using short capacitor leads and short copper traces. Do not use capacitors larger than 820 F. For additional information, see section on output capacitors in Application Information section. B. To simplify the capacitor selection procedure, refer to the quick design table shown in Table 2. This table contains different output voltages, and lists various output capacitors that will provide the best design solutions. C. The capacitor voltage rating should be at least 1.5 times greater than the output voltage, and often much higher voltage ratings are needed to satisfy the low ESR requirements needed for low output ripple voltage.
3. Output Capacitor SeIection (COUT) A. See section on COUT in Application Information section. B. From the quick design table shown in Table 2, locate the output voltage column. From that column, locate the output voltage closest to the output voltage in your application. In this example, select the 24V line. Under the OUTPUT CAPACITOR section, select a capacitor from the list of through hole electrolytic or surface mount tantalum types from four different capacitor manufacturers. It is recommended that both the manufacturers and the manufacturers series that are listed in the table be used. In this example, through hole aluminum electrolytic capacitors from several different manufacturers are available. 220 F/35V Panasonic HFQ Series 150 F/35V Nichicon PL Series C. For a 20V output, a capacitor rating of at least 30V or more is needed. In this example, either a 35V or 50V capacitor would work. A 35V rating was chosen, although a 50V rating could also be used if a lower output ripple voltage is needed. Other manufacturers or other types of capacitors may also be used, provided the capacitor specifications (especially the 100 kHz ESR) closely match the types listed in the table. Refer to the capacitor manufacturers data sheet for this information. 4. Feedforward Capacitor (CFF) The table shown in Table 2 contains feed forward capacitor values for various output voltages. In this example, a 560 pF capacitor is needed.
4. Feedforward Capacitor (CFF) (See Figure 20) For output voltages greater than approximately 10V, an additional capacitor is required. The compensation capacitor is typically between 100 pF and 33 nF, and is wired in parallel with the output voltage setting resistor, R2. It provides additional stability for high output voltages, low input-output voltages, and/or very low ESR output capacitors, such as solid tantalum capacitors.
(6)
This capacitor type can be ceramic, plastic, silver mica, etc. (Because of the unstable characteristics of ceramic capacitors made with Z5U material, they are not recommended.)
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PROCEDURE (Adjustable Output Voltage Version) 5. Catch Diode Selection (D1) A. The catch diode current rating must be at least 1.3 times greater than the maximum load current. Also, if the power supply design must withstand a continuous output short, the diode should have a current rating equal to the maximum current limit of the LM2596. The most stressful condition for this diode is an overload or shorted output condition. B. The reverse voltage rating of the diode should be at least 1.25 times the maximum input voltage. C. This diode must be fast (short reverse recovery time) and must be located close to the LM2596 using short leads and short printed circuit traces. Because of their fast switching speed and low forward voltage drop, Schottky diodes provide the best performance and efficiency, and should be the first choice, especially in low output voltage applications. Ultra-fast recovery, or High-Efficiency rectifiers are also a good choice, but some types with an abrupt turn-off characteristic may cause instability or EMl problems. Ultra-fast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such as the 1N4001 series are much too slow and should not be used. 6. Input Capacitor (CIN) A low ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground to prevent large voltage transients from appearing at the input. In addition, the RMS current rating of the input capacitor should be selected to be at least the DC load current. The capacitor manufacturers data sheet must be checked to assure that this current rating is not exceeded. The curve shown in Figure 25 shows typical RMS current ratings for several different aluminum electrolytic capacitor values. This capacitor should be located close to the IC using short leads and the voltage rating should be approximately 1.5 times the maximum input voltage. If solid tantalum input capacitors are used, it is recomended that they be surge current tested by the manufacturer. Use caution when using a high dielectric constant ceramic capacitor for input bypassing, because it may cause severe ringing at the VIN pin. For additional information, see section on input capacitors in Application Information section.
EXAMPLE (Adjustable Output Voltage Version) 5. Catch Diode Selection (D1) A. Refer to the table shown in Table 6. Schottky diodes provide the best performance, and in this example a 5A, 40V, 1N5825 Schottky diode would be a good choice. The 5A diode rating is more than adequate and will not be overstressed even for a shorted output.
6. Input Capacitor (CIN) The important parameters for the Input capacitor are the input voltage rating and the RMS current rating. With a nominal input voltage of 28V, an aluminum electrolytic aluminum electrolytic capacitor with a voltage rating greater than 42V (1.5 VIN) would be needed. Since the the next higher capacitor voltage rating is 50V, a 50V capacitor should be used. The capacitor voltage rating of (1.5 VIN) is a conservative guideline, and can be modified somewhat if desired. The RMS current rating requirement for the input capacitor of a buck regulator is approximately the DC load current. In this example, with a 3A load, a capacitor with a RMS current rating of at least 1.5A is needed. The curves shown in Figure 25 can be used to select an appropriate input capacitor. From the curves, locate the 50V line and note which capacitor values have RMS current ratings greater than 1.5A. Either a 470 F or 680 F, 50V capacitor could be used. For a through hole design, a 680 F/50V electrolytic capacitor (Panasonic HFQ series or Nichicon PL series or equivalent) would be adequate. Other types or other manufacturers capacitors can be used provided the RMS ripple current ratings are adequate. For surface mount designs, solid tantalum capacitors can be used, but caution must be exercised with regard to the capacitor surge current rting (see Application Information or input capacitors in this data sheet). The TPS series available from AVX, and the 593D series from Sprague are both surge current tested. To further simplify the buck regulator design procedure, Texas Instruments is making available computer design software to be used with the Simple Switcher line ot switching regulators. Switchers Made Simple (version 4.3 or later) is available on a 3 diskette for IBM compatible computers.
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50WQ03
Block Diagram
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APPLICATION INFORMATION
Table 7. PIN DESCRIPTIONS
Name +VIN Ground Output Feedback Description This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be present at this pin to minimize voltage transients and to supply the switching currents needed by the regulator. Circuit ground. Internal switch. The voltage at this pin switches between (+VIN VSAT) and approximately 0.5V, with a duty cycle of approximately VOUT/VIN. To minimize coupling to sensitive circuitry, the PC board copper area connected to this pin should be kept to a minimum. Senses the regulated output voltage to complete the feedback loop. Allows the switching regulator circuit to be shut down using logic level signals thus dropping the total input supply current to approximately 80 A. Pulling this pin below a threshold voltage of approximately 1.3V turns the regulator on, and pulling this pin above 1.3V (up to a maximum of 25V) shuts the regulator down. If this shutdown feature is not needed, the ON /OFF pin can be wired to the ground pin or it can be left open, in either case the regulator will be in the ON condition.
ON /OFF
EXTERNAL COMPONENTS
INPUT CAPACITOR CIN A low ESR aluminum or tantalum bypass capacitor is needed between the input pin and ground pin. It must be located near the regulator using short leads. This capacitor prevents large voltage transients from appearing at the input, and provides the instantaneous current needed each time the switch turns on. The important parameters for the Input capacitor are the voltage rating and the RMS current rating. Because of the relatively high RMS currents flowing in a buck regulator's input capacitor, this capacitor should be chosen for its RMS current rating rather than its capacitance or voltage ratings, although the capacitance value and voltage rating are directly related to the RMS current rating. The RMS current rating of a capacitor could be viewed as a capacitor's power rating. The RMS current flowing through the capacitors internal ESR produces power which causes the internal temperature of the capacitor to rise. The RMS current rating of a capacitor is determined by the amount of current required to raise the internal temperature approximately 10C above an ambient temperature of 105C. The ability of the capacitor to dissipate this heat to the surrounding air will determine the amount of current the capacitor can safely sustain. Capacitors that are physically large and have a large surface area will typically have higher RMS current ratings. For a given capacitor value, a higher voltage electrolytic capacitor will be physically larger than a lower voltage capacitor, and thus be able to dissipate more heat to the surrounding air, and therefore will have a higher RMS current rating. The consequences of operating an electrolytic capacitor above the RMS current rating is a shortened operating life. The higher temperature speeds up the evaporation of the capacitor's electrolyte, resulting in eventual failure. Selecting an input capacitor requires consulting the manufacturers data sheet for maximum allowable RMS ripple current. For a maximum ambient temperature of 40C, a general guideline would be to select a capacitor with a ripple current rating of approximately 50% of the DC load current. For ambient temperatures up to 70C, a current rating of 75% of the DC load current would be a good choice for a conservative design. The capacitor voltage rating must be at least 1.25 times greater than the maximum input voltage, and often a much higher voltage capacitor is needed to satisfy the RMS current requirements. A graph shown in Figure 25 shows the relationship between an electrolytic capacitor value, its voltage rating, and the RMS current it is rated for. These curves were obtained from the Nichicon PL series of low ESR, high reliability electrolytic capacitors designed for switching regulator applications. Other capacitor manufacturers offer similar types of capacitors, but always check the capacitor data sheet. Standard electrolytic capacitors typically have much higher ESR numbers, lower RMS current ratings and typically have a shorter operating lifetime.
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Because of their small size and excellent performance, surface mount solid tantalum capacitors are often used for input bypassing, but several precautions must be observed. A small percentage of solid tantalum capacitors can short if the inrush current rating is exceeded. This can happen at turn on when the input voltage is suddenly applied, and of course, higher input voltages produce higher inrush currents. Several capacitor manufacturers do a 100% surge current testing on their products to minimize this potential problem. If high turn on currents are expected, it may be necessary to limit this current by adding either some resistance or inductance before the tantalum capacitor, or select a higher voltage capacitor. As with aluminum electrolytic capacitors, the RMS ripple current rating must be sized to the load current.
Figure 25. RMS Current Ratings for Low ESR Electrolytic Capacitors (Typical)
OUTPUT CAPACITOR
COUT An output capacitor is required to filter the output and provide regulator loop stability. Low impedance or low ESR Electrolytic or solid tantalum capacitors designed for switching regulator applications must be used. When selecting an output capacitor, the important capacitor parameters are; the 100 kHz Equivalent Series Resistance (ESR), the RMS ripple current rating, voltage rating, and capacitance value. For the output capacitor, the ESR value is the most important parameter. The output capacitor requires an ESR value that has an upper and lower limit. For low output ripple voltage, a low ESR value is needed. This value is determined by the maximum allowable output ripple voltage, typically 1% to 2% of the output voltage. But if the selected capacitor's ESR is extremely low, there is a possibility of an unstable feedback loop, resulting in an oscillation at the output. Using the capacitors listed in the tables, or similar types, will provide design solutions under all conditions. If very low output ripple voltage (less than 15 mV) is required, refer to the section on OUTPUT VOLTAGE RIPPLE AND TRANSIENTS for a post ripple filter. An aluminum electrolytic capacitor's ESR value is related to the capacitance value and its voltage rating. In most cases, higher voltage electrolytic capacitors have lower ESR values (see Figure 26 ). Often, capacitors with much higher voltage ratings may be needed to provide the low ESR values required for low output ripple voltage. The output capacitor for many different switcher designs often can be satisfied with only three or four different capacitor values and several different voltage ratings. See the quick design component selection tables in Table 1 and 4 for typical capacitor values, voltage ratings, and manufacturers capacitor types. Electrolytic capacitors are not recommended for temperatures below 25C. The ESR rises dramatically at cold temperatures and typically rises 3X @ 25C and as much as 10X at 40C. See curve shown in Figure 27.
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Solid tantalum capacitors have a much better ESR spec for cold temperatures and are recommended for temperatures below 25C.
Figure 26. Capacitor ESR vs Capacitor Voltage Rating (Typical Low ESR Electrolytic Capacitor)
CATCH DIODE
Buck regulators require a diode to provide a return path for the inductor current when the switch turns off. This must be a fast diode and must be located close to the LM2596 using short leads and short printed circuit traces. Because of their very fast switching speed and low forward voltage drop, Schottky diodes provide the best performance, especially in low output voltage applications (5V and lower). Ultra-fast recovery, or High-Efficiency rectifiers are also a good choice, but some types with an abrupt turnoff characteristic may cause instability or EMI problems. Ultra-fast recovery diodes typically have reverse recovery times of 50 ns or less. Rectifiers such as the 1N5400 series are much too slow and should not be used.
INDUCTOR SELECTION
All switching regulators have two basic modes of operation; continuous and discontinuous. The difference between the two types relates to the inductor current, whether it is flowing continuously, or if it drops to zero for a period of time in the normal switching cycle. Each mode has distinctively different operating characteristics, which can affect the regulators performance and requirements. Most switcher designs will operate in the discontinuous mode when the load current is low. The LM2596 (or any of the Simple Switcher family) can be used for both continuous or discontinuous modes of operation.
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In many cases the preferred mode of operation is the continuous mode. It offers greater output power, lower peak switch, inductor and diode currents, and can have lower output ripple voltage. But it does require larger inductor values to keep the inductor current flowing continuously, especially at low output load currents and/or high input voltages. To simplify the inductor selection process, an inductor selection guide (nomograph) was designed (see Figure 21 through 8). This guide assumes that the regulator is operating in the continuous mode, and selects an inductor that will allow a peak-to-peak inductor ripple current to be a certain percentage of the maximum design load current. This peak-to-peak inductor ripple current percentage is not fixed, but is allowed to change as different design load currents are selected. (See Figure 28.)
Figure 28. (IIND) Peak-to-Peak Inductor Ripple Current (as a Percentage of the Load Current) vs Load Current By allowing the percentage of inductor ripple current to increase for low load currents, the inductor value and size can be kept relatively low. When operating in the continuous mode, the inductor current waveform ranges from a triangular to a sawtooth type of waveform (depending on the input voltage), with the average value of this current waveform equal to the DC output load current. Inductors are available in different styles such as pot core, toroid, E-core, bobbin core, etc., as well as different core materials, such as ferrites and powdered iron. The least expensive, the bobbin, rod or stick core, consists of wire wound on a ferrite bobbin. This type of construction makes for an inexpensive inductor, but since the magnetic flux is not completely contained within the core, it generates more Electro-Magnetic Interference (EMl). This magnetic flux can induce voltages into nearby printed circuit traces, thus causing problems with both the switching regulator operation and nearby sensitive circuitry, and can give incorrect scope readings because of induced voltages in the scope probe. Also see section on OPEN CORE INDUCTORS. When multiple switching regulators are located on the same PC board, open core magnetics can cause interference between two or more of the regulator circuits, especially at high currents. A torroid or E-core inductor (closed magnetic structure) should be used in these situations. The inductors listed in the selection chart include ferrite E-core construction for Schott, ferrite bobbin core for Renco and Coilcraft, and powdered iron toroid for Pulse Engineering. Exceeding an inductor's maximum current rating may cause the inductor to overheat because of the copper wire losses, or the core may saturate. If the inductor begins to saturate, the inductance decreases rapidly and the inductor begins to look mainly resistive (the DC resistance of the winding). This can cause the switch current to rise very rapidly and force the switch into a cycle-by-cycle current limit, thus reducing the DC output load current. This can also result in overheating of the inductor and/or the LM2596. Different inductor types have different saturation characteristics, and this should be kept in mind when selecting an inductor. The inductor manufacturer's data sheets include current and energy limits to avoid inductor saturation.
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When observing output ripple with a scope, it is essential that a short, low inductance scope probe ground connection be used. Most scope probe manufacturers provide a special probe terminator which is soldered onto the regulator board, preferable at the output capacitor. This provides a very short scope ground thus eliminating the problems associated with the 3 inch ground lead normally provided with the probe, and provides a much cleaner and more accurate picture of the ripple voltage waveform. The voltage spikes are caused by the fast switching action of the output switch and the diode, and the parasitic inductance of the output filter capacitor, and its associated wiring. To minimize these voltage spikes, the output capacitor should be designed for switching regulator applications, and the lead lengths must be kept very short. Wiring inductance, stray capacitance, as well as the scope probe used to evaluate these transients, all contribute to the amplitude of these spikes. When a switching regulator is operating in the continuous mode, the inductor current waveform ranges from a triangular to a sawtooth type of waveform (depending on the input voltage). For a given input and output voltage, the peak-to-peak amplitude of this inductor current waveform remains constant. As the load current increases or decreases, the entire sawtooth current waveform also rises and falls. The average value (or the center) of this current waveform is equal to the DC load current. If the load current drops to a low enough level, the bottom of the sawtooth current waveform will reach zero, and the switcher will smoothly change from a continuous to a discontinuous mode of operation. Most switcher designs (irregardless how large the inductor value is) will be forced to run discontinuous if the output is lightly loaded. This is a perfectly acceptable mode of operation.
Figure 30. Peak-to-Peak Inductor Ripple Current vs Load Current In a switching regulator design, knowing the value of the peak-to-peak inductor ripple current (IIND) can be useful for determining a number of other circuit parameters. Parameters such as, peak inductor or peak switch current, minimum load current before the circuit becomes discontinuous, output ripple voltage and output capacitor ESR can all be calculated from the peak-to-peak IIND. When the inductor nomographs shown in Figure 21 through 8 are used to select an inductor value, the peak-to-peak inductor ripple current can immediately be determined. The curve shown in Figure 30 shows the range of (IIND) that can be expected for different load currents. The curve also shows how the peak-to-peak inductor ripple current (IIND) changes as you go from the lower border to the upper border (for a given load current) within an inductance region. The upper border represents a higher input voltage, while the lower border represents a lower input voltage (see Inductor Selection Guides section). These curves are only correct for continuous mode operation, and only if the inductor selection guides are used to select the inductor value Consider the following example: VOUT = 5V, maximum load current of 2.5A VIN = 12V, nominal, varying between 10V and 16V.
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The selection guide in Figure 22 shows that the vertical line for a 2.5A load current, and the horizontal line for the 12V input voltage intersect approximately midway between the upper and lower borders of the 33 H inductance region. A 33 H inductor will allow a peak-to-peak inductor current (IIND) to flow that will be a percentage of the maximum load current. Referring to Figure 30, follow the 2.5A line approximately midway into the inductance region, and read the peak-to-peak inductor ripple current (IIND) on the left hand axis (approximately 620 mA pp). As the input voltage increases to 16V, it approaches the upper border of the inductance region, and the inductor ripple current increases. Referring to the curve in Figure 30, it can be seen that for a load current of 2.5A, the peak-to-peak inductor ripple current (IIND) is 620 mA with 12V in, and can range from 740 mA at the upper border (16V in) to 500 mA at the lower border (10V in). Once the IIND value is known, the following formulas can be used to calculate additional information about the switching regulator circuit. 1. Peak Inductor or peak switch current 2. Minimum load current before the circuit becomes discontinuous 3. Output Ripple Voltage = (IIND)(ESR of COUT) = 0.62A0.1 = 62 mV p-p 4. added for line
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THERMAL CONSIDERATIONS
The LM2596 is available in two packages, a 5-pin TO-220 (T) and a 5-pin surface mount TO-263 (S). The TO-220 package needs a heat sink under most conditions. The size of the heatsink depends on the input voltage, the output voltage, the load current and the ambient temperature. The curves in Figure 31 show the LM2596T junction temperature rises above ambient temperature for a 3A load and different input and output voltages. The data for these curves was taken with the LM2596T (TO-220 package) operating as a buck switching regulator in an ambient temperature of 25C (still air). These temperature rise numbers are all approximate and there are many factors that can affect these temperatures. Higher ambient temperatures require more heat sinking. The TO-263 surface mount package tab is designed to be soldered to the copper on a printed circuit board. The copper and the board are the heat sink for this package and the other heat producing components, such as the catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.4 in2, and ideally should have 2 or more square inches of 2 oz. (0.0028 in.) copper. Additional copper area improves the thermal characteristics, but with copper areas greater than approximately 6 in2, only small improvements in heat dissipation are realized. If further thermal improvements are needed, double sided, multilayer PC board with large copper areas and/or airflow are recommended. The curves shown in Figure 32 show the LM2596S (TO-263 package) junction temperature rise above ambient temperature with a 2A load for various input and output voltages. This data was taken with the circuit operating as a buck switching regulator with all components mounted on a PC board to simulate the junction temperature under actual operating conditions. This curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature. When load currents higher than 2A are used, double sided or multilayer PC boards with large copper areas and/or airflow might be needed, especially for high ambient temperatures and high output voltages. For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further. Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors that will affect these numbers. Some of these factors include board size, shape, thickness, position, location, and even board temperature. Other factors are, trace width, total printed circuit copper area, copper thickness, single- or double-sided, multilayer board and the amount of solder on the board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board, as well as whether the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board.
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Circuit Data for Temperature Rise Curve TO-220 Package (T) Capacitors Inductor Diode PC board Through hole electrolytic Through hole, Renco Through hole, 5A 40V, Schottky 3 square inches single sided 2 oz. copper (0.0028) Figure 31. Junction Temperature Rise, TO-220
Circuit Data for Temperature Rise Curve TO-263 Package (S) Capacitors Inductor Diode PC board Surface mount tantalum, molded D size Surface mount, Pulse Engineering, 68 H Surface mount, 5A 40V, Schottky 9 square inches single sided 2 oz. copper (0.0028) Figure 32. Junction Temperature Rise, TO-263
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DELAYED STARTUP
The circuit in Figure 33 uses the the ON /OFF pin to provide a time delay between the time the input voltage is applied and the time the output voltage comes up (only the circuitry pertaining to the delayed start up is shown). As the input voltage rises, the charging of capacitor C1 pulls the ON /OFF pin high, keeping the regulator off. Once the input voltage reaches its final value and the capacitor stops charging, and resistor R2 pulls the ON /OFF pin low, thus allowing the circuit to start switching. Resistor R1 is included to limit the maximum voltage applied to the ON /OFF pin (maximum of 25V), reduces power supply noise sensitivity, and also limits the capacitor, C1, discharge current. When high input ripple voltage exists, avoid long delay time, because this ripple can be coupled into the ON /OFF pin and cause problems. This delayed startup feature is useful in situations where the input power source is limited in the amount of current it can deliver. It allows the input voltage to rise to a higher voltage before the regulator starts operating. Buck regulators require less input current at higher input voltages.
UNDERVOLTAGE LOCKOUT
Some applications require the regulator to remain off until the input voltage reaches a predetermined voltage. An undervoltage lockout feature applied to a buck regulator is shown in Figure 34, while Figure 35 and Figure 36 applies the same feature to an inverting circuit. The circuit in Figure 35 features a constant threshold voltage for turn on and turn off (zener voltage plus approximately one volt). If hysteresis is needed, the circuit in Figure 36 has a turn ON voltage which is different than the turn OFF voltage. The amount of hysteresis is approximately equal to the value of the output voltage. If zener voltages greater than 25V are used, an additional 47 k resistor is needed from the ON /OFF pin to the ground pin to stay within the 25V maximum limit of the ON /OFF pin.
INVERTING REGULATOR
The circuit in Figure 37 converts a positive input voltage to a negative output voltage with a common ground. The circuit operates by bootstrapping the regulator's ground pin to the negative output voltage, then grounding the feedback pin, the regulator senses the inverted output voltage and regulates it.
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Figure 35. Undervoltage Lockout for Inverting Regulator This example uses the LM2596-5.0 to generate a 5V output, but other output voltages are possible by selecting other output voltage versions, including the adjustable version. Since this regulator topology can produce an output voltage that is either greater than or less than the input voltage, the maximum output current greatly depends on both the input and output voltage. The curve shown in Figure 38 provides a guide as to the amount of output load current possible for the different input and output voltage conditions. The maximum voltage appearing across the regulator is the absolute sum of the input and output voltage, and this must be limited to a maximum of 40V. For example, when converting +20V to 12V, the regulator would see 32V between the input pin and ground pin. The LM2596 has a maximum input voltage spec of 40V. Additional diodes are required in this regulator configuration. Diode D1 is used to isolate input voltage ripple or noise from coupling through the CIN capacitor to the output, under light or no load conditions. Also, this diode isolation changes the topology to closley resemble a buck configuration thus providing good closed loop stability. A Schottky diode is recommended for low input voltages, (because of its lower voltage drop) but for higher input voltages, a fast recovery diode could be used. Without diode D3, when the input voltage is first applied, the charging current of CIN can pull the output positive by several volts for a short period of time. Adding D3 prevents the output from going positive by more than a diode voltage.
This circuit has hysteresis Regulator starts switching at VIN = 13V Regulator stops switching at VIN = 8V
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CIN 68 F/25V Tant. Sprague 595D 470 F/50V Elec. Panasonic HFQ COUT 47 F/20V Tant. Sprague 595D 220 F/25V Elec. Panasonic HFQ
Figure 38. Inverting Regulator Typical Load Current Because of differences in the operation of the inverting regulator, the standard design procedure is not used to select the inductor value. In the majority of designs, a 33 H, 3.5A inductor is the best choice. Capacitor selection can also be narrowed down to just a few values. Using the values shown in Figure 37 will provide good results in the majority of inverting designs. This type of inverting regulator can require relatively large amounts of input current when starting up, even with light loads. Input currents as high as the LM2596 current limit (approx 4.5A) are needed for at least 2 ms or more, until the output reaches its nominal output voltage. The actual time depends on the output voltage and the size of the output capacitor. Input power sources that are current limited or sources that can not deliver these currents without getting loaded down, may not work correctly. Because of the relatively high startup currents required by the inverting topology, the delayed startup feature (C1, R1 and R2) shown in Figure 37 is recommended. By delaying the regulator startup, the input capacitor is allowed to charge up to a higher voltage before the switcher begins operating. A portion of the high input current needed for startup is now supplied by the input capacitor (CIN). For severe start up conditions, the input capacitor can be made much larger than normal.
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Figure 40. Inverting Regulator Ground Referenced Shutdown using Opto Device
TYPICAL THROUGH HOLE PC BOARD LAYOUT, FIXED OUTPUT (1X SIZE), DOUBLE SIDED
CIN470 F, 50V, Aluminum Electrolytic Panasonic, HFQ Series COUT330 F, 35V, Aluminum Electrolytic Panasonic, HFQ Series D15A, 40V Schottky Rectifier, 1N5825 L147 H, L39, Renco, Through Hole Thermalloy Heat Sink #7020
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TYPICAL THROUGH HOLE PC BOARD LAYOUT, ADJUSTABLE OUTPUT (1X SIZE), DOUBLE SIDED
CIN470 F, 50V, Aluminum Electrolytic Panasonic, HFQ Series COUT220 F, 35V Aluminum Electrolytic Panasonic, HFQ Series D15A, 40V Schottky Rectifier, 1N5825 L147 H, L39, Renco, Through Hole R11 k, 1% R2Use formula in Design Procedure CFFSee Table 2. Thermalloy Heat Sink #7020
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
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PACKAGING INFORMATION
Orderable Device LM2596S-12/NOPB LM2596S-3.3 LM2596S-3.3/NOPB LM2596S-5.0 LM2596S-5.0/NOPB LM2596S-ADJ/NOPB LM2596SX-12/NOPB LM2596SX-3.3 LM2596SX-3.3/NOPB LM2596SX-5.0/NOPB LM2596SX-ADJ LM2596SX-ADJ/NOPB LM2596T-12 LM2596T-12/LF03 LM2596T-12/NOPB LM2596T-3.3 LM2596T-3.3/LF03 Status
(1)
Package Type Package Pins Package Drawing Qty DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 TO-220 TO-220 TO-220 TO-220 TO-220 KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT KTT NDH NDH NDH NDH NDH 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 45 45 45 45 45 45 500 500 500 500 500 500 45 45 45 45 45
Eco Plan
(2)
Lead/Ball Finish
(6)
Op Temp (C)
Device Marking
(4/5)
Samples
ACTIVE NRND ACTIVE NRND ACTIVE ACTIVE ACTIVE NRND ACTIVE ACTIVE NRND ACTIVE NRND ACTIVE ACTIVE NRND ACTIVE
Pb-Free (RoHS Exempt) TBD Pb-Free (RoHS Exempt) TBD Pb-Free (RoHS Exempt) Pb-Free (RoHS Exempt) Pb-Free (RoHS Exempt) TBD Pb-Free (RoHS Exempt) Pb-Free (RoHS Exempt) TBD Pb-Free (RoHS Exempt) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br)
Level-3-245C-168 HR Call TI Level-3-245C-168 HR Call TI Level-3-245C-168 HR Level-3-245C-168 HR Level-3-245C-168 HR Call TI Level-3-245C-168 HR Level-3-245C-168 HR Call TI Level-3-245C-168 HR Call TI Level-1-NA-UNLIM Level-1-NA-UNLIM Call TI Level-1-NA-UNLIM -40 to 125 -40 to 125 -40 to 125
LM2596S -12 P+ LM2596S -3.3 P+ LM2596S -3.3 P+ LM2596S -5.0 P+ LM2596S -5.0 P+ LM2596S -ADJ P+ LM2596S -12 P+ LM2596S -3.3 P+ LM2596S -3.3 P+ LM2596S -5.0 P+ LM2596S -ADJ P+ LM2596S -ADJ P+ LM2596T -12 P+ LM2596T -12 P+ LM2596T -12 P+ LM2596T -3.3 P+ LM2596T -3.3 P+
Addendum-Page 1
www.ti.com
1-Nov-2013
Orderable Device LM2596T-3.3/NOPB LM2596T-5.0 LM2596T-5.0/LF03 LM2596T-5.0/NOPB LM2596T-ADJ LM2596T-ADJ/LB05 LM2596T-ADJ/LF02 LM2596T-ADJ/NOPB
Status
(1)
Package Type Package Pins Package Drawing Qty TO-220 TO-220 TO-220 TO-220 TO-220 TO-220 TO-220 TO-220 NDH NDH NDH NDH NDH NEB NEB NDH 5 5 5 5 5 5 5 5 45 45 45 45 45 45 45 45
Eco Plan
(2)
Lead/Ball Finish
(6)
Op Temp (C)
Device Marking
(4/5)
Samples
Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)
Level-1-NA-UNLIM Call TI Level-1-NA-UNLIM Level-1-NA-UNLIM Call TI Call TI Level-1-NA-UNLIM Level-1-NA-UNLIM -40 to 125 -40 to 125
LM2596T -3.3 P+ LM2596T -5.0 P+ LM2596T -5.0 P+ LM2596T -5.0 P+ LM2596T -ADJ P+ LM2596T -ADJ P+ LM2596T -ADJ P+ LM2596T -ADJ P+
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(4)
Addendum-Page 2
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1-Nov-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
Device
Package Package Pins Type Drawing DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 DDPAK/ TO-263 KTT KTT KTT KTT KTT KTT 5 5 5 5 5 5
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 330.0 24.4 24.4 24.4 24.4 24.4 24.4 10.75 10.75 10.75 10.75 10.75 10.75
Pack Materials-Page 1
Pins 5 5 5 5 5 5
Pack Materials-Page 2
MECHANICAL DATA
NDH0005D
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MECHANICAL DATA
KTT0005B
TS5B (Rev D)
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MECHANICAL DATA
NEB0005B
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MECHANICAL DATA
NEB0005E
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