LG Mg105 Service Manual

Service Manual
Service Manual MG105
Model : MG105
P/N : MMBD0047901
Date: April, 2005 / Issue 1.0
1. INTRODUCTION
Table Of Contents
1. INTRODUCTION................................ 6
1.1 Purpose ............................................. 6 4.4 Charging Trouble ................................ 66 1.2 Regulatory Information .......................... 6 4.5 Vibrator Trouble .................................. 68 1.3 Abbreviations ............................................. 8 4.6 LCD Trouble ....................................... 70 4.7 CameraTrouble .................................. 72 4.2 Tx Trouble ............................................ 56 4.3 Power On Trouble................................. 64
2. PERFORMANCE ............................... 10
2.1 H/W Feature ..................................... 10 2.2 Technical Specification ............................. 11
4.8 Speaker Trouble ................................. 74 4.9 Sim Card Trouble ................................ 76 4.10 Earphone Trouble ............................. 78 4.11 Key Backlight Trouble ...................... 80 4.12 Receiver Trouble .............................. 82
3. TECHNICAL BRIEF ........................... 16

3.1 General Description of RF parts ...... 16 3.2 Power Amplifier Module .................... 22 3.3 13 MHz Clock ................................... 23 3.4 Power Supplies and Control Signals... 23 3.5 Digital Main Processor ...................... 25 3.6 Analog Main Processor ...................... 31 3.7 Display and Interface ............................. 41 3.8 Keypad Switches and Scanning ............ 43 3.9 Microphone ............................................ 44 3.10 Main Speaker......................................... 44 3.11 Headset Interface......................................45 3.12 Key Back-light Illumination .............. 46 3.13 Vibrator......................................... 47
4.13 Microphone Trouble .......................... 84 4.14 RTC Trouble ..................................... 86 4.15 Indication LED Trouble .................... 88
5. DOWNLOAD AND CALIBRATION ................................. 90

5.1 Download ......................................... 90 5.2 Calibration ........................................ 97
6. BLOCK DIAGRAM .......................... 100
7. CIRCUIT DIAGRAM ................................ 102

7.1 MAIN ............................................. 102
4. TROUBLE SHOOTING .................. 48

4.1 RX Troble ................................................. 48
7.2 AUDIO & MIDI .................................. 103 7.3 MEMORY & MMI & IO ............................ 104 7.4 LCD CONN ............................................. 105
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1. INTRODUCTION
Table Of Contents
7.5 RF Circuit ............................................... 106 7.6 CAMERA ................................................ 107 11.7 Setting ..................................................121 11.8 How to do calibration .......................121
8. PCB LAYOUT .............................. 108
12. EXPLODED VIEW & REPLACEMENT PART LIST ........ 123
9. ENGINEERING MODE ................... 109

9.1 BB Test [MENU 1] .............................110
12.1 Exploded View .................................. 123 12. 2 Replacement Parts <Mechanic component> .............................124
9.2 RF Test [MENU 2] .............................113 12. 2 Replacement Parts 9.3 MF mode [MENU 3] ..............................114 <Main component> ................................ 126 9.4 Trace option [MENU 4] .........................115 12. 3 Accessory ................................................ 136 9.5 Call timer [MENU 5] ..........................115 9.6 Fact. Reset [MENU 6] ........................115 9.7 S/W version [MENU 7] .......................115
10. STAND ALONE TEST ................... 116

10.1 Introduction ........................................116 10.2 Setting Method ..................................116 10.3 Means of Test ....................................117
11. AUTO CALIBRATION ................... 119

11.1 Overview ............................................119 11.2 Requirements ....................................119 11.3 Menu and Settings ...............................119 11.4 AGC ......................................................121 11.5 APC .......................................................121 11.6 ADC ......................................................121
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated information is ESD handling: by the sign. Following
U Service personnel should ground themselves by using a wrist strap when exchange system boards. U When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. U Use a suitable, grounded soldering iron. U Keep sensitive parts in these protective packages until these are used. U When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC BB BER CC-CV DAC DCS dBm DSP EEPROM ESD FPCB GMSK GPIB GSM IPUI IF LCD LDO LED OPLL PAM PCB PGA PLL PSTN RF RLR RMS RTC SAW SIM SLR SRAM PSRAM STMR TA Automatic Power Control Baseband Bit Error Ratio Constant Current - Constant Voltage Digital to Analog Converter Digital Communication System dB relative to 1 milli watt Digital Signal Processing Electrical Erasable Programmable Read-Only Memory Electrostatic Discharge Flexible Printed Circuit Board Gaussian Minimum Shift Keying General Purpose Interface Bus Global System for Mobile Communications International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop Public Switched Telephone Network Radio Frequency Receiving Loudness Rating Root Mean Square Real Time Clock Surface Acoustic Wave Subscriber Identity Module Sending Loudness Rating Static Random Access Memory Pseudo SRAM Side Tone Masking Rating Travel Adapter
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1. INTRODUCTION
TDD TDMA UART VCO VCTCXO WAP
Time Division Duplex Time Division Multiple Access Universal Asynchronous Receiver/Transmitter Voltage Controlled Oscillator Voltage Control Temperature Compensated Crystal Oscillator Wireless Application Protocol
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2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item Standard Battery Feature Li-ion, 780mAh Battery Size : 104.5 (W) 44(H) 15.8(T) [mm] Battery Weight : 20kg Under the minimum current consumption environmenth (such as paging period 9), the level of standby current is below 4mA. Up to 2 hours (GSM TX Level 5) Up to 200 hours (Paging Period: 9, RSSI: -85 dBm) Approx. Under 3.75 hours GSM, EGSM: -104dBm, DCS: -104dBm GSM, EGSM : 33dBm(Level 5), DCS, PCS : 30dBm(Level 0) Class 10 3V Small Only Main LCD : CSTN 128 128 pixel 65K Color Hard icons. Key Pad 0 ~ 9, #, *, Menu Key, Clear Key, Camera Key Send Key, END/PWR Key Soft Key(Left/Right) Internal Yes (Mono) Yes EFR/FR/HR Yes No Yes Yes One way dual speaker Yes 40 Poly (Mono SPK) No Cable Comment
Stand by Current Talk time Stand by time Charging time RX Sensitivity TX output power GPRS compatibility SIM card type Display
Status Indicator
ANT EAR Phone Jack PC Synchronization Speech coding Data and Fax Vibrator Loud Speaker Voice Recoding Microphone Speaker/Receiver Travel Adapter MIDI MP3/AAC Options Data
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2. PERFORMANCE
2.2 Technical Specification

Item Description EGSM TX: 890 + (n-1024) 0.2 MHz RX: 935 + (n-1024) 0.2 MHz (n=975~1024) DCS 1 Frequency Band TX: 1710 + (n-512) 0.2 MHz RX: 1805 + (n-512) 0.2 MHz (n=512~885) PCS TX: 1810 + (n-512) 0.2 MHz RX: 1905 + (n-512) 0.2 MHz (n=512~885) 2 3 Phase Error Frequency Error RMS < 5 degrees Peak < 20 degrees < 0.1 ppm GSM, EGSM Level 5 6 7 8 9 10 11 12 4 Power Level DCS, PCS Level 0 1 2 3 4 5 6 7 Power 30dBm 28dBm 26dBm 24dBm 22dBm 20dBm 18dBm 16dBm Toler. 2dB 3dB 3dB 3dB 3dB 3dB 3dB 3dB Level 8 9 10 11 12 13 14 15 Power 14dBm 12dBm 10dBm 8dBm 6dBm 4dBm 2dBm 0dBm Toler. 3dB 4dB 4dB 4dB 4dB 4dB 5dB 5dB Power 33dBm 31dBm 29dBm 27dBm 25dBm 23dBm 21dBm 19dBm Toler. 2dB 3dB 3dB 3dB 3dB 3dB 3dB 3dB Level 13 14 15 16 17 18 19 Power 17dBm 15dBm 13dBm 11dBm 9dBm 7dBm 5dBm Toler. 3dB 3dB 3dB 5dB 5dB 5dB 5dB Specification
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2. PERFORMANCE
Item
Description GSM, EGSM
Specification Offset from Carrier (kHz). 100 200 250 400 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 Max. dBc +0.5 -30 -33 -60 -60 -60 -63 -65 -71
Output RF Spectrum (due to modulation) GSM, EGSM
6,000
Offset from Carrier (kHz). 100 200 250 400 600~ <1,200 1,200~ <1,800 1,800~ <3,000 3,000~ <6,000 6,000 GSM, EGSM Offset from Carrier (kHz). 400 600 Output RF Spectrum 6 (due to switching transient) GSM, EGSM Offset from Carrier (kHz). 400 600 1,200 1,800
Max. dBc +0.5 -30 -33 -60 -60 -60 -65 -65 -73
Max. dBc -19 -21 -21 -24
Max. dBc -19 -21
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2. PERFORMANCE
Item
Description DCS,PCS
Specification Offset from Carrier (kHz). 1,200 1,800 Max. dBc -24 -27
Spurious Emissions
Conduction, Emission Status GSM, EGSM BER (Class II) < 2.439% @-102 dBm
Bit Error Ratio
DCS, PCS BER (Class II) < 2.439% @-100 dBm
9 10
RX Level Report Accuracy Conduction, Emission Status SLR 8 3 dB Frequency (Hz) 100 200 300 Max.(dB) -12 0 0 0 4 4 4 0 Max.(dB) -12 0 2 * 0 2 2 2 Min.(dB) -12 -6 -6 -6 -9 Min.(dB) -5 -5 -5 -10
11
Sending Response
1,000 2,000 3,000 3,400 4,000
12
RLR
2 3 dB Frequency (Hz) 100 200 300 500
13
Receiving Response
1,000 3,000 3,400 4,000
* Mean that Adopt a straight line in between 300 Hz and 1,000 Hz to be Max. level in the range.
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2. PERFORMANCE
Item 14 15
Description STMR Stability Margin 13 5 dB > 6 dB dB to ARL (dB) -35 -30 -20 -10
Specification
Level Ratio (dB) 17.5 22.5 30.7 33.3 33.7 31.7 25.5 4 0 -9 -
16
Distortion
0 7 10 3,400 4,000
17 18 19 20
Side Tone Distortion System frequency (13 MHz) tolerance 32.768KHz tolerance Ringer Volume
Three stage distortion < 10% 2.5 ppm 30 ppm At least 65 dBspl under below conditions: 1. Ringer set as ringer. 2. Test distance set as 50 cm Fast Charge : < 430 mA Slow Charge : < 160 mA Antenna Bar Number 5 4 3 Power -85 dBm ~ -95 dBm ~ -91 dBm 30.7 33.3 33.7 31.7 25.5 Voltage 3.50 ~ 3.59 V 3.60 ~ 3.69 V 3.70 ~ 3.75V
21
Charge Current
22
Antenna Display
2 1 0 10 Battery Bar Number 0
23
Battery Indicator
1 2
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2. PERFORMANCE
Item 23
Description Battery Indicator 3 4
Specification Battery Bar Number Voltage 3.76 ~ 3.89 V 3.90 V ~
24 25
Low Voltage Warning Forced shut down Voltage
3.59 0.03V (Call) 3.50 0.03V (Standby) 3.35 0.03V 1 Li-ion Battery
26
Battery Type
Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 780mAh Switching-mode charger
27
Travel Charger
Input: 100 ~ 240 V, 50/60 Hz Output: 5.2 V, 800 mA
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Transceiver (SI4205-BM, U500)
The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, The Aero I transceiver is the integrated RF front end for multi-band GSM/GPRS digital cellular and a VCTCXO part. handsets and wireless data modems. The integrated solution eliminates the IF SAW filter, external low noise amplifier (LNAs) for three bands, transmit and RF voltage controlled oscillator (VCO modules, and other discrete components found in conventional designs.
Figure. 3-1 RECEIVER FUNCTIONAL BLOCK DIAGRAM
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3. TECHNICAL BRIEF
(1) Receiver Part

The Aero I transceiver uses a low-IF receiver architecture which allows for the on chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional super-heterodyne architectures.
A. RF front end
RF front end consists of Front End Module(FL500) and Tri band LNAs integrated in transceiver (U500). The Received RF signals(GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz PCS 1905MHz ~ 1980MHz) are fed into the antenna or Mobile switch. The Front End Module(FL500) is used to control the Rx and Tx paths. And, the input signals VC1, VC2, VC3 of a FL500 are directly connected to baseband controller to switch either Tx or Rx path on. The logic and current is given below Table 3-1.
VC3 GSM Tx DCS, PCS Tx GSM / DCS Rx GSM / DCS Rx 0V 0V 0V 2.5 ~ 3.0 V 0V
VC2 2.5 ~ 3.0 V 0V 0V 0V 0V 0V
VC1 2.5 ~ 3.0 V
Table 3-1 THE LOGIC AND CURRENT
Three differential-input LNAs are integrated in SI4205. The GSM input supports the GSM 850 (864-894 MHz) or E-GSM 900 (925-960MHz) bands. The DCS input supports the DCS 1800 (1805-1880 MHz) band. The PCS input supports the PCS 1900 (1930-1990 MHz) band. The LNA inputs are matched to the 150 balanced output SAW filters through external LC matching networks. The LNA gain is controlled with the LNAG[1:0] and LNAC[1:0] bits in register 05h (Figure 3-2).
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3. TECHNICAL BRIEF
Figure. 3-2 SI4205 RECEIVER PARTIAGRAM
B. Intermediate frequency (IF) and Demodulation

A quadrature image-reject mixer downconverts the RF signal to a 100KHz intermediate frequency (IF) with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 to 1989.9 MHz, and is internally divided by 2 for GSM 850 and E-GSM 900 modes. The mixer output is amplified with an analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h (Figure3-2). The quadrature IF signal is digitized with high resolution A/D converters(ADCs). The ADC output is downconverted to baseband with a digital 100KHz quadrature LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference interference signals. The selectivity setting (CSEL=0) or a low selectivity setting (CSEL=1). The low selectivity filter has a flatter group channelization filter is in the baseband chip. After channel selection, the digital output is scaled with a digital PGA, which is controlled with the DGAIN [5:0] bits in register 05h. The amplified digital output signal go through with DACs that drive a differential analog signal onto the RXIP,RXIN,RXQP and RXQN pins to interface to standard analog ADC input baseband ICs. No special processing is required in the baseband for offset compensation or extended dynamic range. Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of blockers, and device 1/f noise.
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3. TECHNICAL BRIEF
(2) Transmitter Part

The transmit (Tx) section consists of an I/Q baseband upconverter, and offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824-849 MHz) and E-GSM 900 (880-915 MHz) bands and one for the DCS 1800 (1710-1785 MHz) and PCS 1900 (1850-1910MHz) bands.
Figure. 3-3 SI4205 TRANSMITTER PART
A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted sideband rejection and produces a GMSK modulated signal. The baseband software is able to cancel out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters. The Tx-Modulator implements a quadrature modulator. A quadrature mixer upconverts the differential inphase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals with the IFLO to generate a SSB IF signal that is filtered and used as the reference input to the OPLL. The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2 to generate the quadrature LO signals for the quadrature modulator, resulting in an IF between 383 and 448 MHz. For the E-GSM 900 band, two different IFLO frequencies are required for spur management. Therefore, the IF PLL must be programmed per channel in the E-GSM 900 band.
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3. TECHNICAL BRIEF
B. OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO. The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz. To allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. The I and Q signals are automatically swapped when switching bands. Additionally, the SWAP bit in register 03h can be used to manually exchange the I and Q signals. Low-pass filters before the OPLL phase detector reduce the harmonic content of the quadrature modulator and feedback mixer outputs. The cutoff frequency of the filters is programmable with the FIF[3:0] bits in register 04h (Figure 3-3), and should be set to the recommended settings detailed in the register description.
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3. TECHNICAL BRIEF
(3) Frequency Synthesizer
Figure. 3-4 SI4205 FREQUENCY SYNTHESIZER PART
The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode. All VCO tuning inductors are also integrated. The IF and RF output frequencies are set by programming the N-Divider registers, NRF1, NRF2 and NIF. Programming the N-Divider register for either RF1 or RF2 automatically selects the proper VCO. The output frequency of each PLL is as follows:
fout = N x f
The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a 13 or 26 MHz reference frequency. For receive mode, the RF1 PLL phase detector update rate (f) should be programmed f = 100 kHz for DCS 1800 or PCS 1900 bands, and f = 200 kHz for GSM 850 and E-GSM900 bands. For transmit mode, the RF2 and IF PLL phase detector update rates are always f =200 kHz.
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3. TECHNICAL BRIEF
3.2 Power Amplifier Module (RF3166, U501)

The RF3166 is a high-power, high-efficiency power amplifier module with integrated power control that provides over 50dB of control range. The device is a self-contained 6mmx6mm module with 50 input and output terminals. The device is designed for use as the final RF amplifier in GSM850, EGSM900, DCS and PCS handheld digital cellular equipment and other applications in the 824MHz to 849MHz, 880MHz to 915MHz, 1710MHz to 1785MHz and 1850MHz to 1910MHz bands. The RF3166 incorporates RFMDs latest VBATT tracking circuit, which monitors battery voltage and prevents the power control loop From reaching saturation. The VBATT tracking circuit eliminates the need to monitor battery voltage, thereby minimizing switching transients. The RF3166 requires no external routing or external components, simplifying layout and reducing board space.
Figure. 3-5 Functional Block Diagram
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3. TECHNICAL BRIEF
3.3 13 MHz Clock (VCTCXO, X500)

The 13 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates at a frequency of 13 MHz. It is used within the Si4205, analog base band chipset (U101, AD6537BABC), digital base band chipset (U100, AD6527B). MIDI Chip (U203, ML287HB), Camera Chip (U601, CL761s)
Figure 3-6 VCTCXO CIRCUIT DIAGRAM
3.4 Power Supplies for RF Circuits (RF LDO, U502)

Two regulators are used for RF circuits. One is MIC5255 (U502), and the other is one port of AD6537 (U101). MIC5255 (U502) supplies power to transceiver (SI4205, U500). One port of AD6537 supplies power to VCTCXO (X500). Main power (VBAT) from battery is used for PAM (RF3166, U501) because PAM requires high power.
Supplier U502(VRF) U101(VVCXO) Battery(VBAT)
Voltage 2.85 V 2.75 V 3.4 ~ 4.2 V
Powers U500 X500 U501
enabled signal CLKON
Table 3-2 RF POWER SUPPLIERS
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3. TECHNICAL BRIEF
Figure 3-7 RF LDO CIRCUIT DIAGRAM
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3. TECHNICAL BRIEF
3.5 Digital Main Processor (AD6527B, U100)
Figure 3-8. SYSTEM INTERCONECTION OF AD6527B EXTERNAL INTERFACE
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3. TECHNICAL BRIEF
AD6527 AD6527
is an ADI designed processor.
consists of 1. Control Processor Subsystem 32-bit ARM7TDMI Control Processor 58.5 MHz operation at 1.7V On-board 16KB instruction/Data Cache 1 Mbits of on-chip System SRAM 2. DSP Subsystem 16-bit Fixed Point DSP Processor 91 MIPS at 1.7V 16K word Data and 16K word Program SRAM 4K word Program Instruction Cache Architecture supports Full Rate, Enhanced Full Rate, Half Rate, and AMR Speech Encoding/Decoding Algorithms
3. Peripheral Subsystem Shared on-chip peripheral and off-chip interface: Support for Burst and Page Mode Flash Support for Pseudo SRAM Ciphering module for GPRS supporting GAE1 and GAE2 encryption algorithms Parallel and Serial Display Interface 8 x 8 Keypad Interface Four independent programmable backlight plus One Service Light 1.8V and 3.0V, 64 kbps SIM interface Universal System Connector Interface Slow, Medium and Fast IrDA transceiver interface Enhanced Generic Serial Port Dedicated SPI interface Thumbwheel Interface JTAG Interface for Test and In-Circuit Emulation 4. Other Supports 13 MHz and 26 MHz Input Clocks 1.8V Typical Core Operating Voltages 204-Ball LFBGA(mini-BGA) Package 5. Applications GSM900/DCS1800/PCS1900/PCS850 Wireless Terminals GSM Phase 2 + Compliant GPRS Class 12 Compliant Multimedia Services(MMS) Extended Messaging System(EMS)
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3. TECHNICAL BRIEF
3.5.1 Interconnection with external devices

A. RTC block interface
Countered by external X-TAL The X-TAL oscillates 32.768KHz
B. LCD module interface

The LCD module is controlled by CAMERA IC, CL761S If CL761S is in the state of by-pass mode, the LCD control signals from AD6527 are by-passed through CL761S. In operating mode, the CL761S controls the LCD module through L_MAIN_LCD_CS, L_SUB_LCD_CS, LCD_RESET, LCD_RS, LCD_WR, LCD_RD, L_DATA[15-00], 2V8_VEXT, IF_MODE, LCD_ID[0:2].
Signals
Description MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin It controls dimming mode of LCD module.(GPIO_5) This pin resets LCD module. This signal comes from DBB directly. Enable writing to LCD Driver. 2.8V voltage is supplied to LCD driver IC. It determines the maker of LCD module. It controls back-light of LCD module.(GPO_23)
_LCD_CS LCD_DIM_CTRL LCD_RESET

(GPIO 15)
_WR
2V8_VMEM LCD_ID(GPIO_16) LCD_BL_EN
Table 3-3. LCD CONTRON SIGNALS DISCRIPTION
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3. TECHNICAL BRIEF
The backlight of LCD module is controlled by DBB via TPS60230RGTR , U400. The control signals related to Backlight LED are given bellow.
Signals LCD-BL-EN (GPO-23) LCD-DIM-CTL (GPIO-5) LCD-LED-CTR LCD Backlight IC En / Disable
Description
Control LCD backlight level in 16 steps Voltage source for LCD Backlight LED
Table 3-4. DESCRIPTION OF LCD BACKLIGHT LED CONTROL
C. RF interface
The AD6527B control RF parts through PA-BAND, ANT-SW1, ANT-SW2, ANT-SW2, CLKON, PA-EN, SEN, SDATA, SCLK, RF-PWR-DWN.
Signals PA-BAND (GPO 17) ANT-SW1 (GPO 9) ANT-SW2 (GPO 11) ANT-SW3 (GPO 10) CLKON PA-EN (GPO 16) SEN (GPO 19) SDATA (GPO 20) SCLK (GPO 21) RF-EN (GPO 4) PAM Band Select Antenna switch Band Select Antenna switch Band Select Antenna switch Band Select RF LDO Enable/Disable PAM Enable/Disable PLL Enable/Disable Serial Data to PLL Clock to PLL Power down Input
Description
Table 3-5. RF CONTRON SIGNALS DISCRIPTION
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3. TECHNICAL BRIEF
D. SIM interface
The AD6527 provides SIM Interface Module. The AD6527 checks status periodically during established call mode whether SIM card is inserted or not, but it doesn't check during deep Sleep mode. In order to communicate with SIM card, 3 signals SIM-DATA, SIM-CLK, SIM-RST(GPIO-23) are required. The descriptions about the signals are given by bellow Table 3-6 in detail.
Signals SIM-DATA SIM-CLK SIM-RST (GPIO-23) Description This pin receives and sends data to SIM card. This model can support 1.8volt and 3.0 volt interface SIM card. Clock 3.25MHz frequency. Reset SIM block
Table 3-6. SIM CONTRON SIGNALS DISCRIPTION
SIM CONNECTOR
2V85_VSIM 2V85_VSIM
R339 20K 4 5 6 10 9 C321 NA
R346 SIM_DATA 0
J300 1 GND1 VCC 2 VPP RST 3 CLK IO 7 GND5 GND2 8 GND4 GND3 C322 220n
R347
SIM_RST SIM_CLK
C323 1000p
C324 NA
Figure 3-9. SIM Interface of AD6527
E. Key interface
Include 5 column , 5 row and additional GPIO 35 for KEY-ROW5. The AD6527 detects whether key is pressed or not by using interrupt method.
F. AD6537B Interrupt
AD6537B provides an active-high interrupt output signal. Interrupt signals are generated by the Auxiliary ADC, audio, and charger modules.
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3. TECHNICAL BRIEF
3.5.2 AD6527B Architecture
Figure 3-10. AD6527 Architecture The internal architecture of AD6527 is shown above Figure 3-10. AD6527 regroups three main subsystems connected together through a dynamic and flexible communication bus network. It also includes onboard system RAM (SRAM) and interfaces with external Flash Memory, Baseband converter functions, and terminal functions like MMI, SIM and Universal System Connector (USC). The Digital Signal Processing (DSP) subsystem primarily hosts all the speech processing, channel equalization and channel codec functions. The code used to implement such functions can be stored in external Flash Memory and dynamically downloaded on demand into the DSPs program RAM and Instruction Cache. The micro-controller subsystem supports all the GSM terminal software, including the layer 1, 2 and 3 of the GSM protocol stack, the MMI, and applications software such as data services, test and maintenance. It is tightly associated with on-chip system SRAM and also includes boot ROM memory with a small dedicated routine to facilitate the initialization of the external Flash Memory via code download using the on-chip serial interface to the external Flash Memory interface. The peripheral subsystem is composed of system peripherals such as interrupt controller, real time clock, watch dog timer, power management and a timing and control module. It also includes peripheral interfaces to the terminal functions: keyboard, battery supervision, radio and display. Both the DSP and the MCU can access the peripheral subsystem via the peripheral bus (PBUS). For program and data storage, both the MCU subsystem and the DSP subsystem can access the on chip system SRAM and external memory such Flash Memory. The access to the SRAM module is made through the RAM Bus (RBUS) under the control of the bus arbitration logic. Similarly, access to the Flash Memory is through the parallel External Bus (EBUS).
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3. TECHNICAL BRIEF
3.6 Analog Main & Power Management Processor (AD6537B, U101)
Figure 3-11. AD6537B FUNCTIONAL BLOCK DIAGRAM
Service Manual / 31
3. TECHNICAL BRIEF
AD6537B
is an ADI designed Analog Baseband processor. AD6537B covers the processing GMSK modulation interface, Aux ADC, Voice signal processing and Power Management. consists of 1. BB Transmit section GMSK Modulation I-channel & Q-channel Transmit DACs and Filters Power Ramping DAC
AD6527
2. BB Receive section I-channel & Q-channel Receive ADCs and Filters 3. Auxiliary section Voltage Reference Automatic Frequency Control DAC Auxiliary ADC Light Controllers 4. Audio Section 8 kHz & 16 kHz Voiceband Codec 48 kHz Monophonic DAC Power Amplifiers 5. Power Management section Voltage Regulators Battery Charger Battery Protection 6. Digital Processor section Control, Baseband, and Audio Serial Ports Interrupt Logic
32 / Service Manual
3. TECHNICAL BRIEF
3.6.1 Analog Main & Power Management Processor (AD6537B, U101)

1. The AD6537B Baseband Transmit Section is designed to support GMSK for both singleslot and multi-slot application. 2. The transmit channel consists of a digital GMSK modulator, a matched pair of 10-bit DACs and a matched pair of reconstruction filter
Figure 3-12. AD6537B BASEBAND TRANSMIT SECTION
3.6.2 Baseband Transmit Section

1. This section consists of two identical ADC channels that process baseband in-phase(I) and quadrature(Q) input signals.
Figure 3-13. AD6537B BASEBAND RECEIVER SECTION
Service Manual / 33
3. TECHNICAL BRIEF
3.6.3 Auxiliary Section

1. This section includes an Automatic Frequency Control(AFC) DAC, voltage reference buffers, an Auxiliary ADC, and light controllers. AFC DAC: 13 bits 2. This section also contains AUX ADC and Voltage Reference IDAC: 10 bits The Auxiliary ADC provides : - Two differential inputs for temperature sensing. - A differential input for the battery charger current sensor
Figure 3-14. AD6537B AUXILIARY SECTION
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3. TECHNICAL BRIEF
3.6.4 Audio Section

1. Receive audio signal from microphone. MG105 uses differential configuration. 2. Send audio signal to speaker. MG105 uses differential configuration. 3. This section provides an audio codec with a digital-to-analog converter and an analogtodigital converter, a ring tone volume controller, a microphone interface, and multiple analog input and output channels. 4. It interconnects with external devices like main microphone, main receiver, and headset. The descriptions of audio port used in MG105 are given bellow in detail. <Up Link> -AIN1P,AIN1N : Main microphone positive/negative terminal -AIN2P,AIN2N : Headset microphone positive/negative terminal -AIN3P,AIN3N : External Analog Input terminal <Down Link> -AOUT1P,AOUT1N : Main Speaker positive/negative terminal -AOUT3P : Headset speaker terminal
Figure 3-15. AD6537B AUDIO SECTION
Service Manual / 35
3. TECHNICAL BRIEF
3.6.5 Power Management
Figure 3-16. AD6537B POWER MANAGEMENT SECTION
1. Power up sequence logic 1. The AD6537B controls power on sequence 2. Power on sequence - If a battery is inserted, the battery powers the 8 LDOs. - Then if PWRONKEY is detected, the LDOs output turn on. - REFOUT is also enabled - Reset is generated and send to the AD6527
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3. TECHNICAL BRIEF
Figure 3-17. AD6537B POWER MODE LOGIC
2. LDO Block 1. There are 8 LDOs in the AD6537B. - VCORE : supplies Digital baseband Processor core and AD6537B digital core (1.8V, 80mA) - V M E M : supplies external memory and the interface to the external memory on the digital baseband processor (1,8V or 2.8V, 150mA) - V E X T : supplies Radio digital interface and high voltage interface (2.8V, 170mA) - V S I M : supplies the SIM interface circuitry on the digital processor and SIM card (1.8V or 2.85V, 20mA) - V R T C : supplies the Real-Time Clock module (1.8 V, 20 A) - V A B B : supplies the analog portions of the AD6537B - V M I C : supplies the microphone interface circuitry (2.5 V, 1 mA) - VVCXO : supplies the voltage controlled crystal oscillator ( 2.75 V, 10 mA)
Service Manual / 37
3. TECHNICAL BRIEF
3. Battery Charging Block

1. It can be used to charge Lithium Ion and/or Nickel Metal Hydride batteries. Charger initialization, trickle charging, and Li-Ion charging control are implemented in hardware. 2. Charging Process - Check charger is inserted or not - If AD6537B detects that Charger is inserted, the CC-CV charging starts. - Exception : When battery voltage is lower than 3.2V, the precharge (low current charge mode) starts firstly. - And the battery voltage reach to 3.2V the CC-CV charging starts. 3. Pins used for charging - VCHG : charger supply. - GATEDRIVE : charge DAC output - ISENSE : charge current sense input - VBATSENSE : battery voltage sense input. - BATTYPE : battery type identification input - REFCHG : voltage reference output 4. TA (Travel Adaptor) - Input voltage: AC 85V ~ 260V, 50~60Hz - Output voltage: DC 5.2V ( 0.2 V ) - Output current: Max 800mA ( 50mA ) 5. Battery - Input voltage: AC 85V ~ 260V, 50~60Hz - Standard battery: Capacity - 830mAh
Figure 3-18. AD6537B BATTERY CHARGING BLOCK
38 / Service Manual
3. TECHNICAL BRIEF
Figure 3-19. MG105 HEADSET SPEAKER CIRCUIT (AD6537B)
Figure 3-20. MG105 MG105 HEADSET SPEAKER CIRCUIT (AD6537B)
Service Manual / 39
3. TECHNICAL BRIEF
NORMAL CHARGING
Pre-Charge Circuit
Figure 3-21. CIRCUIT FOR BATTERY CHARGING AT AD6537B
In order to reduce time for trickle charging, additional circuit (Pre-charge circuit) was included. This circuit has supplied Max 160mA current into the battery additionally. So call it, it reduce trickle charging time
40 / Service Manual
3. TECHNICAL BRIEF
3.7 Display and Interface

Main
LCD
Properties Spec. 28.022(H) X 28.022(V) 65,000 128 X RGB X 128 0.063(H) X 0.209(V) Unit mm colors dots mm
Active Screen Size Color Depth Resolution Pixel Size
Controlled by _LCD_CS, LCD_RESET, _WR, DATA[00:15], LCD_ID, _LCD_CS : MAIN LCD driver chip enable. MAIN LCD driver IC has own CS pin LCD_RESET : This pin resets LCD module. This signal comes from DBB directly. _WR : Write control Signal _DATA[00:15] : Parallel data lines. LCD_ID[1:2] : LCD type selection signals - LCD_ID1 : LCD maker(2.4V is SII, 0V is HyeLCD) - LCD_ID[2:3] : for the future using For using 65K color, data buses should be 16 bits.
Service Manual / 41
3. TECHNICAL BRIEF
Figure 3-23. LCD INTERFACE CIRCUIT
42 / Service Manual
3. TECHNICAL BRIEF
3.8 Keypad Switches and Scanning

The key switches are metal domes, which make contact between two concentric pads on the keypad layer of the PCB when pressed. There are 22 switches (Normal Key 21EA, Camera side key), connected in a matrix of 5 rows by 5 columns and additional GPIO 35 for KEY_ROW5, as shown in Figure 3-24, except for the power switch (KB1), which is connected independently. Functions, the row and column lines of the keypad are connected to ports of AD6527. The columns are outputs, while the rows are inputs and have pull-up resistors built in. When a key is pressed, the corresponding row and column are connected together, causing the row input to go low and generate an interrupt. The columns/rows are then scanned by AD6527 to identify the pressed key.
Figure 3-27. Keypad Switches and Scanning
Service Manual / 43
3. TECHNICAL BRIEF
3.9 Microphone
The microphone is placed to the front cover and contacted to main PCB. The audio signal is passed to AIN2P and AIN2N pins of AD6537. The voltage supply VMIC is output from AD6537B, and is a biased voltage for the AIN2P. The AIN2P and AIN2N signals are then A/D converted by the voiceband ADC part of AD6537B.The digitized speech (PCM 8KHz,16KHz) is then passed to the DSP section of AD6527 for processing (coding, interleaving etc).
Figure 3-28. Connection between Microphone and AD6537B
3.10 Main Speaker

In the case of MG105 , there are 2 different speakers. One is main speaker for the received voice, key tone and other MIDI sounds and the other is headset speaker. The main speaker is driven directly from AD6537B AOUT1P and AOUT1N pins and the gain is controlled by the PGA in an AD6537B.
44 / Service Manual
3. TECHNICAL BRIEF
3.11 Headset Interface

This phone chooses a 5 pin type headset which has 6 electrodes such as GND, Headset_Mic_N, Headset_Mic_P, Headset_SPK_N, JACK_DETECT, HOOK_DETECT. This type supports stereo sound.
Switching from Receiver to Headset Jack

If jack is inserted, JACK_DETECT goes from low to high. Audio path is switched from receiver to earphone by JACK_DETECT interrupt.
Switching from Headset Jack to Receiver

If jack is removed, JACK_DETECT goes from high to low. Audio path is switched from earphone to receiver by JACK_DETECT interrupt.
Hook detection
If hook-button is pressed, HOOK_DETECT is changed from high to low.
Figure 3-29. HEADSET JACK INTERFACE
Service Manual / 45
3. TECHNICAL BRIEF
3.12 Key Back-light Illumination

In key back-light illumination, there are 6 Blue LEDs in Main Board, which are driven by MIDI-KEY-BL1 and MIDI-KEY-BL2 signal from ML2871.
Figure 3-30. KEY BACK-LIGHT ILLUMINTION
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3. TECHNICAL BRIEF
3.13 VIBRATOR
The vibrator is placed in the Bar Rear and contacted to LCD MODULE. The vibrator is driven from MIDI_VIBRATOR from ML2871.
Figure 3-32. MOTOR
Service Manual / 47
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RX Trouble
TEST POINT
Figure 4-1(a)
48 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Figure 4-1(a)
Service Manual / 49
4. TROUBLE SHOOTING
(1) Checking Regulator Circuit TEST POINT
Figure 4-2
CIRCUIT
Checking Flow
50 / Service Manual
4. TROUBLE SHOOTING
(2) Checking VCTCXO Circuit TEST POINT Checking Flow
CIRCUIT
Waveform
Graph 4-1(a)
Graph 4-1(b)
Service Manual / 51
4. TROUBLE SHOOTING
(3) Checking Ant SW & Mobile SW TEST POINT
CIRCUIT
Figure 4-5
Waveform
ANT SW Control GSM& DCS RX Mode Graph 4-3
Table 4-2
52 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Table 4-2
Service Manual / 53
4. TROUBLE SHOOTING
(4) Checking RX path Circuit TEST POINT CIRCUIT
Checking Flow
54 / Service Manual
4. TROUBLE SHOOTING
(5) Checking RX IQ TEST POINT CIRCUIT
Waveform
Graph 4-4
Checking Flow
Service Manual / 55
4. TROUBLE SHOOTING
4.2 TX Trouble TEST POINT
56 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 57
4. TROUBLE SHOOTING
(1) Checking Regulator Circuit TEST POINT
CIRCUIT
Checking Flow
58 / Service Manual
4. TROUBLE SHOOTING
(2) Checking VCTCXO Circuit TEST POINT Checking Flow
CIRCUIT
Waveform
Graph 4-1(a)
Graph 4-1(b)
Service Manual / 59
4. TROUBLE SHOOTING
(3) Checking Ant SW & Mobile SW TEST POINT
CIRCUIT
Waveform
Figure 4-5
Graph 4-6(a)
Graph 4-6(b)
60 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Table 4-3
Service Manual / 61
4. TROUBLE SHOOTING
(4) Checking PAM Control Signal TEST POINT Checking Flow
Waveform
TX_RAMP
PAM_EN
Graph 4-7
Checking Flow
Check TX-RAMP and PA-EN Check if there is Any Major Difference or not Refer to Graph 4 - 7
62 / Service Manual
4. TROUBLE SHOOTING
(6) Checking TX IQ TEST POINT Waveform
Graph 4-8
CIRCUIT
Checking Flow
Check if there is Any Major Difference Refer to Graph 4 -8
Service Manual / 63
4. TROUBLE SHOOTING
4.3 Power On Trouble TEST POINT
CIRCUIT
64 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 65
4. TROUBLE SHOOTING
4.4 Charging Trouble TEST POINT
CIRCUIT
66 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 67
4. TROUBLE SHOOTING
4.5 Vibrator Trouble TEST POINT
CIRCUIT
68 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
Service Manual / 69
4. TROUBLE SHOOTING
4.6 LCD Trouble TEST POINT
70 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 71
4. TROUBLE SHOOTING
4.7 Camera Trouble TEST POINT
CIRCUIT DIAGRAM
72 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 73
4. TROUBLE SHOOTING
4.8 Speaker Trouble TEST POINT
CIRCUIT DIAGRAM
74 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 75
4. TROUBLE SHOOTING
4.9 SIM Card Interface Trouble TEST POINT
CIRCUIT DIAGRAM SIM CONNECTOR
76 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 77
4. TROUBLE SHOOTING
4.10 Earphone Trouble TEST POINT
CIRCUIT DIAGRAM
78 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 79
4. TROUBLE SHOOTING
4.11 KEY backlight Trouble TEST POINT
80 / Service Manual
4. TROUBLE SHOOTING
CIRCUIT DIAGRAM
Checking Flow
Service Manual / 81
4. TROUBLE SHOOTING
4.12 Receiver Trouble TEST POINT
CIRCUIT DIAGRAM
82 / Service Manual
4. TROUBLE SHOOTING
Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode Set the property of audio as PRBS or continuous wave. Set the receiving volume of mobile as Max.
Service Manual / 83
4. TROUBLE SHOOTING
4.13 Microphone Trouble TEST POINT
CIRCUIT DIAGRAM
84 / Service Manual
4. TROUBLE SHOOTING
Checking Flow SETTING : After initialize Agilent 8960, Test EGSM, DCS mode
Service Manual / 85
4. TROUBLE SHOOTING
4.14 RTC Trouble TEST POINT
CIRCUIT DIAGRAM
86 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Service Manual / 87
4. TROUBLE SHOOTING
4.15 Indication LED Trouble TEST POINT
CIRCUIT DIAGRAM
88 / Service Manual
4. TROUBLE SHOOTING
Checking Flow
Indication LED only operates in trickle charging mode.
Service Manual / 89
5. DOWNLOAD AND CALIBRATION

5.1 Download
A. Download Setup Figure 5-1 describes Download setup
Figure. 5-1 Download setup
90 / Service Manual
B. Download Procedure
1. Access Flash loader program in PC and select Erase.(Dont check OWCD)
2. Press Start and Wait until Erase is completed.
Service Manual / 91
3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again.
4. Press Write to start Download and press Key to choose software (AlchemyData.mot)
92 / Service Manual
3. Change Address and Size(Address : 18000000, Size : 0x800000), and Press Start and Wait until Erase is completed again.
4. Press Write to start Download and press
Key to choose software (AlchemyData.mot)
Service Manual / 93
7. Press Start and Power on the phone using JIG remote Power on(Switch 1)
8. Wait until Sending Block is completed
94 / Service Manual
9. Press Write to start Download and press
Key to choose software(CodeData.mot)
10. Choose software
Service Manual / 95
11. Wait until Sending Block is completed
96 / Service Manual
5.2 Calibration
A. Equipment List
Equipment for Calibration Wireless Communication Test Set RS-232 Cable and Test JIG RF Cable Power Supply GPIO interface card Calibration & Final test software Test SIM Card PC (for Software Installation) Pentium class above 300MHz HP-66311B HP-GPIB Type / Model HP-8960 Band Agilent LG LG Agilent Agilent LG
B. Equipment Setup
GSM Test Set(8960)
Figure 5-2. Equipment Setup
Service Manual / 97
Figure 5-3 The top of Test JIG
Power Source Power Source Travel Adaptor
Description Usually 4.0V Use TA, name is TA-20G(24pin)
Table 5-2 jig Power

Switch Number Switch1 Switch2 Switch3 Switch4 Name ADI-REMOTE TI-REMOTE VBAT PS Description In ON state, phone is awaked. It is used ADI chipset. In ON state, phone is awaked. It is used TI chipset. Power is provided for phone from battery Power is provided for phone from Power supply
Table 5-3 Jig DIP Switch

LED Number LED1 LED2 LED3 LED4 Name POWER TA VART MON Description Power is provided for Test Jig Indicate charging state of the phone battery Indicate data transfer state through the UART port Indicate data transfer state through the MON port
Table 5-4 LED Description
98 / Service Manual
1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Set the Power Supply 4.0V 3. Set the 3rd, 4th of DIP SW ON state always 4. Press the Phone power key, if the Remote ON is used, 1st ON state
D. Procedure
1. Connect as Fig 6-2(RS232 serial cable is connected between COM port of PC and MON port of TEST JIG, in general) 2. Power ON PC then enter into Windows 98(Remark : Windows 2000 system could be feasible) 3. Run AUTOCAL.exe, the AUTOCAL application window will be appeared.
Service Manual / 99
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM-Base Band
- 100 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM-RF
- 101 -
7. CIRCUIT DIAGRAM
7.1 MANI
- 102 -
7. CIRCUIT DIAGRAM
7.2 AUDIO&MIDI
- 103 -
7. CIRCUIT DIAGRAM
7.3 MEMORY&MMI&IO
- 104 -
7. CIRCUIT DIAGRAM
7.4 LCD CONN
- 105 -
7. CIRCUIT DIAGRAM
7.5 RF Circuit
- 106 -
7. CIRCUIT DIAGRAM
7.6 CAMERA
- 107 -
8. PCB LAYOUT
-108 -
8. PCB LAYOUT
- 109 -
9. ENGINEERING MODE
9. ENGINEERING MODE
A. About Engineering Mode

Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided by a handset.
B. Access Codes
The key sequence for switching the engineering mode on is 2945# *#. Pressing END will switch back to non-engineering mode operation.
C. Key Operation
Use Up and Down key to select a menu and press select key to progress the test. Pressing back key will switch back to the original test menu.
D. Engineering Mode Menu Tree
110 / Service Manual
9. ENGINEERING MODE
9.1 BB Test [MENU 1]
9.1.1 Camera
1) Preview : This menu is to test Camera preview on LCD screen.
9.1.2 LCD
1) Contrast value : This menu is to change contrast value of LCD screen.
9.1.3 Backlight
This menu is to test the LCD Backlight and Keypad Backlight. 1) Backlight on : LCD Backlight and Keypad Backlight light on at the same time. 2) Backlight off : LCD Backlight and Keypad Backlight light off at the same time. 3) Backlight value : This controls brightness of Backlight. When entering into the menu, the present backlight-value in the phone is displayed. Use Left/Right key to adjust the level of brightness. The value of the brightness set at last will be saved in the NVRAM.
9.1.4 Buzzer
This menu is to test the melody sound. 1) Melody on : Melody sound is played through the speaker. 2) Melody off : Melody sound is off.
Service Manual / 111
9. ENGINEERING MODE
9.1.4 Vibrator
This menu is to test the LCD Backlight and Keypad Backlight. 1) Vibrator on : Vibration mode is on. 2) Vibrator off : Vibration mode is off.
9.1.5 ADC (Analog to Digital Converter)

This displays the value of each ADC. 1) MVBAT ADC : Main Voltage Battery ADC 2) AUX ADC : Auxiliary ADC 3) TEMPER ADC : Temperature ADC
9.1.6 BATTERY
1) Bat Cal : This displays the value of Battery Calibration. The following menus are displayed in order : BAT-LEV-4V, BAT-LEV-3-LIMIT, BAT-LEV-2-LIMIT, BAT-LEV-1-LIMIT, BAT-IDLE-LI MIT, BATINCALL-LIMIT, SHUT-DOWN-VOLTAGE, BAT-RECHARGE-LMT 2) TEMP Cal : This displays the value of Temperature Calibration. The following menus are displayed in order:TEMP-HIGH-LIMIT, TEMP-HIGH-RECHARGE-LMT, TEMP-LOW-RECHARGE-LMT, TEMP-LOW-LIMIT
9. ENGINEERING MODE
9.1.7 Audio
This is a menu for setting the control register of Voiceband Baseband Codec chip. Although the actual value can be written over, it returns to default value after switching off and on the phone. 1) VbControl1 : VbControl1 bit Register Value Setting 2) VbControl2 : VbControl2 bit Register Value Setting 3) VbControl3 : VbControl3 bit Register Value Setting 4) VbControl4 : VbControl4 bit Register Value Setting 5) VbControl5 : VbControl5 bit Register Value Setting 6) VbControl6 : VbControl6 bit Register Value Setting
9.1.8 DAI (Digital Audio Interface)

This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. 1) DAI AUDIO : DAI audio mode 2) DAI UPLINK : Speech encoder test 3) DAI DOWNLINK : Speech decoder test 4) DAI OFF : DAI mode off
9.2 RF Test [MENU 2] 9.2.1 SAR test

This menu is to test the Specific Absorption Rate. 1) SAR test on : Phone continuously process TX only. Call-setup equipment is not required. 2) SAR test off : TX process off
9. ENGINEERING MODE
9.3 MF mode [MENU 3]

This manufacturing mode is designed to do the baseband test automatically. Selecting this menu will process the test automatically, and phone displays the previous menu after completing the test.
9.3.1 All auto test

LCD, Backlight, Vibrator, Buzzer, Key Pad, Mic&Speaker,
9.3.2 Backlight
LCD Backlight is on for about 1.5 seconds at the same time, then off.
9.3.3 Buzzer
This menu is to test the volume of Melody. It rings in the following sequence. Volume 1, Volume 2, Volume 3, Volume 0 (mute), Volume 4, Volume 5.
9.3.4 Vibratort
Vibrator is on for about 1.5 seconds.
9.3.5 LCD
1)LCD Main LCD screen resolution tests horizontally and vertically one by one and fills the screen. 2)SubLCD Sub LCD screen resolution tests horizontally and vertically one by one and fills the screen.
9.3.6 Key pad

When a pop-up message shows Press Any Key, you may press any keys including side keys, but not [Soft2 Key]. If the key is working properly, name of the key is displayed on the screen. Test will be completed in 15 seconds automatically.
9.3.7 MicSpk Test

The sound from MIC is recorded for about 3 seconds, then it is replayed on the speaker automatically.
9. ENGINEERING MODE
9.4 Trace option [MENU 4]

This is NOT a necessary menu to be used by neither engineers nor users.
9.5 Call timer [MENU 5]

This menu is to set the Digital Audio Interface Mode for Speech Transcoder and Acoustic testing. 1) All calls : This displays total conversation time. User cannot reset this value. 2) Reset settings : This resets total conversation time to this, [00:00:00]. 3) DAI DOWNLINK : Speech decoder test 4) DAI OFF : DAI mode off
9.6 Fact. Reset [MENU 6]

This Factory Reset menu is to format data block in the flash memory and this procedure set up the default value in data block.
Attention 1 Fact. Reset (i.e.Factory Reset) should be only used during the Manufacturing process. Servicemen should NOT progress this menu, otherwise some of valuable data such as Setting value, RF Calibration data, etc. cannot be restored again.
9.7 S/W version

This displays software version stored in the phone.
10. STAND ALONE TEST
10.1 Introduction
This manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
10.2 Setting Method A. COM port

a. Move your mouse on the Connect button, then click the right button of the mouse and select Com setting. b. In the Dialog Menu, select the values as explained below. - Port : select a correct COM port - Baud rate : 38400 - Leave the rest as default values
B. Tx 1. Selecting Channel
- Select one of GSM or DCS Band and input appropriate channel.
2. Selecting APC
a. Select either Power level or Scaling Factor. b. Power level - Input appropriate value GSM (between 5~19) or DCS (between 0~15) c. Scaling Factor - A Ramp Factor appears on the screen. - You may adjust the shape of the Ramp or directly input the values.
C. Rx
1. Selecting Channel - Select one of GSM or DCS Band and input appropriate channel. 2. Gain Control Index (0~26) and RSSI level - See if the value of RSSI is close to-16dBm when setting the value between 0~26 in Gain Control Index. - Normal phone should indicate the value of RSSI close to-16dBm.
10.3 Means of Test

a. Select a COM port b. Set the values in Tx or Rx c. Select band and channel d. After setting them all above, press connect button. e. Press the start button
Figure. 3-2 SI4205 RECEIVER PARTIAGRAM
Figure 11-2. HW test setting
Figure 11-3. Ramping profile
11.AUTO CALIBRATION
11. AUTO CALIBRATION
11.1 Overview
Autocal (Auto Calibration) is the PC side Calibration tool that perform Tx ,Rx and Battery Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable Power supply). Autocal generate calibration data by communicating with phone and measuring equipment then write it into calibration data block of flash memory in GSM phone.
11.2 Requirements
-PC or Notebook installed with Microsoft Windows 98/ME/2000/XP -Auto Calibration program(Autocal.exe) -GSM Phone -LGE PIF JIG, Serial Cable, Data Cable -Agilent 8960(Call Setting Instrument) -Tektronix PS2521G(Programmable Power Supply)
11.3 Menu and Settings

-File(F) Clear View : Clear Calibration Status window texts -File(F) Save View : Save Calibration Status window texts -File(F) Save Setting : Save Current Calibration settings to setting file(*.cal) -File(F) Load Setting : Load saved Calibration setting -File(F) Make BIN ALL : Make binary file after calibration finished -File(F) Make BIN BAT.Cal only : Make binary file of battery cal data only after calibration finished -File(F) Make & Write BIN : Make binary file after calibration finished then download it to the Flash Memory -View(V) Tools : Enable or disable Tool bar -View(V) Status : Enable or disable status bar -Connection(C) Connect : Connect the phone with PC. This procedure checks whether the PC is connected ag8960 or not. After that it performs sync. procedure with phone. If the sync. procedure is successful state column on status bar changed to SETUP, else you should disconnect phone and try again from the beginning and also check the whole connection. All measurement is performed at state SETUP. -Connection(C) Port Setting : Show COM port setting dialog and Baudrate you can change,etc. -GPIB(G) Connect : Connect the Ag8960 GPIB card with PC.
11.AUTO CALIBRATION
Figure 11-1. Auto Calibration Program Screen Screen Screen Screen Cable loss : Enter the RF cable loss GSM and DCS GPIB(Primary address) : Enter the SS(Ag8960) and PS(Tektronix PS2521G) GPIB address ADC Channel : Default ADC Calibration Channel Auto Calibration Item : Default Calibration Settings about Tx, Rx, ADC and write BIN file
11.AUTO CALIBRATION
11.4 AGC
This procedure is for Rx calibration. In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the result window will show correction values per every power level and gain code and the same measure is performed per every frequency.
11.5 APC
This procedure is for Tx calibration. In this procedure you can get proper scale factor value and measured power level.
11.6 ADC
This procedure is for battery calibration. You can get main Battery Config Table and temperature Config Table
11.7 Setting
check com port and cable loss. Select automatic calibration item. If you uncheck one item calibration will stop from the unchecked item. This is useful when you want to process only one item.
11.8 How to do calibration

A. Connect cable between phone and serial port of PC. B. Connect Ag8960 equipment and Power Supply and phone. C. Set correct port and baud rate. D. Press Start button. AutoCal process all calibration procedure i. AGC EGSM ii. AGC DCS iii. APC EGSM iv. APC DCS v. ADC E. After finished all measurement. The state is return to SETUP. F. The Cal file will be generated and then the calibration data will be written into phone and then will be reset.
12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 Exploded View
17 12 37 33 5 1 2 4 9 7 10
6 13 15
14
16
11 35 38 8 31 28 21 18 23 19 25 30 22
24
26
27 20
32
29 39 34 36
- 123 -
12.EXPLODED VIEW & REPLACEMENT PART LIST
12.2 Replacement Parts <Mechanical Component>

Level 1 2 2 3 4 5 5 4 4 4 4 4 4 4 4 4 4 4 3 4 5 5 4 4 4 4 4 4 4 4 4 4 3 3 3 4 3 4 AAAY00 APEY ACGK00 AWAB00 BFAA MWAC MBJL00 MCJK MDAG00 MGBY00 MICD MICD00 MPBG00 MPBZ00 MTAB00 MTAD00 MTAZ00 ACGM00 AWAZ00 BFAA MWAE MCCC00 MCJN00 MLCD00 MPBT00 MTAB00 MTAC00 MTAD00 MTAZ00 MTAZ01 MTAZ02 AKAZ GMZZ00 MBFP00 MTAZ00 MCCF00 MTAZ Location No. Description GSM,BAR/FILP ADDITION PHONE COVER ASSY,FRONT WINDOW ASSY,LCD FILM,INMOLD WINDOW,LCD BUTTON,SIDE COVER,FRONT DECO,FRONT GAUZE INSERT,BAR INSERT,BAR PAD,LCD PAD TAPE,PROTECTION TAPE,WINDOW TAPE COVER ASSY,REAR WINDOW ASSY FILM,INMOLD WINDOW,CAMERA CAP,EARPHONE JACK COVER,REAR LENS,CAMERA PAD,CAMERA TAPE,PROTECTION TAPE,SHIELD TAPE,WINDOW TAPE TAPE TAPE KEYPAD ASSY SCREW MACHINE BRACKET,CAMERA TAPE CAP,MOBILE SWITCH TAPE Part Number TGSM0034701 AAAY0092101 APEY0183912 ACGK0047201 AWAB0016601 BFAA0024801 MWAC0047901 MBJL0017501 MCJK0035301 MDAG0009201 MGBY0003201 MICD0000801 MICD0000601 MPBG0029801 MPBZ0083501 MTAB0065001 MTAD0031901 MTAZ0067901 ACGM0046601 AWAZ0006501 BFAA0024701 MWAE0006401 MCCC0021101 MCJN0031401 MLCD0003801 MPBT0012601 MTAB0065101 MTAC0023501 MTAD0032001 MTAZ0053801 MTAZ0053901 MTAZ0063701 AKAZ0008104 GMZZ0015101 MBFP0002201 MTAZ0054001 MCCF0021801 MTAZ0053901
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Specification Color Remark
Silver Silver Silver Silver RUSSIA 2
Green Silver Silver Black [1.4X2.5pieX4mm] M1.4X2.5pieX2mm Black Black
6 5 3 38
7 37 1 4 35
Black Black RUSSIA 28
Silver Black
19 21 25
Black
20 31 36 22 23 24
Black TEXT : ENGLISH 1.4 mm,3.0 mm,MSWR3(FN) ,N ,+ ,- , Silver Silver
34 8 27 14 13
Silver
26
Level 3 3 3 3 3 3 3 5 5 6 5 5
Location No. MLAK MPBT00 MPBZ00 MPBZ01 MTAC00 MTAC01 MTAZ00 ADCA00 AMCY00 MPBZ00 MLAB00 MLAC00
Description LABEL,MODEL PAD,CAMERA PAD PAD TAPE,SHIELD TAPE,SHIELD TAPE DOME ASSY,METAL MIKE ASSY PAD LABEL,A/S LABEL,BARCODE
Part Number MLAK0013603 MPBT0012701 MPBZ0080601 MPBZ0080901 MTAC0022101 MTAC0022201 MTAZ0065101 ADCA0028801 AMCY0002401 MPBZ0080901 MLAB0000601 MLAC0003301 HUMIDITY STICKER
Specification
Color
Remark 32
Black Blue Black Gold Gold
16
33 11 Black Black
EZ LOOKS(use for PCB ASSY MAIN(hardware)
12.2 Replacement Parts
<Main component>
Level 4 4 3 4 6 5 5 5 4 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 Location No. SUSY00 SJMY00 SAFY00 SAFB00 SUMY00 SBCL00 SVCY00 SVLY00 SAFF00 SAFC00 C100 C101 C102 C103 C104 C105 C106 C107 C108 C109 C110 C111 C112 C113 C114 C115 C116 C117 C118 C119 C120 C121 C122 C123 C124 C125 C128 C130 Description SPEAKER VIBRATOR,MOTOR PCB ASSY,MAIN PCB ASSY,MAIN,INSERT MICROPHONE BATTERY,CELL,LITHIUM CAMERA LCD PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP RES,VARIABLE,ETC RES,VARIABLE,ETC CAP,TANTAL,CHIP CAP,CERAMIC,CHIP Part Number SUSY0014801 SJMY0007001 SAFY0125001 SAFB0041301 SUMY0003802 SBCL0001303 SVCY0005801 SVLY0025501 SAFF0054601 SAFC0048001 ECCH0000163 ECCH0004904 ECCH0000163 ECCH0004904 ECCH0000163 ECCH0004904 ECCH0000163 ECCH0000163 ECCH0000163 ECCH0000115 ECCH0000163 ECTZ0002602 ECCH0000117 ECCH0004904 ECCH0000276 ECCH0000276 ECCH0004904 ECCH0004904 ECCH0005801 ECCH0004904 ECCH0004904 ECCH0000122 ECCH0000165 ECCH0004904 ERVZ0000101 ERVZ0000101 ECTH0001701 ECCH0000143
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Specification PIN ,8 ohm,88 dB,20 mm,*14mm 3 V,0.085 A,4*12.5 ,6.6T,L3100,SILINDER
Color
Remark 9 18 12
FPCB ,-42 dB,4*1.5 , 2 V,1 mAh,COIN ,SOLDER TYPE BACKUP BATTERY CMOS ,VGA , MAIN ,128*128 ,35.78*39.7 ,65k ,CSTN ,TM ,ST7636 (Sitronix), 15 10
47 nF,10V,K,X5R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 47 nF,10V,K,X5R,HD,1005,R/TP 22 uF,6.3V ,M ,STD ,2012 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V,Z,Y5V,HD,1608,R/TP 1 uF,10V,Z,Y5V,HD,1608,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 68 nF,6.3V,K,X5R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 10 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C131 C133 C134 C135 C136 C137 C138 C139 C140 C141 C142 C143 C144 C145 C146 C200 C203 C204 C205 C206 C207 C208 C212 C215 C216 C217 C218 C219 C220 C222 C223 C224 C226 C227 C228 C229 C230 C231 C299 C300 C301
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,TANTAL,CHIP,MAKER CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0000113 ECCH0004904 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0004904 ECCH0004904 ECCH0000120 ECCH0004903 ECCH0000120 ECCH0000120 ECCH0004904 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000182 ECCH0000182 ECCH0000120 ECTZ0002602 ECTZ0005201 ECTZ0005201 ECCH0007901 ECCH0000120 ECCH0000120 ECCH0000120 ECCH0000182 ECCH0000182 ECCH0000159 ECCH0000159 ECCH0004904 ECCH0000159 ECCH0000159 ECTZ0005201 ECCH0000122 ECCH0000122 ECTZ0005201 ECCH0004904 ECTZ0005201 ECCH0006201 ECCH0004903
Specification 18 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 22 uF,6.3V ,M ,STD ,2012 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP
Color
Remark
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C302 C303 C304 C305 C306 C307 C308 C309 C310 C311 C312 C313 C322 C323 C325 C327 C328 C405 C406 C407 C408 C409 C498 C500 C501 C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C513 C514 C515 C516 C517 C518
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0000155 ECCH0004903 ECCH0000117 ECCH0000120 ECCH0000110 ECCH0000104 ECCH0000182 ECCH0000117 ECCH0004904 ECCH0000117 ECCH0000120 ECTZ0002602 ECCH0001811 ECCH0000143 ECCH0000182 ECCH0007901 ECCH0007901 ECCH0000276 ECCH0000122 ECTZ0002602 ECCH0001811 ECCH0001811 ECCH0004904 ECCH0000120 ECCH0000117 ECCH0000113 ECCH0000155 ECCH0000155 ECCH0000104 ECCH0000110 ECTZ0003101 ECCH0000117 ECCH0000143 ECCH0000901 ECCH0000178 ECCH0000120 ECCH0000181 ECCH0000120 ECCH0000102 ECCH0000104 ECCH0000159
Specification 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 22 uF,6.3V ,M ,STD ,2012 ,R/TP 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,10V,Z,Y5V,HD,1608,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 22 uF,6.3V ,M ,STD ,2012 ,R/TP 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 220000 pF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 18 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 33 uF,10V ,M ,STD ,ETC ,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 4.7 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 3 pF,50V,C,NP0,TC,1005,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP
Color
Remark
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C519 C520 C521 C522 C523 C524 C525 C526 C527 C528 C529 C530 C531 C532 C533 C534 C535 C536 C537 C538 C539 C540 C541 C542 C600 C601 C602 C603 C604 C605 C606 C607 C608 CN300
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,I/O CONNECTOR,BOARD TO
Part Number ECCH0000115 ECCH0000128 ECCH0000115 ECCH0000103 ECCH0000103 ECCH0000102 ECCH0000701 ECCH0000159 ECCH0000115 ECCH0000178 ECCH0000143 ECCH0000143 ECCH0000178 ECCH0005801 ECCH0000135 ECCH0000135 ECCH0007901 ECCH0004903 ECCH0000155 ECCH0000117 ECCH0000117 ECCH0000117 ECCH0000117 ECCH0000135 ECCH0004903 ECCH0000155 ECCH0004903 ECCH0000155 ECCH0000167 ECCH0004903 ECCH0000155 ECCH0000182 ECCH0004903 ENRY0003501
Specification 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1.5 pF,50V,C,NP0,TC,1005,R/TP 1.5 pF,50V,C,NP0,TC,1005,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 22 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1.8 pF,50V ,D ,NP0 ,TC ,1005 ,R/TP 2.2 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 10 uF,4V ,M ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 27 pF,50V,J,NP0,TC,1005,R/TP 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,6.3V,K,X5R,HD,1005,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,Z ,Y5V ,TC ,1005 ,R/TP 24 PIN,0.5 mm,ANGLE , ,
Color
Remark
6 6 6 6 6 6
CN600 D100 D101 D300 FL400 FL401
BOARD DIODE,SWITCHING DIODE,SWITCHING DIODE,SWITCHING FILTER,EMI/POWER FILTER,EMI/POWER
ENBY0019501 EDSY0012101 EDSY0005701 EDSY0012301 SFEY0006401 SFEY0006401
20 PIN,.4 mm,ETC , ,H=1.5, Socket US-FLAT ,30 V,1 A,R/TP ,2.5*1.25*0.6(t) EMT3 ,80 V,4 A,R/TP , 1-1E1A ,85 V,1 A,R/TP ,P=200mW, IFM=200mA SMD ,6 Channel, EMI+ESD, CSP SMD ,6 Channel, EMI+ESD, CSP
Level 6
Location No. FL402
Description FILTER,EMI/POWER
Part Number SFEY0006401
Specification SMD ,6 Channel, EMI+ESD, CSP 900.1800 ,1900 ,3.0 dB,3.8 dB,25 dB,23 dB,ETC ,
Color
Remark
6 6 6 6 6 6 6 6 6 6 6 6
FL500 FL600 FL601 FL602 J200 J300 L500 L501 L502 L503 L504 L505
FILTER,SEPERATOR FILTER,EMI/POWER FILTER,EMI/POWER FILTER,EMI/POWER CONN,JACK/PLUG, EARPHONE CONN,SOCKET INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP
SFAY0003802 SFEY0009301 SFEY0009301 SFEY0009301 ENJE0002301 ENSY0007608 ELCH0005002 ELCH0001003 ELCH0001001 ELCH0002702 ELCH0002717 ELCH0002716
7.2*5.0*1.8mm SMD , SMD , SMD , 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD 6 PIN,ETC ,BRIDGE NON PROTECTOR TYPE ,2.54 mm,2.7T 2.7 nH,S ,1005 ,R/TP , 6.8 nH,J ,1005 ,R/TP , 10 nH,J,1005,R/TP 22 nH,G ,1608 ,R/TP , 6.8 nH,J ,1608 ,R/TP ,coil inductor 5.1 nH,J ,1608 ,R/TP ,coil inductor 2.9*1.9*0.8(t) ,0.7 W,20 V,-6.0 A,R/TP ,NDC652P
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Q100 Q200 Q300 Q301 Q400 R101 R102 R105 R106 R107 R108 R109 R110 R112 R113 R114 R115 R116 R201 R202 R204 R205 R206 R209 R211 R212
TR,FET,P-CHANNEL TR,BJT,NPN TR,BJT,NPN TR,BJT,NPN TR,BJT,NPN RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP
EQFP0004201 EQBN0004801 EQBN0007101 EQBN0004801 EQBN0007101 ERHY0000261 ERHY0000220 ERHY0001102 ERHY0000230 ERHY0000512 ERHY0000273 ERHY0000202 ERHY0000278 ERHY0000202 ERHY0000273 ERHY0000280 ERHY0000254 ERHY0000261 ERHY0000247 ERHY0000296 ERHY0000250 ERHY0000265 ERHY0000265 ERHY0000288 ERHY0000202 ERHY0000202
upgrade(substitution) item SMT6 ,0.2 W,R/TP , EMT3 ,0.15 W,R/TP ,LOW FREQUENCY SMT6 ,0.2 W,R/TP , EMT3 ,0.15 W,R/TP ,LOW FREQUENCY 10K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 0.2 ohm,1/4W ,F ,2012 ,R/TP 330 ohm,1/16W,J,1005,R/TP 10M ohm,1/16W,J,1608,R/TP 47K ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 82K ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 47K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 4.7K ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 2.2K ohm,1/16W,J,1005,R/TP 1M ohm,1/16W,J,1005,R/TP 3.3K ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 240K ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP 4.7 ohm,1/16W,J,1005,R/TP
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R213 R215 R216 R217 R218 R219 R220 R221 R222 R224 R225 R226 R228 R229 R230 R231 R301 R302 R303 R304 R305 R306 R307 R310 R311 R313 R314 R315 R317 R318 R319 R321 R322 R323 R324 R325 R327 R328 R329 R332 R333
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP
Part Number ERHY0000201 ERHY0000296 ERHY0000244 ERHY0000280 ERHY0000203 ERHY0000203 ERHY0000203 ERHY0000203 ERHY0000265 ERHY0000265 ERHY0000265 ERHY0000274 ERHY0000265 ERHY0000201 ERHY0000201 ERHY0000274 ERHY0000237 ERHY0000280 ERHY0000280 ERHY0000280 ERHY0000280 ERHY0000280 ERHY0000237 ERHY0000244 ERHY0000213 ERHY0000220 ERHY0000274 ERHY0000237 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000237 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000237 ERHY0000213 ERHY0000241 ERHY0000237
Specification 0 ohm,1/16W,J,1005,R/TP 1M ohm,1/16W,J,1005,R/TP 1.5K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 10 ohm,1/16W,J,1005,R/TP 10 ohm,1/16W,J,1005,R/TP 10 ohm,1/16W,J,1005,R/TP 10 ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 51K ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 51K ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 1.5K ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 51K ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 1K ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP
Color
Remark
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R334 R335 R336 R337 R338 R339 R346 R347 R349 R350 R352 R353 R354 R355 R356 R357 R358 R359 R405 R406 R407 R498 R500 R501 R502 R503 R504 R505 R506 R507 R508 R509 R510 R511 R512 R513 R600 R602 R604 R605 R606
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP
Part Number ERHY0000237 ERHY0000237 ERHY0000237 ERHY0000237 ERHY0000237 ERHY0000265 ERHY0000201 ERHY0000201 ERHY0007007 ERHY0000241 ERHY0000273 ERHY0000116 ERHY0000261 ERHY0000261 ERHY0000207 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000262 ERHY0000261 ERHY0000287 ERHY0000261 ERHY0000263 ERHY0000220 ERHY0000220 ERHY0006603 ERHY0000223 ERHY0000223 ERHY0000210 ERHY0000224 ERHY0000224 ERHY0000263 ERHY0000220 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000201 ERHY0000261 ERHY0000280 ERHY0000280
Specification 680 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 680 ohm,1/16W,J,1005,R/TP 20K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 15 ohm,1/8W ,F ,2012 ,R/TP 1K ohm,1/16W,J,1005,R/TP 47K ohm,1/16W,J,1005,R/TP 1.5K ohm,1/16W,F,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 20 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 12K ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 220K ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 15K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 36 ohm,1/16W ,J ,1005 ,R/TP 150 ohm,1/16W,J,1005,R/TP 150 ohm,1/16W,J,1005,R/TP 30 ohm,1/16W,J,1005,R/TP 180 ohm,1/16W,J,1005,R/TP 180 ohm,1/16W,J,1005,R/TP 15K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP
Color
Remark
Level 6 6 6 6 6 6
Location No. R608 R609 R610 R611 SW500 SW501
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP CONN,RF SWITCH SWITCH,TACT
Part Number ERHY0000254 ERHY0000254 ERHY0000201 ERHY0000280 ENWY0003001 ESCY0002501
Specification 4.7K ohm,1/16W,J,1005,R/TP 4.7K ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 100K ohm,1/16W,J,1005,R/TP STRAIGHT ,SMD ,0.6 dB,3.8X3.0X3.6T 12 V,0.05 A,HORIZONTAL ,220 G,G5200 TACK S/W CSP BGA ,204 PIN,R/TP ,GSM/GPRS DIGITAL
Color
Remark
U100
IC
EUSY0181502
BASEBAND PROCESSOR / ART7TDMI DSP 148-TERMINAL BGA ,148 PIN,R/TP ,GSM ANALOG
U101
IC
EUSY0169301
BASEBAND / TYPHOON B SC82-AB (SC70-4) ,4 PIN,R/TP ,80mA CMOS LOW IQ
6 6 6 6 6 6
U200 U201 U202 U203 U206 U300
IC IC IC IC IC IC
EUSY0204801 EUSY0250501 EUSY0119001 EUSY0212401 EUSY0149701 EUSY0250201
LDO VOLTAGE REGULATOR / 2.5V SC70 ,5 PIN,R/TP ,Comparator, pin compatible to EUSY0077701 10 uMAX ,10 PIN,R/TP ,DUAL SPDT ANALOG SWITCHES BGA ,35 PIN,R/TP , LLP ,10 PIN,R/TP ,1 Watt Audio Power Amplifier / Leadless Type BGA ,88 PIN,R/TP ,128T+32ps(MLC) 8X10 SOT23 ,5 PIN,R/TP ,2.85V/150mA Low Noise uCap LDO
6 6 6
U310 U400 U500
IC IC IC
EUSY0118602 EUSY0238201 EUSY0161301
Regulator QFN ,16 PIN,R/TP ,3 LEDs, WHITE LED CHARGE PUMP 8x8 LGA ,28 PIN,R/TP , 35 dBm,55 %,2 A,-50 dBc,25 dB,6.0 * 6.0 * 1.4 ,SMD ,
U501
PAM
SMPY0008901
GSM QUAD PAM SOT23 ,5 PIN,R/TP ,2.85V/150mA Low Noise uCap LDO
U502
IC
EUSY0118602
Regulator SOT23 ,5 PIN,R/TP ,2.85V/150mA Low Noise uCap LDO
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
U600 U601 U602 VA101 VA102 VA204 VA205 VA206 VA300 VA304 VA305 VA307 VA308 VA309 VA310
IC IC IC VARISTOR VARISTOR RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC VARISTOR VARISTOR VARISTOR VARISTOR RES,VARIABLE,ETC VARISTOR VARISTOR
EUSY0118602 EUSY0232601 EUSY0118802 SEVY0001001 SEVY0001001 ERVZ0000101 ERVZ0000101 ERVZ0000101 SEVY0001001 SEVY0000702 SEVY0000702 SEVY0000702 ERVZ0000101 SEVY0001001 SEVY0001001
Regulator
SOT-23 ,5 PIN,R/TP ,150mA Low Noise uCap CMOS LDO 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 14 V, ,SMD ,50pF, 1005 14 V,10% ,SMD , 14 V,10% ,SMD , 14 V,10% ,SMD , ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005
Level 6 6 6 6 6 6 6 6 6 6 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. VA311 VA312 VA313 VA314 VA350 VA352 VA353 VA354 X100 X500 SAFD00 C201 C202 C209 C210 C211 C213 C214 C314 C315 C316 C317 C318 C319 C320 C400 C401 C402 C403 C404 C497
Description VARISTOR VARISTOR VARISTOR RES,VARIABLE,ETC VARISTOR VARISTOR VARISTOR VARISTOR X-TAL VCTCXO PCB ASSY,MAIN,SMT TOP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CONNECTOR,BOARD TO
Part Number SEVY0001001 SEVY0001001 SEVY0001001 ERVZ0000101 SEVY0001001 SEVY0001001 SEVY0001001 SEVY0001001 EXXY0015601 EXSK0006501 SAFD0046901 ECCH0000120 ECTZ0002601 ECCH0000120 ECCH0000120 ECCH0000182 ECCH0000120 ECCH0000120 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000182 ECCH0004904 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115 ECCH0000115
Specification 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 14 V, ,SMD ,50pF, 1005 .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 , 13 MHz,2 PPM,10 pF,SMD ,3.2*2.5*1.2 ,SV 2.85V, AFC 0.8V
Color
Remark
39 pF,50V,J,NP0,TC,1005,R/TP 10 uF,10V ,M ,STD ,2125 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP
6 6 6 6 6 6 6 6 6
CN400 LD300 LD301 LD302 LD303 LD304 LD305 LD306 R200
BOARD DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP RES,CHIP
ENBY0018701 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0004502 EDLH0007901 ERHY0000241
41 PIN,0.3 mm,STRAIGHT , ,0.9t stacking height BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T BLUE ,1608 ,R/TP ,0.35T RED ,1608 ,R/TP ,Indicator,0.4T Red LED 1K ohm,1/16W,J,1005,R/TP
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 5 3
Location No. R203 R207 R208 R210 R214 R340 R341 R342 R343 R344 R345 R348 R400 R401 R402 R403 R404 VA200 VA201 VA202 VA203 VA400 VA401 SPFY SNGF00
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC RES,VARIABLE,ETC PCB,MAIN ANTENNA,GSM,FIXED
Part Number ERHY0000247 ERHY0000220 ERHY0000201 ERHY0000220 ERHY0000247 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000213 ERHY0000239 ERHY0000233 ERHY0000233 ERHY0000261 ERHY0000274 ERHY0000274 ERVZ0000101 ERVZ0000101 ERVZ0000101 ERVZ0000101 ERVZ0000101 ERVZ0000101 SPFY0097501 SNGF0006402
Specification 2.2K ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 0 ohm,1/16W,J,1005,R/TP 100 ohm,1/16W,J,1005,R/TP 2.2K ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 47 ohm,1/16W,J,1005,R/TP 820 ohm,1/16W,J,1005,R/TP 470 ohm,1/16W,J,1005,R/TP 470 ohm,1/16W,J,1005,R/TP 10K ohm,1/16W,J,1005,R/TP 51K ohm,1/16W,J,1005,R/TP 51K ohm,1/16W,J,1005,R/TP ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR ohm, PIN, ,SMD ,R/TP ,1005 SIZE CHIP VARISTOR FR-4 ,1.0 mm,BUILD-UP 8 ,B2100 MAIN PCB 3.0 ,-2.0 dBd, ,EGSM+DCS+PCS, Intenna
Color
Remark
17
12.3 Accessory
Location No. WSAY00
Note: This Chapter is used for reference, Part order by SBOM standard on GCSC
Description Part Number WSAY0016801 Specification B2100 SOFTWARE,APPLICATION for Australia Optus B2100P40FL-61-V100-505-02 MAR 29 2005@ B2100 Color Remark
Level 3
SOFTWARE,APPLICATION
WSYY00
SOFTWARE
WSYY0222601
Austailia Optus

LG Mg105 Service Manual

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LG Mg105 Service Manual

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Service Manual

Service Manual MG105

Date: April, 2005 / Issue 1.0

3. TECHNICAL BRIEF ........................... 16

5. DOWNLOAD AND CALIBRATION ................................. 90

6. BLOCK DIAGRAM .......................... 100

7. CIRCUIT DIAGRAM ................................ 102

4. TROUBLE SHOOTING .................. 48

8. PCB LAYOUT .............................. 108

12. EXPLODED VIEW & REPLACEMENT PART LIST ........ 123

9. ENGINEERING MODE ................... 109

10. STAND ALONE TEST ................... 116

11. AUTO CALIBRATION ................... 119

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

TDD TDMA UART VCO VCTCXO WAP

2.2 Technical Specification

Description GSM, EGSM

Output RF Spectrum (due to modulation) GSM, EGSM

Max. dBc -19 -21 -21 -24

Max. dBc -19 -21

Bit Error Ratio

DCS, PCS BER (Class II) < 2.439% @-100 dBm

1,000 2,000 3,000 3,400 4,000

2 3 dB Frequency (Hz) 100 200 300 500

1,000 3,000 3,400 4,000

2 1 0 10 Battery Bar Number 0

Description Battery Indicator 3 4

Specification Battery Bar Number Voltage 3.76 ~ 3.89 V 3.90 V ~

Low Voltage Warning Forced shut down Voltage

Input: 100 ~ 240 V, 50/60 Hz Output: 5.2 V, 800 mA

Figure. 3-1 RECEIVER FUNCTIONAL BLOCK DIAGRAM

(1) Receiver Part

VC2 2.5 ~ 3.0 V 0V 0V 0V 0V 0V

VC1 2.5 ~ 3.0 V

Table 3-1 THE LOGIC AND CURRENT

Figure. 3-2 SI4205 RECEIVER PARTIAGRAM

B. Intermediate frequency (IF) and Demodulation

(2) Transmitter Part

Figure. 3-3 SI4205 TRANSMITTER PART

(3) Frequency Synthesizer

Figure. 3-4 SI4205 FREQUENCY SYNTHESIZER PART

3.2 Power Amplifier Module (RF3166, U501)

Figure. 3-5 Functional Block Diagram

3.3 13 MHz Clock (VCTCXO, X500)

Figure 3-6 VCTCXO CIRCUIT DIAGRAM

3.4 Power Supplies for RF Circuits (RF LDO, U502)

Supplier U502(VRF) U101(VVCXO) Battery(VBAT)

Voltage 2.85 V 2.75 V 3.4 ~ 4.2 V

Powers U500 X500 U501

enabled signal CLKON

Table 3-2 RF POWER SUPPLIERS

Figure 3-7 RF LDO CIRCUIT DIAGRAM

3.5 Digital Main Processor (AD6527B, U100)

Figure 3-8. SYSTEM INTERCONECTION OF AD6527B EXTERNAL INTERFACE

is an ADI designed processor.

3.5.1 Interconnection with external devices