FISCHERSCOPE X-RAY Product Line

X-Ray Fluorescence Spectrometers for

Coating Thickness Measurement and Material Analysis

Coating Thickness

Material Analysis

Microhardness

Material Testing

1953
1981
2

X-RAY Product Overview

Knowledge, Competency, Experience that you can rely on

Based on this principle, FISCHER has developed innovative measuring technology for coating thickness measurement, material analysis, micro-hardness
measurement and material testing since 1953. Today,
measuring technology from FISCHER is employed
around the world, where accuracy, precision and
quality is required.
The development of powerful X-ray fluorescence spectrometers began back in 1981, when this technology was still largely unknown in the manufacturing
industry. Very early, Fischer recognized the tremendous potential of this method for coating thickness
measurement and material analysis and started to
develop and manufacture industrial-strength measuring instruments.
The brand name FISCHERSCOPE X-RAY was born.

With innovative solutions and numerous patents,

FISCHER has shaped this technology with its reliable
products to what it is today an extremely powerful
and sophisticated method for coating and material
analysis. Today, after more than 10,000 X-ray spectrometers sold, the name FISCHERSCOPE X-RAY has
become synonymous with advanced X-ray fluorescence spectrometers.
Industry, research and science worldwide rely on the
reliability and accuracy of the equipment. FISCHER
rises to this challenge with consequent development,
modern equipment and innovative software. Only
what has been designed carefully and built perfectly
can ultimately function optimally.
And only then does it deserve the name FISCHER.
You can rely on that.

X-Ray Fluorescence

Energy Dispersive X-Ray Fluorescence Spectroscopy (EDXRF) is a measuring method for coating
thickness measurement and material analysis. It is
often used for the qualitative and quantitative determination of the elemental composition of a material
sample and for measuring coatings and coating systems. In industrial environments, this process is now
established and can be utilized optimally using modern equipment.

Au-LA

The EDXRF is a very universal method that offers

some outstanding advantages. For example, it is a
non-destructive method that can analyze even sensitive materials without adverse effects. Measurements
can be made quickly and usually without extensive
sample preparation. The method is particularly suited
for the analysis of unknown materials and compositions as well as for the measurement of coating thicknesses and systems. In addition, the method is able
to detect traces of harmful substances in materials
and finished products.
Moreover, the X-ray fluorescence analysis is a very
clean method, as no chemicals or environmentally
critical substances are used. Based on the design,
the used X-radiation cannot leave the device, which
makes the method an absolutely safe one for the
operator and the environment.

Au-LB

Cu-KA

Ag-KA

Ag-LA, LB, LG

Au-MA

Cu-KB

Au-LG
Ag-KB

X-RAY Product Overview

The Principle
X-ray fluorescence analysis is based on the fact that
the atoms in a material sample are excited by the
primary X-radiation. This removes electrons close to
the core from the inner shells of the atom.

The resultant vacancies are filled by electrons from

the outer shells. In the process, a fluorescence radiation is generated that is characteristic for each element. This fluorescence radiation is detected by the
detector and provides information on the elemental
composition of the sample.

Applications
Because the energy dispersive X-ray fluorescence
spectroscopy is capable of analyzing materials and
measuring thin coatings and coating systems, there
are a variety of applications for this technology.
For example, in the electronics and semiconductor
industries very thin gold coatings must be determined
on contacts, printed circuits or bond wires. In the
watch and jewelry industry and in refineries precise
knowledge about the composition of alloys is
required. When inspecting photoactive layers in the
photovoltaic industry or in quality control and incoming goods inspections exact compliance with material
specifications is important. In the electroplating industry when measuring the coating of mass-produced
parts. Or for trace analysis according to RoHS, e.g.,
in everyday objects and toys. FISCHERSCOPE X-RAY
Spectrometers are optimally suited for these tasks.

Advantages of the EDXRF method

Fast and non-destructive coating thickness
measurements
Analysis of solids, powders and liquids
Trace analysis of harmful substances according
to RoHS
No adverse effects on sensitive materials
High precision and trueness
Very broad range of applications
Little to no sample preparation
Safe method without environmentally hazardous
chemicals
Inexpensive because no consumables
Standard-free and calibrated analyses
Determination of sample homogeneity
Microanalysis of complex structures

COATING THICKNESS

MATERIAL ANALYSIS

FISCHERSCOPE X-RAY Spectrometer

X-ray tube

Measurement result

Primary filter
Shutter
Video camera

Aperture
(collimator)

Detector
Measurement spectrum

Sample

Principle

X-RAY Product Overview

It takes inventive ingenuity and continuous development to turn the scientific measurement principle of
X-ray fluorescence into robust and high-precision
measuring instruments that work reliably in both
laboratory and everyday industrial applications. At
FISCHER, we have committed ourselves to this task
with passion. This is reflected in the broad and varied FISCHERSCOPE X-RAY selection of instruments.

X-ray source
The X-radiation required for the X-ray fluorescence
analysis is generated using a special X-ray tube. In
this X-ray tube, a heated, glowing filament emits electrons, which are accelerated to a very high speed by
an applied high voltage field.

For example, spectrometers that measure bottom to

top are ideal for measuring mass-produced parts
quickly and easily.
On the other hand, if a specimen such as silicon
wafers should not come in contact with the measuring stage, then the correct choice is an instrument
that measures from top to bottom.
For automated measurements on wafer-thin bond
wires or individual pins of lead frames, an instrument
with an extremely small measurement spot and a precise programmable XY-stage is needed.
And for the rigorous demands of in-line measurements
in a running production line, an entirely different configuration is necessary.
To meet all these requirements, the building blocks
described here in principle are being used in different combinations. Perfectly matched to each other,
this provides the optimal FISCHERSCOPE X-RAY spectrometer for the respective purpose.

COATING THICKNESS

The primary X-radiation is created when these electrons strike the target material of the tube typically
tungsten or molybdenum. In order for this radiation
to be generated in a consistent and reliable manner, the X-ray tube of the FISCHER X-ray fluorescence
spectrometers is cooled and kept thermally stable.

MATERIAL ANALYSIS

Primary filter
Special filters are employed to optimize the energy
distribution of the primary X-radiation. These filters
suppress undesired portions of the radiation and thus
permit for an optimization of the sample excitation.
Depending on the instrument type, individual filters,
or fixed or removable multi-filters are used.

FISCHERSCOPE X-RAY Spectrometer

Shutter
The shutter is located in the beam path and is open
for the duration of the measurement. It is monitored
by the safety system and can be opened only when
the housing is closed such that there is no risk for the
operator.
Video camera
FISCHERSCOPE X-RAY spectrometers are equipped
with high-magnification camera systems to determine
the exact measurement location. This allows for precise positioning to take place on very small parts.
To achieve this without parallax, the camera looks
through a complex optical system along the primary X-ray beam exactly perpendicular to the sample.
Only then can one measure correctly what is seen.

Detector
The X-ray detector measures the energy distribution
of the X-ray fluorescence radiation that is radiated
back by the sample. Detector types that are optimal
for the respective purpose are available for different
applications.
t
1SPQPSUJPOBM
DPVOUFS
UVCF
Typically used for routine measurements of known
coating systems and alloys.
t
4JMJDPO
1*/
EFUFDUPS
1*/

Ideal for the analysis of unknown samples, e.g., in

the analysis of gold or in the incoming inspection.
t
4JMJDPO
ESJGU
EFUFDUPS
4%%


Ideal when a highly selective analysis of light
elements is required, e.g., in the analysis of
unknown samples and in trace analysis.

Aperture
Using the aperture (collimator), the cross-section
of the primary X-ray beam is restricted, thus creating a measurement spot with a defined size. In this
manner, size and shape of the X-ray beam can be
adjusted precisely for the respective measuring application using different apertures. Depending on the
spectrometer, individual apertures or exchangeable
multi-apertures are used.
For measurements on very small objects such as bond
wires, special X-ray optics with mirrors or polycapillaries replace the aperture. They allow for a very
small measurement spot and at the same time for
proper excitation intensity.

Spectrum
With its lines, the measured spectrum shows the characteristic element distribution of a sample. From this
spectrum, the FISCHER WinFTM Software computes
the desired parameters such as coating thickness or
element concentration.

X-RAY Product Overview

Software WinFTM
The entire operation, the evaluation of the measurement, as well as the clear presentation of the individual measured values is done using a PC with the
innovative and user-friendly Software WinFTM. All
FISCHERSCOPE X-RAY spectrometers operate with
this software.
Sample support and stages
Depending on whether simply a sample shall be
placed and measured quickly or complex components shall be measured automatically, based on the
application, FISCHERSCOPE X-RAY spectrometers are
equipped with a simple, plane probe support, a manually operable XY-stage or a high-precision, programmable XY-stage.
Positioning aids
Simple and fast sample positioning saves time and
money. For this reason, all units with an XY-stage
feature a laser pointer as a positioning aid, which
simplifies the quick localization of the measurement
location. Stops, rulers and sample supports additionally facilitate the placement of specimens.
Housing
The respective instruments for measuring large, flat
components, e.g., printed circuit boards, feature a
slot on the side such that these parts can be measured with the hood closed.

As the first institution in Germany, FISCHER has

been admitted and accredited as a DKD Calibration
Laboratory for the measurand "mass per unit area"
according to DIN EN ISO/IEC 17025.
This accreditation entitles FISCHER to issue Calibration Certificates in the name of the German Accreditation Service (DKD/DAkkS) for mass per unit area
calibration standards that are used for calibrating
X-ray fluorescence instruments for coating thickness
measurements.
Safety
FISCHERSCOPE X-RAY X-ray fluorescence spectrometers are designed such that neither operators nor
the environment are at risk. The design ensures that
the X-radiation is restricted to certain areas inside the
instrument. Solid materials and metal housings make
sure that no harmful radiation can escape to the
outside. Extensive security features ensure that any
X-radiation is stopped immediately when the device
is opened.

COATING THICKNESS

MATERIAL ANALYSIS

All FISCHERSCOPE X-RAY instruments are developed

according to the most recent standards and are tested in accordance with the German X-ray ordinance.

Calibration standards
High-quality calibration standards are the basis for
accurate measurements. For this reason, FISCHER
operates its own calibration lab and creates its own,
traceable calibration standards to the highest quality
standards.

WinFTM Software

But WinFTM is more. It is also the command center

for user-friendly operation of the FISCHERSCOPE
X-RAY spectrometer as well as its optimal utilization.
This is utilized not only in the laboratory but also in
daily industrial work.
User-friendly
Easy and intuitive operation of a complex instrument
is the key to optimal results. For this reason, FISCHER
designed the WinFTM Software such that one can
start without extensive training. It is based on the wellknown WindowsTM standard. Graphic controls and
a context-sensitive guidance make work easy. All
functions are easily accessible and displayed only if
they are actually needed. This ensures that the screen
is always clear and reduced to the essentials.

Every X-ray fluorescence spectrometer requires powerful software to become a true measuring instrument. Thus, the power of the FISCHERSCOPE X-RAY
can only truly unfold and provide optimal analysis
results with the innovative WinFTM Software.

Multi-functional
From applications in the electroplating industry, such
as zinc on iron, to bath analyses and sophisticated
trace analyses according to RoHS, one software is
sufficient for all measuring applications: WinFTM.

For this reason, the WinFTM Software is the mathematical heart of all FISCHERSCOPE X-RAY spectrometers. Because of it, the information regarding material
composition, coating thickness and coating structure
is obtained from the X-ray spectrum. FISCHER leads
in this regard and implements in WinFTM innovative algorithms and methods that make this software
unique.

10

X-RAY Product Overview

WinFTM employs the fundamental parameter method

in a more advanced form in order to determine the
material composition and coating thickness with one
single measurement. Thus, up to 24 properties for
example coating thickness, concentration, elements
can be determined simultaneously with one measurement. Even complex coating systems as well as solid
and liquid samples can be analyzed either calibrated
or standard-free.
Adaptable
Whether in the incoming inspection, in quality control in manufacturing, or in the material testing laboratory in governmental institutions, the requirements
for the operation of the WinFTM are as diverse as
the range of uses of the instruments.
For this reason, the WinFTM interface can be adapted to these diverse needs. From complete access to
all functions to the functionality reduced to a minimum for pass/fail tests.
Calibrating
Quality standards require that the measuring equipment can be calibrated based on calibration standards that are traceable to international or national
calibration standards. Thus, each measurement application of the FISCHERSCOPE X-RAY spectrometers
can be calibrated. The WinFTM Software stores and
manages all calibration data. In this manner, each
calibration can be documented and proven conveniently.

Error calculation / Calculation of uncertainty

The WinFTM Software provides a complete error
computation. The entire measurement uncertainty of a
reading can be computed by considering the uncertainty of the standards, of the calibration procedure
and of the measurement itself. True traceability of a
reading is possible by taking into account this measurement uncertainty.
Easy sample placement
To make reliable measurements on even the smallest
locations, WinFTM shows the measurement location
on the sample greatly magnified in a separate video
window. A superimposed scaled crosshairs that
adapts automatically to the respective image magnification shows the real size and position of the measurement spot on the surface of the sample.
The special autofocus function allows for easy accurate and reproducible optical focusing. A laser pointer acts as a positioning aid to quickly define the
measurement location.

COATING THICKNESS

MATERIAL ANALYSIS

DCM Distance Controlled Method

To measure on geometrically irregular parts or in
indentations, FISCHERSCOPE X-RAY spectrometers are
equipped with a special feature for a distance-based
measurement correction, the DCM Method. This feature also allows for automated testing of complex surface shapes and for measurements in indentations.
With this method, WinFTM automatically takes the
measuring distance into account when computing the
coating thickness value in a certain area.

11

WinFTM Software

Automated Measurements
Recurring measuring applications can be automated easily. This greatly simplifies even very complex measurement sequences. For example, when
using instruments with a programmable XY-measuring stage, numerous measurement spots can be
defined on one sample and can be measured in
an automated fashion. Also complex test plans with
instructions for the operator, e.g., for quality control
in manufacturing, can be created quickly using
WinFTM.
Moreover, the WinFTM Software can recognize regular structures via image processing and can track
deviations in automated measurements. For specimens
with shape tolerances, this can ensure that measurements are always made at the correct location.
Substrate Material Recognition
In certain applications, WinFTM can analyze the substrate material automatically. This eliminates the need
for normalization when making measurements on
different materials. In addition, the reliability of the
measurement results is increased because the coating
thickness is measured correctly even with fluctuating
compositions of the substrate material.
Classes of Materials (COM)
Using the COM function, unknown samples can be
assigned automatically to a material class. These
classes can characterize different types of materials,
e.g., different metals or can distinguish the same

12

materials using certain coating thickness or concentration ranges e.g., gold alloys of high, medium
or low gold content. Unique to WinFTM is that the
materials spectra necessary for defining the classes
are computed theoretically. This eliminates the timeconsuming calibration using many material samples,
and the system can be adapted or expanded to the
specific needs of the customer.
If samples of unknown or different material compositions and coating thicknesses are to be measured,
WinFTM can automatically select the appropriate
application and use it for the measurement.
Example gold analysis: First, WinFTM determines
the alloy and then selects the appropriate measuring
application in order to determine the gold content
with high precision.
Multiple Excitation
The excitation parameters high voltage and primary
filters are selected for each application such that the
best possible results can be achieved. For some applications, it may be necessary to work with different
excitations to measure all the parameters optimally.
In the WinFTM Software, it is possible to use several
excitations for one product. In this manner, the user
can measure all parameters under the best conditions
and receive the results presented in one combined
evaluation.
Reliable
Nothing is worse than to measure incorrectly unwittingly. For this reason, the WinFTM Software can
check if the selected measuring application matches
the sample being measured and can warn the operator in case of deviations. Automatically running
long-term tests monitor the instrument and ensure a
long-term stability.

X-RAY Product Overview

Statistics Functions
Integrated statistics functions of WinFTM compute
from the measurement results the mean value, the
standard deviation and the coefficient of variation
and display these values immediately following the
measurement. The measurement results can be displayed individually, in a list or as an SPC chart and
can be documented.

Documenting Measurement Results

The integrated report generator allows for the generation of individual result reports and the creation of
custom templates. For example, the contents of the
protocol can be specified freely: A photo of the sample with measurement spots, the measurement results,
characteristic statistical values, histogram, probability
chart, etc.
Furthermore, at the push of a button WinFTM computes histograms, probability charts, statistical process
control charts (SPC), cp and cpk values as well as the
measurement uncertainty with random and systematic
portions. Measurement results and the statistical characteristics computed from them can be exported and
evaluated by using quality management systems.

COATING THICKNESS

MATERIAL ANALYSIS

WinFTM Features
Universal Software
Coating thickness measurement and analysis
One package with all functions
User-friendly intuitive operation
Designable user interface
Fundamental Parameter Method
Class of Materials Method
Automated Measurements
Multiple Excitation
Video image with zoom and crosshairs
Automatic material recognition
Substrate material recognition
DCM Distance Controlled Method
Statistics functions
Report generator
Documentation of calibration and settings

13

X-RAY Instruments at One Glance

Product Family

Best for
Coatings

BOTTOM-UP
MEASUREMENT

TOP DOWN
MEASUREMENT

PROCESS

14

Universal

Appli
Analysis

Best

XAN
Gold

Jewellery
Gold
Alloys

XAN

Analytics

XUL

Electroplating

XULM

PCB
Small structures
Connectors

XDL

Electroplating

XDLM

PCB
Small structures
Connectors

XDAL

Analytics
High Reliability

XDV-SDD

RoHS
Traces-analytics
Thin Coatings

XDV-

Coatings
Tiny Parts
Wafers

XUV
Vacuum

Light elements
analytics

Process
4000

Strip
electroplating

Process
5000

PV industry
CIGS, CIS

X-RAY Product Overview

cation

X-Ray Technology
Also

Coatings

Handling

Tube

Detector

Filters

Aperture

Probe
placing

Standard

PC
PIN

None

Place and
shot

Micro

PIN
SDD

3/6

Place and
shot

Standard

PC

None

Place and
shot

Place and
shot

COATING THICKNESS

Electroplating

Micro

PC

MATERIAL ANALYSIS

Standard

PC

None

XYZ

Electroplating

Micro

PC

XYZ

Coatings

Micro

PIN

XYZ

PCB

Micro

SDD

XYZ

Micro

PC
PIN

1/4

Polycapillaries
or
Mirror optics

XYZ

Traces-analytics

Micro

SDD

XYZ

Bulk parts
Contacts

Standard
or
Micro

PC
PIN
SDD

Customized

Customized

Process

Strip
electroplating

Standard
or
Micro

PC
PIN
SDD

Customized

Customized

Process

15

FISCHERSCOPE X-RAY XAN

BOTTOM-UP
MEASUREMENT

16

The spectrometers of the FISCHERSCOPE X-RAY XAN

family are universal X-ray fluorescence spectrometers
for material analysis and coating thickness measurements. In their various configurations, they cover a
wide range of applications. Focus of the applications
is a fast and precise material analysis with user-friendly
handling such as the analysis of precious metal and

gold alloys. The instruments also have their place in the

analysis of thin coatings in the electronics and printedcircuit-board industries. With modern detectors and fast
digital signal processing, they deliver optimum analysis
results with short measuring times.

X-RAY Product Overview

With these instruments, the X-ray source and the

detector are located underneath the measurement
chamber. This allows for fast and easy positioning of
the specimens. A high-resolution video camera simplifies this further by displaying the measurement location with high magnification and the measurement
spot shown on the screen.

The XAN spectrometers are ideal for fast, repetitive

measurements due to easy accessibility and simple
sample placement. The wide-opening hood facilitates
fast positioning and large controls simplify handling,
which is especially helpful and saves time and money
when measuring many parts.

In addition to the instruments of the XAN family, which are designed for the analysis of the
most diverse, even unknown samples, this line also
includes special versions oriented on the requirements of the jewelry industry and the gold trade.
Their hardware and software are designed for the
requirements of these industries and they offer a
practically unbeatable price-performance ratio.

Features
Universal spectrometer for material analysis
and coating thickness measurement
State-of-the-art detectors PC/PIN/SDD
Digital signal processing
Fast, simple operation and measurement
For flat and easy to place parts
Easy-access measurement chamber
Compact design, large controls
Operator support through video image
Special versions for gold and jewelry
and precious metals

COATING THICKNESS

MATERIAL ANALYSIS

Typical fields of application

Analysis of unknown materials
Gold and precious metal analysis
Jewelry and watch industries
Measurement of thin coatings on printed-circuitboards and in the electronics industry
Quality assurance and production monitoring
Trace analysis RoHS

17

FISCHERSCOPE X-RAY XUL/ XULM

BOTTOM-UP
MEASUREMENT

18

The instruments of the FISCHERSCOPE X-RAY XUL

and XULM series are universal X-ray fluorescence
spectrometers for coating thickness measurement and
material analysis. They are ideal for fast, repetitive
measurements in quality assurance and production
control due to easy accessibility and simple sample
placement. The wide-opening hood with a large
viewing window facilitates fast positioning, and large
controls simplify handling, which is especially helpful and saves time and money when measuring many
parts in the daily production.

With these instruments, the X-ray source and the

detector are located underneath the measurement
chamber. This allows for fast and easy positioning
and measurement of the specimens. A high-resolution
video camera simplifies this further by displaying the
measurement location with high magnification and
the measurement spot shown on the screen.
The XUL and XULM instruments are equipped with
proportional counter tube detectors and achieve a
high repeatability precision even with short measuring times.

X-RAY Product Overview

Despite their compact dimensions, these X-ray fluorescence spectrometers feature a large-volume measurement chamber, so that even larger parts can be measured. An opening in the housing allows for measurements on large, flat samples such as printed-circuitboards that would otherwise not fit in the measurement space. The sample can be placed either on the
flat support or on an optionally available XY-stage
for even more precise sample orientation.

The XULM series is based on the XUL family and

shares with it the housing and the entire mechanical
design. With the XULM, the X-ray source is a micro
focus tube that offers particular advantages on small
structures. Additionally, the XULM instruments feature
electrically interchangeable apertures and filters to
create flexible optimum excitation conditions for different measuring applications.
Thus XULM spectrometers are very well suited for
measurements on delicate parts such as connector
contacts and wires as well as for the analysis of galvanic coatings on printed circuit boards. The XULM
is also used in the watch and jewelry industry, where
small parts must be controlled very precisely.
COATING THICKNESS

The XUL series is universal and is therefore well

suited for the measurement of mass-produced parts
such as screws, bolts or nuts, as well as for various
electronics components. The determination of the
metal content of electroplating baths can be performed quickly and easily.

Features
XUL: Precise measurements with high count
rates on larger parts
XULM: Very good measurement results even
on smaller structures
Proportional counter tube detector
For flat and easy to place parts
Fast measurement
Large easy-access measurement chamber
Compact design, large controls
Operator support through video image

MATERIAL ANALYSIS

Typical fields of application

Quality assurance and production monitoring
Galvanized mass-produced parts, e.g.,
screws, nuts, etc.
Coatings on plugs and connectors
Measurements on smaller parts and PCBs
Galvanic corrosion protection
Jewelry and watch industries
Printed-circuit-board manufacturing

19

FISCHERSCOPE X-RAY XDL/XDLM

TOP DOWN
MEASUREMENT

The FISCHERSCOPE X-RAY XDL and XDLM series are

particularly well suited for non-destructive coating thickness measurements and material analysis, for measurements on mass-produced parts and printed-circuitboards as well as for the bath analysis.
Both the XDL as well as the XDLM series uses a proportional counter tube as their detector, which achieves
good count rates due to its large detector surface and
thus achieves a high repeatability precision.

20

The XDL series is equipped with an X-ray tube and an

aperture that are suited for measurements on larger
parts. Typical applications for the XDL spectrometers
are measurements of electroplated coatings on massproduced parts as well as functional coatings in the
electronics and semiconductor industries. XDL instruments can also measure corrosion protection coatings
and decorative coatings such as chrome on nickel/
copper quickly and precisely.

X-RAY Product Overview

With the XDLM spectrometers, the X-ray source is a

micro focus tube that offers particular advantages
with small structures and low material concentrations.
Additionally, the XDLM instruments feature electrically
interchangeable apertures and filters to create flexible optimum excitation conditions for different measuring applications.

testing. The user-friendly operation and ergonomic

design facilitate your daily work with the XDL spectrometers. For this reason, the precise definition of
the measurement location is facilitated by a high-resolution color video camera with high magnification
and the current measurement process is shown in the
video image.
A laser pointer acting as a positioning aid supports
the quick orientation of the samples to be measured
in the models that feature an XY-stage. For large, flat
samples such as PCBs, the housing has openings on
the side. The wide-opening hood and the large control facilitate fast positioning and measuring, which
is especially helpful in the daily production or when
measuring many parts.
COATING THICKNESS

Typical applications for the XDLM spectrometers are

measurements of fine structures, e.g., of printed-circuit-boards, connectors and electronic components
or the measurement of thin gold, palladium or nickel
coatings on printed-circuit- boards. Due to their design
and user-friendly operation, these instruments are
ideally suited for quality assurance, incoming inspection and production monitoring. However, these
spectrometers are also used in laboratories and in
research and development.

Features
Precise measurements with high count rates,
proportional counter tube detector
XDLM: Precise measurements even on small
structures and on small parts
Models with flat supports, XY-stages and
movable Z-axis
Ergonomic design and large control element
Operator support through video image and
laser pointer

The FISCHERSCOPE X-RAY XDL/XDLM spectrometers

are designed as user-friendly desktop units with a
modular structure. Thanks to this design, they can be
equipped with a simple support, various XY-stages
and Z-axes to accommodate different requirements.

Typical fields of application

Quality assurance and production monitoring
Measurements of mass-produced electroplated
parts
Inspection of thin coatings
Analysis of functional coatings
Automated measurement
Bath analysis in the electroplating industry
Electroplating
Gold, jewelry and watch industries
Printed-circuit-board manufacturing
Connectors and contacts

With the easily accessible measurement chamber,

they are suitable for measurements on flat, plane
parts as well as for larger specimens with complex
shapes. In the design with a programmable XY-stage,
the XDL series can be used for automated series

MATERIAL ANALYSIS

21

FISCHERSCOPE X-RAY XDAL

TOP DOWN
MEASUREMENT

22

The FISCHERSCOPE X-RAY XDAL is the universal spectrometer in the XDL series. It is the right tool for the
fast, non-destructive material and coating analysis with
a small measurement locations and/or thin coatings.
This makes it ideal to examine unknown materials, such
as in the incoming inspection or for material analysis.
It also finds a permanent place in the laboratory, in
quality assurance as well as in research and development.

The X-ray source is a micro focus tube that offers a high

excitation of the material sample even with a small
measurement spot. With the XDAL, apertures and filters
can be changed with a click of the mouse via the operating software in order to create the optimum excitation
conditions for different measuring applications.
For a high resolution combined with a short measuring time, a Peltier-cooled silicon PIN detector is used.
With it, elements from aluminum to uranium can be
detected even with very low material concentrations
and very thin coatings.

X-RAY Product Overview

The FISCHERSCOPE X-RAY XDAL has a voluminous

measurement chamber and is easy to use. For large,
flat samples such as PCBs, the housing has openings
on the side. But the instrument is also suitable for
large specimens with complex shapes. For this purpose, it is equipped with a motorized Z-axis that can
be adjusted by 140 mm.

With the fast, programmable XY-stage, surfaces can

be examined easily in the mapping mode. Also, serial measurements of components, e.g., lead frames,
or the measurement of several, even different components can be programmed and executed automatically with ease.

Features
Universal, non-destructive element analysis
Ideal for small structures and thin coatings
Very good analysis results even with low
element concentrations
Silicon PIN detector
Large easy-access measurement chamber
Quickly programmable XY-stage and moveable
Z-axis
Operator support through video image
and laser pointer
The wide-opening hood allows for easy access to the
measurement chamber. Because the XY-stage travels
automatically to the loading position when the hood
is opened, quickly placing the sample is extremely
easy. A laser pointer shows the exact measuring position on the specimen.
A high-resolution and high-magnification color video
camera with auto-focus zooms at the measuring spot
with a magnification of up to 180x and thus enables
the precise definition of the measurement spot.

Typical fields of application

Incoming inspection, quality assurance and
production monitoring
Research and development
Electronics industry
Gold, jewelry and watch industries
Printed-circuit-board manufacturing
Measurement of unknown materials
Trace analysis, e.g., lead (Pb) with a high
reliability
Inspection of thin coatings, even at low
concentrations
Analysis of hard material coatings
Automated measurements in mapping or
array mode

COATING THICKNESS

MATERIAL ANALYSIS

23

FISCHERSCOPE X-RAY XDV-SDD

TOP DOWN
MEASUREMENT

The FISCHERSCOPE X-RAY XDV-SDD is the universally useable energy dispersive X-ray spectrometer for
precise trace analysis and for non-destructive measurements and analyses of very thin coatings. This
spectrometer achieves high count rates and deep
detection limits due to high excitation intensity.
The universal design with changeable filters and
apertures makes this instrument ideal, even if coatings of only a few nanometers are to be measured
or the smallest concentrations in materials are to be
determined precisely.
For example, in the photovoltaic industry, where the
accurate maintenance of the coating composition
and structure determines the efficiency of thin film

24

cells, the XDV-SDD can be utilized to its full potential.

Whether sputtered on glass or plastic, on copper
or precious metal, the analysis will succeed with the
XDV-SDD.
But also in the printed-circuit-board, semiconductor
and electronics industries, where modern technologies, rising commodity prices and cost pressure lead
to ever thinner and more complex layers, the XDVSDD aids in pushing the boundaries of what is possible and to inspect it reliably.
In trace analysis and the search for hazardous materials, whether in the consumer sector or in electronics
manufacturing, according to RoHS, WEEE, or other
requirements, the XDV-SDD analyzes even low concentration levels reliably and precisely.

X-RAY Product Overview

In order to create ideal excitation conditions with

maximum intensity for every measurement, the XDVSDD features electrically interchangeable apertures
and primary filters. Using a modern silicon drift
detector, high count rates are achieved for a high
accuracy of the analysis with very low detection limits. The latest SDD detectors with ultra-thin beryllium
windows also allow for the analysis of elements such
as phosphorus or aluminum in air.

The performance capabilities and the universal

design make the XDV-SDD ideal for research and
development, process qualifying and laboratories. It
also has a permanent place in quality assurance and
in production monitoring due to its design and the
user-friendliness.

Features
Universal for analysis and trace detection
Lowest detection limits
Powerful silicon drift detector and digital signal
processing for high resolution
Precise measurements of low concentrations
Analysis of thin and very thin coatings
Determination of complex multi-coating systems
Ergonomic design and large control elements
Operator support through video image and
laser pointer
Automated measurements, array measurements

COATING THICKNESS

MATERIAL ANALYSIS

With the large and easily accessible measurement

chamber, the XDV-SDD is suitable for measurements
on flat, plane parts as well as for larger specimens
with complex shapes. Serial tests or array measurements can be realized in a simple manner with the
fast, programmable XY-stage.
User-friendly operation, a wide-opening hood and the
control element on the front of the instrument make
daily work easy with this instrument.
The precise definition of the measurement location is
facilitated by a high-resolution color video camera
with high magnification and the current measurement
process is shown in the video image. A laser pointer
acting as a positioning aid additionally supports the
quick orientation of the samples to be measured.

Typical fields of application

Analysis of unknown materials and low
concentrations
Inspection of thin coatings, even at low
concentrations
Trace analysis according to RoHS and
WEEE requirements
Electronics and semiconductor industries
Photovoltaic industries
Gold and precious metal analysis with
highest precision
Research, development, quality assurance
Process qualification and production monitoring

25

FISCHERSCOPE X-RAY XDV-

TOP DOWN
MEASUREMENT

26

The spectrometers of the FISCHERSCOPE X-RAY XDV-

series are designed for the highest demands in coating thickness measurement and material analysis in
the micro-range. The innovative X-ray optics such as
polycapillaries and X-ray mirror optics allows them to
measure on very small components and structures with
the smallest of measurement spots, yet with high excitation intensity. In order to create ideal excitation conditions for every measurement, the XDV- series features
electrically interchangeable primary filters.

The spectrometers of the XDV- family are, therefore,

ideal for the semiconductor and electronics industries,
where there is a need to measure micro-structures on
wafers, components or printed-circuit-boards. Typical
fields of applications are, for example, analyses on
thin bond wires or on contact locations of semiconductor chips. In addition the coating analysis on very
small connectors or the measurement of thin gold/
palladium/nickel coatings on PCBs is the domain of
the XDV- series.

X-RAY Product Overview

With the large and easily accessible measurement

chamber, the XDV- spectrometers are well suited
for measurements on flat, plane parts as well as for
specimens with complex shapes. For large, flat samples such as printed-circuit-board, the housing has
openings on the side. Serial tests or array measurements can be realized in a simple manner with the
fast, programmable XY-stage.

The performance capabilities and the specialization

on the smallest structures the XDV- spectrometers are
ideal for research and development, process qualifying and for laboratories. They also have a permanent
place in quality assurance and in production monitoring.

Features
Coating thickness measurement and materials
analysis on the smallest of components and
structures
Polycapillaries or X-ray mirrors for high
excitation intensities
High detection sensitivity
Proportional counter tube or semiconductor
detector
Measurements of thin coatings on small
components
Determination of complex multi-coating systems
Ergonomic design and large control elements
Operator support through video image and
laser pointer
Automated measurements, array measurements

User-friendly operation, a wide-opening hood with

a large viewing window and a control element on
the front of the instrument make daily work easy with
these instruments.
The precise definition of the measurement location is
facilitated by a high-resolution color video camera
with extremely high magnification. Even the thinnest
bond wires or small contact points are displayed
razor-sharp and the measurement spot appears
exactly at the target position. A laser pointer acting
as a positioning aid additionally supports easy orientation of the samples to be measured.

COATING THICKNESS

MATERIAL ANALYSIS

Typical fields of application

Measurements on connectors, contacts,
lead frames, printed-circuit-boards
Semiconductors and wafers
Bond wires and bond spots
Measurement of Au/Pd/Ni/Cu coatings
Electronics and semiconductor industries
Research, development, quality assurance
Process qualification and production monitoring

27

FISCHERSCOPE X-RAY XUV

TOP DOWN
MEASUREMENT

28

The FISCHERSCOPE X-RAY XUV is a universal X-ray

spectrometer for non-destructive coating thickness
measurements and material analysis. It is particularly
well suited for the analysis of very thin coatings, traces
and light elements. It is equipped with a large measurement chamber for measuring larger samples under
vacuum; thus, the chamber can be evacuated or flushed
with helium for better detectability of light elements. Elements in the range from sodium (11) to uranium (92)
can thus be detected.

With interchangeable apertures and primary filters, the

XUV is equipped to create the ideal excitation conditions for any type of measurement. A modern silicon
drift detector with a high energy resolution ensures a
high accuracy of the analysis as well as very good
detection sensitivity even with short measuring times.

X-RAY Product Overview

The FISCHERSCOPE X-RAY XUV is universally suitable for both coating thickness measurements and
materials analysis. Typical areas of application are
the analysis of functional coatings in the electronics
and semiconductor industries such as the thinnest
gold/palladium/nickel coatings. In the photovoltaic
industry, photo-active coating systems such as CiGS
or CdTe can be analyzed together with their base
coat and top coat on various carrier materials.

with complex shapes. Serial tests or array measurements can be obtained with it, in a simple fashion,
as well.

Another important application is the analysis of gemstones in order to determine origin and genuineness.
The XUV is also well suited for general analyses due
to its universal approach.

Due to the universal design and the expanded measurement capabilities through the vacuum chamber,
the FISCHERSCOPE X-RAY XUV spectrometer is the
ideal instrument for research and development but in
addition to process qualifying and laboratory applications.

With its large and wide-opening measurement chamber and the big travel range of the programmable
XYZ-stage, this spectrometer is well suited for measurements on flat, plane parts as well as for specimens

The precise definition of the measurement location is

facilitated by a high-resolution color video camera
with high magnification. A laser pointer acting as a
positioning aid additionally supports the quick orientation of the samples to be measured.

COATING THICKNESS

Features
Coating thickness measurement and analysis
even for light elements
Measurements in air, vacuum or under helium
High resolution and detection sensitivity
Silicon drift detector
Determination of complex multi-coating systems
Operator support through video image and
laser pointer
Automated measurements, array measurements

MATERIAL ANALYSIS

Typical fields of application

Analysis of thin coatings, traces and
light elements
General material analysis and forensics
Non-destructive gemstone analysis
Analysis of Au/Pd/Ni/Cu coatings
Electronics and semiconductor industries
Photovoltaic industry
Research and development, process
qualification

29

FISCHERSCOPE X-RAY 4000

PROCESS

30

With the FISCHERSCOPE X-RAY inline spectrometers,

FISCHER created a product line for continuous measurements during industrial production. These high-precision X-ray fluorescence spectrometers are designed
specifically for the high demands of industrial environments. They are particularly robust while at the
same time very precise. For this product line, a particular focus was placed on exceptional reliability
and serviceability.

The FISCHERSCOPE X-RAY 4000 instruments are

inline X-ray fluorescence spectrometers for non-destructive coating thickness measurements and material analyses during the production process. They are
particularly well suited for measuring thin coatings in
continuous processes on mass-produced or stamped
parts, strips and foils. Typical applications include
roll-to-roll strip electroplating or selective coating.
Both solid and already stamped strip can be measured.

X-RAY Product Overview

The X-RAY 4000 instruments include a travel device

that can position the measuring head exactly at various locations. Thus, measurements can be made on
a passing strip at various positions or the measuring
head can track the strip with excellent positioning
accuracy.

As a true inline measuring instrument, the FISCHERSCOPE X-RAY 4000 is designed for user-friendliness
and minimal setup times. For example, quick conversions between various productions are possible due to
the easily adjustable strip guides. Calibration is also
automated and thus carried out quickly and easily.

FISCHERSCOPE X-RAY 4000 spectrometers can be

customized to optimally meet the respective production requirements. Whether measurements are
to be made on the top side, the bottom side or on
both sides of a strip, the modular structure allows for
any of these options. Temperature-controlled measuring heads are used when measurements are to be
made on hot surfaces such as hot-galvanized strip.
And depending on the need, the entire unit can be
installed horizontally or vertically.

The data interface according to industry standards

allows for an easy integration in quality management
systems or controls. The production process can also
be measured directly at the measurement location
thus directly signaling the violation of specification
limits.

Features
Coating thickness measurements in the running
production process
Determination of complex multi-coating systems
Measurements on top, bottom or both sides
Positioning device, measurements at several
positions
Large measurement spot for integral
measurements
Small measurement spot for fine structures
Customer-specific layout
Automated calibration
Continuous operation, low maintenance
Integration in QMS and controls

COATING THICKNESS

MATERIAL ANALYSIS

Typical fields of application

Strip electroplating, e.g., contacts, stamped
components
Measurement on hot-galvanized strip
Photovoltaic industry
Strip, stamped components and foils
Electronics industry, suppliers
Process monitoring

31

FISCHERSCOPE X-RAY 5000

PROCESS

32

The FISCHERSCOPE X-RAY 5000 series is specifically

designed as a flange measuring head for integration into a production line. It is ideally suited for continuous, non-destructive inline analyses of alloys and
the measurement of the thinnest coatings and coating
systems directly during the production process. The
FISCHERSCOPE X-RAY 5000 instruments determine,
for example in the solar industry, the thickness and the
composition of CIGS, CIS, or CdTe coatings on different substrate materials such as glass, metal or plastic.
Roll-to-roll strip electroplating is another continuous
process for which the X-RAY 5000 spectrometer is
well suited.

The X-RAY 5000 can be customized for optimization

to the respective requirement. Both X-ray source and
semiconductor detector can be adapted optimally to
the respective application. They are placed such that
they can measure precisely at measuring distances
from 20 mm to 150 mm, depending on the application.
They are even capable of compensating for distance
fluctuations, e.g., due to wavy specimens, during the
running measurement.

X-RAY Product Overview

Using the powerful semiconductor detectors, elements

can be determined reliably in a range from sodium
(11) to uranium (92). The calibration is done with a
work piece master very quickly and easily directly in
the production process. The repeatability precision
of the X-RAY 5000 instruments is excellent due to the
large apertures, state-of-the-art semiconductor detectors and the digital pulse processors. The need for
re-calibration is also reduced drastically, which saves
time and expenditures.
These robust spectrometers measure in vacuum or
in ambient air. Even measurements on very hot substrate materials with surface temperatures up to
500C are possible without a problem.

The FISCHERSCOPE X-RAY 5000 measuring head

has a very compact design and can be integrated
directly in production lines using a standardized
flange. The entire mechanical design is focused on
maximum robustness and serviceability. For example,
the spectrometer can be serviced during operation at
a production line under vacuum, without the need to
remove the vacuum.
To integrate the X-RAY 5000 spectrometers into a
superordinate process control system, open interfaces
according to industry standards, e.g., OPC are available.

Feature
Coating thickness measurements and analyses
in the running production process
Very simple calibration
Measurements in ambient air or vacuum
Measurement also on very hot substrate
materials up to 500C
Semiconductor detector
Determination of complex multi-coating systems
Continuous operation, low maintenance

COATING THICKNESS

MATERIAL ANALYSIS

Typical fields of application

Photovoltaic, CIGS, CIS, CdTe analysis
Analysis of thin coatings
Continuous production
Process monitoring
Area measurement

33

Fischer worldwide

Those who wish to be successful in a global world

must know the requirements and desires of their customers. We see ourselves as partners of our customers
and, therefore, place great emphasis on excellent consultation and close cooperation. For this reason, the
Helmut Fischer Group is present worldwide with independent companies and qualified distributor partners
close to you.

SERVICE

34

Conforming to our high standards of quality and customer satisfaction, all members of the Helmut Fischer
Group are certified according to DIN EN ISO 9001.

Service
Superior service and efficient support of our customers
are just as important to us as technically advanced
and innovative products. Thus, FISCHER has a tight
and well-established world-wide applications and service network with a highly qualified staff. Extensive
services such as setup, maintenance, training, calibration and... and... and .., we support you in all aspects
concerning your instruments and their uses. In this
manner, we ensure that the reliability and precision
of FISCHER products are retained. Worldwide.

X-RAY Product Overview

Training and seminars

We want our customers to benefit most from our products. Thus, we are happy to share our application
know-how by offering seminars and training sessions
on topics such as measurement basics and the optimal use of the instruments as well as expert symposia
regarding special topics.
35

Helmut Fischer GmbH

Institut fr Elektronik und Messtechnik
71069 Sindelfingen, Germany
Tel. +49 70 31 30 30
mail@helmut-fischer.de

Fischer Instrumentation Electronique

78180 Montigny le Bretonneux, France
Tel. +33 1 30 58 00 58
france@helmutfischer.com
Helmut Fischer S.R.L.
Tecnica di Misura, 20128 Milano, Italy
Tel. +39 0 22 55 26 26
italy@helmutfischer.com

Fischer Instrumentation (GB) Ltd

Lymington / Hampshire SO41 8JD, England
Tel. +44 15 90 68 41 00
mail@fischergb.co.uk

photos iStockphoto.com/schergermany

Fischer worldwide

Fischer Instruments, S.A.

08018 Barcelona, Spain
Tel. +34 9 33 09 79 16
spain@helmutfischer.com

Fischer Technology, Inc.

Windsor, CT 06095, USA
Tel. +1 860 683 07 81
info@fischer-technology.com

Helmut Fischer Meettechniek B.V.

5627 GB Eindhoven, The Netherlands
Tel. +31 40 248 22 55
netherlands@helmutfischer.com

Helmut Fischer AG
CH-6331 Hnenberg, Switzerland
Tel. +41 41 785 08 00
switzerland@helmutfischer.com

Fischer Instruments K.K.

Saitama-ken 340-0012, Japan
Tel. +81 4 89 29 34 55
japan@helmutfischer.com
Fischer Instrumentation (Far East) Ltd
Kwai Chung, N.T., Hong Kong
Tel. +852 24 20 11 00
hongkong@helmutfischer.com

www.helmut-fischer.com

Coating Thickness

Material Analysis

Microhardness

Material Testing

10/10

Fischer Measurement Technologies (India) Pvt. Ltd

Pune 411036, India
Tel. + 91 20 26 82 20 65
india@helmutfischer.com

952-008

Nantong Fischer Instrumentation Ltd

Shanghai 200333, P.R. China
Tel. +86 21 32 51 31 31
china@helmutfischer.com

10-10

Fischer Instrumentation (S) Pte Ltd

Singapore 118529, Singapore
Tel. +65 62 76 67 76
singapore@helmutfischer.com