STN1110

Multiprotocol OBD to UART Interpreter

Datasheet

STN1110

Table of Contents
Overview ......................................................................................................................................................... 3
1.0
2.0
Feature Highlights ......................................................................................................................................... 3
3.0
Typical Applications ...................................................................................................................................... 3
4.0
Pinout .............................................................................................................................................................. 4
4.1
Pinout Summary .......................................................................................................................................... 5
4.2
Detailed Pin Descriptions ............................................................................................................................ 6
5.0
Guidelines for Getting Started with STN1110 ............................................................................................. 8
5.1
Basic Connection Requirements ................................................................................................................. 8
5.2
Decoupling Capacitors ................................................................................................................................ 8
5.2.1 Tank Capacitors ...................................................................................................................................... 8
5.3
AVDD and AVSS Pins ................................................................................................................................... 8
5.4
Internal Voltage Regulator Filter Capacitor ................................................................................................. 8
5.5
Device Reset Pin ......................................................................................................................................... 8
5.6
Oscillator Pins .............................................................................................................................................. 9
5.7
NVM Reset Input ......................................................................................................................................... 9
5.8
Open Drain Outputs ..................................................................................................................................... 9
5.9
Unused Inputs and Unused Open Drain Outputs ........................................................................................ 9
6.0
Reference Schematics................................................................................................................................. 10
6.1
Recommended Minimum Connection ....................................................................................................... 10
6.2
Typical Configuration ................................................................................................................................. 11
7.0
Electrical Characteristics ............................................................................................................................ 15
7.1
Absolute Maximum Ratings ....................................................................................................................... 15
7.2
Electrical Characteristics ........................................................................................................................... 15
8.0
Packaging Diagrams and Parameters ....................................................................................................... 18
8.1
SPDIP (SP) Package ................................................................................................................................. 18
8.2
SOIC 300mil (SO) Package....................................................................................................................... 19
8.3
SOIC 300mil (SO) Land Pattern ................................................................................................................ 20
8.4
QFN-S (MM) Package ............................................................................................................................... 21
8.5
QFN-S (MM) Land Pattern ........................................................................................................................ 22
9.0
Ordering Information ................................................................................................................................... 23
Appendix A: Revision History.............................................................................................................................. 24
Appendix B: Contact Information ........................................................................................................................ 24

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Most Current Data Sheet

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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last
character of the literature number is the version number, (e.g., STN1110DSA is version A of document STN1110DS).

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STN1110DSB

STN1110

1.0

Overview

This datasheet summarizes the features of the STN1110 device. It is not intended as a comprehensive reference source. To
complement the information in this datasheet refer to the STN1100 Family Reference and Programming Manual.
Please see the OBD Solutions website (www.obdsol.com) for the latest version of the STN1100 Family Reference Manual.

The STN1110 is an OBD to UART interpreter IC

designed to provide bi-directional half-duplex
communication with the vehicles On-Board Diagnostic
System (OBD-II). It supports all legislated OBD-II
protocols
A wealth of information can be obtained by tapping
into the OBD bus, including the status of the
malfunction indicator light (MIL), diagnostic trouble

2.0

Feature Highlights
Stable, field-tested firmware
Fully compatible with the ELM327 AT command set
Extended ST command set
1
UART interface (baud rates from 38 bps to 10 Mbps )
Secure bootloader for easy firmware updates
Support for all legislated OBD-II protocols:
o ISO 15765-4 (CAN)
o ISO 14230-4 (Keyword Protocol 2000)
o ISO 9141-2 (Asian, European, Chrysler vehicles)
o SAE J1850 VPW (GM vehicles)
o SAE J1850 PWM (Ford vehicles)
Support for non-legislated OBD protocols:
o ISO 15765
o ISO 11898 (raw CAN)
Support for the heavy-duty SAE J1939 OBD protocol
Superior automatic protocol detection algorithm
Large memory buffer
Sophisticated PowerSave Sleep/Wakeup Triggers
Available in SPDIP, SOIC and QFN-S packages
RoHS compliant

Note 1:

3.0

codes (DTCs), inspection and maintenance (I/M)

information, freeze frames, VIN, hundreds of real-time
parameters, and more.
The STN1110 is fully compatible with the de facto
industry standard ELM327 command set. Based on a
16-bit processor core, the STN1110 offers more
features and better performance than any other
ELM327 compatible IC.

Maximum theoretical baud rate. Actual maximum baud rate is

application dependent and may be limited by driver hardware.

Typical Applications
Vehicle telematics
Fleet management and tracking applications
Usage-based insurance (UBI)
OBD data loggers
Automotive diagnostic scan tools and code readers
Digital dashboards

STN1110DSB

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STN1110

4.0 Pinout
28-Pin SPDIP, SOIC

RESET

28

ANALOG_IN

5V tolerant pins

AVDD
AVSS

26

ISO_L_TX

VPW_RX

25

ISO_K_TX

PWM_RX

24

UART_RX_LED

J1850_BUS+_TX

23

UART_TX_LED

J1850_BUS-_TX

22

OBD_RX_LED / INT

VSS

21

OBD_TX_LED / RST_NVM

OSC1

20

VCAP

OSC2

10

19

VSS

ISO_RX

11

18

PWR_CTRL

SLEEP

12

17

UART_TX

VDD

13

16

UART_RX

CAN_RX

14

15

CAN_TX

STN1110-I/SP
STN1110-I/SO

PWM/VPW

Note
4 of 24

1.

PWM/VPW

ANALOG_IN

RESET

AVDD

AVSS

ISO_L_TX

ISO_K_TX

28

27

26

25

24

23

22

28-Pin QFN-S(1)

5V tolerant pins

VPW_RX

21

UART_RX_LED

PWM_RX

20

UART_TX_LED

J1850_BUS+_TX

19

OBD_RX_LED / INT

J1850_BUS-_TX

18

OBD_TX_LED / RST_NVM

VSS

17

VCAP

OSC1

16

VSS

OSC2

15

PWR_CTRL

12

13

14

CAN_TX

UART_RX

UART_TX

10
VDD

11

9
SLEEP

CAN_RX

8
ISO_RX

STN1110-I/MM

The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to VSS externally.
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STN1110DSB

STN1110
4.1

Pinout Summary

Table 1: Pinout Summary

Pin Number
Pin Name

Pin Type

Pin Description

SOIC
SPDIP

QFN-S

26

RESET

27

ANALOG_IN

28

PWM/VPW

O, 4x

VPW_RX

Active low J1850 VPW receive input

PWM_RX

SAE J1850 PWM receive input

J1850_BUS+_TX

O, 4x

SAE J1850 Bus+ transmit output

J1850_BUS-_TX

O, 4x

Active low SAE J1850 Bus- transmit output

VSS

Ground reference for logic and I/O pins

OSC1

16.000 MHz oscillator crystal input

10

OSC2

16.000 MHz oscillator crystal output

11

ISO_RX

Active low ISO 9141/ISO 14230 K-line input

12

SLEEP

External sleep control input

13

10

VDD

Positive supply for logic and I/O pins

14

11

CAN_RX

I, 5V

15

12

CAN_TX

OD, 5V, 4x

CAN transmit output

16

13

UART_RX

I, 5V

UART receive input

17

14

UART_TX

OD, 5V, 4x

UART transmit output

18

15

PWR_CTRL

OD, 5V, 4x

External power control output

19

16

VSS

Ground reference for logic and I/O pins

20

17

VCAP

CPU logic filter capacitor connection

21

18

OBD_TX_LED /

RST_NVM

OD/I, 5V, 2x

Active low OBD transmit activity LED output and

active low input to reset non-volatile settings to
factory defaults

22

19

OBD_RX_LED /

INT

OD, 5V, 2x

Active low OBD receive activity LED or interrupt

output

23

20

UART_TX_LED

O, 4x

Active low UART transmit activity LED output

24

21

UART_RX_LED

O, 4x

Active low UART transmit activity LED output

25

22

ISO_K_TX

O, 4x

Active low ISO 9141/ISO 14230 K-line output

26

23

ISO_L_TX

O, 4x

Active low ISO 9141/ISO 14230 L-line output

27

24

AVSS

Analog ground reference

28

25

AVDD

Analog positive supply

PAD

Thermal pad

Legend:

STN1110DSB

I
A
P

Schmitt trigger input with CMOS levels

analog input
power pin

I, 5V

Active low device reset input

Analog voltage measurement input
SAE J1850 PWM/VPW Bus+ voltage select
output

CAN receive input

O digital output
OD open drain output
5V 5 volt tolerant pin

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2x
4x

2x source/sink driver
4x source/sink driver

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STN1110
4.2

Detailed Pin Descriptions

RESET

J1850_BUS-_TX

Device reset input. A logic low pulse (min 2 s) on

this pin will reset the device. Apply a continuous logic
low to hold the device in reset. If your circuit does not
use this functionality, connect this pin to VDD.

Active low SAE J1850 Bus- transmit output. When

the pin is high, Bus- should be low (dominant). This
pin has a 4x current rating (see Table 6 Output Pin
DC Specifications). Leave unconnected if unused.
VSS

ANALOG_IN

Ground reference for logic and I/O pins.

Analog voltage measurement input (AVDD max).

By default, this input is calibrated for an external
62 k/10 k voltage divider connected to battery
positive. Connect to AVSS if unused.

PWM /
VPW

OSC1, OSC2
16.000 MHz oscillator crystal connection.

ISO_RX

The firmware uses this pin to control the voltage

level of the SAE J1850 PWM/VPW Bus+ supply.
When the PWM protocol is selected, it outputs a logic
high to switch the supply voltage to a nominal 5V.
When the VPW protocol is selected, it outputs a logic
low to switch the supply voltage to a nominal 8V. This
pin has a 4x current rating (see Table 6 Output Pin
DC Specifications). Leave unconnected if unused.

VPW_RX
Active low SAE J1850 VPW receive input. When
the SAE J1850 Bus+ is in the recessive (low) state,
this pin should be at a logic high level. When the
SAE J1850 Bus+ is in the dominant (high) state, this
pin should be at a logic low level. Pull up to VDD if
unused.

Active low ISO 9141/ISO 14230 K-line receive

input. When K-line is high (recessive), this pin should
be at a logic low level. Connect to VSS if unused.

SLEEP
External sleep control input. When enabled in
firmware, puts the device into low-power sleep mode.
Polarity of this pin can be configured in firmware;
default configuration is active low. Internal pull-up to
VDD is enabled by default, but can be disabled in
firmware. Leave unconnected if unused.

VDD
Positive 3.0 3.6V supply for logic and I/O pins.

PWM_RX

CAN_RX

SAE J1850 PWM receive input. When the

SAE J1850 bus is in the recessive state (Bus+ is low,
Bus- is high), this pin should be at a logic low level.
When the SAE J1850 bus is in the dominant (Bus+ is
high) state, this pin should be at a logic high level.
Connect to VSS if unused.

CAN receive input. Compatible with 3.3V and 5V

logic. Pull up to VDD if unused.

J1850_BUS+_TX
SAE J1850 Bus+ transmit output. When the pin is
high, Bus+ should be high (dominant). This pin has a
4x current rating (see Table 6 Output Pin DC
Specifications). Leave unconnected if unused.

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CAN_TX
CAN transmit output. Open drain requires a pullup to VDD or 5V. This pin has a 4x current rating (see
Table 6 Output Pin DC Specifications). Pull-up value
depends on CAN baud rates used and the trace
length (higher resistor values can be used with lower
baud rates and shorter traces); recommended value is
1 k. Pull up to VDD via 100 k resistor if unused.

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STN1110DSB

STN1110
UART_RX
UART receive input. Compatible with 3.3V and 5V
logic.

This pin has a 4x current rating (see Table 6 Output

Pin DC Specifications). Leave unconnected if unused.

UART_RX_LED

UART_TX
UART transmit output. Open drain requires a
pull-up to VDD or 5V. This pin has a 4x current rating
(see Table 6 Output Pin DC Specifications). Pull-up
value depends on UART baud rate and the trace
length (higher resistor values can be used with lower
baud rates and shorter traces); typical value is 1 k.

Active low UART transmit activity LED output.

Voltage on the anode of the LED must not exceed
VDD + 0.3V. This pin has a 4x current rating (see
Table 6 Output Pin DC Specifications). Leave
unconnected if unused.

PWR_CTRL

ISO_K_TX

External power control output. Used to switch

external circuitry into low-power (sleep) state. Polarity
can be configured in firmware; default configuration is
active high (logic low = sleep mode). Open drain
requires a pull-up to VDD or 5V; be mindful of the fact
that the pull-up will draw current in low-power state.
This pin has a 4x current rating (see Table 6 Output
Pin DC Specifications). Pull down to VSS via 100 k
resistor if unused.

Active low ISO 9141/ISO 14230 K-line output.

When the pin is logic high, K-line should be low. This
pin has a 4x current rating (see Table 6 Output Pin
DC Specifications). Leave unconnected if unused.

VCAP
CPU logic filter capacitor connection. Connect to a
low-ESR (< 5 ) tantalum or ceramic capacitor.
Minimum value is 4.7 F; typical value is 10 F.

RST_NVM
OBD_TX_LED /
Active low OBD transmit activity LED output and
active low input to reset NVM to factory defaults.
Open drain requires a pull-up to VDD or 5V. This pin
has a 2x current rating (see Table 6 Output Pin DC
Specifications). Pull up to VDD via 100 k resistor if
unused.

/
INT
OBD_RX_LED
Active low OBD receive activity LED or interrupt
output. Open drain requires a pull-up to VDD or 5V
when configured as interrupt. This pin has a 2x
current rating (see Table 6 Output Pin DC
Specifications). Pull up to VDD if unused.

ISO_L_TX
Active low ISO 9141/ISO 14230 L-line output.
When the pin is logic high, L-line should be low. This
pin has a 4x current rating (see Table 6 Output Pin
DC Specifications). Leave unconnected if unused.

AVSS
Analog ground reference. Must be connected to
analog clean ground (between VSS - 0.3V and
VSS + 0.3V) or VSS.

AVDD
Analog positive supply. Must be connected to VDD
or an external voltage reference (between VDD - 0.3V
or 3.0V, whichever is greater and VDD + 0.3V or 3.6V,
whichever is less). AVDD may be decoupled from
digital supply by connecting it to VDD via a 10
resistor or a small (10 H 47 H) inductor.
PAD
The metal plane at the bottom of the device (QFN
package only). It is not connected to any pins
internally. Connect to VSS externally.

UART_TX_LED
Active low UART transmit activity LED output.
Voltage on the anode of the LED must not exceed
VDD + 0.3V.

STN1110DSB

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STN1110

5.0 Guidelines for Getting Started with STN1110

5.1

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.

Basic Connection
Requirements

Getting started with the STN1110 IC requires

attention to a minimal set of device pin connections
before proceeding with development. The following is
a list of pin names, which must always be connected:

VDD and both VSS pins (see Section 5.2

Decoupling Capacitors)

AVDD and AVSS pins (see Section 5.2

Decoupling Capacitors and Section 5.3 AVDD
and AVSS Pins)

VCAP (see Section 5.4 Internal Voltage

Regulator Filter Capacitor)

RESET pin (see Section 5.5 Device Reset Pin)

OSC1 and OSC2 pins (see Section 5.6

Oscillator Pins)

RST_NVM pin (see Section 5.7 NVM Reset

Input)

Open Drain Output Pull-ups (see Section 5.8

Open Drain Outputs)

5.2

5.2.1 Tank Capacitors

5.3

Decoupling Capacitors

The use of decoupling capacitors on every pair of

power supply pins, such as VDD, VSS and AVDD,
AVSS is required. Consider the following criteria when
using decoupling capacitors:

Value and type of capacitor: Recommendation

of 1 F, 10-20V. This capacitor should be a lowESR and have resonance frequency in the range
of 20 MHz and higher. It is recommended that
ceramic capacitors be used.

Placement on the printed circuit board: The

decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
(6 mm) in length.

Handling high frequency noise: If the board is

experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type
capacitor in parallel to the above described
decoupling capacitor. The value of the second
capacitor can be in the range of 0.01 F to
0.001 F. Place this second capacitor next to the
primary decoupling capacitor.

Maximizing performance: On the board layout

from the power supply circuit, run the power and

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On boards with power traces running longer than

six inches in length, use a tank capacitor for
integrated circuits, including STN1110, to supply a
local power source. The value of the tank capacitor
should be determined based on the trace resistance
that connects the power supply source to the device,
and the maximum current drawn by the device in the
application. In other words, select the tank capacitor
so that it meets the acceptable voltage sag at the
device. Typical values range from 4.7 F to 47 F.

AVDD and AVSS Pins

As a minimum, AVDD must be connected directly

to VDD and AVSS must be connected directly to VSS.
It is recommended that AVDD be connected to to VDD
via a 10 resistor or a small (10 H 47 H)
inductor.
AVSS should be connected to the electrically
cleanest ground net (plane). For best results, analog
circuitry should have a separate ground plane with a
point connection to VSS ground plane as close as
possible to the AVSS pin.

5.4

Internal Voltage Regulator

Filter Capacitor

A low-ESR (< 5 ) capacitor is required on the

VCAP pin, which is used to stabilize the internal
voltage regulator output voltage. The VCAP pin must
not be connected to VDD, and must have a capacitor
between 4.7 F and 10 F, 16V connected to ground.
The type can be ceramic or tantalum. Refer to
Section 7.2 Electrical Characteristics for additional
information. The placement of this capacitor should
be close to the VCAP pin. It is recommended that the
trace length not exceed (6 mm).

5.5

Device Reset Pin

RESET
pin must be logic high for STN1110 to
run. If this pin is not controlled by the host controller,
it must be connected to VDD.
It is recommended to pull up RESET
pin to VDD
via a 10 k resistor.

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STN1110DSB

STN1110
5.6

Oscillator Pins

The oscillator circuit should be placed on the

same side of the board as the device. Also, place the
oscillator circuit close to the oscillator pins, not
exceeding one-half inch (12 mm) distance between
them. The load capacitors should be placed next to
the oscillator itself, on the same side of the board.
Use a grounded copper pour around the oscillator
circuit to isolate them from surrounding circuits. The
grounded copper pour should be routed directly to
the STN1110 ground. Do not run any signal traces or
power traces inside the ground pour. Also, if using a
two-sided board, avoid any traces on the other side
of the board where the crystal is placed. A suggested
layout is shown in Figure 1.
Figure 1 Suggested Placement of the
Oscillator Circuit

circuit. Leaving any of its inputs or open drain outputs

floating may result in IC damage.
Unused open drain outputs can only be
terminated with a resistor connected to VDD or 5V.
Unused inputs can be terminated via a resistor or
direct connection to VSS or VDD.
Unused inputs and open drain outputs should be
connected as shown in Table 2. See section 4.2
Detailed Pin Descriptions and section 6.1
Recommended Minimum Connection for more
information.
Table 2 Recommended Unused Input and
Open Drain Output Connections
Pin Number
Pin Name
QFN-S

26

RESET

27

ANALOG_IN

VPW_RX

PWM_RX

11

ISO_RX

12

SLEEP

14

11

CAN_RX

15

12

CAN_TX

16

13

UART_RX

17

14

UART_TX

18

15

PWR_CTRL

21

18

OBD_TX_LED
/
RST_NVM

(3)

22

19

OBD_RX_LED /
INT

(3)

Oscillator
Guard Ring

5.7

NVM Reset Input

RST_NVM pin must be pulled up to VDD via a

100 k resistor for proper device operation.

5.8

Open Drain Outputs

All open drain outputs (as specified in section 4.1)

that are in use must be pulled up to VDD or 5V.
Specifically, UART_TX pin must be pulled up in order
to be able to communicate with the device. See
section 4.2 Detailed Pin Descriptions for more
information.

5.9

Unused Inputs and Unused

Open Drain Outputs

None of the unused inputs or unused open drain

outputs (as specified in section 4.1) should be left
unconnected. The STN1110 is a CMOS integrated

STN1110DSB

Level

SOIC
SPDIP

H
(1)
(1)

(1)
(1)
(2)

H
H

(3)

H
(3)

(4)

Note 1. These inputs may be connected to either VDD or

VSS. However, the preferred level is shown.
2. SLEEP
input has internal pull-up to VDD enabled by
default. Therefore, it can be left unconnected.
3. These open drain outputs cannot be connected to
VDD directly. They can only be connected to VDD or
5V via a resistor.
4. This open drain output should not be connected to
VSS directly. For reduced current consumption
during sleep, when unused, this output should be
connected to VSS via a resistor.

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STN1110

6.0 Reference Schematics

6.1

Recommended Minimum Connection

Figure 2 shows the recommended minimum of components necessary to get the STN1110 to operate reliably,
while minimizing power consumption. It is not a practical circuit; it is intended as a reference to show what to do
with unused pins. Refer to the detailed pin descriptions (section 4.2) for more information.
Figure 2 Recommended Minimum Connection

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STN1110DSB

STN1110
6.2

Typical Configuration

This section contains schematics showing the typical configuration for the various circuit blocks. Pay special
attention when choosing substitutes for components with specific part numbers, to make sure they have the same
or better characteristics. Components without specific part numbers are generic. Use good engineering practices
and common sense to make sure the specific parts you choose are appropriate for your application.
Figure 3 STN1110 IC

Figure 4 LEDs

STN1110DSB

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STN1110
Figure 5 Voltage Sense

Figure 6 Power Supplies

Figure 7 Switched Power Control

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STN1110DSB

STN1110
Figure 8 OBD Port Connector

Figure 9 ISO Transceiver

Figure 10 CAN Transceiver

STN1110DSB

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STN1110
Important: Q4, Q5, and Q6 can only be substituted with transistors that have the same or better switching
characteristics. OK to substitute fast-switching silicon diodes (e.g., 1N4148) for D10, D12 and D13. Also, note that
the comparator IC4 is powered from DLC_SW.
Figure 11 J1850 Transceiver

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STN1110DSB

STN1110

7.0 Electrical Characteristics

This section provides an overview of STN1110 electrical characteristics. Additional information will be provided
in future revisions of this document as it becomes available.
The STN1110 is based on the PIC24HJ128GP502 device from Microchip Technology. For more detailed device
specifications or clarification, refer to Microchip documentation, available at http://www.microchip.com.

7.1

Absolute Maximum Ratings (1)

Ambient temperature under bias ................................................................................................... -40C to +125C

Storage temperature ........................................................................................................................ -65C to +160C
Voltage on VDD with respect to VSS ................................................................................................... -0.3V to +4.0V
(2)
Voltage on any pin that is not 5V tolerant with respect to VSS ......................................... -0.3V to (VDD + 0.3V)
(2)
Voltage on any 5V tolerant pin with respect to VSS when VDD 3.0V ......................................... -0.3V to +5.6V
(2)
Voltage on any 5V tolerant pin with respect to VSS when VDD < 3.0V ........................................... -0.3V to 3.6V
(3)
Maximum current sourced/sunk by any 2x output ....................................................................................... 8 mA
(3)
Maximum current sourced/sunk by any 4x output ..................................................................................... 15 mA
Note

7.2

1.

Stresses beyond those listed here can cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not
implied. Exposure to maximum rating conditions for extended periods can affect device reliability.

2.
3.

See section 4.0 Pinout for the list of 5V tolerant pins.

See section 4.1 Pinout Summary to determine current rating of individual pins.

Electrical Characteristics

Table 3: Thermal Operating Conditions

Sym

Characteristic

Min

Typ

Max

Units

TJ

Operating Junction Temperature

-40

+125

TA

Operating Ambient Temperature

-40

+85

Min

Typ

Max

Units

VDD Supply Voltage

3.0

3.6

VPOR VDD Start Voltage

to ensure internal power-on reset
(POR) signal

VSS

SvDD VDD Rise Rate(2)

to ensure internal power-on reset
(POR) signal

0.03

AVDD Analog Supply Voltage

Greater of
VDD 0.3
or 3.0

Lesser of
VDD + 0.3
or 3.6

AVSS Analog Ground Reference

VSS 0.3

VSS + 0.3

Conditions

Table 4: Power Specifications

Sym

STN1110DSB

Characteristic

(1)

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Conditions

V/ms 03.0V in 0.1s

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STN1110
Sym

Characteristic

VBOR Brown-out Reset Voltage(3)

on VDD transition high-to-low
(4)

IDD

Operating Current

IPD

Average Sleep Current

(4,6)

CEFC External Filter Capacitor

connected to VCAP pin
Note

(7)

Min

Typ

2.40

(1)

Max

Units

2.55

68

82

98

210

(5)

Conditions

mA

(5)

TA = +25C

(5)

300

710

TA = +85C

4.7

10

ESR < 5

(5)

1.

Data in Typ column is at 3.3V, 25C, unless otherwise stated.

2.

This spec must be met in order to ensure that a correct internal power-on reset (POR) occurs. It is easily achieved using most
common types of supplies, but may be violated if a supply with slowly varying voltage is used, as may be obtained through direct
connection to solar cells or some charge pump circuits.

3.

This parameter is for design guidance only and is not tested in manufacturing.

4.

STN1110 device current only. Does not include any load currents.

5.
6.

Values are characterized, but not tested.

All wakeup triggers are on and wakeup trigger inputs are in their inactive states.

7.

Typical VCAP voltage = 2.5V when VDD VDDMIN.

Table 5: Input Pin DC Specifications

Min

Typ

MS_CAN_RX pin

VSS

all other inputs

Sym
VIL

VIH

Characteristic

(1)

Max

Units

0.3 VDD

VSS

0.2 VDD

0.7 VDD

VDD

0.7 VDD

5.5

AVSS

AVDD

Input Low Voltage

Input High Voltage

non-5V tolerant pins
5V tolerant pins

(2)

(2)

VIN

ANALOG_IN Input Voltage

RIN

Recommended ANALOG_IN
Voltage Source Impedance

200

IPU

Internal Pull-up Current

50

250

400

VDD = 3.3V, VPIN = VSS

(4,7)

mA

All pins, except VDD, VSS,

AVDD, AVSS, RESET
,
VCAP, SLEEP
, ISO_RX

and
ISO_K_TX

(5,6,7)

mA

All pins, except VDD, VSS,

AVDD, AVSS, RESET
,
VCAP, SLEEP
, ISO_RX

,
ISO_K_TX , and 5V tolerant
designated pins

(8)

mA

Absolute instantaneous sum

of all input injection
currents from all I/O pins
(|IICL| + |IICH|) IICT

IICL

Input Low Injection Current

-5

IICH

Input High Injection Current

+5

IICT Total Input Injection Current

sum of all I/O and control pins

Note

16 of 24

Conditions

1.

Data in Typ column is at 3.3V, 25C, unless otherwise stated.

2.

See section 4.0 Pinout for the list of 5V tolerant pins.

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20

STN1110DSB

STN1110
3.

Negative current is defined as current sourced by the pin.

4.

VIL source < (VSS 0.3). Characterized, but not tested.

5.

Non-5V tolerant pins: VIH source > (VDD + 0.3), 5V tolerant pins: VIH source > 5.5V. Characterized, but not tested.

6.
7.

5V tolerant pins cannot tolerate any positive input injection current from input sources > 5.5V.
Injection currents > 0 can affect the ADC results by approximately 4-6 counts.

8.

Any number and/or combination of inputs listed under IICL or IICH conditions are permitted, provided the mathematical absolute
instantaneous sum of the input injection currents from all pins does not exceed the specified limit. Characterized, but not tested.

Table 6: Output Pin DC Specifications

Sym
VOL

VOH

Characteristic
Output Low Voltage
2x Sink Driver Pins

(2)

4x Sink Driver Pins

(2)

Min

Typ

Max

Units

Conditions

0.4

IOL 3 mA, VDD = 3.3V

0.4

IOL 6 mA, VDD = 3.3V

(1)

(1)

Output High Voltage

2x Source Driver Pins

(2)

2.4

IOH -3 mA, VDD = 3.3V

4x Source Driver Pins

(2)

2.4

IOH -6 mA, VDD = 3.3V

1.5

IOH -6 mA, VDD = 3.3V

2.0

IOH -5 mA, VDD = 3.3V

3.0

IOH -2 mA, VDD = 3.3V

1.5

IOH -12 mA, VDD = 3.3V

2.0

IOH -11 mA, VDD = 3.3V

3.0

IOH -3 mA, VDD = 3.3V

(1)

VOH1 Output High Voltage

2x Source Driver Pins

4x Source Driver Pins

Note

1.
2.

(2)

(2)

Parameters are characterized, but not tested.

See section 4.1 Pinout Summary for the output driver current rating designations.

Table 7: I/O Pin Timing Requirements

Sym

Characteristic

Min

Typ

Max

Units

TRST
RESET Pulse Width (low)

TUWM Minimum UART Rx Pulse Width

required for wakeup (user settable)

20

ns

user setting < 15

15

65,534

user setting 15

15

user setting = 0

65,534

ms

user setting > 0

TSTM Minimum SLEEP

Input Time
to stay high before wakeup (user
settable)

STN1110DSB

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Conditions

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STN1110

8.0

Packaging Diagrams and Parameters

8.1

SPDIP (SP) Package

28-Lead Skinny Plastic Dual In-Line (SP) 300 mil Body [SPDIP]

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

N
NOTE 1
E1

3
D
E
A2

b1

A1

eB

Units
Dimension Limits
Number of Pins

INCHES
MIN

NOM

MAX

28

Pitch

Top to Seating Plane

.200

Molded Package Thickness

A2

.120

.135

.150

Base to Seating Plane

A1

.015

Shoulder to Shoulder Width

.290

.310

.335

Molded Package Width

E1

.240

.285

.295

Overall Length

1.345

1.365

1.400

Tip to Seating Plane

.110

.130

.150

Lead Thickness

.008

.010

.015

Upper Lead Width

b1

.040

.050

.070

Lower Lead Width

.014

.018

.022

eB

.430

Overall Row Spacing

.100 BSC

Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010 per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-070B
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STN1110
8.2

SOIC 300mil (SO) Package

28-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC]

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
D
N

E
E1
NOT E 1
1 2 3
e
b

A2

L
A1

Units
Dimension Limits
Number of Pins

L1

MILLIMETERS
MIN

NOM

MAX

28

Pitch

Overall Height

1.27 BSC

Molded Package Thickness

A2

2.05

Standoff

A1

0.10

0.30

Overall Width

Molded Package Width

E1

7.50 BSC

Overall Length

17.90 BSC

Chamfer (optional)

0.25

0.75

Foot Length

0.40

1.27

Footprint

L1

Foot Angle Top

Lead Thickness

0.18

0.33

Lead Width

0.31

0.51

Mold Draft Angle Top

15

Mold Draft Angle Bottom

15

2.65

10.30 BSC

1.40 REF

Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-052B

STN1110DSB

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STN1110
8.3

SOIC 300mil (SO) Land Pattern

28-Lead Plastic Small Outline (SO) Wide, 7.50 mm Body [SOIC]

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

RECOMMENDED LAND PATTERN

Units
Dimension Limits

MILLIMETERS
MIN

NOM

Contact Pitch

1.27 BSC

Contact Pad Spacing

9.40

Contact Pad Width (x28)

Contact Pad Length (x28)

MAX

0.60
2.00

Distance Between Pads

Gx

0.67

Distance Between Pads

7.40

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2052A

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STN1110
8.4

QFN-S (MM) Package

28-Lead Plastic Quad Flat, No Lead Package (MM) 6x6x0.9 mm Body [QFN-S] with
0.40 mm Contact Length

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

D2

EXPOSED
PAD

e
E2
E
b
2

2
1

K
N
L

NOTE 1

TOP VIEW

BOTTOM VIEW

A3

A1

Units
Dimension Limits
Number of Pins

MILLIMETERS
MIN

NOM

MAX

28

Pitch

Overall Height

0.80

0.90

1.00

Standoff

A1

0.00

0.02

0.05

Contact Thickness

A3

Overall Width

Exposed Pad Width

E2

Overall Length

Exposed Pad Length

0.65 BSC

0.20 REF
6.00 BSC
3.65

3.70

4.70

6.00 BSC

D2

3.65

3.70

4.70

Contact Width

0.23

0.38

0.43

Contact Length

0.30

0.40

0.50

Contact-to-Exposed Pad

0.20

Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-124B

STN1110DSB

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STN1110
8.5

QFN-S (MM) Land Pattern

28-Lead Plastic Quad Flat, No Lead Package (MM) 6x6x0.9 mm Body [QFN-S] with
0.40 mm Contact Length

For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.

RECOMMENDED LAND PATTERN

Units
Dimension Limits
Contact Pitch
Optional Center Pad Width

MILLIMETERS
MIN

NOM

MAX

0.65 BSC

W2

4.70

Optional Center Pad Length

T2

Contact Pad Spacing

C1

6.00

4.70

Contact Pad Spacing

C2

6.00

Contact Pad Width (x28)

X1

Contact Pad Length (x28)

Y1

Distance Between Pads

0.40
0.85
0.25

Notes:
1. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2124

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STN1110DSB

STN1110

9.0 Ordering Information

TA
-40C to +85C

STN1110DSB

Package

Part Number

SKU

SPDIP (SP)

Tube

STN1110-I/SP

365101

SOIC (SO)

Tube

STN1110-I/SO

365111

QFN-S (MM)

Tube

STN1110-I/MM

365121

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STN1110

Appendix A: Revision History

Revision A (October 22, 2010)
Initial release of this document.

Revision B (July 13, 2012)

Revised the Overview, Feature Highlights, and Typical Applications sections. Added current capability
ratings to the Pinout Summary table and relevant pin descriptions. Changed recommended connections for
unused pins. Deleted last sentence of NVM Reset Input description (RST_NVM needs a pullup whether an LED is
connected or not). Added Recommended ANALOG_IN Voltage Source Impedance (RIN) specification to Input
Pin Specifications table. Updated schematics, and added short descriptions to the Recommended Minimum
Connection and Typical Configuration sections. Minor typographical and formatting changes.

Appendix B: Contact Information

OBD Solutions
1819 W Rose Garden Ln Ste 3
Phoenix, AZ 85027
United States
Phone:
Fax:
Email:
Web:

24 of 24

+1 623.434.5506
+1 623.321.1628
sales@obdsol.com
www.obdsol.com

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STN1110DSB