LM675

LM675
Power Operational Amplifier

General Description
The LM675 is a monolithic power operational amplifier featuring wide bandwidth and low input offset voltage, making it
equally suitable for AC and DC applications.
The LM675 is capable of delivering output currents in excess
of 3 amps, operating at supply voltages of up to 60V. The
device overload protection consists of both internal current
limiting and thermal shutdown. The amplifier is also internally
compensated for gains of 10 or greater.
1 mV typical offset voltage

Short circuit protection
Thermal protection with parole circuit (100% tested)
16V60V supply range
Wide common mode range
Internal output protection diodes
90 dB ripple rejection
Plastic power package TO-220
Applications
Features
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3A current capability
AVO typically 90 dB
5.5 MHz gain bandwidth product
8 V/s slew rate
Wide power bandwidth 70 kHz
Connection Diagram
High performance power op amp

Bridge amplifiers
Motor speed controls
Servo amplifiers
Instrument systems
Typical Applications
TO-220 Power Package (T)
Non-Inverting Amplifier
00673901
*The tab is internally connected to pin 3 (VEE)
Front View
Order Number LM675T
See NS Package T05D
00673902
2004 National Semiconductor Corporation
DS006739
www.national.com
LM675 Power Operational Amplifier
May 1999
LM675
Absolute Maximum Ratings (Note 1)
Storage Temperature
65C to +150C
If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Junction Temperature
150C
Power Dissipation (Note 2)
30V
Supply Voltage
Input Voltage
VEE to VCC
Operating Temperature
0C to +70C
30W
Lead Temperature
(Soldering, 10 seconds)
260C
ESD rating to be determined.
Electrical Characteristics
VS= 25V, TA=25C unless otherwise specified.
Typical
Tested Limit
Units
Supply Current
Parameter
POUT = 0W
Conditions
18
50 (max)
mA
Input Offset Voltage
VCM = 0V
10 (max)
mV
Input Bias Current
VCM = 0V
0.2
2 (max)
Input Offset Current
VCM = 0V
50
500 (max)
nA
Open Loop Gain
RL =
90
70 (min)
dB
PSRR
VS = 5V
90
70 (min)
dB
CMRR
VIN = 20V
90
70 (min)
dB
Output Voltage Swing
RL = 8
21
18 (min)
Offset Voltage Drift Versus Temperature
RS < 100 k
25
Offset Voltage Drift Versus Output Power
25
Output Power
THD = 1%, fO = 1 kHz, RL = 8
25
Gain Bandwidth Product
fO = 20 kHz, AVCL = 1000
5.5
Max Slew Rate
V/W
20
W
MHz
22
Input Common Mode Range
V
V/C
V/s
20 (min)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 2: Assumes TA equal to 70C. For operation at higher tab temperatures, the LM675 must be derated based on a maximum junction temperature of 150C.
Generating a Split Supply From a Single Supply
00673903
VS = 8V 30V
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LM675
Typical Performance Characteristics

Input Common Mode
Range vs Supply Voltage
THD vs Power Output
00673911
00673910
Supply Current vs
Supply Voltage
PSRR vs Frequency
00673913
00673912
Device Dissipation vs
Ambient Temperature
Current Limit vs
Output Voltage*
00673914
00673915
INTERFACE = 1 C/W
*VS = 25V
See Application Hints.
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LM675
Typical Performance Characteristics
(Continued)
Output Voltage
Swing vs Supply Voltage
IB vs Supply Voltage
00673916
00673917
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Schematic Diagram
00673905
LM675
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LM675
These are part of the internal circuitry of the LM675, and

neednt be added externally when standard reactive loads
are driven.
Application Hints
STABILITY
The LM675 is designed to be stable when operated at a
closed-loop gain of 10 or greater, but, as with any other
high-current amplifier, the LM675 can be made to oscillate
under certain conditions. These usually involve printed circuit board layout or output/input coupling.
THERMAL PROTECTION
The LM675 has a sophisticated thermal protection scheme
to prevent long-term thermal stress to the device. When the
temperature on the die reaches 170C, the LM675 shuts
down. It starts operating again when the die temperature
drops to about 145C, but if the temperature again begins to
rise, shutdown will occur at only 150C. Therefore, the device is allowed to heat up to a relatively high temperature if
the fault condition is temporary, but a sustained fault will limit
the maximum die temperature to a lower value. This greatly
reduces the stresses imposed on the IC by thermal cycling,
which in turn improves its reliability under sustained fault
conditions. This circuitry is 100% tested without a heat sink.
When designing a printed circuit board layout, it is important

to return the load ground, the output compensation ground,
and the low level (feedback and input) grounds to the circuit
board ground point through separate paths. Otherwise, large
currents flowing along a ground conductor will generate
voltages on the conductor which can effectively act as signals at the input, resulting in high frequency oscillation or
excessive distortion. It is advisable to keep the output compensation components and the 0.1 F supply decoupling
capacitors as close as possible to the LM675 to reduce the
effects of PCB trace resistance and inductance. For the
same reason, the ground return paths for these components
should be as short as possible.
Since the die temperature is directly dependent upon the

heat sink, the heat sink should be chosen for thermal resistance low enough that thermal shutdown will not be reached
during normal operaton. Using the best heat sink possible
within the cost and space constraints of the system will
improve the long-term reliability of any power semiconductor.
Occasionally, current in the output leads (which function as

antennas) can be coupled through the air to the amplifier
input, resulting in high-frequency oscillation. This normally
happens when the source impedance is high or the input
leads are long. The problem can be eliminated by placing a
small capacitor (on the order of 50 pF to 500 pF) across the
circuit input.
Most power amplifiers do not drive highly capacitive loads
well, and the LM675 is no exception. If the output of the
LM675 is connected directly to a capacitor with no series
resistance, the square wave response will exhibit ringing if
the capacitance is greater than about 0.1 F. The amplifier
can typically drive load capacitances up to 2 F or so without
oscillating, but this is not recommended. If highly capacitive
loads are expected, a resistor (at least 1) should be placed
in series with the output of the LM675. A method commonly
employed to protect amplifiers from low impedances at high
frequencies is to couple to the load through a 10 resistor in
parallel with a 5 H inductor.
POWER DISSIPATION AND HEAT SINKING

The LM675 should always be operated with a heat sink,
even though at idle worst case power dissipation will be only
1.8W (30 mA x 60V) which corresponds to a rise in die
temperature of 97C above ambient assuming jA = 54C/W
for a TO-220 package. This in itself will not cause the thermal
protection circuitry to shut down the amplifier when operating
at room temperature, but a mere 0.9W of additional power
dissipation will shut the amplifier down since TJ will then
increase from 122C (97C + 25C) to 170C.
In order to determine the appropriate heat sink for a given
application, the power dissipation of the LM675 in that application must be known. When the load is resistive, the maximum average power that the IC will be required to dissipate
is approximately:
CURRENT LIMIT AND SAFE OPERATING AREA

(SOA) PROTECTION
A power amplifiers output transistors can be damaged by
excessive applied voltage, current flow, or power dissipation.
The voltage applied to the amplifier is limited by the design of
the external power supply, while the maximum current
passed by the output devices is usually limited by internal
circuitry to some fixed value. Short-term power dissipation is
usually not limited in monolithic operational power amplifiers,
and this can be a problem when driving reactive loads, which
may draw large currents while high voltages appear on the
output transistors. The LM675 not only limits current to
around 4A, but also reduces the value of the limit current
when an output transistor has a high voltage across it.
When driving nonlinear reactive loads such as motors or
loudspeakers with built-in protection relays, there is a possibility that an amplifier output will be connected to a load
whose terminal voltage may attempt to swing beyond the
power supply voltages applied to the amplifier. This can
cause degradation of the output transistors or catastrophic
failure of the whole circuit. The standard protection for this
type of failure mechanism is a pair of diodes connected
between the output of the amplifier and the supply rails.
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where VS is the total power supply voltage across the

LM675, RL is the load resistance and PQ is the quiescent
power dissipation of the amplifier. The above equation is
only an approximation which assumes an ideal class B
output stage and constant power dissipation in all other parts
of the circuit. As an example, if the LM675 is operated on a
50V power supply with a resistive load of 8, it can develop
up to 19W of internal power dissipation. If the die temperature is to remain below 150C for ambient temperatures up to
70C, the total junction-to-ambient thermal resistance must
be less than
Using JC = 2C/W, the sum of the case-to-heat sink interface thermal resistance and the heat-sink-to-ambient thermal resistance must be less than 2.2C/W. The case-to-heatsink thermal resistance of the TO-220 package varies with
the mounting method used. A metal-to-metal interface will be
about 1C/W if lubricated, and about 1.2C/W if dry. If a mica
insulator is used, the thermal resistance will be about
6
The thermal requirements can become more difficult when

an amplifier is driving a reactive load. For a given magnitude
of load impedance, a higher degree of reactance will cause
a higher level of power dissipation within the amplifier. As a
general rule, the power dissipation of an amplifier driving a
60 reactive load will be roughly that of the same amplifier
driving the resistive part of that load. For example, some
reactive loads may at some frequency have an impedance
with a magnitude of 8 and a phase angle of 60. The real
part of this load will then be 8 x cos 60 or 4, and the
amplifier power dissipation will roughly follow the curve of
power dissipation with a 4 load.
(Continued)
1.6C/W lubricated and 3.4C/W dry. For this example, we

assume a lubricated mica insulator between the LM675 and
the heat sink. The heat sink thermal resistance must then be
less than
4.2C/W 2C/W 1.6C/W = 0.6C/W.
This is a rather large heat sink and may not be practical in
some applications. If a smaller heat sink is required for
reasons of size or cost, there are two alternatives. The
maximum ambient operating temperature can be restricted
to 50C (122F), resulting in a 1.6C/W heat sink, or the heat
sink can be isolated from the chassis so the mica washer is
not needed. This will change the required heat sink to a
1.2C/W unit if the case-to-heat-sink interface is lubricated.
Non-Inverting Unity Gain Operation
00673906
Inverting Unity Gain Operation
00673907
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LM675
Application Hints
LM675
(Continued)
Servo Motor Control
00673908
High Current Source/Sink
00673909
IOUT = VIN x 2.5 amps/volt

i.e. IOUT = 1A when VIN = 400 mV
Trim pot for max ROUT
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LM675 Power Operational Amplifier
Physical Dimensions
inches (millimeters) unless otherwise noted
TO-220 Power Package (T)

Order Number LM675T
NS Package T05D
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONALS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support

device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no Banned
Substances as defined in CSP-9-111S2.
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Support Center
Email: new.feedback@nsc.com
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LM675

Power Operational Amplifier

1 mV typical offset voltage

High performance power op amp

TO-220 Power Package (T)

*The tab is internally connected to pin 3 (VEE)

2004 National Semiconductor Corporation

LM675 Power Operational Amplifier

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

Power Dissipation (Note 2)

ESD rating to be determined.

Input Offset Voltage

Input Bias Current

Input Offset Current

Open Loop Gain

Output Voltage Swing

Offset Voltage Drift Versus Temperature

Offset Voltage Drift Versus Output Power

THD = 1%, fO = 1 kHz, RL = 8

Gain Bandwidth Product

fO = 20 kHz, AVCL = 1000

Max Slew Rate

Input Common Mode Range

Typical Performance Characteristics

THD vs Power Output

See Application Hints.

Typical Performance Characteristics

These are part of the internal circuitry of the LM675, and

When designing a printed circuit board layout, it is important

Since the die temperature is directly dependent upon the

Occasionally, current in the output leads (which function as

POWER DISSIPATION AND HEAT SINKING

CURRENT LIMIT AND SAFE OPERATING AREA

where VS is the total power supply voltage across the

The thermal requirements can become more difficult when

1.6C/W lubricated and 3.4C/W dry. For this example, we

Inverting Unity Gain Operation

High Current Source/Sink

IOUT = VIN x 2.5 amps/volt

LM675 Power Operational Amplifier

inches (millimeters) unless otherwise noted

TO-220 Power Package (T)

2. A critical component is any component of a life support

BANNED SUBSTANCE COMPLIANCE

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