Emc Design Fundamentals

EMC Design
Fundamentals
James Colotti
EMC Certified by NARTE

Staff Analog Design Engineer
Telephonics - Command Systems Division
Outline
Introduction
Importance of EMC
Problems with non-compliance
Concepts & Definitions

Standards
FCC, US Military, EU, RTCA
Design Guidelines and Methodology

EM Waves, Shielding
Layout and Partitioning
Power Distribution
Power Conversion
Signal Distribution
Design Process
References and Vendors
Revision 3
Copyright Telephonics 2003-2005
Introduction
Revision 3
Importance of EMC
Electromagnetic Compatibility (EMC) requires th systems/equipment be
able to tolerate a specifi of interference and not generate more than a sp
amount of interference
EMC is becoming more important because there many more opportunities
today for EMC issues
Increase use of electronic devices

Automotive applications
Personal computing/entertainment/communication
Increased potential for susceptibility/emissions

Lower supply voltages
Increasing clock frequencies, faster slew rates
Increasing packaging density
Demand for smaller, lighter, cheaper, lower-power
Revision 3
Problems with Non-Complia

Product may be blocked from market
Practical impact can be minor annoyance to lethal
and everything in between
Annoyance,
Delays
Lost Revenue, Minor
Property Loss Property Loss
Significant
AM/FM/XM/TV
Critical communications
Interference
Interference/Interruption System I
Cell Phone
Automated Monetary
Interference
Transactions
Improper
of Airbag
Firing
Erroneou
RADAR,
Revision 3
Non-Compliance (continue
Fortunately, industry is well regulated and standa comprehensive
Major EMC issues are relatively rare
For cost-effective compliance
- EMC considered throughout product/system developm
Revision 3
Concepts
&
Definitions
Revision 3
Concepts & Definitions

Electromagnetic Interference (EMI)
Electromagnetic emissions from a device or system th interfere with the normal
operation of another device
Also referred to as Radio Frequency Interference (RFI
Electromagnetic Compatibility (EMC)
The ability of equipment or system to function satisfa its Electromagnetic

Environment (EME) without introd intolerable electromagnetic disturbance to
anything in environment
In other words:
Tolerate a specified degree of interference,
Not generate more than a specified amount of interfe Be self-compatible
Revision 3
Concepts & Definitions, Contin

For an EMC problem to exist:
System/Device that generates interference
System/Device that is susceptible to the interference
Coupling path
Coupling Path
System/Device
System/Dev
that generates
that is
interference
susceptible
Conducted
Radiated
Interferenc
(Culprit)
Power Lines
Magnetic
(Victim)
Signal Lines
Electric
Mitigation of EMC Issues

Plane Wave
Reduce interference levels generated by culprit

Increase the susceptibility (immunity) threshold of the
Reduce the effectiveness of the coupling path
Combination of the above
Source (Culprit)
Coupling Path
Receiver (Victi
Modify Signal Routing

Increase Separation
Modify Signal Routi
Add Local Filtering

Shielding
Add Local Filtering
Operating Freq Selection

Reduce # of Interconnections
Operating Freq Sele
Freq Dithering
Filter Interconnections
Reduce Signal Level
Revision 3
Standards
Revision 3
Some of the Institutes tha Establish EMC

Standards
Federal Communication Commission (FCC)
US Military
European Union (EU)
Radio Technical Commission for Aeronautics (RTC
This lectures main focus is on EMC Fundamentals
Electro Static Discharge (ESD)

Direct Lightning Effects
Antenna Lead Conducted Emissions/Susceptibility
RF Radiation Safety
Revision 3
FCC Part 15
Conducted Emissions
Frequency
Quasi-Peak Limit
Average
(MHz)
(dBuV)
(dBu
Class A
0.15 0.5
79
66
0.5 - 30.0
73
60
Class B
0.15 0.5
66 to 56 *
56 to 4
0.5 5
56
46
5 - 30
60
50
*Decrease as logarithm of frequency
Revision 3
FCC Part 15
General Radiated Emission
Frequency
Field Strength Li
(MHz)
(uV/m)
Class A
30
88
90
88 216
150
(10 meters)
216
960
210
above 960
300
Class B
30
88
100
88 216
150
(3 meters)
216
960
200
above 960
500
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MIL-STD-461E
Requirements for the Control of EMI Characteristics of Subsystems & E
Reqt
Description
CE101
Conducted Emissions, Power Leads, 30 Hz to 10 kHz
CE102
Conducted Emissions, Power Leads, 10 kHz to 10 MHz
CE106
Conducted Emissions, Antenna Terminal, 10 kHz to 40 GHz
CS101
Conducted Susceptibility, Power Leads, 30 Hz to 50 kHz
CS103
Conducted Susceptibility, Antenna Port, Intermodulation, 15 kHz to 10 GHz
CS104
Conducted Susceptibility, Antenna Port, Rejection of Undesired Signals, 30 Hz to 20 G
CS105
Conducted Susceptibility, Antenna Port, Cross Modulation, 30 Hz to 20 GHz
CS109
Conducted Susceptibility, Structure Current, 60 Hz to 100 kHz
CS114
Conducted Susceptibility, Bulk Cable Injection, 10 kHz to 200 MHz
CS115
Conducted Susceptibility, Bulk Cable Injection, Impulse Excitation
CS116
Conducted Susceptibility, Dampened Sinusoidal Transients, Cables & Power Leads, 10
RE101
Radiated Emissions, Magnetic Field, 30 Hz to 100 kHz
RE102
Radiated Emissions, Electric Field, 10 kHz to 18 GHz
RE103
Radiated Emissions, Antenna Spurious and Harmonic Outputs, 10 kHz to 40 GHz
RS101
Radiated Susceptibility, Magnetic Field, 30 Hz to 100 kHz
RS103
Radiated Susceptibility, Electric Field, 10 kHz to 40 GHz
RS105
Radiated Susceptibility, Transient Electromagnetic Field
Revision 3
EU Standard Examples (Emiss
Standard
Description
EN50081-1
Generic emissions standard for residential, commercial and li
industrial environments.
EN50081-2
Generic emissions standard for industrial environment
EN55022
Limits and methods of measurement of radio disturbance
characteristics of information technology equipment
(Also known as CISPR-22)
EN55011
Industrial, scientific and medical (ISM) radio frequency equip
Radio disturbance characteristics - Limits and methods of
measurement
(Also known as CISPR-11)
EN55013
characteristics of broadcast receivers and associated equipme
EN55014-1
Emission requirements for household appliances, electric tool
similar apparatus
EN55015
characteristics of electrical lighting and similar equipment
EN61000-3-2
Limits for harmonic current emissions (equipment input curre
and including 16 A per phase)
EN61000-3-3
Limitation of voltage changes, voltage fluctuations and flicker
public low-voltage supply systems
Revision 3
EU Standard Examples (Immu
Standard
Description
EN61000-4-2
Electrostatic Discharge
EN61000-4-3
Radiated Susceptibility Test
EN61000-4-4
Electrical Fast Transient/Burst Test
EN61000-4-5
Surge Test
EN61000-4-6
Conducted Immunity Test
EN61000-4-8
Power Frequency Magnetic Test
EN61000-4-11
Voltage Dips and Interruptions Test
EN61000-6-1
Immunity for residential, commercial and light-industrial
environments
EN61000-6-2
Immunity for industrial environments
EN61547
Equipment for general lighting purposes EMC immunity
requirements
EN12016
Electromagnetic compatibility Product family standard for
escalators and passenger conveyors Immunity
Revision 3
Standard Example - RTCA

DO-160, Environmental Conditions & Test Procedures fo Equipment
Section
Title
Notes
16
Power Input
115 VAC, 28 VDC and 14
Voltage/frequency range,
surges
17
Voltage Spike
Power Leads
Up to 600 V or 2x Line V
18
Audio Frequency Conducted Susceptibility
0.01 - 150 kHz or 0.2 - 1
Power Inputs
19
Induced Signal Susceptibility
Interconnection Cabling
E field and H Field
400 Hz 15 kHz and spik
20
Radio Frequency Susceptibility (Radiated

Conducted: 0.01-400 MH
and Conducted)
Radiated: 0.1-2, 8 or 18
21
Emission of Radio Frequency
Power Lines: 0.15-30 MH
Interconnecting Cables:
Radiated: 2-6,000 MHz
22
Lightning Induced Transient Susceptibility
Pin & Bulk injection, Puls
Sine
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Standard Summary
Numerous EMC standards exists

Common Fundamental Theme
Conducted Emission Limits
Radiated Emission Limits
Conducted Susceptibility (Immunity) Limits
Radiated Susceptibility (Immunity) Limits
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Design Guidelines
and
Methodology
Revision 3
Electromagnetic Waves
Electromagnetic waves consist of two orthogonal f
Electric, E-Field (V/m)
Magnetic, H-Field (A/m)
Wave Impedance, ZW=E/H
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Electromagnetic Waves
E-Fields, high impedance, wire (dipole)
H-Fields, low impedance, current loops (xformer)
In far field, all waves become plane waves
d>2
Far Field for a Point Source
4 107
H
=120 = 377
36
10
Impedance of Plain Wave
Revision 3
Shielding
Enclosure/Chassis
Mechanical Structure
Thermal Path
Can form an overall shield (important EMC componen
Can be used as first line of defense for Radiated emission/susceptibility
Some Applications Cannot Afford Overall Shield

Rely of other means of controlling EMC
Enclosure material
Metal
Plastic with conductive coating
(Conductive paint or vacuum deposition)
Revision 3
Shielding Illustration
Revision 3
Shielding Effectiveness
Shielding effectiveness (SE) is a measure of how enclosure attenuates

electromagnetic fields
SE = 20Log10
dB
E
Outside
EInside
Theoretical SE of homogeneous material

Reflective losses, R
Absorption losses, A and
Secondary reflective losses, B (ignore if A>8 dB)
SE = R + A + B SE = R + A
Revision 3
SE Equations
0.462
r
0136.r
R h = 20Log10
+
+ 0.354
r
fr
Magnetic Field
Reflective Loss
fr
r
r
2
Re = 354 - 10 Log10
Electric Field Reflective Loss
10
r f
Rp = 168 + 10 Log
Plane Wave
Reflective Loss
A = 0.003338t
Absorptive Los
where:
t = Material thickness (mils) r =

Material permeability rela r = Material
conductivity rela f = Frequency (Hz)
Revision 3
r = Source to shield
distance
SE Theoretical Examples
Freq
Aluminum (60 mils)
Cold Rolled Steel (60 mils)
Coppe
(Hz)
Magnetic
Electric
Plane
Magnetic
Electric
Plane
Magnetic
El
(dB)
(dB)
(dB)
(dB)
(dB)
(dB)
(dB)
(
10k
58
>200
141
125
>200
>200
45
>
100k
101
>200
165
>200
>200
>200
57
1
1M
>200
>200
>200
>200
>200
>200
74
1
10M
>200
>200
>200
>200
>200
>200
106
1
100M
>200
>200
>200
>200
>200
>200
184
1
1G
>200
>200
>200
>200
>200
>200
>200
>
r=12
r = 1 (Aluminum), 180 (Cold Rolled Steel), 1 (Copper)
r = 0.6 (Aluminum), 0.17 (Cold Rolled Steel), 1 (Coppe
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SE Practical Consideration
SE is typically limited by apertures & seams
Removable Covers
Holes for control/display components
Holes for ventilation
Holes for connectors
Mitigation of apertures and seams
Minimize size and number of apertures and seams

Use gaskets/spring-fingers to seal metal-to-metal inte
Interfaces free of paint and debris

Adequate mating surface area
Avoid Galvanic Corrosion
Use of EMI/conductive control/display components
Revision 3
Holes/Apertures d>t
Single
Hole
M
ul
ti
If
2
SE 0dB
d
If s < 2 >
<d
If
>d
SE
20L
og10
SE 20Log
2d
where:
t = Material thickness n = Number of Holes
s = edge to edge hole spacing
Notes:
d is the longest dimension of the hole.
Maximum SE is that of a solid barrier without aperture.
Revision 3
Holes/Apertures d<t (w<
Behaves
like a waveguide below cu
Absorption factor of WG below c
c = 2w
Cutoff
waveleng
th
c
f
=
2
=
For frequencies well below cutof
t
Absorption loss
t/w
Lo
A =8.686t = 27.3 w
>
6
1
2
5
4
1
Revision 3
Enclosure Seams
SE can be limited by the failure of seams to make contact

Contact area must be conductive
Adequate cross-section of overlap
Adequate number of contact points
Gasketing helps ensure electrical contact between
Revision 3
Gasketing Examples
Fingerstock
(100 dB @ 2GHz)
Large Selection (shape, size, plati

Wide mechanical compression ran
High shielding effectiveness

Good for frequent access applicat
No environmental seal
Oriented Wire
(80 dB @ 2GHz)
Provides both EMI and Moisture S
Lower SE than all-metal gaskets

Sponge or Solid Silicone, Aluminu
Mechanically versatile die cut
Conductive Elastomers
(80 d
Provides both EMI and Moisture S
Lower SE than all-metal gaskets

Mechanically versatile die cut or
Courtesy of Tecknit
Revision 3
Panel Components
Air
Ventilation
Panels
EMC
S
Shielded
Windows
Courtesy of Tecknit
Revision 3
Galvanic Series
Galvanic
Corrosion
-Two dissimilar metals in electrical contact in presence o electrolyte
Revision 3
Galvanic Series Table

Metallurgical Category
Gold, Wrought Platinum, Graphite Carbon
Rhodium Plating
Silver, High-Silver Alloys
Nickel, Nickel-Copper Alloys, Titanium, Titanium Alloys, Monel
Beryllium Copper, Low Brasses or Bronzes, Silver Solder, Copper, Ni-Cr Alloys, Austenitic Corrosion-Resistant Steels, M Moly Steels, Specialty High-Temp Stainless
Steels
Commercial Yellow Brasses and Bronzes
High Brasses and Bronzes, Naval Brass, Muntz Metal
18% Cr-type Corrosion Resistant Steels, Common 300 Series Stainless Steels
Chromium or Tin Plating, 12% Cr type Corrosion Resistant Steels, Most 400 Series Stainless Steels
Tin-Lead Solder, Terneplate
Lead, High-Lead Alloys
Wrought 2000 Series Aluminum Alloys
Wrought Gray or Malleable Iron, Plain Carbon and Low-Alloy Steels, Armco Iron, Cold-Rolled Steel
Wrought Aluminum Alloys (except 2000 series cast Al-Si alloys), 6000 Series Aluminum
Cast aluminum Alloys (other than Al-Si), Cadmium Plating
Hot-Dip Galvanized or Electro-Galvanized Steel
Wrought Zinc, Zinc Die Casting Alloys
Wrought and Cast Magnesium Alloys
Beryllium
Revision 3
Galvanic Series Notes

For harsh environments
Outdoors, high humidity/salt
Typically design for < 0.15 V difference
For normal environments

Storage in warehouses, no-temperature/humidity cont
Typically < 0.25 V difference
For controlled environments
Temperature/humidity controlled
Typically design for < 0.50 V difference
Mitigation of Galvanic Corrosion

Choosing metals with the least potential difference
Finishes, such as MIL-C-5541, Class 3 using minimal d
Plating
Insulators, as electrically/thermally appropriate
Revision 3
System Partitioning/Guideli
Minimize interconnections between WRAs/LRUs

Minimize the distribution of analog signals
Control interference at the source
Potential
Potential
Potential
Culprit
Victim
Victim
Victim
Power Bus
Signals
Revision 3
Control Interference at the So
Preferred Approach Shield/Filter the Source (Cul
Potential
Culprit
Potential
Potential
Power Bus
Victim
Victim
Victim
Signals
Alternate Approach Shield/Filter Potential Receiv
Potential
Potential
Potential
Culprit
Victim
Victim
Victim
Power Bus
Signals
Revision 3
CCA Layout and Partitionin
Layout is 3 Dimensional
Component placement (X & Y)
Signal and Power Routing (X & Y)
PWB Stack Up (Z)
Dedicate layer(s) to ground
Forms reference planes for signals

EMI Control (high speed, fast slew rate, critical analog
Simpler impedance control
Dedicate layer(s) to Supply Voltages

In addition to dedicated ground layers
Low ESL/ESR power distribution
Revision 3
One and Two Layer
Signals, Grounds, Supplies
Dielectric
Signals, Ground, Supplies
One Sided
Dielectric
Ground Plane
Two Sided
Inexpensive
Difficult to control EMI wi external shield

Difficult to control imped
Inexpensive (slightly mo sided)
EMI mitigation with grou
Impedance control simpl ground

plane
Revision 3
Radiation Example, 50 MHz C

E-Field
E-Field
Probe
Probe
Adding plane re
emissio fundam
PWB: 2 x 6 Trace: 5 x 0. E-Field Probe (Emco 7405-0 Source: 50 M 3 Vp
No Ground Plane
With Ground Plane
(Micro-Strip)
Revision 3
Multi-Layer Stack Up Examp

1
3
Signal
Ground Plane
Signal
Signal
Signal
Ground Plane
Supply Plane
Signal
Signal
Ground Plane
Supply Plane
Signal
Signal
Ground Plane
Signal
Signal
High Density
High Speed Digital PWB
High Speed Digital PWB
Ten Layers
Moderate Density
Six Layers

Two Micro-Strip
Strip-Line Routing
Two Micro-Strip
Routing Layers
Routing Layers
Routing Layers
Single Supply Plane
Layers
Two Buried Micro-Strip
Four Asymmetrical
Single Supply Plane
Two Sided
Two Micro-St
Four Asymme Routing

Laye
Two Sided
Single Digital
Analog suppli
Mixed Analog/RF/
Routing Cle
Moderate Den
Improved is
Ten Layers
Two Sided
Revision 3
PWB Example
Three
Channel, L-Band VME Receiver
- Shield removed for clarity

VME I
IF Processing
Video
ADCs
FPGA &
Support
Logic
High Speed
Digital I/O
Revision 3
CCA Level Shielding

Used in conjunction with PWB ground plane(s)
Supplement shielding of overall enclosure or inste overall enclosure
Isolate sections of CCA
Local Oscillators, Front Ends, High Speed Digital,
Low Level Analog (audio, video)
Metalized Plastic
Shield Examples
Metal CCA Shield
Examples
Courtesy of Leader Tech
Courtesy of Mueller
Revision 3
COTS Power Supply Selecti

(AC/DC Power Converters)
EMC Selection Considerations

AC Input EMC Specification Compliance
Radiated emission/immunity compliance
Open frame, enclosed, stand-alone
Hold-Up Time
DC to AC Noise Isolation
DC to DC Noise Isolation (Multi-output)
DC to DC Galvanic Isolation (Multi-output)
Non-EMC Selection Considerations

Safety compliance
Size & weight
Efficiency
Line/Load/Temperature Regulation
Operating/Storage Temperature Ranges
Revision 3
DC/DC Converter Design/Sele

Small Converters at CCA Level
Local regulation in critical applications
Generate unavailable voltages (3.3 to 1.25 VDC for FP
Many complete COTs solutions available (Vicor, Interp
Many discrete solutions available (Linear Tech, Nation
Linear
Inherently Quiet
Provide noise isolation, input to output
Typically much less efficient (depends on VIn-VOut diffe
Three terminal devices provide no Galvanic isolation
Switching
Can be configured for Galvanic isolation
Typically noisier than Linear (however mitigation optio
Pulse Width Modulation, Controlled di/dt and dV/dt

Pulse Width Modulation, Spread Spectrum
Resonant mode (zero current switching)
Revision 3
PWM, Controlled Transition, Spread Spe
Linear
Standard
Con
PWM
Tra
Tim
Technology LT1777 (Controlled di/dt & dV/d
Linear
Fixed
Spr
Frequency
Spe
Technology LTC3252 (Spread spectrum 1.0-
PWM
PW
Revision 3
PWM, Resonant Mode Compa

Resonant Mode Vs PWM
48 VDC Input, 5 VDC Output
100 kHz to 30 MHz, Input Noise
Revision 3
Power Distribution System
AC/DC
DC Power Bus (Single Voltage)
Power Converter
System AC
DC/DC
DC/DC
DC/DC
DC/DC
Converter
Converter
Converter
Converter
Load
Power
Load
Load
Load
Power
AC/DC
DC Power Supply (Multiple Voltages)
Load
Load
Load
Load
Power Converter
Distributed
One Primary
System AC
Multiple Seco Converters a
Direct DC
Typical Applic Large ground
One Primary for all loads

Typical Applic Home
Compu
AC/DC
Load(s)
Power Converter
System AC
Power
DC Power
(Multiple
Voltages)
Load(s)
Power Converter
AC/DC
System AC
DC Power
Power
(Multiple
Voltages)
Power Converter
AC/DC
System AC
DC Power
Load(s)
Voltages)
Revision 3
Power
Separate P
(Multiple
One AC/DC C
Typical Applic RADAR

Syste multiple unit
Power Distribution Exampl
AN/APS-147 LAMPS RADAR

(Separate Primary Distribution)
Multiple Access
Beamforming
Equipment
(Distributed DC)
Courtesy of Dell
Personal Computer
(Direct DC Distribution)
Revision 3
Power Distribution Compari

Architecture
Load
Load
Power
Load
Notes
Ground
Reg
Effic
Iso
Loops
Distributed
+
+
+
Only one Converte
DC
exposed to input.
Direct
May not be practic
+
systems with heav
DC
demands and/or ti
regulation require
Separate
x
x
+
x
Primary
Legend:
+ Advantage - Disadvantage x Neutral
Revision 3
Signal Distribution
Avoid routing analog signals over long distances i environments, but if

unavoidable:
Differential
Amplify at source and attenuate/filter at destination
Inter-Unit (LRU or WRA)

Digital preferred over analog
Differential preferred over single ended

Minimize number of interconnects
Revision 3
Cable Shields
Shields of external interconnecting cables
Essentially extensions of the chassis enclosure
Shielding Effectiveness and Transfer Impedance

Properties of material
Degree of coverage
Geometry
Shields are an important part of EMC design, espe systems that require
compliance to EMP and/or In Lightning Effects
Revision 3
Cable Shield Termination

Maintaining quality SE and Transfer Impedance de effective termination of
shields at both ends
360 Degree Backshells
If high frequency isolation is
needed, avoid using long leads to terminate shields
Coax Shield Ter
Excessive Lea
Unassembled 360
Circular D38999 Mil
Exploded View of
Degree Backshell for D

Connector with 360
Backshell for D389
Connector
Degree Backshell
Revision 3
Shield Example
95% Coverage Double Copper Shield
Shielding Effectiveness
Frequency
Xer Z
Magnetic
Electric
Plane
(Hz)
(/m)
Wave
(dB)
(dB)
(dB)
1k
0
100
100
10 k
16
100
100
0.0080
100 k
36
100
100
0.0080
1M
70
100
100
0.0014
10 M
90
90
90
0.0011
100 M
90
90
90
0.0060
1G
80
80
80
10 G
60
60
60
Revision 3
Transfer Impedance Examp

Z
T
V
i
( per me
Is
CS116 of MIL-STD-461E Example

10 A at 10 MHz
IS
Transfer Impedan
Vi = Is ZT l = (10 A) 0.0011
Induced Voltage of 22 mV i damage/upset threshold o
families.
Revision 3
Coupling Example #1, 0.3-200

Two Parallel Lines, One shielded, One unshielded
0.5 Over Ground Plane, 10 Long, Separated by 2
Shielded Line has 0.5 exposed
Both ends of shield

Both ends of shield grounded
Both shielded
ungrounded
with 3 loop (60 nH)
with 1 l
Both ends of shield directly grounded
Revision 3
Coupling Example #2, 0.3-200

Two Parallel Lines, One shielded, One unshielded
0.5 Over Ground Plane, 10 Long, Separated by 0.5
Shielded Line has 0.5 exposed
Both ends of shield

Both ends of shield grounded
Both shielded
ungrounded
with 3 loop (60 nH)
with 1 l
Both ends of shield directly grounded
Revision 3
Filter Connectors
Applications for connectors with integral filtering an transient suppressors
Shields not permitted on interconnection cables
Isolation needed between assemblies (WRAs, LRU
Filtering effectiveness is typically much better than filters

Parasitics
Interconnection Coupling
(between filter & connector)
Courtesy of G&H Technology
Revision 3
Discrete Filter vs. Filter Conn

Portable RADAR System, I/O Cables Unshielded
RADAR Headset cable interferes with 100 - 200 MH Communication band
Baseline
Discrete LC Filter at
Filter C
Connector
(1nH, 8
(1nH, 8200p)
Revision 3
Signal Spectra & Filter Conne

Come in many types and filter capabilities
Filter Topologies: Pi, C, LC
Various cutoff frequencies
In some cases, not larger than standard non-filtered v
Selection Considerations
Spectrum of Signals
- Source/Sink Capability of Driver

A(f)
Frequency Dom
- Source/Load Impedances
20 dB/Decade
- Cable effects
40 dB/Deca
Time Domain
f1f2
Typical 50 MHz Clock

A(t)
tw
f=
Time
1
tr
tf
=15.
(20ns)
(2 ns + 2ns)
t +t
r
Revision 3
EMC Design Process
Revision 3
Design Process
Starts with a System/Device Specification
Describes the applicable EMC Requirement(s)
Develop and Implement an EMC Control Plan

Details EMC Requirements and clarifies interpretation
Lists applicable documents
Defines management approach
Defines the design procedures/techniques

EMC design is most efficiently accomplished when con early in the program
Process Example
Intended for large system
Can easily be tailored for smaller system or a single d
Revision 3
EMC Design Flow Diagram

Specification
System/Device
EMC Engineer may need to be involved wi specification prior to contract award.
Generate
Cull EMC Requirements from System/Dev and clarifies interpretation

Summarize applicable documents, specifi standards
EMC/EMI
EMC Program Organization and Responsi
Defines design procedures and technique
Control Plan
Mechanical Design
Electrical Design System Desig
Chassis/
Enclosure
Revision 3
Shielding
Material Selection
Bonding
Gasketing
Hardware
Covers
PWB Layout
Partitioning and
Power
and
Conversion and
Grounding
Location
Construction
Distribution
and
Conversion Topology
Ground
allocation
Number of layers
Linear, Resonant,
Single vs. Multi Point
Chassis component
System functional
Separation of analog,
Micro-strip, stripline
Ground layers
RF, digital and power

PWM
Filter/Non-Filter
L
F
bonding
RF, digital and power

Separation of analog,
Connector Selection
Filter location/type
Typical EMC Engineers Involvem
Prepare EMC Section of Proposal Pre-A
Contract/SOW Review and Recommendations
Interference Prediction
Design Testing
Interference Control Design
Preparation of EMC Control Plan
Subcontractor and Vendor EMC Control

Internal Electrical and Mechanical Design Reviews
EMC Design Reviews with the Customer
Interference Testing of Critical Items
Amend the EMC Control Plan, as Necessary
Liaison with Manufacturing
Manufa
In-Process Inspection During Manufacturing

Preparation of EMC Test Plan/Procedure
Performance of EMC Qualification Tests

Redesign and Retest where Necessary
Preparation and Submittal of EMC Test Report or Declaratio
Revision 3
References
Revision 3
References
New Dimensions in Shielding, Robert B. Cowdell, IEE Transactions on
Electromagnetic Compatibility, 1968 M
Alleviating Noise Concerns in Handheld Wireless Produ Armstrong, Power
Electronics Technology, 2003 Octob
Electromagnetic Compatibility Design Guide, Tecknit

Metals Galvanic Compatibility Chart, Instrument Spe
EMI Shielding Theory, Chomerics
Shield that Cable!, Bruce Morgen, Electronic Products August 15

Interference Coupling - Attack it Early, Richard J Moh Electronic Design News,
1969 July
Simplified Method of Analyzing Transients in Interfere Prediction H.L. Rehkopf,
Presented at the Eighth IEEE Symposium of EMC, San Francisco, CA, 1966
Electronic Systems Failures & Anomalies Attributed to
NASA Reference Publication 1374
Revision 3
Committees and Organizati
Comit Internationale Spcial des Perturbations Radioelectrotechnique (CISPR)

Federal Communication Commission (FCC), www.FCC.g
European Union, www.Europa.eu.int

Radio Technical Commission for Aeronautics (RTCA) www.RTCA.org
National Association of Radio & Telecommunications En (NARTE), www.NARTE.org
Revision 3
Gasket and Shielding Vend
www.Chomerics.com
www.LairdTech.com
www.Tecknit.com
www.Spira-EMI.com
www.WaveZero.com
www.LeaderTechInc.com
Revision 3
Backshell Vendors
www.SunBankCorp.com
www.TycoElectronics.com
Revision 3
Filter Connector Vendors
www.GHtech.com
www.SpectrumControl.com
www.Amphenol-Aerospace.com
www.EMPconnectors.com
www.Sabritec.com
Revision 3

Emc Design Fundamentals

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EMC Design

EMC Certified by NARTE

Telephonics - Command Systems Division

Concepts & Definitions

Design Guidelines and Methodology

Copyright Telephonics 2003-2005

Copyright Telephonics 2003-2005

Increase use of electronic devices

Increased potential for susceptibility/emissions

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Problems with Non-Complia

Lost Revenue, Minor

Property Loss Property Loss

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Concepts & Definitions

Also referred to as Radio Frequency Interference (RFI

Electromagnetic Compatibility (EMC)

The ability of equipment or system to function satisfa its Electromagnetic

Copyright Telephonics 2003-2005

Concepts & Definitions, Contin

Mitigation of EMC Issues

Reduce interference levels generated by culprit

Combination of the above

Modify Signal Routing

Add Local Filtering

Operating Freq Selection

Operating Freq Sele

Reduce Signal Level

Copyright Telephonics 2003-2005

Copyright Telephonics 2003-2005

Some of the Institutes tha Establish EMC

Electro Static Discharge (ESD)

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*Decrease as logarithm of frequency

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General Radiated Emission

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Conducted Susceptibility, Structure Current, 60 Hz to 100 kHz

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EU Standard Examples (Emiss

characteristics of information technology equipment

(Also known as CISPR-22)

Radio disturbance characteristics - Limits and methods of

(Also known as CISPR-11)

characteristics of broadcast receivers and associated equipme

characteristics of electrical lighting and similar equipment

and including 16 A per phase)

public low-voltage supply systems

Copyright Telephonics 2003-2005

EU Standard Examples (Immu

escalators and passenger conveyors Immunity

Copyright Telephonics 2003-2005

Standard Example - RTCA

115 VAC, 28 VDC and 14

E field and H Field

400 Hz 15 kHz and spik

Radio Frequency Susceptibility (Radiated