TC1072 50ma Cmos Ldo With Shutdown, Error Output and V Bypass
TC1072 50ma Cmos Ldo With Shutdown, Error Output and V Bypass
TC1072 50ma Cmos Ldo With Shutdown, Error Output and V Bypass
PRELIMINARY INFORMATION
TC1072
TC1072
50mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS
FEATURES
APPLICATIONS
CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is
typically 50A at full load (20 to 60 times lower than in bipolar
regulators!).
TC1072 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage (typically 100mV at full load) and internal feed-forward compensation for fast response to step changes in load. An error
output (ERROR) is asserted when the TC1072 is out-ofregulation (due to a low input voltage or excessive output
current). ERROR can be used as a low battery warning or as
a processor RESET signal (with the addition of an external
RC network). Supply current is reduced to less than 1A,
and both VOUT and ERROR are disabled when the shutdown
input is low. The TC1072 incorporates both over-temperature and over-current protection.
The TC1072 is stable with an output capacitor of only
1F and has a maximum output current of 50mA. For higher
output current versions, please see the TC1107, TC1108
and TC1073 (IOUT = 300mA) data sheets.
ORDERING INFORMATION
Output
Voltage **(V) Package
Junction
Temp. Range
GENERAL DESCRIPTION
Part No.
TC1072-2.5VCH
2.5
TC1072-2.7VCH
2.7
TC1072-3.0VCH
3.0
TYPICAL APPLICATION
TC1072-3.3VCH
3.3
TC1072-5.0VCH
5.0
1M
VIN
VOUT
VIN
VOUT
1F
PIN CONFIGURATION
2
GND
TC1072
Bypass
ERROR
TC1072
(SOT-23A-6*)
ERROR
VIN
TC1072-01
6/16/97
4
SHDN
Shutdown Control
(from Power Control Logic)
TOP VIEW
GND SHDN
PRELIMINARY INFORMATION
TC1072
ABSOLUTE MAXIMUM RATINGS*
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise specified.BOLDFACE type specifications apply for junction temperatures of
40C to +125C.
Symbol
Parameter
VIN
IOUTMAX
VOUT
TC VOUT
VOUT/VIN
VOUT/VOUT
Line Regulation
Load Regulation
VIN VOUT
IGND
IIN
IINSD
PSRR
IOUTSC
VOUT/PD
eN
Test Conditions
Note 1
Note 2
Min
Typ
Max
Units
50
VR 2.5%
VR 0.5%
40
0.05
0.5
6.5
VR + 2.5%
V
mA
V
ppm/C
%/V
%
5
65
95
mV
0
50
64
200
0.04
260
0.05
450
A
A
A
dB
mA
%/W
nV/Hz
45
15
%VIN
%VIN
SHDN Input
VIH
VIL
TC1072-01
6/16/97
PRELIMINARY INFORMATION
TC1072
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
1.0
0.95 x VR
50
400
V
mV
V
mV
NOTES: 1. VR is the regulator output voltage setting. VR = 2.5V, 2.7V, 3.0V, 3.2V, 3.3V, 3.8V 5.0V.
2. TC VOUT = (VOUTMAX VOUTMIN) x 106
VOUT x T
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load
current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD).
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
8. Hysteresis voltage is referenced by VR.
PIN DESCRIPTION
Pin No.
(SOT-23A-6)
Symbol
1
2
3
VIN
GND
SHDN
ERROR
5
6
Bypass
VOUT
TC1072-01
6/16/97
Description
Unregulated supply input.
Ground terminal.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this
input. The regulator enters shutdown when a logic low is applied to this input. During
shutdown, output voltage falls to zero and supply current is reduced to 0.05 microamp
(typical).
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-oftolerance by approximately 5%.
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Regulated voltage output.
PRELIMINARY INFORMATION
TC1072
DETAILED DESCRIPTION
The TC1072 is a precision fixed output voltage regulator. (If an adjustable version is desired, please see the
TC1070 or TC1071 data sheets.) Unlike the bipolar regulators, the TC1072 supply current does not increase with load
current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in
RTC and CMOS RAM battery back-up applications).
Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or
above VIH, and shutdown (disabled) when SHDN is at or
below VIL. SHDN may be controlled by a CMOS logic gate,
or I/O port of a microcontroller. If the SHDN input is not
required, it should be connected directly to the input supply.
While in shutdown, supply current decreases to 0.05A
(typical) and VOUT falls to zero volts and ERROR is opencircuited.
1F
BATTERY
ERROR
VIH
VOL
Output Capacitor
A 1F (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective
series resistance of 5 or less, and a resonant frequency
above 1MHz. A 1F capacitor should be connected from VIN
to GND if there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is used as
the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately 30C, solid tantalums
are recommended for applications operating below 25C.)
When operating from sources other than batteries, supplynoise rejection and transient response can be improved by
increasing the value of the input and output capacitors and
employing passive filtering techniques.
1F
C1
GND
Bypass
TC1072
C3, 470pF
V+
SHDN
Shutdown Control
(to CMOS Logic or Tie
to VIN if unused)
ERROR
C2 Requires Only
if ERROR is used as a
Processor RESET Signal
(See Text)
R1
1M
0.2F
C2
HYSTERESIS (VHYS)
VTH
VOUT
VOUT
VIN
VOUT
BATTLOW
or RESET
Bypass Input
Figure 1. Typical Application Circuit
6/16/97
Thermal Considerations
Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator
remains off until the die temperature drops to approximately
150C.
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current.
4
PRELIMINARY INFORMATION
TC1072
The following equation is used to calculate worst case
actual power dissipation:
= (125 55)
220
PD (VINMAX VOUTMIN)ILOADMAX
Where:
PD
VINMAX
VOUTMIN
ILOADMAX
= 318mW
In this example, the TC1072 dissipates a maximum of
only 60mW; far below the allowable limit of 318mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit.
Equation 1.
Find:
TC1072-01
6/16/97
PRELIMINARY INFORMATION
TC1072
a & b = part number code + temperature range and voltage
SOT-23A-6
TC1072 (V)
2.5
2.7
3.0
3.3
5.0
Code
E1
E2
E3
E4
E6
PACKAGE DIMENSIONS
SOT-23A-6*
.069 (1.75)
.059 (1.50)
.118 (3.00)
.102 (2.60)
.020 (0.50)
.014 (0.35)
.037 (0.95)
REFERENCE
.118 (3.00)
.110 (2.80)
.057 (1.45)
.035 (0.90)
.008 (0.20)
.004 (0.09)
10 MAX.
.006 (0.15)
.000 (0.00)
.022 (0.55)
.014 (0.35)
Sales Offices
TelCom Semiconductor
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 415-968-9241
FAX: 415-967-1590
E-Mail: liter@c2smtp.telcom-semi.com
TC1072-01
6/16/97
TelCom Semiconductor
Austin Product Center
9101 Burnet Rd. Suite 214
Austin, TX 78758
TEL: 512-873-7100
FAX: 512-873-8236
6
PRELIMINARY INFORMATION
TC1073
TC1073
100mA CMOS LDO WITH SHUTDOWN, ERROR OUTPUT AND VREF BYPASS
FEATURES
GENERAL DESCRIPTION
APPLICATIONS
TYPICAL APPLICATION
ORDERING INFORMATION
1M
Part No.
VIN
VOUT
VIN
VOUT
1F
GND
TC1073
Bypass
5
CBYPASS
470pF
Output
Voltage**
Package
Junction
Temp. Range
TC1073-2.5VCH
2.5V
TC1073-2.7VCH
2.7V
TC1073-3.0VCH
3.0V
TC1073-3.3VCH
3.3V
TC1073-5.0VCH
5.0V
NOTE:
4
SHDN
ERROR
ERROR
PIN CONFIGURATION
VOUT Bypass ERROR
6
Shutdown Control
(from Power Control Logic)
TC1073
(SOT-23A-6*)
1
VIN
TOP VIEW
GND SHDN
TelCom Semiconductor reserves the right to make changes in the circuitry1and specifications ot its devices.
PRELIMINARY INFORMATION
TC1073
ABSOLUTE MAXIMUM RATINGS*
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1mA, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise noted.
Symbol
Parameter
Test Conditions
VIN
IOUTMAX
VOUT
TC VOUT
Note 9
Note 9
Notes 1, 9
Note 2, 9
VOUT/VIN
VOUT/VOUT
Line Regulation
Load Regulation
VIN VOUT
IGND
IIN
IINSD
ROUT
PSRR
IOUTSC
VOUT/PD
TSD
TSD
eN
IL = IOUTMAX
470pF from Bypass to GND
Min
Typ
Max
Units
100
VR 2.5%
VR 0.5%
20
40
0.05
0.5
6.5
VR + 2.5%
V
mA
V
ppm/C
%
%
20
70
100
200
mV
100 x VR
0
50
160 x VR
64
300
0.04
160
10
260
80
0.05
500
A
A
A
k
dB
mA
%/W
C
C
nV/Hz
45
15
%VIN
%VIN
SHDN Input
VIH
VIL
TC1073-01 6/5/97
PRELIMINARY INFORMATION
TC1073
ELECTRICAL CHARACTERISTICS: VIN = VOUT + 1V, IL = 0.1A, CL = 3.3F, SHDN > VIH, TA = 25C, unless otherwise noted.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
1.0
0.95 x VR
50
400
V
mV
V
mV
NOTES: 1. VR is the regulator output voltage setting. (VR = 2.5V, 2.7V, 3.0V, 3.3V, 5.0V).
2. TC VOUT = (VOUTMAX VOUTMIN) x 106
VOUT x T
3. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load
range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the
thermal regulation specification.
4. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5. Ground pin current is the regulator pass transistor gate current. The total current drawn from the input supply is the sum of the load
current, ground current and supply current (i.e. IIN = ISUPPLY + IGND + ILOAD).
6. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
7. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. TA, TJ, qJA). Exceeding the maximum allowable power dissipation causes the device to
initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
8. Hysteresis voltage is referenced by VR.
9. Boldface type specifications apply for junction temperatures of 40C to +125C.
PIN DESCRIPTION
Pin No.
(SOT-23A-6)
Symbol
1
2
3
VIN
GND
SHDN
ERROR
5
6
Bypass
VOUT
TC1073-01 6/5/97
Description
Unregulated supply input.
Ground terminal.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05 microamp (typical).
Out-of-Regulation Flag. (Open drain output). This output goes low when VOUT is out-of-tolerance
by approximately 5%.
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Regulated voltage output.
PRELIMINARY INFORMATION
TC1073
DETAILED DESCRIPTION
The TC1073 is a precision fixed output voltage regulator. (If an adjustable version is desired, please see the
TC1070 or TC1071 data sheets.) Unlike the bipolar regulators, the TC1073 supply current does not increase with load
current. In addition, VOUT remains stable and within regulation at very low load currents (an important consideration in
RTC and CMOS RAM battery back-up applications).
Figure 1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or
above VIH, and shutdown (disabled) when SHDN is at or
below VIL. SHDN may be controlled by a CMOS logic gate,
or I/O port of a microcontroller. If the SHDN input is not
required, it should be connected directly to the input supply.
While in shutdown, supply current decreases to 0.05A
(typical) and VOUT falls to zero volts and ERROR is opencircuited.
1F
BATTERY
ERROR
VIH
VOL
Output Capacitor
A 1F (min) capacitor from VOUT to ground is recommended. The output capacitor should have an effective
series resistance of 5 or less, and a resonant frequency
above 1MHz. A 1F capacitor should be connected from VIN
to GND if there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is used as
the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately 30C, solid tantalums
are recommended for applications operating below 25C.)
When operating from sources other than batteries, supplynoise rejection and transient response can be improved by
increasing the value of the input and output capacitors and
employing passive filtering techniques.
1F
C1
GND
Bypass
TC1073
C3, 470pF
V+
SHDN
Shutdown Control
(to CMOS Logic or Tie
to VIN if unused)
ERROR
C2 Requires Only
if ERROR is used as a
Processor RESET Signal
(See Text)
R1
1M
0.2F
C2
HYSTERESIS (VHYS)
VTH
VOUT
VOUT
VIN
VOUT
BATTLOW
or RESET
Bypass Input
Figure 1. Typical Application Circuit
Thermal Considerations
Thermal Shutdown
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator
remains off until the die temperature drops to approximately
150C.
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current.
4
PRELIMINARY INFORMATION
TC1073
The following equation is used to calculate worst case
actual power dissipation:
= (125 55)
220
PD (VINMAX VOUTMIN)ILOADMAX
Where:
PD
VINMAX
VOUTMIN
ILOADMAX
= 318mW
In this example, the TC1073 dissipates a maximum of
only 60mW; far below the allowable limit of 318mW. In a
similar manner, Equation 1 and Equation 2 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by sustituting
the maximum allowable power dissipation of 318mW into
Equation 1, from which VINMAX = 5.9V.
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit.
Find:
TC1073-01 6/5/97
PRELIMINARY INFORMATION
TC1073
a & b = part number code + temperature range and voltage
MARKING
SOT-23A-6
TC1073 (V)
2.5
2.7
3.0
3.3
5.0
Code
F1
F2
F3
F4
F6
PACKAGE DIMENSIONS
SOT-23A-6*
.069 (1.75)
.059 (1.50)
.118 (3.00)
.102 (2.60)
.020 (0.50)
.014 (0.35)
.037 (0.95)
REFERENCE
.118 (3.00)
.110 (2.80)
.057 (1.45)
.035 (0.90)
.008 (0.20)
.004 (0.09)
10 MAX.
.006 (0.15)
.000 (0.00)
.022 (0.55)
.014 (0.35)
Sales Offices
TelCom Semiconductor
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, CA 94039-7267
TEL: 415-968-9241
FAX: 415-967-1590
E-Mail: liter@c2smtp.telcom-semi.com
TC1073-01 6/5/97
TelCom Semiconductor
Austin Product Center
9101 Burnet Rd. Suite 214
Austin, TX 78758
TEL: 512-873-7100
FAX: 512-873-8236
6