KANDLIKAR - 2012 - Heat Transfer and Microchannels
KANDLIKAR - 2012 - Heat Transfer and Microchannels
KANDLIKAR - 2012 - Heat Transfer and Microchannels
Overview of Presentation
Unresolved Issues
Rochester, NY
Rochester, NY
Toronto, Canada
Limerick, Ireland
Puebla, Mexico
Darmstadt, Germany
Pohang, South Korea
Montreal, Canada
Edmonton, Canada
Puerto Rico, USA
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Dongqing Li
Dongqing Li
Heat Transfer Applications in Lab-on-Chips
Yoav Peles
Enhancement through Mixing Techniques
Sushanta Mitra
Mixing in Adiabatic Microfluidics
Satish Kandlikar
Enhancement through Roughness
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Highlights of ICNMM2011
Boiling Enhancement
Highlights of ICNMM2011
Surface treatments
Diffusion/Mass Transfer
Diffusion measurement using microscale experimental techniques Mitra, U. Alberta
Microscopic freezing phenomena of small droplets in Fuel Cell application
Chikahisa, Japan
Microfluidics
Oxcillators in microchannels El-Genk, N.Mexico
Freezing of water droplets on surfaces Amirfazli, Alberta
Microcoolers using Joule-Thompson effect Takata, Japan
Gas Flow
Gas flow simulation Colin (INSA-Toulouse, France, Duan Waterloo, Canada, Croce,
Udine, Italy. Kamali, Shiraz U., Iran)
Application to modeling gas flow through filters, microfilter model, Schneider,
Waterloo
Roughness effects in gas flow (Faghri, RI, Ueno, Japan, Kandlikar RIT and Yang,
Taiwan)
Gas flow inmicrotubes (Morini, Italy, Kandlikar, RIT and Yang, Taiwan)
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Molecular film for pressure measurement in gas flow, (Matsuda/Nimi Japan)
Highlights of ICNMM2011
Single Phase Enhancement
Application
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STATUS SNAPSHOT
ELECTRONICS COOLING
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Early Pioneers
IBM Physicist,
IEEE Fellow.
Studied physical limits
in electronic systems
Courtesy
Prof. R. F. W. Pease
Stanford University
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Courtesy
Prof. R. F. W. Pease
Stanford University
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STATUS SNAPSHOT
APPLICATIONS
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No reproduction or distribution
without express written
permission of Intellectual
Ventures
Courtesy
Dr. David Tuckerman
Intellectual Ventures
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Publications: 1991-2011
Single-Phase Liquid and Gas Flow
1st ICMM
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Enhancement Techniques
Colgan et al. (2005) developed a microcooler
removing a heat flux of 800 W/cm2 and a heat
transfer coefficient of >500,000 W/m2 C.
Complex header arrangement and high pressure
gradient limit its usage across other applications.
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Publications: 1993-2011
Microchannel Flow Boiling
1st ICMM
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Research Needs/Opportunities
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ASME
HTD / FED/ ICNMM 2012
JULY 8 12
PUERTO RICO, USA