C565 - Cl05a106mq5nunc
C565 - Cl05a106mq5nunc
C565 - Cl05a106mq5nunc
Samsung P/N:
CL05A106MQ5NUNC
Description :
Series
CL
05
106
Size
Dielectric
X5R
Capacitance
Capacitance
L: 1.0 0.2
Rated Voltage
6.3 V
Thickness
0.5 0.2
mm
0.5 0.2
W:
Inner electrode
Ni
Termination
Cu
Plating
Sn 100%
10
20 %
tolerance
mm
mm
(Pb Free)
Product
Special
Packaging
Tan (DF)
0.125 max.
Insulation
Test condition
110%
0.50.1Vrms
Rated Voltage
60~120 sec.
Resistance
10,000Mohm or 50Mohm
Whichever is Smaller
Appearance
Withstanding
No dielectric breakdown or
Microscope (10)
250% of the rated voltage
Voltage
mechanical breakdown
Temperature
X5R
Characteristics
Adhesive Strength
of Termination
terminal electrode
Bending Strength
Capacitance change :
Solderability
SnAg3.0Cu0.5 solder
is to be soldered newly
2455, 30.3sec.
(preheating : 80~120 for 10~30sec.)
Resistance to
Capacitance change :
Soldering heat
within 7.5%
Judgement
Vibration Test
Capacitance change :
within 5%
Capacitance change :
Resistance
Tan
IR :
Amplitude : 1.5mm
From 10 to 55 (return : 1min.)
2hours 3 direction (x, y, z)
0.25 max
3.5 or Over
High Temperature
Capacitance change :
Resistance
Tan
IR :
Test condition
0.25 max
7 or Over
Temperature
Capacitance change :
Cycling
within 15%
1 cycle condition
Min. operating temperature
25
25
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.