MLX90614 Rev001 PDF
MLX90614 Rev001 PDF
MLX90614 Rev001 PDF
Ordering Information
Table of Contents
1 Functional diagram .....................................................................................................................................1
2 General Description ....................................................................................................................................1
General description (continued) .....................................................................................................................2
3 Glossary of Terms ......................................................................................................................................4
4 Maximum ratings ........................................................................................................................................4
5 Pin definitions and descriptions...................................................................................................................5
6 Electrical Specifications ..............................................................................................................................6
6.1 MLX90614Axx......................................................................................................................................6
6.2 MLX90614Bxx......................................................................................................................................8
7 Detailed description ..................................................................................................................................10
7.1 Block diagram ....................................................................................................................................10
7.2 Signal processing principle.................................................................................................................10
7.3 Block description ................................................................................................................................11
7.3.1 Amplifier ......................................................................................................................................11
7.3.2 Supply regulator and POR ...........................................................................................................11
7.3.3 EEPROM.....................................................................................................................................11
7.3.4 RAM ............................................................................................................................................13
7.4 SMBus compatible 2-wire protocol......................................................................................................13
7.4.1 Functional description ..................................................................................................................13
7.4.2 Differences with the standard SMBus specification (reference [1]) ................................................14
7.4.3 Detailed description .....................................................................................................................14
7.4.4 AC specification for SMBus..........................................................................................................15
7.4.5 Bit transfer ...................................................................................................................................16
7.4.6 Commands ..................................................................................................................................16
7.4.7 Sleep Mode .................................................................................................................................17
7.5 PWM..................................................................................................................................................18
7.5.1 Single PWM format ......................................................................................................................18
7.5.2 Extended PWM format .................................................................................................................19
7.5.3 Customizing the temperature range for PWM output ....................................................................20
7.6 Switching Between PWM and SMBus communication ........................................................................21
7.6.1 PWM is enabled...........................................................................................................................21
7.6.2 Request condition ........................................................................................................................21
7.6.3 PWM is disabled ..........................................................................................................................21
7.7 Computation of ambient and object temperatures ...............................................................................22
7.7.1 Ambient temperature Ta...............................................................................................................22
7.7.2 Object temperature To .................................................................................................................22
7.7.3 Calculation flow............................................................................................................................22
7.8 Thermal relay .....................................................................................................................................24
8 Unique Features.......................................................................................................................................24
9 Performance Graphs ................................................................................................................................25
9.1 Temperature accuracy of the MLX90601AAA .....................................................................................25
9.2 Field Of View (FOV) ...........................................................................................................................27
10 Applications Information..........................................................................................................................28
10.1 Use of the MLX90614 thermometer in SMBus configuration .............................................................28
10.2 Use of multiple MLX90614s in SMBus configuration .........................................................................28
10.3 Thermal alert / thermostat.................................................................................................................29
10.4 High voltage source operation ..........................................................................................................29
11 Application Comments............................................................................................................................30
12 ESD Precautions ....................................................................................................................................32
13 FAQ........................................................................................................................................................32
14 Package Information...............................................................................................................................34
15 References .............................................................................................................................................35
16 Disclaimer...............................................................................................................................................35
3 Glossary of Terms
PTAT Proportional To Absolute Temperature sensor (package temperature)
PTC Positive Temperature Coefficient sensor (package temperature)
POR Power On Reset
HFO High Frequency Oscillator (RC)
DSP Digital Signal Processing
FIR Finite Impulse Response. Digital filter
IIR Infinite Impulse Response. Digital filter
IR Infra-Red
PWM Pulse With Modulation
DC Duty Cycle (of the PWM) ; Direct Current (for settled conditions specifications)
FOV Field Of View
SDA,SCL Serial DAta, Serial CLock SMBus compatible communication pins
Ta Ambient Temperature measured from the chip (the package temperature)
To Object Temperature, seen from IR sensor
ESD Electro-Static Discharge
EMC Electro-Magnetic Compatibility
TBD To Be Defined
Note: sometimes the MLX90614xxx is referred to as the module.
4 Maximum ratings
Parameter. MLX90614AAA MLX90614BAA MLX90614AAB MLX90614BAB
MLX90614ABA MLX90614BBA MLX90614ABB MLX90614BBB
Supply Voltage, VDD (over voltage) 7V 5V 7V 5V
Supply Voltage, VDD (operating) 5.5 V 3.6V 5.5V 3.6V
Reverse Voltage 0.4 V
Operating Temperature Range, TA -40 to +125C -40+85C
Storage Temperature Range, TS -40+125 C -40+105C
ESD Sensitivity (AEC Q100 002) 2kV
DC current into SCL/Vz (Vz mode) 2 mA
DC sink current, SDA /PWM pin 25 mA
DC source current, SDA/PWM pin 25 mA
DC clamp current, SDA/PWM pin 25 mA
DC clamp current, SCL pin 25 mA
Table 1: Absolute maximum ratings for MLX90614
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-
rated conditions for extended periods may affect device reliability.
2 - PWM/ 1 - SCL/
SDA Vz
3 - VDD 4 - VSS
Top view
Note: for +12V (+8+16V) powered operation refer to the Application information section. For EMC and
isothermal conditions reasons it is highly recommended not to use any electrical connection to the metal can
except by the Vss pin.
With the SCL/Vz and PWM/SDA pins operated in 2-wire interface mode, the input Schmidt trigger function is
automatically enabled.
6 Electrical Specifications
6.1 MLX90614Axx
All parameters are preliminary for TA = 25 C, VDD =5V (unless otherwise specified)
Supplies
External supply VDD 4.5 5 5.5 V
2
SMBus compatible 2-wire interface
Input high voltage VIH 1.8 2 2.2 V
Input high voltage VIH(Ta,V) Over temperature and supply 1.6 2.4 V
Input low voltage V IL 0.7 1.0 1.3 V
Input low voltage VIL(Ta,V) Over temperature and supply 0.5 1.5 V
SDA pin in open drain mode,
Output low voltage VOL over temperature and supply, 0.2 V
Isink = 2mA
SCL leakage ISCL,leak V SCL=4V, Ta=+85C 30 uA
SDA leakage ISDA,leak V SDA=4V, Ta=+85C 0.3 uA
SCL capacitance C SCL 10 pF
SDA capacitance C SDA 10 pF
Slave address SA Factory default 5Ah hex
SMBus Request tREQ SCL low 1.024 ms
Timeout, low Timeout,L SCL low 30 ms
Timeout, high Timeout,H SCL high 50 us
Acknowledge setup time Tsuac(MD) 8-th SCL falling edge, Master 0.5 1.5 us
Acknowledge hold time Thdac(MD) 9-th SCL falling edge, Master 1.5 2.5 us
Acknowledge setup time Tsuac(SD) 8-th SCL falling edge, Slave 2.5 us
Acknowledge hold time Thdac(SD) 9-th SCL falling edge, Slave 1.5 us
EEPROM
Data retention Ta = +85C 10 years
Erase/write cycles Ta = +25C 100,000 Times
Erase/write cycles Ta = +125C 10,000 Times
Erase cell time Terase 5 ms
Write cell time Twrite 5 ms
Notes: All the communication and refresh rate timings are given for the nominal calibrated HFO frequency and will vary
with this frequencys variations.
1. All PWM timing specifications are given for single PWM output (factory default for MLX90614xAx). For the extended
PWM output (factory default for the MLX90614xBx) each period has twice the timing specifications (refer to the PWM
detailed description section). With large capacitive load lower PWM frequency is recommended. Thermal relay output
(when configured) has the PWM DC specification and can be programmed as push-pull, or NMOS open drain. PWM is
free-running, power-up factory default is SMBus, refer to 7.6, Switching between PWM and SMBus communication for
details..
2. For SMBus compatible interface on 12V application refer to Application information section. SMBus compatible
interface is described in details in the SMBus detailed description section. Maximum number of MLX90614xxx devices on
one bus is 127, higher pullup currents are recommended for higher number of devices, faster bus data transfer rates, and
increased reactive loading of the bus.
MLX90614xxx is always a slave device on the bus. MLX90614xxx can work in both low-power and high-power SMBus
communication.
All voltage are with respect to the Vss (ground) unless otherwise noted.
6.2 MLX90614Bxx
All parameters are preliminary for TA = 25 C, VDD =3V (unless otherwise specified)
Supplies
External supply VDD 2.4 3 3.6 V
2
SMBus compatible 2-wire interface
Input high voltage V IH 1.6 2 2.4 V
Input high voltage V IH(Ta,V) Over temperature and supply 1.2 2 2.8 V
Input low voltage V IL 0.7 1.0 1.3 V
Input low voltage V IL(Ta,V) Over temperature and supply 0.5 1.0 1.5 V
SDA pin in open drain mode,
Output low voltage VOL over temperature and supply, 0.25 V
Isink = 2mA
SCL leakage ISCL,leak VSCL=3V, Ta=+85C 20 uA
SDA leakage ISDA,leak V SDA=3V, Ta=+85C 0.25 uA
SCL capacitance CSCL 10 pF
SDA capacitance CSDA 10 pF
Slave address SA Factory default 5Ah hex
SMBus Request tREQ SCL low 1.024 ms
Timeout,low Timeout,L SCL low 30 ms
Timeout, high Timeout,H SCL high 50 us
Acknowledge setup Tsuac(MD 8-th SCL falling edge, Master 0.5 1.5 us
time
Acknowledge hold )Thdac(MD 9-th SCL falling edge, Master 1.5 2.5 us
time
Acknowledge setup )Tsuac(SD) 8-th SCL falling edge, Slave 2.5 us
time
Acknowledge hold Thdac(SD 9-th SCL falling edge, Slave 1.5 us
time )
EEPROM
Data retention Ta = +85C 10 years
Erase/write cycles Ta = +25C 100,000 Times
Erase/write cycles Ta = +125C 10,000 Times
Erase cell time Terase 5 ms
Write cell time Twrite 5 ms
Note: refer to MLX90614Axx notes.
7 Detailed description
7.1 Block diagram
81101
STATE MACHINE
Voltage
90302 Regulator
7.3.1 Amplifier
A low noise low offset amplifier with programmable gain is implemented for amplification of the IR sensor
voltage. With a carefully designed input modulator and balanced input impedance, an offset as low as 0.5V
is achieved.
The Power On Reset (POR) is connected to Vdd supply. The on-chip POR circuit provides an active (high)
level of the POR signal when the Vdd voltage rises above approximately 0.5V and holds the entire
MLX90614xxx in reset until the Vdd is higher than the specified POR threshold VPOR (note that this level is
different for MLX90614Axx and MLX90614Bxx). During the time POR is active, the POR signal is available as
an open drain (active high) at the PWM/SDA pin. After the MLX90614xxx exits the POR condition, the
function programmed in EEPROM takes precedence for that pin.
7.3.3 EEPROM
A limited number of addresses in the EEPROM memory can be changed by the customer. The whole
EEPROM can be read via SMBus interface.
EEPROM (32X16)
Name Address Write acces
Tomax 000h Yes
Tomin 001h Yes
PWMCTRL 002h Yes
Ta range 003h Yes
Ke 004h Yes
Config Register1 005h Yes
Melexis reserved 006h No
Melexis reserved 00Dh No
SMBus address 00Eh Yes
Melexis reserved 00Fh Yes
Melexis reserved 010h No
Melexis reserved 018 No
Melexis reserved 019h Yes
Melexis reserved 01Ah No
Melexis reserved 01Bh No
ID number 01Ch No
ID number 01Dh No
ID number 01Eh No
ID number 01Fh No
The addresses Tomax, Tomin and Ta range are for customer dependent object and ambient temperature
ranges. For details see point 7.5.3 below in this document
The address ConfigRegister1 consist of control bits for configuring the analog and digital parts:
Bits[2:0] Configure coefficients of IIR Bit 2 Bit 1 Bit 0 a1 b1
digital filter: 0 x x 0.5 0.5
1 1 1 0.571428571 0.428571428
1 1 0 0.666(6) 0.333(3)
1 0 1 0.8 0.2
1 0 0 1 0 (IIR bypassed)
Bit 3 Configure the type of 1 - PTC, 0 PTAT.
ambient temperature sensor:
Bits[5:4] Configure the type of data Bit 5 Bit 4 Data 1 Data 2
transmitted through PWM: 0 0 Ta IR 1
0 1 Ta IR 2
1 1 IR 1 IR 2
1 0 IR 2 Undefined*
Bit 6 Define the number IR 1 2 sensors, 0 -1 sensor.
sensors:
Bit 7 Define the sign Ks Factory calibration, do not alter
(Ks=dAlpha/dTobj) :
Bits[10:8] Configure coefficient N of Bit 10 Bit 9 Bit 8 N
FIR digital filter: 0 0 0 8
0 0 1 16
0 1 0 32
0 1 1 64
1 0 0 128
1 0 1 256
1 1 0 512
1 1 1 1024
Bits[13:11] Configure the gain of Bit 13 Bit 12 Bit 11 Gain
amplifier: 0 0 0 1 (preamplifier bypassed)
0 0 1 3
0 1 0 6
0 1 1 12.5
1 0 0 25
1 0 1 50
1 1 0 100
1 1 1 100
Bit 14 Unused
Bit 15 Define the sign of thermo- 1 - negative, 0 positive.
shock compensation:
Note: The following bits/registers should not be altered (except with special tools contact Melexis for such
tools availability) in order to keep the factory calibration relevant:
Ke [15..0] ; Config Register1 [13..11;7;3] ; addresses 00Fh and 019h.
* not recommended for extended PWM mode
It is not possible to write into the RAM memory. It can only be read and only a limited number of RAM
registers are of interest to the customer.
RAM (32x17)
Name Address Read access
Melexis reserved 000h Yes
Melexis reserved 005h Yes
TA 006h Yes
TOBJ1 007h Yes
TOBJ2 008h Yes
Melexis reserved 009h Yes
Melexis reserved 01Fh Yes
SCL digital input, used as the clock for SMBus compatible communication. This pin has the
auxiliary function for building an external voltage regulator. When the external voltage regulator is
used, the 2-wire protocol is available only if the power supply regulator is overdriven.
PWM/SDA Digital input/output, used for both the PWM output of the measured object
temperature(s) or the digital input/output for the SMBus. The pin can be programmed in EEPROM to
operate as Push/Pull or open drain NMOS (open drain NMOS is factory default).
The SMBus interface is a 2-wire protocol, allowing communication between the Master Device (MD) and one
or more Slave Devices (SD). In the system only one master can be presented at any given time [1]. The
MLX90614 can only be used as a slave device.
Generally, the MD initiates the start of data transfer by selecting a SD through the Slave Address (SA).
The MD has read access to the RAM and EEPROM and write access to 9 EEPROM cells (at addresses
0x20h, 0x21h, 0x22h, 0x23h, 0x24h, 0x25h*, 0x2Eh, 0x2Fh, 0x39h). If the access to the MLX90614 is a read
operation it will respond with 16 data bits and 8 bit PEC only if its own slave address, programmed in internal
EEPROM, is equal to the SA, sent by the master. The SA feature allows connecting up to 127 devices with
only 2 wires, unless the system has some of the specific features described in paragraph 5.2 of reference
[1]. In order to provide access to any device or to assign an address to a SD before it is connected to the bus
system, the communication must start with zero SA followed by low RWB bit. When this command is sent
from the MD, the MLX90614 will always respond and will ignore the internal chip code information.
Special care must be taken not to put two MLX90614 devices with the same SD addresses on the
same bus as MLX90614 does not support ARP[1].
The MD can force the MLX90614 into low consumption mode sleep mode (3V version only).
Read flags like EEBUSY (1 EEPROM is busy with executing the previous write/erase), EE_DEAD (1
there is fatal EEPROM error and this chip is not functional**).
Note*: This address is readable and writable. Bit 3 should not be altered as this will cancel the factory
calibration.
Note**: EEPROM error signalling is implemented in automotive grade parts only.
There are eleven command protocols for standard SMBus interface. The MLX90614 supports only two of
them. Not supported commands are:
Quick Command
Byte commands - Sent Byte, Receive Byte, Write Byte and Read Byte
Process Call
Block commands Block Write and Write-Block Read Process Call
Supported commands are:
Read Word
Write Word
The PWM/SDA pin of MLX90614 can operate also as PWM output, depending on the EEPROM settings. If
PWM is enabled, after POR the PWM/SDA pin is directly configured as PWM output. The PWM mode can be
avoided and the pin can be restored to its Data function by a special command. That is why hereafter both
modes are treated separately.
1 7 1 1 8 1 1
S Slave Address Wr A Data Byte A P
S Start Condition
S Stop Condition
Master-to-Slave
Slave-to-Master
After every 8 bits received by the SD an ACK/NACK takes place. When a MD initiates communication, it first
sends the address of the slave and only the SD which recognizes the address will ACK the rest will remain
silent. If the SD NACKs one of the bytes, the MD should stop the communication and repeat the message. A
NACK could be received after the PEC. This means that there is error in the received message and the MD
should try sending the message again. The PEC calculation includes all bits except the START, REPEATED
START, STOP, ACK, and NACK bits. The PEC is a CRC-8 with polynomial X8+X2+X1+1. The Most
Significant Bit of every byte is transferred first.
1 7 1 1 8 1 1 7 1 1
S Slave Address Wr A Command A Sr Slave Address Rd A ..
8 8 8 8 8 1 1
.. Data Byte Low A Data Byte High A PEC A P
1 7 1 1 8 1
S Slave Address Wr A Command A ..
8 8 8 8 8 1 1
.. Data Byte Low A Data Byte High A PEC A P
7.4.4.1 Timing
The MLX90614 meets all the timing specifications of the SMBus [1]. The maximum frequency of the
MLX90614 SMBus is 100KHz and the minimum is 10KHz.
The specific timings in MLX90614s SMBus are:
SMBus Request (tREQ ) is the time that the SCL should be forced low in order to switch MLX90614 from PWM
mode to SMBus mode;
Timeout L is the maximum allowed time for SCL to be low. After this time the MLX90614 will reset its
communication block and will be ready for new communication;
Timeout H is the maximum time for which it is allowed for SCL to be high during communication. After this
time MLX90614 will reset its communication block assuming that the bus is idle (according to the SMBus
specification).
Tsuac(SD) is the time after the eighth falling edge of SCL that MLX90614 will force PWM/SDA low to
acknowledge the last received byte.
Thdac(SD) is the time after the ninth falling edge of SCL that MLX90614 will release the PWM/SDA (so the
MD can continue with the communication).
Tsuac(MD) is the time after the eighth falling edge of SCL that MLX90614 will release PWM/SDA (so that the
MD can acknowledge the last received byte).
Thdac(MD) is the time after the ninth falling edge of SCL that MLX90614 will take control of the PWM/SDA
(so it can continue with the next byte to transmit).
SCL
PWM/SDA
Sampling Changing
data data
SCL
PWM/SDA
The data on PWM/SDA must be changed when SCL is low (min 300ns after the falling edge of SCL). The
data is fetched by both MD and SDs on the rising edge of the SCL.
7.4.6 Commands
In application mode RAM and EEPROM can be read both with 32x16 sizes. If the RAM is read, the data are
divided by two, due to a sign bit in RAM (for example, TOBJ1 - RAM address 0x07h will sweep between
0x27ADh to 0x7FFF as the object temperature rises from -70.01C to +382.19C). The MSB read from RAM
is an error flag (active high) for the linearized temperatures (TOBJ1, TOBJ2 and Ta). The MSB for the raw data
(e.g. IR sensor1 data) is a sign bit (sign and magnitude format).
Opcode Command
000x xxxx* RAM Access
001x xxxx* EEPROM Access
1111_0000** Read Flags
1111_1111 Enter SLEEP mode
Note*: The xxxxx are the 5 LSBits of the memory map address to be read/written.
Note**: Behaves like read command. The MLX90614 returns PEC after 16 bits data of which only 4 are
meaningful and if the MD wants it, it can stop the communication after the first byte. The difference between
read and read flags is that the latter does not have a repeated start bit.
Flags read are:
Data[15] EEBUSY the previous write/erase EEPROM access is still in progress. High active.
Data[14] Unused
Data[13] - EE_DEAD EEPROM double error has occurred. High active.
Data[12] INIT POR initialization routine is still ongoing. High active.
Data[11] not implemented..
Data[10..0] all zeros.
Flags read is a diagnostic feature. The MLX90614 can be used regardless of these flags.
MLX90614 can enter Sleep Mode via command Enter SLEEP mode sent via the SMBus interface. This
mode is not available for the 5V supply version. To limit the current consumption to 2.5uA (typ), the SCL pin
should be kept low during sleep. MLX90614 goes back into power-up default mode (via POR reset) by setting
SCL pin high and then PWM/SDA pin low for at least tDDq=13ms. If EEPROM is configured for PWM
(EN_PWM is high), the PWM interface will be selected after awakening and if PWM control [2], PPODB
is 1 the MLX90614 will output a PWM pulse train with push-pull output.
SCL
PWM/SDA
Stop
SCL
PWM/SDA
tDDq
7.5 PWM
The MLX90614 can be read via PWM or SMBus compatible interface. Selection of PWM output is done in
EEPROM configuration (factory default is PWM). PWM output has two programmable formats, single and
dual data transmission, providing single wire reading of two temperatures (dual zone object or object and
ambient). The PWM period is derived from the on-chip oscillator and is programmable.
Config Register[5:4] PWM1 data PWM2 data Tmin,1 Tmax,1 Tmin,2 Tmax,2
00 Ta Tobj1 Tarange,L Tarange,H Tomin Tomax
01 Ta Tobj2 Tarange,L Tarange,H Tomin Tomax
11 Tobj1 Tobj2 Tomin Tomax Tomin Tomax
10* Tobj2 Undefined Tomin Tomax N.A. N.A.
Note: Serial data functions (2-wire / PWM) are multiplexed with a thermal relay function (described in the
Thermal relay section).
* not recommended for extended PWM format operation
In single PWM output mode the settings for PWM1 data only are used. The temperature reading can be
calculated from the signal timing as:
2t2
Tout = * (Tmax Tmin) + Tmin ,
T
where Tmin and Tmax are the corresponding rescale coefficients in EEPROM for the selected temperature
output (Ta, object temperature range is valid for both Tobj1 and Tobj2 as specified in the previous table) and
T is the PWM period. Tout is Tobj1, Tobj2 or Ta according to Config Register [5:4] settings.
Example:
Tobj1 => Config Reg[5:4] = 11b
Tomin = 0C => Tomin [EEPROM] = 100 * (tomin + 273.15) = 6AB3h
Tomax = +50C => Tomax [EEPROM] = 100 * (tomax + 273.15) = 7E3Bh
Captured PWM high duration is 0.495*T => t2=(0.495 0.125)*T=0.370*T =>
measured object temperature = 2X0.370* (50C -0C)+0C = +37.0C.
The PWM format for extended PWM is shown in Figure 11. Note that with bits DUAL[5:1]>00h each period
will be repeated 2N+1 times, where N is the decimal value of the number written in DUAL[5:1] (DUAL[5:1]
=PWM control & clock [8:4] ), like shown on Figure 12.
Figure 12: Extended PWM format with DUAL[5:1] = 01h (2 repetitions for each data)
The temperature transmitted in Data 1 field can be calculated using the following equation:
2t 2
Tout1 = * (Tmax1 Tmin1 ) + Tmin1
T
For Data 2 field the equation is:
2t 5
Tout2 = * (Tmax2 Tmin2 ) + Tmin2
T
Where Tmin1,Tmax1,Tmin2 and Tmax2 are given in Table 9, t2=thigh1-t1, and t5=thigh2-t4.
Time bands are: t1=0.125*T, t3=0.25*T and t4=1.125*T. As shown in Figure 11, in extended PWM format the
period is twice the period for the single PWM format. All equations provided herein are given for the single
PWM period T. The EEPROM Error band signalling will be 43.75% duty cycle for Data1 and 93.75% for
Data2.
Note:EEPROM error signalling is implemented in automotive grade parts only.
Example:
Configuration: Ta : Tobj1 @ Data1 : Data2 => Config Reg[5:4] = 00b,
Tamin = -5C => Tarange, L [EEPROM] = 100*(Tamin+38.2)/64 = 33h,
Tamax = +105C => Tarange,H [EEPROM] = 100*(Tamax+38.2)/64 = DFh,
Tarange [EEPROM]=DF33h
Tomin = 0C => Tomin [EEPROM] = 100 * (Tomin + 273.15)/64 = 6AB3h
Tomax = +50C => Tomax [EEPROM] = 100 * (Tomax + 273.15)/64 = 7E3Bh
Captured high durations are 0.13068*(2T) and 0.7475*(2T), where 2T is each captured PWM period. Time band t4 is
provided for reliable determination between Data1 and Data2 data fields. Thus Data1 is represented by 0.13068*(2T) and
Data2 by 0.7475*(2T), and the temperatures can be calculated as follows:
t2/T=(thigh1/T)-0.125=0.13636 => Ta=+25.0C,
t5/T=( thigh2/T)-1.125=0.370 => Tobj1=+37.0C.
The calculated ambient and object temperatures are stored in RAM with a resolution of 0.01 C (16 bit). The
PWM operates with a 10-bit word so the transmitted temperature is rescaled in order to fit in the desired
range.
For this goal 2 cells in EEPROM are foreseen to store the desired range for To (Tomin and Tomax) and one for
Ta (Tarange: the 8MSB are foreseen for Tamax and the 8LSB for Tamin).
Thus the output range for To can be programmed with an accuracy of 0.01 C, while the corresponding Ta
range can be programmed with an accuracy of 2.56 C.
The object data for PWM is rescaled according to the following equation:
TRAM TMIN EEPROM TMAX EEPROM TMIN EEPROM
TPWM obj = , K PWM obj =
K PWM obj 1023
The TRAM is the linearised Tobj, 16-bit (0000FFFFh, 0000 for -273.15C and FFFFh for +382.2C) and the
result is a 10-bit word, in which 000h corresponds to ToMIN[C], 3FFh corresponds to ToMAX[C] and 1LSB
ToMAX ToMIN
corresponds to [C]
1023
TMIN EEPORM = TMIN 100 LSB
TMAX EEPORM = TMAX 100 LSB
The ambient data for PWM is rescaled according to the following equation:
TRAM TMIN EEPROM TMAX EEPROM TMIN EEPROM
TPWM ambient = , K PWM ambient =
K PWM ambient 1023
The result is a 10-bit word, where 000h corresponds to -38.2 C (lowest Ta that can be read via PWM), 3FFh
TMAX TMIN
corresponds to 125 C (highest Ta that can be read via PWM) and 1LSB corresponds to [C]
1023
100
TMIN EEPORM = [TMIN ( 38.2 )] LSB
64
100
TMAX EEPORM = [TMAX ( 38.2)] LSB
64
The diagram below illustrates the way of switching to SMBus if PWM is enabled (factory programmed POR
default for MLX90614 is SMBus, PWM enabled). Note that the SCL pin needs to be kept high in order to use
PWM.
tREQ
SCL
PWM/SDA
Start Stop
PWM SMBus
tREQ
SCL
SMBus Request
If PWM is enabled, the MLX90614s SMBus Request condition is needed to disable PWM and reconfigure
PWM/SDA pin before starting SMBus communication. Once disabled PWM, it can be only enabled by
switching Off-On of the supply or exit from Sleep Mode. The MLX90614s SMBus request condition requires
forcing LOW the SCL pin for period longer than the request time (tREQ). The SDA line value is ignored in this
case.
If PWM is disabled by means of EEPROM the PWM/SDA pin is directly used for the SMBus purposes after
POR. Request condition should not be sent in this case.
( )
Vir (Ta, To ) = A. To 4 Ta 4 ,
Where To is the object temperature absolute (Kelvin) temperature, Ta is the sensor die absolute (Kelvin)
temperature, and A is the overall sensitivity.
An additional temperature sensor is needed for measuring the temperature of the chip temperature. After
measurement of the output of both sensors, the corresponding ambient and object temperatures can be
calculated. These calculations are done by the internal DSP, which produces digital outputs, linearly
proportional to measured temperatures.
The Sensor die temperature is measured with a PTC or a PTAT element. All the sensors conditioning and
data processing is handled on-chip and the linearized sensor die temperatureTa is made available in
memory.
The resolution of the calculated Ta is 0.01 C. The sensor is factory calibrated for the full automotive range
(-40 to 125 C). In RAM cell ,006h, 0000h corresponds to -40 C and 4074h (16500d) corresponds to 125 C.
The conversions from RAM contend to real Ta is easy using the following relation:
Ta[ K ] = Tareg 0.01 Note that via SMBus Ta is read divided by 2, or Ta,SMBus[K]=Tareg x 0.02
The result has a resolution of 0.01 C and is available in RAM. To is derived from RAM as:
To[ K ] = Toreg 0.01 Note that via SMBus To is read divided by 2, or To,SMBus[K]=Toreg x 0.02
The measurement, calculation and linearization are held by core, which executes a program form ROM.
After POR the chip is initialized with calibration data from EEPROM. During this phase the number of IR
sensor is selected and which temperature sensor will be used. Measurements, compensation and
linearization routines run in a closed loop afterwards.
Note*: The measurements with programmable filter length for FIR filter use the same EEPROMs sell for N.
Note**: The IIR filter with programmable filter length uses the same EEPROMs sell for L.
1 2
Initialization 3
TOBJ2
filtering filtering
TOBJ1 calculation TOBJ2 calculation
TD= IIR(LTa,TDATAcomp) IRG= IIR(LG,IRGcomp)
IR offset
TA calculation KG calculation
PWM calculation
TA
hysteresis hysteresis
threshold T
Figure 16: Thermal relay : PWM pin versus Tobj
The MLX90614 preserves its normal operation when configured as a thermal relay (PWM configuration and
specification applies as a general rule also for the thermal relay) and therefore it can be read using the
SMBus (entering the SMBus mode from both PWM and thermal relay configuration is the same).
For example, the MLX90614 can generate a wake-up alert for a system upon reaching a certain temperature
and then be read as a thermometer. A reset condition (enter-and exit Sleep, for example) will be needed in
order to return to the thermal relay configuration.
8 Unique Features
The MLX90614 is a ready-to use low-cost non contact thermometer provided from Melexis with output data
linearly dependent on the object temperature with high accuracy and extended resolution.
It supports versatile customization to a very wide range of temperatures, power supplies and refresh rates.
The user can program the internal object emissivity correction for objects with a low emissivity. An embedded
error checking and correction mechanism provides high memory reliability.
The sensors is housed in an industry standard TO39 package for both single- and dual-zone IR
thermometers. The thermometer is available in automotive grade and can use two different packages for
wider applications coverage.
The low power consumption and sleep mode make the thermometer ideally suited for handheld mobile
applications.
The digital sensor interface can be either a power-up-and-measure PWM or an enhanced access SMBus
compatible protocol. Systems with more than 100 devices can be built with only two signal lines. Dual zone
non contact temperatures measurements available via a single line (extended PWM).
A built-in thermal relay function further extends the easy implementation of wide variety of freezing/boiling
prevention and alert systems, as well as thermostats (no MCU is needed).
9 Performance Graphs
9.1 Temperature accuracy of the MLX90601AAA
380
To,oC
4 oC
300
240
4 oC 3 oC
180
4 oC 3 oC 2 oC 2 oC 2 oC
120
3 oC 2 oC 1 oC 1 oC 2 oC
60
2 oC 1 oC 0.5 oC 1 oC 2 oC
3 oC 1 oC 1 oC 2 oC 3 oC
-40
3 oC 3 oC 2 oC 3 oC 4 oC
-70
45
To,oC
42
0.2 oC
39
0.3 oC 0.1 oC 0.3 oC
36
0.2 oC
32
30
10 20 30 40
Ta,oC
Figure 18: Preliminary accuracy of MLX90601BAA (Ta,To) for medical applications.
Width zone 1 72 80 70 70
0.5
0.5
-80o -60o -40o -20o 0o 20o 40o 60o 80o Figure 21: identification of zone
1&2 relative to alignment tab.
10 Applications Information
10.1 Use of the MLX90614 thermometer in SMBus configuration
+3.3V
R1 R2 U1 MCU
2 Vdd
PW M
SDA SDA
SMBus
SCL 1
Vdd Vz SCL
3
Vss GND
C1 U1 MLX90614Bxx
4
0.1uF
+3.3V
I1 I2
R1 R2 U1 MCU
C3
2 Cbus1
PW M
SDA
SCL 1
Vdd Vz
3
Cbus2
C2 U1 Vss C4
4 MLX90614Bxx
0.1uF
SDA SCL
+5V +24V
+3.3V R1
- R2 Q1
D1
Alert dev ice
+
MLX90614Axx
R1 R2 U1 MCU
2
Vdd
U1
2 2 PW M
PW M P WM SDA
SDA SDA SDA
SMBus SCL 1
Vdd
SCL 1 SCL 1 3
Vz
Vdd Vz Vdd Vz SCL
3 3
C3 Vss
GND C2
C1 U1 Vss C1 U1 Vss 4 C*
4 MLX90614Axx 4 MLX90614Bxx
U2 10uF 0.1uF
0.1uF 0.1uF
AC line
R1
Q1
C* Q1
+12V +5V
J1 1 MLX90614 R1
SCL U1
V+ Vz
PW M 4
PWM Vss
2 SDA U1
5.7V
GND Vdd
3
CON1 C1
2.2uF Equivalent schematics
11 Application Comments
Significant contamination at the optical input side (sensor filter) might cause unknown additional
filtering/distortion of the optical signal and therefore result in unspecified errors.
IR sensors are inherently susceptible to errors caused by thermal gradients. There are physical reasons for
that phenomena and, in spite of the careful design of the MLX90614xxx, it is recommended not to subject the
MLX90614 to heat transfer and especially transient conditions.
Upon power-up the MLX90614 passes embedded checking and calibration routines. During these routines
the output is not defined and it is recommended to wait for the specified POR time before reading the module.
Very slow power-up may cause the embedded POR circuitry trigger on inappropriate levels, resulting in
unspecified operation and is not recommended.
The MLX90614xxx is designed and calibrated to operate as a non contact thermometer in settled
conditions. Using the module in very different way will result in unknown results.
Capacitive loading on a SMBus can degrade the communication. Some improvement is possible with use
of current sources compared to resistors in pull-up circuitry. Further improvement is possible with specialized
commercially available bus accelerators. With the MLX90614xxx additional improvement is possible with
increasing the pull-up current (decreasing the pull-up resistor values). Input levels for SMBus compatible
mode have higher overall tolerance than the SMBus specification, but the output low level is rather low even
with the high-power SMBus specification for pull-up currents. Another option might be to go for a slower
communication (clock speed), as the MLX90614xxx implements Schmidt triggers on its inputs in SMBus
compatible mode and is therefore not really sensitive to rise time of the bus (it is more likely the rise time to
be an issue than the fall time, as far as the SMBus systems are open drain with pull-up).
For ESD protection there are clamp diodes between the Vss and Vdd and each of the other pins. This
means that the MLX90614 might draw current from a bus in case the SCL and/or SDA is connected and the
Vdd is lower than the bus pull-ups voltage.
In 12V powered systems SMBus usage is constrained because the SCL pin is used for the zener diode
function. Therefore, higher than 5V applications are likely to use PWM output or external regulator.
Nevertheless, in the 12V powered applications MLX90614 can be programmed (configured and customized)
by forcing the Vdd to 5V externally and running the SMBus communication.
Sleep mode is available in MLX90614Bxx. This mode is entered and exited via the SMBus compatible 2-wire
communication. On the other hand, the extended functionality of the SCL pin yields in increased leakage
current through that pin. As a result, this pin needs to be forced low in power-down mode and the pull-up on
the SCL line needs to be disabled in order to keep the overall power drain in power-down really small.
The PWM pin is not designed for direct drive of inductive loads (such as electro-magnetic relays). Some
driver needs to be implemented for higher load, and auxiliary protection might be necessary even for light but
inductive loading.
It is possible to use the MLX90614xxx in applications, powered directly from the AC line (trasformerless). In
such cases it is very important not to forget that the metal package of the sensor is not isolated and
therefore may occur to be connected to that line, too. Melexis can not be responsible for any application like
this and highly recommends not to use the MLX90614xxx in that way.
Power dissipation within the package may affect performance in two ways: by heating the ambient sensitive
element significantly beyond the actual ambient temperature, as well as by causing gradients over the
package that will inherently cause thermal gradient over the cap. Loading the outputs also causes increased
power dissipation. In case of using the MLX90614Axx internal zener voltage feature, the regulating external
transistor should also not cause heating of the TO39 package.
High capacitive load on a PWM line will result in significant charging currents from the power supply,
bypassing the capacitor and therefore causing EMC, noise, level degradation and power dissipation
problems. A simple option is adding a series resistor between the PWM/SDA pin and the capacitive loaded
line, in which case timing specifications have to be carefully reviewed. For example, with a PWM output that
is set to 1.024 ms and the output format that is 11 bit, the time step is 0.5 s and a settling time of 2 s would
introduce a 4 LSBs error.
Standard information regarding manufacturability of Melexis products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMDs (Surface Mount Devices) and THDs (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMDs to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMDs (Surface Mount Devices) and THDs (Through Hole Devices)
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMDs is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.asp
The MLX90614 is RoHS compliant
12 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
13 FAQ
When I measure aluminium and plastic parts settled at the same conditions I get significant errors on
aluminium. Why?
Different materials have different emissivity. A typical value for aluminium (roughly polished) is 0.18 and for
plastics values of 0.84 0.95 are typical. IR thermometers use the radiation flux between the sensitive
element in the sensor and the object of interest, given by the equation
( ) ( )
q = 1 . 1 . T1 . . A1 .Fab 2 . T2 . . A2 ,
4 4
where
1 and 2 are the emissivities of the two objects,
1 is the absorptivity of the sensor (in this case),
is the Stefan-Boltzmann constant,
A1 and A2 are the surface areas involved in the radiation heat transfer,
Fa-b is the shape factor,
T1 and T2 are known temperature of the sensor die (measured with specially integrated and calibrated
element) and the object temperature that we need.
Note that these are all in Kelvin, heat exchange knows only physics.
When a body with low emissivity (such as aluminium) is involved in this heat transfer, the portion of the
radiation incident to the sensor element that really comes from the object of interest decreases and the
reflected environmental IR emissions take place. (This is all for bodies with zero transparency in the IR band.)
The IR thermometer is calibrated to stay within specified accuracy but it has no way to separate the
incoming IR radiation into real object and reflected environmental part. Therefore, measuring objects with low
emissivity is a very sophisticated issue and infra-red measurements of such materials is a specialised field.
What can be done to solve that problem? Look at paintings for example, oil paints are likely to have
emissivity of 0.850.95 but keep in mind that the stability of the paint emissivity has inevitable impact on
measurements.
It is also a good point to keep in mind that not everything that looks black is black also for IR. For example,
even heavily oxidized aluminium has still emissivity as low as 0.30.
How high is enough? Not an easy question but, in all cases the closer you need to get to the real object
temperature the higher the needed emissivity will be, of course.
With the real life emissivity values the environmental IR comes into play via the reflectivity of the object (the
sum of Emissivity, Reflectivity and Absorptivity gives 1.00 for any material). The larger the difference between
environmental and object temperature is at given reflectivity (with an opaque for IR material reflectivity equals
1.00 minus emissivity) the bigger errors it produces.
After I put the MLX90614 in the dashboard I start getting errors larger than specified in spite that the
module was working properly before that. Why?
Any object present in the FOV of the module provides IR signal. It is actually possible to introduce error in the
measurements if the module is attached to the dashboard with an opening that enters the FOV. In that case
portion of the dashboard opening will introduce IR signal in conjunction with constraining the effective FOV
and thus compromising specified accuracy. Relevant opening that takes in account the FOV is a must for
accurate measurements. Note that the basic FOV specification takes 50% of IR signal as threshold (in order
to define the area, where the measurements are relevant), while the entire FOV at lower level is capable of
introducing lateral IR signal under many conditions.
I measure human body temperature and I often get measurements that significantly differ from the
+37C I expect.
IR measurements are true surface temperature measurements. In many applications this means that the
actual temperature measured by an IR thermometer will be temperature of the clothing and not the skin
temperature. Emissivity (explained first in this section) is another issue with clothes that has to be considered.
There is also the simple chance that the measured temperature is adequate for example, in a cold winter
human hand can appear at temperatures not too close to the well known +37C.
14 Package Information
The MLX90614 is packaged in an industry standard TO 39 can.
15 References
[1] System Management Bus (SMBus) Specification Version 2.0 August 3, 2000
SBS Implementers Forum Copyright . 1994, 1995, 1998, 2000
Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology
Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc.,
Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc.
16 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical life-
support or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis rendering
of technical or other services.
2006 Melexis NV. All rights reserved.