42LF20FR
42LF20FR
42LF20FR
LCD TV
SERVICE MANUAL
CHASSIS : LP91A
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS .............................................................................................. 2
SPECIFICATION ....................................................................................... 6
BLOCK DIAGRAM.................................................................................. 17
Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
SAFETY PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service unit under test.
manual and its supplements and addenda, read and follow the 2. After removing an electrical assembly equipped with ES
SAFETY PRECAUTIONS on page 3 of this publication. devices, place the assembly on a conductive surface such as
NOTE: If unforeseen circumstances create conflict between the aluminum foil, to prevent electrostatic charge buildup or
following servicing precautions and any of the safety precautions on exposure of the assembly.
page 3 of this publication, always follow the safety precautions. 3. Use only a grounded-tip soldering iron to solder or unsolder ES
Remember: Safety First. devices.
4. Use only an anti-static type solder removal device. Some solder
General Servicing Precautions removal devices not classified as "anti-static" can generate
1. Always unplug the receiver AC power cord from the AC power electrical charges sufficient to damage ES devices.
source before; 5. Do not use freon-propelled chemicals. These can generate
a. Removing or reinstalling any component, circuit board electrical charges sufficient to damage ES devices.
module or any other receiver assembly. 6. Do not remove a replacement ES device from its protective
b. Disconnecting or reconnecting any receiver electrical plug or package until immediately before you are ready to install it.
other electrical connection. (Most replacement ES devices are packaged with leads
c. Connecting a test substitute in parallel with an electrolytic electrically shorted together by conductive foam, aluminum foil
capacitor in the receiver. or comparable conductive material).
CAUTION: A wrong part substitution or incorrect polarity 7. Immediately before removing the protective material from the
installation of electrolytic capacitors may result in an leads of a replacement ES device, touch the protective material
explosion hazard. to the chassis or circuit assembly into which the device will be
installed.
2. Test high voltage only by measuring it with an appropriate high CAUTION: Be sure no power is applied to the chassis or circuit,
voltage meter or other voltage measuring device (DVM, and observe all other safety precautions.
FETVOM, etc) equipped with a suitable high voltage probe. 8. Minimize bodily motions when handling unpackaged
Do not test high voltage by "drawing an arc". replacement ES devices. (Otherwise harmless motion such as
3. Do not spray chemicals on or near this receiver or any of its the brushing together of your clothes fabric or the lifting of your
assemblies. foot from a carpeted floor can generate static electricity
4. Unless specified otherwise in this service manual, clean sufficient to damage an ES device.)
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable General Soldering Guidelines
non-abrasive applicator; 10% (by volume) Acetone and 90% (by 1. Use a grounded-tip, low-wattage soldering iron and appropriate
volume) isopropyl alcohol (90%-99% strength) tip size and shape that will maintain tip temperature within the
CAUTION: This is a flammable mixture. range or 500°F to 600°F.
Unless specified otherwise in this service manual, lubrication of 2. Use an appropriate gauge of RMA resin-core solder composed
contacts in not required. of 60 parts tin/40 parts lead.
5. Do not defeat any plug/socket B+ voltage interlocks with which 3. Keep the soldering iron tip clean and well tinned.
receivers covered by this service manual might be equipped. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
6. Do not apply AC power to this instrument and/or any of its bristle (0.5 inch, or 1.25cm) brush with a metal handle.
electrical assemblies unless all solid-state device heat sinks are Do not use freon-propelled spray-on cleaners.
correctly installed. 5. Use the following unsoldering technique
7. Always connect the test receiver ground lead to the receiver a. Allow the soldering iron tip to reach normal temperature.
chassis ground before connecting the test receiver positive (500°F to 600°F)
lead. b. Heat the component lead until the solder melts.
Always remove the test receiver ground lead last. c. Quickly draw the melted solder with an anti-static, suction-
8. Use with this receiver only the test fixtures specified in this type solder removal device or with solder braid.
service manual. CAUTION: Work quickly to avoid overheating the circuit
CAUTION: Do not connect the test fixture ground strap to any board printed foil.
heat sink in this receiver. 6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
Electrostatically Sensitive (ES) Devices (500°F to 600°F)
Some semiconductor (solid-state) devices can be damaged easily b. First, hold the soldering iron tip and solder the strand against
by static electricity. Such components commonly are called the component lead until the solder melts.
Electrostatically Sensitive (ES) Devices. Examples of typical ES c. Quickly move the soldering iron tip to the junction of the
devices are integrated circuits and some field-effect transistors and component lead and the printed circuit foil, and hold it there
semiconductor "chip" components. The following techniques only until the solder flows onto and around both the
should be used to help reduce the incidence of component component lead and the foil.
damage caused by static by static electricity. CAUTION: Work quickly to avoid overheating the circuit
1. Immediately before handling any semiconductor component or board printed foil.
semiconductor-equipped assembly, drain off any electrostatic d. Closely inspect the solder area and remove any excess or
charge on your body by touching a known earth ground. splashed solder with a small wire-bristle brush.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
Copyright LG Electronics. Inc. All right reserved. -4- LGE Internal Use Only
Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through Circuit Board Foil Repair
which the IC leads are inserted and then bent flat against the Excessive heat applied to the copper foil of any printed circuit
circuit foil. When holes are the slotted type, the following technique board will weaken the adhesive that bonds the foil to the circuit
should be used to remove and replace the IC. When working with board causing the foil to separate from or "lift-off" the board. The
boards using the familiar round hole, use the standard technique following guidelines and procedures should be followed whenever
as outlined in paragraphs 5 and 6 above. this condition is encountered.
Removal At IC Connections
1. Desolder and straighten each IC lead in one operation by gently To repair a defective copper pattern at IC connections use the
prying up on the lead with the soldering iron tip as the solder following procedure to install a jumper wire on the copper pattern
melts. side of the circuit board. (Use this technique only on IC
2. Draw away the melted solder with an anti-static suction-type connections).
solder removal device (or with solder braid) before removing the
IC. 1. Carefully remove the damaged copper pattern with a sharp
Replacement knife. (Remove only as much copper as absolutely necessary).
1. Carefully insert the replacement IC in the circuit board. 2. carefully scratch away the solder resist and acrylic coating (if
2. Carefully bend each IC lead against the circuit foil pad and used) from the end of the remaining copper pattern.
solder it. 3. Bend a small "U" in one end of a small gauge jumper wire and
3. Clean the soldered areas with a small wire-bristle brush. carefully crimp it around the IC pin. Solder the IC connection.
(It is not necessary to reapply acrylic coating to the areas). 4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
"Small-Signal" Discrete Transistor copper pattern. Solder the overlapped area and clip off any
Removal/Replacement excess jumper wire.
1. Remove the defective transistor by clipping its leads as close as
possible to the component body. At Other Connections
2. Bend into a "U" shape the end of each of three leads remaining Use the following technique to repair the defective copper pattern
on the circuit board. at connections other than IC Pins. This technique involves the
3. Bend into a "U" shape the replacement transistor leads. installation of a jumper wire on the component side of the circuit
4. Connect the replacement transistor leads to the corresponding board.
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder 1. Remove the defective copper pattern with a sharp knife.
each connection. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
Power Output, Transistor Device 2. Trace along the copper pattern from both sides of the pattern
Removal/Replacement break and locate the nearest component that is directly
1. Heat and remove all solder from around the transistor leads. connected to the affected copper pattern.
2. Remove the heat sink mounting screw (if so equipped). 3. Connect insulated 20-gauge jumper wire from the lead of the
3. Carefully remove the transistor from the heat sink of the circuit nearest component on one side of the pattern break to the lead
board. of the nearest component on the other side.
4. Insert new transistor in the circuit board. Carefully crimp and solder the connections.
5. Solder each transistor lead, and clip off excess lead. CAUTION: Be sure the insulated jumper wire is dressed so the
6. Replace heat sink. it does not touch components or sharp edges.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
- General Specification
No Item Specification Measurement Remark
1 Screen Size 42” wide Color Display Module Resolution : 1920*1080
2 Aspect Ratio 16:9
3 LCD Module 42” TFT WUXGA LCD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 85 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤ 200 W 42” FHD Unit : mm
7 LDC Module FHD 983 x 576 x 47.3/(51) [W/O inverter]/(with inverter)
(Maker : LGD) 0.4845 x 0.4845
18 EEFL
Coating 3H
Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
5. Chroma& Brightness (Optical)
(1) LCD Module
The Color Coordinates check condition
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 400 500 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree LGD
3. Color Coordinates White Wx Typ 0.279 Typ LGD 42”(FHD)
Wy -0.03 0.292 +0.03
RED Xr 0.638
Yr 0.334
Green Xg 0.291
Yg 0.607
Blue Xb 0.145
Yb 0.062
4. Contrast ratio 1000:1 1400:1
5. Luminance Variation 1.3
Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
7. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
Specification Proposed
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
8. HDMI Input(PC)
(PC - Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
9. HDMI Input(DTV)
Specification
No Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range (2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
This specification sheet is applied to all of the LCD TV, utility Vx.x.x) will be opened
LP91A/B/C/D chassis. 2) Click the “Connect” button and confirm “Dialog Box”
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration – RGB / Component
(4) Check SW Version. 3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
Filexxx.bin
1
Fil
Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
1
Filexxx.bin
Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
4.3.4. EDID data 4.4. ADC Calibration
(1) Analog(RGB): 128bytes> 4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
(2) HDMI 1 : 256Bytes
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
OK
Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
4.5. Check SW Version 5.2. Adjustment of White Balance
(1) Method : (For automatic adjustment)
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx” – LH70
Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
Copyright LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
Only for training and service purposes
TROUBLESHOOTING
Fail
Check 24V, 12V, 5,2V Check short of Main B/D
of Power B/D or Change Power B/D
Pass
Fail Fail
Check Output of Check short of IC1001, Re-soldering or Change defect
IC1001, IC1003, IC1007 IC1003, IC1007 part of IC1001, IC1003, IC1007
Pass
Pass
Change IC1002,, Q1003
Fail
Check LEDAssy Change LEDAssy
Pass
Pass
Pass
Pass
Pass
Pass
Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
No Raster on PC Signal
Pass
Pass
Pass
Re-soldering or
Check the Input/Output
Of IC100 Fail Change the defect part,
Check RGB EDID Data
Pass
Pass
Pass
Pass
Check Input source
Cable And Jack
Check Input source
Cable And Jack
Pass
Pass
Repeat [A], & [B] Process
Copyright LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Pass Pass
Pass
Pass
Pass
Pass
Pass
Pass
Repeat [A], & [B] Process Repeat [A], & [B] Process
No Sound
Pass
Pass
Pass
Copyright LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
Copyright
EEPROM HDM 2_SCL/ SDA
TMDS 24C02 IR
HDMI1 HDMI_DATA_1
HDMI2 TMDS TX
HDMI_DATA_2
EEPROM
HDMI1_SCL/
_ SDA
24C02
PC_Aud io _L/ R :7 00m Vrms
PC_Aud io PC_Aud io _L/ R Serial Flash
EEPROM ( 8MByt e)
RGB_PC 24C02 PC_SCL/ SDA
COMP1_Y/ Pb / Pr
P : 1/ 0. 7Vp p EEPROM( 256K)
COMP1_Y/ Pb / Pr: 1/ 0. 7Vp p
COMP1 COMP2_Y/ Pb /Pr/ : 1/ 0. 7Vp p
COMP2_Y/ Pb / Pr: 1/0. 7Vp p
COMP2 Co mp 1_L/ R :5 00mVrms
COMP1_LIN/
MNT_OUT RIN
Co mp 2_L/ R :5 00mVrms
COMP2_LIN/ RIN
AV1_VIN: 1Vp p
AV1_VIN
MNT_OUT MNT_OUT: 1Vp p
MNT_VOUT
AV1 AV11_LIN/ RIN :5 00m Vrms
AV1_LIN/ RIN
- 17 -
MNT_L/ R OUT
AMP OUT_E_TX_A
OUT_E_TX_A–
OUT_E_TX_B
OUT_E_TX_B–
TV TU_MAIN TU_MAIN OUT_E_TX_C
OUT_E_TX_C–
TUNER SUB_SCL / SDA OUT_E_TX_CLK
OUT_E_TX_CLK–
( RF)
SIF SIF OUT_E_TX_D
OUT_E_TX_ –
OUT_E_TX_E
OUT_E_TX_ –
Tx/ Rx : – 15Vp p 232C Driver
TXD / RXD :5V Dig it al OUT_O_TX_A–
OUT_O_TX_A
ST3232C OUT_O_TX_B
OUT_O_TX_B–
RS232
BLOCK DIAGRAM
OUT_O_TX_C
OUT_O_TX_C–
OUT_O_TX_CLK–
OUT_O_TX_C
L VDS c onnec tor
USB OUT_O_TX_D
OUT_O_TX_D–
Fo r D/ L OUT_O_TX_E
OUT_O_TX_E–
USB USB_DN/ PN
EEPROM HDMI3_SCL/ SDA
TMDS 24C02
HDMI3 HDMI_DATA_3 PWM
NTP3100L
IIS_OUT R_SPK_OUT
R_CH
L_CH L_SPK_OUT
SIDE_L/ SIDE_R :5 00mVrms
AV2 AV2_LIN/ RIN
( Sid e AV) SIDE_V : 1Vp p
AV2_VIN
400
821
540
521
804
A2
806
830
801
LV1
550
805
802
803
A9
200T
530
A10
200
900
901
122
120
300
500
510
Copyright LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
Copyright
4.7K R8010 4.7K R8011 +3.3V_MULTI_MST
R896 4.7K R898 4.7K
*H/W OPTION Small_HD Small_HD Non_Small_FHD
+3.3V_MULTI_MST
Small_FHD
R896 R898 R8010 R8011 R8010-*3 R8011-*3 R896-*2 R898-*2
4.7K 4.7K 4.7K 4.7K
Small HD 4.7K X 4.7K X Apollo 100Hz Non_Small_HD 100Hz DDR2_A[0-12]
Small FHD (27) 4.7K X 4.7K R8010-*2 R8011-*2 R896-*1 R898-*1
4.7K 4.7K 4.7K 4.7K 4.7K
Non Small HD 4.7K X X 4.7K Non_Small_FHDApollo Small_FHD Apollo
DDR2_A[3]
DDR2_A[7]
DDR2_A[9]
DDR2_A[5]
DDR2_A[1]
DDR2_A[8]
DDR2_A[6]
DDR2_A[4]
DDR2_A[2]
DDR2_A[0]
R8010-*1 Close to IC as close as possible
DDR2_A[12]
DDR2_A[10]
DDR2_A[11]
R8011-*1
POWER_SW
Non Small FHD X 4.7K 4.7K X 4.7K 4.7K +1.2V_VDDC_MST
Apollo X 4.7K 4.7K 4.7K Small_FHD Non_Small_HD +5VST_MST +1.8V_DDR
R8020
100HZ X 4.7K X 4.7K +3.3V_MST 10K +3.3V_MST
IC802
** Small HD : 19/22/26 Inch R8003
DDR2_CKE
DDR2_BA0
DDR2_BA1
DDR2_WEZ
DDR2_CASZ
DDR2_RASZ
DDR2_ODT
SERIAL FLASH 64M MX25L6405DMI-12G
** Non Small FHD : Normal(non 100Hz) FHD Model
C811
10K C857 C859 C877 C878 C879
+3.3V_MULTI_MST 0.1uF 0.01uF 0.01uF 0.01uF
R867 1K
0.01uF 0.01uF
1 HOLD SCLK 16 I2S_OUT +3.3V_MULTI_MST
SPI_CLK +1.8V_DDR
C807
56
0.1uF
0.1uF
1K
0.01uF 2 VCC SI.SIO015
LED_R
TXD
RXD
KEY2
KEY1
SPI_DI
EEP_SCL
EEP_SDA
IR
RXD
TXD
I2S_SDO
I2S_SCK
I2S_WS
I2S_MCLK
PANEL_STATUS
AR812
56
AR813
56
AR814
56
AR815
56
AR800
56
RL_ON
PC_VS
PC_HS
CEC_C
SYS_RESET
L802
DSUB_SDA
120-ohm C864 C858 C860 C862 C865
R852
C844
C863
R868
3 NC_1 NC_8 14 0.01uF 0.01uF 0.01uF 0.01uF 0.01uF
C817 20pF
C816 20pF
+1.8V_DDR
4 NC_2 NC_7 13
+3.3V_MULTI_MST +1.2V_VDDC_MST
X801
12MHz
READY
READY
+3.3V_MULTI_MST
0
0
100
100
100
100
100
100
0
0
0.1uF
100
+3.3V_MULTI_MST 5 NC_3 NC_6 12
100 R8022
100 R8021
R878 C867
R839
1M
C866
R8035
R8034
R895
R849
R850
R8012
R824
R825
R8016
R8017
C883
R829
6 NC_4 NC_5 11 4.7K 0.1uF 10uF
R877
194
L800
Q805 READY 120-ohm
8 SO/SIO1 WP/ACC 9
XIN 244
CEC 255
RT1C3904-T112
IRIN 250
SAR3 241
SAR2 240
SAR1 239
SAR0 238
SPI_DO
XOUT 243
READY R851 10 1 RXBCKN B_MCLKZ 192 R843 33
A_ODT 196
A_WEZ 206
SPDIFO 229
MVREF 195
TMDS2_RXC- DDR2_MCLKZ
GND_18 235
GND_17 234
GND_16 225
GND_15 202
GND_14 193
DDR2_D[0-15]
VDDP_5 224
A_CASZ 198
A_RASZ 197
GPIO140 249
GPIO139 248
GPIO138 247
GPIO135 246
GPIO134 245
VDDC_7 226
VDDC_6 218
VSYNC1 254
HSYNC1 253
VSYNC0 252
HSYNC0 251
USB0_DP 237
USB0_DM 236
HWRESET 256
I2S_IN_SD 221
A_MCLKE 217
R854 10 2 RXBCKP B_MCLK 191 R844 33
A_BADR[0] 208
A_BADR[1] 207
TMDS2_RXC+ DDR2_MCLK
A_MADR[3] 216
A_MADR[7] 215
A_MADR[9] 213
A_MADR[5] 212
A_MADR[1] 209
A_MADR[8] 204
A_MADR[6] 203
A_MADR[4] 201
A_MADR[2] 200
A_MADR[0] 199
I2S_OUT_SD 228
A_MADR[12] 214
A_MADR[10] 210
A_MADR[11] 205
I2S_OUT_WS 223
AVDD_MPLL 242
I2S_OUT_BCK 227
AVDD_DDR_6 211
R856 10 3 RXB0N B_MDATA[5] 190 DDR2_D[5]
I2S_OUT_MCK 222
TMDS2_RX0-
AVDD_MEMPLL
R858 10 4 RXB0P B_MDATA[2] 189 AR805 DDR2_D[2]
I2S_IN_WS/GPIO67219
TMDS2_RX0+
UART1_TX/GPIO87 233
UART1_RX/GPIO86 232
I2S_IN_BCK/GPIO68220
5 HOTPLUGB B_MDATA[0] 188 56 DDR2_D[0]
UART2_TX/I2CM_SCK 231
HPD_MST_2
UART2_RX/I2CM_SDA 230
TMDS2_RX1- R859 10 6 RXB1N B_MDATA[7] 187 DDR2_D[7]
R862 10 7 RXB1P AVDD_DDR_5 186 C853 0.1uF
HDMI_2
EEPROM TMDS2_RX1+
8 AVDD_33_1 B_MDATA[13] 185 DDR2_D[13]
IC801 C833 0.1uF R869 10 9 RXB2N B_MDATA[10] 184 AR806 DDR2_D[10]
TMDS2_RX2-
24LC256-I/SM R871 10 10 RXB2P GND_13 183 56 DDR2_D[8]
+3.3V_MULTI_MST TMDS2_RX2+
TMDS1_RXC- R872 10 11 RXACKN B_MDATA[8] 182 DDR2_D[15]
A0 VCC TMDS1_RXC+ R873 10 12 RXACKP B_MDATA[15] 181
1 8
TMDS1_RX0- R874 10 13 RXA0N AVDD_DDR_4 180
C803 TMDS1_RX0+ R879 10 14 RXA0P B_DDR2_DQSB[1] 179 DDR2_DQS1M
A1 WP 0.01uF
2 7 R8027 R8028 15 AVDD_33_2 B_DDR2_DQS[1] 178 DDR2_DQS1P
4.7K 4.7K C815 0.1uF TMDS1_RX1- R880 10 16 RXA1N GND_12 177
HDMI_1
A2 SCL TMDS1_RX1+ R890 10 17 RXA1P VDDP_4 176 C849 0.1uF
3 6 R812 22
EEP_SCL 18 GND_1 AVDD_DDR_3 175
R891 10 19 RXA2N B_DDR2_DQSB[0] 174
AUL0
AUR0
AUL1
AUR1
AUL2
AUR2
AUL3
AUR3
AUCOM
AUL4
AUR4
GND_4
AUVRP
AUVAG
AVDD_AU
GND_5
VDDC_2
DDCA_CK
DDCA_DA
DDCDA_CK
DDCDA_DA
DDCDB_CK
DDCDB_DA
GPIO20
VDDP_1
VDDC_3
UART2_RX
UART2_TX
DDCDC_CK
RXCCKN
RXCCKP
DDCDC_DA
RXC0N
RXC0P
GND_6
RXC1N
RXC1P
AVDD_DM
RXC2N
RXC2P
HOTPLUGC
USB1_DM
USB1_DP
SCK
SDI
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
LVA4P
LVA4M
LVA3P
LVA3M
LVACKP
LVACKM
LVA2P
LVA2M
LVA1P
LVA1M
LVA0P
LVA0M
VDDP_2
R845 22K
C841 0.01uF
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
96
99
102
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
P_24V_SMALL_15V
P_12V_SMALL_15V NON 19_22"
Q804 C842 0.1uF
R800 RT1C3904-T112 NON 19_22"
R8001
AR818
33
R8037
0
0
0
0
0 READY
0.1uF
READY
100
100
100
100
10 HDMI3_SIDE 94
10 HDMI3_SIDE 95
10 HDMI3_SIDE 97
10 HDMI3_SIDE 98
10 HDMI3_SIDE 100
10 HDMI3_SIDE 101
10 HDMI3_SIDE 103
10 HDMI3_SIDE 104
0
0
2.2uF
C B R8007 33K RL_ON TXCE4-
0 E NON 19_22" 0
0 C871 TXCE4+
4.7uF TXCE3-
GND
R894
R899
C876 0.01uF
10V TXCE3+
C823 2.2uF
C824 2.2uF
C802 2.2uF
C873 2.2uF
C874 2.2uF
C875 2.2uF
C808 0.1uF
C821
C822 2.2uF
C840 0.01uF
R806
R870
R8033
R8023
R8024
R8025
R8026
C882
R8039 100 HDMI3_SIDE
R801
R805
R8040 100HDMI3_SIDE
R820
R821
R822
R823
R841
R848
R826
R827
READY TXCLKE-
TXCLKE+
D801 POWER_DET TXCE2-
KDS181 TXCE2+
L801
R885 150 +5VST_MST TXCE1-
120-ohm
D802
TXCE1+
I-DIM
R860 1K KDS181
E-DIM
SPI_DI
SPI_CZ
USB_DN
SPI_DO
TXCE0-
SPI_CLK
R855
COMP2_L
COMP2_R
CVBS_LIN
CVBS_RIN
TXCE0+
DDC_SCL1
DDC_SCL2
DDC_SCL3
PC_AUD_L
DSUB_SCL
PC_AUD_R
DDC_SDA1
DDC_SDA2
DDC_SDA3
DSUB_SDA
POWER_DET
R8036 10K
HPD_MST_3
TMDS3_RX0-
TMDS3_RX1-
TMDS3_RX2-
TMDS3_RXC-
TMDS3_RX0+
TMDS3_RX1+
TMDS3_RX2+
TMDS3_RXC+
RT1C3904-T112
Q800 SW800 1K 4.7K R863
ISA1530AC1 C8000 2.2uF E +3.3V_MULTI_MST +3.3V_MULTI_MST
JTP-1127WEM 16V 4.7K R864
2
READY
R861 1K B E
C SYS_RESET
3 1
4
R886 +5VST_MST
R811 R883
2K 1K 1K
C809 10uF 16V
C813 0.1uF
C818 1000pF
C820 4.7uF
C812 READY
M_SCL
R8000
M_SDA
Close to IC
with width trace
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
SDI
SCZ
SCK
SDO
AUL0
AUL1
AUL2
AUL3
AUL4
AUR0
AUR1
AUR2
AUR3
AUR4
PWM0
PWM1
PWM2
PWM3
RXC0P
RXC1P
RXC2P
LVA4P
LVA3P
LVA2P
LVA1P
LVA0P
GND_4
GND_5
GND_6
RXC0N
RXC1N
RXC2N
GPIO20
AUVRP
LVA4M
LVA3M
LVA2M
LVA1M
LVA0M
AUVAG
AUCOM
VDDP_1
VDDP_2
VDDC_2
VDDC_3
RXCCKP
LVACKP
RXCCKN
USB1_DP
LVACKM
USB1_DM
DDCA_CK
DDCA_DA
AVDD_AU
AVDD_DM
UART2_TX
UART2_RX
HOTPLUGC
DDCDB_CK
DDCDC_CK
DDCDA_CK
DDCDB_DA
DDCDC_DA
DDCDA_DA
+1.8V_DDR V_REF
1K
R907
C904 C905 C918
1K
0 . 0 1 u F 1000pF 0.1uF
50V
R908
V_REF
IC900
Close to DDR2 IC HYB18TC512160B2F-2.5
DDR2_A[0-12]
VREF DQ0 DDR2_D[0]
J2 G8
DQ1 DDR2_D[1]
G2
DQ2 DDR2_D[2]
DDR2_A[0] H7
DDR2_DQM1 56
B2 VSSQ10
NC1 A2
B8 VSSQ9
NC2 E2
A7 VSSQ8
NC3 R8
D2 VSSQ7
D8 VSSQ6
+1.8V_DDR VSSDL E7 VSSQ5
J7
F2 VSSQ4
F8 VSSQ3
H2 VSSQ2
VDDL J1 H8 VSSQ1
C900 C919
0.01uF 10uF
50V 10V
DDR2 MEMORY
L1012
35V
MLB-201209-0120P-N2
P_12V_SMALL_15V +12V_AUDIO **5V_MULTI->3.3V->1.2V
120-ohm C1002 C1007
P1001 47uF 25V 0.01uF
FM20020-24
L1001
P_5V +5VST_MST
NC 1 2 Power ON 120-ohm C1003 C1008 C1011
GND 3 4 GND 10uF 0.01uF 0.01uF
GND GND
IC1001
5 6 16V
5.2V 5.2V
BD9130EFJ-E2
7 8
5.2V 9 10 5.2V
GND 11 12 GND ADJ EN
1 8
12V 13 14 12V
GND GND
*ST 5V->3.3V 10K
15 16 R1006
VCC PVCC
24V 17 18 24V 2 7
+5V_MULTI
NC 19 20 Inverter ON L1002
A.Dim Error Out 2.2uH OUT:1.27V
21 22 ITH SW
IC1007 3 6 +1.2V_VDDC_MST
NC 23 24 PWM Dim
AP2121N-3.3TRE1 C1004 C1017 R2 C1036
10uF R1008 R1078
10uF
R1009
2K
1%
12K GND PGND C1014 1uF 25V
16V 4 5 3.3
25 16V 0 . 1 u FC1013 C1018 READY
VIN 3 2 VOUT READY 10uF
+5VST_MST +3.3V_MST C1055 16V 10uF
.
MAX 300mA C1012 16V 16VR1010
26" 1 C1053 C1034 2200pF 3.3K R1
C1052 560pF MAX 2A
1/10W 1/10W
0.01uF 1uF 25V 50V 1%
GND 10uF16V 50V
READY READY
R1074
0
1/4W
5%
GND
19_22"
GND GND 3
15 16
24V 24V
11
P_5V G2 D2_1
4 5 +5V_MULTI
C1019 C1021
10uF 16V 0.01uF
C1048
R1070 1uF
22K
R1069
1.6K
R1054 4.7K R1001 0
PANEL_STATUS C
NON SHARP 32&52",AUO NON CMO 57" R1068
25V 10K B Q1004
R1053 C1043
0 0.47uF POWER_SW RT1C3904-T112
SHARP 52",AUO NON SHARP 52",AUO E
R1014
0
CMO 32,42,47,57
+5V_MULTI
R1064 0
R1046
3K
R1040 0 V0 = 0.8*(1+(R1/R2)) OUT:5V L1010
**DC-DC CONVERTER MLB-201209-0120P-N2
CMO 57" +5V_TUNER
R1041 3 +5V_MULTI C1000 C1020 C1025
0 R1047 10K 10uF 10uF 0.1uF C1038
DISP_EN/VAVS_ON C1026
CMO 57" 1 2 Q1002 100uF 16V 16V 16V 1uF 25V
R1039 2SC3875S 12V->5V_TUNER/USB 16V READY
0 R1059 READY R1056
CMO 32,42,47 R1023 10 +5V_USB
R1042 0 10K
0 NON (CMO 32,42,47,57, SHARP 32") NON 19_22"
OPC_DISABLE
R1076 C1024
1K 0.1uF
R1043 0 R1044 1K 50V
NON CMO 32,42,47,57 DC_DIM E-DIM R1057 IC1006 READY
R1075 R1 MP2212DN
1K 30K
LED Block C1045 OPC_OUT R1018
2.2uF 16V R1044-*1
100 OPC_ENABLE 2K
R1022
DC_DIM PWM_DIM R1021 1K FB 1 8 EN/SYNC NON 19_22"
1K R1058 C1032 MAX 3A +5V_MULTI
*SHARP32":DC DIMMING OPC_DISABLE OPC_ENABLE 560pF
19_22" R2 5.6K L1009 3.6uH 19_22"
Small(19_22")
+5VST_MST +5V_MULTI 50V
R1079 D1001 R1016
R10450 10K GND2 7 SW_2
R1015 10 4.7K
R1002 R1005 CMO 32,42,47,57 C1044
I-DIM L1008 S2A 50V +5V_MULTI
CIC21J501NE R1012 19_22"
10K 1.2K 2.2uF 16V IN 3 6 SW_1
0 R1024 3 R1017 10K
**OPC_ENABLE : USE LGD Module P_12V_SMALL_15V NON 19_22" C1030 C1031 RL_ON
10uF 10uF 10 12 19_22"
25V 25V BS 4 5 VCC
Q1005
D1002 C1035 C1029 C1033 2SC3875S
0.1uF
1uF 25V 50V 0.1uF 19_22"
SAM2333 50V
R1011
PGND1A_2
PGND1A_1
OUT1A_2
OUT1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1
OUT1B_2
OUT1B_1
PGND1B_2
PGND1B_1
BST1B
VDR1B
Q603
RT1C3904-T112 R622
E HOTEL_OPT 6.8K
C622 C
56
55
54
53
52
51
50
49
48
47
46
45
44
43
0.1uF R616-*12K
READY Q601 B
RT1C3904-T112 7 OUT2 OUT3 8
R624
15
16
17
18
19
20
21
22
23
24
25
26
27
28
16V 50V
SCL
SDA
BCK
WCK
DVDD
BST2B
FAULT
VDR2B
SDATA
DVSS_2
PGND2B_1
MONITOR_0
MONITOR_1
MONITOR_2
+1.8V_DVDD C614 C623 22000pF
1uF
C609 C610
10uF16V 0.1uF
R673 0
100
100
100
R602 R603 C651
MULTI_PW_SW
100 100 1000pF
50V
R656 0
HOTEL_OPT
R677
R676
R678
Chinese Hotel Option
P600 +16V_NTP
SMAW250-04 P601
12505WR-09A00
HOTEL_OPT
1
SPK_R- R620 0 1
M_SCL
M_SDA
I2S_WS
C636 HOTEL_OPT
I2S_SCK
I2S_SDO
2 0.1uF
SPK_R+ HOTEL_OPT 2
3
SPK_L- 3
AMP_MUTE_HOTEL
AUDIO_R
4 C639
SPK_L+ C638 +3.3V_MULTI_MST
33pF 33pF 4
50V 50V HOTEL_OPT
READY READY
R619 0 5
R617 SW_RESET
10K
HOTEL_OPT 6
C Q602
RT1C3904-T112
R612 200 B HOTEL_OPT 7
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES AMP_MUTE_HOTEL HOTEL_OPT
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. E 8
SPK_R+_HOTEL
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR SPK_R-_HOTEL 9
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. 10
READY
SIF-OUT
15 A-OUT 16
NC_6
16 SIF-OUT MAIN_SIF 17
NC_7
17 NC_6 18
NC_8
18 NC_7 19
NC_9
19 NC_8 20
20 NC_9 21
21 SHIELD
SHIELD
A2
A1
A2
A1
Q301 D301 D302
RT1C3904-T112
R303 R314
HPD_MST_2 1K KDS184S 1K KDS184S
C
C
C IC301 Q302C IC302
R301 R312 2SC3875S
10K B CAT24C02WI-GT3 10K B CAT24C02WI-GT3
HPD_MST_3 RT1C3904-T112
E A0 VCC E A0 VCC
1 8 1 8 C300
R309 R311 R319 R320 0.01uF
C301
22 20
VSS SDA R305 100 VSS SDA R318 100
4 5 19 HPD 4 5
19
18+5V_POWER
18
17DDC/CEC_GND
17 JP304
JP301 16 SDA
16 DDC_SDA2 JP305
DDC_SDA3
15 SCL
15 DDC_SCL2 DDC_SCL3
JP300 14 NC
14
13 CEC
13 CEC CEC
12 CLK-
12 TMDS2_RXC- TMDS3_RXC-
11 CLK_SHIELD
11
10 CLK+ 10 CLK+
9 DATA0-
TMDS2_RXC+ 9 DATA0-
TMDS3_RXC+
6 DATA1-
TMDS2_RX0+ 6 DATA1-
TMDS3_RX0+
5 DATA1_SHIELD
TMDS2_RX1- 5 DATA1_SHIELD
TMDS3_RX1-
4 DATA1+ 4 DATA1+
3 DATA2-
TMDS2_RX1+ 3 DATA2-
TMDS3_RX1+
2 DATA2_SHIELD
TMDS2_RX2- 2 DATA2_SHIELD
TMDS3_RX2-
1 DATA2+ 1 DATA2+
20JACK_GND
TMDS2_RX2+ TMDS3_RX2+
21 .
KJA-ET-0-0032
JK303
JK302
QJ41193-CFEE1-7F
+5V_MULTI
+5V_HDMI_1
HDMI
+5V_HDMI_1
+3.3V_MST
A2
A1
R302 D300
1K KDS184S
C
Q300C IC300
HPD_MST_1 R300
10K B CAT24C02WI-GT3
RT1C3904-T112
R315
68K
E 2SC3875S A0 VCC
CEC_READY
1 8
R308 R310 C302 Q303
0.01uF R316
10K 10K 56K
A1 WP R331 100 BSS83
2 7 D303 CEC_READY
DDC_WP CEC_READY MMBD301LT1G
30V
A2 SCL R306 100 CEC_READY
3 6 D CEC_C
22 B R313
VSS SDA R307 100
4 5 0
19
G S CEC
18 D304
CDS3C30GTH
17 JP302 30V CEC_READY
16 DDC_SDA1
15 DDC_SCL1
JP303
14
13 CEC
12 TMDS1_RXC-
11
10 CLK+
9 DATA0-
TMDS1_RXC+
8 DATA0_SHIELD
TMDS1_RX0-
7 DATA0+
6 DATA1-
TMDS1_RX0+
5 DATA1_SHIELD
TMDS1_RX1-
4 DATA1+
3 DATA2-
TMDS1_RX1+
TMDS1_RX2- THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
2 DATA2_SHIELD
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
1 DATA2+
TMDS1_RX2+ FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
20JACK_GND
.
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
21
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
JK301
QJ41193-CFEE1-7F
9B [BL]1P_CAN
8B [BL]C-LUG_A COMP2_PB
ZD101 R108
POP NOISE
[RD]O-SPRING_B 5L 4H [RD]O-SPRING_A_2 R116 10K
R105 0 CVBS_RIN
MNT_OUT
SPK_R+_HOTEL HOTEL_OPT D105 R112 R120
[RD]CONTACT_B 6L 30V 220K 12K
R106 0 3H [RD]CONTACT_A_2
MNT_ROUT 16V 10uF C101
NON_HOTEL_OPT
D103
30V
R101 0 NON_HOTEL_OPT
AUDIO_R HOTEL_OPT
C
B
MUTE_LINE
POP NOISE Q101
RT1C3904-T112E
S-VIDEO(China Model)
S-VIDEO SIDE_C
JK101 R122
PSJ014-01 D107 75
30V S-VIDEO
C-LUG1
1 +3.3V_MULTI_MST
C-LUG2
2 R123
10K
GND 0-SPRING
6 3 S_VIDEO_DET
C-LUG3 C104
4 D106 OPT
C-LUG4
30V READY
5
7 SHIELD
ZD106
SIDE_Y
SD05 R121
75
ZD107 S-VIDEO
SD05
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3V_MST KCN-DS-1-0089
6630TGA004K
C
C
C
A
A
A
1
D210
D211
D212
6 RED_GND
AC
AC
AC
IC200 6
ST3232CDR GND_2
ENKMC2837-T112
ENKMC2837-T112
ENKMC2837-T112
C203 1
0.1uF 11 RED
C1+ 1 16 VCC R202 100 2 R211
PC_R
D200 GREEN_GND 75
C200 V+
2 15 GND ADUC30S03010L_AMODIODE 7
0.1uF 30V 7 DDC_DATA
2 12 DSUB_SDA
GREEN D204
C1- 3 14 T1OUT
3 PC_G 30V ADUC30S03010L_AMODIODE
R212
R203 100 8 BLUE_GND 75
SHILED
SIDE AV
JK201
PPJ218-01 PC SOUND
JK203
4A [YL]O_SPRING PEJ024-01
SIDE_V 3 E_SPRING
5.6B R227
ZD202 75 PC_AUD_R
5A[YL]CONTACT 5.6B
ZD203 6A T_TERMINAL1 R233
10K
D202 R231 R235
2A [YL]U_CAN 30V 220K 12K
B_TERMINAL1
INPUT2
7A CDS3C30GTH
1
1
R216
REAR_USB It’s possibel to 27~47ohm L200 A1 WP 100
6 VOUT VIN 1 120OHM 2 7
R229 R200
2
2
0 0
USB_DN USB_DL_N OCP_READY R217
DDC_WP
USB_DL_N A2 SCL 100
R230
5 ILIMIT GND 2 R210 C208 C209 3 6
R201
OCP_READY 4.7K
3
3
USB_DP USB_DL_P 0.1uF 10uF DSUB_SCL
0 0 R206 OCP_READY OCP_READY OCP_READY R218
UB01123-4HHS-4F
VSS SDA 100
KJA-UB-4-0004
USB_DL_P D207 D208 160 4 FAULT/ ENABLE 3 4 5
REAR_USB 30V 30V
5 4
5
1K
OCP_READY
SIDE_USB
IR(Non 19/22/26) 1
1 1
2
CONTROL KEY(Non 19/22/26) 2 2
3
3 3
41
LVDS/ CTR KEY
42
43
44
45
46
+3.3V_MULTI_MST
47
R407
48 4.7K
NON 22/27" FHD JEIDA
49 R423 0
19_22_26" R424
P405
IR(19/22/26") 50
0
51 R409 100 VESA
KEY1 READY
1 READY
52
R413 0
KEY2
2
GND
3
5V_ST
4
GND +3.3V_MULTI_MST
5
IR R404
6
19_22_26" 10K CONTROL KEY
L408 19_22_26"
LED_B BG1608B121F R416 0
7 SUB_SCL
C405
READY (19/22/26")
LED_R 100pF R410 10K +3.3V_MST
8 50V 19_22_26" C B
19_22_26"
19_22_26" Q401 E 19_22_26"
2SC3052 P404
9 R414 +3.3V_MST
19_22_26" SMAW200-03
10K 19_22_26"
. L405 19_22_26"
BG1608B121F L400
R406 BG1608B121F
KEY1
4.7K 1
19_22_26" KEY1
C402
100pF C R415 10K L401
50V B LED_R BG1608B121F KEY2 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
KEY2 2
19_22_26" Q402 E 19_22_26"
2SC3052 19_22_26" SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
19_22_26" C401 GND
19_22_26" C400
100pF 100pF19_22_26" 3 FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
50V 50V
R418 0 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
READY THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.