Product End-of-Life Disassembly Instructions

Product Category: Notebooks and Tablet PCs

Marketing Name / Model

[List multiple models if applicable.]
HP EliteBook 2760p Notebook PC
Name / Model #2
Name / Model #3
Name / Model #4
Name / Model #5
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
of items
Item Description Notes
included
in product
Printed Circuit Boards (PCB) or Printed Circuit With a surface greater than 10 sq cm 1
Assemblies (PCA) Yes
Batteries All types including standard alkaline and lithium coin 2
or button style batteries Yes
Mercury-containing components For example, mercury in lamps, display backlights, 0
scanner lamps, switches, batteries No
Liquid Crystal Displays (LCD) with a surface greater Includes background illuminated displays with gas 1
than 100 sq cm discharge lamps Yes
Cathode Ray Tubes (CRT) No 0
Capacitors / condensers (Containing PCB/PCT) No 0
Electrolytic Capacitors / Condensers measuring No 0
greater than 2.5 cm in diameter or height
External electrical cables and cords No 0
Gas Discharge Lamps No 0
Plastics containing Brominated Flame Retardants No 0
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent 0
including liquids, semi-liquids (gel/paste) and toner chambers, and service stations. No
Components and waste containing asbestos No 0
Components, parts and materials containing No 0
refractory ceramic fibers

EL-MF877-00 Page 1
Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing No 0
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
T8 Torx T8
Cross #1
Slot 2.5*50
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Took off the battery module and bottom door

2. Took off HDD module/hinge cover
3. Loosed KB screws and took off KB module
4. Took off upper case and VGA half cover
5. Took out antenna/LVDS/MIC cables
6. Took off hinge-up assembly and MB shielding
7. Took off smart card and MB assembly from base system
8. Loosed screws and took off display bezel
9. Took off jog dial/converter board
10. Took off hinge cap/CVR covers and loosed hinge screws
11. Took off display rubber and loosed screws
12. Took off LVDS/digitizer connector cables

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 2
Template Revision B

PSG instructions for this template are available at EL-MF877-01



       




         
05.11.2006
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