SUGGESTED PAD LAYOUT

Based on IPC-7351A

X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC

Y G
Z

X1-DFN1006-2 /
Dimensions MiniMELF MELF SOD123 SOD323 SOD523 SMA SMB SMC
X2-DFN1006-2
Z 1.1 4.7 6.3 4.9 3.75 2.3 6.5 6.8 9.4
G 0.3 2.1 3.3 2.5 1.05 1.1 1.5 1.8 4.4
X 0.7 1.7 2.7 0.7 0.65 0.8 1.7 2.3 3.3
Y 0.4 1.3 1.5 1.2 1.35 0.6 2.5 2.5 2.5
C 0.7 3.5 4.8 3.7 2.40 1.7 4.0 4.3 6.8

X3-DFN0603-2 X1-DFN1006-3 / X2-DFN1006-3

Z C

C Dimensions Value (in mm)

X1 Z 1.1
Dimensions Value (in mm)
G1 0.3
C 0.355 G2
X G2 0.2
X 0.230
Y (2x) X 0.7
Y 0.300
X1 0.25
Z 0.610
Y 0.4
G1 C 0.7
Y
X (2x) Z

X1-DFN1212-3

Y Dimensions Value (in mm)

C 0.80
X 0.42
Y2 X1 X1 0.32
(2x) Y 0.50
Y1 0.50
Y1
Y2 1.50
(2x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 1 of 14 Suggested Pad Layout
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 X1-DFN1212-3
Type B

X
Dimensions Value (in mm)
Y C 0.80
X 0.42
X2
X1 0.32
Y3 Y2 X2 0.90
X1(2x) Y 0.50
Y1 0.50
Y1
Y2 0.20
(2x)
Y3 1.50
C

X1-DFN1411-3

C
Dimensions Value (in mm)
Z 1.38
X2 G1 0.15
G2 0.15
X1 G2 X X 0.95
X1 0.75
X2 0.40
Y 0.75
Y G1 C 0.76
Z

X1-DFN1612-6 / X2-DFN1310-6

G2 X2
Dimensions X1-DFN1612-6 X2- DFN1310-6
G1 0.15 0.16
Y2
G2 0.175 0.17
G3 0.15 0.15
G1
X1 0.60 0.52
b
X2 0.25 0.20
Y1 Y1 0.65 0.52
Y2 0.45 0.375
a 0.10 0.09
a X1 b 0.15 0.06
G3

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 2 of 14 Suggested Pad Layout
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 U-DFN1616-6 U-DFN1616-8

Y X2 a
C G2
Dimensions Value (in mm)
X2 Dimensions Value (in mm) Y2 G1 0.15
Z 1.3 G2 0.20
G
G 0.175 X1 0.65
X1 X1 0.50 X2 0.25
X2 0.525 Y1
Y1 1.25
Y 0.30 G1 Y2 0.50
C 0.50 C 0.40
a 0.10
Z X1 C

U-DFN2018-6

X C

Dimensions Value (in mm)

C 0.50
G 0.20
Y1 X 0.25
X1 1.60
Y 0.35
G Y1 1.20

X1

U-DFN2020-3

X
X2 Value Value
Dimensions Dimensions
X4 X3 (in mm) (in mm)
Y3 R2 C 1.00 Y1 0.60
G 0.15 Y2 0.45
Y4
Y2 Y X 1.40 Y3 0.45
R3 Y5 R1 X1 0.35 Y4 0.698
G X2 0.45 Y5 0.313
Y1 X3 0.322 R1 0.225
X4 0.60 R2 0.05
X1 Y 1.10 R3 0.20
C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 3 of 14 Suggested Pad Layout
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 U-DFN2020-3 U-DFN2020-6
Type B

X Y C
Value
Dimensions Value
Y1 (in mm) X2 G Dimensions
(in mm)
C 1.30
Z 1.67
G 0.24
Y X1 G 0.15
X 0.35
X1 0.90
X1 1.52
X2 0.45
G Y 1.09
X1 G Y 0.37
Y1 0.47
Y2 C 0.65
Y2 0.50 Y
C
Z

U-DFN2020-6 U-DFN2020-6
Type B Type E

Y C
Value Value
Dimensions Dimensions
(in mm) (in mm)
G
X2 Z 1.67 C 0.650
G 0.20
X 0.400
G1 G1 0.40 X2
Y3 Y2 Y1 X1 0.285
X1 X1 1.0
X2 1.050
X2 0.45
Y 0.500
Y 0.37 X1 Y1 0.920
Y1 0.70
G Y2 1.600
C 0.65
Y1 Y3 2.300
Z Y (2x)
X (6x) C

U-DFN2510-8 U-DFN2523-6
X1
X X1
Value Y1
Dimensions Dimensions Value (in mm)
(in mm)
Y C 0.650
c 0.5
Y2 X 0.400
c1 1.0
Y1 G X1 1.700
G 0.2 Y3
Y 0.650
X 0.2
Y1 0.450
X1 0.4
Y2 1.830
Y 0.6
Y
Y3 2.700
c Y1 1.4
c1
C X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 4 of 14 Suggested Pad Layout
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 W-DFN3020-8
Type B

C X
Dimensions Value (in mm)
Y1 C 0.650
G1 G 0.285
G G1 0.090
Y2 X 0.400
Y X1 1.120
Y 0.730
X1 Y1 0.500
Y2 0.365

U-DFN3030-4 U-DFN3030-8

Dimensions Value (in mm)

C 1.300
C G1 0.100
G2 0.150
Y3 (2x) G3 0.830 Z
G6
G4 0.115
G4 G5 0.135 Dimensions Value (in mm)
Y2 G1 G3 G6 0.170 Z 2.59
X3
R G7 0.500 X1 G 0.11
Y G8 0.500 X1 2.49
G2 R 0.150 X2 0.65
G5
Y1 X 0.500 Y 0.39
X2
X1 1.375 C 0.65
X1 X2 G
G7 G8
X2 1.225
X3 1.175 Y C
Y 1.980
X (4x) Y1 1.015
Y2 0.715
Y3 0.650

U-DFN3030-8
Type E

X (x8) C

Y
(x8)
Dimensions Value (in mm)
C 0.65
C1 2.35
Y1 Y2 X 0.30
Y 0.65
Y1 1.60
Y2 2.75

C1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 5 of 14 Suggested Pad Layout
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 U-DFN3030-10 U-DFN3030-12

Y C Y C

X1 X1
Dimensions Value (in mm) Dimensions Value (in mm)
G G
Z 2.60 Z 2.60
G 0.15 G 0.15
X X 1.80 X X 1.80
X1 0.60 X1 0.60
Y 0.30 Y 0.28
G C 0.50 G C 0.45

Z Z

DFN322

C C X (3x) Value
Dimensions
(in mm)
Y (2x) C 0.65
G 0.20
G X 0.35
Y4 X1 1.52
Y1 Y 0.55
Y3
Y1 0.98
Y2 0.47
Y2
Y3 0.63
X1 Y4 2.20

W-DFN5020-6 W-DFN5060-4

Z
Y C

X C G Dimensions Value (in mm)

C 0.50
Dimensions Value (in mm)
G 0.35
X1 Y2 C 4.00
X 0.35
Y3 X 0.75
X1 0.90
Y 0.95
X2 X2 1.80 Y1 Y1 6.20
Y 0.70
Z 4.75
Y2 1.60
Y3 3.20 X (4x)

Y (4x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 6 of 14 Suggested Pad Layout
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 MSOP-8
DF-S / MiniDIP

X
Dimensions DF-S MiniDIP Dimensions Value (in mm)
Z 10.26 6.91 X 0.45
Z X 1.2 0.60 C1 Y 1.4
Y 1.52 0.76 C1 4.4
C 5.2 2.67 C2 C2 0.65
Y

C Y

MSOP-8L-EP MSOP-10

X
Dimensions Value (in mm) X
X1
C1 4.2 Dimensions Value (in mm)
C2 0.65 X 0.30
Y1 C1 X 0.32 C1 Y 1.4
X1 1.95 C1 4.4
Y 0.8 C2 0.50
C2 Y1 1.65 C2

Y Y

® ® ®
POWERDI 5 POWERDI 123 / POWERDI 323

Y X1 G X2

Y2 Y1

X1
(2x) G

Y1
(2x)

Dimensions Value (in mm)

Dimensions POWERDI®123 POWERDI®323
C 1.840
G 0.852 G 1.0 0.5
X 3.360 X1 2.2 2.0
X1 1.390 X2 0.9 0.8
Y 4.860 Y1 1.4 0.8
Y1 1.400 Y2 1.4 1.1

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 7 of 14 Suggested Pad Layout
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 ®
POWERDI 123 Type B

Value
Dimensions
Y (in mm)
G 2.000
X 1.050
X1 4.100
Y 1.500
G
X1

® ®
POWERDI 3333-8 POWERDI 5060-8

X X
G
Y2

8 5
Y2 G1 X1
Y1 Y1
Y
Y

1 4 G1
C
Y3 Y3 (4x)

X2 X2 (8x) G
C

Dimensions Value (in mm)

Dimensions Value (in mm)
C 1.270
C 0.650
G 0.660
G 0.230
G1 0.820
G1 0.420
X 4.420
Y 3.700
X1 4.100
Y1 2.250
X2 0.610
Y2 1.850
Y 6.610
Y3 0.700
Y1 3.810
X 2.370
Y2 1.020
X2 0.420
Y3 1.270

SM-8 SO-8
X
Y (8x)

C1 Dimensions Value (in mm)

Dimensions Value (in mm)
C 1.52
Y1 X 0.60
C1 4.6
Y 1.55
X 0.95 C1
C1 5.4
Y 2.80
C2 1.27
Y1 6.80 C2

Y
X (8x) C

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 8 of 14 Suggested Pad Layout
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 SOD323F

X1
Dimensions Value (in mm)
X 0.710
Y (2x) X1 2.700
Y 0.403
X (2x)

SOP-14

Dimensions Value (in mm)

X 0.60
Y 1.50
C1 C1 5.4
C2 1.27
C2

SOP-16

Dimensions Value (in mm)

X 0.60
Y 1.50
C1 C1 5.4
C2 1.27
C2

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 9 of 14 Suggested Pad Layout
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 SOT143 SOT223

X X1
X2
Y1
Y

C C1
Z G

Y2

C2
X1 X2 X2

Dimensions Value (in mm)

Dimensions Value (in mm)
Z 2.70
X1 3.3
G 1.30
X2 1.2
X 2.50
Y1 1.6
X1 1.0
Y2 1.6
X2 0.60
C1 6.4
Y 0.70
C2 2.3
C 2.0

SOT523 / SOT323 / SOT23 / SC59

Z C

X E

Dimensions SOT523 SOT323 SOT23 SC59

Z 1.8 2.8 2.9 3.4
X 0.4 0.7 0.8 0.8
Y 0.51 0.9 0.9 1.0
C 1.3 1.9 2.0 2.4
E 0.7 1.0 1.35 1.35

SOT23F
C

Dimensions Value (in mm)

C 0.95
Y1
X 0.60
Y 0.80
Y (3x) Y1 1.80

X (3x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 10 of 14 Suggested Pad Layout
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 SC74R / SOT26 / SOT363 / SOT563 SOT25 / SOT353 / SOT553

C2 C2 C2 C2

G C1 G C1
Z Z

Y Y

X X

Dimensions SC74R / SOT26 SOT363 SOT563 Dimensions SOT25 SOT353 SOT553

Z 3.20 2.5 2.2 Z 3.20 2.5 2.2
G 1.60 1.3 1.2 G 1.60 1.3 1.2
X 0.55 0.42 0.375 X 0.55 0.42 0.375
Y 0.80 0.6 0.5 Y 0.80 0.6 0.5
C1 2.40 1.9 1.7 C1 2.40 1.9 1.7
C2 0.95 0.65 0.5 C2 0.95 0.65 0.5

SOT666

Y (6x)
Dimensions Value (in mm)
C 0.50
G G 0.80
X 0.35
Y 0.50

X
(6x)

SOT953

C C

Dimensions Value (in mm)

C 0.350
Y1 X 0.200
Y 0.200
Y1 1.100
Y (5X)

X (5X)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 11 of 14 Suggested Pad Layout
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 SOT963

C C

Dimensions Value (in mm)

C 0.350
Y1 X 0.200
Y 0.200
Y1 1.100
Y (6X)

X (6X)

SOT89-3 SOT89-5

X1 X1
Dimensions Value (in mm) Dimensions Value (in mm)
X 0.900 Y4 X1 1.7
X2 (2x) X1 1.733
X2 0.55
X2 0.416
Y1 X3 0.4
Y 1.300 Y1
Y3 Y4 Y1 4.6
Y1 4.600
X2 Y2 1.2
Y2 1.475
Y Y2 Y3 0.5
Y3 0.950
Y2 X3 Y3 Y4 1.1
Y4 1.125
C C 1.500 C 3.0
C
X (3x)

2
TO252 (DPAK) / TO263 (D PAK)

X2
2
Dimensions TO252 / DPAK TO263 / D PAK
Y2
Z 11.6 16.9
X1 1.5 1.1
Z X2 7.0 10.8
C
Y1 2.5 3.5
Y2 7.0 11.4
Y1 C 6.9 9.5
E1 2.3 2.5

X1 E1

TO252-4

X1

Dimensions Value (in mm)

c 1.27
Y1 c1 2.54
X 1.00
Y2 X1 5.73
Y 2.00
c1 Y3
Y1 6.17
Y2 1.64
Y
Y3 2.66
X (4x) c

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 12 of 14 Suggested Pad Layout
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 TO252-5 TO263-5

X X

Y1 Y1

Y Y
C1

Y2 Y2

X1 X1
C2 C

Dimensions Value (in mm)

Dimensions Value (in mm)
X 5.6
X 10.9
X1 0.6
X1 1.05
Y 11.0
Y 15.7
Y1 5.6
Y1 9.1
Y2 2.0
Y2 2.5
C1 7.2
C 1.7
C2 1.27

TSOT25

C C

Dimensions Value (in mm)

C 0.950
Y1
X 0.700
Y 1.000
Y1 3.199
Y (5x)

X (5x)

TSOT26

C C

Dimensions Value (in mm)

C 0.950
Y1
X 0.700
Y 1.000
Y1 3.199
Y (6x)

X (6x)

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 13 of 14 Suggested Pad Layout
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 TSSOP-14

Dimensions Value (in mm)

X 0.45
Y 1.45
C1 C1 5.9
C2 0.65
C2

U-WLB1010-4

ØD

Dimensions Value (in mm)

C C 0.50
D 0.25

U-WLB1510-6

Value
Dimensions
(in mm)
C1 C 0.50
C C1 1.00
D 0.25

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.
These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave
soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming
Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
AP02001 Rev. 43 14 of 14 Suggested Pad Layout
www.diodes.com © Diodes Incorporated