STGB8NC60KD - STGD8NC60KD

STGF8NC60KD - STGP8NC60KD

600 V - 8 A - short circuit rugged IGBT

Features
■ Lower on voltage drop (VCE(sat)) 2

■ Lower CRES / CIES ratio (no cross-conduction 3

1
susceptibility) 3
2 DPAK
■ Very soft ultra fast recovery antiparallel diode 1
TO-220
■ Short circuit withstand time 10 µs
2

Applications
■ High frequency motor controls 3 3
2 1
1
■ SMPS and PFC in both hard switch and D²PAK
TO-220FP
resonant topologies
■ Motor drivers

Description Figure 1. Internal schematic diagram

This IGBT utilizes the advanced PowerMESH™

process resulting in an excellent trade-off
between switching performance and low on-state
behavior.

Table 1. Device summary

Order codes Marking Package Packaging

STGB8NC60KDT4 GB8NC60KD D²PAK Tape and reel

STGD8NC60KDT4 GD8NC60KD DPAK Tape and reel
STGF8NC60KD GF8NC60KD TO-220FP Tube
STGP8NC60KD GP8NC60KD TO-220 Tube

April 2008 Rev 2 1/18

www.st.com 18
Contents STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

Contents

1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................. 7

3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical ratings

1 Electrical ratings

Table 2. Absolute maximum ratings

Value
Symbol Parameter D²PAK Unit
DPAK TO-220FP
TO-220

VCES Collector-emitter voltage (VGE = 0) 600 V

IC(1) Collector current (continuous) at TC = 25 °C 15 7 A

IC(1) Collector current (continuous) at TC = 100 °C 8 4 A

ICL(2) Turn-off latching current 30 A

ICP(3) Pulsed collector current 30 A

VGE Gate-emitter voltage ±20 V

IF Diode RMS forward current at TC = 25 °C 7 A
Surge not repetitive forward current
IFSM 20 A
tp = 10 ms sinusoidal

Insulation withstand voltage (RMS) from all

VISO three leads to external hea sink -- -- 2500 V
( t=1 s; TC = 25 °C)

PTOT Total dissipation at TC = 25 °C 65 62 24 W

Tj Operating junction temperature – 55 to 150 °C
Short circuit withstand time
Tscw (VCE = 0.5 VBR(CES) , TC = 125 °C, RG = 10 Ω, 10 µs
VGE = 12 V)

1. Calculated according to the iterative formula:

T –T
JMAX C
I ( T ) = -----------------------------------------------------------------------------------------------------
-
C C R × V (T , I )
THJ – C CESAT ( MAX ) C C

2. Vclamp = 80% (VCES), VGE=15 V, RG=10 Ω, TJ=150 °C

3. Pulse width limited by max junction temperature allowed

Table 3. Thermal resistance

Value
Symbol Parameter D²PAK Unit
DPAK TO-220FP
TO-220

Thermal resistance junction-case max

Rthj-case 1.9 2.0 5.1 °C/W
IGBT
Thermal resistance junction-case max
Rthj-case 4 4.5 7 °C/W
diode
Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W

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Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

2 Electrical characteristics

(TCASE=25°C unless otherwise specified)

Table 4. Static
Symbol Parameter Test conditions Min. Typ. Max. Unit

Collector-emitter
V(BR)CES breakdown voltage IC= 1 mA 600 V
(VGE= 0)

Collector-emitter saturation VGE= 15 V, IC = 3 A 2.2 2.75 V

VCE(sat)
voltage VGE= 15 V, IC = 3 A, TC = 125°C 1.8 V

VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA 4.5 6.5 V

Collector cut-off current VCE = 600 V 150 µA

ICES
(VGE = 0) VCE = 600 V, TC = 125 °C 1 mA

Gate-emitter leakage
IGES VGE= ±20 V ±100 nA
current (VCE = 0)

gfs (1) Forward transconductance VCE = 15 V, IC= 3 A 1.9 S

1. Pulse duration = 300 us, duty cycle 1.5 %

Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit

Cies Input capacitance

380 pF
Output capacitance VCE = 25 V, f = 1 MHz,
Coes 46 pF
Reverse transfer VGE = 0
Cres 8.5 pF
capacitance
Qg Total gate charge VCE = 390 V, IC = 3 A, 19 nC
Qge Gate-emitter charge VGE = 15 V, 5 nC
Qgc Gate-collector charge (see Figure 20) 9 nC

Table 6. Switching on/off (inductive load)

Symbol Parameter Test conditions Min. Typ. Max. Unit

td(on) Turn-on delay time VCC = 390 V, IC = 3 A 17 ns

tr Current rise time RG= 10 Ω, VGE= 15 V 6 ns
(di/dt)on Turn-on current slope (see Figure 21) 655 A/µs

VCC = 390 V, IC =3 A
td(on) Turn-on delay time 16.5 ns
RG= 10 Ω, VGE= 15 V,
tr Current rise time 6.5 ns
TC = 125 °C
(di/dt)on Turn-on current slope 575 A/µs
(see Figure 21)

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics

Table 6. Switching on/off (inductive load) (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

tr(Voff) Off voltage rise time Vcc = 390 V, IC = 3 A, 33 ns

td(off) Turn-off delay time RGE = 10 Ω, VGE =15 V 72 ns
tf Current fall time (see Figure 21) 82 ns

Vcc = 390 V, IC = 3 A,
tr(Voff) Off voltage rise time 60 ns
RGE=10 Ω, VGE =15 V,
td(off) Turn-off delay time 106 ns
TC = 125 °C
tf Current fall time 136 ns
(see Figure 21)

Table 7. Switching energy (inductive load)

Symbol Parameter Test conditions Min. Typ. Max. Unit

Eon(1) Turn-on switching losses VCC = 390 V, IC = 3 A 55 µJ

Eoff(2) Turn-off switching losses RG= 10 Ω, VGE=15 V 85 µJ
Ets Total switching losses (see Figure 21) 140 µJ

VCC = 390 V, IC = 3 A
Eon(1) Turn-on switching losses 87 µJ
RG= 10 Ω, VGE= 15 V,
Eoff(2) Turn-off switching losses 162 µJ
TC = 125 °C
Ets Total switching losses 249 µJ
(see Figure 21)
1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in
a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the
same temperature (25°C and 125°C)
2. Turn-off losses include also the tail of the collector current

Table 8. Collector-emitter diode

Symbol Parameter Test conditions Min. Typ. Max. Unit

IF = 3 A 1.6 2.1 V
VF Forward on-voltage
IF = 3 A, TC = 125 °C 1.3 V

trr Reverse recovery time IF = 3 A, VR = 30 V, 23.5 ns

Qrr Reverse recovery charge di/dt = 100 A/µs 16.5 nC
Irrm Reverse recovery current (see Figure 22) 1.4 A

trr Reverse recovery time IF = 3 A,VR = 30 V, 39 ns

Qrr Reverse recovery charge TC =125 °C, di/dt = 100 A/µs 39 nC
Irrm Reverse recovery current (see Figure 22) 2 A

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Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

2.1 Electrical characteristics (curves)

Figure 2. Output characteristics Figure 3. Transfer characteristics

Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs

temperature

Figure 6. Gate charge vs gate-source voltage Figure 7. Capacitance variations

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Electrical characteristics

Figure 8. Normalized gate threshold voltage Figure 9. Collector-emitter on voltage vs

vs temperature collector current

Figure 10. Normalized breakdown voltage vs Figure 11. Switching losses vs temperature
temperature

Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector
current

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Electrical characteristics STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

Figure 14. Thermal impedance for TO-220/ Figure 15. Turn-off SOA
D²PAK

Figure 16. Forward voltage drop versus Figure 17. Thermal impedance for DPAK
forward current

Figure 18. Thermal impedance for TO-220FP

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Test circuit

3 Test circuit

Figure 19. Test circuit for inductive load Figure 20. Gate charge test circuit
switching

Figure 21. Switching waveform Figure 22. Diode recovery time waveform

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Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data

TO-220 mechanical data

mm inch
Dim
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.14 1.70 0.044 0.066
c 0.48 0.70 0.019 0.027
D 15.25 15.75 0.6 0.62
D1 1.27 0.050
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.051
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
∅P 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116

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Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

TO-252 (DPAK) mechanical data

mm.
DIM.
min. typ max.
A 2.20 2.40
A1 0.90 1.10
A2 0.03 0.23
b 0.64 0.90
b4 5.20 5.40
c 0.45 0.60
c2 0.48 0.60
D 6.00 6.20
D1 5.10
E 6.40 6.60
E1 4.70
e 2.28
e1 4.40 4.60
H 9.35 10.10
L 1
L1 2.80
L2 0.80
L4 0.60 1
R 0.20
V2 0o 8o

0068772_G

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Package mechanical data

D²PAK (TO-263) mechanical data

mm inch
Dim
Min Typ Max Min Typ Max
A 4.40 4.60 0.173 0.181
A1 0.03 0.23 0.001 0.009
b 0.70 0.93 0.027 0.037
b2 1.14 1.70 0.045 0.067
c 0.45 0.60 0.017 0.024
c2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 7.50 0.295
E 10 10.40 0.394 0.409
E1 8.50 0.334
e 2.54 0.1
e1 4.88 5.28 0.192 0.208
H 15 15.85 0.590 0.624
J1 2.49 2.69 0.099 0.106
L 2.29 2.79 0.090 0.110
L1 1.27 1.40 0.05 0.055
L2 1.30 1.75 0.051 0.069
R 0.4 0.016
V2 0° 8° 0° 8°

0079457_M

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Package mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

TO-220FP mechanical data

mm. inch
Dim.
Min. Typ Max. Min. Typ. Max.
A 4.40 4.60 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.017 0.027
F 0.75 1.00 0.030 0.039
F1 1.15 1.50 0.045 0.067
F2 1.15 1.50 0.045 0.067
G 4.95 5.20 0.195 0.204
G1 2.40 2.70 0.094 0.106
H 10 10.40 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.80 10.60 0.385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.90 16.40 0.626 0.645
L7 9 9.30 0.354 0.366
Dia 3 3.2 0.118 0.126

E
A

D
B

L3
L6
L7
F1

Dia
F

G1

G
H

F2

1 2 3
L5
L2 L4
7012510-I

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Packaging mechanical data

5 Packaging mechanical data

D2PAK FOOTPRINT

TAPE AND REEL SHIPMENT

REEL MECHANICAL DATA

mm inch
DIM.
MIN. MAX. MIN. MAX.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197

BASE QTY BULK QTY

TAPE MECHANICAL DATA
1000 1000
mm inch
DIM.
MIN. MAX. MIN. MAX.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type

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Packaging mechanical data STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

DPAK FOOTPRINT

All dimensions are in millimeters

TAPE AND REEL SHIPMENT

REEL MECHANICAL DATA

mm inch
DIM.
MIN. MAX. MIN. MAX.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881

BASE QTY BULK QTY

TAPE MECHANICAL DATA
2500 2500
mm inch
DIM.
MIN. MAX. MIN. MAX.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641

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STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD Revision history

6 Revision history

Table 9. Document revision history

Date Revision Changes

02-Oct-2007 1 First release

01-Apr-2008 2 Updated Figure 14 and Figure 17

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 STGB8NC60KD - STGD8NC60KD - STGF8NC60KD - STGP8NC60KD

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