BSNL CPAN Project Overview

October 27, 2017

Broaden Your Future

CPAN Project Overview

CPAN Equipment Brief Introduction

CPAN Network Design Principle

Customer Questions

1. Space and power requirement

2. Trans power output

3. Permissible Span loss between two nodes

4. WAN/LAN feasibility of 10G bandwidth, Client side interface etc.

5. Integration and seamless connectivity with MPLS and other transports

6. Features and facilities available

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1 CPAN Project Overview
2 CPAN Equipment Brief Introduction
3 CPAN Network Design Principle
BSNL CPAN Project
 BSNL deployed CPAN Access Network
MPLS-TP based Converged Packet Access Network (CPAN)
• Network in 15 Areas
• 4935 B1 & B2
• 10200 A1 & A2

➢ Equipment Type

• B1 & B2 : CiTRANS 650 U3 100G

• A1 & A2 : CiTRANS 610A-8 6G

➢ Service Deployment

2G 3G 4G WiFi

ILL P2P VPN DSLAM

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CPAN Project Scale
Equipment distribution and quantity(PO)
Equipment Name TYPE Description PH1-Qty. PH2-Qty. Total
B1 Typical Configurations 1316 1316 2632
CiTRANS 650 U3
B2 High-level Configuration 1152 1151 2303
A1 Direct-Current (DC) 4935 4935 9870
CiTRANS 610A-8
A2 Alternating Current (AC) 165 165 330

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CPAN Project Scale
Equipment Ports’ type and quantity

CPAN Number of Ports per Switch

Total Quantity
Switches 10G(O) GE(O) GE/FE(E) STM-1（O） E1(E)
B1 2632 2 10 10 4 32
B2 2303 4 20 20 8 32
A1 9870 0 2 4 0 4
A2 330 0 2 4 0 4
SUM 15135 14476 92780 113180 28952 198720

All ports can be configured as client interface, that is UNI mode

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 1 CPAN Project Overview

2 CPAN Equipment Brief Introduction

3 CPAN Network Design Principle
CiTRANS 610A-8A/8D Hardware Descriptions

Combo: GE/FE(O) or GE/FE(E) Power Consumption: 15w

System Box QTY.
A1/A2
Module System Board (2*GE/FEo+2*GE/Fe Combo+2*FE/GEe+4*E1, DC) /AC 1
CiTRANS 610 DC/AC
Optical module
Dimension 254(W)×225(D)×43.5(H)mm GE optical module（1000BASE-LX, 1310nm, 10km, SFP, LC） 2

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CiTRANS 610A-8A/8D Hardware Descriptions

(1)NMS interface (2)E1 interface (3)State LED (4)Reset

(5)Clock/Time syn. (6)FE/GE(E) interface (7)FE/GE(O)interface (8)Power SW

(9)Power interface (10)GND/ESD (11) Hangers

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CiTRANS 650 U3 Hardware Descriptions
Service Card

• Support 10GE/GE/FE/STM-1/E1

FAN Unit

• Auto mode
• Manual mode

Cross Connection & EMU Card

Power Supply Card
• PAN EMU & Cross connect platform
• Adopt 1+1 Protection
• Time & clock synchronization • -48V DC 1+1

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 PDP

Power
B1 consumption
389（W)

Abbr. Card Description

Two Channels，-48V, 32A SNCV1 Cross Connection & Clock Unit
2200H×600W×300Dmm Rack
PWR Power Unit
XSV3 10GE Optical Card (1 Port)
GSV4 GE/FE Adaptive Electrical Card (8 Ports for E)
MSV1 GE/FE Combo Card (8 Ports for both O&E)
CiTRANS 650
S1V1 STM1 Optical Card (CES, 4 Ports)
S1V1 5 E1V1 10 E1V1 E1 Process Card (32 ch, Panel Outlet, CES)
XSV3 4 XSV3 9
MSV1 3 MSV1 8 Optical Module QTY
FAN
2 GSV4 7
UNIT 10GE Optical Module (10GBASE-LR,1310nm, 10km, SFP+, LC) 2
1 6
SNCV1 12 PWR 14
SNCV1 11 PWR 13 GE Optical Module (1000BASE-LX, 1310nm, 10km, SFP, LC) 10
154Hx480Wx225Dmm Sub-Rack 155M Optical Module (L1.1-1310nm, 40km, SFP, LC) 4

GE/FE Self-adapted Electrical Module (1000/100BASE, SFP, RJ45) 2

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 PDP

Power
B2 consumption
465（W)

Abbr. Card Description

Two Channels，-48V, 32A SNCV1 Cross Connection & Clock Unit
2200H×600W×300Dmm Rack
PWR Power Unit
XSV2 10GE Optical Card (2 Ports)
GSV4 GE/FE Adaptive Electrical Card (8 Ports for E)
MSV1 GE/FE Combo Card (8 Ports for both O&E)
CiTRANS 650
S1V5 STM1 Optical Card (CES, 8Ports)
S1V5 5 E1V1 10 E1V1 E1 Process Card (32 ch, Panel Outlet, CES)
MSV1 4 MSV1 9
MSV1 3 GSV4 8 Optical Module QTY
FAN
XSV2 2 XSV2 7
UNIT 10GE Optical Module (10GBASE-LR,1310nm, 10km, SFP+, LC) 4
1 GSV4 6
SNCV1 12 PWR 14
SNCV1 11 PWR 13 GE Optical Module (1000BASE-LX, 1310nm, 10km, SFP, LC) 20
154Hx480Wx225Dmm Sub-Rack 155M Optical Module (L1.1-1310nm, 40km, SFP, LC) 8

GE/FE Self-adapted Electrical Module (1000/100BASE, SFP, RJ45) 4

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CiTRANS 650 U3 Service Cards

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Optical Module TX/RX Specifications

Receiving Overload
Transmitting optical
Module Type power (dBm)
sensitivity optical
(dBm) power (dBm)

*10GE Optical Module

-8.2~0.5 -14.4 0.5
(10GBASE-LR,1310nm, 10km, SFP+, LC)

GE Optical Module
-8~-3 -20 -3
(1000BASE-LX, 1310nm, 10km, SFP, LC)

155M Optical Module

-5~-0 -34 -10
(L1.1-1310nm, 40km, SFP, LC)
TX RX
* Span Loss 6.2~14.9 (dBm)

Node A Node B

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 1 CPAN Project Overview
2 CPAN Equipment Brief Introduction

3 CPAN Network Design Principle

CHD SSA--B2&B1 Connectivity Diagram--Original
DR EMS SEC 17 CHANDIGARH

BNG
CH 4 FE
10G Ring
PE 1G

B1-CiTRANS 650 U3 FE MPLS/IP

PE
Cloud

PE
MAIN EMS NOC BANGLORE
B2-CiTRANS 650 U3
1G
For Mobile Data

Outer Ring
Inner Ring

CH 2
CH 3 CH 1 10G Ring
10G Ring 10G Ring

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CHD SSA--B2&B1 Connectivity Diagram--Modify
DR EMS SEC 17 CHANDIGARH

CH 4 FE(e)
10G Ring
N*GE PE 1G(e)

Management Data ① PE
MPLS/IP
Service Data
Cloud
B1-CiTRANS 650 U3 10G(o)
FE(e) PE
MAIN EMS NOC BANGLORE
B2-CiTRANS 650 U3
1G(e)

For Mobile Data

Outer Ring Inner Ring

CH 2
② 10G Ring
CH 3
CH 1
10G Ring
10G Ring

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Design Principle
➢ The management data should be directly uplink to PE Router , just like ① in picture

1*FE interface, 10Mbps bandwidth required, 2*FE interfaces if protection required

➢ Dual uplink. Recommend each access ring uplink to 2 aggregation nodes，

just like ② in picture

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Design Principle ---Access Network

1. Adopt Ring topology CR650

2. Ring capacity should be 10GE, be ready for 4G
Ring
or Massive Wi-Fi
3. Nodes per Ring should be 6~8, Maximum 10
Rural only
4. In case Rural area don't have sufficient fiber, it is
allow to have a short link, Ring + Link Maximum CR610A

nodes should less than 15

5. Dual uplink. Each Access Ring should uplink to
2 Aggregation Nodes
Dual uplink
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Design Principle ---Aggregation Network

1. Adopt Ring topology

2. Ring capacity should be 10GE and can upgrade
to higher Capacity
3. Nodes per Ring should be 4~8
4. Dual uplink. Each Aggregation Ring should
uplink to 2 Core Nodes

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1.Recommend Topology for B1/B2/A1/A2

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2.IP Planning
MPLS/IP
PE

10.X.X.X/30 10.X.X.X/30 NMU IP

B2 B2
 10.X.X.X/30,Private Network IP
10.X.X.X/30  30 bits mask
10.X.X.X/30
 Allotted by BSNL
B1 B1  Each IP in the different IP segment

10.X.X.X/30 B1/2 B1/2 10.X.X.X/30

10.X.X.X/30
A1/2 A1/2 10.X.X.X/30

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FiberHome Reply
1. Space and power requirement
➢ Space: Rack 2200×600×300mm; Sub-Rack 154x480x225mm

➢ Power: Two Channels. -48V, 32A per channel

2. Trans power output & 3. Permissible Span loss between two nodes

Transmitting optical Receiving sensitivity Overload optical Span Loss

Module Type power (dBm) (dBm) power (dBm) (dBm)

10GE Optical Module (10GBASE-LR,1310nm, 10km, SFP+, LC) -8.2~0.5 -14.4 0.5 6.2~14.9

GE Optical Module (1000BASE-LX, 1310nm, 10km, SFP, LC) -8~-3 -20 -3 12~17

155M Optical Module (L1.1-1310nm, 40km, SFP, LC) -5~0 -34 -10 29-34

4. WAN/LAN feasibility of 10G bandwidth, Client side interface etc.

➢ As per tender, 10G LAN Port; All ports can be configured as client interface, that is UNI mode
5. Integration and seamless connectivity with MPLS and other transports & 6. Features and facilities available

➢ Refer to PPTs

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Something about MPLS-TP···

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Summary
Points SDH/MSTP RPR MPLS-TP

Service TDM, limited Ethernet Ethernet only Ethernet, TDM(E1/STM-1)

Capacity 155M/622M/2.5G/10G GE/10G GE/10GE/40GE/100GE
Highest Efficiency
Efficiency for Low, with 50% capacity for Packet based transport, almost
Ethernet Protection
Higher than SDH
all bandwidth used for service
and support resilience tunnel
Link, Ring, Mesh Link, Ring, Mesh
Topology Suitable for big network, E2E Ring Suitable for big network, E2E
service monitor service monitor

OAM Powerful No special OAM for RPR Powerful

Strong
Protection
Strong Ring protection LSP, PW, Wrapping, Dual-
SNCP, MSP
homing
Sync Synchronous Sync-E 1588, Sync-E
IEEE 802.17 stopped promotion, No further develop of RPR industry chain
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MPLS Transport Profile (TP)
Multi-protocol Label Switching - Transport Profile
MPLS
Qos Manage ➢ Based on packet switch, carrying carrier-
ethernet Multicast Pseudo Wire
ACL class Ethernet business, compatible with
Packet Switch TDM, ATM etc.
MPLS-TP
Time ➢ Inherited MSTP idea, Combines the
Protection Switch
Network Management advantages of Ethernet and MPLS, Meet
MSTP Level Network
OAM
the next generation network technology

MPLS-TP Characteristic:
➢ Connection - Oriented, Statistical Multiplexing ➢ Carrier-Class OAM & Protection
➢ Scalability, Survivability ➢ Support Multi Services
➢ Support 1588, Sync-E
Tunl1 UNI NNI NNI
Flexible Tunl2
Tunnel Tunl3 20*GE 10GE
Free Bandwidth
CIR:500M PIR:1G

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MPLS-TP Data Frame
TPID
DA SA （0x8847） TMP TMC IP Payload CRC

6 Bytes 6Bytes 2Bytes 4Bytes 4Bytes 20Bytes 4Bytes

TMP/LSP Label TMC/PW Label

TMP TMC
Lable EXP Sbit=0 TTL EXP Sbit=1 TTL
Lable
20bit 3bit 1bit 8bit 20bit 3bit 1bit 8bit

• DA: Destination Address

• SA: Source Address
• TPID: Tag Protocol Identifier
• TMP: T-MPLS Path
• TMC: T-MPLS Channel
• CRC: Cyclic Redundancy Check
Streams correspond with TMP corresponds with
• EXP: reserve, for test specific customer service, TMC corresponds with TUNNEL, different
they are distinguished by PW, different PW has TUNNEL has different
VLAN-ID or Emulation -ID different PW label TUNNEL label

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Ethernet service encapsulation format
LSP

MPLS Domain
CE1 LER LSR LER CE2

Ethernet Header 1 Ethernet Header 2

MAC DA Tunnel Label 1 Tunnel Label 2 MAC DA
MAC SA PW Label PW Label MAC SA
C-tag(optional) MAC DA MAC DA C-tag(optional)
Data MAC SA MAC SA Data
C-tag(optional) C-tag(optional)
Data Data

• LSP: Label Switch Path

• LER: Label Edge Router MAC DA n
• LSR: Label Switch Router Ethernet Header n MAC SA n
0x8847

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TDM service encapsulation format

LSP

MPLS Domain
CE1 LER LSR LER CE2

Ethernet Header 1 Ethernet Header 2

TDM Data
Tunnel Label 1 Tunnel Label 2
TDM Data
PW Label PW Label
Control Word Control Word

RTP Header RTP Header

(optional) (optional)
• LSP: Label Switch Path TDM Data TDM Data
• LER: Label Edge Router
• LSR: Label Switch Router

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MPLS-TP Domain Routers
LER

LSR
LSR
LSR
27 12
LSR 29

27 29

LER 12 23
LER
DATA
MPLS Domain LSR DATA

LSR
23 27

LSR

LER
LER

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 Key Technology ①: Circuit Emulation

MPLS-TP Pseudowire Muxing

Encap
PWE3
802.1ad
802.1Q
SAToP

Encap
PWE3
CEoP
MPLS Label Ethernet MPLS Label
E1 Service Service MPLS-TP
Switched Path Switched Path GE/10GE
Circuit Emulation Ach
(LSP) (LSP)
Ach

G-Ach G-Ach

Non-
Packet net load
•Non-structuralized emulation protocol SAToP
Octet Octet Octet
……..
Octet structuralized Packet Octet Octet
…..
Octet (RFC4553)
1 2 3 n emulation header 1 2 n •Provides the emulation function for the PDH circuit services with
RFC4553 non-structuralized (i.e. non-frame node). It segments all TDM services
as serial data code streams which are encapsulated in PW messages
that are transmitted on pseudo wire.

• Structuralized emulation protocol CESoPSN

Packet net load
(RFC5086)
Frame Structuralized Packet •Different from SAToP protocol and provides structuralized TDM
TS1 TS2 …….. TS24 TS1 TS2 ….. TS24 TS1 TS2 ….. TS24
header emulation header service emulation transport function. CESoPSN protocol can identity
RFC5086 the frame structure of TDM services. It does not necessarily transport
Time slot of Frame1 Time slot of Frame2 free timeslot channels, instead, it only extracts the useful timeslots of
CE equipment from the E1 service flow and encapsulate them into
PW message which will be transported.

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Key Technology ②: OAM

Function Type Description

CC Continuity and Connectivity Check

AIS Alarm Indication Signal

RDI Remote Defect Indication

Failure
Management LB Loopback

LCK Lock

TST TEST

CSF Client Signal Fail

LM Frame Loss Measurement

Performance
Monitor
DM Frame Delay Measurement

Ethernet Service OAM ITU-T Y.1731

APS Automatic Protection Switching

PAN Network OAM

GAch+ITU-T Y.1731
(LSP/PW/Section) Others MCC Management Communication Channel

Access Link OAM IEEE 802.3ah SSM Synchronization Status Message

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Key Technology ③: QoS

Voice: cir=2M pir=2M

Data: cir=4M pir=10M
Signal: cir=1M pir=2M

Congestion

V D S

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Key Technology ④:Synchronization

Requirements
Wireless for clock Requirements for clock phase
system frequency synchronization
accuracy

GSM 0.05ppm NA

WCDMA 0.05ppm NA
FDD
TD-SCDMA 0.05ppm ±1.5us , where 0.5us is required by
the aerial part and 1us by the ground
part

CDMA2000 0.05ppm 3us

LTE 0.05ppm Time synchronization is preferrable.

IEEE1588 is "Synchronization Protocol Standard for

Precision Clocks of Network Measurement and Control
System"

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Any Doubt???

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 Thanks

Broaden Your Future