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TJA1042
High-speed CAN transceiver with Standby mode
Rev. 04 — 6 October 2009 Product data sheet

1. General description
The TJA1042 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the
automotive industry, providing the differential transmit and receive capability to (a
microcontroller with) a CAN protocol controller.

The TJA1042 is a step up from the TJA1040, PCA82C250 and PCA82C251 high-speed
CAN transceivers. It offers improved ElectroMagnetic Compatibility (EMC) and
ElectroStatic Discharge (ESD) performance, and also features:

• Ideal passive behavior to the CAN bus when the supply voltage is off
• A very low-current Standby mode with bus wake-up capability
• TJA1042T/3 and TJA1042TK/3 can be interfaced directly to microcontrollers with
supply voltages from 3 V to 5 V

These features make the TJA1042 an excellent choice for all types of HS-CAN networks,
in nodes that require a low-power mode with wake-up capability via the CAN bus.

2. Features

2.1 General
n Fully ISO 11898-2 and ISO 11898-5 compliant
n Suitable for 12 V and 24 V systems
n Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
n VIO input on TJA1042T/3 and TJA1042TK/3 allows for direct interfacing with 3 V to 5 V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
n SPLIT voltage output on TJA1042T for stabilizing the recessive bus level (available in
SO8 package only)

2.2 Low-power management

n Very low-current Standby mode with host and bus wake-up capability
n Functional behavior predictable under all supply conditions
n Transceiver disengages from the bus when not powered up (zero load)

2.3 Protections
n High ESD handling capability on the bus pins
n Bus pins protected against transients in automotive environments
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NXP Semiconductors TJA1042
High-speed CAN transceiver with Standby mode

n Transmit Data (TXD) dominant time-out function

n Bus-dominant time-out function in Standby mode
n Undervoltage detection on pins VCC and VIO
n Thermally protected

3. Ordering information
Table 1. Ordering information
Type number[1] Package
Name Description Version
TJA1042T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96
TJA1042T/3 SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96
TJA1042TK/3 HVSON8 plastic thermal enhanced very thin small outline package; no leads; SOT782
8 terminals; body width 3 × 3 × 0.85 mm

[1] TJA1042T with SPLIT pin; TJA1042T/3 and TJA1042TK/3 with VIO pin.

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NXP Semiconductors TJA1042
High-speed CAN transceiver with Standby mode

4. Block diagram

VIO VCC

5 3

VCC TJA1042

TEMPERATURE
PROTECTION
VIO(1) 7
CANH

SLOPE
CONTROL
AND
1 TIME-OUT 6
TXD DRIVER CANL

VIO(1)

MODE 5
8 CONTROL SPLIT SPLIT(1)
STB

4
RXD
MUX
AND
DRIVER
WAKE-UP
FILTER

015aaa017
GND

(1) In a transceiver with a SPLIT pin, the VIO input is internally connected to VCC.
Fig 1. Block diagram

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NXP Semiconductors TJA1042
High-speed CAN transceiver with Standby mode

5. Pinning information

5.1 Pinning

TJA1042T/3
TJA1042T TJA1042TK/3

TXD 1 8 STB TXD 1 8 STB

GND 2 7 CANH GND 2 7 CANH

VCC 3 6 CANL VCC 3 6 CANL

RXD 4 5 SPLIT RXD 4 5 VIO

015aaa018 015aaa019

Fig 2. Pin configuration diagrams

5.2 Pin description

Table 2. Pin description
Symbol Pin Description
TXD 1 transmit data input
GND 2 ground supply
VCC 3 supply voltage
RXD 4 receive data output; reads out data from the bus lines
SPLIT 5 common-mode stabilization output; in TJA1042T version only
VIO 5 supply voltage for I/O level adapter; in TJA1042T/3 and TJA1042TK/3 versions
only
CANL 6 LOW-level CAN bus line
CANH 7 HIGH-level CAN bus line
STB 8 Standby mode control input

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NXP Semiconductors TJA1042
High-speed CAN transceiver with Standby mode

6. Functional description
The TJA1042 is a HS-CAN stand-alone transceiver with Standby mode. It combines the
functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers with improved
EMC and ESD handling capability and quiescent current performance. Improved slope
control and high DC handling capability on the bus pins provide additional application
flexibility.

The TJA1042 is available in two versions, distinguished only by the function of pin 5:

• The TJA1042T is 100 % backwards compatible with the TJA1040, and also covers
existing PCA82C250 and PCA82C251 applications
• The TJA1042T/3 and TJA1042TK/3 allow for direct interfacing to microcontrollers with
supply voltages down to 3 V

6.1 Operating modes

The TJA1042 supports two operating modes, Normal and Standby, which are selectable
via pin STB. See Table 3 for a description of the operating modes under normal supply
conditions.

Table 3. Operating modes

Mode Pin STB Pin RXD
LOW HIGH
Normal LOW bus dominant bus recessive
Standby HIGH wake-up request no wake-up request
detected detected

6.1.1 Normal mode

A LOW level on pin STB selects Normal mode. In this mode, the transceiver can transmit
and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram).
The differential receiver converts the analog data on the bus lines into digital data which is
output to pin RXD. The slope of the output signals on the bus lines is controlled and
optimized in a way that guarantees the lowest possible EME.

6.1.2 Standby mode

A HIGH level on pin STB selects Standby mode. In Standby mode, the transceiver is not
able to transmit or correctly receive data via the bus lines. The transmitter and
Normal-mode receiver blocks are switched off to reduce supply current, and only a
low-power differential receiver monitors the bus lines for activity. The wake-up filter on the
output of the low-power receiver does not latch bus dominant states, but ensures that only
bus dominant and bus recessive states that persist longer than tfltr(wake)bus are reflected on
pin RXD.

In Standby mode, the bus lines are biased to ground to minimize the system supply
current. The low-power receiver is supplied by VIO, and is capable of detecting CAN bus
activity even if VIO is the only supply voltage available. When pin RXD goes LOW to signal
a wake-up request, a transition to Normal mode will not be triggered until STB is forced
LOW.

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High-speed CAN transceiver with Standby mode

6.2 Fail-safe features

6.2.1 TXD dominant time-out function

A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set to HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.

6.2.2 Bus dominant time-out function

In Standby mode a 'bus dominant time-out' timer is started when the CAN bus changes
from recessive to dominant state. If the dominant state on the bus persists for longer than
tto(dom)bus, the RXD pin is reset to HIGH. This function prevents a clamped dominant bus
(due to a bus short-circuit or a failure in one of the other nodes on the network) from
generating a permanent wake-up request. The bus dominant time-out timer is reset when
the CAN bus changes from dominant to recessive state.

6.2.3 Internal biasing of TXD and STB input pins

Pins TXD and STB have internal pull-ups to VIO to ensure a safe, defined state in case
one or both of these pins are left floating.

6.2.4 Undervoltage detection on pins VCC and VIO

Should VCC drop below the VCC undervoltage detection level, Vuvd(VCC), the transceiver
will switch to Standby mode. The logic state of pin STB will be ignored until VCC has
recovered.

Should VIO drop below the VIO undervoltage detection level, Vuvd(VIO), the transceiver will
switch off and disengage from the bus (zero load) until VIO has recovered.

6.2.5 Over-temperature protection

The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillation due to
temperature drift is avoided.

6.3 SPLIT output pin and VIO supply pin

Two versions of the TJA1042 are available, only differing in the function of a single pin. Pin
5 is either a SPLIT output pin or a VIO supply pin.

6.3.1 SPLIT pin

Using the SPLIT pin on the TJA1042T in conjunction with a split termination network (see
Figure 3 and Figure 4) can help to stabilize the recessive voltage level on the bus. This will
reduce EME in networks with DC leakage to ground (e.g. from deactivated nodes with
poor bus leakage performance). In Normal mode, pin SPLIT delivers a DC output voltage
of 0.5VCC. In Standby mode or when VCC is off, pin SPLIT is floating.

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High-speed CAN transceiver with Standby mode

VCC

TJA1042T
CANH

R 60 Ω
VSPLIT = 0.5 VCC SPLIT
in normal mode;
otherwise floating
R 60 Ω

CANL

GND 015aaa020

Fig 3. Stabilization circuitry and application for version with SPLIT pin

6.3.2 VIO supply pin

Pin VIO on the TTJA1042T/3 and TJA1042TK/3 should be connected to the
microcontroller supply voltage (see Figure 5). This will adjust the signal levels of pins TXD,
RXD and STB to the I/O levels of the microcontroller. Pin VIO also provides the internal
supply voltage for the low-power differential receiver of the transceiver. For applications
running in low-power mode, this allows the bus lines to be monitored for activity even if
there is no supply voltage on pin VCC.

For versions of the TJA1042 without a VIO pin, the VIO input is internally connected to VCC.
This sets the signal levels of pins TXD, RXD and STB to levels compatible with 5 V
microcontrollers.

7. Application design-in information

BAT 5V

VCC

CANH STB VDD

CANH Pxx

SPLIT Pyy MICRO-

TJA1042T
TXD CONTROLLER
TX0
CANL RXD
CANL RX0
GND
GND
015aaa022

Fig 4. Typical application with TJA1042T and a 5 V microcontroller.

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High-speed CAN transceiver with Standby mode

BAT 3V

INH

5V

VCC VIO

CANH STB VDD

CANH Pxx

TJA1042T/3 MICRO-
TJA1042TK/3 TXD CONTROLLER
TX0
CANL RXD
CANL RX0
GND
GND 015aaa021

Switching off the 5 V supply in Standby mode (dotted line) is optional.

Fig 5. Typical application with TJA1042T/3 or TJA1042TK/3 and a 3 V microcontroller.

8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter Conditions Min Max Unit
Vx voltage on pin x no time limit; DC value
on pins CANH, CANL and SPLIT −58 +58 V
on any other pin −0.3 +7 V
Vtrt transient voltage on pins CANH and CANL [1] −150 +100 V
VESD electrostatic discharge voltage IEC 61000-4-2 [2]

at pins CANH and CANL [3] −8 +8 kV

HBM [4]

at pins CANH and CANL −8 +8 kV

at any other pin −4 +4 kV
MM [5]

at any pin −300 +300 V

CDM [6]

at corner pins −750 +750 V

at any pin −500 +500 V
Tvj virtual junction temperature [7] −40 +150 °C
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +125 °C

[1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,
3a and 3b.
[2] IEC 61000-4-2 (150 pF, 330 Ω).

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High-speed CAN transceiver with Standby mode

[3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 Ω) has been be verified by an external test house.
The result is equal to or better than ±8 kV (unaided).
[4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).
[5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 µH, 10 Ω).
[6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). The classification level is C5 (>1000 V).
[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj = Tamb + P × Rth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).

9. Thermal characteristics
Table 5. Thermal characteristics
According to IEC 60747-1.
Symbol Parameter Conditions Value Unit
Rth(vj-a) thermal resistance from virtual junction to ambient SO8 package; in free air 145 K/W
HVSON8 package; in free air 50 K/W

10. Static characteristics

Table 6. Static characteristics
Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC.[2]
Symbol Parameter Conditions Min Typ Max Unit
Supply; pin VCC
VCC supply voltage 4.5 - 5.5 V
ICC supply current Standby mode
TJA1042T; includes IIO - 10 15 µA
TJA1042T/3 or TJA1042TK/3 - - 5 µA
Normal mode
recessive; VTXD = VIO 2.5 5 10 mA
dominant; VTXD = 0 V 20 45 70 mA
Vuvd(VCC) undervoltage detection 3.5 - 4.5 V
voltage on pin VCC
I/O level adapter supply; pin VIO[1]
VIO supply voltage on pin VIO 2.8 - 5.5 V
IIO supply current on pin VIO Standby mode 5 - 14 µA
Normal mode
recessive; VTXD = VIO 15 80 200 µA
dominant; VTXD = 0 V 100 350 1000 µA
Vuvd(VIO) undervoltage detection 1.3 2.0 2.7 V
voltage on pin VIO
Standby mode control input; pin STB
VIH HIGH-level input voltage 0.7VIO - VIO + V
0.3
VIL LOW-level input voltage −0.3 - 0.3VIO V
IIH HIGH-level input current VSTB = VIO −1 - +1 µA

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High-speed CAN transceiver with Standby mode

Table 6. Static characteristics …continued

Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC.[2]
Symbol Parameter Conditions Min Typ Max Unit
IIL LOW-level input current VSTB = 0 V −15 - −1 µA
CAN transmit data input; pin TXD
VIH HIGH-level input voltage 0.7VIO - VIO + V
0.3
VIL LOW-level input voltage −0.3 - 0.3VIO V
IIH HIGH-level input current VTXD = VIO −5 - +5 µA
IIL LOW-level input current Normal mode; VTXD = 0 V −260 −150 −30 µA
Ci input capacitance [3] - 5 10 pF
CAN receive data output; pin RXD
IOH HIGH-level output current VRXD = VIO − 0.4 V; VIO = VCC −8 −3 −1 mA
IOL LOW-level output current VRXD = 0.4 V; bus dominant 2 5 12 mA
Bus lines; pins CANH and CANL
VO(dom) dominant output voltage VTXD = 0 V; t < tto(dom)TXD
pin CANH 2.75 3.5 4.5 V
pin CANL 0.5 1.5 2.25 V
Vdom(TX)sy transmitter dominant voltage Vdom(TX)sym = VCC − VCANH − VCANL −400 - +400 mV
m symmetry
VO(dif)bus bus differential output voltage VTXD = 0 V; t < tto(dom)TXD 1.5 - 3 V
VCC = 4.75 V to 5.25 V
RL = 45 Ω to 65 Ω
VTXD = VIO; VCC = 4.75 V to 5.25 V −50 - +50 mV
recessive; no load
VO(rec) recessive output voltage Normal mode; VTXD = VIO; no load 2 0.5VCC 3 V
Standby mode; no load −0.1 - +0.1 V
Vth(RX)dif differential receiver threshold Vcm(CAN) = −30 V to +30 V [4]

voltage Normal mode 0.5 0.7 0.9 V

Standby mode [5] 0.4 0.7 1.15 V
Vhys(RX)dif differential receiver hysteresis Vcm(CAN) = −30 V to +30 V 50 120 200 mV
voltage Normal mode
IO(dom) dominant output current VTXD = 0 V; t < tto(dom)TXD; VCC = 5 V
pin CANH; VCANH = 0 V −100 −70 −40 mA
pin CANL; VCANL = 5 V / 40 V 40 70 100 mA
IO(rec) recessive output current Normal mode; VTXD = VIO −5 - +5 mA
VCANH = VCANL = −27 V to +32 V
IL leakage current VCC = VIO = 0 V; VCANH = VCANL = 5 V −5 - +5 µA
Ri input resistance 9 15 28 kΩ
∆Ri input resistance deviation between VCANH and VCANL −1 - +1 %
Ri(dif) differential input resistance 19 30 52 kΩ
Ci(cm) common-mode input [3] - - 20 pF
capacitance
Ci(dif) differential input capacitance [3] - - 10 pF

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High-speed CAN transceiver with Standby mode

Table 6. Static characteristics …continued

Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC.[2]
Symbol Parameter Conditions Min Typ Max Unit
Common mode stabilization output; pin SPLIT; only for TJA1042T
VO output voltage Normal mode 0.3VCC 0.5VCC 0.7VCC V
ISPLIT = −500 µA to +500 µA
Normal mode; RL = 1 MΩ 0.45VCC 0.5VCC 0.55VCC V
IL leakage current Standby mode −5 - +5 µA
VSPLIT = −58 V to +58 V
Temperature detection
Tj(sd) shutdown junction [3] - 190 - °C
temperature

[1] Only TJA1042T/3 and TJA1042TK/3 have a VIO pin. With TJA1042T, the VIO input is internally connected to VCC.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient
temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use
correlated test conditions to cover the specified temperature and power supply voltage range.
[3] Not tested in production.
[4] Vcm(CAN) is the common mode voltage of CANH and CANL.
[5] For TJA1042T/3 and TJA1042TK/3: values valid when VIO = 4.5 V to 5.5 V; when VIO = 2.8 V to 4.5 V, values valid when
Vcm(CAN) = −12 V to +12 V.

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High-speed CAN transceiver with Standby mode

11. Dynamic characteristics

Table 7. Dynamic characteristics
Tvj = −40 °C to +150 °C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL = 60 Ω unless specified otherwise. All voltages are
defined with respect to ground. Positive currents flow into the IC.[2]
Symbol Parameter Conditions Min Typ Max Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 6 and Figure 7
td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns
td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns
td(busdom-RXD) delay time from bus dominant to RXD Normal mode - 60 - ns
td(busrec-RXD) delay time from bus recessive to RXD Normal mode - 65 - ns
tPD(TXD-RXD) propagation delay from TXD to RXD version with SPLIT pin 60 - 220 ns
Normal mode
versions with VIO pin 60 - 250 ns
Normal mode
tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode 0.3 2 12 ms
tto(dom)bus bus dominant time-out time Standby mode 0.3 2 12 ms
tfltr(wake)bus bus wake-up filter time version with SPLIT pin 0.5 1 3 µs
Standby mode
versions with VIO pin 0.5 1.5 5 µs
Standby mode
td(stb-norm) standby to normal mode delay time 7 25 47 µs

[1] Only TJA1042T/3 and TJA1042TK/3 have a VIO pin. With TJA1042T, the VIO input is internally connected to VCC.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient
temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (final testing). Both pretesting and final testing use
correlated test conditions to cover the specified temperature and power supply voltage range.

+5 V
47 µF 100 nF

VIO(1) VCC

TXD CANH

TJA1042 RL 100 pF
SPLIT

RXD CANL

GND STB
15 pF
015aaa024

(1) For versions with a VIO pin (TJA1042T/3 and TJA1042TK/3), the VIO pin is connected to pin VCC.
Fig 6. Timing test circuit for CAN transceiver

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High-speed CAN transceiver with Standby mode

HIGH

TXD

LOW

CANH

CANL

dominant

0.9 V

VO(dif)(bus)
0.5 V

recessive

HIGH
0.7VIO
RXD
0.3VIO
LOW

td(TXD-busdom) td(TXD-busrec)

td(busdom-RXD) td(busrec-RXD)

tPD(TXD-RXD) tPD(TXD-RXD) 015aaa025

Fig 7. CAN transceiver timing diagram

12. Test information

12.1 Quality information

This product has been qualified to the appropriate Automotive Electronics Council (AEC)
standard Q100 or Q101 and is suitable for use in automotive applications.

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High-speed CAN transceiver with Standby mode

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

D E A
X

y HE v M A

8 5

Q
A2
(A 3) A
A1
pin 1 index
θ
Lp

1 4 L

e w M detail X
bp

0 2.5 5 mm
scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A
UNIT max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ

0.25 1.45 0.49 0.25 5.0 4.0 6.2 1.0 0.7 0.7
mm 1.75 0.25 1.27 1.05 0.25 0.25 0.1
0.10 1.25 0.36 0.19 4.8 3.8 5.8 0.4 0.6 0.3 8o
o
0.010 0.057 0.019 0.0100 0.20 0.16 0.244 0.039 0.028 0.028 0
inches 0.069 0.01 0.05 0.041 0.01 0.01 0.004
0.004 0.049 0.014 0.0075 0.19 0.15 0.228 0.016 0.024 0.012

Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

99-12-27
SOT96-1 076E03 MS-012
03-02-18

Fig 8. Package outline SOT96-1 (SO8)

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High-speed CAN transceiver with Standby mode

HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm SOT782-1

D B A

E A
A1
c

detail X

terminal 1
index area
e1
terminal 1 C
v C A B
index area e b
w C y1 C y
1 4
L
K

Eh

8 5
Dh

0 1 2 mm

Dimensions scale

Unit(1) A A1 b c D Dh E Eh e e1 K L v w y y1

max 1.00 0.05 0.35 3.10 2.45 3.10 1.65 0.35 0.45
mm nom 0.85 0.03 0.30 0.2 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.1 0.05 0.05 0.1
min 0.80 0.00 0.25 2.90 2.35 2.90 1.55 0.25 0.35
Note
1. Plastic or metal protrusions of 0.075 maximum per side are not included. sot782-1_po

Outline References European

Issue date
version IEC JEDEC JEITA projection
09-08-25
SOT782-1 --- MO-229 ---
09-08-28

Fig 9. Package outline SOT782-1 (HVSON8)

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14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.

14.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities

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14.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9

Table 8. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220

Table 9. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.

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maximum peak temperature

temperature = MSL limit, damage level

minimum peak temperature

= minimum soldering temperature

peak
temperature

time
001aac844

MSL: Moisture Sensitivity Level

Fig 10. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

15. Revision history

Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TJA1042_4 20091006 Product data sheet - TJA1042_3
Modifications
• Revised parameter values in Table 4 (VESD)
TJA1042_3 20090825 Product data sheet - TJA1042_2
TJA1042_2 20090708 Product data sheet - TJA1042_1
TJA1042_1 20090309 Product data sheet - -

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16. Legal information

16.1 Data sheet status

Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in Applications — Applications that are described herein for any of these
modifications or additions. NXP Semiconductors does not give any products are for illustrative purposes only. NXP Semiconductors makes no
representations or warranties as to the accuracy or completeness of representation or warranty that such applications will be suitable for the
information included herein and shall have no liability for the consequences of specified use without further testing or modification.
use of such information. Limiting values — Stress above one or more limiting values (as defined in
Short data sheet — A short data sheet is an extract from a full data sheet the Absolute Maximum Ratings System of IEC 60134) may cause permanent
with the same product type number(s) and title. A short data sheet is intended damage to the device. Limiting values are stress ratings only and operation of
for quick reference only and should not be relied upon to contain detailed and the device at these or any other conditions above those given in the
full information. For detailed and full information see the relevant full data Characteristics sections of this document is not implied. Exposure to limiting
sheet, which is available on request via the local NXP Semiconductors sales values for extended periods may affect device reliability.
office. In case of any inconsistency or conflict with the short data sheet, the Terms and conditions of sale — NXP Semiconductors products are sold
full data sheet shall prevail. subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
16.3 Disclaimers explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
General — Information in this document is believed to be accurate and terms and conditions, the latter will prevail.
reliable. However, NXP Semiconductors does not give any representations or
No offer to sell or license — Nothing in this document may be interpreted
warranties, expressed or implied, as to the accuracy or completeness of such
or construed as an offer to sell products that is open for acceptance or the
information and shall have no liability for the consequences of use of such
grant, conveyance or implication of any license under any copyrights, patents
information.
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
Export control — This document as well as the item(s) described herein
changes to information published in this document, including without
may be subject to export control regulations. Export might require a prior
limitation specifications and product descriptions, at any time and without
authorization from national authorities.
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, 16.4 Trademarks
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or Notice: All referenced brands, product names, service names and trademarks
malfunction of an NXP Semiconductors product can reasonably be expected are the property of their respective owners.
to result in personal injury, death or severe property or environmental

17. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com

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18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Low-power management . . . . . . . . . . . . . . . . . 1
2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6 Functional description . . . . . . . . . . . . . . . . . . . 5
6.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
6.1.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.1.2 Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6
6.2.1 TXD dominant time-out function . . . . . . . . . . . . 6
6.2.2 Bus dominant time-out function . . . . . . . . . . . . 6
6.2.3 Internal biasing of TXD and STB input pins . . . 6
6.2.4 Undervoltage detection on pins VCC and VIO . . 6
6.2.5 Over-temperature protection. . . . . . . . . . . . . . . 6
6.3 SPLIT output pin and VIO supply pin . . . . . . . . 6
6.3.1 SPLIT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6.3.2 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7 Application design-in information . . . . . . . . . . 7
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 9
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 12
12 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13
12.1 Quality information . . . . . . . . . . . . . . . . . . . . . 13
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
14 Soldering of SMD packages . . . . . . . . . . . . . . 16
14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 16
14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 16
14.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
14.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
16.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
17 Contact information. . . . . . . . . . . . . . . . . . . . . 19
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2009. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 October 2009
Document identifier: TJA1042_4