AirPrime EM7511 Product Specification r7

AirPrime EM7511
Product Technical Specification
41112028
Rev 7
Proprietary and Confidential
Contents subject to change
Important Due to the nature of wireless communications, transmission and reception of data can
Notice never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when wireless devices such as the
Sierra Wireless product are used in a normal manner with a well-constructed network, the
Sierra Wireless product should not be used in situations where failure to transmit or
receive data could result in damage of any kind to the user or any other party, including
but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no
responsibility for damages of any kind resulting from delays or errors in data transmitted
or received using the Sierra Wireless product, or for failure of the Sierra Wireless product
to transmit or receive such data.
Safety and Do not operate the Sierra Wireless product in areas where blasting is in progress, where
Hazards explosive atmospheres may be present, near medical equipment, near life support
equipment, or any equipment which may be susceptible to any form of radio interference.
In such areas, the Sierra Wireless product MUST BE POWERED OFF. The Sierra
Wireless product can transmit signals that could interfere with this equipment.
Do not operate the Sierra Wireless product in any aircraft, whether the aircraft is on the
ground or in flight. In aircraft, the Sierra Wireless product MUST BE POWERED OFF.
When operating, the Sierra Wireless product can transmit signals that could interfere with
various onboard systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and
the door is open. Sierra Wireless products may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless product while
in control of a vehicle. Doing so will detract from the driver or operator's control and
operation of that vehicle. In some states and provinces, operating such communications
devices while in control of a vehicle is an offence.
Limitation of The information in this manual is subject to change without notice and does not represent
Liability a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT,
SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY
DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR
ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO
USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS
AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR
THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates
aggregate liability arising under or in connection with the Sierra Wireless product,
regardless of the number of events, occurrences, or claims giving rise to liability, be in
excess of the price paid by the purchaser for the Sierra Wireless product.
Rev 7 Oct.19 2 41112028

Preface
Patents This product may contain technology developed by or for Sierra Wireless Inc. This product
includes technology licensed from QUALCOMM®. This product is manufactured or sold
by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital
Group and MMP Portfolio Licensing.
Copyright ©2019 Sierra Wireless. All rights reserved.
Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo are
registered trademarks of Sierra Wireless, Inc.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under
license.
Other trademarks are the property of their respective owners.
Contact
Information
Sales information and technical Web: sierrawireless.com/company/contact-us/
support, including warranty and returns Global toll-free number: 1-877-687-7795
6:00 am to 6:00 pm PST
Corporate and product information Web: sierrawireless.com
Revision
History
Revision Release date Changes

number
1 March 2018 Preliminary release
2 April 2018 Removed WCDMA Band 3

Marked LTE B42 as disabled
Updated RESET# usage in Table 2-7, Full_Card_Power_Off# and RESET# Usage, on
page 35
3 August 2018 Updated PTCRB Carrier Aggregation Download Combinations

Updated Power-on signal timing graphic and host signals note
Updated PCI_PERST_N voltage levels
LTE B30 noted as downlink only
Replaced references to !RXDEN with !LTERXCONTROL
Updated envelope correlation coefficient values
4 October 2018 Updated topic Disabling the Diversity Antenna

Updated TEMP_HI_CRIT value
Rev 7 Oct.19 3 41112028

Revision Release date Changes

number
5 May 2019 LTE B42, B43, B48 support enabled, and added LTE B48 Regulatory note for airborne
operations
Added table of Additional Carrier Aggregation Downlink Combinations (Table 1-3)
Updated RESET# usage description in (Table 2-7)
Updated LTE B7/B41 Conducted Tx Power Tolerances (Table 3-6)
Added footnote for LTE B7/B41 (Table 7-2)
6 July 2019 Removed PCM/I2S/I2C details

Updated internal module temperature note (Physical Features section)
11 October 2019 Updated Figure 2-1—Removed eSIM block.

Updated Table 2-1—Indicate PCI pins to be left floating.
Rev 7 Oct.19 4 41112028

Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supported RF bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Physical Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Application Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Module Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
LTE Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Short Message Service (SMS) Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Position Location (GNSS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Supporting Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Required Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Integration Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Host Interface Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Host-side Recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
USB Throughput Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
User-developed Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
SIM Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Control Interface (Signals) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
WAKE_ON_WAN# — Wake Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
W_DISABLE# (Wireless Disable) and GPS_DISABLE# (GNSS Disable) . . . . . . . . 33
Full_Card_Power_Off# and RESET# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
WWAN_LED#—LED Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Antenna Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Rev 7 Oct.19 5 41112028

RF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
RF Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Antenna and Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Ground Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Interference and Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Interference from Other Wireless Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Host-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Device-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Methods to Mitigate Decreased Rx Performance . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Radiated Spurious Emissions (RSE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Radiated Sensitivity Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Sierra Wireless’ Sensitivity Testing and Desensitization Investigation . . . . . . . . . . 41
Sensitivity vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Supported Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Conducted Rx Sensitivity / Tx Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
GNSS Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Module Power States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Power State Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Power Ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Power Supply Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
SED (Smart Error Detection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Tx Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Software Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Support Tools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Host Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Rev 7 Oct.19 6 41112028

Contents
Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Device Views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Product Marking (Labeling) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Electrostatic Discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Thermal Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Module Integration Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Regulatory Compliance and Industry Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Important Compliance Information for the United States and Canada . . . . . . . . . . . . 62
Antenna Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Recommended Main/Diversity Antenna Specifications. . . . . . . . . . . . . . . . . . . . . . . . 65
Recommended GNSS Antenna Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Antenna Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
AT Command Entry Timing Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Acceptance Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Acceptance Test Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Acceptance Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Certification Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Production Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Functional Production Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Production Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
UMTS (WCDMA) RF Transmission Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
LTE RF Transmission Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
UMTS (WCDMA) RF Receive Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
LTE RF Receive Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
GNSS RF Receive Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Quality Assurance Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Rev 7 Oct.19 7 41112028

Suggested Testing Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Testing Assistance Provided by Sierra Wireless . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
IOT/Operator Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Extended AT Commands for Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Thermal Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Worst Case Testing—Absolute vs Realistic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Thermal Testing Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Sierra Wireless Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Command Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Other Sierra Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Industry/Other Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
Rev 7 Oct.19 8 41112028

List of Tables
Table 1-1: Supported RF Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 1-2: PTCRB Carrier Aggregation Downlink Combinations. . . . . . . . . . . . . . . . . . . . 12
Table 1-3: Additional Carrier Aggregation Downlink Combinations . . . . . . . . . . . . . . . . . . 14
Table 1-4: Carrier Aggregation Uplink Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 1-5: Required Host-Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 2-1: Host Interface (75-pin) Connections—Module View . . . . . . . . . . . . . . . . . . . . 23
Table 2-2: Power and Ground Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 2-3: USB Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 2-4: SIM Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 2-5: Module Control Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 2-6: W_DISABLE#/GPS_DISABLE# Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 2-7: Full_Card_Power_Off# and RESET# Usage . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Table 2-8: Antenna Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 3-1: LTE Frequency Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 3-2: LTE Bandwidth Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 3-3: WCDMA Frequency Bands Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Table 3-4: Conducted Rx (Receive) Sensitivity—LTE Bands . . . . . . . . . . . . . . . . . . . . . . 45
Table 3-5: Conducted Rx (Receive) Sensitivity—UMTS Bands . . . . . . . . . . . . . . . . . . . . 46
Table 3-6: Conducted Tx (Transmit) Power Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 3-7: GNSS Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 4-1: Averaged Standby DC Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 4-2: Averaged Call Mode DC Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 4-3: Miscellaneous DC Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 4-4: Module Power States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 4-5: Power State Transition Trigger Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 4-6: USB 2.0 Power-On/Off Timing Parameters (Double Enumeration) . . . . . . . . . 53
Table 4-7: USB 2.0 Power-On/Off Timing Parameters (Single Enumeration). . . . . . . . . . 54
Table 4-8: USB 3.0 Power-On/Off Timing Parameters (Single Enumeration). . . . . . . . . . 54
Table 4-9: Dynamic Power Control of SAR Backoff State . . . . . . . . . . . . . . . . . . . . . . . . . 55
Table 6-1: Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 57
Rev 7 Oct.19 9 41112028

Table 7-1: Standards Compliance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Table 7-2: Antenna Gain and Collocated Radio Transmitter Specifications . . . . . . . . . . . 63
Table A-1: Antenna Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table A-2: GNSS Antenna Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Table B-1: Hardware Integration Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . 69
Table 3-1: Test Settings—UMTS Transmission Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Table 3-2: Test Settings—LTE Transmission Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Table 3-3: Test Settings—UMTS Receive Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Table 3-4: Test Settings—LTE Receive Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Table 3-5: Extended AT Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Table D-1: Suggested worst-case conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Table G-1: Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Rev 7 Oct.19 10 41112028

List of Figures
Figure 2-1: System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 2-2: Expanded RF (Transmit) Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 2-3: Expanded RF (Receive/GNSS) Block Diagram . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 2-4: Recommended Capacitor Placement for USB3.0 Signals . . . . . . . . . . . . . . . 28
Figure 2-5: SIM Application Interface (applies to both SIM interfaces) . . . . . . . . . . . . . . . 30
Figure 2-6: SIM Card Contacts (Contact View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 2-7: Recommended WAKE_ON_WAN# Connection . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 2-8: Recommended Wireless Disable Connection . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 2-9: Example LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 3-1: Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 4-1: Voltage/Temperature Monitoring State Machines. . . . . . . . . . . . . . . . . . . . . . 52
Figure 4-2: Signal Timing (Full_Card_Power_Off#, and USB Enumeration) . . . . . . . . . . . 53
Figure 6-1: Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 6-2: Dimensioned View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 6-3: Unit Product Marking Example—Laser-etched, Typical Representation (Not to
scale. Contents will vary by SKU.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 6-4: Shield Locations (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Figure 6-5: Copper Pad Location on Bottom Side of Module . . . . . . . . . . . . . . . . . . . . . . 60
Figure 5-1: Device Placement in Module Tray. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Figure 5-2: Shipping Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
Rev 7 Oct.19 11 41112028

1
1: Introduction
The Sierra Wireless EM7511 Embedded Module is a FirstNet-ready (B14 LTE) M.2
module that provides LTE, UMTS, and GNSS connectivity for notebook, ultrabook, tablet
computers, and M2M applications over several radio frequency bands.
Supported RF bands
The module, based on Qualcomm's MDM9250 baseband processor, supports data
operation on LTE and UMTS networks over the bands described in Table 1-1, with LTE
carrier aggregation (CA) as described in Table 1-2, Table 1-3 and Table 1-4.
Table 1-1: Supported RF Bands

Bands
RAT 12
13
14
18
19
20
26
29
30
32
41
42
43
46
48
66
1
2
3
4
5
6
7
8
9
LTEa F F F F F F F F F F F F F F F Fb Fb Fb T T T Tb T F
UMTSc Y Y Y Y Y Y Y Y N/A N/A
• GPS: 1575.42 MHz

• GLONASS: 1602 MHz
GNSS • BeiDou: 1561.098 MHz
• Galileo: 1575.42 MHz
• QZSS: 1575.42 MHz
a. (LTE) Downlink MIMO support (2x2; 4x2)

F=FDD; T=TDD
Data rates: Downlink (Cat 12 with 3CA, 256QAM=600 Mbps; Cat 9 with 3CA, 64QAM=450 Mbps), Uplink
(Cat 13 with 2CA contiguous, 64QAM=150 Mbps)
b. Downlink only
c. UMTS (DC-HSPA+, HSPA+, HSPA, UMTS)
Diversity support
Data rates: Downlink (Cat 24, up to 42 Mbps), Uplink (Cat 6, up to 5.76 Mbps)
Important: B14 carrier aggregation is not supported.
Table 1-2: PTCRB Carrier Aggregation Downlink Combinations a

1 Band / 2CC 1 Band / 3CC 2 Bands / 2CC 2 Bands / 3CC 3 Bands / 3CC
CA_1A-3A CA_1A-7A-7A CA_1A-3A-5A
CA_1A-5A CA_1A-3A-7A
Rev. 7 Oct.19 12 41112028

Introduction
Table 1-2: PTCRB Carrier Aggregation Downlink Combinations a (Continued)

CA_1A-41A
CA_2A-2A CA_2A-4A CA_2A-2A-5A CA_2A-4A-5A
CA_2C CA_2A-7A CA_2A-2A-12A CA_2A-4A-7A
CA_2A-29A CA_2A-66A-66A CA_2A-4A-29A
CA_2A-30A CA_2A-66B CA_2A-12A-30A
CA_2A-46A CA_2A-66C CA_2A-13A-66A
CA_2A-66A CA_2A-29A-30A
CA_3C CA_3A-7A CA_3C-5A
CA_3A-8A CA_3A-7B
CA_3A-19A CA_3A-7C
CA_3A-41A CA_3C-7A
CA_3C-20A
CA_3A-41C
CA_4A-12A CA_4A-4A-13A CA_4A-12A-30A
CA_4A-13A CA_4A-4A-30A CA_4A-29A-30A
CA_4A-30A
CA_4A-46A
CA_5A-30A CA_5A-66C CA_5A-30A-66A
CA_5A-66A CA_5A-66A-66A
CA_7B CA_7A-12A
CA_7C CA_7A-20A
CA_12A-30A CA_12A-30A-66A
CA_12A-66A
CA_13A-66A CA_13A-66A-66A
CA_13A-66B
CA_20A-32A
Rev. 7 Oct.19 13 41112028

Table 1-2: PTCRB Carrier Aggregation Downlink Combinations a (Continued)

CA_29A-30A CA_29A-30A-66A
CA_29A-66A
CA_30A-66A
CA_41D
CA_66B CA_66A-66B
CA_66C CA_66A-66C
a. Supported CA DL combinations outside of North America are carrier-dependent.
Table 1-3: Additional Carrier Aggregation Downlink Combinations a

CA_1A-8A CA_1A-42C CA_1A-3A-28A
CA_1A-42A
CA_2A-7A-12A
CA_3A-28A CA_3A-42C CA_3A-41A-42A
CA_3C-28A
CA_4A-28A
CA_5B CA_5A-7A
CA_5A-46A
CA_5A-66B
CA_7A-7A CA_7A-28A
CA_7B-28A
CA_7C-28A
CA_13A-46A CA_13A-66C
CA_19A-42A CA_19A-42C
CA_28A-42A
CA_41C CA_41A_42A CA_41A-42C
CA_41C-42A
CA_42C
CA_48A-48A CA_48A-48C
Rev. 7 Oct.19 14 41112028

Introduction
Table 1-3: Additional Carrier Aggregation Downlink Combinations a

CA_48C
CA_48D
a. Supported CA DL combinations outside of North America are carrier-dependent.
Table 1-4: Carrier Aggregation Uplink Combinations

CA_3C
CA_7C
CA_41C
Physical Features
• M.2 form factor—WWAN Type 3042-S3-B (in WWAN—USB 3.0 Port
Configuration 2), as specified in [8] PCI Express NGFF (M.2) Electromechanical
Specification Revision 1.0. (Note: Any variations from the specification are detailed in
this document.)
• Ambient operating temperature range with appropriate heatsinking:
· Class A (3GPP compliant): -30°C to +70°C
· Class B (operational, non-3GPP compliant): -40°C to +85°C (reduced operating
parameters required)
Important: The internal module temperature (reported by AT!PCTEMP) must be kept below
100°C. For best performance, the internal module temperature should be kept below 85°C. Proper
mounting, heat sinks, and active cooling may be required, depending on the integrated application.
Application Interface Features

• USB interface (QMI) for Linux and Android
• MBIM for Windows 8.1, Windows 10, and Linux
• AT command interface ([1] AT Command Set for User Equipment (UE) (Release 6)
(Doc# 3GPP TS 27.007), plus proprietary extended AT commands) in [2] AirPrime
EM75xx AT Command Reference (Doc# 41111748)
• Software Development Kits (SDK),including API (Application Program Interface)
functions:
· Windows 8.1, Windows 10
· Linux
• Support for active antenna control via dedicated antenna control signals
(ANTCTL0:3)
• Dynamic power reduction support via software and dedicated GPIO (DPR)
• OMA DM (Open Mobile Alliance Device Management)
• FOTA (Firmware Over The Air)
Rev. 7 Oct.19 15 41112028

Note: OMA DM and FOTA support is operator-dependent.
Module Features
• LTE / DC-HSPA+ / HSPA+ / HSPA / UMTS (WCDMA) operation
• Multiple (up to 16) cellular packet data profiles
• Traditional modem COM port support for AT commands
• USB suspend / resume
• Sleep mode for minimum idle power draw
• SIM application tool kit with proactive SIM commands
• Enhanced Operator Name String (EONS)
• Mobile-originated PDP context activation / deactivation
• Support QoS QCI (3GPP Release 12)
• Static and Dynamic IP address. The network may assign a fixed IP address or
dynamically assign one using DHCP (Dynamic Host Configuration Protocol).
• PAP and CHAP support
• PDP context type (IPv4, IPv6, or IPv4v6)
• RFC1144 TCP/IP header compression
LTE Features
• Carrier aggregation:
· DL LTE-FDD—60 MHz
· DL LTE-TDD—60 MHz
· UL LTE—40 MHz intraband contiguous
• CSG support (LTE Femto)
• LTE Advanced receivers (NLIC, eICIC, feICIC)
• Basic cell selection and system acquisition
· PSS/SSS/MIB decode
· SIB1–SIB16 decoding
• NAS/AS security procedures
· Snow 3G/AES/ZUC security
• CQI/RI/PMI reporting
• Paging procedures
· Paging in Idle and Connected mode
• Dedicated bearer
· Network-initiated dedicated bearer
· UE-initiated dedicated bearer
• Multiple PDN connections (IPv4 and IPv6 combinations), subject to operating system
support.
• Connected mode intra-LTE mobility
• Idle mode intra-LTE mobility
• iRAT between LTE/3G for idle and connection release with redirection
• Detach procedure
· Network-initiated detach with reattach required
· Network-initiated detach followed by connection release
Rev. 7 Oct.19 16 41112028

Introduction
Short Message Service (SMS) Features

• Mobile-originated and mobile-terminated SMS over IMS
• Mobile-originated and mobile-terminated SMS over SGs
Position Location (GNSS)

• Customizable tracking session
• Automatic tracking session on startup
• Concurrent standalone GPS, GLONASS, Galileo, BeiDou, and QZSS
• Assisted GPS (A-GPS) SUPL1.0
• Assisted GPS/GLONASS SUPL2.0
• gpsOneXTRA 1.0/2.0/3.0/3.1
• GNSS reception on dedicated connector or diversity connector
Supporting Documents
Several additional documents describe module design, usage, integration, and other
features. See References on page 91.
Accessories
A hardware development kit is available for AirPrime M.2 modules. The kit contains
hardware components for evaluating and developing with the module, including:
• Development board
• Cables
• Antennas
• Other accessories
For over-the-air LTE testing, ensure that suitable antennas are used.
Required Connectors
Table 1-5 describes the connectors used to integrate the EM7511 Embedded Module into
your host device.
Table 1-5: Required Host-Module Connectors a

Connector type Description
RF cables • Mate with M.2-spec connectors

• Three connector jacks (I-PEX 20448-001R-081 or equivalent)
Rev. 7 Oct.19 17 41112028

Table 1-5: Required Host-Module Connectors a (Continued)

Connector type Description
EDGE (67 pin) • Slot B compatible—Per the M.2 standard ([8] PCI Express
NGFF (M.2) Electromechanical Specification Revision 1.0), a
generic 75 pin position EDGE connector on the motherboard
uses a mechanical key to mate with the 67 pin notched module
connector.
• Manufacturers include LOTES (part #APCI0018-P001A01),
Kyocera, JAE, Tyco, and Longwell.
SIM • Industry-standard connector. See SIM Interface on page 29 for

details.
a. Manufacturers/part numbers are for reference only and are subject to change. Choose
connectors that are appropriate for your own design.
Ordering Information
To order, contact the Sierra Wireless Sales Desk at +1 (604) 232-1488 between 8 AM and
5 PM Pacific Time.
Integration Requirements
Sierra Wireless provides, in the documentation suite, guidelines for successful module
integration and offers integration support services as necessary.
When integrating the EM7511 Embedded Module, the following items must be addressed:
• Mounting —Effect on temperature, shock, and vibration performance
• Power supply —Impact on battery drain and possible RF interference
• Antenna location and type —Impact on RF performance
• Regulatory approvals —As discussed in Regulatory Compliance and Industry Certifica-
tions on page 62.
• Service provisioning —Manufacturing process
• Software —As discussed in Software Interface on page 56.
• Host interface —Compliance with interface voltage levels
Rev. 7 Oct.19 18 41112028

2
2: Electrical Specifications
The system block diagram in Figure 2-1 represents the EM7511 module integrated into a
host system. The module includes the following interfaces to the host:
• Full_Card_Power_Off#—Input supplied to the module by the host—active-low to turn
the unit off, or active-high to turn the unit on.
• W_DISABLE#—Active low input from the host to the EM7511 disables the main RF
radio.
• GPS_DISABLE#—Active low input from the host to the EM7511 disables the GNSS
radio receiver.
• WAKE_ON_WAN#—Active low output used to wake the host when specific events
occur.
• WWAN_LED#—Active-low LED drive signal provides an indication of WAN radio ON
state.
• RESET#—Active low input from the host used to reset the module.
• Antenna—Three RF connectors (main (Rx/Tx), GNSS, and auxiliary (diversity/MIMO/
GNSS)). For details, see RF Specifications on page 37.
• Antenna control—Four signals that can be used to control external antenna switches.
• Dynamic power control—Signal used to adjust Tx power to meet FCC SAR require-
ments. For details, see Tx Power Control on page 55.).
• Dual SIM—Supported through the interface connector. The SIM cavities / connectors
must be placed on the host device for this feature.
• SIM detect—Internal pullup on the module detects whether a SIM is present or not:
· If a SIM is not inserted, the pin must be shorted to ground.
· If a SIM is present, the pin will be an open circuit.
• USB—USB 2.0 and USB 3.0 interfaces to the host for data, control, and status infor-
mation.
• PCIe port—Reserved for future use.
The EM7511 has two main interface areas—the host I/O connector and the RF ports.
Details of these interfaces are described in the sections that follow.
Rev. 7 Oct.19 19 41112028

RF APT
BLOCK
GPS
PWR
RF + GRFC_GPIO
Voltage Supply
SPMI
NAND SIM Detect1

External NAND and USIM1
RAM
4GB NAND
2GB RAM SIM Detect2
PDM9655
DDR2 DRAM USIM2
MDM9250
CBL_PWR_N
LED_DRV_N
RESIN_N
VPH/
LDO
VBAT
WAKE_ON_WAN#
HOST INTERFACE CONNECTOR

W_DISABLE#
VCC
GPS_DISABLE#
DPR
RESET#
ANTCTL/RFFE
LED#1
COEX_RXD / COEX_TXD /
COEX3
Full_Card_Power_Off#
PCI-E USB3.0 USB2.0 PCIe
2.7 / 1.8 V
Figure 2-1: System Block Diagram
Rev. 7 Oct.19 20 41112028

Electrical Specifications
QLN1030_PRX
LTE-LAA (B46)
LAA_IN LTE-LAA
B42/43/48 B42/43/48
UHB_IN
B30
HB2_IN1
B7
HB1_IN1
B4/66
MB1_IN2
B2
MB_SW21
B3/9
MB_SW22
B1
MB1_IN1
B41
HB1_IN2
WTR5975
PRX_UHB_LTEU_A UHB_AUX_OUT1 B41 RX
B41 TRX B41 TRX
PRX_UHB_LTEU_B UHB_AUX_OUT2 B41
SW B30 B30
PRX_LHB HB_AUX_OUT1 B30
B7 B7
PRX_HB_A HUHB_OUT B7
B4/66 B4/66
PRX_MB_B MHUHB_OUT B4/66
B2 B2
PRX_MB_A MLMHB_OUT B2
B3/9 B3/9
SW
LHB_LB_IN B3/9
B1 B1
B1
B32
MLB_IN2 B32
TX_CH1_UHB
B13
TX_CH0_HB2 B13
B8
TX_CH0_MB B8
B20
B20
B5/26
SW
SW
TX_CH0_LB2
B5/26
QLN1020_PRX B12 LPF
B12
OUT2 B14
B14
PRX_LB OUT1
B29
B14
LB_SW12
B29 50 Ohms
LB_SW14 TerminaƟon
B5/18/19/26
LB_SW21
B20
LB_SW11
LPF
B8
LB_SW23
B12/13
LB_SW13
TX_FBRX
Figure 2-2: Expanded RF (Transmit) Block Diagram
Rev. 7 Oct.19 21 41112028

WTR5975
GNSS GNSS
GNSS_L1 GNSS
PRX_LB OUT1
OUT2
B8
B8
B20
B20
B12/13
B12/13
B5/18/19/26
B26
B14
B14
B29
B29
LHB_LB_IN
B32
B32
B1 GNSS
B1
B3/9
B3/9
B4/66
B66
B2
B2
B7
B7
B30
B30
B41
B41
B42/43/48
B42/43/48
LTE-LAA (B46)
LTE-LAA
DRX_UHB_LTEU_B UHB_AUX_OUT2
DRX_UHB_LTEU_A UHB_AUX_OUT1
DRX_LHB HB_AUX_OUT
DRX_HB HUHB_OUT
DRX_MB_B MHUHB_OUT
DRX_MB_A MHB_OUT
Figure 2-3: Expanded RF (Receive/GNSS) Block Diagram
Host Interface Pin Assignments

The EM7511 host I/O connector provides pins for power, serial communications, and
control. Pin assignments are listed in Table 2-1.
Refer to the following tables for pin details based on interface types:
• Table 2-2, Power and Ground Specifications, on page 27
• Table 2-3, USB Interfaces, on page 28
• Table 2-4, SIM Interface Signals, on page 29
• Table 2-5, Module Control Signals, on page 32
Note: On any given interface (USB, SIM, etc.), leave unused inputs and outputs as no-connects.
Rev. 7 Oct.19 22 41112028

Note: The host should not drive any signals to the module until >100 ms from the start of the
power-on sequence.
Table 2-1: Host Interface (75-pin) Connections — Module View a
Pin Voltage levels (V)

Active
Pin Signal name b Description Direction c state
type Min Typ Max
1 CONFIG_3 Reserved—Host must

(NC in default module not repurpose this pin.
configuration)
2 VCC V Power source Input Power 3.135 3.3 4.4
3 GND V Ground Input Power - 0 -
6 Full_Card_Power_Off#d PD Turn module on Input High 0.7 - 4.4
Turn module off Input Low -0.3 - 0.5
7 USB_D+d - USB data positive Input/Output Differential - - -
8 W_DISABLE#e PU Wireless Disable (main Input Low - - 0.4

RF radio)
Input High 0.7 - 4.4
9 USB_D-d - USB data negative Input/Output Differential - - -
10 WWAN_LED# OC LED Driver Output Low 0 - 0.15
12 Key Notch location
20 NC Reserved—Host must
not repurpose this pin.
21 CONFIG_0 Reserved—Host must Output - 0

(GND in default module not repurpose this pin.
configuration)
23 WAKE_ON_WAN#d OC Wake Host Output Low 0 0.1
Rev. 7 Oct.19 23 41112028

Table 2-1: Host Interface (75-pin) Connections — Module View a (Continued)

Active
type Min Typ Max
25 DPR - Dynamic power control Input High 1.17 1.80 2.10
Input Low -0.3 - 0.63
26 GPS_DISABLE#e PU Wireless disable Input Low - - 0.4

(GNSS radio)
Input High 0.7 - 4.4
29 USB3.0_TX- USB 3.0 Transmit Data Output Differential - - -

negative
30 UIM1_RESETd O SIM Reset Output Low 0 - 0.45
High 2.55 3.00 3.10

(3V SIM) (3V SIM) (3V SIM)
1.35 1.80 1.90
(1.8V SIM) (1.8V SIM) (1.8V SIM)
31 USB3.0_TX+ USB 3.0 Transmit Data Output Differential - - -

positive
32 UIM1_CLKd O SIM Clock Output Low 0 - 0.45
High 2.55 3.00 3.10

1.35 1.80 1.90
(1.8V SIM) (1.8V SIM) (1.8V SIM)
34 UIM1_DATAd - SIM IO pin Input Low -0.30 - 0.60

(3V SIM) (3V SIM)
-0.30 0.35
(1.8V SIM) (1.8V SIM)
High 2.10 3.00 3.30

1.17 1.80 2.10
(1.8V SIM) (1.8V SIM) (1.8V SIM)
Output Low 0 - 0.40
High 2.55 3.00 3.10

1.35 1.80 1.90
(1.8V SIM) (1.8V SIM) (1.8V SIM)
35 USB3.0_RX- USB 3.0 Receive Data Input Differential - - -

negative
36 UIM1_PWRd V SIM VCC supply Output Power 2.90 3.00 3.10

1.75 1.80 1.85
(1.8V SIM) (1.8V SIM) (1.8V SIM)
Rev. 7 Oct.19 24 41112028


Active
type Min Typ Max
37 USB3.0_RX+ USB 3.0 Receive Data Input Differential - - -

positive
38 NC Reserved
40 SIM_DETECT_2 SIM2 indication Input 0 V—SIM not present

Open circuit—SIM present
41 PCIE_TXM Reserved
Note: Leave pin
floating on host side.
42 UIM2_DATAd - SIM2 IO pin Input Low -0.30 - 0.60

(3V SIM) (3V SIM)
-0.30 0.35
(1.8V SIM) (1.8V SIM)
High 2.10 3.00 3.30

1.17 1.80 2.10
(1.8V SIM) (1.8V SIM) (1.8V SIM)
Output Low 0 - 0.40
High 2.55 3.00 3.10

1.35 1.80 1.90
(1.8V SIM) (1.8V SIM) (1.8V SIM)
43 PCIE_TXP Reserved
Note: Leave pin
44 UIM2_CLKd O SIM2 Clock Output Low 0 - 0.45
High 2.55 3.00 3.10

1.35 1.80 1.90
(1.8V SIM) (1.8V SIM) (1.8V SIM)

d
46 UIM2_RESET O SIM2 Reset Output Low 0 - 0.45
High 2.55 - 3.10

(3V SIM) (3V SIM)
1.35 1.90
(1.8V SIM) (1.8V SIM)
47 PCIE_RXM Reserved
Note: Leave pin
48 UIM2_PWRd V SIM2 VCC supply Output Power 2.90 3.00 3.10

1.75 1.80 1.85
(1.8V SIM) (1.8V SIM) (1.8V SIM)
Rev. 7 Oct.19 25 41112028


Active
type Min Typ Max
49 PCIE_RXP Reserved
Note: Leave pin
50 PCIE_PERST_N Reserved
Note: Leave pin
52 PCIE_CLKREQ_N OC Reserved
Note: Leave pin
53 PCIE_REFCLKM Reserved
Note: Leave pin
54 PCIE_PEWAKE_N OC Reserved
Note: Leave pin
55 PCIE_REFCLKP Reserved
Note: Leave pin
59 ANTCTL0 (GPIO1) Customer-defined Output High 1.35 - 1.80

external switch control
for multiple antennas Output Low 0 - 0.45
60 Reserved—Host must not repurpose this pin and should leave it not connected.



66 SIM_DETECTd PU SIM indication Input 0 V—SIM not present

Open circuit—SIM present
Rev. 7 Oct.19 26 41112028


Active
type Min Typ Max
67 RESET# PU Reset module Input Low -0.3 0.63
68 NC Reserved
69 CONFIG_1 Reserved—Host must Output - 0

(GND in default module not re-purpose this pin.
configuration)
75 CONFIG_2 V Reserved Output - - -

(NC in default module
configuration)
a. All values are preliminary and subject to change.

b. I—Input; O—Digital output; OC—Open Collector output; PU—Digital input (internal pull up); PD—Digital input (internal pull down);
V—Power or ground
c. Signal directions are from module’s point of view (e.g. ‘Output’ from module to host, ‘Input’ to module from host.)
d. Required signal
e. Sierra Wireless recommends that the host implement an open collector driver where a Low signal will turn the module off or enter
low power mode, and a high signal will turn the module on or leave low power mode.
Power Supply
The host provides power to the EM7511 through multiple power and ground pins as
summarized in Table 2-2.
The host must provide safe and continuous power (via battery or a regulated power
supply) at all times; the module does not have an independent power supply, or protection
circuits to guard against electrical issues.
Table 2-2: Power and Ground Specifications

Name Pins Specification Min Typ Max Units
VCC 2, 4, 70, 72, 74 Voltage range See Table 2-1 on page 23.
(3.3V)
Ripple voltage - - 100 mVpp
GND 3, 5, 11, 27, 33, 39, - - 0 - V

45, 51, 57, 71, 73
Rev. 7 Oct.19 27 41112028

USB Interface
Important: Host support for USB 2.0 or USB 3.0 signals is required.
The device supports USB 2.0 and USB 3.0 interfaces for communication between the
host and module.
The interfaces comply with the [9] Universal Serial Bus Specification, Rev 2.0 and [10]
Universal Serial Bus Specification, Rev 3.0 (subject to limitations described below), and
the host device must be designed to the same standards.
Table 2-3: USB Interfaces

Name Pin Description
USB 2.0 USB_D+ 7 Data positive
USB_D- 9 Data negative
USB 3.0 USB3.0-TX-a 29 Transmit data negative
USB3.0-TX+a 31 Transmit data positive
USB3.0-RX-a 35 Receive data negative
USB3.0-RX+a 37 Receive data positive
a. Signal directions (Tx/Rx) are from module’s point of view.
Host-side Recommendation
Note: When designing the host device, careful PCB layout practices must be followed.
Sierra Wireless recommends the host platform include series capacitors on the USB3.0
Rx signals (no capacitors required for the Tx signals), as shown below.
Host
100 nF 35 USB3.0-RX-
M.2 Connector
100 nF 37 USB3.0-RX+
RX
EM7511
29 USB3.0-TX- 100 nF
31 USB3.0-TX+ 100 nF TX
Figure 2-4: Recommended Capacitor Placement for USB3.0 Signals
Rev. 7 Oct.19 28 41112028

USB Throughput Performance

This device has been designed to achieve optimal performance and maximum throughput
using USB superspeed mode (USB 3.0). Although the device may operate with a high
speed host, throughput performance will be on an “as is” basis and needs to be
characterized by the OEM. Note that throughput will be reduced and may vary
significantly based on packet size, host interface, and firmware revision.
User-developed Drivers
Details for user-developed USB drivers are described in [4] AirCard/AirPrime USB Driver
Developer’s Guide (Doc# 2130634).
SIM Interface
Note: Host support for SIM interface signals is required.
The module supports up to two SIMs (Subscriber Identity Module) (1.8 V or 3 V). Each
SIM holds information for a unique account, allowing users to optimize their use of each
account on multiple devices.
The SIM pins (Table 2-4 on page 29) provide the connections necessary to interface to
SIM sockets located on the host device as shown in Figure 2-5 on page 30. Voltage levels
over this interface comply with 3GPP standards.
The types of SIM connectors used depends on how the host device exposes the SIM
sockets.
Table 2-4: SIM Interface Signals

SIM
SIM Name Pin Description contact a Notes
UIM1_RESET 30 Reset 2 Active low SIM reset
UIM1_CLK 32 Serial clock 3 Serial clock for SIM data
UIM1_DATA 34 Data I/O 7 Bi-directional SIM data line
UIM1_PWR 36 SIM voltage 1 Power supply for SIM

Primary
Input from host indicating whether SIM is present or not
SIM_DETECT 66 SIM indication - • Grounded if no SIM is present
• No-connect (floating) if SIM is inserted
Ground reference
UIM_GND Ground 5
UIM_GND is common to module ground
Rev. 7 Oct.19 29 41112028

Table 2-4: SIM Interface Signals (Continued)

SIM
SIM Name Pin Description contact a Notes
UIM2_RESET 46 Reset 2 Active low SIM reset
UIM2_CLK 44 Serial clock 3 Serial clock for SIM data
UIM2_DATA 42 Data I/O 7 Bi-directional SIM data line
UIM2_PWR 48 SIM voltage 1 Power supply for SIM

Secondary
Input from host indicating whether SIM is present or not
SIM_DETECT_2 40 SIM indication - • Grounded if no SIM is present
• No-connect (floating) if SIM is inserted
Ground reference
UIM2_GND SIM indication -
UIM2_GND is common to module ground
a. See Figure 2-6 on page 31 for SIM card contacts.
SIM Detect
UIM-PWR
4.7uF
X5R 0.1uF (Optional.
typ Locate near the
SIM socket)
15 k - 30 k NOTE: UIM signals
refer to both UIM1
and UIM2.
Located near
SIM socket
(Optional.
(C9) (C1) Locate near the
Note: SIM Detect SIM socket)
contact may vary 47 pF, 51 
by vendor UIM-CLK
(C3)
UIM-DATA
(C7)
UIM-RESET
(C2)
UIM_GND EM7511
(C5)
Located near SIM socket.

NOTE: Carefully consider if ESD
SIM card connector protection is required – it may
ESD
protection increase signal rise time and
lead to certification failure
Figure 2-5: SIM Application Interface (applies to both SIM interfaces)
Rev. 7 Oct.19 30 41112028

Contact View (notched corner at top left)
RFU C8 C4 RFU
I/O C7 C3 CLK
VPP C6 C2 RST
GND C5 C1 VCC
Figure 2-6: SIM Card Contacts (Contact View)
SIM Implementation
Note: For interface design requirements, refer to ETSI TS 102 230 V5.5.0, section 5.2.
When designing the remote SIM interface, you must make sure that SIM signal integrity is
not compromised.
Some design recommendations include:
• Total impedance of the VCC and GND connections to the SIM, measured at the
module connector, should be less than 1  to minimize voltage drop (includes any
trace impedance and lumped element components—inductors, filters, etc.).
• Position the SIM connector 10 cm from the module. If a longer distance is required
because of the host device design, use a shielded wire assembly—connect one end
as close as possible to the SIM connector and the other end as close as possible to
the module connector. The shielded assembly may help shield the SIM interface from
system noise.
• Reduce crosstalk on the UIM1_DATA and UIM2_DATA lines to reduce the risk of
failures during GCF approval testing.
• Avoid routing the clock and data lines for each SIM (UIM1_CLK/UIM1_DATA,
UIM2_CLK/UIM2_DATA) in parallel over distances 2 cm—cross-coupling of a clock
and data line pair can cause failures.
• 3GPP has stringent requirements for I/O rise time (<1 µs), signal level limits, and
noise immunity—consider this carefully when developing your PCB layout.
· Keep signal rise time <1 µs—keep SIM signals as short as possible, and keep very
low capacitance traces on the data and clock signals (UIM1_CLK, UIM1_DATA,
UIM2_CLK, UIM2_DATA). High capacitance increases signal rise time, potentially
causing your device to fail certification tests.
• Add external pull-up resistors (15 k–30 k), if required, between the data and power
lines for each SIM (UIM1_DATA/UIM1_PWR, UIM2_DATA/UIM2_PWR) to optimize
the signal rise time.
• VCC line should be decoupled close to the SIM socket.
• SIM is specified to run up to 5 MHz (SIM clock rate). Take note of this speed in the
placement and routing of the SIM signals and connectors.
• You must decide whether additional ESD protection is required for your product, as it
is dependent on the application, mechanical enclosure, and SIM connector design.
Rev. 7 Oct.19 31 41112028

The SIM pins will require additional ESD protection if they are exposed to high ESD
levels (i.e. can be touched by a user).
• Putting optional decoupling capacitors on the SIM power lines (UIM1_PWR,
UIM2_PWR) near the SIM sockets is recommended—the longer the trace length
(impedance) from the socket to the module, the greater the capacitance requirement
to meet compliance tests.
• Putting an optional series capacitor and resistor termination (to ground) on the clock
lines (UIM1_CLK, UIM2_CLK) at the SIM sockets to reduce EMI and increase signal
integrity is recommended if the trace length between the SIM socket and module is
long—47 pF and 50  resistor are recommended.
• Test your first prototype host hardware with a Comprion IT3 SIM test device at a
suitable testing facility.
Control Interface (Signals)

The EM7511 provides signals for:
• Waking the host when specific events occur
• Host control of the module’s radios
• Host control of module power
• LED driver output
Note: Host support for Full_Card_Power_Off# is required, and support for other signals in Table 2-5
is optional.
These signals are summarized in Table 2-5 and paragraphs that follow.
Table 2-5: Module Control Signals

Name Pin Description Type a
Full_Card_Power_Off# 6 On/off signal PD
W_DISABLE# 8 Wireless disable (Main RF) PU
WWAN_LED# 10 LED driver OC
WAKE_ON_WAN# 23 Wake host O
GPS_DISABLE# 26 Wireless disable (GNSS) PU
RESET# 67 Reset module PU

a. O—Digital pin Output; OC—Open Collector output; PD—Digital pin Input,
internal pull down; PU—Digital pin Input, internal pull up
WAKE_ON_WAN# — Wake Host
Note: Host support for WAKE_ON_WAN# is optional.
The EM7511 uses WAKE_ON_WAN# to wake the host when specific events occur.
Rev. 7 Oct.19 32 41112028

The host must provide a 5 k–100 k pullup resistor that considers total line capacitance
(including parasitic capacitance) such that when WAKE_ON_WAN# is deasserted, the line
will rise to 3.3 V (Host power rail) in < 100 ns.
See Figure 2-7 on page 33 for a recommended implementation.
VCC
5k-100k
Host
WAKE_ON_WAN#
1 Q
Control
R
2
Module
Figure 2-7: Recommended WAKE_ON_WAN# Connection
W_DISABLE# (Wireless Disable) and

GPS_DISABLE# (GNSS Disable)
Note: Host support for wireless/GNSS disable signals is optional.
The host device uses W_DISABLE# to enable/disable the WWAN or radio modem, and
GPS_DISABLE# to enable/disable GNSS functionality.
Letting these signals float high allows the module to operate normally. These pins have
100 k pull-up resistors. See Figure 2-8 on page 34 for a recommended implementation.
When integrating with your host device, keep the following in mind:
• The signal is an input to the module and should be driven LOW to turn the radio off, or
HIGH or floating to keep it on.
• If the host never needs to assert this power state control to the module, leave this
signal unconnected from the host interface.
Rev. 7 Oct.19 33 41112028

Table 2-6: W_DISABLE# / GPS_DISABLE# Usage

Name Pin Description / notes
W_DISABLE# 8 Enable/disable the WWAN or radio modema. When disabled, the modem cannot
transmit or receive.
• Leave as not connected or drive HIGH to keep the modem always on.
• Drive LOW to turn the modem off.
GPS_DISABLE# 26 Enable/disable GNSS functionalitya
• Leave as not connected or drive HIGH to enable GNSS functionality.
• Drive LOW to disable GNSS functionality.
• For details on enabling / disabling GNSS functionality, see the
AT!CUSTOM=”GPSENABLE” command in [2] AirPrime EM75xx AT
Command Reference (Doc# 41111748).
a. Sierra Wireless recommends that the host implement an open collector driver where a Low signal turns off the modem or dis-
ables GNSS functionality, and a high signal turns on the modem or lenables GNSS functionality.
VCC PMIC for W_DISABLE#

100k
3
Wireless
10k 1 Q
disable control
Host
R
2
Module
Figure 2-8: Recommended Wireless Disable Connection
Full_Card_Power_Off# and RESET#
Note: Host support for Full_Card_Power_Off# is required, and support for RESET# is optional.
Full_Card_Power_Off# and RESET# are inputs to the module that the host uses as
described in Table 2-7.
For timing details, see Power On/Off Timing for the USB on page 53.
Rev. 7 Oct.19 34 41112028

Table 2-7: Full_Card_Power_Off# and RESET# Usage

Name Pin Description / notes
Full_Card_Power_Off# 6 Powers the module on/off.

• Signal is required.
• Pull HIGH to keep the module on. To keep the module always on:
· Tie the pin directly to a host GPIO (1.8V), or
· Use an external pull-up to pull signal high (10k–20k for 1.8V, 75–100k for VCC
rail). Note that a larger-value resistor will reduce leakage current.
• To power off the module, see Required Shutdown Sequence on page 54.
RESET# 67 Resets the module.

• Signal is optional. The module will operate correctly if the pin is left disconnected
on the host.
• To reset the module, pulse the RESET# pin with a logic low signal for
250 ms (min) to 2 seconds (max)—if the signal is held low for more than
2 seconds, the reset cycle restarts, and if it continues to be held low through
several cycles, SED (smart error detection, see page 57 for details) will engage
and cause the modem to wait in boot-and-hold mode.
Otherwise, leave the signal floating or high impedance (the module will remain
operational because the module has a pull-up resistor to an internal reference
voltage (1.8V) in place.).
RESET#
High
Low
250ms–2 sec
• The signal requires an open collector input from the host.

• This is a ‘hard’ reset, which should be used only if the host cannot communicate
with the module via the USB port. (If the port is not working, the module may have
locked up or crashed.)
Caution: RESET# should not be driven or pulled to a logic high level by the host, as
this may cause damage to the module.
WWAN_LED#—LED Output
Note: Host support for WWAN_LED# is optional.
The configuration for the LED shown in Figure 2-9 is customizable. Contact your Sierra
Wireless account representative for details.
Rev. 7 Oct.19 35 41112028

VCC
Current limiting Resistor
LED
Module
LED#
MIO
Figure 2-9: Example LED
Antenna Control
Note: Host support for antenna control signals is optional.
The EM7511 provides four output signals (listed in Table 2-8) that may be used for host
designs that incorporate tunable antennas. Customers can configure these signals as
appropriate for the operating band(s) using the command AT!ANTSEL. (See [2] AirPrime
EM75xx AT Command Reference (Doc# 41111748) for details.)
Note: To avoid detuning the PCC band, customers must make sure there are no GPIO state
conflicts between the PCC and SCC for all supported CA combinations.
Table 2-8: Antenna Control Signals

Name Pin Description
ANTCTL0 59
ANTCTL1 61 Customer-defined external switch controls for tunable

antennas
ANTCTL2 63
ANTCTL3 65
Rev. 7 Oct.19 36 41112028

3
3: RF Specifications
The EM7511 includes three RF connectors for use with host-supplied antennas:
• Main RF connector—Tx/Rx path
• GNSS RF connector—Dedicated GPS, GLONASS, BeiDou, Galileo, and QZSS
• Auxiliary RF connector—Diversity, MIMO, GPS, GLONASS, BeiDou, Galileo, and
QZSS
The module does not have integrated antennas.
Auxiliary RF (Diversity/MIMO/GNSS)
GNSS RF
Main RF (Rx/Tx)
I/O FPC Connector
Figure 3-1: Module Connectors
RF Connections
When attaching antennas to the module:
• Use RF plug connectors that are compatible with the following RF receptacle
connectors: Foxconn (KK12011-02-7H), Longwell (911-002-0006R), Speedtech
(C87P101-00001-H), Murata (MM4829-2702RA4 (HSC)), IPEX (20449-001E
(MHF4)).
• Match coaxial connections between the module and the antenna to 50 .
• Minimize RF cable losses to the antenna; the recommended maximum cable loss for
antenna cabling is 0.5 dB.
• To ensure best thermal performance, use the mounting hole (if possible) to attach
(ground) the device to a metal chassis.
Note: If the antenna connection is shorted or open, the modem will not sustain permanent damage.
Shielding
The module is fully shielded to protect against EMI and must not be removed.
Rev. 7 Oct.19 37 41112028

Antenna and Cabling

When selecting the antenna and cable, it is critical to RF performance to match antenna
gain and cable loss.
Note: For detailed electrical performance criteria, see Appendix A: Antenna Specification on
page 65.
Choosing the Correct Antenna and Cabling

When matching antennas and cabling:
• The antenna (and associated circuitry) should have a nominal impedance of 50 
with a return loss of better than 10 dB across each frequency band of operation.
• The system gain value affects both radiated power and regulatory (FCC, IC, CE, etc.)
test results.
Designing Custom Antennas

Consider the following points when designing custom antennas:
• A skilled RF engineer should do the development to ensure that the RF performance
is maintained.
• If both UMTS and CDMA modules will be installed in the same platform, you may
want to develop separate antennas for maximum performance.
Determining the Antenna’s Location

When deciding where to put the antennas:
• Antenna location may affect RF performance. Although the module is shielded to
prevent interference in most applications, the placement of the antenna is still very
important—if the host device is insufficiently shielded, high levels of broadband or
spurious noise can degrade the module’s performance.
• Connecting cables between the module and the antenna must have 50  impedance.
If the impedance of the module is mismatched, RF performance is reduced signifi-
cantly.
• Antenna cables should be routed, if possible, away from noise sources (switching
power supplies, LCD assemblies, etc.). If the cables are near the noise sources, the
noise may be coupled into the RF cable and into the antenna. See Interference from
Other Wireless Devices on page 39.
Disabling the Diversity Antenna

Certification testing of a device with an integrated EM7511 may require the module’s main
and diversity antennas to be tested separately.
To facilitate this testing, receive diversity can be enabled/disabled using AT commands:
• !RXDEN—Used to enable/disable diversity for single-cell call (no carrier aggre-
gation).
• !LTERXCONTROL—Used to enable/disable paths (in carrier aggregation scenarios)
after a call is set up.
Rev. 7 Oct.19 38 41112028

RF Specifications
Important: LTE networks expect modules to have more than one antenna enabled for proper
operation. Therefore, customers must not commercially deploy their systems with the diversity
antenna disabled.
For details, see [2] AirPrime EM75xx AT Command Reference (Doc# 41111748).
Note: A diversity antenna is used to improve connection quality and reliability through redundancy.
Because two antennas may experience difference interference effects (signal distortion, delay, etc.),
when one antenna receives a degraded signal, the other may not be similarly affected.
Ground Connection
When connecting the module to system ground:
• Prevent noise leakage by establishing a very good ground connection to the module
through the host connector.
• Connect to system ground using the mounting hole shown in Figure 3-1 on page 37.
• Minimize ground noise leakage into the RF.
Depending on the host board design, noise could potentially be coupled to the
module from the host board. This is mainly an issue for host designs that have signals
traveling along the length of the module, or circuitry operating at both ends of the
module interconnects.
Interference and Sensitivity

Several interference sources can affect the module’s RF performance (RF desense).
Common sources include power supply noise and device-generated RF.
RF desense can be addressed through a combination of mitigation techniques (Methods
to Mitigate Decreased Rx Performance on page 40) and radiated sensitivity measurement
(Radiated Sensitivity Measurement on page 41).
Note: The EM7511 is based on ZIF (Zero Intermediate Frequency) technologies. When performing
EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate Frequency) components
from the module to consider.
Interference from Other Wireless Devices

Wireless devices operating inside the host device can cause interference that affects the
module.
To determine the most suitable locations for antennas on your host device, evaluate each
wireless device’s radio system, considering the following:
• Any harmonics, sub-harmonics, or cross-products of signals generated by wireless
devices that fall in the module’s Rx range may cause spurious response, resulting in
decreased Rx performance.
• The Tx power and corresponding broadband noise of other wireless devices may
overload or increase the noise floor of the module’s receiver, resulting in Rx desense.
Rev. 7 Oct.19 39 41112028

The severity of this interference depends on the closeness of the other antennas to the
module’s antenna. To determine suitable locations for each wireless device’s antenna,
thoroughly evaluate your host device’s design.
Host-generated RF Interference
All electronic computing devices generate RF interference that can negatively affect the
receive sensitivity of the module.
Proximity of host electronics to the antenna in wireless devices can contribute to
decreased Rx performance. Components that are most likely to cause this include:
• Microprocessor and memory
• Display panel and display drivers
• Switching-mode power supplies
Device-generated RF Interference
The module can cause interference with other devices. Wireless devices such as AirPrime
embedded modules transmit in bursts (pulse transients) for set durations (RF burst
frequencies). Hearing aids and speakers convert these burst frequencies into audible
frequencies, resulting in audible noise.
Methods to Mitigate Decreased Rx Performance

It is important to investigate sources of localized interference early in the design cycle. To
reduce the effect of device-generated RF on Rx performance:
• Put the antenna as far as possible from sources of interference. The drawback is that
the module may be less convenient to use.
• Shield the host device. The module itself is well shielded to avoid external inter-
ference. However, the antenna cannot be shielded for obvious reasons. In most
instances, it is necessary to employ shielding on the components of the host device
(such as the main processor and parallel bus) that have the highest RF emissions.
• Filter out unwanted high-order harmonic energy by using discrete filtering on low
frequency lines.
• Form shielding layers around high-speed clock traces by using multi-layer PCBs.
• Route antenna cables away from noise sources.
Radiated Spurious Emissions (RSE)

When designing an antenna for use with AirPrime embedded modules, the host device
with an AirPrime embedded module must satisfy any applicable standards/local
regulatory bodies for radiated spurious emission (RSE) for receive-only mode and for
transmit mode (transmitter is operating).
Note that antenna impedance affects radiated emissions, which must be compared
against the conducted 50-ohm emissions baseline. (AirPrime embedded modules meet
the 50-ohm conducted emissions requirement.)
Rev. 7 Oct.19 40 41112028

RF Specifications
Radiated Sensitivity Measurement

A wireless host device contains many noise sources that contribute to a reduction in Rx
performance.
To determine the extent of any receiver performance desensitization due to self-generated
noise in the host device, over-the-air (OTA) or radiated testing is required. This testing can
be performed by Sierra Wireless or you can use your own OTA test chamber for in-house
testing.
Sierra Wireless’ Sensitivity Testing and

Desensitization Investigation
Although AirPrime embedded modules are designed to meet network operator
requirements for receiver performance, they are still susceptible to various performance
inhibitors.
As part of the Engineering Services package, Sierra Wireless offers modem OTA
sensitivity testing and desensitization (desense) investigation. For more information,
contact your account manager or the Sales Desk (see Contact Information on page 3).
Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and TRP (Total
Radiated Power) according to CTIA's published test procedure.
Sensitivity vs. Frequency

For UMTS bands, sensitivity is defined as the input power level in dBm that produces a
BER (Bit Error Rate) of 0.1%. Sensitivity should be measured at all UMTS frequencies
across each band.
For LTE bands, sensitivity is defined as the RF level at which throughput is 95% of
maximum.
Supported Frequencies
The EM7511 supports:
• Multiple-band LTE—See Table 3-1 on page 42 (supported bands) and Table 3-2 on
page 42 (LTE bandwidth support).
• LTE Advanced carrier aggregation—See Table 1-1 on page 12, Table 1-2 on
page 12, and Table 1-3 on page 14 for details.
• Multiple-band WCDMA/HSPA/HSPA+/DC-HSPA+—See Table 3-3 on page 43.
• Multiple-band WCDMA receive diversity
• GPS, GLONASS, BeiDou, Galileo, QZSS—See Table 3-7 on page 47.
• Inter-RAT and inter-frequency cell reselection and handover between supported
frequency bands
Rev. 7 Oct.19 41 41112028

Table 3-1: LTE Frequency Bands

Band Frequency (Tx) Frequency (Rx)
B1 1920–1980 MHz 2110–2170 MHz
B2 1850–1910 MHz 1930–1990 MHz
B3 1710–1785 1805–1880 MHz
B4 1710–1755 2110–2155 MHz
B5 824–849 MHz 869–894 MHz
B7 2500–2570 MHz 2620–2690 MHz
B8 880–915 MHz 925–960 MHz
B9 1749.9–1784.9 MHz 1844.9–1879.9 MHz
B12 699–716 MHz 729–746 MHz
B13 777–787 MHz 746–756 MHz
B14 788–798 MHz 758–768 MHz
B18 815–830 MHz 860–875 MHz
B19 830–845 MHz 875–890 MHz
B20 832–862 MHz 791–821 MHz
B26 814–849 MHz 859–894 MHz
B29 n/a 717–728 MHz
2305–2315 MHz
B30 2350–2360 MHz
Note: B30 Tx is disabled.
B32 n/a 1452–1496 MHz
B41 2496–2690 MHz (TDD)
B42 3400–3600 MHz (TDD)
B43 3600–3800 MHz (TDD)
B46 n/a 5150–5925 MHz (TDD)
B48 3550–3700 MHz (TDD)
B66 1710–1780 MHz 2110–2200 MHz
Table 3-2: LTE Bandwidth Support a

Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz
B1      
B2     b b
B3     b b
Rev. 7 Oct.19 42 41112028

RF Specifications
Table 3-2: LTE Bandwidth Support a (Continued)

Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz
B4      
B5    b  
B7     c b,c
B8    b  
B9     b b
B12   b b  
B13   b b  
B14   b b  
B18    b b 
B19    b b 
B20    b b b
B26    b b 
B30    b  
B32      
B41      
B42      
B43      
B46      
B48      
B66      
a. Table contents are derived from 3GPP TS 36.521-1 v12.6.0, table 5.4.2.1-1.
b. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement
(Clause 7.3 of 3GPP TS 36.521-1 v12.6.0) is allowed.
c. Bandwidth for which uplink transmission bandwidth can be restricted by the network for
some channel assignments in FDD/TDD co-existence scenarios in order to meet
unwanted emissions requirements (Clause 6.6.3.2 of 3GPP TS 36.521-1 v12.6.0).
Table 3-3: WCDMA Frequency Bands Support

Band 1 1920–1980 MHz 2110–2170 MHz
Band 2 1850–1910 MHz 1930–1990 MHz
Band 4 1710–1755 MHz 2110–2155 MHz
Band 5 824–849 MHz 869–894 MHz
Band 6 830–840 MHz 875–885 MHz
Rev. 7 Oct.19 43 41112028

Table 3-3: WCDMA Frequency Bands Support (Continued)

Band 8 880–915 MHz 925–960 MHz
Band 9 1749.9–1784.9 MHz 1844.9–1879.9 MHz
Band 19 830–845 MHz 875–890 MHz
Rev. 7 Oct.19 44 41112028

RF Specifications
Conducted Rx Sensitivity / Tx Power

Note: Values in the following tables are preliminary, pending transceiver matching/testing.
Table 3-4: Conducted Rx (Receive) Sensitivity — LTE Bands

Conducted Rx sensitivity (dBm)
LTE bands
Primary (Typ) Secondary (Typ) SIMO (Typ) SIMO a (Worst case)
B1 -97.5 -97.5 -100.0 -96.3
B2 -98.0 -97.5 -100.5 -94.3
B3 -97.0 -98.0 -100.5 -93.3
B4 -97.0 -98.0 -100.0 -96.3
B5 -99.0 -100.5 -102.5 -94.3
B7 -97.0 -99.0 -101.0 -94.3
B8 -98.5 -100.5 -102.5 -93.3
B9 -97.0 -98.5 -100.5 -95.3
B12 -98.0 -101.0 -102.5 -93.3
B13 -98.0 -101.0 -103.0 -93.3
B14 -97.5 -100.0 -102.0 -93.3
B18 -99.0 -101.0 -103.0 -96.3

Full RB on downlink;
B19 BW: 10 MHzb -98.5 -100.5 -102.5 -96.3
B20 -98.5 -101.0 -103.5 -93.3
B26 -99.0 -100.5 -102.5 -93.8
B29 -97.0 -101.0 -102.5 -93.3
B30 -97.0 -99.0 -101.0 -95.3
B32 -99.5 -98.0 -101.5 -96.3
B41 -96.5 -98.0 -100.5 -94.3
B42 -97.0 -98.5 -101.0 -95.0
B43 -97.0 -97.5 -101.0 -95.0
B48 -97.0 -98.0 -101.0 -95.3
B66 -97.0 -98.0 -100.0 -95.8
Full RB on downlink;
B46 -96.5 -97.0 -99.0 -88.5
BW: 20 MHz
a. Per 3GPP specification

b. Sensitivity values scale with bandwidth:
x_MHz_Sensitivity = 10_MHz_Sensitivity - 10*log(10 MHz/x_MHz)
Note: Bandwidth support is dependent on firmware version.
Rev. 7 Oct.19 45 41112028

Table 3-5: Conducted Rx (Receive) Sensitivity — UMTS Bands

Conducted Rx sensitivity (dBm)
UMTS bands Primary / Secondary
Primary Secondary
(Typical) (Typical) (Worst case) a
Band 1 -110.6 -110.5 -106.7
Band 2 -111.2 -110.4 -104.7
Band 4 -110.1 -110.6 -106.7
Band 5 -111.4 -113.5 -104.7
Band 6 0.1% BER -111.2 -113.5 -106.7

12.2 kbps
Band 8 -111.4 -113.4 -103.7
Band 9 -110.1 -111.3 -105.7
Band 19 -111.1 -113.4 -106.7
a. Per 3GPP specification
Table 3-6: Conducted Tx (Transmit) Power Tolerances

Bands Conducted Tx power Notes
LTE
LTE bands 1,2,3,4,5,8,9,12,13,14,18,19,20,26,66 +23 dBm  1 dB
Single cell: +22 dBm  1 dB 0.8 dB offset for UL CA

LTE bands 7,41 hardcoded by chipset
UL CA: +22.8 dBm  1 dB manufacturer
LTE bands 42,43,48 +22 dBm  1 dB
UMTS
Band 1 (IMT 2100 12.2 kbps)

Band 2 (UMTS 1900 12.2 kbps)
Band 4 (AWS 1700/2100 12.2 kbps)
Band 5 (UMTS 850 12.2 kbps) Connectorized
+23 dBm  1 dB
Band 6 (UMTS 800 12.2 kbps) (Class 3)
Rev. 7 Oct.19 46 41112028

RF Specifications
GNSS Specifications
Note: For detailed electrical performance criteria, see Recommended GNSS Antenna Specifica-
tions on page 67.
.
Table 3-7: GNSS Specifications
Parameter/feature Description
Maximum 30 channels (16 GPS, 14 GLONASS),

Satellite channels
simultaneous tracking
Protocols NMEA 0183 V3.0
Hot start: 1 s
Acquisition timea Warm start: 29 s
Cold start: 32 s
Horizontal: < 2 m (50%); < 5 m (90%)

Accuracy Altitude: < 4 m (50%); < 8 m (90%)
Velocity: < 0.2 m/s
Trackingb: -160 dBm

Sensitivity Acquisitionc (Assisted): -158 dBm
Acquisition (Standalone): -145 dBm
Altitude <6000 m or velocity <100 m/s

Operational limits
(Either limit may be exceeded, but not both.)
a. Acquisition times measured with signal strength = -135 dBm

b. Tracking sensitivity is the lowest GNSS signal level for which the device can still
detect an in-view satellite 50% of the time when in sequential tracking mode.
c. Acquisition sensitivity is the lowest GNSS signal level for which the device can still
detect an in-view satellite 50% of the time.
The module includes an internal GNSS LNA, as shown in Figure 2-3 on page 22.
Rev. 7 Oct.19 47 41112028

4
4: Power
Power Consumption
Power consumption measurements in the tables below are for the EM7511 connected to
the host PC via USB.
The module does not have its own power source and depends on the host device for
power. For a description of input voltage requirements, see Power Supply on page 27.
Table 4-1: Averaged Standby DC Power Consumption a

Current
b Notes /
Signal Description Bands
c configuration
Typ Max Unit
VCC Standby current consumption (Sleep mode activatedd)
LTE LTE bands 2.8 3.3 mA DRX cycle = 8 (2.56 s)
HSPA / WCDMA UMTS bands 2.8 3.3 mA DRX cycle = 8 (2.56 s)
Standby current consumptione (Sleep mode deactivatedd)
LTE LTE bands 37 42 mA DRX cycle = 8 (2.56 s)
HSPA / WCDMA UMTS bands 37 42 mA DRX cycle = 8 (2.56 s)
Low Power Mode (LPM)/Offline Modee (Sleep mode activatedd)
RF disabled, but module is operational 2.1 2.6 mA
Low Power Mode (LPM)/Offline Modee (Sleep mode deactivatedd)
RF disabled, but module is operational 37 40 mA
Leakage current
Module powered off— 70 120 A

Full_Card_Power_Off# is Low, and VCC is
supplied
a. Preliminary, subject to change.

b. For supported bands, see Table 3-1, LTE Frequency Bands, on page 42 and Table 3-3, WCDMA Frequency
Bands Support, on page 43.
c. Measured at 25ºC/nominal 3.3 V voltage.
d. Assumes USB bus is fully suspended during measurements
e. LPM and standby power consumption will increase when LEDs are enabled. To reduce power consumption,
configure LEDs to remain off while in standby and LPM modes.
Rev. 7 Oct.19 48 41112028

Power
Table 4-2: Averaged Call Mode DC Power Consumption
Current a
Description Tx power Notes
Typ Unit
510 mA 3 CA, 20 MHz+20 MHz+20 MHz BW
382 mA 2 CA, 20 MHz+20 MHz BW

0 dBm
300 mA Single Carrier, 20 MHz BW

LTE 20 dBm

23 dBm
0 dBm 220 mA All speeds
DC-HSPA/HSPA 20 dBm 460 mA All speeds
23 dBm 540 mA Worst case
Peak current
1.3 A All LTE/WCDMA bands
(averaged over 100 s)
a. Measured at 25ºC/nominal 3.3 V voltage
Rev. 7 Oct.19 49 41112028

Table 4-3: Miscellaneous DC Power Consumption

Current / Voltage
Signal Description Min Typ Max Unit Notes / configuration

High speed USB connection, CL = 50 pF
USB active current — 15 20 mA
on D+ and D- signals
• Assumes power supply turn on time

> 100µs
Inrush current — 2.2 2.5 A
VCC • Dependent on host power supply
rise time.
• Across all bands, all temperature

Maximum current — — 1.5 A ranges
• 3.3 V supply
— — 100 mA Voltage applied to the GNSS antenna to

GNSS Signal power electronics inside the antenna
Active bias on GNSS port
connector (GNSS RF connector in Figure 3-1 on
3.05 3.15 3.25 V
page 37).
Warning: The maximum RF power level allowable on any RF port is +10dBm—damage may
occur if this level is exceeded.
Module Power States

The module has five power states, as described in Table 4-4.
Table 4-4: Module Power States
USB interface active

Host is powered
State Details
RF enabled
Normal • Module is active   

(Default
state) • Default state. Occurs when VCC is first applied, Full_Card_Power_Off# is
deasserted (pulled high), and W_DISABLE# is deasserted
• Module is capable of placing/receiving calls, or establishing data connections on the
wireless network
• Current consumption is affected by several factors, including:
• Radio band being used
• Transmit power
• Receive gain settings
• Data rate
Rev. 7 Oct.19 50 41112028

Power
Table 4-4: Module Power States (Continued)
USB interface active

Host is powered
State Details
RF enabled
Low power • Module is active   
(‘Airplane
mode’) • Module enters this state:
• Under host interface control:
· Host issues AT+CFUN=0 ([1] AT Command Set for User Equipment (UE)
(Release 6) (Doc# 3GPP TS 27.007))), or
· Host asserts W_DISABLE#, after AT!PCOFFEN=0 has been issued.
• Automatically, when critical temperature or voltage trigger limits have been
reached))
Sleep • Normal state of module between calls or data connections   

• Module cycles between wake (polling the network) and sleep, at network provider-
determined interval.
Off • Host keeps module powered off by asserting Full_Card_Power_Off# (signal pulled   
low or left floating)
• Module draws minimal current
• See Full_Card_Power_Off# and RESET# on page 34 for more information.
Disconnected • Host power source is disconnected from the module and all voltages associated with   
the module are at 0 V.
Power State Transitions

The module uses state machines to monitor supply voltage and operating temperature,
and notifies the host when critical threshold limits are exceeded. (See Table 4-5 for trigger
details and Figure 4-1 for state machine behavior.)
Power state transitions may occur:
• Automatically, when critical supply voltage or module temperature trigger levels are
encountered.
• Under host control, using available AT commands in response to user choices (for
example, opting to switch to airplane mode) or operating conditions.
Table 4-5: Power State Transition Trigger Levels
Voltage Temperature a
Transition Trigger V Trigger °C Notes
VOLT_HI_CRIT 4.4 TEMP_LO_CRIT -45

Normal to Low Power • RF activity suspended
VOLT_LO_CRIT 3.135 TEMP_HI_CRIT 105
Rev. 7 Oct.19 51 41112028

Table 4-5: Power State Transition Trigger Levels (Continued)
Voltage Temperature a
Transition Trigger V Trigger °C Notes
Low Power to Normal VOLT_HI_NORM 4.3 TEMP_NORM_LO -30
Low Power to Normal

• RF activity resumed
or VOLT_LO_NORM 3.3 TEMP_HI_NORM 70
Remain in Normal
(Remove warnings)
• In the TEMP_HI_WARN state, the module may

Normal (Issue warning) VOLT_LO_WARN 3.2 TEMP_HI_WARN 85 have reduced performance (Class B temperature
range).
• Power off recommended when supply voltage or

Power off/on
- - - - module operating temperature is critically low or
(Host-initiated)
high.
a. Module-reported temperatures at the printed circuit board.
current_vcc < VOLT_LO_WARN Normal mode

current_temp > TEMP_HI_WARN
Low supply voltage warning
Normal mode
current_vcc > VOLT_LO_NORM or
current_temp < TEMP_HI_NORM High temperature warning
current_vcc > VOLT_LO_NORM

current_temp <= TEMP_HI_NORM current_vcc < VOLT_LO_CRIT
current_temp > TEMP_HI_CRIT
Low power mode (Manual transition) Off mode

current_vcc > VOLT_HI_CRIT
current_temp < TEMP_LO_CRIT
Handled by Power Host deasserts Handled by Power
State state machine. Full_Card_Power_Off# State state machine
current_vcc < VOLT_HI_NORM
current_temp > TEMP_NORM_LO
Figure 4-1: Voltage/Temperature Monitoring State Machines
Power Interface
Power Ramp-up
On initial power up, inrush current depends on the power supply rise time—turn on time
>100 µs is required for < 3A inrush current.
The supply voltage must remain within specified tolerances while this is occurring.
Rev. 7 Oct.19 52 41112028

Power
Timing
Power On/Off Timing for the USB
Figure 4-2 describes the timing sequence for powering the module on and off.
Note: Before reaching the “Active” state, signals on the host port are considered to be undefined
and signal transitions may occur. This undefined state also applies when the module is in reset
mode, during a firmware update, or during the Power-off sequence. The host must consider these
undefined signal activities when designing the module interface.
Note: The host should not drive any signals to the module until >100 ms from the start of the
power-on sequence.
Power-on Power-off
DEVICE STATE Disconnected Off Active Off Disconnected
Sequence Sequence
High
VCC
Low
High
t_USB_suspend
Full_Card_Power_Off# Low
t_pwr_on_seq
High
USB_D+
(Double enumeration) Low
t_USB_active t_pwr_off_seq
t_pwr_on_seq
High
USB_D+
(Single enumeration) Low
t_pwr_off_seq
t_pwr_on_seq
High
USB3.0
(Single enumeration) Low
t_pwr_off_seq
High
M.2 Host Signals
Low
Figure 4-2: Signal Timing (Full_Card_Power_Off#, and USB Enumeration)
Table 4-6: USB 2.0 Power-On / Off Timing Parameters (Double Enumeration)
Parameter Typical (s) Maximum (s)
t_pwr_on_seq 0.8 0.9
t_USB_active 0.12 0.2
t_USB_suspend 8.5 11
t_pwr_off_seq 21.4 25
Rev. 7 Oct.19 53 41112028

Table 4-7: USB 2.0 Power-On / Off Timing Parameters (Single Enumeration)
t_pwr_on_seq 8.7 11
Table 4-8: USB 3.0 Power-On / Off Timing Parameters (Single Enumeration)
t_pwr_on_seq 8.6 11
USB Enumeration
The unit supports single and double USB enumeration with the host:
• Single enumeration:
· Enumeration starts within maximum t_pwr_on_seq seconds of power-on.
• Double enumeration—As shown in Figure 4-2:
· First enumeration starts within t_pwr_on_seq seconds of power-on (while USB_D+
is high)
· Second enumeration starts after t_USB_suspend (when USB_D+ goes high again)
Reset Timing
To reset the module, refer to Table 2-7 on page 35 for RESET# signal usage instructions.
Required Shutdown Sequence
Warning: To avoid causing issues with the file system, follow this shutdown sequence.
1. Drive Full_Card_Power_Off# low.

2. Wait for at least t_pwr_off_seq seconds.
3. Remove power.
Power Supply Noise

Noise in the power supply can lead to noise in the RF signal.
The power supply ripple limit for the module is no more than 100 mVp-p 1 Hz to 100 kHz.
This limit includes voltage ripple due to transmitter burst activity.
Additional decoupling capacitors can be added to the main VCC line to filter noise into the
device.
Rev. 7 Oct.19 54 41112028

Power
SED (Smart Error Detection)

The module uses a form of SED to track premature modem resets.
• Module tracks consecutive resets occuring soon after power-on.
• After a sixth consecutive reset, the module waits in boot-and-hold mode for a
firmware download to resolve the power-cycle problem.
Tx Power Control
The module’s Tx power limit may be controlled using either SAR backoff AT commands,
defined in [2] AirPrime EM75xx AT Command Reference (Doc# 41111748), or the DPR
(Dynamic power control) signal. Use the GPIOSARENABLE parameter for !CUSTOM to
choose the method:
• AT commands:
· !SARSTATEDFLT—Set (or report) the default SAR backoff state that the device
uses when it powers up. This setting is persistent across power cycles and
overrides any PRI setting.
· !SARSTATE—Set (or report) the current SAR backoff state (override the default
state). This change in state is non-persistent across power cycles.
· !SARBACKOFF—Set (or report) the maximum Tx power limit for a specific band/
technology/state combination.
Note: A customization is available to invert the DPR logic. (e.g. make DPR low = No SAR backoff)
• Dynamic power control— The module’s firmware monitors DPR (pin 25) and adjusts
the RF Tx power appropriately, as detailed in Table 4-9. (This state change is equiv-
alent to issuing the !SARSTATE AT command.)
Table 4-9: Dynamic Power Control of SAR Backoff State

DPR SAR backoff state
High a No SAR backof
Low Backoff 1
a. DPR is pulled high by default.
Note: The host can implement an open collector drive for the DPR pin (if a 1.8 V-compatible drive is
not available).
Rev. 7 Oct.19 55 41112028

5
5: Software Interface
Support Tools
The EM7511 is compatible with the following support tools from Sierra Wireless and
authorized third parties:
• Firmware update utilities from Sierra Wireless
• Sierra Wireless Logger
• QXDM from QUALCOMM
• QUALCOMM Product Support Tool (QPST)
• Windows and Linux SDKs (including API and drivers)
Host Interface
The device supports the following protocols for modem communication:
• MBIM (Mobile Broadband Interface Model)
• Qualcomm QMI interface. (Please contact your Sierra Wireless account represen-
tative for QMI interface documentation.)
Rev. 7 Oct.19 56 41112028

6
6: Mechanical and Environmental Specifica-
tions
The EM7511 module complies with the mechanical and environmental specifications in
Table 6-1. Final product conformance to these specifications depends on the OEM device
implementation.
Table 6-1: Mechanical and Environmental Specifications

Mode Details
Ambient temperature Operational -30ºC to +70ºC – 3GPP compliant
Class A
Operational -40ºC to +85ºC, with appropriate heatsinking – non-3GPP compliant

Class B (reduced operating parameters required)
Non-operational -40ºC to +85ºC, 96 hours

(from MIL-STD 202 Method 108)
Relative humidity Non-operational 85ºC, 85% relative humidity for 48 hours (non-condensing)
Vibration Non-operational Random vibration, 10 to 2000 Hz, 0.1 g2/Hz to

0.0005 g2/Hz, in each of three mutually perpendicular axes. Test
duration of 60 minutes for each axis, for a total test time of three hours.
Shock Non-operational Half sine shock, 11 ms, 30 g, 8x each axis

Half sine shock, 6 ms, 100 g, 3x each axis
Drop Non-operational 1 m on concrete on each of six faces, two times (module only)
(Electrostatic discharge Operational The RF port (antenna launch and RF connector) complies with the IEC
(See Electrostatic 61000-4-2 standard:
Discharge (ESD) on • Electrostatic Discharge Immunity: Test: Level3
page 59.) Air Discharge: ±8 kV
Non-operational The host connector interface complies with the following standard only:
• minimum ±500 V Human Body Model (JESD22-A114-B)
Thermal considerations See Thermal Considerations on page 60.
Form factor M.2 Form Factor
Dimensions Length: 42±0.15 mm (max)

Width: 30±0.15 mm (max)
Thickness: Above PCB—1.50 mm (max)
PCB—0.88 mm (max)
Weight: 6.5 g
Rev. 7 Oct.19 57 41112028

Device Views
Figure 6-1: Top View
19.30 1.50 (max)
23.80
29.68
30.00
0.8 ± 10%
0.00
0.32
6.20
0.00
1.90
3.72
 10.0
vacuum cup
28.43 Lid assembly

orientation arrow
37.68
38.00
42.00
Shield lid
5.08
15.00
20.02
21.22
24.92
(Note: All dimensions shown in mm.)

Figure 6-2: Dimensioned View
Rev. 7 Oct.19 58 41112028

Mechanical and Environmental Specifications
Product Marking (Labeling)
Figure 6-3: Unit Product Marking Example—Laser-etched, Typical Representation (Not to scale. Contents will
vary by SKU.)
The EM7511 product marking is laser-etched and may contain:

• Sierra Wireless logo and product name
• IMEI number in Data Matrix barcode format
• SKU number (when required)
• Factory Serial Number (FSN) in alphanumeric format
• Manufacturing date code (incorporated into FSN)
• Licensed vendor logo
• Certification marks/details
Note: The EM7511 supports OEM partner-specific label requirements.
Electrostatic Discharge (ESD)

The OEM is responsible for ensuring that the EM7511 host interface pins are not exposed
to ESD during handling or normal operation. (See Table 6-1 on page 57 for
specifications.)
ESD protection is highly recommended for the SIM connector at the point where the
contacts are exposed, and for any other signals from the host interface that would be
subjected to ESD by the user of the product. (The device includes ESD protection on the
antenna.)
Rev. 7 Oct.19 59 41112028

Thermal Considerations
Embedded modules can generate significant amounts of heat that must be dissipated in
the host device for safety and performance reasons.
RF
Baseband
Figure 6-4: Shield Locations (Top View)
The amount of thermal dissipation required depends on:

• Supply voltage—Maximum power dissipation for the module can be up to 3.5 W at
voltage supply limits.
• Usage—Typical power dissipation values depend on the location within the host,
amount of data transferred, etc.
Specific areas requiring heat dissipation are shown in Figure 6-5:
• RF—Bottom face of module near RF connectors. Likely to be the hottest area.
• Baseband—Bottom face of module, below the baseband area.
RF
Baseband
Figure 6-5: Copper Pad Location on Bottom Side of Module
Rev. 7 Oct.19 60 41112028

Mechanical and Environmental Specifications
To enhance heat dissipation:

• It is recommended to add a heat sink that mounts the module to the main PCB or
metal chassis (a thermal compound or pads must be used between the module and
the heat sink).
• Maximize airflow over/around the module.
• Locate the module away from other hot components.
• Module mounting holes must be used to attach (ground) the device to the main PCB
ground or a metal chassis.
• You may also need active cooling to pull heat away from the module.
Note: Adequate dissipation of heat is necessary to ensure that the module functions properly.
Module Integration Testing

When testing your integration design:
• Test to your worst case operating environment conditions (temperature and voltage)
• Test using worst case operation (transmitter on 100% duty cycle, maximum power)
• Monitor temperature at all shield locations. Attach thermocouples to the areas
indicated in Figure 6-4 on page 60 (RF, Baseband).
Note: Make sure that your system design provides sufficient cooling for the module.
(For acceptance, certification, quality, and production (including RF) test suggestions, see
Testing on page 71.)
Rev. 7 Oct.19 61 41112028

7
7: Regulatory Compliance and Industry Certifi-
cations
The EM7511 module is designed to meet, and upon commercial release, will meet the
requirements of the following regulatory bodies and regulations, where applicable:
• Federal Communications Commission (FCC) of the United States
• The Certification and Engineering Bureau of Industry Canada (IC)
• The National Communications Commission (NCC) of Taiwan, Republic of China
The EM7511 Embedded Module complies with the mandatory requirements described in
the following standards. The exact set of requirements supported is network operator-
dependent.
Table 7-1: Standards Compliance

Technology Standards
LTE • 3GPP Release 11a
UMTS • 3GPP Release 9
a. Some auxiliary functions support Release 12 or Release 13.
Upon commercial release, the following industry certifications will have been obtained,
where applicable:
• GCF
• PTCRB
Additional certifications and details on specific country approvals may be obtained upon
customer request—contact your Sierra Wireless account representative for details.
Additional testing and certification may be required for the end product with an embedded
EM7511 module and are the responsibility of the OEM. Sierra Wireless offers professional
services-based assistance to OEMs with the testing and certification process, if required.
Important Compliance Information for the

United States and Canada
The EM7511 module, upon commercial release, will have been granted modular approval
for mobile applications. Integrators may use the EM7511 module in their final products
without additional FCC/IC (Industry Canada) certification if they meet the following
conditions. Otherwise, additional FCC/IC approvals must be obtained.
1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.
2. To comply with FCC/IC regulations limiting both maximum RF output power and
human exposure to RF radiation, the maximum antenna gain including cable loss in a
mobile-only exposure condition must not exceed the limits stipulated in Table 7-2 on
page 63.
Rev. 7 Oct.19 62 41112028

Regulatory Compliance and Industry Certifications
3. The EM7511 module may transmit simultaneously with other collocated radio trans-
mitters within a host device, provided the following conditions are met:
· Each collocated radio transmitter has been certified by FCC/IC for mobile appli-
cation.
· At least 20 cm separation distance between the antennas of the collocated trans-
mitters and the user’s body must be maintained at all times.
· The radiated power of a collocated transmitter must not exceed the EIRP limit stipu-
lated in Table 7-2 on page 63.
Table 7-2: Antenna Gain and Collocated Radio Transmitter Specifications
Max Time-Avg Antenna Gain Limit (dBi) EIRP
Tx Freq Range Cond. Power Limits
Operating mode (MHz) (dBm) Standalone Collocated (dBm)
WCDMA Band 2, LTE B2 1850 1910 24 6 4 30
WCDMA Band 4, LTE B4 1710 1755 24 6 4 30
WCDMA Band 5, LTE B5 824 849 24 6 4 30
LTE B7 2500 2570 23.8a 9 4 32.8
LTE B12 699 716 24 6 4 30
LTE B13 777 787 24 6 4 30

EM7511
Embedded LTE B14 788 798 24 6 4 30
Module
LTE B26 814 849 24 6 4 30
LTE B41 2496 2690 23.8a 9 4 32.8
LTE B48b 3550 3700 23 0 0 23
LTE B66 1710 1780 24 6 4 30
WLAN 2.4 GHz 2400 2500 30
WLAN 5 GHz 5150 5850 30

Collocated
transmitters
BT 2400 2500 16
WiGig 58320 62640 25
a. Includes 0.8 dB offset from single-cell tolerance (Table 3-6 on page 46) for UL CA.
b. Important: Airborne operations in LTE Band 48 are prohibited.
4. A label must be affixed to the outside of the end product into which the EM7511
module is incorporated, with a statement similar to the following:
· This device contains FCC ID: N7NEM75S
Contains transmitter module IC: 2417C-EM75S where 2417C-EM75S is the
module’s certification number.
5. A user manual with the end product must clearly indicate the operating requirements
and conditions that must be observed to ensure compliance with current FCC/IC RF
exposure guidelines.
The end product with an embedded EM7511 module may also need to pass the FCC
Part 15 unintentional emission testing requirements and be properly authorized per FCC
Part 15.
Rev. 7 Oct.19 63 41112028

Note: If this module is intended for use in a portable device, you are responsible for
separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102.
Rev. 7 Oct.19 64 41112028

A
A: Antenna Specification
This appendix describes recommended electrical performance criteria for main path,
diversity path, and GNSS antennas used with AirPrime embedded modules.
The performance specifications described in this section are valid while antennas are
mounted in the host device with antenna feed cables routed in their final application
configuration.
Note: Antennas should be designed before the industrial design is finished to make sure that the
best antennas can be developed
Recommended Main/Diversity Antenna

Specifications
Table A-1: Antenna Requirements a
Parameter Requirements Comments
Antenna system (LTE) External multi-band 2x2 If Ant2 includes GNSS, then it must also satisfy
MIMO antenna system (Ant1/ requirements in Table A-2 on page 67.
Ant2)b
(3G) External multi-band antenna
system with diversity (Ant1/Ant2)c
Operating bands — All supporting Tx and Rx frequency

Antenna 1 bands.
Operating bands — All supporting Rx frequency bands,

Antenna 2 plus GNSS frequency bands if
Antenna 2 is used in shared
Diversity/MIMO/GNSS mode.
VSWR of Ant1 and Ant2 • < 2:1 (recommended) On all bands including band edges
• < 3:1 (worst case)
Total radiated efficiency of > 50% on all bands • Measured at the RF connector.
Ant1 and Ant2 • Includes mismatch losses, losses in the
matching circuit, and antenna losses,
excluding cable loss.
• Sierra Wireless recommends using
antenna efficiency as the primary
parameter for evaluating the antenna
system.
Peak gain is not a good indication of
antenna performance when integrated
with a host device (the antenna does not
provide omni-directional gain patterns).
Peak gain can be affected by antenna
size, location, design type, etc.—the
antenna gain patterns remain fixed unless
one or more of these parameters change.
Rev. 7 Oct.19 65 41112028

Table A-1: Antenna Requirements (Continued) a

Radiation patterns of Ant1 Nominally Omni-directional

and Ant2 radiation pattern in azimuth plane.
Envelope correlation • < 0.5 on Rx bands below

coefficient between Ant1 960 MHz
and Ant2 • < 0.2 on Rx bands above
1.4 GHz
Mean Effective Gain of  -3 dBi

Ant1 and Ant2 (MEG1,
MEG2)
Ant1 and Ant2 Mean < 2 dB for MIMO operation

Effective Gain Imbalance I < 6 dB for diversity operation
MEG1 / MEG2 I
Maximum antenna gain Must not exceed antenna gains See Important Compliance Information for the
due to RF exposure and ERP/ United States and Canada on page 62.
EIRP limits, as listed in the
module’s FCC grant.
Isolation between Ant1 and > 10 dB • If antennas can be moved, test all
Ant2 (S21) positions for both antennas.
• Make sure all other wireless devices
(Bluetooth or WLAN antennas, etc.) are
turned OFF to avoid interference.
Power handling • >1W • Measure power endurance over 4 hours

(estimated talk time) using a 1 W CW
signal—set the CW test signal frequency
to the middle of each supporting Tx band.
• Visually inspect device to ensure there is
no damage to the antenna structure and
matching components.
• VSWR/TIS/TRP measurements taken
before and after this test must show
similar results.
a. These worst-case VSWR figures for the transmitter bands may not guarantee RSE levels to be within regulatory limits. The
device alone meets all regulatory emissions limits when tested into a cabled (conducted) 50 ohm system. With antenna
designs with up to 2.5:1 VSWR or worse, the radiated emissions could exceed limits. The antenna system may need to be
tuned in order to meet the RSE limits as the complex match between the module and antenna can cause unwanted levels of
emissions. Tuning may include antenna pattern changes, phase/delay adjustment, passive component matching. Examples of
the application test limits would be included in FCC Part 22, Part 24 and Part 27,test case 4.2.2 for WCDMA
(ETSI EN 301 908-1), where applicable.
b. Ant1—Primary, Ant2—Secondary (Diversity/MIMO/GNSS)
c. Ant1—Primary, Ant2—Secondary (Diversity/GNSS)
Rev. 7 Oct.19 66 41112028

Antenna Specification
Recommended GNSS Antenna Specifications

Table A-2: GNSS Antenna Requirements
Frequency range • Wide-band GNSS:

1559–1606 MHz recommended
• Narrow-band GPS:
1575.42 MHz ±2 MHz minimum
• Narrow-band Galileo:
• Narrow-band BeiDou:
• Narrow-band GLONASS:
1601.72 MHz ±4.2 MHz minimum
• Narrow-band QZSS
Field of view (FOV) • Omni-directional in azimuth

• -45° to +90° in elevation
Polarization > 0 dB Vertical linear polarization is

(average Gv/Gh) sufficient.
Free space average gain > -6 dBi (preferably > -3 dBi) Gv and Gh are measured
(Gv+Gh) over FOV and averaged over -45° to
+90° in elevation, and ±180°
in azimuth.
Gain • Maximum gain and uniform

coverage in the high elevation
angle and zenith.
• Gain in azimuth plane is not
desired.
Average 3D gain > -5 dBi
Isolation between GNSS > 10 dB in all uplink bands

and Ant1
Typical VSWR < 2.5:1
Polarization Any other than LHCP (left-hand

circular polarized) is acceptable.
Antenna Tests
The following guidelines apply to the requirements described in Table A-1 on page 65 and
Table A-2 on page 67:
• Perform electrical measurements at room temperature (+20°C to +26°C) unless
otherwise specified
• For main and diversity path antennas, make sure the antennas (including contact
device, coaxial cable, connectors, and matching circuit with no more than six compo-
nents, if required) have nominal impedances of 50  across supported frequency
bands.
Rev. 7 Oct.19 67 41112028

• All tests (except isolation/correlation coefficient)—Test the main or diversity antenna

with the other antenna terminated.
• Any metallic part of the antenna system that is exposed to the outside environment
needs to meet the electrostatic discharge tests per IEC61000-4-2 (conducted
discharge +8kV).
• The functional requirements of the antenna system are tested and verified while the
embedded module’s antenna is integrated in the host device.
Note: Additional testing, including active performance tests, mechanical, and accelerated life tests
can be discussed with Sierra Wireless’ engineering services. Contact your Sierra Wireless repre-
sentative for assistance.
Rev. 7 Oct.19 68 41112028

B
B: Design Checklist
This chapter provides a summary of the design considerations mentioned throughout this
guide. This includes items relating to the power interface, RF integration, thermal
considerations, cabling issues, and so on.
Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ
good design practices and engineering principles in your integration.
Table B-1: Hardware Integration Design Considerations

Suggestion Section where discussed
Component placement
If an ESD suppressor is not used on the host device, allow space on the SIM connector SIM Implementation on
for series resistors in layout. (Up to 100  may be used depending on ESD testing page 31
requirements).
Minimize RF cable losses as these affect performance values listed in product RF Connections on page 37
specification documents.
Antennas
Match the module/antenna coax connections to 50 —mismatched antenna RF Connections on page 37

impedance and cable loss negatively affect RF performance.
If installing UMTS and CDMA modules in the same device, consider using separate Antenna and Cabling on
antennas for maximum performance. page 38
Power
Make sure the power supply can handle the maximum current specified for the module Power Consumption on
type. page 48
Limit the total impedance of VCC and GND connections to the SIM at the connector to SIM Implementation on
less than 1  (including any trace impedance and lumped element components— page 31
inductors, filters, etc.). All other lines must have a trace impedance less than 2 .
Decouple the VCC line close to the SIM socket. The longer the trace length SIM Implementation on
(impedance) from socket to module, the greater the capacitance requirement to meet page 31
compliance tests.
PCB signal routing
USB 2.0/3.0—Route these signals over 90  differential lines on the PCB.
EMI / ESD
Investigate sources of localized interference early in the design cycle. Methods to Mitigate Decreased
Rx Performance on page 40
Provide ESD protection for the SIM connector at the exposed contact point (in SIM Implementation on
particular, the CLK, VCC, IO, and RESET# lines). page 31
Keep very low capacitance traces on the UIM_DATA and UIM_CLK signals. SIM Implementation on
page 31
Rev. 7 Oct.19 69 41112028

Table B-1: Hardware Integration Design Considerations (Continued)

Suggestion Section where discussed
To minimize noise leakage, establish a very good ground connection between the Ground Connection on page 39
module and host.
Route cables away from noise sources (for example, power supplies, LCD assemblies, Methods to Mitigate Decreased
etc.). Rx Performance on page 40
Shield high RF-emitting components of the host device (for example, main processor, Methods to Mitigate Decreased
parallel bus, etc.). Rx Performance on page 40
Use discrete filtering on low frequency lines to filter out unwanted high-order harmonic Methods to Mitigate Decreased
energy. Rx Performance on page 40
Use multi-layer PCBs to form shielding layers around high-speed clock traces. Methods to Mitigate Decreased
Rx Performance on page 40
Thermal
Test to worst case operating conditions—temperature, voltage, and operation mode Thermal Considerations on
(transmitter on 100% duty cycle, maximum power). page 60
Use appropriate techniques to reduce module temperatures (for example, airflow, heat Thermal Considerations on
sinks, heat-relief tape, module placement, etc.). page 60
Host / Modem communication
Make sure the host USB driver supports remote wakeup, resume, and suspend [4] AirCard/AirPrime USB
operations, and serial port emulation. Driver Developer’s Guide
(Doc# 2130634)
When no valid data is being sent, do not send SOF tokens from the host (causes [4] AirCard/AirPrime USB
unnecessary power consumption). Driver Developer’s Guide
(Doc# 2130634)
Rev. 7 Oct.19 70 41112028

C
C: Testing
Note: All AirPrime embedded modules are factory-tested to ensure they conform to published
product specifications.
Developers of OEM devices integrating Sierra Wireless AirPrime embedded modules

should include a series of test phases in their manufacturing process to make sure that
their devices work properly with the embedded modules.
Suggested phases include:
• Acceptance Testing—Testing of modules when they are received from Sierra
Wireless
• Certification Testing—Testing of completed devices to obtain required certifications
before beginning mass production
• Production Testing—Testing of completed devices with the modules embedded
• Quality Assurance Testing—Post-production
AT Command Entry Timing Requirement

Some AT commands require time to process before additional commands are entered.
For example, the modem will return “OK” when it receives AT!DAFTMACT. However, if
AT!DARCONFIG is received too soon after this, the modem will return an error.
When building automated test scripts, ensure that sufficient delays are embedded where
necessary to avoid these errors.
Acceptance Testing
Note: Acceptance testing is typically performed for each shipment received.
When you receive a shipment from Sierra Wireless, you should make sure it is suitable
before beginning production.
From a random sampling of units, test that:
• Units are operational
• Units are loaded with the correct firmware version
Acceptance Test Requirements

To perform the suggested tests, you require a test system in which to temporarily install
the module, and you must be able to observe the test device’s LED indicator.
Rev. 7 Oct.19 71 41112028

Acceptance Test Procedure

The following is a suggested acceptance testing procedure using Sierra Wireless’
Skylight™ software:
Note: You can perform these tests using appropriate AT commands.
Test 1: Check Power-up and Initialization

1. After installing the module, start the test system.
2. Launch Skylight.
3. Check the LED—If the LED is off, there is a problem with the module or with the
connection to the LED.
Test 2: Check Version Numbers

1. From Skylight, select Help > About.
2. Verify that the firmware version in the About window is correct.
3. Close the About window.
If the module fails either of these tests, or is not recognized by Skylight:

1. Replace the module with one that is known to work correctly and repeat the tests.
2. If the tests are successful, reinstall the original module and repeat the tests.
If the module still does not work correctly, contact your account manager.
Certification Testing
Note: Typically, certification testing of your device with the integrated module is required one time
only.
The AirPrime embedded module has been certified as described in Regulatory

Compliance and Industry Certifications on page 62.
When you produce a host device with a Sierra Wireless AirPrime embedded module, you
must obtain certifications for the final product from appropriate regulatory bodies in the
jurisdictions where it will be distributed.
The following are some of the regulatory bodies from which you may require
certification—it is your responsibility to make sure that you obtain all necessary
certifications for your product from these or other groups:
• FCC (Federal Communications Commission—www.fcc.gov)
• Industry Canada (www.ic.gc.ca)
• GCF (Global Certification Forum—www.globalcertificationforum.org) outside of North
America
• PTCRB (PCS Type Certification Review Board—www.ptcrb.com) in North America
Rev. 7 Oct.19 72 41112028

Testing
Production Testing
Note: Production testing typically continues for the life of the product.
Production testing ensures that, for each assembled device, the module is installed
correctly (I/O signals are passed between the host and module), and the antenna is
connected and performing to specifications (RF tests).
Typical items to test include:
• Host connectivity
• Baseband (host/module connectors)
• RF assembly (Tx and/or Rx, as appropriate)
• Network availability
• Host/device configuration issues
Note: The number and types of tests to perform are your decision—the tests listed in this section
are guidelines only. Make sure that the tests you perform exercise functionality to the degree that
your situation requires.
Use an appropriate test station for your testing environment (see Acceptance Test
Requirements on page 71 for suggestions) and use AT commands to control the
integrated module.
Note: Your test location must be protected from ESD to avoid interference with the module and
antenna(s), assuming that your test computer is in a disassembled state.
Also, consider using an RF shielding box—local government regulations may prohibit unauthorized
transmissions.
Functional Production Test

This section presents a suggested procedure for performing a basic manual functional
test on a laboratory bench using an EM7511 Embedded Module and a hardware
development kit. When you have become familiar with the testing method, use it to
develop your own automated production testing procedures.
Suggested Production Tests

Consider the following tests when you design your production test procedures for devices
with the AirPrime module installed.
• Visual check of the module’s connectors and RF assemblies
• Module is operational
• USB connection is functional
• LED is functional
• Power on/off
• Firmware revision check
• Rx tests on main and auxiliary paths
• Tx test
Rev. 7 Oct.19 73 41112028

Production Test Procedure

The following is a suggested test plan—you must decide which tests are appropriate for
your product. You may wish to add additional tests that more fully exercise the capabilities
of your product.
Using an appropriate Dev Kit-based test station, and referring to the appropriate AT
command references:
1. Visually inspect the module’s connectors and RF assemblies for obvious defects
before installing it in the test station.
2. Ensure that the module is turned off before beginning your tests—Drive Full_-
Card_Power_Off# low or leave floating.
3. Test Full_Card_Power_Off#—Turn on the module by driving Full_Card_Power_Off#
high.
4. Test USB functionality—Check for USB enumeration.
· (Windows systems) The Device Manager shows the device under Network
adapters. For example:
5. Make sure your modem is connected and running, and then establish contact with the
module:
· Windows systems: Use a terminal emulation/communications program such as
Microsoft HyperTerminal® to connect to the Sierra Wireless modem (see listings in
Step 4):
a. Start HyperTerminal.
b. Select File > Connection Description. The Connection Description dialog box
appears.
i. Type Sierra in the Name box and click OK. The Connect To dialog box
appears.
ii. Click OK without changing any of the displayed information. The Connect
dialog box appears.
iii. Click Cancel.
Note: If necessary, use AT E1 to enable echo.
iv. Type ATZ in the HyperTerminal window. If the connection is established, the
message OK appears.
6. Display the firmware version:
· AT+GMR
7. Test the LED—Set the LED in blinking mode using this command, then visually verify
that the LED turns off and on:
· AT!LDTEST=0,0 (LED on)
· AT!LDTEST=0,1 (LED off)
Rev. 7 Oct.19 74 41112028

Testing
8. Unlock the extended AT command set. (Note: Use AT!ENTERCND? to check

command syntax, which is SKU-dependent.):
· AT!ENTERCND=”<password>”
9. Put the module in diagnostic/factory test mode:
· AT!DAFTMACT
10. Communicate with the SIM using +CPIN or +CIMI.
When performing RF tests, use a test platform as described in Suggested Testing
Equipment on page 84.
11. Test RF transmission, if desired:
· (UMTS) See UMTS (WCDMA) RF Transmission Path Test on page 75.
· (LTE) See LTE RF Transmission Path Test on page 77.
12. Test RF reception, if desired:
· (UMTS) See UMTS (WCDMA) RF Receive Path Test on page 79.
· (LTE) See LTE RF Receive Path Test on page 81.
13. Test standalone GNSS functionality—See GNSS RF Receive Path Test on page 83.
14. Drive Full_Card_Power_Off# low (or leave floating) and confirm that the module
powers down:
· Windows systems—The Sierra Wireless items under the Ports (COM & LPT) entry
in Device Manager disappear as the module powers off.
UMTS (WCDMA) RF Transmission Path Test
Note: This procedure segment is performed in Step 11 of the Production Test Procedure on
page 74.
The suggested test procedure that follows uses the parameters in Table 3-1.
Table 3-1: Test Settings — UMTS Transmission Path
Band Frequency (MHz) Band ID Channel a
2100 MHz Band 1 1950.0 9 9750
1900 MHz Band 2 1880.0 15b 9400
1700 MHz Band 4 1732.6 28 1413
850 MHz Band 5 836.6 22 4183
800 MHz Band 6 835.0 22 4175
900 MHz Band 8 897.6 29 2788
1700 MHz Band 9 1767.4 31 8837
800 MHz Band 19 837.6 75 338
a. Channel value used by the !DARCONFIG command (!DARCONFIG uses uplink (Tx) channel at
the center of the corresponding band (rounded down), for both Tx and Rx testing).
b. Either 15 (WCDMA1900A) or 16 (WCDMA1900B) may be used for testing.
Rev. 7 Oct.19 75 41112028

To test the DUT’s transmitter path:

1. Set up the power meter:
Note: This procedure describes steps using the "Power Meter: Gigatronics 8651A” (with
Option 12 and Power Sensor 80701A).
a. Make sure the meter has been given sufficient time to warm up, if necessary, to
enable it to take accurate measurements.
b. Zero-calibrate the meter.
c. Enable MAP mode.
2. Prepare the DUT using the following AT commands:
a. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
b. AT!DAFTMACT (Enter test mode.)
c. AT!DARCONFIG=0,1,<bandValue>,<channel>
(e.g. AT!DARCONFIG=0,1,2,9400)
(Set frequency band and channel.
See Table 3-1 for values.)
d. AT!DAWTXCONTROL=1,<power_dBm>
(e.g. AT!DAWTXCONTROL=1,10)
(Enable Tx power output.
<power_dBm> = -57.0 to 23.0)
e. Take the measurement.
f. Repeat steps c–e with different Tx power levels if needed.
g. AT!DAWTXCONTROL=0 (Disable Tx power output.)
h. AT!DARCONFIGDROP=1 (Drop the current UMTS configuration.)
3. Test limits—Run ten or more good DUTs through this test procedure to obtain a
nominal output power value.
· Apply a tolerance of 5 to 6 dB to each measurement (assuming a good setup
design).
· Monitor these limits during mass-production ramp-up to determine if further adjust-
ments are needed.
Note: The module has a nominal output power of +23 dBm 1 dB in WCDMA mode. However, the
value measured by the power meter is significantly influenced (beyond the stated 1 dB output
power tolerance) by the test setup (host RF cabling loss, antenna efficiency and pattern, test
antenna efficiency and pattern, and choice of shield box).
Rev. 7 Oct.19 76 41112028

Testing
Note: When doing the same test over the air in an RF chamber, values are likely to be significantly
lower.
LTE RF Transmission Path Test
page 74.
The suggested test procedure that follows uses the parameters in Table 3-2..
Table 3-2: Test Settings — LTE Transmission Path
Band # Frequency (MHz) Band ID Channel a
2100 MHz B1 1950.0 34 18300
1900 MHz B2 1880.0 43 18900
1800 MHz B3 1747.5 44 19575
1700 MHz B4 1732.5 42 20175
850 MHz B5 836.5 45 20525
2600 MHz B7 2535.0 35 21100
900 MHz B8 897.5 47 21625
1800 MHz B9 1767.4 48 21975
700 MHz B12 707.5 50 23095
700 MHz B13 782.0 36 23230
700 MHz B14 793.0 51 23330
850 MHz B18 822.5 54 23925
850 MHz B19 837.5 55 24075
800 MHz B20 847.0 56 24300
850 MHz B26 831.5 62 26865
2500 MHz B41 2593.0 76 40620
3500 MHz B42 3500.0 77 42590
3700 MHz B43 3700.0 88 44590
3600 MHz B48 3625.0 96 55990
1700 MHz B66 1745.0 83 132322
a. Channel value used by the !DARCONFIG command (!DARCONFIG uses uplink (Tx) channel at
Rev. 7 Oct.19 77 41112028

To test the DUT’s transmitter path:

1. Set up the power meter:
Note: This procedure describes steps using the "Power Meter: Gigatronics 8651A” (with
Option 12 and Power Sensor 80701A).
a. Make sure the meter has been given sufficient time to warm up, if necessary, to
enable it to take accurate measurements.
b. Zero-calibrate the meter.
c. Enable MAP mode.
2. Prepare the DUT using the following AT commands:
b. AT!DAFTMACT (Enter test mode.)
c. AT!DARCONFIG=0,3,<bandValue>,<channel>,<lte_bw>
(e.g. AT!DARCONFIG=0,3,1,18300,3)
(Set frequency band and channel. See Table 3-1
for values. <lte_bw>: 0 (1.4 MHz), 1 (3 MHz),
2 (5 MHz), 3 (10 MHz), 4 (15 MHz), 5(20 MHz))
d. AT!DALTXCONTROL=0,1,<tx_pwr>,<waveform>,<mod>,<ns_val>,<num_RB>,<start_RB>
(e.g. AT!DALTXCONTROL=0,1,10,1,0,1,12,19)
(Set LTE Tx power level, waveform, modulation
and NS value. Programs PA range, LUT index,
and digital gain to reach Tx power level with
power limiting enabled.)
e. Take the measurement.
f. Repeat steps c–e with different Tx power levels if desired.
g. AT!DALTXCONTROL=0,0 (Disable Tx power control.)
h. AT!DARCONFIGDROP=3 (Drop the current LTE configuration.)
nominal output power value.
design).
ments are needed.
Rev. 7 Oct.19 78 41112028

Testing
Note: The module has a nominal output power of +23 dBm 1 dB in LTE mode. However, the value
measured by the power meter is significantly influenced (beyond the stated 1 dB output power
tolerance) by the test setup (host RF cabling loss, antenna efficiency and pattern, test antenna
efficiency and pattern, and choice of shield box).
Note: When doing the same test over the air in an RF chamber, values are likely to be significantly
lower.
UMTS (WCDMA) RF Receive Path Test
Note: This procedure segment is performed in Step 12 of Production Test Procedure on page 74.
Table 3-3: Test Settings — UMTS Receive Path
Band # Frequency a (MHz) Band ID Channel b
2100 MHz Band 1 2141.2 9 9750
1900 MHz Band 2 1961.2 15c 9400
1700 MHz Band 4 2133.7 28 1413
850 MHz Band 5 882.7 22 4183
800 MHz Band 6 881.2 22 4175
900 MHz Band 8 943.7 29 2788
1700 MHz Band 9 1863.6 31 8837
800 MHz Band 19 883.7 75 338
a. Receive frequencies shown are 1.2 MHz offset from center

b. Channel value used by the !DARCONFIG command (!DARCONFIG uses uplink (Tx) channel at
c. Either 15 (WCDMA1900A) or 16 (WCDMA1900B) may be used for testing.
Rev. 7 Oct.19 79 41112028

To test the DUT’s receive path:

1. Set up the signal generator:
Note: This procedure describes steps using the Agilent 8648C signal generator—the
Rohde & Schwarz SML03 is shown for reference only.
a. Set the amplitude to:

· -80 dBm
b. Set the frequency for the band being tested. See Table 3-3 on page 79 for
frequency values.
2. Set up the DUT:

b. AT!DAFTMACT (Put modem into factory test mode.)
c. AT!DARCONFIG=0,1,<bandValue>,<channel>
(e.g. AT!DARCONFIG=0,1,2,9400)
(Set frequency band and channel.
See Table 3-3 for values.)
d. AT!DAGFTMRXAGC=0,1,0,0
(Set LNA to maximum gain on primary Rx, and
get the RSSI.)
e. AT!DAGFTMRXAGC=0,1,0,1 (Set LNA to maximum gain on Diversity Rx, and
get the RSSI.)
f. AT!DARCONFIGDROP=1 (Drop the current UMTS configuration.)
nominal received power value.
design).
Rev. 7 Oct.19 80 41112028

Testing
· Make sure the measurement is made at a high enough level that it is not influenced
by DUT-generated and ambient noise.
· The Signal Generator power level can be adjusted and new limits found if the
radiated test needs greater signal strength.
ments are needed.
Note: The value measured from the DUT is significantly influenced by the test setup and DUT
design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern,
and choice of shield box).
LTE RF Receive Path Test
page 74.
Table 3-4: Test Settings — LTE Receive Path
2100 MHz B1 2142.0 34 18300
1900 MHz B2 1962.0 43 18900
1800 MHz B3 1844.5 44 19575
1700 MHz B4 2134.5 42 20175
850 MHz B5 883.5 45 20525
2600 MHz B7 2657.0 35 21100
900 MHz B8 944.5 47 21625
1800 MHz B9 1864.4 48 21975
700 MHz B12 739.5 50 23095
700 MHz B13 753.0 36 23230
850 MHz B14 765 51 23330
850 MHz B18 869.5 54 23925
850 MHz B19 884.5 55 24075
800 MHz B20 808.0 56 24300
850 MHz B26 878.5 62 26865
700 MHz B29 See footnotec.
2300 MHz B30 2357.0 66 27710
Rev. 7 Oct.19 81 41112028

Table 3-4: Test Settings — LTE Receive Path (Continued)
2500 MHz B41 2595.0 76 40620
3500 MHz B42 3502.0 77 42590
3700 MHz B43 3702.0 88 44590
3600 MHz B48 3627.0 96 55990
1700 MHz B66 2157.0 83 132322
a. Receive frequencies shown are 2 MHz offset from center

b. Channel value used by the !DARCONFIG command (!DARCONFIG uses uplink (Tx) channel at
c. Test procedure does not apply to this band. Downlink-only band requires CA mode testing in
signaling mode (outside scope of this document; testing methodology to be determined by
user).
To test the DUT’s receive path (or diversity path, while connected to the diversity
antenna):
1. Set up the signal generator:
Note: This procedure describes steps using the Agilent 8648C signal generator—the
Rohde & Schwarz SML03 is shown for reference only.
a. Set the amplitude to -70 dBm

b. Set the frequency for the band being tested. See Table 3-4 for frequency values.
2. Set up the DUT:
Rev. 7 Oct.19 82 41112028

Testing

c. AT!DARCONFIG=0,3,<bandValue>,<channel>,<lte_bw>
(e.g. AT!DARCONFIG=0,3,1,18300,3)
(Set frequency band and channel. See Table 3-4
for values. <lte_bw>: 0 (1.4 MHz), 1 (3 MHz),
2 (5 MHz), 3 (10 MHz), 4 (15 MHz), 5(20 MHz))
d. AT!DAGFTMRXAGC=0,3,0,0 (Set LNA to maximum gain on primary Rx, and
get the RSSI.)
e. AT!DAGFTMRXAGC=0,3,0,1 (Set the LNA to maximum gain on Diversity Rx,
and get the RSSI.)
f. AT!DARCONFIGDROP=0,3 (Drop the current LTE configuration.)
nominal received power value.
design).
· Make sure the measurement is made at a high enough level that it is not influenced
by DUT-generated and ambient noise.
· The Signal Generator power level can be adjusted and new limits found if the
radiated test needs greater signal strength.
ments are needed.
Note: The value measured from the DUT is significantly influenced by the test setup and DUT
design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency and pattern,
and choice of shield box).
GNSS RF Receive Path Test

The GNSS receive path uses either the dedicated GNSS connector or the shared
Diversity/MIMO/GNSS connector.
To test the GNSS receive path:
1. Inject a carrier signal at -110dBm, frequency 1575.52 MHz into the GNSS Rx path at
the connector. (Note that this frequency is 100 kHz higher than the actual GPS L1
center frequency.)
2. Test the signal carrier-to-noise level at the GNSS receiver:
c. AT!DACGPSTESTMODE=1 (Start CGPS diagnostic task.)
d. AT!DACGPSSTANDALONE=1 (Enter standalone RF mode.)
e. AT!DACGPSMASKON (Enable log mask.)
f. AT!DACGPSCTON (Return signal-to-noise and frequency measurements.)
g. Repeat AT!DACGPSCTON five to ten times to ensure the measurements are
repeatable and stable.
3. Leave the RF connection to the embedded module intact, and turn off the signal
generator.
Rev. 7 Oct.19 83 41112028

4. Take several more !DACGPSCTON readings. This will demonstrate a 'bad' signal in
order to set limits for testing, if needed. This frequency offset should fall outside of the
guidelines in the note below, which indicates that the CtoN result is invalid.
5. (Optional) Turn the signal generator on again, and reduce the level to -120dBm. Take
more !DACGPSCTON readings and use these as a reference for what a marginal/poor
signal would be.
Note: The response to AT!DACGPSCTON for a good connection should show CtoN within 58 +/-
5dB and Freq (frequency offset) within 100000 Hz +/- 5000 Hz .
Quality Assurance Testing

Note: QA is an ongoing process based on random samples from a finished batch of devices.
The quality assurance tests that you perform on your finished products should be
designed to verify the performance and quality of your devices.
The following are some testing suggestions that can confirm that the antenna is interfaced
properly, and that the RF module is calibrated and performs to specifications:
• Module registration on cellular networks
• Power consumption
• Originate and terminate data and voice (if applicable) calls
• Cell hand-off
• Transmitter and receiver tests
• FER (Frame Error Rate) as an indicator of receiver sensitivity/performance
• Channel and average power measurements to verify that the device is transmitting
within product specifications
• RF sensitivity tests
• RF sensitivity testing—BER/BLER for different bands and modes
• Transmitter and receiver tests (based on relevant sections of the 3GPP TS51010 and
3GPP 34121 documents)
Suggested Testing Equipment

To perform production and post-production tests, you will require appropriate testing
equipment. A test computer can be used to coordinate testing between the integrated
module (on the development kit or host) and the measurement equipment, usually with
GPIB connections. The suggested setup includes a power meter to test RF output power
and a signal generator to evaluate the receiver.
Testing Assistance Provided by Sierra

Wireless
Extended AT commands have been implemented to assist with performing FTA GCF tests
and portions of CE Mark tests requiring radio module access. These are documented in
the [2] AirPrime EM75xx AT Command Reference (Doc# 41111748).
Sierra Wireless offers optional professional services based assistance to OEMs with
regulatory approvals.
Rev. 7 Oct.19 84 41112028

Testing
IOT/Operator Testing
Interoperability and Operator/Carrier testing of the finished system is the responsibility of
the OEM. The test process will be determined with the chosen network operator(s) and
will be dependent upon your business relationship with them, as well as the product's
application and sales channel strategy.
Sierra Wireless offers assistance to OEMs with the testing process, if required.
Extended AT Commands for Testing

Sierra Wireless provides the [2] AirPrime EM75xx AT Command Reference
(Doc# 41111748), which describes proprietary AT commands that may help in hardware
integration design and testing (these commands are NOT intended for use by end users).
Some commands from this document that may be useful for hardware integration are
listed in Table 3-5 on page 85.
Table 3-5: Extended AT Commands

Command Description
Password commands
!ENTERCND Enable access to password-protected commands
!SETCND Set AT command password
Modem reset and status commands
!GSTATUS Return the operation status of the modem (mode, band,

channel, and so on)
!RESET Reset the modem
Diagnostic commands
!BAND Select a set of frequency bands or reports current selection
Test commands
!DAFTMACT Put the modem into FTM (Factory Test Mode)
!DAFTMDEACT Put the modem into online mode
!DAGFTMRXAGC Get FTM Rx AGC (Primary or Diversity)
!DALGRXAGC Return Rx AGC value (LTE)
!DALGTXAGC Return Tx AGC value and transmitter parameters (LTE)
!DALTXCONTROL Configure LTE Tx Parameters
!DAOFFLINE Place modem offline
!DARCONFIG Set Band and Channel
!DARCONFIGDROP Drop Radio Configurations
!DASLNAGAIN Set the LNA (Low Noise Amplifier) gain state
Rev. 7 Oct.19 85 41112028

Table 3-5: Extended AT Commands

Command Description
!DAWGAVGAGC Return averaged RX AGC value (WCDMA)
!DAWINFO Return WCDMA mode RF information
!DAWTXCONTROL Configure WCDMA Tx Power
Rev. 7 Oct.19 86 41112028

D
D: Thermal Testing
Worst Case Testing—Absolute vs Realistic
Sierra Wireless recommends that customers identify realistic worst-case conditions for
their applications and perform appropriate thermal testing.
For example:
• If the device has very good throughput, it is likely near a tower so will not have to
transmit at maximum Tx output power.
• If the device is transmitting at maximum Tx power, it is likely not near a tower and will
not reach maximum throughput rates.
• Networks usually are sharing capacity among many users, so no single user is likely
to reach maximum throughput rates for any significant length of time.
• If the device is transmitting at maximum throughput, it will likely do so for a limited
time to limit the amount of data usage consumed from their data plan.
Suggested realistic worst-case test conditions

Sierra Wireless suggests using a worst-case test such as shown in Table D-1.
Table D-1: Suggested worst-case conditions

Condition Value
Data throughput rate 150 Mbps/40 Mbps
Tx output power 20 dBm
Carrier aggregation 3CA
Scheduling—50% duty cycle, 2 ms period

Test case
(i.e. On for 1 ms, Off for 1 ms)
Thermal Testing Process

To perform thermal testing of the module:
1. Mount the module in its designed location on the platform.
2. Provide the same amount of airflow as will be experienced in your application.
3. Set the platform’s ambient to the higher limit of its ambient temperature specification
and observe the board temperature ramp due to the ambient temperature. (Use
AT!PCTEMP? or SLQSNasSwiModemStatus.)
Note: It is highly recommended to have a thermocouple measuring the air temperature around
the module inside the platform, which will be close to the module’s board temperature.
Rev. 7 Oct.19 87 41112028

4. Set up a call with the use case for the platform (throughput rate, output power, duty
cycle) on the worst-case band.
Note: The worst case band for power consumption and thermals is a 3CA call with PCC LTE
Band 66 (20 MHz) and SCC any bands (20 MHz + 20 MHz). For example, Sierra Wireless tests
using B66+B2+B66.
5. Observe the ramp in board temperature due to the call, and confirm whether the
overall system performance still meets customer requirements.
6. Use AT!TMSTATUS? to check the module’s thermal mitigation status (see [2] AirPrime
EM75xx AT Command Reference (Doc# 41111748) for details).
7. Increase the platform’s ambient temperature to determine the margin that exists over
the desired temperature specifications as subsequent mitigation methods activate
(e.g. UL data rate throttled, DL throughput throttled (third and second CA dropped),
UL power reduced, Emergency Service).
Rev. 7 Oct.19 88 41112028

E
E: Packaging
Sierra Wireless AirPrime Embedded Modules are shipped in sealed boxes. The standard
packaging (see Figure 5-1), contains a single tray with a capacity of 100 modules. (Note
that some SKUs may have custom packaging—contact Sierra Wireless for SKU-specific
details.)
In the standard packaging, Embedded Modules are inserted, system connector first, into
the bottom portion (T1) of a two-part tray. all facing the same direction. This allows the top
edge of each Embedded Module to contact the top of the triangular features in the top
portion (T2) of the tray (see Detail A).
The top and bottom portions of the tray snap together at the four connection points.
Triangular recesses hold top
edges of modules
System connector
Tray connection points
Detail A
See Detail A
Figure 5-1: Device Placement in Module Tray
Rev. 7 Oct.19 89 41112028

The tray cover is secured to the tray base with ESD-safe tape (EP1) at the locations
indicated. The tray is placed in a manufacturing box(B1), sealed with a security tape (P1),
a manufacturing label (L3) is placed on the bottom-right corner, above the security tape,
and if required a label (L4) is applied beside the manufacturing label. (See Figure 5-2.)
If required
(SKU-specific)
Figure 5-2: Shipping Package
Rev. 7 Oct.19 90 41112028

F
F: References
This guide deals specifically with hardware integration issues that are unique to AirPrime
embedded modules.
Sierra Wireless Documents

The Sierra Wireless documents listed below are available from www.sierrawireless.com.
For additional documents describing embedded module design, usage, and integration
issues, contact your Sierra Wireless account representative.
Command Documents
[1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.007)
[2] AirPrime EM75xx AT Command Reference (Doc# 41111748)
Other Sierra Documents

[3] M.2 Dev Kit Welcome Letter (Doc# 2400323)
[4] AirCard/AirPrime USB Driver Developer’s Guide (Doc# 2130634)
Industry/Other Documents
The following non-Sierra Wireless references are not included in your documentation
package:
[5] FCC Regulations - Part 15 - Radio Frequency Devices
[6] IEC-61000-4-2 level 3 (Electrostatic Discharge Immunity Test)
[7] Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module
(Doc# 3GPP TS 11.10-4)
[8] PCI Express NGFF (M.2) Electromechanical Specification Revision 1.0
[9] Universal Serial Bus Specification, Rev 2.0
[10] Universal Serial Bus Specification, Rev 3.0
[11] JESD22-A114-B
[12] JESD22-C101
[13]MIPI Alliance Specification for RF Front-End Control Interface
Rev. 7 Oct.19 91 41112028

G
G: Acronyms
Table G-1: Acronyms and Definitions
Acronym or term Definition
3GPP 3rd Generation Partnership Project
8PSK Octagonal Phase Shift Keying
AGC Automatic Gain Control
A-GPS Assisted GPS
API Application Programming Interface
BeiDou BeiDou Navigation Satellite System

A Chinese system that uses a series of satellites in geostationary and middle earth
orbits to provide navigational data.
BER Bit Error Rate—A measure of receive sensitivity
BLER Block Error Rate
bluetooth Wireless protocol for data exchange over short distances
CQI Channel Quality Indication
COM Communication port
CS Circuit-switched
CSG Closed Subscriber Group
CW Continuous waveform
dB Decibel = 10 x log10 (P1/P2)

P1 is calculated power; P2 is reference power
Decibel = 20 x log10 (V1/V2)
V1 is calculated voltage, V2 is reference voltage
dBm A logarithmic (base 10) measure of relative power (dB for decibels); relative to
milliwatts (m). A dBm value will be 30 units (1000 times) larger (less negative) than a
dBW value, because of the difference in scale (milliwatts vs. watts).
DC-HSPA+ Dual Carrier HSPA+
DCS Digital Cellular System

A cellular communication infrastructure that uses the 1.8 GHz radio spectrum.
DL Downlink (network to mobile)
DRX Discontinuous Reception
DSM Distributed Shared Memory
DUT Device Under Test
eICIC Enhanced Inter-Cell Interference Coordination
EIRP Effective (or Equivalent) Isotropic Radiated Power
Rev 7 Oct.19 92 41112028

Acronyms
Table G-1: Acronyms and Definitions (Continued)

EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
ERP Effective Radiated Power
ESD Electrostatic Discharge
FCC Federal Communications Commission

The U.S. federal agency that is responsible for interstate and foreign communications.
The FCC regulates commercial and private radio spectrum management, sets rates for
communications services, determines standards for equipment, and controls broadcast
licensing. Consult www.fcc.gov.
FDD Frequency Division Duplexing
FDMA Frequency Division Multiple Access
feICIC Further Enhanced Inter-Cell Interference Coordination
FER Frame Error Rate—A measure of receive sensitivity.
firmware Software stored in ROM or EEPROM; essential programs that remain even when the
system is turned off. Firmware is easier to change than hardware but more permanent
than software stored on disk.
FOTA Firmware Over The Air—Technology used to download firmware upgrades directly
from the service provider, over the air.
FOV Field Of View
FSN Factory Serial Number—A unique serial number assigned to the mini card during
manufacturing.
Galileo A European system that uses a series of satellites in middle earth orbit to provide
navigational data.
GCF Global Certification Forum
GLONASS Global Navigation Satellite System—A Russian system that uses a series of 24
satellites in middle circular orbit to provide navigational data.
GMSK Gaussian Minimum Shift Keying modulation
GNSS Global Navigation Satellite Systems (GPS, GLONASS, BeiDou, and Galileo)
GPS Global Positioning System

An American system that uses a series of 24 satellites in middle circular orbit to provide
navigational data.
Host The device into which an embedded module is integrated
HSDPA High Speed Downlink Packet Access
HSPA+ Enhanced HSPA, as defined in 3GPP Release 7 and beyond
HSUPA High Speed Uplink Packet Access
Hz Hertz = 1 cycle/second
Rev 7 Oct.19 93 41112028


IC Industry Canada
IF Intermediate Frequency
IMEI International Mobile Equipment Identity
IMS IP Multimedia Subsystem—Architectural framework for delivering IP multimedia

services.
inrush current Peak current drawn when a device is connected or powered on
inter-RAT Radio Access Technology
IOT Interoperability Testing
IS Interim Standard.
After receiving industry consensus, the TIA forwards the standard to ANSI for approval.
ISIM IMS Subscriber Identity Module (Also referred to as a SIM card)
LED Light Emitting Diode.

A semiconductor diode that emits visible or infrared light.
LHCP Left-Hand Circular Polarized
LNA Low Noise Amplifier
LPM Low Power Mode
LPT Line Print Terminal
LTE Long Term Evolution—a high-performance air interface for cellular mobile
communication systems.
MCS Modulation and Coding Scheme
MHz Megahertz = 10e6 Hz
MIMO Multiple Input Multiple Output—wireless antenna technology that uses multiple
antennas at both transmitter and receiver side. This improves performance.
NAS/AS Network Access Server
NC No Connect
NIC Network Interface Card
NLIC Non-Linear Interference Cancellation
NMEA National Marine Electronics Association
OEM Original Equipment Manufacturer—a company that manufactures a product and sells it
to a reseller.
OFDMA Orthogonal Frequency Division Multiple Access
OMA DM Open Mobile Alliance Device Management—A device management protocol.
OTA ‘Over the air’ (or radiated through the antenna)
Rev 7 Oct.19 94 41112028

Acronyms

PA Power Amplifier
packet A short, fixed-length block of data, including a header, that is transmitted as a unit in a
communications network.
PCB Printed Circuit Board
PCC Primary Component Carrier
PCS Personal Communication System

A cellular communication infrastructure that uses the 1.9 GHz radio spectrum.
PDN Packet Data Network
PMI Pre-coding Matrix Index
PSS Primary synchronisation signal
PST Product Support Tools
PTCRB PCS Type Certification Review Board
QAM Quadrature Amplitude Modulation.

This form of modulation uses amplitude, frequency, and phase to transfer data on the
carrier wave.
QCI QoS Class Identifier
QMI Qualcomm MSM/Modem Interface
QOS Quality of Service
QPSK Quadrature Phase-Shift Keying
QPST Qualcomm Product Support Tools
QZSS Quasi-Zenith Satellite System—Japanese system for satellite-based augmentation of

GPS.
RAT Radio Access Technology
RF Radio Frequency
RI Ring Indicator
roaming A cellular subscriber is in an area where service is obtained from a cellular service
provider that is not the subscriber’s provider.
RSE Radiated Spurious Emissions
RSSI Received Signal Strength Indication
SCC Secondary Component Carrier
SDK Software Development Kit
SED Smart Error Detection
Sensitivity (Audio) Measure of lowest power signal that the receiver can measure.
Rev 7 Oct.19 95 41112028


Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed
BER/BLER/SNR value at the receiver output.
SG An LTE signaling interface for SMS (“SMS over SGs”)
SIB System Information Block
SIM Subscriber Identity Module. Also referred to as USIM or UICC.
SIMO Single Input Multiple Output—smart antenna technology that uses a single antenna at
the transmitter side and multiple antennas at the receiver side. This improves
performance and security.
SISO Single Input Single Output—antenna technology that uses a single antenna at both the
transmitter side and the receiver side.
SKU Stock Keeping Unit—identifies an inventory item: a unique code, consisting of numbers
or letters and numbers, assigned to a product by a retailer for purposes of identification
and inventory control.
SMS Short Message Service.

A feature that allows users of a wireless device on a wireless network to receive or
transmit short electronic alphanumeric messages (up to 160 characters, depending on
the service provider).
S/N Signal-to-noise (ratio)
SNR Signal-to-Noise Ratio
SOF Start of Frame—A USB function.
SSS Secondary synchronisation signal.
SUPL Secure User Plane Location
TDD Time Division Duplexing
TD-SCDMA Time Division Synchronous Code Division Multiple Access
TIA/EIA Telecommunications Industry Association / Electronics Industry Association.

A standards setting trade organization, whose members provide communications and
information technology products, systems, distribution services and professional
services in the United States and around the world. Consult www.tiaonline.org.
TIS Total Isotropic Sensitivity
TRP Total Radiated Power
UDK Universal Development Kit (for PCI Express Mini Cards)
UE User Equipment
UICC Universal Integrated Circuit Card (Also referred to as a SIM card.)
UL Uplink (mobile to network)
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
Rev 7 Oct.19 96 41112028

Acronyms

USIM Universal Subscriber Identity Module (UMTS)
VCC Supply voltage
VSWR Voltage Standing Wave Ratio
WAN Wide Area Network
WCDMA Wideband Code Division Multiple Access (also referred to as UMTS)
WLAN Wireless Local Area Network
ZIF Zero Intermediate Frequency
ZUC ZUC stream cypher
Rev 7 Oct.19 97 41112028

Index
Numerics capacitors
with SIM, 32
3D gain, average with XIM_DATA / XIM_CLK, 31
gain carrier/operator testing, 85
3D average (GNSS), 67 cell selection, 16
3GPP compliance certification tests, 72
LTE, 62 checklist, design, 69
UMTS, 62 communications, host to modem
design checklist, 70
conducted Tx power tolerances, 46
A connection
grounding, 39
acceptance tests, 71
connectors, required
accessories, 17 host-module, 17
accuracy (GNSS), 47
control interface, 32
acquisition time (GNSS), 47
CQI, 16
acronyms and definitions, 92– 97
A-GNSS, 17
A-GPS, 17 D
antenna
connection considerations, 37 DC power consumption
connectors, 19 averaged call mode, 49
control, 19, 36 averaged standby, 48
custom, design, 38 desense. See RF
diversity antenna, disabling, 38 design checklist
GNSS, specifications, recommended, 65, 67 antennas, 69
limit, matching coaxial connections, 37 component placement, 69
location, considerations, 38 EMI/ESD, 69
matching, considerations, 38 host/modem communications, 70
maximum cable loss, 37 power, 69
routing, 38 thermal, 70
specification, 65– 68 USB3, 69
specifications, recommended, 65 detach procedure, 16
testing, 67 dimensioned view, 58
antennas dimensions, 57, 58
design checklist, 69 diversity antenna
API, 56 disabling, 38
application interface features, 15 drop specifications, 57
approvals, regulatory and industry, 62 dynamic power control, 19
AT commands, 85
averaged call mode DC power consumption, 49
averaged standby DC power consumption, 48
E
EDGE
B connector, required, 18
electrical specifications, 19
bands supported, RF electrostatic discharge specifications, 57
summary, 12 electrostatic discharge. See ESD
LTE, 42, 43, 75, 77, 79, 81 envelope correlation coefficient, 66
bearers, dedicated, 16 environmental specifications, 57– 59
BER (Bit Error Rate), 41 ESD
bit error rate (BER) design checklist, 69
measure of sensitivity, 41 protection requirements, 59
block diagram ESD specifications, 57
expanded RF, 21, 22 expanded RF block diagram, 21, 22
system, 20
bottom view, 58
F
C field of view, 67
filtering, RF desense, 40
cable loss form factor, 57
antenna, maximum, 37 FOV, 67
free space average gain, 67
Rev 7 Oct.19 98 41112028

Index
frequencies supported, 41 LTE

frequency band support 3GPP compliance, 62
LTE, 42, 43, 75, 77, 79, 81 bandwidth support, 42
Full_Card_Power_Off#, 34 features, 16
frequency band support, 42, 43, 75, 77, 79, 81
G
M
gain
GNSS, 67 mean effective gain, 66
maximum, 62, 66 mean effective gain imbalance, 66
mean effective, 66 mechanical specifications, 57– 59
mean effective imbalance, 66 MIB, 16
GNSS modem features, 16
antenna specifications, recommended, 65, 67 module
GPS power states, 50– 52
features supported, 17
specifications, 47
GPS_DISABLE#, 19, 32, 33 N
ground specifications, 27
NAS/AS security, 16
grounding
noise
connection considerations, 39
leakage, minimizing, 39
RF interference, power supply, 54
H
host interface O
pin assignments, 22
OEM
humidity specifications, 57
assistance with testing, 85
labeling, 59
I operator/carrier testing, 85
ordering information, 18
I/O rise time requirements, 31
impedance
module–antenna, 38 P
SIM, 31
packaging, 89
industry approvals, 62
paging procedures, 16
integration requirements, 18
PCB
interface
multi-layer, shielding for RF desense, 40
control interface, 32
PDN connections, multiple, 16
feature summary, 15
pin assignments, host interface, 22
host, pin assignments, 22
PMI, 16
QMI, 56
polarization, 67
SIM, 29
position location, 17
software, 56
power
USB, 28
interference
handling, 66
device generated, 40
power-up timing, 53
host-generated, 40
ramp-up timing, 52
power supply noise, 54
state machines, 51
wireless devices, 39
states, module, 50– 52
Interoperability testing, 85
supply, RF interference, 54
intra-LTE mobility, 16
supply, ripple limit, 54
IOT testing, 85
power consumption, DC
iRAT, 16
averaged call mode, 49
isolation, 66, 67
averaged standby, 48
power off signal, 19
L power specifications, 27
power tolerances, conducted Tx, 46
labeling, 59 Product Support Tool, QUALCOMM (QPST), 56
LED production tests, 73
example, 36 PSS, 16
LED output, 19, 32, 35
Rev 7 Oct.19 99 41112028

Q shielding
module, compliance, 37
QMI interface, 56 reducing RF desense, 40
QPST (QUALCOMM Product Support Tool), 56 shock specifications, 57
QUALCOMM Product Support Tool (QPST), 56 SIB, 16
quality assurance tests, 84 signals, 32
QXDM support, 56 Full_Card_Power_Off#, 34
RESET#, 34
WWAN_LED#, 35
R SIM
capacitor recommendations, 32
radiated efficiency, total, 65
card contacts, 28, 31
radiated sensitivity measurement, 41
clock rate, 31
radiated spurious emissions, 40 connector, required, 18
radiation patterns, 66
electrical specifications, 31
references, 91
impedance, connectors, 31
regulatory approvals, 62 interface, 29
regulatory information, ??– 64
interface diagram, 30
FCC, 62
operation, 31– 32
reset SIM Detect, 19
timing, 53
Smart Error Detection
RESET#, 19, 34
detecting module reset, 55
resistors, external pull-up, 31 SMS features, 17
RF
Snow 3G/AES security, 16
antenna cable loss, maximum, 37
software interface, 56
antenna connection, considerations, 37
specifications
connectors, required, 17 electrical, 19
desense
environmental specifications, 57– 59
device-generated, 40
GPS, 47
harmonic energy, filtering, 40 mechanical, 57– 59
mitigation suggestions, 40
RF, 37–??
shielding suggestions, 40
SSS, 16
interference standalone mode, GPS/GLONASS, 17
other devices, 40
standby DC power consumption, averaged, 48
power supply, 54
state machines, 51
wireless devices, 39 support
RF bands supported
testing assistance by Sierra Wireless, 84
summary, 12
tools, 56
LTE, 42, 43, 75, 77, 79, 81 system acquisition, 16
RF block diagram, expanded, 21, 22
system block diagram, 20
RF specifications, 37–??
RI, 16
RSE, 40 T
Rx sensitivity
conducted, 45, 46 temperature specifications, 57
temperature, module. See thermal
testing
S overview, 71
acceptance tests, 71
sales assistance provided by Sierra Wireless, 84
ordering, 18
certification tests, 72
SAR backoff, 55
equipment, suggested, 84
SDKs available, 56 interoperability and operator/carrier testing, 85
SED
manual functional test, suggested, 73
see Smart Error Detection
production tests, 73
See also GPS_DISABLE#, 33 quality assurance tests, 84
See also W_DISABLE#, 33
RF receive path, LTE, 81
sensitivity
RF receive path, UMTS, 79
conducted, RF parameter, 45, 46 RF transmission path, LTE, 77
defined, 41
RF transmission path, UMTS, 75
radiated measurement, overview, 41
suggestions, 71–??
testing, overview, 41
Rev 7 Oct.19 100 41112028

Index
thermal
considerations, 60– 61
dissipation, factors affecting, 60
dissipation, suggestions, 61
testing, module, 61
timing
power ramp-up, 52
power-up, 53
reset, 53
USB enumeration, 53
top view, 58
tracking session
automatic, 17
standalone, 17
Tx power tolerances, conducted, 46
U
UMTS
3GPP compliance, 62
USB
drivers, user-developed, 29
high / full speed throughput performance, 29
interface, 28
USB enumeration timing, 53
USB3
V
vibration specifications, 57
VSWR, 65, 67
W
W_DISABLE#, 19, 32, 33
WAKE_ON_WAN#, 19
Wireless Disable, 32
Wireless Disable (GNSS), 33
Wireless Disable (Main RF), 33
WWAN_LED#, 32, 35
Z
ZIF (Zero Intermediate Frequency), 39
Rev 7 Oct.19 101 41112028

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AirPrime EM7511

Product Technical Specification

Rev 7 Oct.19 2 41112028

Copyright ©2019 Sierra Wireless. All rights reserved.

Corporate and product information Web: sierrawireless.com

Revision Release date Changes

1 March 2018 Preliminary release

2 April 2018 Removed WCDMA Band 3

3 August 2018 Updated PTCRB Carrier Aggregation Download Combinations

4 October 2018 Updated topic Disabling the Diversity Antenna

Rev 7 Oct.19 3 41112028

Revision Release date Changes

6 July 2019 Removed PCM/I2S/I2C details

11 October 2019 Updated Figure 2-1—Removed eSIM block.

Rev 7 Oct.19 4 41112028

Rev 7 Oct.19 5 41112028

Rev 7 Oct.19 6 41112028

Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

Regulatory Compliance and Industry Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Rev 7 Oct.19 7 41112028

Suggested Testing Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Rev 7 Oct.19 8 41112028

Rev 7 Oct.19 9 41112028

Table 7-1: Standards Compliance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

Rev 7 Oct.19 10 41112028

Rev 7 Oct.19 11 41112028

Table 1-1: Supported RF Bands

UMTSc Y Y Y Y Y Y Y Y N/A N/A

• GPS: 1575.42 MHz

a. (LTE) Downlink MIMO support (2x2; 4x2)

Important: B14 carrier aggregation is not supported.

Table 1-2: PTCRB Carrier Aggregation Downlink Combinations a

CA_1A-3A CA_1A-7A-7A CA_1A-3A-5A

Rev. 7 Oct.19 12 41112028

Table 1-2: PTCRB Carrier Aggregation Downlink Combinations a (Continued)

CA_2A-2A CA_2A-4A CA_2A-2A-5A CA_2A-4A-5A

CA_2C CA_2A-7A CA_2A-2A-12A CA_2A-4A-7A

CA_2A-12A CA_2A-2A-13A CA_2A-4A-12A

CA_2A-13A CA_2A-7A-7A CA_2A-4A-13A

CA_2A-29A CA_2A-66A-66A CA_2A-4A-29A

CA_2A-30A CA_2A-66B CA_2A-12A-30A

CA_2A-46A CA_2A-66C CA_2A-13A-66A

CA_3A-3A CA_3A-5A CA_3A-3A-7A CA_3A-7A-20A

CA_3C CA_3A-7A CA_3C-5A

CA_4A-4A CA_4A-5A CA_4A-4A-5A CA_4A-5A-30A

CA_4A-7A CA_4A-4A-12A CA_4A-7A-12A

CA_4A-12A CA_4A-4A-13A CA_4A-12A-30A

CA_4A-13A CA_4A-4A-30A CA_4A-29A-30A

CA_5A-30A CA_5A-66C CA_5A-30A-66A

Rev. 7 Oct.19 13 41112028

Table 1-2: PTCRB Carrier Aggregation Downlink Combinations a (Continued)

a. Supported CA DL combinations outside of North America are carrier-dependent.

Table 1-3: Additional Carrier Aggregation Downlink Combinations a

CA_1A-8A CA_1A-42C CA_1A-3A-28A

CA_3A-28A CA_3A-42C CA_3A-41A-42A

CA_41C CA_41A_42A CA_41A-42C

Rev. 7 Oct.19 14 41112028

Table 1-3: Additional Carrier Aggregation Downlink Combinations a

a. Supported CA DL combinations outside of North America are carrier-dependent.