Light Load High Efficiency,31V, Current Mode Step-Down 4A Switcing Regulator IC

NR111D Oct./17/2013

 DIP8 Package
General Descriptions
The NR111D is buck regulator ICs integrates High-side
power MOSFETs. The feature increasing efficiency at light
loads allows the device to be used in the energy-saving
applications. With the current mode control, ultra low ESR
capacitors such as ceramic capacitors can be used. The ICs
have protection functions such as Over-Current Protection
(OCP), Under-Voltage Lockout (UVLO) and Thermal
Shutdown (TSD). An adjustable Soft-Start by an external BS SS
capacitor prevents the excessive inrush current at turn-on. IN EN
The ICs integrate phase compensation circuit which reduces NR111D
the number of external components and simplifies the SW Iset
design of customer application. The ON/OFF pin (EN Pin)
GND FB
turns the regulator on or off and helps to achieve low power
consumption requirements. The NR111D is available in an
8-pin DIP package.
Features & Benefits Electrical Characteristics
 Current mode PWM control  4A output current
 Up to 94% Efficiency,
 Operating input range VIN = 6.5V～31V
Up to 68% Efficiency at IO = 20mA Light Load
 Stable with low ESR ceramic output capacitors  Output adjustable VO= 0.8V～24V
 Built-in protection function  Fixed 350kHz frequency
Over Current Protection (OCP)
Thermal Shutdown (TSD) Applications
Under Voltage Lockout (UVLO)  LCD TV / Blu-Ray / Set top box
 Built-in phase compensation
 Home appliance
 Adjustable Soft-Start with an external capacitor
 Green Electronic products
 Turn ON/OF the regulator function
 Other power supply

Package
Typical Application Circuit
VIN R3

VIN_s C10
2 1
R1 L1 Vo
IN BS 3
7
EN
SW Vo_s
C2 C1
NR111D
NR111E R5
C4 C5
8 5
SS FB
GND ISET R4 GND
4 6
C9
GND
R7 R6
D1

SW

C1, C2: 10μF / 35V R1: 1.7MΩ L1: 10μH

C4, C5: 22μF / 16V R3: 22Ω
C9: 0.1μF R4: 18kΩ, R5: 2.7kΩ (Vo=5.0V)
C10: 0.1μF R6: 3.9kΩ

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Light Load High Efficiency,31V, Current Mode Step-Down 4A Switcing Regulator IC

NR111D Oct./17/2013

Series Lineup
Product No. fSW VIN VO IO

(1) (2)
NR111D 350kHz 8V to 31V 0.8V to 24V 4A

(1)
The minimum input voltage shall be either of 6.5V or VO+3V, whichever is higher.
(2)
The I/O condition is limited by the Minimum on-time (TON(MIN)).

Absolute Maximum Ratings

項目 記号 規格値 単位 条件
DC input voltage VIN 35 V
BS Pin voltage VBS 44 V
BS-SW Pin voltage VBS-SW 8 V
SW Pin voltage VSW 35 V
FB Pin voltage VFB 5.5 V
EN Pin voltage VEN 35 V
SS Pin voltage VSS 5.5 V
Glass-epoxy board mounting
(3) in a 70×60mm.
Power dissipation PD 1.47 W
(copper area in a 1310mm2)
Max TJ =150°C
30 to 150
(4)
Junction temperature TJ °C
Storage temperature TS 40 to 150 °C

Thermal resistance
θJP 41 °C /W
(junction- Pin No. 7)

Glass-epoxy board mounting

Thermal resistance
θJA 85 °C /W in a 70×60mm.
(junction-ambient air)
(copper area in a 1310mm2)
(3)
Limited by thermal shutdown.
(4)
The temperature detection of thermal shutdown is about 160°C
Recommended Operating Conditions
Ratings
Parameter Symbol Units Conditions
MIN MAX
(5)
DC input voltage VIN Vo+3 31 V
(6)
DC output current (7) Io 0 4.0 A

Output voltage Vo 0.8 24 V

40
(7)
Ambient operating temperature Top 85 °C
(5)
The minimum value of input voltage is taken as the larger one of either 6.5V or Vo +3V.
(6)
Recommended circuit refer to Typical Application Circuit (P.7).
(7)
To be used within the allowable package power dissipation characteristics (P.9)

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Light Load High Efficiency,31V, Current Mode Step-Down 4A Switcing Regulator IC

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Electrical Characteristics
Ta = 25°C
Ratings
Parameter Symbol Units Test conditions
MIN TYP MAX
Reference voltage VREF 0.784 0.800 0.816 V VIN = 12V，IO = 1.0A
Output voltage temperature VIN = 12V, IO = 1.0A
⊿VREF/⊿T ― ±0.05 ― mV/°C
coefficient 40°C to +85°C
VIN=12V, VO=5.0V,
Switching frequency fSW 280 350 420 kHz
IO=1A
(8) VIN=8V～31V, VO =5.0V,
Line regulation VLine ― 50 ― mV
IO=1A
(8) VIN=12V, VO=5.0V,
Load regulation VLoad ― 50 ― mV
IO=0.1A～2.0A
VIN =12V, VO =5.0V
IS1 ― 1.5 ―
Overcurrent protection ISET=OPEN
A
threshold VIN =12V, VO =5.0V
IS2 ― 5.5 ―
ISET=SHORT
VIN = 12V
Supply Current IIN ― 1 ― mA
VEN=10kΩ pull up to VIN
VIN =12V, IO =0A,
Shutdown Supply Current IIN(off) 0 1 ― μA
VEN=0V
Source current
SS Pin at low level IEN/SS 6 10 14 μA VSS=0V, VIN =12V
voltage
Sink current IEN 20 50 μA VEN= 10V
EN Pin
Threshold voltage VC/EH 0.7 1.4 2.1 V VIN =12V
ISET Pin Open voltage VISET 1.5 V VIN =12V
(8)
Max on-duty DMAX ― 90 ― %
(8)
Minimum on-time TON(MIN) ― 150 ― nsec
Thermal shutdown threshold (8)
TSD 151 165 ― °C
temperature
Thermal shutdown
(8)
restart hysteresis TSD_hys ― 20 ― °C
of temperature
(8)
Guaranteed by design,not tested.
The input and output condition is limited by Minimum on-time.

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Light Load High Efficiency,31V, Current Mode Step-Down 4A Switcing Regulator IC

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Typical characteristics
(1)Efficiency

NR111D Vo=3.3V
100

90

80
Efficiency

VIN=6.5V
η [%]

70
8V
60 12V
50
24V

40

30
0.01 0.1 1 10
Output current IO [A]

NR111D Vo=5V
100

90

80
VIN=8V
Efficiency

70
η [%]

12V
60 24V
50

40

30
0.01 0.1 1 10
Output current IO [A]

NR111D Vo=12V
100

90

80
Efficiency

VIN=24V
η [%]

70

60

50
0.01 0.1 1 10
Output current IO [A]

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Light Load High Efficiency,31V, Current Mode Step-Down 4A Switcing Regulator IC

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NR114K
(2)Output UVLO
start-up Load=CR NR110K/111K
(5)Over OCP.
current protection
Vo=3.3V L=47uH Vo=5.0V L=10uH
7.0 6.00
6.5 VO=3.3V 5.50

Vo [V] VO [V]
6.0 VIN=12V
VO[V] VO [V]

5.00
5.5 15V
4.50
5.0 20V
4.5 4.00
24V
4.0 3.50

Output voltage
ISET=OPEN ISET=SHORT
Output voltage

3.5 3.00
3.0 2.50
2.5 2.00
2.0 1.50
1.5
1.00
1.0
0.5 0.50
0.0 0.00
0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
Input voltage
VIN[V] VIN [V] Output current
Io [A] IO [A]

(3)Load Regulation : VLoad (6) Supply current : IIN

NR114K/115K,NR116K,NR117K
At No-load IQ
V =5.0V O

5.1 5.0
5.08 4.5
Output voltage VO [V]

Input current Iin [mA]

5.06 Vin=8v 4.0

5.04 12v
3.5
24v
5.02 3.0
Iin [mA]

5 2.5
4.98 2.0
4.96
1.5
4.94
1.0
4.92
0.5
4.9
0.0
0 1 2 3 4
0.0 5.0 10.0 15.0 20.0 25.0 30.0
Output current IO [A] Input voltage
VIN[V] VIN [V]

(4)Shut down supply current : IIN(off) (7) Switching Frequency : fsw

NR110K,111K,114K,115K,116K,117K NR110K focs
VENIQ_off
=0V Vo=3.3V L=10uH
0.40 500
[mA] Iin [mA]

480
0.35
fosc [kHz] fOSC [kHz]

460
0.30 440
420
0.25 400
0.20 380
current

360
0.15 340
Frequency

0.10 320
Input Iin

300
0.05 280
0.00 260
240
-0.05 220
-0.10 200
0.0 5.0 10.0 15.0 20.0 25.0 30.0 0.0 1.0 2.0 3.0 4.0 5.0
Input voltage
VIN[V] VIN [V] OutputIo current
[A] IO [A]

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Functional Block Diagram

VIN

C1 C2
2 ５
IN

R1 D2
Current
Σ （ Option)
OSC Sense
Amp 1
OCP Drive ６
7 ON/ REG BS
３ P.REG R3
OFF OCP_REF
EN
VREF C10
0.8V L1 VO
PWM 3
４
6 LOGIC SW
７ ISET OCP_REF R5
D1 C4 C5
ISET

R4
Compensation
FB OVP FB 5
８
0.8V FB
Err Amp
UVLO
R6

TSD SS
１ １
GND 4 SS 8
C9

Pin Assignment & Functions

Pin Assign
Pin Assign & Functions
Pin
Symbol Description
No.
High-side Boost input. BS supplies the drive for High-side Nch-MOSFET switch.
1 BS
Connect a capacitor and a resistor between SW to BS.
2 IN Power input. IN supplies the power to the IC as well as the regulator switches
Power switching output.SW supplies power to the output.
3 SW Connect the LC filter from SW to the output.
Note that a capacitor is required from SW to BS to supply the power the High-side switch
4 GND Ground.Connect the exposed pad to Pin No.4
Feedback input Pin to compare Reference Voltage. The feedback threshold is 0.8V.
5 FB To set the output voltage, FB Pin is required to connect between resistive voltage divider R4
and R6.
Adjust Pin of OCP starting current.OCP starting current can be adjusted by connecting a resistor to
6 Iset
ISET Pin.In the case of using at Maximum Io, ISET Pin is required to connect to GND.
7 EN Enable input. Drive EN Pin high to turn on the regulator, low to turn it off.

8 SS Soft-Start control input. To set the soft-start period, connect to a capacitor between GND.

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Example Application Circuit

VIN R3

VIN_s C10
2 1
R1 L1 Vo
IN BS 3
7
EN NR111D
SW Vo_s
C2 C1
NR111E R5
C4 C5
8 5
SS FB
GND ISET R4 GND
4 6
C9
GND
R7 R6
D1

SW

C1, C2: 10μF / 35V R1: 1.7MΩ L1: 10μH

C4, C5: 22μF / 16V R3: 22Ω
C9: 0.1μF R4: 18kΩ, R5: 2.7kΩ (Vo=5.0V)
C10: 0.1μF R6: 3.9kΩ

A design guide of External Components

(1)Diode D1
・The schottky-barrier diode must be used for D1. If other diodes like fast recovery diodes are used, IC may be
destroyed because of the reverse voltage applied by the recovery voltage or ON voltage.

(2)Choke coil L1
・If the winding resistance of the choke coil is too high, the efficiency may go down to the extent that it is out of the
rating.
・As the start current of the over current protection is approximately 4A,
attention must be paid to the heating of the choke coil
by the magnetic saturation due to overload or short-circulated load.

(3)Capacitor C1( C2), C4(C5), C9

・As large ripple currents across C1 (C2) and C4 (C5), capacitors with high frequency and low impedance for SMPS
must be used. Especially when the impedance of C4 (C5) is high, the switching waveform may not be normal at low
temperature.
・C9 is a capacitor for soft start. In case soft start function is not used, please keep Pin No.2 open.

(4)Resistor R4, R5,R6

・R4, R5, R6 are resistor to the Output Voltage. IADJ is required to set to 0.2mA.
R4, R5, R6 are calculated by the equation (1).

VO  VFB  VO  0.8

R 4  R5   3
 ， R6  VFB 
0.8
≒ 4.0k   ------- (1)
I FB 0.2  10 I FB 0.2  10 3
IFB:The electric current which flows to R6

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(5)Resistor R7
・R7 is resistor to adjust OCP starting
RISET-ILpeak
current .
The graph shows the relationship between R7 and OCP .
The OCP output current is calculated in terms of the equation (2),(3),(4)。
8.00 設定値_MAX
VIN：Input voltage
[A]

7.00 Vo：Output voltage

過電流開始ピーク電流
Inductor peak current Ip[A]

6.00 設定値_MIN
Io：Output current
current Protection

5.00 L：Inductance
f：Switching Frequency
4.00 ⊿IL：Inductor ripple current
3.00 Ip：Inductor peak current
at Over current protection
2.00
at Over

1.00
0.00
10k
10 100k
100 1M
1000 10M
10000 100M
100000
OCP Adjust resistance value RISET[Ω]
過電流開始電流 設定抵抗Rset [kΩ]

*Ip becomes the peak value of inductor ripple current. Calculate it in accordance with the following
equation.

In case of continuous inductor current･･･ ⊿IL  Ip－ ⊿IL ------- (2)

２
VIN  L ｆ １
In case of discontinuous inductor current･･･ Io   Ip２   Ip２
 2  Vo  (VIN - Vo ) ２ ⊿IL 
------ (3)

Vo Vo
*Inductor ripple current ････ ⊿IL   (1 - ） ------- (4)
L ｆ VIN
In order to have optimum operating condition, each component must be connected with the minimum distance.

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Allowable package power dissipation

NOTES:
1) Glass-epoxy board mounting in a 30×30mm
2) copper area : 25×25mm
3) The power dissipation is calculated at the junction temperature 125 °C
4) Losses can be calculated by the following equation.
As the efficiency is subject to the input voltage and output current, it shall be obtained from the efficiency curve and
substituted in percent
5) Thermal design for D1 shall be made separately.

 100   V  VO: Output voltage

PD  VO  I O   1  VF  I O 1  O 
 x   VIN  VIN: Input voltage

IO: Output current

ηx: Efficiency(%)

VF: Diode forward voltage

SJPB-L4…0.55V(IO=3A)

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PCB layout recommendation

*The demonstration Printed circuit board. It can mount a part for the experiment ,except for the Example Application Circuit.

Front Side: Component Side (double sided board) Back Side: GND Side (double sided board)

Note
1) Size of the PCB is about 40mm × 40mm
2)Dimension is in millimeters, dimension in bracket is in inches.
3) Drawing is not to scale.

8×φ0.8

(Reference)
DIP8 package
About the position of the lead-insertion hole

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Package outline & Dimension

An outside size is supplied by either Package type A or Package type B.

Package A
9.4±0.127

*1
NR111D
*4
SK *2 6.35±0.127

*3

（1.524）

（1.524） 7.938±0.3175
（1.524）
6.35±0.127
0.2032~0.3810

3.302±0.127

0.381min
3.302±0.254

0.356~0.559 8.636±0.762

（2.54）

Mariking
PIN Assignment
1.NC *1. Type number
2.IN
3.SW *2. Lot number (three digit)
4.GND
5.FB 1st letter: The last digit of year
6.EN 2nd letter: Month
7.SS (1 to 9 for Jan. to Sept.,
8.BS O for Oct. N for Nov. D for Dec.)
3rd letter week
01～03：Arabic Numerical
*3. Control number (four digit)
Note:
1) Dimension is in millimeters. *4 .Logo: SK
2) Drawing is not to scale.

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Package B
9.2±0.2

*1
NR111D
*4 *2 6.4±0.2
SK
*3

7.62±0.3
0.282±0.078
(2.54)
4.01±0.3 3.4±0.2

3.3±0.3
0.51min
0.475±0.095
8.7±0.3
(1.524)
PIN Assignment

1.NC
2.IN
3.SW
4.GND Marking
5.FB *1. Type number
6.EN
7.SS *2. Lot number (three digit)
8.BS
1st letter: The last digit of year
2nd letter: Month
(1 to 9 for Jan. to Sept.,
Note: O for Oct. N for Nov. D for Dec.)
1) Dimension is in millimeters. 3rd letter week
2) Drawing is not to scale.
01～03：Arabic Numerical
*3. Control number (four digit)
*4 .Logo: SK

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OPERATING PRECAUTIONS
Reliability can be affected adversely by improper storage environments and handling methods. Please observe the
following cautions.
Heat dissipation and reliability
Thermal performance of the surface mount package IC depends on the material and area size of PCB and its copper
plane. Design thermal condition with sufficient margin
Parallel operation
The parallel operation to increase the current is not available.
Thermal shut down
The NR111D has a thermal protection circuit.
This circuit protects the IC from the heat generation by the over load.
This circuit cannot guarantee the long-term reliability against the continuously over load status.
Cautions for Storage
 Ensure that storage conditions comply with the standard temperature (5 to 35°C) and the standard relative humidity
(around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity.
 Avoid locations where dust or harmful gases are present and avoid direct sunlight.
 Reinspect for rust on leads and solderability of products that have been stored for a long time.
Cautions for Testing and Handling
 When tests are carried out during inspection testing and other standard test periods, protect the products from power
surges from the testing products, shorts between the product pins, and wrong connections. In addition, avoid tests
exceeded ratings
Soldering
When soldering the products, please be sure to minimize the working time, within the following limits.
・Reflow Preheat ; 180°C / 90±30s
Heat ; 250°C / 10±1s (260°C peak ,2times)
・Soldering iron ; 380±10°C / 3.5±0.5s (1time)
Electrostatic Discharge
 When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1MΩ of
resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator.
 Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats.
 When using measuring equipment such as a curve tracer, the equipment should be grounded.
 When soldering the products, the head of a soldering irons or the solder bath must be grounded in order to prevent leak
voltages generated by them from being applied to the products.
 The products should always be stored and transported in Sanken shipping containers or conductive containers, or be
wrapped in aluminum foil.

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IMPORTANTS NOTES
 The contents in this document are subject to changes, for improvement and other purposes, without notice.
Make sure that this is the latest revision of the document before use.
 Application and operation examples described in this document are quoted for the sole purpose of reference for
the use of the products herein and Sanken can assume no responsibility for any infringement of industrial
property rights, intellectual property rights or any other rights of Sanken or any third party which may result
from its use.
 Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and
defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take,
at their own risk, preventative measures including safety design of the equipment or systems against any
possible injury, death, fires or damages to the society due to device failure or malfunction.
 Sanken products listed in this document are designed and intended for the use as components in general purpose
electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment,
measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required
(transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm
systems, various safety devices, etc.), please contact your nearest Sanken sales representative to discuss, prior to
the use of the products herein.
The use of Sanken products without the written consent of Sanken in the applications where extremely high
reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly
prohibited.
 In the case that you use Sanken semiconductor products or design your products by using Sanken
semiconductor products, the reliability largely depends on the degree of derating to be made to the rated values.
Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or
surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating
factors include electric stresses such as electric voltage, electric current, electric power etc., environmental
stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of
semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must
be taken into consideration.
In addition, it should be noted that since power devices or IC’s including power devices have large self-heating
value, the degree of derating of junction temperature affects the reliability significantly.
 When using the products specified herein by either (i) combining other products or materials therewith or (ii)
physically, chemically or otherwise processing or treating the products, please duly consider all possible risks
that may result from all such uses in advance and proceed therewith at your own responsibility.
 Anti radioactive ray design is not considered for the products listed herein.
 Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out
of Sanken’s distribution network.
 The contents in this document must not be transcribed or copied without Sanken’s written consent.

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