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BITS Pilani Presentation

The document discusses the scope and process steps for fabricating integrated circuits. It describes the differences between a circuit and an integrated circuit, with an integrated circuit having all components housed on the same substrate. The types of integrated circuits are defined based on complexity from SSI to VLSI. The course will cover the process steps for fabricating BJT-based and MOSFET-based ICs using silicon as the most common material. For BJTs, the initial steps discussed are silicon crystal growth, oxidation, photolithography, etching, and diffusion to form the n-type and p-type regions.

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104 views11 pages

BITS Pilani Presentation

The document discusses the scope and process steps for fabricating integrated circuits. It describes the differences between a circuit and an integrated circuit, with an integrated circuit having all components housed on the same substrate. The types of integrated circuits are defined based on complexity from SSI to VLSI. The course will cover the process steps for fabricating BJT-based and MOSFET-based ICs using silicon as the most common material. For BJTs, the initial steps discussed are silicon crystal growth, oxidation, photolithography, etching, and diffusion to form the n-type and p-type regions.

Uploaded by

Shubam
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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BITS Pilani

presentation
BITS Pilani Dr. Pankaj Arora
Department of Electrical and Electronics Engineering
Pilani Campus
BITS Pilani
Pilani Campus

MEL ZG611, IC Fabrication Technology

Lecture No. 1
Scope of the course

• Difference between a circuit and IC (Integrated Circuit)

Circuit: A PCB with different components soldered on it


e.g. Resistor, capacitor, transistors, wires, diodes etc.

Integrated Circuit: The entire circuitry {all active and


passive components) are housed on the same substrate.

Circuit Integrated Circuit


BITS Pilani, Pilani Campus
Types of Integrated Circuits

Depending on the Complexity of the Integrated circuits:

SSI: Small Scale Integrated Circuits (10 to 100 transistors)

MSI: Medium Scale Integrated circuits (100 to 1000


transistors)

LSI: Large Scale Integrated Circuits (More Than 10000)

VLSI: Very Large Scale Integrated Circuits (Millions of


Transistors

BITS Pilani, Pilani Campus


What we are going to study in
the course ??
What are the processes to fabricate these Integrated
Circuits (IC)?

• 95% of Today’s chips are made of Silicon (Si)

• The most important element in IC is the active element


which can be BJT or MOSFET.
BJT: In IC with high speed
MOSFET: In IC with High package density

• BIMOS or BICMOS : Both BJT and MOSFETS are active


elements.
BITS Pilani, Pilani Campus
How do we propose the
course
• Process steps for BJT based Technology

• Process steps for MOSFET base Technology

• After getting familiar with process steps, we will study the


each process individually in details

• Reference book :
1. Sze S. M., “VLSI TECHNOLOGY”
2. James Plummer, M. Deal and P. Griffin, “Silicon VLSI
technology”
• Contact me @: pankaj.arora@pilani.bits-pilani.ac.in
BITS Pilani, Pilani Campus
Process steps for BJT

Silicon (npn Bipolar Junction Transistor):


Start with a p type, single crystal oriented <111> and with
a resistivity of 10 Ω cm • P type , Single crystal Si Wafer
with resistivity 10 Ω cm
• Crystal Orientation <111>
1. Crystal Growth, structure and orientation

3D View

Si Wafer

Cross
section

BITS Pilani, Pilani Campus


Process steps for BJT

1. Crystal Growth, structure and orientation


2. Oxidation
Si has a good tendency to get oxidized as (SiO2)
• SiO2 can be used as an insulator, dielectric and a mask

SiO2

Si

Si after Oxidation

BITS Pilani, Pilani Campus


Process steps for BJT

1. Crystal Growth, structure and orientation


2. Oxidation
3. Photolithography
Photoresist + Mask + UV radiation

Photoresist
SiO2

Si

P P

BITS Pilani, Pilani Campus


Process steps for BJT

1. Crystal Growth, structure and orientation


2. Oxidation
3. Photolithography
4. Etching
Putting in HF solution and then remove the photoresist

Photoresist
SiO2 SiO2

Si Si
P
P

BITS Pilani, Pilani Campus


Process steps for BJT

1. Crystal Growth, structure and orientation


2. Oxidation
3. Photolithography
4. Etching
5. Diffusion
Antimony and Bismuth are used as n+ dopant

SiO2

Si
P P P

BITS Pilani, Pilani Campus

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