For Ghic Only: High-Performance 6-Axis Mems Motiontracking™ Device

MPU-6886
High-Performance 6-Axis MEMS MotionTracking™ Device

GENERAL DESCRIPTION APPLICATIONS
The MPU-6886 is a 6-axis MotionTracking device that • Smartphones and Tablets
combines a 3-axis gyroscope and a 3-axis accelerometer in a • Wearable sensors
small 3 mm x 3 mm x 0.75 mm 24-pin LGA package. • IoT Applications
• High performance specs: • Motion-based game controllers
o Gyroscope sensitivity error: ±1% • 3D remote controls for Internet connected DTVs and
o Gyroscope noise: ±4 mdps/√Hz set top boxes, 3D mice
o Accelerometer noise: 100 µg/√Hz
FEATURES
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• Includes 1 kB FIFO to reduce traffic on the serial bus
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interface, and reduce power consumption by • 3-Axis gyroscope with programmable FSR of
allowing the system processor to burst read sensor ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps
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data and then go into low-power mode • 3-Axis accelerometer with programmable FSR of
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• EIS FSYNC support ±2g, ±4g, ±8g, and ±16g
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• User-programmable interrupts
MPU-6886 includes on-chip 16-bit ADC’s, programmable
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• Wake-on-motion interrupt for low power operation
digital filters, an embedded temperature sensor, and
of applications processor
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programmable interrupts. The device features an operating
voltage range down to 1.71V. Communication ports include • 1 kB FIFO buffer enables the applications processor
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I C and high speed SPI at 10 MHz.
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• On-Chip 16-bit ADCs and Programmable Filters
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ORDERING INFORMATION •
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Host interface: 10 MHz SPI or 400 kHz I C
• Digital-output temperature sensor
PART TEMP RANGE PACKAGE
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• VDD operating range of 1.71V to 3.45V

MPU-6886† −40°C to +85°C 24-Pin LGA • MEMS structure hermetically sealed and bonded at
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†Denotes RoHS and Green-Compliant Package wafer level

• RoHS and Green compliant
BLOCK DIAGRAM
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TYPICAL OPERATING CIRCUIT

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InvenSense Inc.
This document contains information on a pre-production Document Number: DS-000193
1745 Technology Drive, San Jose, CA 95110 U.S.A
product. InvenSense Inc. reserves the right to change Revision: 1.1
+1(408) 988–7339
specifications and information herein without notice.. Release Date: 03/29/2017
www.invensense.com
MPU-6886
TABLE OF CONTENTS
GENERAL DESCRIPTION .................................................................................................................................................. 1
ORDERING INFORMATION .............................................................................................................................................. 1
APPLICATIONS ................................................................................................................................................................ 1
FEATURES ....................................................................................................................................................................... 1
TYPICAL OPERATING CIRCUIT ......................................................................................................................................... 1
1 INTRODUCTION.................................................................................................................................................... 7
1.1 PURPOSE AND SCOPE ............................................................................................................................................... 7
1.2 PRODUCT OVERVIEW ............................................................................................................................................... 7
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1.3 APPLICATIONS ......................................................................................................................................................... 7
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2 FEATURES ............................................................................................................................................................ 8
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2.1 GYROSCOPE FEATURES ............................................................................................................................................. 8
2.2 ACCELEROMETER FEATURES....................................................................................................................................... 8
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2.3 ADDITIONAL FEATURES ............................................................................................................................................. 8
3 ELECTRICAL CHARACTERISTICS ............................................................................................................................. 9
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3.1 GYROSCOPE SPECIFICATIONS...................................................................................................................................... 9
3.2 ACCELEROMETER SPECIFICATIONS ............................................................................................................................. 10
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3.3 ELECTRICAL SPECIFICATIONS..................................................................................................................................... 11
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3.4 I C TIMING CHARACTERIZATION ............................................................................................................................... 14
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3.5 SPI TIMING CHARACTERIZATION ............................................................................................................................... 15
3.6 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................... 16
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4 APPLICATIONS INFORMATION ........................................................................................................................... 17

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4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION ............................................................................................................ 17

4.2 TYPICAL OPERATING CIRCUIT ................................................................................................................................... 18
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4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................................................... 18

4.4 EXPOSED DIE PAD PRECAUTIONS .............................................................................................................................. 18
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4.5 BLOCK DIAGRAM ................................................................................................................................................... 19

4.6 OVERVIEW ........................................................................................................................................................... 19
4.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ............................................................ 20
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4.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING...................................................... 20
4.9 I2C AND SPI SERIAL COMMUNICATIONS INTERFACES.................................................................................................... 20
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4.10 SELF-TEST ............................................................................................................................................................ 21

4.11 CLOCKING ............................................................................................................................................................ 22
4.12 SENSOR DATA REGISTERS ........................................................................................................................................ 22
4.13 FIFO ................................................................................................................................................................... 22
4.14 INTERRUPTS.......................................................................................................................................................... 22
4.15 DIGITAL-OUTPUT TEMPERATURE SENSOR................................................................................................................... 22
4.16 BIAS AND LDOS .................................................................................................................................................... 22
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4.17 CHARGE PUMP...................................................................................................................................................... 22

4.18 STANDARD POWER MODES ..................................................................................................................................... 23
5 PROGRAMMABLE INTERRUPTS .......................................................................................................................... 24
5.1 WAKE-ON-MOTION INTERRUPT ............................................................................................................................... 24
6 DIGITAL INTERFACE ............................................................................................................................................ 25
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6.1 I C AND SPI SERIAL INTERFACES ............................................................................................................................... 25
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6.2 I C INTERFACE ...................................................................................................................................................... 25
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6.3 I C COMMUNICATIONS PROTOCOL ........................................................................................................................... 25
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6.4 I C TERMS ........................................................................................................................................................... 27
6.5 SPI INTERFACE ...................................................................................................................................................... 28
7 REGISTER MAP ................................................................................................................................................... 29
8 REGISTER DESCRIPTIONS.................................................................................................................................... 32
8.1 REGISTER 04 – GYROSCOPE LOW NOISE TO LOW POWER OFFSET SHIFT AND GYROSCOPE OFFSET TEMPERATURE COMPENSATION
(TC) REGISTER .................................................................................................................................................................. 32
(TC) REGISTER .................................................................................................................................................................. 32
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(TC) REGISTER .................................................................................................................................................................. 33
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(TC) REGISTER .................................................................................................................................................................. 33
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(TC) REGISTER .................................................................................................................................................................. 33
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(TC) REGISTER .................................................................................................................................................................. 33
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8.7 REGISTERS 13 TO 15 – ACCELEROMETER SELF-TEST REGISTERS ...................................................................................... 34
8.8 REGISTER 19 – X-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE ............................................................................ 34
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8.9 REGISTER 20 – X-GYRO OFFSET ADJUSTMENT REGISTER – LOW BYTE ............................................................................. 34
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8.10 REGISTER 21 – Y-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE............................................................................. 35
8.11 REGISTER 22 – Y-GYRO OFFSET ADJUSTMENT REGISTER – LOW BYTE ............................................................................. 35
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8.12 REGISTER 23 – Z-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE............................................................................. 35

8.13 REGISTER 24 – Z-GYRO OFFSET ADJUSTMENT REGISTER – LOW BYTE ............................................................................. 35
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8.14 REGISTER 25 – SAMPLE RATE DIVIDER....................................................................................................................... 35

8.15 REGISTER 26 – CONFIGURATION .............................................................................................................................. 36
8.16 REGISTER 27 – GYROSCOPE CONFIGURATION ............................................................................................................. 37
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8.17 REGISTER 28 – ACCELEROMETER CONFIGURATION....................................................................................................... 37

8.18 REGISTER 29 – ACCELEROMETER CONFIGURATION 2 .................................................................................................... 37
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8.19 REGISTER 30 – GYROSCOPE LOW POWER MODE CONFIGURATION ................................................................................. 39

8.20 REGISTER 32 – WAKE-ON MOTION THRESHOLD (X-AXIS ACCELEROMETER) ...................................................................... 39
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8.21 REGISTER 33 – WAKE-ON MOTION THRESHOLD (Y-AXIS ACCELEROMETER) ...................................................................... 40

8.22 REGISTER 34 – WAKE-ON MOTION THRESHOLD (Z-AXIS ACCELEROMETER) ...................................................................... 40
8.23 REGISTER 35 – FIFO ENABLE................................................................................................................................... 40
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8.24 REGISTER 54 – FSYNC INTERRUPT STATUS ................................................................................................................ 40

8.25 REGISTER 55 – INT/DRDY PIN / BYPASS ENABLE CONFIGURATION ................................................................................ 41
8.26 REGISTER 56 – INTERRUPT ENABLE ........................................................................................................................... 41
8.27 REGISTER 57 – FIFO WATERMARK INTERRUPT STATUS ................................................................................................ 41
8.28 REGISTER 58 – INTERRUPT STATUS ........................................................................................................................... 42
8.29 REGISTERS 59 TO 64 – ACCELEROMETER MEASUREMENTS ............................................................................................ 42
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8.30 REGISTERS 65 AND 66 – TEMPERATURE MEASUREMENT .............................................................................................. 43

8.31 REGISTERS 67 TO 72 – GYROSCOPE MEASUREMENTS................................................................................................... 43
8.32 REGISTERS 80 TO 82 – GYROSCOPE SELF-TEST REGISTERS............................................................................................. 44
8.33 REGISTERS 83 TO 90 – ENGINEERING ID REGISTERS ..................................................................................................... 44
8.34 REGISTER 96-97 – FIFO WATERMARK THRESHOLD IN NUMBER OF BYTES ....................................................................... 45
8.35 REGISTER 104 – SIGNAL PATH RESET ........................................................................................................................ 46
8.36 REGISTER 105 – ACCELEROMETER INTELLIGENCE CONTROL ........................................................................................... 46
8.37 REGISTER 106 – USER CONTROL .............................................................................................................................. 46

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8.38 REGISTER 107 – POWER MANAGEMENT 1 ................................................................................................................. 47
8.39 REGISTER 108 – POWER MANAGEMENT 2 ................................................................................................................. 47
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8.40 REGISTER 112 – I C INTERFACE ............................................................................................................................... 48
8.41 REGISTER 114 AND 115 – FIFO COUNT REGISTERS ..................................................................................................... 48
8.42 REGISTER 116 – FIFO READ WRITE.......................................................................................................................... 48
8.43 REGISTER 117 – WHO AM I .................................................................................................................................... 49
8.44 REGISTERS 119, 120, 122, 123, 125, 126 ACCELEROMETER OFFSET REGISTERS ............................................................. 49
9 USE NOTES ......................................................................................................................................................... 51
9.1 ACCELEROMETER-ONLY LOW-NOISE MODE ............................................................................................................... 51
9.2 ACCELEROMETER LOW-POWER MODE ...................................................................................................................... 51
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9.3 SENSOR MODE CHANGE ......................................................................................................................................... 51
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9.4 TEMP SENSOR DURING GYROSCOPE STANDBY MODE ................................................................................................... 51
9.5 GYROSCOPE MODE CHANGE.................................................................................................................................... 51
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9.6 POWER MANAGEMENT 1 REGISTER SETTING .............................................................................................................. 51
9.7 UNLISTED REGISTER LOCATIONS ............................................................................................................................... 51
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9.8 CLOCK TRANSITION WHEN GYROSCOPE IS TURNED OFF ................................................................................................ 51
9.9 SLEEP MODE ........................................................................................................................................................ 52
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9.10 NO SPECIAL OPERATION NEEDED FOR FIFO READ IN LOW POWER MODE ........................................................................ 52
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9.11 GYROSCOPE STANDBY PROCEDURE ........................................................................................................................... 52
10 ASSEMBLY ...................................................................................................................................................... 53
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10.1 ORIENTATION OF AXES ........................................................................................................................................... 53
10.2 PACKAGE DIMENSIONS ........................................................................................................................................... 54
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11 PART NUMBER PACKAGE MARKING ............................................................................................................... 55

12 REFERENCE ..................................................................................................................................................... 56
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13 DOCUMENT INFORMATION ........................................................................................................................... 57

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13.1 REVISION HISTORY ................................................................................................................................................. 57

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Table of Figures
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Figure 1. I C Bus Timing Diagram ....................................................................................................................14
Figure 2. SPI Bus Timing Diagram ...................................................................................................................15
Figure 3. Pin out Diagram for MPU-6886 3.0 mm x 3.0 mm x 0.75 mm LGA ..................................................17
Figure 4. MPU-6886 LGA Example Application Schematic .............................................................................18
Figure 5. MPU-6886 Block Diagram .................................................................................................................19
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Figure 6. MPU-6886 Solution Using I C Interface ............................................................................................20
Figure 7. MPU-6886 Solution Using SPI Interface ...........................................................................................21
Figure 8. START and STOP Conditions ...........................................................................................................25
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Figure 9. Acknowledge on the I C Bus .............................................................................................................26
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Figure 10. Complete I C Data Transfer ............................................................................................................26
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Figure 11. Typical SPI Master/Slave Configuration ..........................................................................................28
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Figure 12. Orientation of Axes of Sensitivity and Polarity of Rotation ..............................................................53
Figure 13. Package Diagram ............................................................................................................................54
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Figure 14. Part Number Package Marking .......................................................................................................55
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Table of Tables
Table 1. Gyroscope Specifications ..................................................................................................................... 9
Table 2. Accelerometer Specifications ............................................................................................................10
Table 3. D.C. Electrical Characteristics ............................................................................................................11
Table 4. A.C. Electrical Characteristics ............................................................................................................13
Table 5. Other Electrical Specifications ............................................................................................................13
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Table 6. I C Timing Characteristics ..................................................................................................................14
Table 7. SPI Timing Characteristics (10 MHz Operation) ................................................................................15
Table 8. Absolute Maximum Ratings ................................................................................................................16
Table 9. Signal Descriptions .............................................................................................................................17
Table 10. Bill of Materials .................................................................................................................................18
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Table 11. Standard Power Modes for MPU-6886.............................................................................................23
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Table 12. Table of Interrupt Sources ................................................................................................................24
Table 13. Serial Interface..................................................................................................................................25
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Table 14. I C Terms ..........................................................................................................................................27
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Table 15. MPU-6886 Register Map ..................................................................................................................31
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Table 16. Configuration ....................................................................................................................................36
Table 17. Accelerometer Data Rates and Bandwidths (Low-Noise Mode) ......................................................38
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Table 18. Approximate Accelerometer Filter Bandwidths (Low-Power Mode) .................................................38
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Table 19. Example Gyroscope Configurations (Low-Power Mode) .................................................................39
Table 20. Package Dimensions ........................................................................................................................54
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Table 21. Part Number Package Marking ........................................................................................................55
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1 INTRODUCTION
1.1 PURPOSE AND SCOPE
This document is a product specification, providing a description, specifications, and design related information on the
MPU-6886™ MotionTracking device. The device is housed in a small 3x3x0.75mm 24-pin LGA package.
1.2 PRODUCT OVERVIEW

The MPU-6886 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, in a small
3 mm x 3 mm x 0.75 mm (24-pin LGA) package. It also features a 1 kB FIFO that can lower the traffic on the serial bus
interface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into
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a low-power mode. MPU-6886, with its 6-axis integration, enables manufacturers to eliminate the costly and complex
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selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for
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The gyroscope has a programmable full-scale range of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps. The
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accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated
initial sensitivity of both sensors reduces production-line calibration requirements.
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Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature
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sensor, and programmable interrupts. The device features I C and SPI serial interfaces, a VDD operating range of 1.71V
to 3.45V, and a separate digital IO supply, VDDIO from 1.71V to 3.45V.
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Communication with all registers of the device is performed using either I C at 400 kHz or SPI at 10M Hz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with
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companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a
footprint and thickness of 3 mm x 3 mm x 0.75 mm (24-pin LGA), to provide a very small yet high performance low
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cost package. The device provides high robustness by supporting 20,000g shock reliability.
1.3 APPLICATIONS
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• Drones
• Wearable Sensors
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2 FEATURES
2.1 GYROSCOPE FEATURES
The triple-axis MEMS gyroscope in the MPU-6886 includes a wide range of features:
• Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-scale range
of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps and integrated 16-bit ADCs
• Digitally-programmable low-pass filter
• Low-power gyroscope operation
• Factory calibrated sensitivity scale factor
• Self-test
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2.2 ACCELEROMETER FEATURES
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The triple-axis MEMS accelerometer in MPU-6886 includes a wide range of features:
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• Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and
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±16g and integrated 16-bit ADCs
• User-programmable interrupts
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• Wake-on-motion interrupt for low power operation of applications processor
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• Self-test
2.3 ADDITIONAL FEATURES

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The MPU-6886 includes the following additional features:
• Smallest and thinnest LGA package: 3 mm x 3 mm x 0.75 mm (24-pin LGA)
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• Minimal cross-axis sensitivity between the accelerometer and gyroscope axes

• 1 kB FIFO buffer enables the applications processor to read the data in bursts
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• Digital-output temperature sensor

• User-programmable digital filters for gyroscope, accelerometer, and temp sensor
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• 20,000g shock tolerant

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• 400 kHz Fast Mode I C for communicating with all registers
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• 10 MHz SPI serial interface for communicating with all registers

• MEMS structure hermetically sealed and bonded at wafer level
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• RoHS and Green compliant

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3 ELECTRICAL CHARACTERISTICS
3.1 GYROSCOPE SPECIFICATIONS
Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A =25°C, unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES
GYROSCOPE SENSITIVITY
Full-Scale Range FS_SEL=0 ±250 dps 3
FS_SEL=1 ±500 dps 3
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Gyroscope ADC Word Length 16 bits 3
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Sensitivity Scale Factor FS_SEL=0 131 LSB/(dps) 3
FS_SEL=1 65.5 LSB/(dps) 3
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Sensitivity Scale Factor Initial Tolerance 25°C -1 +1 % 1
Sensitivity Scale Factor Variation Over -40°C to +85°C -2.5 +2.5 % 1
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Temperature
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Nonlinearity Best fit straight line; 25°C -0.2 ±0.1 +0.2 % 1
Cross-Axis Sensitivity -4.5 ±1 +4.5 % 1
ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
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ZRO Variation vs. Temperature -40°C to +85°C -0.05 ±0.01 +0,05 dps/ºC 1
OTHER PARAMETERS
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Rate Noise Spectral Density @ 10 Hz 0.004 0.01 dps/√Hz 1, 4

Total RMS Noise Bandwidth = 100 Hz 0.04 0.1 dps-rms 1, 4
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Gyroscope Mechanical Frequencies 25 27 29 KHz 2

Low Pass Filter Response Programmable Range 5 250 Hz 3
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Gyroscope Start-Up Time Time from gyro enable to gyro drive ready 35 100 ms 1
Low-Noise mode 3.91 8000 Hz 3
Output Data Rate
Low Power Mode 3.91 333.33 Hz 3
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Table 1. Gyroscope Specifications

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NOTES:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
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3. Guaranteed by design.
4. Noise specifications shown are for low-noise mode.
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3.2 ACCELEROMETER SPECIFICATIONS
ACCELEROMETER SENSITIVITY
Full-Scale Range AFS_SEL=0 ±2 g 2
AFS_SEL=1 ±4 g 2
AFS_SEL=2 ±8 g 2
AFS_SEL=3 ±16 g 2
ADC Word Length Output in two’s complement format 16 bits 2
Sensitivity Scale Factor AFS_SEL=0 16,384 LSB/g 2
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AFS_SEL=1 8,192 LSB/g 2
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Sensitivity Scale Factor Initial Component-level
-1 +1 % 1
Tolerance
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Sensitivity Change vs. Temperature -40°C to +85°C -2 +2 % 1
Nonlinearity Best Fit Straight Line -1 ±0.3 +1 % 1
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Cross-Axis Sensitivity -4.5 ±1 +4.5 % 1
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ZERO-G OUTPUT
Component-level, all axes -65 ±25 +65 mg 1
Initial Tolerance
Board-level, all axes -100 ±40 +100 mg 1
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Zero-G Level Change vs. Temperature -40°C to +85°C
Z axis -1.2 ±1 +1.2 mg/ºC 1
OTHER PARAMETERS
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Power Spectral Density @ 10 Hz 100 170 µg/√Hz 1, 3

RMS Noise Bandwidth = 100 Hz 1.0 1.7 mg-rms 1, 3
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Low-Pass Filter Response Programmable Range 5 218 Hz 2

Accelerometer Startup Time From sleep mode to valid data 10 20 ms 2
Low-Noise mode 3.91 4000 Hz
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Output Data Rate 2

Low Power Mode 3.91 500 Hz
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Table 2. Accelerometer Specifications

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3. Noise specifications shown are for low-noise mode.
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3.3 ELECTRICAL SPECIFICATIONS
D.C. Electrical Characteristics
SUPPLY VOLTAGES
VDD 1.71 1.8 3.45 V 1
VDDIO 1.71 1.8 3.45 V 1
SUPPLY CURRENTS
Low-Noise Mode 6-Axis Gyroscope + Accelerometer 2.79 3.0 mA 1
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3-Axis Accelerometer 321 370 µA 1
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3-Axis Gyroscope 2.55 2.8 mA 1
Accelerometer Low -Power Mode
100Hz ODR, 1x averaging µA 1
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(Gyroscope disabled) 40 45
Gyroscope Low-Power Mode 100Hz ODR, 1x averaging
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1.08 1.2 mA 1
(Accelerometer disabled)
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6-Axis Low-Power Mode
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(Gyroscope Low-Power Mode; 100Hz ODR, 1x averaging 1.33 1.45 mA 1
Accelerometer Low-Noise Mode)
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Full-Chip Sleep Mode At 25ºC 6 10 µA 1
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Specified Temperature Range Performance parameters are not applicable
-40 +85 °C 1
beyond Specified Temperature Range
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Table 3. D.C. Electrical Characteristics

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1. Target spec. Subject to update.

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A.C. Electrical Characteristics
SUPPLIES
Monotonic ramp. Ramp rate is 10%
Supply Ramp Time 0.01 3 ms
to 90% of the final value 1
mV peak-
Power Supply Noise 10 1
peak
TEMPERATURE SENSOR
Operating Range Ambient -40 85 °C 1
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25°C Output 0 LSB 3
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ADC Resolution 16 bits 2
Without Filter 8000 Hz 2
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With Filter 3.91 1000 Hz 2
Room Temperature Offset 25°C -15 15 °C 3
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Stabilization Time 14000 µs 2
Sensitivity Untrimmed 326.8 LSB/°C 1
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Sensitivity Error -2.5 +2.5 % 1
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2
I C ADDRESS
2 SA0 = 0 1101000
I C ADDRESS
SA0 = 1 1101001
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V IH , High Level Input Voltage 0.7*VDDIO V
V IL , Low Level Input Voltage 0.3*VDDI V
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C I , Input Capacitance < 10 pF
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DIGITAL OUTPUT (SDO, INT, DRDY)

V OH , High Level Output Voltage R LOAD =1 MΩ; 0.9*VDDIO V
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V OL1 , LOW-Level Output Voltage R LOAD =1 MΩ; 0.1*VDDI V

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V OL.INT , INT Low-Level Output OPEN=1, 0.3 mA sink 0.1 V 1
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Voltage Current
Output Leakage Current OPEN=1 100 nA
t INT , INT Pulse Width LATCH_INT_EN=0 50 µs
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I C I/O (SCL, SDA)
V IL , LOW Level Input Voltage -0.5V 0.3*VDDI V
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V IH , HIGH-Level Input Voltage 0.7*VDDIO VDDIO + V
0.5V
0.1*VDDI
V hys , Hysteresis V
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V OL , LOW-Level Output Voltage 3 mA sink current 0 0.4 V
I OL , LOW-Level Output Current V OL =0.4V 3 mA
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V OL =0.6V 6 mA
Output Leakage Current 100 nA
t of , Output Fall Time from V IHmax
C b bus capacitance in pf 20+0.1C b 300 ns
to V ILmax
INTERNAL CLOCK SOURCE
FCHOICE_B=1,2,3; SMPLRT_DIV=0 32 kHz 2
FCHOICE_B=0;
Sample Rate
DLPFCFG=0 or 7 8 kHz 2
SMPLRT_DIV=0

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FCHOICE_B=0;
DLPFCFG=1,2,3,4,5,6; 1 kHz 2
SMPLRT_DIV=0
CLK_SEL=0, 6 or gyro inactive; 25°C -3 +3 % 1
Clock Frequency Initial
CLK_SEL=1,2,3,4,5 and gyro active;
Tolerance -1 +1 % 1
25°C
CLK_SEL=0,6 or gyro inactive. (-40°C
Frequency Variation over ±2 % 1
to +85°C)
Temperature
CLK_SEL=1,2,3,4,5 and gyro active ±2 % 1
Table 4. A.C. Electrical Characteristics
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3. Production tested.
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Other Electrical Specifications
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SERIAL INTERFACE
SPI Operating Frequency, All

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100 100
kHz 1,3
±10%
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Registers Read/Write
High Speed Characterization 0.2 1 10 MHz 1, 2, 3
SPI Modes 0 and 3
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2 All registers, Fast-mode 100 400 kHz 1

I C Operating Frequency
All registers, Standard-mode 100 kHz 1
fo se
Table 5. Other Electrical Specifications

NOTES:
In en

2. SPI clock duty cycle between 45% and 55% should be used for 10 MHz operation.
ed nS
3. Minimum SPI/I2C clock rate is dependent on ODR. If ODR is below 4 kHz, minimum clock rate is 100 kHz. If ODR is greater than 4 kHz,
minimum clock rate is 200 kHz.
nc ve
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Revision: 1.1
MPU-6886
3.4 I2C TIMING CHARACTERIZATION
PARAMETERS CONDITIONS MIN TYPICAL MAX UNITS NOTES
2 2
I C TIMING I C FAST-MODE
f SCL , SCL Clock Frequency 100 400 kHz 1
t HD.STA , (Repeated) START Condition Hold Time 0.6 µs 1
t LOW , SCL Low Period 1.3 µs 1
t HIGH , SCL High Period 0.6 µs 1
t SU.STA , Repeated START Condition Setup Time 0.6 µs 1
t HD.DAT , SDA Data Hold Time 0 µs 1
y
t SU.DAT , SDA Data Setup Time 100 ns 1
nl
t r , SDA and SCL Rise Time C b bus cap. from 10 to 400 pF 20+0.1C b 300 ns 1
t f , SDA and SCL Fall Time C b bus cap. from 10 to 400 pF 20+0.1C b 300 ns 1
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t SU.STO , STOP Condition Setup Time 0.6 µs 1
r G tia
t BUF , Bus Free Time Between STOP and START 1.3 µs 1
IC
Condition
C b , Capacitive Load for each Bus Line < 400 pF 1
fo n
t VD.DAT , Data Valid Time 0.9 µs 1
n de
t VD.ACK , Data Valid Acknowledge Time 0.9 µs 1
2
io fi Table 6. I C Timing Characteristics
NOTE:
at on
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
rm C
tf tSU.DAT
fo se
tr
SDA 70% 70%
30% 30%
continued below at A
In en
tf
tr tVD.DAT
SCL 70% 70%
tHD.DAT
30% 30%
tHD.STA 9th clock cycle
ed nS
1/fSCL tLOW
S 1st clock cycle tHIGH
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tBUF
SDA 70%
A 30%
va In
tSU.STA tHD.STA tVD.ACK tSU.STO

SCL 70%
30%
Sr 9th clock cycle P S
2
Figure 1. I C Bus Timing Diagram
Ad

Revision: 1.1
MPU-6886
3.5 SPI TIMING CHARACTERIZATION
SPI TIMING
f SPC , SPC Clock Frequency 10 MHz 1
t LOW , SPC Low Period 45 ns 1
t HIGH , SPC High Period 45 ns 1
t SU.CS , CS Setup Time 2 ns 1
t HD.CS , CS Hold Time 63 ns 1
y
t SU.SDI , SDI Setup Time 3 ns 1
nl
t HD.SDI , SDI Hold Time 7 ns 1
H l-
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t VD.SDO , SDO Valid Time C load = 20 pF 40 ns 1
t DIS.SDO , SDO Output Disable Time 20 ns 1
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IC
Table 7. SPI Timing Characteristics (10 MHz Operation)
fo n
Notes:
n de
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
CS
io fi
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70%
30%
tHD;CS
rm C
tSU;CS tHIGH 1/fCLK

SCLK 70%
30%
fo se
tSU;SDI tHD;SDI tLOW

In en
SDI 70%
MSB IN LSB IN
30%
tVD;SDO tDIS;SDO
ed nS
SDO 70%
MSB OUT LSB OUT
30%
nc ve
Figure 2. SPI Bus Timing Diagram

va In
Ad

Revision: 1.1
MPU-6886
3.6 ABSOLUTE MAXIMUM RATINGS
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these conditions is not implied. Exposure to the absolute
maximum ratings conditions for extended periods may affect device reliability.
PARAMETER RATING
Supply Voltage, VDD -0.5V to +4V
Supply Voltage, VDDIO -0.5V to +4V
REGOUT -0.5V to 2V
Input Voltage Level (SA0, FSYNC, SCL, SDA) -0.5V to VDDIO + 0.5V
Acceleration (Any Axis, unpowered) 20,000g for 0.2ms
y
Operating Temperature Range -40°C to +85°C
nl
Storage Temperature Range -40°C to +125°C
2kV (HBM);
Electrostatic Discharge (ESD) Protection
H l-
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250V (MM)
JEDEC Class II (2),125°C
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Latch-up
±100mA
IC
Table 8. Absolute Maximum Ratings
fo n
n de
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fo se
In en
ed nS
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Revision: 1.1
MPU-6886
4 APPLICATIONS INFORMATION
4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION
PIN NUMBER PIN NAME
23 SCL / SCLK
24 SDA / SDI
9 AD0 / SDO
11 FSYNC / NC
19 RESV (INT/TP0)
y
8 VDDIO
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12 INT1/DRDY/TP2
H l-
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22 nCS
20 RESV (VPP)
r G tia
IC
10 REGOUT
fo n
13 VDD
n de
18 GND
io fi 1,2,3,4,5,6,7,14,15,16,17,21 NC
Table 9. Signal Descriptions
at on
NOTE: Power up with SCL/SPC and CS pins held low is not a supported use case. In case this power up approach is used, software reset is required
using the PWR_MGMT_1 register, prior to initialization.
rm C
fo se
SCL/SCLK
SDA/SDI
In en
nCS
NC
NC
NC
24 23 22 21 20 19
ed nS
+Z
NC 1 18 GND
+Y
nc ve
+Z
NC 2 17 NC
NC 3 16 NC +Y
va In
MP
U-
MPU-6886 68
86
NC 4 15 NC
NC 5 14 NC
+X +X
NC 6 13 VDD
7 8 9 10 11 12
Ad
NC
VDDIO
AD0/SDO
REGOUT
FSYNC
INT
Top View – LGA Package Orientation of Axes of Sensitivity and

24-pin, 3mm x 3mm x 0.75mm Polarity of Rotation
Figure 3. Pin out Diagram for MPU-6886 3.0 mm x 3.0 mm x 0.75 mm LGA

Revision: 1.1
MPU-6886
y
nl
H l-
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IC
fo n
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In en
Figure 4. MPU-6886 LGA Example Application Schematic
4.2 TYPICAL OPERATING CIRCUIT

ed nS
2
I C lines are open drain and pullup resistors (e.g. 10kΩ) are required.
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS

nc ve
COMPONENT LABEL SPECIFICATION QUANTITY

va In
REGOUT Capacitor C1 X7R, 0.1 µF ±10% 1

C2 X7R, 0.1 µF ±10% 1
VDD Bypass Capacitors
C4 X7R, 2.2 µF ±10% 1
VDDIO Bypass Capacitor C3 X7R, 10 nF ±10% 1
Table 10. Bill of Materials

Ad
4.4 EXPOSED DIE PAD PRECAUTIONS

InvenSense products have very low active and standby current consumption. The exposed die pad is not required for
heat sinking, and should not be soldered to the PCB. Failure to adhere to this rule can induce performance changes
due to package thermo-mechanical stress. There is no electrical connection between the pad and the CMOS.

Revision: 1.1
MPU-6886
4.5 BLOCK DIAGRAM
MPU-6886
INT
Self
X Accel ADC
test Interrupt
Status
Register
CS
Self Y Accel ADC Slave I2C and SA0 / SDO
test
SPI Serial
FIFO
Interface SCL / SPC
SDA / SDI
y
Self
Z Accel ADC
test User & Config
nl
Signal Conditioning
Registers
FSYNC
H l-
Self
O
X Gyro ADC
test Sensor
Registers
r G tia
IC
Self
Y Gyro ADC
test
fo n
n de
Self
Z Gyro ADC
test
io fi
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Temp Sensor ADC
rm C
Charge Bias & LDOs

Pump
fo se
VDD GND REGOUT
Figure 5. MPU-6886 Block Diagram

In en
4.6 OVERVIEW
ed nS
The MPU-6886 is comprised of the following key blocks and functions:

• Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
nc ve
• Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
2
• I C and SPI serial communications interface
va In
• Self-Test
• Clocking
• Sensor Data Registers
• FIFO
• Interrupts
• Digital-Output Temperature Sensor
• Bias and LDOs
Ad
• Charge Pump
• Standard Power Modes

Revision: 1.1
MPU-6886
4.7 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The MPU-6886 consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X-, Y-,
and Z- Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is
detected by a capacitive pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that
is proportional to the angular rate. This voltage is digitized using individual on-chip 16-bit Analog-to-Digital Converters
(ADCs) to sample each axis. The full-scale range of the gyro sensors may be digitally programmed to ±250, ±500,
±1000, or ±2000 degrees per second (dps). The ADC sample rate is programmable from 8,000 samples per second,
down to 3.9 samples per second, and user-selectable low-pass filters enable a wide range of cut-off frequencies.
4.8 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING
y
The MPU-6886’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis
induces displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially.
nl
The MPU-6886’s architecture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal
H l-
O
drift. When the device is placed on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis. The
accelerometers’ scale factor is calibrated at the factory and is nominally independent of supply voltage. Each sensor
r G tia
IC
has a dedicated sigma-delta ADC for providing digital outputs. The full scale range of the digital output can be adjusted
to ±2g, ±4g, ±8g, or ±16g.
fo n
4.9 I2C AND SPI SERIAL COMMUNICATIONS INTERFACES
n de
2
The MPU-6886 communicates to a system processor using either a SPI or an I C serial interface. The MPU-6886 always
io fi 2
acts as a slave when communicating to the system processor. The LSB of the I C slave address is set by pin 9 (SA0).
at on
MPU-6886 Solution Using I2C Interface
2
rm C
In Figure 6, the system processor is an I C master to the MPU-6886.

fo se
Interrupt
I2C Processor Bus: for reading all
Status INT
sensor data from MPU
Register
In en
MPU-6886 SA0
VDDIO or GND
Slave I2C
ed nS
or SPI SCL SCL

Serial System
Interface SDA SDA Processor
FIFO
nc ve
User & Config

Registers
va In
Sensor
Register
Factory
Calibration
Ad
Bias & LDOs
VDD GND REGOUT
2
Figure 6. MPU-6886 Solution Using I C Interface

Revision: 1.1
MPU-6886
MPU-6886 Solution Using SPI Interface
In Figure 7, the system processor is an SPI master to the MPU-6886. Pins 23, 24, 9, and 22 are used to support the SPC,
SDI, SDO, and CS signals for SPI communications.
Processor SPI Bus: for reading all
data from MPU and for configuring
MPU
Interrupt
Status INT
Register
CS nCS
MPU-6886 SDO SDI
System
Slave SPI
SPC SPC Processor
Serial
Interface
SDI SDO
FIFO
y
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Config
Register
H l-
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Sensor
Register
r G tia
Factory
IC
Calibration
fo n
n de
io fi Bias & LDOs
at on
VDD GND REGOUT
Figure 7. MPU-6886 Solution Using SPI Interface

rm C
4.10 SELF-TEST
fo se
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each
measurement axis can be activated by means of the gyroscope and accelerometer self-test registers (registers 27 and
In en
28).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output signal. The
ed nS
output signal is used to observe the self-test response.

The self-test response is defined as follows:
nc ve
SELF-TEST RESPONSE = SENSOR OUTPUT WITH SELF-TEST ENABLED – SENSOR OUTPUT WITH SELF-TEST DISABLED
va In
The self-test response for each gyroscope axis is defined in the gyroscope specification table, while that for each
accelerometer axis is defined in the accelerometer specification table.
When the value of the self-test response is within the specified min/max limits of the product specification, the part
has passed self-test. When the self-test response exceeds the min/max values, the part is deemed to have failed self-
test.
Ad

Revision: 1.1
MPU-6886
4.11 CLOCKING
The MPU-6886 has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the internal
synchronous circuitry. This synchronous circuitry includes the signal conditioning and ADCs, and various control
circuits and registers. An on-chip PLL provides flexibility in the allowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:
a) An internal relaxation oscillator
b) Auto-select between internal relaxation oscillator and gyroscope MEMS oscillator to use the best available
source
The only setting supporting specified performance in all modes is option b). It is recommended that option b) be used.
y
4.12 SENSOR DATA REGISTERS
nl
The sensor data registers contain the latest gyroscope, accelerometer, and temperature measurement data. They are
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read-only registers, and are accessed via the serial interface. Data from these registers may be read anytime.
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IC
4.13 FIFO
fo n
The MPU-6886 contains a 1 kB FIFO register that is accessible via the Serial Interface. The FIFO configuration register
n de
determines which data is written into the FIFO. Possible choices include gyro data, accelerometer data, temperature
readings, and FSYNC input. A FIFO counter keeps track of how many bytes of valid data are contained in the FIFO. The
FIFO register supports burst reads. The interrupt function may be used to determine when new data is available.
io fi
at on
The MPU-6886 allows FIFO read in low-power accelerometer mode.
4.14 INTERRUPTS
rm C
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include the
INT and DRDY pins configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that
fo se
can trigger an interrupt are (1) Clock generator locked to new reference oscillator (used when switching clock
sources); (2) new data is available to be read (from the FIFO and Data registers); (3) accelerometer event interrupts;
In en
(4) FIFO overflow. The interrupt status can be read from the Interrupt Status register.
4.15 DIGITAL-OUTPUT TEMPERATURE SENSOR

ed nS
An on-chip temperature sensor and ADC are used to measure the MPU-6886 die temperature. The readings from the
nc ve
ADC can be read from the FIFO or the Sensor Data registers.
4.16 BIAS AND LDOS

va In
The bias and LDO section generates the internal supply and the reference voltages and currents required by the MPU-
6886. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO output is bypassed
by a capacitor at REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External
Components.
4.17 CHARGE PUMP

Ad
An on-chip charge pump generates the high voltage required for the MEMS oscillator.

Revision: 1.1
MPU-6886
4.18 STANDARD POWER MODES
The following table lists the user-accessible power modes for MPU-6886.
MODE NAME GYRO ACCEL
1 Sleep Mode Off Off
2 Standby Mode Drive On Off
3 Accelerometer Low-Power Mode Off Duty-Cycled
4 Accelerometer Low-Noise Mode Off On
5 Gyroscope Low-Power Mode Duty-Cycled Off
6 Gyroscope Low-Noise Mode On Off
7 6-Axis Low-Noise Mode On On
y
8 6-Axis Low-Power Mode Duty-Cycled On
nl
Table 11. Standard Power Modes for MPU-6886
H l-
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NOTES:
1. Power consumption for individual modes can be found in D.C. Electrical Characteristics.
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IC
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In en
ed nS
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va In
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Revision: 1.1
MPU-6886
5 PROGRAMMABLE INTERRUPTS
The MPU-6886 has a programmable interrupt system which can generate an interrupt signal on the INT and DRDY
pins. Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled individually.
INTERRUPT NAME MODULE
Motion Detection Motion
FIFO Overflow FIFO
Data Ready Sensor Registers
Table 12. Table of Interrupt Sources
For information regarding the interrupt enable/disable registers and flag registers, please refer to sections 11 and 12
y
of this document. Some interrupt sources are explained below.
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5.1 WAKE-ON-MOTION INTERRUPT
H l-
O
The MPU-6886 provides motion detection capability. A qualifying motion sample is one where the high passed sample
r G tia
from any axis has an absolute value exceeding a user-programmable threshold. The following steps explain how to
IC
configure the Wake-on-Motion Interrupt.
fo n
Step 1: Ensure that Accelerometer is running
n de
• In PWR_MGMT_1 register (0x6B) set CYCLE = 0, SLEEP = 0, and GYRO_STANDBY = 0
• In PWR_MGMT_2 register (0x6C) set STBY_XA = STBY_YA = STBY_ZA = 0, and STBY_XG = STBY_YG = STBY_ZG
=1
io fi
at on
Step 2: Set Accelerometer LPF bandwidth to 218.1 Hz
rm C
• In ACEEL_CONFIG2 register (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPF_CFG[2:0] = 1 (b001)

Step 3: Enable Motion Interrupt
fo se
• In INT_ENABLE register (0x38) set WOM_INT_EN = 111 to enable motion interrupt

In en
Step 4: Set Motion Threshold

• Set the motion threshold in ACCEL_WOM_THR register (0x1F)
ed nS
Step 5: Enable Accelerometer Hardware Intelligence

nc ve
• In ACCEL_INTEL_CTRL register (0x69) set ACCEL_INTEL_EN = ACCEL_INTEL_MODE = 1; Ensure that bit 0 is set
to 0
va In
Step 7: Set Frequency of Wake-Up

• In SMPLRT_DIV register (0x19) set SMPLRT_DIV[7:0] = 3.9 Hz – 500 Hz
Step 8: Enable Cycle Mode (Accelerometer Low-Power Mode)
• In PWR_MGMT_1 register (0x6B) set CYCLE = 1
Ad

Revision: 1.1
MPU-6886
6 DIGITAL INTERFACE
6.1 I2C AND SPI SERIAL INTERFACES
2
The internal registers and memory of the MPU-6886 can be accessed using either I C at 400 kHz or SPI at 10 MHz. SPI
operates in four-wire mode.
PIN NUMBER PIN NAME PIN DESCRIPTION
2
23 SCL / SPC I C serial clock (SCL); SPI serial clock (SPC)
2
24 SDA / SDI I C serial data (SDA); SPI serial data input (SDI)
2
9 SA0 / SDO I C Slave Address LSB (SA0); SPI serial data output (SDO)
22 CS Chip select (0 = SPI mode)
y
Table 13. Serial Interface
nl
2
6.2 I C INTERFACE
H l-
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2
I C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the lines are
r G tia
2
IC
open-drain and bi-directional. In a generalized I C interface implementation, attached devices can be a master or a
slave. The master device puts the slave address on the bus, and the slave device with the matching address
fo n
acknowledges the master.
n de
The MPU-6886 always operates as a slave device when communicating to the system processor, which thus acts as the
master. SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is 400 kHz.
io fi
The slave address of the MPU-6886 is b110100X which is 7 bits long. The LSB bit of the 7-bit address is determined by
at on
2
the logic level on pin SA0. This allows two MPU-6886s to be connected to the same I C bus. When used in this
configuration, the address of one of the devices should be b1101000 (pin SA0 is logic low) and the address of the
rm C
other should be b1101001 (pin SA0 is logic high).
6.3 I2C COMMUNICATIONS PROTOCOL

fo se
START (S) and STOP (P) Conditions

In en
2
Communication on the I C bus starts when the master puts the START condition (S) on the bus, which is defined as a
HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until
ed nS
the master puts a STOP condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while
SCL is HIGH (see figure below).
nc ve
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
va In
SDA
SCL
Ad
S P
START condition STOP condition
Figure 8. START and STOP Conditions

Revision: 1.1
MPU-6886
Data Format / Acknowledge
2
I C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data
transfer. Each byte transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge
signal is generated by the master, while the receiver generates the actual acknowledge signal by pulling down SDA and
holding it low during the HIGH portion of the acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can
hold SCL LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready, and
releases the clock line (refer to the following figure).
y
DATA OUTPUT BY
TRANSMITTER (SDA)
nl
H l-
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not acknowledge
DATA OUTPUT BY
r G tia
RECEIVER (SDA)
IC
acknowledge
fo n
n de
SCL FROM
1 2 8 9
MASTER
io fi START
clock pulse for
at on
acknowledgement
condition
2
Figure 9. Acknowledge on the I C Bus
rm C
Communications
fo se
After beginning communications with the START condition (S), the master sends a 7-bit slave address followed by an
th
8 bit, the read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the
In en
slave device. Then, the master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device.
Each byte transferred must be followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line
LOW and keeps it LOW for the high period of the SCL line. Data transmission is always terminated by the master with
ed nS
a STOP condition (P), thus freeing the communications line. However, the master can generate a repeated START
condition (Sr), and address another slave without first generating a STOP condition (P). A LOW to HIGH transition on
nc ve
the SDA line while SCL is HIGH defines the stop condition. All SDA changes should take place when SCL is low, with the
exception of start and stop conditions.
va In
SDA
Ad
SCL 1–7 8 9 1–7 8 9 1–7 8 9
S P
START ADDRESS R/W ACK DATA ACK DATA ACK STOP

condition condition
2
Figure 10. Complete I C Data Transfer

Revision: 1.1
MPU-6886
2
To write the internal MPU-6886 registers, the master transmits the start condition (S), followed by the I C address and
th
the write bit (0). At the 9 clock cycle (when the clock is high), the MPU-6886 acknowledges the transfer. Then the
master puts the register address (RA) on the bus. After the MPU-6886 acknowledges the reception of the register
address, the master puts the register data onto the bus. This is followed by the ACK signal, and data transfer may be
concluded by the stop condition (P). To write multiple bytes after the last ACK signal, the master can continue
outputting data rather than transmitting a stop signal. In this case, the MPU-6886 automatically increments the
register address and loads the data to the appropriate register. The following figures show single and two-byte write
sequences.
Single-Byte Write Sequence
y
Master S AD+W RA DATA P
nl
Slave ACK ACK ACK
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Burst Write Sequence
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IC
Master S AD+W RA DATA DATA P
fo n
Slave ACK ACK ACK ACK
2
n de
To read the internal MPU-6886 registers, the master sends a start condition, followed by the I C address and a write
bit, and then the register address that is going to be read. Upon receiving the ACK signal from the MPU-6886, the
master transmits a start signal followed by the slave address and read bit. As a result, the MPU-6886 sends an ACK
io fi
signal and the data. The communication ends with a not acknowledge (NACK) signal and a stop bit from master. The
at on
th
NACK condition is defined such that the SDA line remains high at the 9 clock cycle. The following figures show single
and two-byte read sequences.
rm C
Single-Byte Read Sequence

fo se
Master S AD+W RA S AD+R NACK P

In en
Slave ACK ACK ACK DATA

ed nS
Burst Read Sequence
Master S AD+W RA S AD+R ACK NACK P

nc ve
Slave ACK ACK ACK DATA DATA
6.4 I2C TERMS

va In
SIGNAL DESCRIPTION
S Start Condition: SDA goes from high to low while SCL is high
2
AD Slave I C address
W Write bit (0)
R Read bit (1)
Ad
th
ACK Acknowledge: SDA line is low while the SCL line is high at the 9 clock cycle
th
NACK Not-Acknowledge: SDA line stays high at the 9 clock cycle
RA MPU-6886 internal register address
DATA Transmit or received data
P Stop condition: SDA going from low to high while SCL is high
2
Table 14. I C Terms

Revision: 1.1
MPU-6886
6.5 SPI INTERFACE
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The MPU-6886 always
operates as a Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SPC), the Serial Data Output (SDO) and the Serial Data Input (SDI)
are shared among the Slave devices. Each SPI slave device requires its own Chip Select (CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line is active at a
time, ensuring that only one slave is selected at any given time. The CS lines of the non-selected slave devices are held
high, causing their SDO lines to remain in a high-impedance (high-z) state so that they do not interfere with any active
devices.
y
SPI Operational Features
nl
1. Data is delivered MSB first and LSB last
H l-
O
2. Data is latched on the rising edge of SPC
3. Data should be transitioned on the falling edge of SPC
r G tia
4. The maximum frequency of SPC is 10MHz
IC
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The first byte
fo n
contains the SPI Address, and the following byte(s) contain(s) the SPI data. The first bit of the first byte
n de
contains the Read/Write bit and indicates the Read (1) or Write (0) operation. The following 7 bits contain the
Register Address. In cases of multiple-byte Read/Writes, data is two or more bytes:
io fi SPI Address format
at on
MSB LSB
R/W A6 A5 A4 A3 A2 A1 A0
rm C
SPI Data format

fo se
MSB LSB
D7 D6 D5 D4 D3 D2 D1 D0
In en
6. Supports Single or Burst Read/Writes.

ed nS
SPC
SDI
SPI Master SPI Slave 1
nc ve
SDO
CS1 CS
CS2
va In
SPC
SDI
SDO
SPI Slave 2
CS
Ad
Figure 11. Typical SPI Master/Slave Configuration

Revision: 1.1
MPU-6886
7 REGISTER MAP
The following table lists the register map for the MPU-6886. Note that all registers are accessible in all modes of
device operation.
ADDR ADDR SERIAL
REGISTER NAME BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
(HEX) (DEC.) I/F
READ/
04 04 XG_OFFS_TC_H XG_OFFS_LP[5:0] XG_OFFS_TC_H [9:8]
WRITE
READ/
05 05 XG_OFFS_TC_L XG_OFFS_TC_L [7:0]
WRITE
READ/
07 07 YG_OFFS_TC_H YG_OFFS_LP[5:0] YG_OFFS_TC_H [9:8]
WRITE
y
nl
READ/
08 08 YG_OFFS_TC_L YG_OFFS_TC_L [7:0]
WRITE
H l-
O
READ/
0A 10 ZG_OFFS_TC_H ZG_OFFS_LP[5:0] ZG_OFFS_TC_H [9:8]
WRITE
r G tia
READ/
IC
0B 11 ZG_OFFS_TC_L ZG_OFFS_TC_L [7:0]
WRITE
READ/
fo n
0D 13 SELF_TEST_X_ACCEL XA_ST_DATA[7:0]
WRITE
n de
READ/
0E 14 SELF_TEST_Y_ACCEL YA_ST_DATA[7:0]
WRITE
READ/
0F 15 SELF_TEST_Z_ACCEL ZA_ST_DATA[7:0]
io fi
WRITE
at on
READ/
13 19 XG_OFFS_USRH X_OFFS_USR [15:8]
WRITE
READ/
14 20 XG_OFFS_USRL X_OFFS_USR [7:0]
rm C
WRITE
READ/
15 21 YG_OFFS_USRH Y_OFFS_USR [15:8]
WRITE
fo se
READ/
16 22 YG_OFFS_USRL Y_OFFS_USR [7:0]
WRITE
READ/
In en
17 23 ZG_OFFS_USRH Z_OFFS_USR [15:8]

WRITE
READ/
18 24 ZG_OFFS_USRL Z_OFFS_USR [7:0]
WRITE
ed nS
READ/
19 25 SMPLRT_DIV SMPLRT_DIV[7:0]
WRITE
READ/ FIFO_
nc ve
1A 26 CONFIG - EXT_SYNC_SET[2:0] DLPF_CFG[2:0]

WRITE MODE
READ/
1B 27 GYRO_CONFIG XG_ST YG_ST ZG_ST FS_SEL [1:0] - FCHOICE_B[1:0]
WRITE
va In
READ/
1C 28 ACCEL_CONFIG XA_ST YA_ST ZA_ST ACCEL_FS_SEL[1:0] -
WRITE
READ/ ACCEL_FCH
1D 29 ACCEL_CONFIG 2 - DEC2_CFG A_DLPF_CFG
WRITE OICE_B
READ/ GYRO_CYC
1E 30 LP_MODE_CFG G_AVGCFG[2:0] -
WRITE LE
READ/
20 32 ACCEL_WOM_X_THR WOM_X_TH[7:0]
WRITE
Ad
READ/
21 33 ACCEL_WOM_Y_THR WOM_Y_TH[7:0]
WRITE
READ/
22 34 ACCEL_WOM_Z_THR WOM_Z_TH[7:0]
WRITE
READ/ ACCEL_FIF
23 35 FIFO_EN - GYRO_FIFO_EN -
WRITE O_EN
READ to
36 54 FSYNC_INT FSYNC_INT -
CLEAR

Revision: 1.1
MPU-6886
ADDR ADDR SERIAL
(HEX) (DEC.) I/F
FSYNC
READ/ LATCH INT_RD FSYNC_INT
37 55 INT_PIN_CFG INT_LEVEL INT_OPEN _INT_MODE -
WRITE _INT_EN _CLEAR _LEVEL
_EN
FIFO
READ/ WOM_X_I WOM_Y_INT WOM_Z_INT GDRIVE_INT DATA_RDY_IN
38 56 INT_ENABLE _OFLOW - -
WRITE NT_EN _EN _EN _EN T_EN
_EN
READ to FIFO_WM_IN
39 57 FIFO_WM_INT_STATUS - -
CLEAR T
FIFO
READ to WOM_X_I DATA
3A 58 INT_STATUS WOM_Y_INT WOM_Z_INT _OFLOW - GDRIVE_INT -
CLEAR NT _RDY_INT
_INT
3B 59 ACCEL_XOUT_H READ ACCEL_XOUT[15:8]
y
3C 60 ACCEL_XOUT_L READ ACCEL_XOUT[7:0]
nl
3D 61 ACCEL_YOUT_H READ ACCEL_YOUT[15:8]
3E 62 ACCEL_YOUT_L READ ACCEL_YOUT[7:0]
H l-
O
3F 63 ACCEL_ZOUT_H READ ACCEL_ZOUT[15:8]
40 64 ACCEL_ZOUT_L READ ACCEL_ZOUT[7:0]
r G tia
IC
41 65 TEMP_OUT_H READ TEMP_OUT[15:8]
42 66 TEMP_OUT_L READ TEMP_OUT[7:0]
fo n
43 67 GYRO_XOUT_H READ GYRO_XOUT[15:8]
n de
44 68 GYRO_XOUT_L READ GYRO_XOUT[7:0]
45 69 GYRO_YOUT_H READ GYRO_YOUT[15:8]
46 70 GYRO_YOUT_L
io fi
READ GYRO_YOUT[7:0]
at on
47 71 GYRO_ZOUT_H READ GYRO_ZOUT[15:8]
48 72 GYRO_ZOUT_L READ GYRO_ZOUT[7:0]
READ/
rm C
50 80 SELF_TEST_X_GYRO XG_ST_DATA[7:0]
WRITE
READ/
51 81 SELF_TEST_Y_GYRO YG_ST_DATA[7:0]
WRITE
fo se
READ/
52 82 SELF_TEST_Z_GYRO ZG_ST_DATA[7:0]
WRITE
In en
READ/
53 83 E_ID0 ENGINEERING_ID0[7:0]
WRITE
READ/
ed nS
WRITE
READ/
WRITE
nc ve
READ/
WRITE
READ/
va In
WRITE
READ/
WRITE
READ/
WRITE
READ/
60 96 FIFO_WM_TH1 - FIFO_WM_TH[9:8]
WRITE
READ/
61 97 FIFO_WM_TH2 FIFO_WM_TH[7:0]
WRITE
Ad
READ/ ACCEL TEMP

68 104 SIGNAL_PATH_RESET -
WRITE _RST _RST
READ/ ACCEL_INT ACCEL_INTEL OUTPUT_LIMI WOM_TH_MO

69 105 ACCEL_INTEL_CTRL -
WRITE EL_EN _MODE T DE
READ/ FIFO SIG_COND

6A 106 USER_CTRL - FIFO_EN - -
WRITE _RST _RST
READ/ DEVICE_RE GYRO_

6B 107 PWR_MGMT_1 SLEEP CYCLE TEMP_DIS CLKSEL[2:0]
WRITE SET STANDBY
READ/
6C 108 PWR_MGMT_2 - STBY_XA STBY_YA STBY_ZA STBY_XG STBY_YG STBY_ZG
WRITE

Revision: 1.1
MPU-6886
ADDR ADDR SERIAL
(HEX) (DEC.) I/F
READ/
70 112 I2C_IF - I2C_IF_DIS -
WRITE
72 114 FIFO_COUNTH READ FIFO_COUNT[15:8]
73 115 FIFO_COUNTL READ FIFO_COUNT[7:0]
READ/
74 116 FIFO_R_W FIFO_DATA[7:0]
WRITE
75 117 WHO_AM_I READ WHOAMI[7:0]
READ/
77 119 XA_OFFSET_H XA_OFFS [14:7]
WRITE
READ/
78 120 XA_OFFSET_L XA_OFFS [6:0] -
WRITE
y
READ/
7A 122 YA_OFFSET_H YA_OFFS [14:7]
nl
WRITE
READ/
7B 123 YA_OFFSET_L YA_OFFS [6:0] -
H l-
WRITE
O
READ/
7D 125 ZA_OFFSET_H ZA_OFFS [14:7]
WRITE
r G tia
IC
READ/
7E 126 ZA_OFFSET_L ZA_OFFS [6:0] -
WRITE
fo n
Table 15. MPU-6886 Register Map
n de
NOTE: Register Names ending in _H and _L contain the high and low bytes, respectively, of an internal register value.
The reset value is 0x00 for all registers other than the registers below, also the self-test registers contain pre-
io fi
programmed values and will not be 0x00 after reset.
at on
• Register 26 (0x80) CONFIG
rm C
• Register 107 (0x41) Power Management 1

• Register 117 (0x19) WHO_AM_I
fo se
In en
ed nS
nc ve
va In
Ad

Revision: 1.1
MPU-6886
8 REGISTER DESCRIPTIONS
This section describes the function and contents of each register within the MPU-6886.
NOTE: The device will come up in sleep mode upon power-up.
8.1 REGISTER 04 – GYROSCOPE LOW NOISE TO LOW POWER OFFSET SHIFT AND GYROSCOPE
OFFSET TEMPERATURE COMPENSATION (TC) REGISTER
Register Name: XG_OFFS_TC_H
Register Type: READ/WRITE
Register Address: 04 (Decimal); 04 (Hex)
y
nl
BIT NAME FUNCTION
Stores the offset shift in the gyroscope output from low noise mode to low
H l-
O
[7:2] XG_OFFS_LP[5:0] power mode to be implemented as a correction in the customer software. 2’s
complement digital code, 0.125 dps/LSB from 3.875 dps to -4 dps.
r G tia
IC
[1:0] XG_OFFS_TC_H[9:8] Bits 9 and 8 of the 10-bit offset of X gyroscope (2’s complement)
fo n
n de
Register Name: XG_OFFS_TC_L io fi
at on
BIT NAME FUNCTION
rm C
[7:0] XG_OFFS_TC_L[7:0]] Bits 7 to 0 of the 10-bit offset of X gyroscope (2’s complement).

fo se
Description:
The temperature compensation (TC) registers are used to reduce gyro offset variation due to temperature change.
In en
The TC feature is always enabled. However the compensation only happens when a TC coefficient is programed
during factory trim which gets loaded into these registers at power up or after a DEVICE_RESET. If these registers
ed nS
contain a value of zero, temperature compensation has no effect on the offset of the chip. The TC registers have a
10-bit magnitude and sign adjustment in all full scale modes with a resolution of 2.52 mdps/C steps.
nc ve
If these registers contain a non-zero value after power up, the user may write zeros to them to see the offset values
without TC with temperature variation. Note that doing so may result in offset values that exceed data sheet “Initial
ZRO Tolerance” in other than normal ambient temperature (~25 °C). The TC coefficients maybe restored by the user
va In
with a power up or a DEVICE_RESET.

The above description also applies to registers 7-8 and 10-11 in sections 8.3, 8.4, 8.5, and 8.6.
Ad

Revision: 1.1
MPU-6886
Register Name: YG_OFFS_TC_H
BIT NAME FUNCTION
[7:2] YG_OFFS_LP[5:0] power mode to be implemented as a correction in the customer software. 2’s
[1:0] YG_OFFS_TC_H[9:8] Bits 9 and 8 of the 10-bit offset of Y gyroscope (2’s complement).
y
nl
H l-
O
Register Name: YG_OFFS_TC_L
r G tia
IC
fo n
n de
BIT NAME FUNCTION
[7:0] YG_OFFS_TC_L[7:0]] Bits 7 to 0 of the 10-bit offset of Y gyroscope (2’s complement).
io fi
at on
Register Name: ZG_OFFS_TC_H
rm C

fo se
Register Address: 10 (Decimal); 0A (Hex)

BIT NAME FUNCTION
In en
[7:2] ZG_OFFS_LP[5:0] power mode to be implemented as a correction in the customer software. 2’s
ed nS
[1:0] ZG_OFFS_TC_H[9:8] Bits 9 and 8 of the 10-bit offset of Z gyroscope (2’s complement).
nc ve

va In
Register Name: ZG_OFFS_TC_L

Register Address: 11 (Decimal); 0B (Hex)
BIT NAME FUNCTION
[7:0] ZG_OFFS_TC_L[7:0]] Bits 7 to 0 of the 10-bit offset of Z gyroscope (2’s complement).
Ad

Revision: 1.1
MPU-6886
8.7 REGISTERS 13 TO 15 – ACCELEROMETER SELF-TEST REGISTERS
Register Name: SELF_TEST_X_ACCEL, SELF_TEST_Y_ACCEL, SELF_TEST_Z_ACCEL
Type: READ/WRITE
Register Address: 13, 14, 15 (Decimal); 0D, 0E, 0F (Hex)
REGISTER BITS NAME FUNCTION
The value in this register indicates the self-test output
generated during manufacturing tests. This value is to be used
SELF_TEST_X_ACCEL [7:0] XA_ST_DATA[7:0]
to check against subsequent self-test outputs performed by the
end user.
y
SELF_TEST_Y_ACCEL [7:0] YA_ST_DATA[7:0]
nl
end user.
H l-
O
r G tia
SELF_TEST_Z_ACCEL [7:0] ZA_ST_DATA[7:0]
IC
end user.
fo n
The equation to convert self-test codes in OTP to factory self-test measurement is:
n de
ST _ OTP = ( 2620 / 2 FS ) * 1.01( ST _ code−1) (lsb)
io fi
where ST_OTP is the value that is stored in OTP of the device, FS is the Full Scale value, and ST_code is based on the
at on
Self-Test value (ST_ FAC) determined in InvenSense’s factory final test and calculated based on the following equation:
log(ST _ FAC /(2620 / 2 FS ))

ST _ code = round ( ) +1
rm C
log(1.01)
fo se
8.8 REGISTER 19 – X-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE

In en
Register Name: XG_OFFS_USRH

ed nS

BIT NAME FUNCTION
nc ve
Bits 15 to 8 of the 16-bit offset of X gyroscope (2’s complement). This register is

[7:0] X_OFFS_USR[15:8] used to remove DC bias from the sensor output. The value in this register is
added to the gyroscope sensor value before going into the sensor register.
va In
8.9 REGISTER 20 – X-GYRO OFFSET ADJUSTMENT REGISTER – LOW BYTE

Register Name: XG_OFFS_USRL
BIT NAME FUNCTION
Ad
Bits 7 to 0 of the 16-bit offset of X gyroscope (2’s complement). This register is

[7:0] X_OFFS_USR[7:0] used to remove DC bias from the sensor output. The value in this register is

Revision: 1.1
MPU-6886
8.10 REGISTER 21 – Y-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE
Register Name: YG_OFFS_USRH
BIT NAME FUNCTION
Bits 15 to 8 of the 16-bit offset of Y gyroscope (2’s complement). This register is
[7:0] Y_OFFS_USR[15:8] used to remove DC bias from the sensor output. The value in this register is
8.11 REGISTER 22 – Y-GYRO OFFSET ADJUSTMENT REGISTER – LOW BYTE
y
Register Name: YG_OFFS_USRL
nl
H l-
O
r G tia
BIT NAME FUNCTION
IC
Bits 7 to 0 of the 16-bit offset of Y gyroscope (2’s complement). This register is
[7:0] Y_OFFS_USR[7:0] used to remove DC bias from the sensor output. The value in this register is
fo n
n de
8.12 REGISTER 23 – Z-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE
io fi
Register Name: ZG_OFFS_USRH
at on
rm C
BIT NAME FUNCTION

Bits 15 to 8 of the 16-bit offset of Z gyroscope (2’s complement). This register is
fo se
[7:0] Z_OFFS_USR[15:8] used to remove DC bias from the sensor output. The value in this register is
In en
8.13 REGISTER 24 – Z-GYRO OFFSET ADJUSTMENT REGISTER – LOW BYTE

ed nS
Register Name: ZG_OFFS_USRL

nc ve

BIT NAME FUNCTION
va In
Bits 7 to 0 of the 16-bit offset of Z gyroscope (2’s complement). This register is

[7:0] Z_OFFS_USR[7:0] used to remove DC bias from the sensor output. The value in this register is
8.14 REGISTER 25 – SAMPLE RATE DIVIDER

Register Name: SMPLRT_DIV
Ad

BIT NAME FUNCTION
[7:0] SMPLRT_DIV[7:0] Divides the internal sample rate (see register CONFIG) to generate the sample rate that
controls sensor data output rate, FIFO sample rate. NOTE: This register is only effective when
FCHOICE_B register bits are 2’b00, and (0 < DLPF_CFG < 7).
This is the update rate of the sensor register:
SAMPLE_RATE = INTERNAL_SAMPLE_RATE / (1 + SMPLRT_DIV)
Where INTERNAL_SAMPLE_RATE = 1 kHz

Revision: 1.1
MPU-6886
8.15 REGISTER 26 – CONFIGURATION
Register Name: CONFIG
BIT NAME FUNCTION
[7] - Default configuration value is 1. User should set it to 0.
[6] FIFO_MODE When set to ‘1’, when the FIFO is full, additional writes will not be written to FIFO.
When set to ‘0’, when the FIFO is full, additional writes will be written to the FIFO, replacing
the oldest data.
[5:3] EXT_SYNC_SET[2:0] Enables the FSYNC pin data to be sampled.
y
EXT_SYNC_SET FSYNC BIT LOCATION
nl
0 function disabled
1 TEMP_OUT_L[0]
H l-
O
2 GYRO_XOUT_L[0]
3 GYRO_YOUT_L[0]
r G tia
4 GYRO_ZOUT_L[0]
IC
5 ACCEL_XOUT_L[0]
6 ACCEL_YOUT_L[0]
fo n
7 ACCEL_ZOUT_L[0]
n de
FSYNC will be latched to capture short strobes. This will be done such that if FSYNC toggles,
the latched value toggles, but won’t toggle again until the new latched value is captured by
the sample rate strobe.
[2:0] DLPF_CFG[2:0]
io fi For the DLPF to be used, FCHOICE_B[1:0] is 2’b00.
at on
See Table 16.
The DLPF is configured by DLPF_CFG, when FCHOICE_B [1:0] = 2b’00. The gyroscope and temperature sensor are
rm C
filtered according to the value of DLPF_CFG and FCHOICE_B as shown in the table below.
fo se
TEMPERATURE
FCHOICE_B GYROSCOPE
SENSOR
DLPF_CFG
In en
3-DB BW NOISE BW RATE

<1> <0> 3-DB BW (HZ)
(HZ) (HZ) (KHZ)
ed nS
X 1 X 8173 8595.1 32 4000

1 0 X 3281 3451.0 32 4000
0 0 0 250 306.6 8 4000
nc ve
0 0 1 176 177.0 1 188

0 0 2 92 108.6 1 98
va In
0 0 3 41 59.0 1 42
0 0 4 20 30.5 1 20
0 0 5 10 15.6 1 10
0 0 6 5 8.0 1 5
0 0 7 3281 3451.0 8 4000
Table 16. Configuration

Ad

Revision: 1.1
MPU-6886
8.16 REGISTER 27 – GYROSCOPE CONFIGURATION
Register Name: GYRO_CONFIG
BIT NAME FUNCTION
[7] XG_ST X Gyro self-test.
[6] YG_ST Y Gyro self-test.
[5] ZG_ST Z Gyro self-test.
Gyro Full Scale Select:
00 = ±250 dps.
y
[4:3] FS_SEL[1:0] 01= ±500 dps.
nl
10 = ±1000 dps.
11 = ±2000 dps.
H l-
O
[2] - Reserved.
[1:0] FCHOICE_B[1:0] Used to bypass DLPF as shown in Table 16.
r G tia
IC
8.17 REGISTER 28 – ACCELEROMETER CONFIGURATION
fo n
Register Name: ACCEL_CONFIG
n de
Register Address: 28 (Decimal); 1C (Hex)
io fi
BIT NAME FUNCTION
at on
[7] XA_ST X Accel self-test.
[6] YA_ST Y Accel self-test.
rm C
[5] ZA_ST Z Accel self-test.

Accel Full Scale Select:
[4:3] ACCEL_FS_SEL[1:0]
fo se
±2g (00), ±4g (01), ±8g (10), ±16g (11)

[2:0] - Reserved.
In en
8.18 REGISTER 29 – ACCELEROMETER CONFIGURATION 2

ed nS
Register Name: ACCEL_CONFIG2

nc ve
Register Address: 29 (Decimal); 1D (Hex)

BIT NAME FUNCTION
va In
Averaging filter settings for Low Power Accelerometer mode:

0 = Average 4 samples.
[5:4] DEC2_CFG[1:0] 1 = Average 8 samples.
[3] ACCEL_FCHOICE_B Used to bypass DLPF as shown in the table below.
[2:0] A_DLPF_CFG Accelerometer low pass filter setting as shown in Table 18.
Ad
ACCELEROMETER
ACCEL_FCHOICE_B A_DLPF_CFG 3-DB BW NOISE BW RATE
(HZ) (HZ) (KHZ)
1 X 1046.0 1100.0 4
0 0 218.1 235.0 1
0 1 218.1 235.0 1
0 2 99.0 121.3 1

Revision: 1.1
MPU-6886
ACCELEROMETER
ACCEL_FCHOICE_B A_DLPF_CFG 3-DB BW NOISE BW RATE
(HZ) (HZ) (KHZ)
0 3 44.8 61.5 1
0 4 21.2 31.0 1
0 5 10.2 15.5 1
0 6 5.1 7.8 1
0 7 420.0 441.6 1
Table 17. Accelerometer Data Rates and Bandwidths (Low-Noise Mode)
The data output rate of the DLPF filter block can be further reduced by a factor of 1/(1+SMPLRT_DIV), where
y
SMPLRT_DIV is an 8-bit integer. Following is a small subset of ODRs that are configurable for the accelerometer in the
nl
low-noise mode in this manner (Hz):
H l-
O
3.91, 7.81, 15.63, 31.25, 62.50, 125, 250, 500, 1K
r G tia
The following table lists the approximate accelerometer filter bandwidths available in the low-power mode of
IC
operation for some example ODRs.
fo n
In the low-power mode of operation, the accelerometer is duty-cycled. Table 18 shows some example configurations
n de
for accelerometer low power mode.
AVERAGES 1x 4x 8x 16x 32x
io fi
at on
ACCEL_FCHOICE_B 1 0 0 0 0
DEC2_CFG X 0 1 2 3
rm C
A_DLPF_CFG X 7 7 7 7
TON (MS) 1.084 1.84 2.84 4.84 8.84
fo se
NBW (HZ) 1100 442 236 122 62

3-DB BW (HZ) 1046 420 219 111 56
In en
NOISE
4.8 3.0 2.2 1.6 1.1
(MG-RMS)
ed nS
ODR LOW-POWER ACCELEROMETER MODE CURRENT

SMPLRT_DIV
(HZ) CONSUMPTION (µA)
nc ve
255 3.91 9.4 10.2 11.5 13.8 18.5

127 7.81 10.7 12.4 14.7 19.6 28.9
va In
99 10 11.4 13.7 16.6 22.6 34.7

63 15.63 13.3 16.7 21.5 30.8 49.7
31 31.25 18.3 25.4 34.8 53.6 91.2
19 50 24.4 35.8 50.8 80.8 141.1
15 62.5 28.4 42.7 61.5 99.0 174.3
Ad
9 100 40.7 63.5 93.6 153.7 303.3

7 125 48.8 77.4 114.8 190.1
N/A
4 200 73.4 118.8 178.9 299.3
3 250 89.6 146.5 221.6 N/A
1 500 171.1 284.9 N/A
Table 18. Approximate Accelerometer Filter Bandwidths (Low-Power Mode)

Revision: 1.1
MPU-6886
8.19 REGISTER 30 – GYROSCOPE LOW POWER MODE CONFIGURATION
Register Name: LP_MODE_CFG
Register Address: 30 (Decimal); 1E (Hex)
BIT NAME FUNCTION
[7] GYRO_CYCLE When set to ‘1’ low-power gyroscope mode is enabled. Default setting is ‘0’.
Averaging filter configuration for low-power gyroscope mode. Default setting
[6:4] G_AVGCFG[2:0]
is ‘000’.
[3:0] - Reserved.
To operate in gyroscope low-power mode or 6-axis low-power mode, GYRO_CYCLE should be set to ‘1.’ Gyroscope
y
filter configuration is determined by G_AVGCFG[2:0] that sets the averaging filter configuration. It is not dependent
nl
on DLPF_CFG[2:0].
H l-
O
AVERAGES 1X 2X 4X 8X 16X 32X 64X 128X
r G tia
G_AVGCFG 0 1 2 3 4 5 6 7
IC
NBW (HZ) 650.8 407.1 224.2 117.4 60.2 30.6 15.6 8.0
fo n
3-DB BW (HZ) 622 391 211 108 54 27 14 7
n de
SMPLRT_DIV ODR (HZ) LOW-POWER GYROSCOPE MODE CURRENT CONSUMPTION (MA)
255 3.9 0.79
io fi 0.80 0.80 0.82 0.85 0.90 1.01 1.23
99 10.0 0.81 0.82 0.84 0.87 0.95 1.09 1.37 1.94
at on
65 15.2 0.83 0.84 0.87 0.92 1.03 1.24 1.67 2.53
64 15.4 0.83 0.84 0.87 0.92 1.03 1.25 1.69 N/A
rm C
33 29.4 0.87 0.90 0.95 1.05 1.26 1.68 2.51 N/A

32 30.3 0.87 0.90 0.95 1.06 1.28 1.70 N/A N/A
fo se
19 50.0 0.93 0.98 1.06 1.24 1.60 2.30 N/A N/A

17 55.6 0.95 1.00 1.10 1.29 1.69 2.47 N/A N/A
In en
16 58.8 0.96 1.01 1.11 1.32 1.74 N/A N/A N/A

9 100.0 1.08 1.17 1.35 1.70 2.41 N/A N/A N/A
ed nS
7 125.0 1.16 1.27 1.49 1.93 N/A N/A N/A N/A

6 142.9 1.21 1.34 1.59 2.09 N/A N/A N/A N/A
4 200.0 1.38 1.56 1.91 N/A N/A N/A N/A N/A
nc ve
3 250.0 1.53 1.75 2.19 N/A N/A N/A N/A N/A

2 333.3 1.78 2.07 N/A N/A N/A N/A N/A N/A
va In
Table 19. Example Gyroscope Configurations (Low-Power Mode)
8.20 REGISTER 32 – WAKE-ON MOTION THRESHOLD (X-AXIS ACCELEROMETER)

Register Name: ACCEL_WOM_X_THR
Ad
BIT NAME FUNCTION

This register holds the threshold value for the Wake on Motion Interrupt for X-axis
[7:0] WOM_X_TH[7:0]
accelerometer.

Revision: 1.1
MPU-6886
8.21 REGISTER 33 – WAKE-ON MOTION THRESHOLD (Y-AXIS ACCELEROMETER)
Register Name: ACCEL_WOM_Y_THR
BIT NAME FUNCTION
This register holds the threshold value for the Wake on Motion Interrupt for Y-axis
[7:0] WOM_Y_TH[7:0]
accelerometer.
8.22 REGISTER 34 – WAKE-ON MOTION THRESHOLD (Z-AXIS ACCELEROMETER)

Register Name: ACCEL_WOM_Z_THR
y
nl
H l-
O
BIT NAME FUNCTION
r G tia
This register holds the threshold value for the Wake on Motion Interrupt for Z-axis
IC
[7:0] WOM_Z_TH[7:0]
accelerometer.
fo n
8.23 REGISTER 35 – FIFO ENABLE
n de
Register Name: FIFO_EN
io fi
at on
BIT NAME FUNCTION
rm C
[7:5] - Reserved.
1 – Write TEMP_OUT_H, TEMP_OUT_L, GYRO_XOUT_H, GYRO_XOUT_L, GYRO_YOUT_H,
GYRO_YOUT_L, GYRO_ZOUT_H, and GYRO_ZOUT_L to the FIFO at the sample rate; If enabled,
fo se
[4] GYRO_FIFO_EN
buffering of data occurs even if data path is in standby.
0 – Function is disabled.
In en
1 – Write ACCEL_XOUT_H, ACCEL_XOUT_L, ACCEL_YOUT_H, ACCEL_YOUT_L, ACCEL_ZOUT_H,

[3] ACCEL_FIFO_EN ACCEL_ZOUT_L, TEMP_OUT_H, and TEMP_OUT_L to the FIFO at the sample rate;
ed nS
[2:0] - Reserved.
NOTE: If both GYRO_FIFO_EN And ACCEL_FIFO_EN are 1, write ACCEL_XOUT_H, ACCEL_XOUT_L, ACCEL_YOUT_H, ACCEL_YOUT_L, ACCEL_ZOUT_H,
nc ve
ACCEL_ZOUT_L, TEMP_OUT_H, TEMP_OUT_L, GYRO_XOUT_H, GYRO_XOUT_L, GYRO_YOUT_H, GYRO_YOUT_L, GYRO_ZOUT_H, and GYRO_ZOUT_L
to the FIFO at the sample rate.
va In
8.24 REGISTER 54 – FSYNC INTERRUPT STATUS

Register Name: FSYNC_INT
Register Type: READ to CLEAR
BIT NAME FUNCTION
Ad
This bit automatically sets to 1 when a FSYNC interrupt has been generated. The bit
[7] FSYNC_INT
clears to 0 after the register has been read.

Revision: 1.1
MPU-6886
8.25 REGISTER 55 – INT/DRDY PIN / BYPASS ENABLE CONFIGURATION
Register Name: INT_PIN_CFG
BIT NAME FUNCTION
1 – The logic level for INT/DRDY pin is active low.
[7] INT_LEVEL
0 – The logic level for INT/DRDY pin is active high.
1 – INT/DRDY pin is configured as open drain.
[6] INT_OPEN
0 – INT/DRDY pin is configured as push-pull.
1 – INT/DRDY pin level held until interrupt status is cleared.
[5] LATCH_INT_EN
y
0 – INT/DRDY pin indicates interrupt pulse’s width is 50 µs.
nl
1 – Interrupt status is cleared if any read operation is performed.
[4] INT_RD_CLEAR
0 – Interrupt status is cleared only by reading INT_STATUS register.
H l-
O
1 – The logic level for the FSYNC pin as an interrupt is active low.
[3] FSYNC_INT_LEVEL
0 – The logic level for the FSYNC pin as an interrupt is active high.
r G tia
IC
When this bit is equal to 1, the FSYNC pin will trigger an interrupt when it transitions to
[2] FSYNC_INT_MODE_EN the level specified by FSYNC_INT_LEVEL. When this bit is equal to 0, the FSYNC pin is
fo n
disabled from causing an interrupt.
n de
[1:0] - Reserved.
8.26 REGISTER 56 – INTERRUPT ENABLE

io fi
Register Name: INT_ENABLE
at on
rm C
BIT NAME FUNCTION

fo se
[7] WOM_X_INT_EN 1 – Enable WoM interrupt on X-axis accelerometer. Default setting is 0.

[6] WOM_Y_INT_EN 1 – Enable WoM interrupt on Y-axis accelerometer. Default setting is 0.
[5] WOM_Z_INT_EN 1 – Enable WoM interrupt on Z-axis accelerometer. Default setting is 0.
In en
1 – Enables a FIFO buffer overflow to generate an interrupt.

[4] FIFO_OFLOW_EN
ed nS
[3] - Reserved.
[2] GDRIVE_INT_EN Gyroscope Drive System Ready interrupt enable.
[1] - Reserved.
nc ve
[0] DATA_RDY_INT_EN Data ready interrupt enable.
8.27 REGISTER 57 – FIFO WATERMARK INTERRUPT STATUS

va In
Register Name: FIFO_WM_INT_STATUS

BIT NAME FUNCTION
[6] FIFO_WM_INT FIFO Watermark interrupt status. Cleared on Read.
Ad

Revision: 1.1
MPU-6886
8.28 REGISTER 58 – INTERRUPT STATUS
Register Name: INT_STATUS
BIT NAME FUNCTION
[7] WOM_X_INT X-axis accelerometer WoM interrupt status. Cleared on Read.
[6] WOM_Y_INT Y-axis accelerometer WoM interrupt status. Cleared on Read.
[5] WOM_Z_INT Z-axis accelerometer WoM interrupt status. Cleared on Read.
This bit automatically sets to 1 when a FIFO buffer overflow has been generated. The bit
[4] FIFO_OFLOW_INT
clears to 0 after the register has been read.
y
[3] - Reserved.
nl
[2] GDRIVE_INT Gyroscope Drive System Ready interrupt.
H l-
[1] - Reserved.
O
This bit automatically sets to 1 when a Data Ready interrupt is generated. The bit clears
[0] DATA_RDY_INT
r G tia
to 0 after the register has been read.
IC
8.29 REGISTERS 59 TO 64 – ACCELEROMETER MEASUREMENTS
fo n
Register Name: ACCEL_XOUT_H
n de
Register Type: READ only
io fi
at on
BIT NAME FUNCTION
[7:0] ACCEL_XOUT[15:8] High byte of accelerometer x-axis data.
rm C
Register Name: ACCEL_XOUT_L

fo se

BIT NAME FUNCTION
In en
[7:0] ACCEL_XOUT[7:0] Low byte of accelerometer x-axis data.

Register Name: ACCEL_YOUT_H
ed nS

nc ve
BIT NAME FUNCTION

[7:0] ACCEL_YOUT[15:8] High byte of accelerometer y-axis data.
va In
Register Name: ACCEL_YOUT_L

BIT NAME FUNCTION
[7:0] ACCEL_YOUT[7:0] Low byte of accelerometer y-axis data.
Ad
Register Name: ACCEL_ZOUT_H

Register Address: 63 (Decimal); 3F (Hex)
BIT NAME FUNCTION
[7:0] ACCEL_ZOUT[15:8] High byte of accelerometer z-axis data.

Revision: 1.1
MPU-6886
Register Name: ACCEL_ZOUT_L
BIT NAME FUNCTION
[7:0] ACCEL_ZOUT[7:0] Low byte of accelerometer z-axis data.
8.30 REGISTERS 65 AND 66 – TEMPERATURE MEASUREMENT

Register Name: TEMP_OUT_H
y
BIT NAME FUNCTION
nl
[7:0] TEMP_OUT[15:8] Low byte of the temperature sensor output
H l-
O
Register Name: TEMP_OUT_L
r G tia
IC
fo n
BIT NAME FUNCTION
n de
High byte of the temperature sensor output
TEMP_degC = (TEMP_OUT[15:0]/Temp_Sensitivity) +
[7:0] TEMP_OUT[7:0]
io fi RoomTemp_Offset
where Temp_Sensitivity = 326.8 LSB/ºC and
at on
RoomTemp_Offset = 25ºC
8.31 REGISTERS 67 TO 72 – GYROSCOPE MEASUREMENTS

rm C
Register Name: GYRO_XOUT_H

fo se

In en
BIT NAME FUNCTION

[7:0] GYRO_XOUT[15:8] High byte of the X-Axis gyroscope output.
ed nS
Register Name: GYRO_XOUT_L

nc ve

BIT NAME FUNCTION
va In
Low byte of the X-Axis gyroscope output

GYRO_XOUT = Gyro_Sensitivity * X_angular_rate
[7:0] GYRO_XOUT[7:0]
Nominal FS_SEL = 0
Conditions Gyro_Sensitivity = 131 LSB/(dps)
Register Name: GYRO_YOUT_H
Ad

BIT NAME FUNCTION
[7:0] GYRO_YOUT[15:8] High byte of the Y-Axis gyroscope output.

Revision: 1.1
MPU-6886
Register Name: GYRO_YOUT_L
BIT NAME FUNCTION
Low byte of the Y-Axis gyroscope output
GYRO_YOUT = Gyro_Sensitivity * Y_angular_rate
[7:0] GYRO_YOUT[7:0]
Nominal FS_SEL = 0
Register Name: GYRO_ZOUT_H
y
nl
BIT NAME FUNCTION
[7:0] GYRO_ZOUT[15:8] High byte of the Z-Axis gyroscope output.
H l-
O
Register Name: GYRO_ZOUT_L
r G tia
IC
fo n
BIT NAME FUNCTION
n de
Low byte of the Z-Axis gyroscope output
GYRO_ZOUT = Gyro_Sensitivity * Z_angular_rate
[7:0] GYRO_ZOUT[7:0]
io fi Nominal FS_SEL = 0
at on
8.32 REGISTERS 80 TO 82 – GYROSCOPE SELF-TEST REGISTERS

rm C
Register Name: SELF_TEST_X_GYRO, SELF_TEST_Y_GYRO, SELF_TEST_Z_GYRO

Type: READ/WRITE
fo se
Register Address: 80, 81, 82 (Decimal); 50, 51, 52 (Hex)

In en
REGISTER BIT NAME FUNCTION

The value in this register indicates the self-test output generated
SELF_TEST_X_GYRO [7:0] XG_ST_DATA[7:0] during manufacturing tests. This value is to be used to check
ed nS
against subsequent self-test outputs performed by the end user.

nc ve
SELF_TEST_Y_GYRO [7:0] YG_ST_DATA[7:0] during manufacturing tests. This value is to be used to check
va In
SELF_TEST_Z_GYRO [7:0] ZG_ST_DATA[7:0] during manufacturing tests. This value is to be used to check
The equation to convert self-test codes in OTP to factory self-test measurement is:
ST _ OTP = ( 2620 / 2 FS ) * 1.01( ST _ code−1) (lsb)

where ST_OTP is the value that is stored in OTP of the device, FS is the Full Scale value, and ST_code is based on the
Ad
Self-Test value (ST_ FAC) determined in InvenSense’s factory final test and calculated based on the following equation:
log(ST _ FAC /(2620 / 2 FS ))

ST _ code = round ( ) +1
log(1.01)
8.33 REGISTERS 83 TO 90 – ENGINEERING ID REGISTERS
Register Name: E_ID0 – E_ID6

Revision: 1.1
MPU-6886
Type: READ/WRITE
Register Address: 83 - 89 (Decimal); 53 – 59 (Hex)
REGISTER BIT NAME FUNCTION
E_ID0 [7:0] ENGINEERING_ID0[7:0] Engineering ID.
8.34 REGISTER 96-97 – FIFO WATERMARK THRESHOLD IN NUMBER OF BYTES
y
nl
Register Name: FIFO_WM_TH1
H l-
O
r G tia
IC
BIT NAME FUNCTION
FIFO watermark threshold in number of bytes. Watermark interrupt is
fo n
[1:0] FIFO_WM_TH[9:8]
disabled if the threshold is set to “0”. Default value is 00000000.
n de
Register Name: FIFO_WM_TH2
io fi
at on
BIT NAME FUNCTION
rm C
FIFO watermark threshold in number of bytes. Watermark interrupt is

[7:0] FIFO_WM_TH[7:0]
disabled if the threshold is set to “0”. Default value is 00000000.
fo se
The register FIFO_WM_TH[9:0] sets the FIFO watermark threshold level (0 - 1023). User should ensure that bit 7 of
register 0x1A is set to 0 before using this feature. When the FIFO count is at or above the watermark level
In en
(FIFO_COUNT[15:0] ≥ FIFO_WM_TH[9:0]) and the system is not in the middle of a FIFO read, an interrupt is triggered.
The interrupt will set the FIFO watermark interrupt status register field FIFO_WM_INT = 1, and the INT pin will issue a
pulse if configured in pulse mode, or set to the active level if configured in latch mode. Register bit FIFO_WM_INT is
ed nS
not read-to-clear, unlike the other interrupts. Rather, whenever FIFO_R_W register is read, FIFO_WM_INT status bit is
cleared automatically. At the same time, the INT pin will be cleared as well if it is configured in latch mode.
nc ve
The FIFO watermark interrupt and the INT pin are cleared upon the first read (and only the first read) of the FIFO. If, at
the end of the FIFO read, the FIFO count is at or above the watermark level, the interrupt status bit and INT pin will
va In
again be set. If the INT pin is configured for latched operation, it will wait until the host completes the read to set to
the active level.
When FIFO_WM_TH = 0, the FIFO watermark interrupt is disabled.
Ad

Revision: 1.1
MPU-6886
8.35 REGISTER 104 – SIGNAL PATH RESET
Register Name: SIGNAL_PATH_RESET
BIT NAME FUNCTION
[7:2] - Reserved.
Reset accel digital signal path. NOTE: Sensor registers are not cleared. Use SIG_COND_RST to clear
[1] ACCEL_RST
sensor registers.
Reset temp digital signal path. NOTE: Sensor registers are not cleared. Use SIG_COND_RST to clear
[0] TEMP_RST
sensor registers.
y
8.36 REGISTER 105 – ACCELEROMETER INTELLIGENCE CONTROL
nl
Register Name: ACCEL_INTEL_CTRL
H l-
O
r G tia
IC
BIT NAME FUNCTION
fo n
[7] ACCEL_INTEL_EN This bit enables the Wake-on-Motion detection logic.
n de
0 – Do not use.
[6] ACCEL_INTEL_MODE
1 – Compare the current sample with the previous sample.
io fi
[5:2] - Reserved.
at on
To avoid limiting sensor output to less than 0x7F7F, set this bit to 1. This should be done
[1] OUTPUT_LIMIT
every time the MPU-6886 is powered up.
0 – Set WoM interrupt on the OR of all enabled accelerometer thresholds.
rm C
[0] WOM_TH_MODE 1 – Set WoM interrupt on the AND of all enabled accelerometer threshold.
Default setting is 0.
fo se
8.37 REGISTER 106 – USER CONTROL

In en
Register Name: USER_CTRL

ed nS

BIT NAME FUNCTION
nc ve
[7] - Reserved.
1 – Enable FIFO operation mode.
[6] FIFO_EN
va In
0 – Disable FIFO access from serial interface.

[5] - Reserved.
[4] - Reserved.
[3] - Reserved.
1 – Reset FIFO module. Reset is asynchronous. This bit auto clears after one clock cycle of the
[2] FIFO_RST
internal 20 MHz clock.
[1] - Reserved.
1 – Reset all gyro digital signal path, accel digital signal path, and temp digital signal path.
Ad
[0] SIG_COND_RST
This bit also clears all the sensor registers.

Revision: 1.1
MPU-6886
8.38 REGISTER 107 – POWER MANAGEMENT 1
Register Name: PWR_MGMT_1
BIT NAME FUNCTION
1 – Reset the internal registers and restores the default settings. The bit automatically clears
[7] DEVICE_RESET
to 0 once the reset is done.
[6] SLEEP When set to 1, the chip is set to sleep mode.
When set to 1, and SLEEP and STANDBY are not set to 1, the chip will cycle between sleep
and taking a single accelerometer sample at a rate determined by SMPLRT_DIV
y
[5] CYCLE NOTE: When all accelerometer axes are disabled via PWR_MGMT_2 register bits and cycle is enabled,
nl
the chip will wake up at the rate determined by the respective registers above, but will not take any
samples.
H l-
O
When set, the gyro drive and pll circuitry are enabled, but the sense paths are disabled. This
[4] GYRO_STANDBY
is a low power mode that allows quick enabling of the gyros.
r G tia
[3] TEMP_DIS When set to 1, this bit disables the temperature sensor.
IC
CODE CLOCK SOURCE
fo n
0 Internal 20 MHz oscillator
1 Auto selects the best available clock source – PLL if ready, else use the Internal oscillator
n de
[2:0] CLKSEL[2:0] 3 Auto selects the best available clock source – PLL if ready, else use the Internal oscillator
io fi 5 Auto selects the best available clock source – PLL if ready, else use the Internal oscillator
at on
6 Internal 20MHz oscillator
7 Stops the clock and keeps timing generator in reset
rm C
NOTE: The default value of CLKSEL[2:0] is 001. CLKSEL[2:0] must be set to 001 to achieve full gyroscope performance.
8.39 REGISTER 108 – POWER MANAGEMENT 2

fo se
Register Name: PWR_MGMT_2

In en

ed nS
BIT NAME FUNCTION

[7] - Reserved.
nc ve
[6] - Reserved.
1 – X-accelerometer is disabled.
[5] STBY_XA
0 – X-accelerometer is on.
va In
1 – Y-accelerometer is disabled.
[4] STBY_YA
0 – Y-accelerometer is on.
1 – Z-accelerometer is disabled.
[3] STBY_ZA
0 – Z-accelerometer is on.
1 – X-gyro is disabled.
[2] STBY_XG
0 – X-gyro is on.
1 – Y-gyro is disabled.
[1] STBY_YG
Ad
0 – Y-gyro is on.
1 – Z-gyro is disabled.
[0] STBY_ZG
0 – Z-gyro is on.

Revision: 1.1
MPU-6886
8.40 REGISTER 112 – I2C INTERFACE
Register Name: I2C_IF
BIT NAME FUNCTION
[7] - Reserved.
2
[6] I2C_IF_DIS 1 – Disable I C Slave module and put the serial interface in SPI mode only.
[5:0] - Reserved.
8.41 REGISTER 114 AND 115 – FIFO COUNT REGISTERS
y
Register Name: FIFO_COUNTH
nl
Register Type: READ Only
H l-
O
r G tia
BIT NAME FUNCTION
IC
High Bits, count indicates the number of written bytes in the FIFO.
[7:0] FIFO_COUNT[15:8]
fo n
Reading this byte latches the data for both FIFO_COUNTH, and FIFO_COUNTL.
n de
Register Name: FIFO_COUNTL
Register Type: READ Only
io fi
at on
BIT NAME FUNCTION
Low Bits, count indicates the number of written bytes in the FIFO. NOTE: Must read
[7:0] FIFO_COUNT[7:0]
rm C
FIFO_COUNTL to latch new data for both FIFO_COUNTH and FIFO_COUNTL.
8.42 REGISTER 116 – FIFO READ WRITE

fo se
Register Name: FIFO_R_W

In en

ed nS
BIT NAME FUNCTION

[7:0] FIFO_DATA[7:0] Read/Write command provides Read or Write operation for the FIFO.
nc ve
Description:
This register is used to read and write data from the FIFO buffer.
va In
Data is written to the FIFO in order of register number (from lowest to highest). If all the FIFO enable flags (see below)
are enabled, the contents of registers 59 through 72 will be written in order at the Sample Rate.
The contents of the sensor data registers (Registers 59 to 72) are written into the FIFO buffer when their
corresponding FIFO enable flags are set to 1 in FIFO_EN (Register 35).
If the FIFO buffer has overflowed, the status bit FIFO_OFLOW_INT is automatically set to 1. This bit is located in
Ad
INT_STATUS (Register 58). When the FIFO buffer has overflowed, the oldest data will be lost and new data will be
written to the FIFO unless register 26 CONFIG, bit[6] FIFO_MODE = 1.
If the FIFO buffer is empty, reading register FIFO_DATA will return a unique value of 0xFF until new data is available.
Normal data is precluded from ever indicating 0xFF, so 0xFF gives a trustworthy indication of FIFO empty.

Revision: 1.1
MPU-6886
8.43 REGISTER 117 – WHO AM I
Register Name: WHO_AM_I
BIT NAME FUNCTION
[7:0] WHOAMI Register to indicate to user which device is being accessed.
This register is used to verify the identity of the device. The contents of WHOAMI is an 8-bit device ID. The default
2 2
value of the register is 0x19. This is different from the I C address of the device as seen on the slave I C controller by
2
the applications processor. The I C address of the MPU-6886 is 0x68 or 0x69 depending upon the value driven on AD0
y
pin.
nl
8.44 REGISTERS 119, 120, 122, 123, 125, 126 ACCELEROMETER OFFSET REGISTERS
H l-
O
Register Name: XA_OFFSET_H
r G tia
IC
fo n
BIT NAME FUNCTION
n de
Upper bits of the X accelerometer offset cancellation. ±16g Offset cancellation in all Full
[7:0] XA_OFFS[14:7]
io fi Scale modes, 15 bit 0.98-mg steps.
Register Name: XA_OFFSET_L
at on
rm C
BIT NAME FUNCTION

Lower bits of the X accelerometer offset cancellation. ±16g Offset cancellation in all Full
fo se
[7:1] XA_OFFS[6:0]
Scale modes, 15 bit 0.98-mg steps.
[0] - Reserved.
In en
Register Name: YA_OFFSET_H

ed nS

BIT NAME FUNCTION
nc ve
Upper bits of the Y accelerometer offset cancellation. ±16g Offset cancellation in all Full
[7:0] YA_OFFS[14:7]
Scale modes, 15 bit 0.98-mg steps
va In
Register Name: YA_OFFSET_L

BIT NAME FUNCTION
Lower bits of the Y accelerometer offset cancellation. ±16g Offset cancellation in all Full
[7:1] YA_OFFS[6:0]
Ad
[0] - Reserved.

Revision: 1.1
MPU-6886
Register Name: ZA_OFFSET_H
BIT NAME FUNCTION
Upper bits of the Z accelerometer offset cancellation. ±16g Offset cancellation in all Full
[7:0] ZA_OFFS[14:7]
Register Name: ZA_OFFSET_L
BIT NAME FUNCTION
y
Lower bits of the Z accelerometer offset cancellation. ±16g Offset cancellation in all Full
nl
[7:1] ZA_OFFS[6:0]
H l-
O
[0] - Reserved.
r G tia
IC
fo n
n de
io fi
at on
rm C
fo se
In en
ed nS
nc ve
va In
Ad

Revision: 1.1
MPU-6886
9 USE NOTES
9.1 ACCELEROMETER-ONLY LOW-NOISE MODE
The first output sample in Accelerometer-Only Low-Noise Mode after wake up from sleep always has 1 ms delay,
independent of ODR.
9.2 ACCELEROMETER LOW-POWER MODE

Changing the value of SMPLRT_DIV register in Accelerometer Low-Power mode will take effect after up to one sample
at the old ODR.
9.3 SENSOR MODE CHANGE
y
nl
When switching from low-power modes to low-noise modes, unsettled output samples may be observed at the
gyroscope or accelerometer outputs due to filter switching and settling. The number of unsettled output samples
H l-
O
depends on the filter and ODR settings. The number of unsettled output samples is minimized by selecting the widest
r G tia
low-noise-mode filter bandwidth consistent with the chosen ODR.
IC
9.4 TEMP SENSOR DURING GYROSCOPE STANDBY MODE
fo n
During transition from Gyro Low power mode (GYRO_CYCLE=1), to Gyro Standby mode, in addition to the Gyro axis
n de
(axes) being turned off, the Temp Sensor will also be turned off if the Accel is disabled. In order to keep the temp
sensor on during Gyroscope standby mode when Accel is disabled, the following procedure should be followed:
io fi
•
at on
Set GYRO_CYCLE = 0 at least one ODR cycle prior to entering Standby mode
• At least one of the Gyro axis is ON prior to entering Standby mode
• Set GYRO_STANDBY = 1
rm C
9.5 GYROSCOPE MODE CHANGE

fo se
Gyroscope will take one ODR clock period to switch from Low-Noise to Low-Power mode after GYRO_CYCLE bit is set.
In en
If GYRO_CYCLE is set to 1 prior to turning on the gyroscope, the first sample will be from low-noise mode, which may
not be a settled value. Ignoring the first reading is recommended in this case.
ed nS
9.6 POWER MANAGEMENT 1 REGISTER SETTING

It is required to set CLKSEL[2:0] to 001 (auto-select) for full performance.
nc ve
9.7 UNLISTED REGISTER LOCATIONS

va In
Do not read unlisted register locations in Sleep mode as this may cause the device to hang up, requiring power cycle to
restore operation.
9.8 CLOCK TRANSITION WHEN GYROSCOPE IS TURNED OFF

When the gyroscope is on, the on-chip master clock source will be the gyroscope clock (assuming CLKSEL[2:0] = 001
for auto-select mode); otherwise, the master clock source will be the internal oscillator as long as the part is not in
Sleep mode. During a power mode transition, whenever the gyroscope is disabled and the part enters a mode other
Ad
than Sleep, the on-chip master clock source will transition from the gyroscope clock to the internal oscillator. It will
take about 20 µs for this transition to complete.

Revision: 1.1
MPU-6886
9.9 SLEEP MODE
The part will only enter Sleep mode when the SLEEP bit in PWR_MGMT_2 is set to ‘1’. If SLEEP bit is ‘0’ and bit
STBY_[X,Y,Z]A and STBY_[X,Y,Z]G are all set to ‘1’, accelerometer and gyroscope will be turned off, but the on-chip
master clock will still be running and consuming power.
9.10 NO SPECIAL OPERATION NEEDED FOR FIFO READ IN LOW POWER MODE
The use of FIFO is enabled in all modes including low power mode.
9.11 GYROSCOPE STANDBY PROCEDURE

The follow precaution and procedure must be followed while using the Gyroscope Standby mode:
y
Precaution to follow while entering Standby Mode:
nl
• The user will ensure that at least one gyro axis is ON when setting gyro_standby = 1.
H l-
O
Procedure to transition from Gyro Standby to Gyro off:
r G tia
IC
• The user should set gyro_standby = 0 first
• Next, turn off gyro x/y/z.
fo n
n de
io fi
at on
rm C
fo se
In en
ed nS
nc ve
va In
Ad

Revision: 1.1
MPU-6886
10 ASSEMBLY
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros
packaged in LGA package.
10.1 ORIENTATION OF AXES

The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1
identifier (•) in the figure.
+Z
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+Y
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+Z
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Mp +Y
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+X +X
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Figure 12. Orientation of Axes of Sensitivity and Polarity of Rotation
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MPU-6886
10.2 PACKAGE DIMENSIONS
24 Lead LGA (3x3x0.75) mm NiAu pad finish
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Figure 13. Package Diagram
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DIMENSIONS IN MILLIMETERS
SYMBOLS
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MIN NOM MAX

A 0.70 0.75 0.80
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A3 --- 0.65 REF. ---

b 0.15 0.20 0.25
c --- 0.10 REF. ---
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D 2.90 3.00 3.10

E 2.90 3.00 3.10
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e --- 0.40 ---

L 0.32 0.37 0.42
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L1 0.02 0.07 0.12

L3 0.25 0.30 0.35
y 0.00 --- 0.08
Table 20. Package Dimensions

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MPU-6886
11 PART NUMBER PACKAGE MARKING
The part number package marking for MPU-6886 devices is summarized below:
PART NUMBER PART NUMBER PACKAGE MARKING
MPU-6886 I66
Table 21. Part Number Package Marking
TOP VIEW
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I66 Part Number
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XXXX Lot Traceability Code
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AWW
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WW = Work Week
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Figure 14. Part Number Package Marking

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12 REFERENCE
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:
• Manufacturing Recommendations
o Assembly Guidelines and Recommendations
o PCB Design Guidelines and Recommendations
o MEMS Handling Instructions
o ESD Considerations
o Reflow Specification
o Storage Specifications
o Package Marking Specification
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o Tape & Reel Specification
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o Reel & Pizza Box Label
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o Packaging
o Representative Shipping Carton Label
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• Compliance
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o Environmental Compliance
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o DRC Compliance
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o Compliance Declaration Disclaimer
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13 DOCUMENT INFORMATION
13.1 REVISION HISTORY
Revision Date Revision Description
12/20/2016 1.0 Initial Release
03/29/2017 1.1 Updated Sections 1, 2, 4, 8, 10
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This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense
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for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to
change without notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to
improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding
the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising
nc ve
from information contained in this document, or from the use of products and services detailed therein. This includes, but is not limited
to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights.
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Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for
any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
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©2017 InvenSense, Inc. All rights reserved. InvenSense, Sensing Everything, MotionTracking, MotionProcessing, MotionProcessor,
MotionFusion, MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may
be trademarks of the respective companies with which they are associated.
©2017 InvenSense, Inc. All rights reserved.

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Revision: 1.1

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MPU-6886

High-Performance 6-Axis MEMS MotionTracking™ Device

• VDD operating range of 1.71V to 3.45V

†Denotes RoHS and Green-Compliant Package wafer level

TYPICAL OPERATING CIRCUIT

4 APPLICATIONS INFORMATION ........................................................................................................................... 17

4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION ............................................................................................................ 17

4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ....................................................................................................... 18

4.5 BLOCK DIAGRAM ................................................................................................................................................... 19

4.10 SELF-TEST ............................................................................................................................................................ 21

4.17 CHARGE PUMP...................................................................................................................................................... 22

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 2 of 59

8.12 REGISTER 23 – Z-GYRO OFFSET ADJUSTMENT REGISTER – HIGH BYTE............................................................................. 35

8.14 REGISTER 25 – SAMPLE RATE DIVIDER....................................................................................................................... 35

8.17 REGISTER 28 – ACCELEROMETER CONFIGURATION....................................................................................................... 37

8.19 REGISTER 30 – GYROSCOPE LOW POWER MODE CONFIGURATION ................................................................................. 39

8.21 REGISTER 33 – WAKE-ON MOTION THRESHOLD (Y-AXIS ACCELEROMETER) ...................................................................... 40

8.24 REGISTER 54 – FSYNC INTERRUPT STATUS ................................................................................................................ 40

8.30 REGISTERS 65 AND 66 – TEMPERATURE MEASUREMENT .............................................................................................. 43

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 3 of 59

11 PART NUMBER PACKAGE MARKING ............................................................................................................... 55

13 DOCUMENT INFORMATION ........................................................................................................................... 57

13.1 REVISION HISTORY ................................................................................................................................................. 57

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 4 of 59

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 5 of 59

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 6 of 59

1.2 PRODUCT OVERVIEW

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 7 of 59

2.3 ADDITIONAL FEATURES

• Minimal cross-axis sensitivity between the accelerometer and gyroscope axes

• Digital-output temperature sensor

• 20,000g shock tolerant

• 10 MHz SPI serial interface for communicating with all registers

• RoHS and Green compliant

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 8 of 59

Rate Noise Spectral Density @ 10 Hz 0.004 0.01 dps/√Hz 1, 4

Gyroscope Mechanical Frequencies 25 27 29 KHz 2

Table 1. Gyroscope Specifications

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 9 of 59

Power Spectral Density @ 10 Hz 100 170 µg/√Hz 1, 3

Low-Pass Filter Response Programmable Range 5 218 Hz 2

Output Data Rate 2

Table 2. Accelerometer Specifications

1. Derived from validation or characterization of parts, not guaranteed in production.

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 10 of 59

Table 3. D.C. Electrical Characteristics

1. Target spec. Subject to update.

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 11 of 59

DIGITAL OUTPUT (SDO, INT, DRDY)

V OL1 , LOW-Level Output Voltage R LOAD =1 MΩ; 0.1*VDDI V

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 12 of 59

SPI Operating Frequency, All

2 All registers, Fast-mode 100 400 kHz 1

Table 5. Other Electrical Specifications

1. Derived from validation or characterization of parts, not guaranteed in production.

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 13 of 59

tSU.STA tHD.STA tVD.ACK tSU.STO

Document Number: DS-000193 InvenSense Confidential & Proprietary Page 14 of 59

tSU;CS tHIGH 1/fCLK