NEO-8Q / NEO-M8

u-blox 8 / M8 GNSS modules

Hardware integration manual

Abstract
This document describes the features and specifications of u-blox NEO-8Q and NEO-M8 series
modules.

www.u-blox.com
UBX-15029985 - R07
 NEO-8Q / NEO-M8 - Hardware integration manual

Document information
Title NEO-8Q / NEO-M8
Subtitle u-blox 8 / M8 GNSS modules
Document type Hardware integration manual
Document number UBX-15029985
Revision and date R07 26-May-2020
Document status Production Information

Product status Corresponding content status

In Development / Objective Specification Target values. Revised and supplementary data will be published later.
Prototype
Engineering Sample Advance Information Data based on early testing. Revised and supplementary data will be published later.

Initial Production Early Production Information Data from product verification. Revised and supplementary data may be published later.

Mass Production / Production Information Document contains the final product specification.
End of Life

European Union regulatory compliance

NEO-8Q and NEO-M8N/M/Q/T modules comply with all relevant requirements for RED 2014/53/EU. The NEO-8Q and NEO-
M8N/M/Q/T Declaration of Conformity (DoC) is available at www.u-blox.com in Support > Product resources > Conformity
Declaration.

This document applies to the following products:

Product name Type number ROM/FLASH version PCN reference
NEO-M8N NEO-M8N-0-11 FLASH FW SPG 3.01 UBX-20013367
NEO-M8M NEO-M8M-0-10 ROM SPG 3.01 UBX-16013121
NEO-M8Q NEO-M8Q-0-11 ROM SPG 3.01 UBX-20013367
NEO-M8T NEO-M8T-0-11 FLASH FW3.01 TIM 1.10 UBX-20013367
NEO-8Q NEO-8Q-0-11 ROM SPG 3.01 UBX-20013367

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
documents, visit www.u-blox.com.
Copyright © u-blox AG.

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Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Hardware description ........................................................................................................................... 5
1.1 Overview ........................................................................................................................................................ 5
1.2 Configuration ............................................................................................................................................... 5
1.3 Connecting power ....................................................................................................................................... 5
1.3.1 VCC: Main supply voltage ................................................................................................................. 5
1.3.2 V_BCKP: Backup supply voltage ...................................................................................................... 5
1.3.3 VDD_USB: USB interface power supply ......................................................................................... 6
1.3.4 VCC_RF: Output voltage RF ............................................................................................................. 6
1.4 Interfaces ...................................................................................................................................................... 6
1.4.1 UART ..................................................................................................................................................... 6
1.4.2 USB ........................................................................................................................................................ 7
1.4.3 Display Data Channel (DDC) ............................................................................................................. 7
1.4.4 SPI .......................................................................................................................................................... 8
1.4.5 TX_READY ............................................................................................................................................ 8
1.5 I/O pins ........................................................................................................................................................... 8
1.5.1 RESET_N: Reset .................................................................................................................................. 8
1.5.2 EXTINT: External interrupt ............................................................................................................... 8
1.5.3 SAFEBOOT_N ...................................................................................................................................... 9
1.5.4 D_SEL: Interface select ..................................................................................................................... 9
1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T) .................................................................................... 9
1.5.6 TIMEPULSE2 ....................................................................................................................................... 9
1.5.7 LNA_EN: LNA enable .......................................................................................................................... 9
1.6 Electromagnetic interference on I/O lines ...........................................................................................10
2 Design ..................................................................................................................................................... 11
2.1 Pin description ...........................................................................................................................................11
2.1.1 Pin name changes.............................................................................................................................12
2.2 Minimal design...........................................................................................................................................12
2.3 Layout: Footprint and paste mask ........................................................................................................12
2.4 Antenna .......................................................................................................................................................13
2.4.1 Antenna design with passive antenna .........................................................................................13
2.4.2 Active antenna design .....................................................................................................................15
2.5 Layout design-in: Thermal management .............................................................................................16
3 Migration to u-blox 8 / M8 modules.............................................................................................. 17
3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series modules ............................................17
3.2 Hardware migration of NEO-6 to NEO-8Q and NEO-M8 series .......................................................17
3.3 Software migration ...................................................................................................................................18
4 Product handling ................................................................................................................................. 19
4.1 Packaging, shipping, storage and moisture preconditioning ..........................................................19

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4.2 Soldering .....................................................................................................................................................19

4.3 EOS/ESD/EMI precautions ......................................................................................................................22
4.4 Applications with cellular modules ........................................................................................................25
Appendix ....................................................................................................................................................... 27
A Glossary ................................................................................................................................................. 27
B Recommended parts ......................................................................................................................... 27
Related documents ................................................................................................................................... 29
Revision history .......................................................................................................................................... 30
Contact .......................................................................................................................................................... 31

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1 Hardware description
1.1 Overview
u-blox NEO-8Q, NEO-M8N, NEO-M8Q, and NEO-M8M standard precision GNSS modules, and the
NEO-M8T timing GNSS module, all feature the high performance u-blox M8 GNSS engine. Available
in the industry standard NEO form factor in a leadless chip carrier (LCC) package, they are easy to
integrate and combine exceptional positioning performance with highly flexible power, design, and
connectivity options. SMT pads allow fully automated assembly with standard pick & place and
reflow-soldering equipment for cost-efficient, high-volume production enabling short time-to-
market.

☞ For product features, see the corresponding product data sheet in the Related documents section.

☞ To determine which u-blox product best meets your needs, see the product selector tables on the
u-blox website www.u-blox.com.

1.2 Configuration
The configuration settings can be modified using UBX protocol configuration messages, see the u-
blox 8 / u-blox M8 Receiver Description including Protocol Specification [4]. The modified settings
remain effective until power-down or reset. If these settings have been stored in BBR (Battery Backed
RAM), then the modified configuration will be retained, as long as the backup battery supply is not
interrupted.
For the NEO-M8N module, configuration can be saved permanently in SQI flash.

1.3 Connecting power

The u-blox NEO-8Q and NEO-M8 series modules have three power supply pins: VCC, V_BCKP, and
VDD_USB.

1.3.1 VCC: Main supply voltage

The VCC pin provides the main supply voltage. During operation, the current drawn by the module can
vary by some orders of magnitude, especially if enabling low-power operation modes. For this reason,
it is important that the supply circuitry be able to support the peak power for a short time (for the
specifications, see the corresponding product data sheet in the Related documents section).

☞ When switching from backup mode to normal operation or at start-up, u-blox NEO-8Q and NEO-
M8 series modules must charge the internal capacitors in the core domain. In certain situations,
this can result in a significant current draw. For low power applications using Power Save and
backup modes, it is important that the power supply or low ESR capacitors at the module input
can deliver this current/charge.

☞ Use a proper GND concept. Do not use any resistors or coils in the power line.

1.3.2 V_BCKP: Backup supply voltage

If the module supply has a power failure, the V_BCKP pin supplies the real-time clock (RTC) and
battery backed RAM (BBR). Use of valid time and the GNSS orbit data at start up will improve the
GNSS performance, as with hot starts, warm starts, AssistNow Autonomous and AssistNow Offline.
If no backup battery is connected, the module performs a cold start at power up.

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Figure 1: Backup battery and voltage (for exact pin orientation, see the corresponding product data sheet)

☞ Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply,
a short current adjustment peak can cause high voltage drop on the pin with possible
malfunctions.

☞ If no backup supply voltage is available, connect the V_BCKP pin to VCC.

☞ As long as power is supplied to the NEO-8Q and NEO-M8 series modules through the VCC pin, the
backup battery is disconnected from the RTC and the BBR to avoid unnecessary battery drain (see
Figure 1). In this case, VCC supplies power to the RTC and BBR.
Real-Time Clock (RTC)
The RTC is driven by a 32 kHz oscillator using an RTC crystal. If the main supply voltage fails, and a
battery is connected to V_BCKP, parts of the receiver switch off, but the RTC still runs providing a
timing reference for the receiver. This operating mode is called Hardware Backup Mode, which enables
all relevant data to be saved in the backup RAM to allow a hot or warm start later

1.3.3 VDD_USB: USB interface power supply

VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be
connected to GND. For more information about correctly handling the VDD_USB pin, see section 1.4.

1.3.4 VCC_RF: Output voltage RF

The VCC_RF pin can supply an active antenna or external LNA. For more information, see section 2.4.

1.4 Interfaces
1.4.1 UART
The NEO-8Q and NEO-M8 series modules include a Universal Asynchronous Receiver Transmitter
(UART) serial interface RXD/TXD supporting configurable baud rates. The baud rates supported are
specified in the corresponding product data sheet.
The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/-
12 V) can be implemented using level shifters such as Maxim MAX3232. Hardware handshake signals
and synchronous operation are not supported.

☞ Designs must allow access to the UART pin for future service and reconfiguration.

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1.4.2 USB
A USB version 2.0 FS (Full Speed, 12 Mbit/s) compatible interface is available for communication as
an alternative to the UART. The USB_DP integrates a pull-up resistor to signal a full-speed device to
the host. The VDD_USB pin supplies the USB interface.
u-blox provides Microsoft® certified USB drivers for Windows Vista, Windows 7, Windows 8 and
Windows 10 operating systems. These drivers are available at our website at www.u-blox.com
USB external components
The USB interface requires some external components to implement the physical characteristics
required by the USB 2.0 specification. These external components are shown in Figure 2 and listed in
Table 1. To comply with USB specifications, VBUS must be connected through an LDO (U1) to pin
VDD_USB on the module.
In USB self-powered mode, the power supply (VCC) can be turned off and the digital block is not
powered. In this case, since VBUS is still available, the USB host would still receive the signal indicating
that the device is present and ready to communicate. This should be avoided by disabling the LDO
(U1) using the enable signal (EN) of the VCC-LDO or the output of a voltage supervisor. Depending on
the characteristics of the LDO (U1) it is recommended to add a pull-down resistor (R11) at its output
to ensure VDD_USB is not floating if the LDO (U1) is disabled or the USB cable is not connected, that
is, VBUS is not supplied.

☞ USB bus-powered mode is not supported.

U1
D2 LDO
VBUS VDD_USB VDD_USB
USB Device Connector

C24 EN C23 R11

DP
R4
USB_DP
Module
R5
DM USB_DM

GND
EN

Figure 2: USB interface

Name Component Function Comments

U1 LDO Regulates VBUS (4.4 …5.25 V) Almost no current requirement (~1 mA) if the GNSS receiver is
down to a voltage of 3.3 V. operated as a USB self-powered device.
C23, C24 Capacitors Required according to the specification of LDO U1
D2 Protection Protect circuit from overvoltage / Use low capacitance ESD protection such as ST Microelectronics
diodes ESD when connecting. USBLC6-2.
R4, R5 Serial Establish a full-speed driver A value of 27  is recommended.
termination impedance of 28…44 
resistors
R11 Resistor 100 k is recommended for USB self-powered setup.
Table 1: Summary of USB external components

1.4.3 Display Data Channel (DDC)

An I2C compatible Display Data Channel (DDC) interface is available on NEO-8Q and NEO-M8 series
modules for serial communication with an external host CPU. The interface only supports operation
in slave mode (master mode is not supported). The DDC protocol and electrical interface are fully
compatible with the Fast-Mode of the I2C industry standard. DDC pins SDA and SCL have internal
pull-up resistors.

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For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver
Description Including Protocol Specification [4]. For bandwidth information, see the corresponding
product data sheet. For timing parameters, consult the I2C-bus specification [7].

☞ The NEO-8Q and NEO-M8 series DDC interface supports serial communication with most u-blox
cellular modules. See the specification of the applicable cellular module to confirm compatibility.

1.4.4 SPI
An SPI interface is available for communication to a host CPU.

☞ SPI is not available in the default configuration, because its pins are shared with the UART and
DDC interfaces. The SPI interface can be enabled by connecting D_SEL to ground. For speed and
clock frequency, see the corresponding product data sheet.

1.4.5 TX_READY
The TX_READY function is used to indicate when the receiver has data to transmit. A listener can wait
on the TX_READY signal instead of polling the DDC or SPI interfaces. The UBX-CFG-PRT message lets
you configure the polarity and the number of bytes in the buffer before the TX READY signal goes
active. The TX_READY function can be mapped to TXD (PIO 06). The TX_READY function is disabled
by default.

☞ The TX_READY functionality can be enabled and configured by AT commands sent to the u-blox
cellular module supporting the feature. For more information, see the GPS Implementation and
Aiding Features in u-blox wireless modules [8].

1.5 I/O pins

All I/O pins make use of internal pull-ups. Thus, there is no need to connect unused pins to VCC_IO.

1.5.1 RESET_N: Reset

Driving RESET_N low activates a hardware reset of the system. Use this pin only to reset the module.
Do not use RESET_N to turn the module on and off, since the reset state increases power
consumption. With NEO-8Q and NEO-M8 series modules RESET_N is an input only.

☞ The RTC time is also reset (but not BBR).

1.5.2 EXTINT: External interrupt

EXTINT (EXTINT0 on NEO-M8T), PIO 13 is an external interrupt pin with fixed input voltage
thresholds with respect to VCC (see the corresponding product data sheet for more information). It
can be used for wake-up functions in power save mode on NEO-8Q and NEO-M8 series modules and
for aiding. Leave open if unused. The function is disabled by default.
If the EXTINT is not used for an external interrupt function, it can be used for some other purpose. For
example, as an output pin for the TX_READY feature to indicate that the receiver has data to
transmit.
EXTINT1 is an external interrupt pin on NEO-M8T with fixed input voltage thresholds with respect to
VCC (see the corresponding product data sheet for more information). It can be used for wake-up
functions in Power Save Mode on NEO-M8T module and for aiding. Leave open if unused. The function
is disabled by default.

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Power control
The power control feature allows overriding the automatic active/inactive cycle of power save mode.
The state of the receiver can be controlled through the EXTINT (EXTINT0 on NEO-M8T) pin. The
receiver can also be forced OFF using EXTINT (EXTINT0 on NEO-M8T) when power save mode is not
active.
Frequency aiding
The EXTINT (EXTINT0 on NEO-M8T) pin can be used to supply time or frequency aiding data to the
receiver.
For time aiding, hardware time synchronization can be achieved by connecting an accurate time pulse
to the EXTINT (EXTINT0 on NEO-M8T) pin.
Frequency aiding can be implemented by connecting a periodic rectangular signal with a frequency up
to 500 kHz and arbitrary duty cycle (low/high phase duration must not be shorter than 50 ns) to the
EXTINT (EXTINT0 on NEO-M8T) pin. Provide the applied frequency value to the receiver using UBX
messages.

1.5.3 SAFEBOOT_N
The SAFEBOOT_N pin is for future service, updates and reconfiguration.
On the NEO-M8T module, a configurable TIMEPULSE2 signal can be programmed on
TP2/SAFEBOOT_N.

☞ Do not pull low during reset.

1.5.4 D_SEL: Interface select

The D_SEL pin selects the available interfaces. SPI cannot be used simultaneously with UART/DDC. If
open, UART and DDC are available. If pulled low, the SPI interface is available. See the corresponding
product data sheet.

1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T)

On NEO-8Q and NEO-M8 series modules, a configurable time pulse signal is available. By default, the
time pulse signal is configured to one pulse per second. For more information, see the u-blox 8 / u-blox
M8 Receiver Description including Protocol Specification [4].

1.5.6 TIMEPULSE2
On the NEO-M8T module, a configurable TIMEPULSE2 signal can be programmed on
TP2/SAFEBOOT_N.
For more information, see the u-blox 8 / u-blox M8 Receiver Description including Protocol
Specification [4].

☞ The TIMEPULSE2 output must not be held LOW during start-up.

1.5.7 LNA_EN: LNA enable

On NEO-M8N, NEO-M8Q, NEO-M8T and NEO-8Q modules, in power save mode, the system can turn
on/off an optional external LNA using the LNA_EN signal in order to optimize power consumption.
Signals: "high" = Turn ON LNA, "low" = Turn OFF LNA

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1.6 Electromagnetic interference on I/O lines

Any I/O signal line with a length greater than approximately 3 mm can act as an antenna and may pick
up arbitrary RF signals transferring them as noise into the GNSS receiver. This specifically applies to
unshielded lines, in which the corresponding GND layer is remote or missing entirely, and lines close
to the edges of the printed circuit board.
If, for example, a cellular signal radiates into an unshielded high-impedance line, it is possible to
generate noise in the order of volts and not only distort receiver operation but also damage it
permanently.
On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver
performance may be degraded when this noise is coupled into the GNSS antenna (see Figure 15).
To avoid interference by improperly shielded lines, it is recommended to use resistors (e.g. R>20 ),
ferrite beads (e.g. BLM15HD102SN1) or inductors (e.g. LQG15HS47NJ02) on the I/O lines in series.
These components should be chosen with care because they will affect also the signal rise times.

Figure 3 shows an example of EMI protection measures on the RXD/TXD line using a ferrite bead. For
more information, see section 4.3.

Figure 3: EMI precautions

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2 Design
2.1 Pin description
Function Pin No. I/O Description Remarks

Power VCC 23 Supply voltage Provide clean and stable supply.

GND 10, 12, Ground Assure a good GND connection to all GND pins of the module,
13, 24 preferably with a large ground plane.
V_BCKP 22 Backup supply It is recommended to connect a backup supply voltage to
voltage V_BCKP in order to enable warm and hot start features on the
positioning modules. Otherwise, connect to VCC.
VDD_USB 7 USB power To use the USB interface, connect this pin to 3.0 – 3.6 V.
supply If no USB serial port used connect to GND.
Antenna RF_IN 11 I GNSS signal The connection to the antenna must be routed on the PCB.
input from Use a controlled impedance of 50  to connect RF_IN to the
antenna antenna or the antenna connector.
VCC_RF 9 O Output voltage VCC_RF can be used to power an external active antenna.
RF section
UART TXD / SPI MISO 20 O UART_TX/ SPI Communication interface,
MISO can be programmed as TX_READY for DDC interface.
If pin 2 low => SPI MISO.
RXD / SPI MOSI 21 I UART_RX / SPI Serial input. Internal pull-up resistor to VCC. Leave open if not
MOSI used. If pin 2 low => SPI MOSI.
USB USB_DM 5 I/O USB I/O line USB bidirectional communication pin. Leave open if unused.
USB_DP 6 I/O USB I/O line
System TIMEPULSE 3 O Timepulse Configurable Timepulse signal (one pulse per second by
TIMEPULSE1 signal default). Leave open if not used.
(NEO-M8T)
SAFEBOOT_N 1 I SAFEBOOT_N SAFEBOOT_N, leave OPEN
TP2/SAFEBOOT
I/O TP2 / Configurable Timepulse2 signal
_N (NEO-M8T)
SAFEBOOT_N SAFEBOOT_N, leave open if not used. Do not pull low during
reset.
EXTINT 4 I External External interrupt pin.
interrupt Internal pull-up resistor to VCC. Leave open if not used.
EXTINT0
Function is disabled by default.
(NEO-M8T)
RESERVED 15 - Reserved Leave open.
EXTINT1 I External External interrupt pin.
(NEO-M8T) interrupt Internal pull-up resistor to VCC. Leave open if not used.
Function is disabled by default.
SDA / SPI CS_N 18 I/O DDC data / SPI DDC data.
CS_N If pin 2 low => SPI chip select.
SCL / SPI CLK 19 I DDC Clock / SPI DDC Clock.
SCK If pin 2 low => SPI clock.
LNA_EN 14 O LNA_EN Antenna control can be used to turn on and off an optional
external LNA.
RESERVED
(NEO-M8M) - Reserved Leave open.
RESET_N 8 I Reset input Reset input
D_SEL 2 I Selects the Allow selecting UART/DDC or SPI
interface open-> UART/DDC; low->SPI
RESERVED 16, 17 - Reserved Leave open.
Table 2: NEO-8Q and NEO-M8 series pinout

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2.1.1 Pin name changes

Selected pin names have been updated to agree with a common naming convention across u-blox
modules. The pins have not changed their operation and are the same physical hardware but with
updated names. The table below lists the pins that have a changed name along with their old and new
names.
No. Previous name New name

14 ANT_ON LNA_EN
20 TxD TXD /
SPI MISO SPI MISO
21 RxD RXD /
SPI MOSI SPI MOSI
Table 3: Pin name changes

2.2 Minimal design

This is a minimal design for a NEO-8Q and NEO-M8 series GNSS receiver.

Figure 4: NEO-8Q / NEO-M8 passive antenna design

☞ NEO-M8M can have a passive antenna, but for optimal operation it requires an external SAW and
LNA, see Figure 7.

2.3 Layout: Footprint and paste mask

Figure 5 describes the footprint of the NEO-8Q and NEO-M8 series modules and provides
recommendations (not specifications) for the paste mask Note that the copper and solder masks
have the same size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase the volume outside of the module by defining the dimensions of the paste mask to form a T-
shape (or equivalent) extending beyond the copper mask. For the stencil thickness, see section 4.2.

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☞ Consider the paste mask outline when defining the minimal distance to the next component. The
exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (e.g. soldering) of the customer.
1.0 mm 0.8 mm
[39.3 mil] [31.5 mil]

[31.5 mil]
0.8 mm
Stencil: 150 m

[118.1 mil]
16.0 mm [630 mil]

3.0 mm
[43.3 mil]
1.1 mm
[23.5 mil]

[31.5 mil]
0.6 mm

0.8 mm

10.4 mm [409.5 mil]

[39.3 mil]
1.0 mm
12.2 mm [480 mil]

14.6 mm [575 mil] 12.2 mm [480.3 mil]

Figure 5: NEO-8Q and NEO-M8 series paste mask NEO-8Q and NEO-M8 series footprint

2.4 Antenna
2.4.1 Antenna design with passive antenna
A design using a passive antenna requires more attention to the layout of the RF section. Typically, a
passive antenna is located near electronic components; therefore, care should be taken to reduce
electrical noise that may interfere with the antenna performance. Passive antennas do not require a
DC bias voltage and can be directly connected to the RF input pin RF_IN. Sometimes, they may also
need a passive matching network to match the impedance to 50 .

☞ Use an antenna that has sufficient bandwidth to receive all GNSS constellations. See the
Appendix.
Figure 6 shows a minimal setup for a design with a good GNSS patch antenna. For exact pin
orientation, see the corresponding product data sheet.

Figure 6: NEO-M8N / NEO-M8T / NEO-M8Q / NEO-8Q passive antenna design

Figure 7 and Figure 8 show designs using an external LNA and SAW to increase the sensitivity for
optimum performance with passive antenna. For exact pin orientation, see the corresponding product
data sheet.

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Figure 7: NEO-M8M module design with passive antenna and an external LNA and SAW

The VCC_RF output can be used to supply the LNA with a filtered supply voltage.

☞ An external LNA is only required if the antenna is far away. In that case, the LNA must be placed
close to the passive antenna.

Figure 8: NEO-M8N / NEO-M8Q / NEO-M8T / NEO-8Q module design with passive antenna and an external LNA

The LNA_EN pin (LNA enable) can be used to turn on and off an optional external LNA.
The VCC_RF output can be used to supply the LNA with a filtered supply voltage.

☞ A standard GNSS LNA has enough bandwidth to amplify GPS/GLONASS/Galileo/BeiDou signals.

☞ An external LNA is only required if the antenna is far away. In that case the LNA must be placed
close to the passive antenna.

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2.4.2 Active antenna design

Active antennas have an integrated low-noise amplifier. Active antennas require a power supply that
will contribute to the total GNSS system power consumption budget with additional 5 to 20 mA
typically.
For maximum external gain see the corresponding product data sheet.
If the supply voltage of the NEO-8Q / NEO-M8 receiver matches the supply voltage of the antenna
(e.g. 3.0 V), use the filtered supply voltage available at pin VCC_RF as shown in Figure 9. For exact pin
orientation, see the corresponding product data sheet.
Active antenna design using VCC_RF pin to supply the active antenna

Figure 9: Active antenna design, external supply from VCC_RF

If the VCC_RF voltage does not match the supply voltage of the active antenna, use a filtered external
supply, as shown in Figure 10. For the exact pin orientation, see the corresponding product data sheet.
Active antenna design powered from external supply

Figure 10: Active antenna design, direct external supply

☞ The circuit shown in Figure 10 works with all u-blox M8 modules, and also with modules without
VCC_RF output.

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2.5 Layout design-in: Thermal management

During design-in do not place the module near sources of heating or cooling. The receiver oscillator is
sensitive to sudden changes in ambient temperature which can adversely impact satellite signal
tracking. Sources can include co-located power devices, cooling fans or thermal conduction via the
PCB. Take into account the following questions when designing in the module.
 Is the receiver placed away from heat sources?
 Is the receiver placed away from air-cooling sources?
 Is the receiver shielded by a cover/case to prevent the effects of air currents and rapid
environmental temperature changes?

⚠ High temperature drift and air vents can affect the GNSS performance. For best performance,
avoid high temperature drift and air vents near the module.

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3 Migration to u-blox 8 / M8 modules

3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series
modules
u-blox is committed to ensuring that products in the same form factor are backwards compatible over
several technology generations. Utmost care has been taken to ensure there is no negative impact on
function or performance and to make NEO-8Q and NEO-M8 series modules as fully compatible as
possible with u-blox 7 modules. If using BeiDou, check the bandwidth of the external RF components
and the antenna. For information about power consumption, see the corresponding product data
sheet.
It is highly advisable that customers consider a design review with the u-blox support team to ensure
the compatibility of key functionalities.

☞ Selected pin names have been updated to agree with a common naming convention across u-blox
modules. The pins have not changed their operation and are the same physical hardware but with
updated names.

3.2 Hardware migration of NEO-6 to NEO-8Q and NEO-M8

series
NEO-6 NEO-8Q and NEO-M8 series Remarks for migration
Pin name Typical Pin name Typical assignment
Pin

assignment
1 SAFEBOOT_ Leave open SAFEBOOT_ Leave open No difference
N N
2 SS_N SPI slave D_SEL Selects the -> Various functions, compatible only when not
select interface using SPI for communication.
3 TIMEPULSE Timepulse 1 TIMEPULSE/ Timepulse1 No difference
1 (1PPS) TIMEPULSE
1
4 EXTINT0 External EXTINT/ External interrupt No difference
interrupt pin EXTINT0
5 USB_DM USB data USB_DM USB data No difference
6 USB_DP USB data USB_DP USB data No difference
7 VDD_USB USB supply VDD_USB USB supply No difference
8 RESERVED Pin 8 and 9 RESET_N Reset If pin 8 is connected directly to pin 9, the RESET_N
must be function is not available. If the RESET_N function
connected shall be used, a 3k3 resistor from pin 8 to pin 9 in
conjunction with an open drain buffer is required
for u-blox 6. For NEO-8Q / NEO-M8 modules pin 8
can be connected to pin 9 or can be left open. Do
not populate the 3k3 resistor.
Behavior of RESET_N has changed; For u-blox 7
and M8, a RESET_N will erase the time information
in the BBR, which was maintained in u-blox 6.
Therefore, with u-blox 7 and M8 a RESET_N will not
result in a hot start, etc.
9 VCC_RF Can be used VCC_RF Can be used for No difference
for active active antenna or
antenna or external LNA supply
external LNA
supply

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NEO-6 NEO-8Q and NEO-M8 series Remarks for migration

Pin name Typical Pin name Typical assignment
Pin

assignment
10 GND GND GND GND No difference
11 RF_IN GNSS signal RF_IN GNSS signal input No difference
input
12 GND GND GND GND No difference
13 GND GND GND GND No difference
14 MOSI/ SPI MOSI / LNA_EN Used to turn an LNA_EN (Active Antenna Control) can be used to
CFG_COM0 configuration optional external turn an optional external LNA on and off.
pin. LNA on and off -> Different functions, no SPI MOSI and
Leave open if configuration pins with NEO-8Q / NEO-M8. If not
not used. used as default configuration, it must be set using
software command!
It is not possible to migrate from NEO-6 to NEO-8Q
/ NEO-M8 if NEO-6 pin 14 is connected to GND. In
this case, migrate to NEO-M8M!
15 MISO/ SPI MISO / RESERVED Leave open
CFG_COM1 configuration
pin. Leave
open if not
used.
16 CFG_GPS0/ Power mode RESERVED Leave open
SCK configuration
pin / SPI
clock. Leave
open if not
used.
17 RESERVED Leave open RESERVED Leave open No difference
18 SDA DDC data SDA DDC data / SPI CS_N No difference for DDC. If pin 2 low = SPI chip select
19 SCL DDC clock SCL DDC clock / SPI SCK No difference for DDC. If pin 2 low = SPI clock
20 TxD Serial port TXD UART_TX / SPI MISO No difference for UART. If pin 2 low = SPI MISO
21 RxD Serial port RXD UART_RX / SPI MOSI No difference for UART. If pin 2 low = SPI MOSI
22 V_BCKP Backup V_BCKP Backup supply Check current in Data sheet.
supply voltage If in u-blox 6 module this was connected to GND,
voltage you can do the same in u-blox M8/8.
23 VCC Supply VCC Supply voltage
voltage NEO-8Q / NEO-
NEO- M8N/Q: 2.7 – 3.6 V No difference for NEO-8Q / NEO-M8N/Q
6Q/M/P/V/T: NEO-M8M: 1.65 – Extended supply voltage range for NEO-M8M
2.7 – 3.6 V 3.6 V
NEO-6G:
1.75 – 1.95 V
24 GND GND GND GND No difference
Table 4: Pin-out comparison NEO-6 vs. NEO-8Q and NEO-M8 series

Make sure that the RF path (antenna and filtering) matches that of the GNSS constellations used.

3.3 Software migration

☞ For an overall description of the module software operation, see the u-blox 8 / u-blox M8 Receiver
Description including Protocol Specification [4].

☞ For migration, see the u-blox M8 FW SPG3.01 Migration Guide [9].

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4 Product handling
4.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, moisture sensitivity levels (MSL), shipment and storage
information, as well as drying for preconditioning see the corresponding product data sheet.
Population of modules

☞ When populating the modules, make sure that the pick and place machine is aligned to the copper
pins of the module and not on the module edge.

4.2 Soldering
Soldering paste
Use of “No Clean” soldering paste is highly recommended, as it does not require cleaning after the
soldering process. The paste in the example below meets these criteria.
Soldering paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% tin/ 4% silver/ 0.5% copper)
Melting temperature: +217 °C
Stencil thickness: see section 2.3
The final choice of the soldering paste depends on the approved manufacturing procedures.
The paste-mask geometry for applying soldering paste should meet the recommendations.

☞ The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
Reflow soldering
A convection type-soldering oven is highly recommended over the infrared type radiation oven.
Convection-heated ovens allow precise control of the temperature, and all parts will heat up evenly,
regardless of material properties, thickness of components and surface color.
As a reference, see the “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and
wave) processes”, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that
this preheat phase will not replace prior baking procedures.
 Temperature rise rate: max. 3 °C/s. If the temperature rise is too rapid in the preheat phase, it may
cause excessive slumping.
 Time: 60 – 120 s. If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will be generated in clusters.
 End temperature: 150 – 200 °C. If the temperature is too low, non-melting tends to be caused in
areas containing large heat capacity.
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.
 Limit time above 217 °C liquidus temperature: 40 – 60 s

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 Peak reflow temperature: 245 °C

Cooling phase
A controlled cooling avoids negative metallurgical effects of the solder (solder becomes more brittle)
and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder
fillets with a good shape and low contact angle.
 Temperature fall rate: max 4 °C/s

☞ To avoid falling off, place the u-blox module on the topside of the motherboard during soldering.
The final soldering temperature chosen at the factory depends on additional external factors like
choice of soldering paste, size, thickness and properties of the base board. Exceeding the maximum
soldering temperature in the recommended soldering profile may permanently damage the module.

Figure 11: Recommended soldering profile

☞ u-blox modules must not be soldered with a damp heat process.

Optical inspection
After soldering the u-blox module, consider an optical inspection step to check whether:
 The module is properly aligned and centered over the pads
 All pads are properly soldered
 No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias
nearby
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residues underneath the
modules cannot be easily removed with a washing process.
 Cleaning with water will lead to capillary effects where water is absorbed into the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pads.
 Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the two housings, areas that are not accessible for post-wash inspections. The solvent will also
damage the sticker and the ink-jet printed text.
 Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
The best approach is to use a “no clean” soldering paste and eliminate the cleaning step after the
soldering.

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Repeated reflow soldering

Only single reflow soldering processes are recommended for boards populated with u-blox modules.
To avoid upside down orientation during the second reflow cycle, do not submit u-blox modules to two
reflow cycles on a board populated with components on both sides. In such a case, place the module
on the side of the board which is submitted into the last reflow cycle. This is because of the risk of the
module falling off due to the significantly higher weight in relation to other components.
Two reflow cycles can be considered by excluding the above described upside down scenario and
taking into account the rework conditions described in section Product handling.

☞ Repeated reflow soldering processes and soldering the module upside down are not
recommended.
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with u-blox modules.
Hand soldering
Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the
module precisely on the pads. Start with a cross-diagonal fixture soldering (for example, pins 1 and
15), and continue from left to right.
Rework
The u-blox module can be unsoldered from the baseboard using a hot air gun. When using a hot air
gun for unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not
recommend using a hot air gun because this is an uncontrolled process and might damage the
module.

⚠ Attention: use of a hot air gun can lead to overheating and severely damage the module. Always
avoid overheating the module.
After the module is removed, clean the pads before placing and hand soldering a new module.

⚠ Never attempt a rework on the module itself, for example, replacing individual components. Such
actions immediately terminate the warranty.
In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is
allowed. Manual rework steps on the module can be done several times.
Conformal coating
Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating
products. These materials affect the HF properties of the GNSS module and it is important to prevent
them from flowing into the module. The RF shields do not provide 100% protection for the module
from coating liquids with low viscosity; apply the coating carefully.

☞ Conformal coating of the module will void the warranty.

Casting
If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the u-blox module before implementing this in the
production.

☞ Casting will void the warranty.

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Grounding metal covers

Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer’s own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interferences and noise.

☞ u-blox offers no warranty for damages to the modules caused by soldering metal cables or any
other forms of metal strips directly onto the EMI covers.
Use of ultrasonic processes
Some components on the modules are sensitive to ultrasonic waves. Use of any ultrasonic processes
(cleaning, welding, and so on) may cause damage to the GNSS receiver.

☞ u-blox offers no warranty against damages to the modules caused by any ultrasonic processes.

4.3 EOS/ESD/EMI precautions

When integrating GNSS positioning modules into wireless systems, consider electromagnetic and
voltage susceptibility issues carefully. Wireless systems include components that can produce
electrical overstress (EOS) and electro-magnetic interference (EMI). CMOS devices are more sensitive
to such influences because their failure mechanism is defined by the applied voltage, whereas bipolar
semiconductors are more susceptible to thermal overstress. The following design guidelines help in
designing robust yet cost-effective solutions.

⚠ To avoid overstress damage during production or in the field, observe strict EOS/ESD/EMI
handling and protection measures.

⚠ To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input
power (see the corresponding product data sheet).
Electrostatic discharge (ESD)
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows
between two objects at different electrical potentials caused by direct contact or
induced by an electrostatic field. The term is usually used in the electronics and other
industries to describe momentary unwanted currents that may cause damage to
electronic equipment.
ESD handling precautions
ESD prevention is based on establishing an electrostatic protective area (EPA). The EPA can be a
small working station or a large manufacturing area. The main principle of the EPA is that there are
no highly charging materials near ESD-sensitive electronics, all conductive materials are grounded,
workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International
standards are used to define typical EPA and can be obtained, for example, from International
Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).
GNSS positioning modules are sensitive to ESD and require special precautions when handling. Due
to the risk of electrostatic charges, take particular care when handling patch antennas. In addition to
standard ESD safety practices, take the following measures into account whenever handling the
receiver.
 Unless there is a galvanic coupling between the local GND
(i.e. the work table) and the PCB GND, the first point of
contact when handling the PCB must always be between
the local GND and PCB GND.

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 Before mounting an antenna patch, connect ground of the

device.
 When handling the RF pin, do not come into contact with
any charged capacitors and be careful when contacting
materials that can develop charges (e.g. patch antenna ~10
pF, coax cable ~50 – 80 pF/m, soldering iron).
 To prevent electrostatic discharge through the RF input, do
not touch any exposed antenna area. If there is any risk that
such exposed antenna area is touched in a non-ESD
protected work area, implement proper ESD protection
measures in the design.
 When soldering RF connectors and patch antennas to the
receiver’s RF pin, make sure to use an ESD safe soldering
iron (tip).

⚠ Failure to observe these precautions can result in severe damage to the GNSS module!

ESD protection measures

⚠ GNSS positioning modules are sensitive to electrostatic discharge (ESD). Special precautions are
required when handling.

☞ For more robust designs, employ additional ESD protection measures. Using an LNA with
appropriate ESD rating can provide enhanced GNSS performance with passive antennas and
increases ESD protection.
Most defects caused by ESD can be prevented by following strict ESD protection rules for production
and handling. When implementing passive antenna patches or external antenna connection points,
additional ESD measures can also avoid failures in the field as shown in Figure 12.

Small passive antennas (<2 dBic and Passive antennas (>2 dBic or Active antennas
performance critical) performance sufficient)
A B C
RF_IN
RF_IN
RF_IN

Receiver
Receiver
Receiver

GNSS
GNSS
GNSS

LNA
L
D

LNA with appropriate ESD rating

Figure 12: ESD precautions

☞ Protection measure A is preferred because it offers the best GNSS performance and best level of
ESD protection.
Electrical Overstress (EOS)
Electrical overstress (EOS) usually describes situations where the maximum input power exceeds the
maximum specified ratings. EOS failure can happen if RF emitters are close to a GNSS receiver or its
antenna. EOS causes damage to the chip structures. If the RF_IN is damaged by EOS, it is hard to
determine whether the chip structures have been damaged by ESD or EOS.

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EOS protection measures

☞ For designs with GNSS positioning modules and wireless (for example, cellular) transceivers in
close proximity, ensure sufficient isolation between the wireless and GNSS antennas. If wireless
power output causes the specified maximum power input at the GNSS RF_IN to be exceeded,
employ EOS protection measures to prevent overstress damage.
For robustness, EOS protection measures as shown in Figure 13 are recommended for designs
combining wireless communication transceivers (for example, cellular) and GNSS in the same design
or in close proximity.
Small passive antennas (<2 dBic Passive antennas (>2 dBic or Active antennas (without internal filter which
and performance critical) performance sufficient) need the module antenna supervisor circuits)
D E F
GPS GPS
Bandpass Bandpass

RF_IN
RF_IN

Filtler Filtler

Receiver
Receiver

GNSS
GNSS

LNA

LNA with appropriate ESD rating GNSS band pass filter: SAW or
and maximum input power ceramic with low insertion loss
and appropriate ESD rating
Figure 13: EOS and ESD precautions

Electromagnetic interference (EMI)

Electromagnetic interference (EMI) is the addition or coupling of energy causing a spontaneous reset
of the GNSS receiver or resulting in unstable performance. In addition to EMI degradation due to self-
jamming (see section 1.5) any electronic device near the GNSS receiver can emit noise that can lead
to EMI disturbances or damage.
The following elements are critical regarding EMI:
 Unshielded connectors (for example, pin rows)
 Weakly shielded lines on PCB (for example, on top or bottom layer and especially at the border of
a PCB)
 Weak GND concept (for example, small and/or long ground line connections)
EMI protection measures are recommended when RF emitting devices are near the GNSS receiver. To
minimize the effect of EMI a robust grounding concept is essential. To achieve electromagnetic
robustness, follow the standard EMI suppression techniques.
http://www.murata.com/products/emc/knowhow/index.html
http://www.murata.com/products/emc/knowhow/pdf/4to5e.pdf
Improved EMI protection can be achieved by inserting a resistor or, better yet, a ferrite bead or an
inductor (see Table 6) into any unshielded PCB lines connected to the GNSS receiver. Place the
resistor as close to the GNSS receiver pin as possible.
Alternatively, feed-through capacitors with good GND connection can be used to protect, for example,
the VCC supply pin against EMI. A selection of feed-through capacitors is listed in Table 6.
Intended use

☞ To mitigate any performance degradation of a radio equipment under EMC disturbance, system
integration shall adopt appropriate EMC design practice and not contain cables over three meters
on signal and supply ports.

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4.4 Applications with cellular modules

GSM terminals transmit power levels up to 2 W (+33 dBm) peak, 3G and LTE up to 250 mW
continuous. Consult the corresponding product data sheet for the absolute maximum power input at
the GNSS receiver.

☞ See the GPS Implementation and Aiding Features in u-blox wireless modules [8].
Isolation between GNSS and cellular antenna
In a handheld type design, an isolation of approximately 20 dB can be reached with careful placement
of the antennas. If such isolation cannot be achieved, for example, in the case of an integrated cellular
/GNSS antenna, an additional input filter is needed on the GNSS side to block the high energy emitted
by the cellular transmitter. Examples of these kinds of filters are the SAW Filters from Epcos (B9444
or B7839) or Murata.
Increasing interference immunity
Interference signals come from in-band and out-band frequency sources.
In-band interference
With in-band interference, the signal frequency is very close to the GNSS constellation frequency
used, for example, GPS frequency of 1575 MHz (see Figure 14). Such interference signals are typically
caused by harmonics from displays, micro-controller, bus systems, and so on.

GPSCarrier
Power [dBm]
Jamming 1575.4 MHz GPS
signal signals

0
Jammin
g signal
GPS input filter
-110 characteristics
Frequency [MHz]

1525 1550 1575 1600 1625

Figure 14: In-band interference signals

Figure 15: In-band interference sources

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Measures against in-band interference include:

 Maintaining a good grounding concept in the design
 Shielding
 Layout optimization
 Filtering
 Placement of the GNSS antenna
 Adding a CDMA, cellular, WCDMA band pass filter before handset antenna
Out-band interference
Out-band interference is caused by signal frequencies that are different from the GNSS carrier (see
Figure 16). The main sources are wireless communication systems such as cellular, CDMA, WCDMA,
Wi-Fi, BT, etc.

Figure 16: Out-band interference signals

Measures against out-band interference include maintaining a good grounding concept in the design
and adding a SAW or band pass ceramic filter (as recommend in section 4) into the antenna input line
to the GNSS receiver (see Figure 17).

Figure 17: Measures against out-band interference

☞ For design-in recommendations in combination to cellular operation see the Appendix.

☞ See the GPS Implementation and Aiding Features in u-blox wireless modules [8].

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Appendix
A Glossary
Abbreviation Definition
ANSI American National Standards Institute
BeiDou Chinese navigation satellite system
CDMA Code Division Multiple Access
EMC Electromagnetic compatibility
EMI Electromagnetic interference
EOS Electrical Overstress
EPA Electrostatic Protective Area
ESD Electrostatic discharge
Galileo European navigation system
GLONASS Russian satellite system
GND Ground
GNSS Global Navigation Satellite System
GPS Global Positioning System
GSM Global System for Mobile Communications
IEC International Electrotechnical Commission
PCB Printed circuit board
QZSS Quasi-Zenith Satellite System
Table 5: Explanation of the abbreviations and terms used

B Recommended parts
Recommended parts are selected on data sheet basis only. Other components may also be used.
Part Manufacturer Part ID Remarks Parameters to consider
Diode ON ESD9R3.3ST5G Standoff voltage>3.3 V Low capacitance < 0.5 pF
semiconductor
ESD9L3.3ST5G Standoff voltage>3.3 V Standoff voltage > Voltage for active
antenna
ESD9L5.0ST5G Standoff voltage>5 V Low inductance
SAW TDK/ EPCOS B8401: B39162B8401P810 GPS+GLONASS High attenuation
TDK/ EPCOS B3913: B39162B3913U410 GPS+GLONASS+BeiDou For automotive application
TDK/ EPCOS B4310: B39162B4310P810 GPS+GLONASS Compliant to the AEC-Q200 standard
ReyConns NDF9169 GPS+BeiDou Low insertion loss, only for mobile
application
Murata SAFFB1G56KB0F0A GPS+GLONASS+BeiDou Low insertion loss, only for mobile
application
Murata SAFEA1G58KB0F00 GPS+GLONASS Low insertion loss, only for mobile
application
Murata SAFEA1G58KA0F00 GPS+GLONASS High attenuation, only for mobile
application
Murata SAFFB1G58KA0F0A GPS+GLONASS High attenuation, only for mobile
application

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Part Manufacturer Part ID Remarks Parameters to consider

Murata SAFFB1G58KB0F0A GPS+GLONASS Low insertion loss, only for mobile
application
TAI-SAW TA1573A GPS+GLONASS Low insertion loss
TAI-SAW TA1343A GPS+GLONASS+BeiDou Low insertion loss
TAI-SAW TA0638A GPS+GLONASS+BeiDou Low insertion loss
LNA JRC NJG1143UA2 LNA Low noise figure, up to 15 dBm RF input
power
Inductor Murata LQG15HS27NJ02 L, 27 nH Impedance at freq. GPS > 500 ,
rated current > 300mA
Capacitor Murata GRM1555C1E470JZ01 C DC-block, 47 pF DC-block
Murata X7R 10N 10% 16V C Bias, 10nF Bias-T
Ferrite Murata BLM15HD102SN1 FB High IZI @ fGSM
bead
Feed- Murata NFL18SP157X1A3 Monolithic type For data signals, 34 pF load capacitance
through
NFA18SL307V1A45 Array type For data signals, 4 circuits in 1 package
capacitor
for signal
Feed- Murata NFM18PC …. 0603 2A Rs < 0.5 
through NFM21P…. 0805 4A
Capacitor
Resistor 10   10%, min 0.250 W Rbias
560   5% R2
100 k  5% R3, R4

Table 6: Recommended parts

Recommended antennas
Manufacturer Order no. Comments
Hirschmann (www.hirschmann-car.com) GLONASS 9 M GPS+GLONASS active
Taoglas (www.taoglas.com ) AA.160.301111 36 x 36 x 4 mm, 3-5 V 30 mA active
Taoglas (www.taoglas.com ) AA.161.301111 36 x 36 x 3 mm, 1.8 to 5.5 V / 10 mA at 3 V active
INPAQ (www.inpaq.com.tw) B3G02G-S3-01-A 2.7 to 3.9 V / 10 mA active
Amotech (www.amotech.co.kr) B35-3556920-2J2 35 x 35 x 3 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) A25-4102920-2J3 25 x 25 x 4 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) A18-4135920-AMT04 18 x 18 x 4 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) Amotech AGA363913- GPS+GLONASS+ BeiDou active
S0-A1
INPAQ (www.inpaq.com.tw) ACM4-5036-A1-CC-S 5.2 x 3.7 x 0.7 mm GPS+GLONASS passive
Additional antenna manufacturer: Allis Communications, 2J, Tallysman Wireless
Table 7: Recommend antennas

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Related documents
[1] NEO-M8 Data sheet (FW3), UBX-15031086
[2] NEO-8Q Data sheet, UBX-15031913
[3] NEO / LEA-M8T Data sheet (FW3), UBX-15025193
[4] u-blox 8 / u-blox M8 Receiver Description including Protocol Specification (Public version), UBX-
13003221
[5] GPS Antenna Application note, GPS-X-08014
[6] GPS Compendium, GPS-X-02007
[7] I2C-bus specification, Rev. 6 - 4 April 2014,
http://www.nxp.com/documents/user_manual/UM10204.pdf
[8] GPS Implementation and Aiding Features in u-blox wireless modules, GSM.G1-CS-09007
[9] u-blox M8 FW SPG3.01 Migration Guide, UBX-15028330

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UBX-15029985 - R07 Related documents Page 29 of 31

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Revision history
Revision Date Name Comments

R01 28-Jan-2016 jfur Advance Information

R02 17-May-2016 jfur Pin name updated (Table 2 and Table 4, section 1.5.2, section 1.5.5 and section
1.5.7), added NEO-M8M, NEO-M8Q, NEO-M8T and NEO-8Q variants.
R03 08-Aug-2016 jfur Production Information
R04 11-Nov-2017 msul Added Information on RED DoC in the European Union regulatory compliance
section (page 2); added Intended use case for EMI in section 4.3 EOS/ESD/EMI
precautions; updated legal statement on the cover page and added
Documentation feedback e-mail address in contacts page.
R05 10-Jul-2019 jesk Clarified use of internal pull-ups in section 1.5. Clarified alternative uses for the
EXTINT pin in section 1.5.2. Updated parameters for the recommended inductor in
appendix B.
R06 24-Jan-2020 rmak Updated section 3.2 Hardware migration (NEO-M8M supply voltage)
R07 26-May-2020 msul Updated type number and PCN reference for NEO-M8N, NEO-M8Q, NEO-M8T, and
NEO-8Q in page 2, added thermal management statement in section 2.5.

UBX-15029985 - R07 Revision history Page 30 of 31

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