Tehinse Olayinka
Tehinse Olayinka
Tehinse Olayinka
By
MASTER OF SCIENCE
University of Manitoba
Winnipeg
Al-Zn-Mg-Cu (7xxx series) aluminium alloys are widely used for aircraft structures.
(SCC) resistance for these alloys. It appears that SCC resistance of these alloys is
related to grain boundary precipitate morphology. One technique to control the grain
solution heat treatment. There is need for a detailed study of the effect of HTPP on the
temperatures. In this thesis research, the results of ten HTPP processes applied to
7075 and 7050 commercial 7xxx series alloys are presented in terms of hardness,
precipitate morphology and EDS analysis of solute concentration profile at the grain
boundary. Results indicate that subsequent to HTPP processing, the 7050 alloy can be
with the modification of 7050 alloy by zirconium versus chromium in 7075 alloy.
HTPP heat treatment achieves better SCC resistance compared to standard T6 temper.
However, it does not appear that HTPP can achieve a combination of hardness,
tempers.
ii
ACKNOWLEDGEMENT
I really appreciate my advisor, Dr. Jonathan Beddoes for the opportunity to work on
this research. I am grateful to him for the teaching, guidance, mentorship, personal
interest and support which has enabled me to have a great graduate study experience.
I also appreciate the support and guidance of my thesis committee, Dr. Bassuoni and
Dr. Caley.
Trevor Smith and Dan Rossong for their technical support. I really appreciate Dr.
Khan for the training and support on the TEM analysis used in this work.
I acknowledge the inspiring effort of my parents Mr. and Mrs. Tehinse, Mr. and Mrs.
Adetunji and the rest of my family. Their moral support, prayers and encouragement
Dr. Oluwasegun, Dr. Krutika, Emmanuel Ocran, Johnson Aina, Omhudhowo Oshobe,
Ebenezer Essel, Afua Adobea Ampadu-mintah, Ioannis Polyzois and others for their
Owuobe for their love and companionship. My absolute gratitude goes to Jehovah
iii
TABLE OF CONTENTS
ABSTRACT ..................................................................................................................ii
ACKNOWLEDGEMENT ..........................................................................................iii
OBTAINED ................................................................................................................xii
2.2 7xxx versus 2xxx series aluminium alloys for aircraft structures ................. 14
ALLOYS ..................................................................................................................... 30
iv
3.2 Exfoliation Corrosion .................................................................................... 31
requirement ................................................................................................... 39
v
5.6 Microstructural Analysis ............................................................................... 64
7.1 Effect of heat treatment on EC of 7075 and 7050 alloys ............................ 110
7.2 Effect of heat treatment on hardness of 7050 and 7075 alloys ................... 111
7.3 Exfoliation Corrosion (EXCO) versus EC of 7075 and 7050 alloy ............ 114
7.4 Effect of HTPP on Stress corrosion cracking of 7075 and 7050 alloy ....... 115
vi
LIST OF TABLES
Tables Page
6.1. Electrical conductivity results of 7075 alloy before and after aging ............... 68
6.2. Electrical conductivity results of 7050 alloy before and after aging ............... 69
6.8. Summary of results obtained from 7075 alloy double beam samples ............. 84
6.9. Summary of results obtained from 7050 alloy double beam samples ............. 84
vii
LIST OF FIGURES
Figures Page
structures ............................................................................................................ 2
2.1. Fracture toughness versus yield strength relationship for 2xxx and 7xxx
2.3. Heat treatment process for precipitation hardening in 7xxx alloys ................. 17
4.1. Schematic showing retrogression and reaging heat treatment procedure ........ 43
viii
4.2. Effect of heat treatment on SCC resistance in 7075 alloy heat treated to T6,
4.5. Micrographs of (a) fine and (b) coarse precipitates in the grains of
4.6. Discontinuous precipitates at the grain boundary region of HTPP temper ..... 50
of (a) T651 (b) T73 (c) RRA tempers of 7150 alloy ....................................... 51
5.2. Fisher Scientific silicon oil bath used for aging treatment .............................. 55
6.1. Effect of heat treatment on electrical conductivity of 7075 and 7050 alloy .... 70
ix
6.6. Optical micrograph of a section of an exfoliated sample showing
6.7. Comparism of crack length with time in two SCC samples for each of
6.8. Average crack length with time of 7075 double beam samples ...................... 87
6.9. Average crack length with time of 7050 double beam samples ...................... 88
6.14. Comparism of SCC behaviour in 7050 and 7075 alloy at TF/Q = 370 oC ........ 97
6.16. Optical images of as-received (a) 7075-T651 and (b) 7050-T74 alloy ........... 99
7050 alloy......................................................................................................... 99
6.18. TEM analyses of unaged 7075 alloy in (a) and (b) T6 (c) TF/Q= 405 oC (d)
6.19. TEM analyses of unaged 7050 alloy in (a) and (b) T6 (c) TF/Q = 405 oC (d)
6.20. TEM analysis of grain boundary precipitate morphology of 7075 alloy. ...... 104
6.21. TEM analysis of grain boundary precipitate morphology of 7050 alloy ....... 105
6.24. EDS analysis showing the extent of scatter in results ................................... 109
x
7.1. Effect of heat treatment on electrical conductivity of 7050 and
7.2. Effect of heat treatment on hardness of 7050 and 7075 alloys ...................... 113
7.5. Relationship between EC and SCC resistance (using crack length measured
after 257 hours of SCC test) of 7075 and 7050 alloy .................................... 116
growth velocity at 3MPa√m stress intensity for 7075 alloy .......................... 117
growth velocity at 3MPa√m stress intensity for 7050 alloy .......................... 117
7.8. Summary of grain boundary copper solute concentration in (a) 7075 and
xi
LIST OF COPYRIGHTED MATERIAL FOR WHICH PERMISSION WAS
OBTAINED
Australia (13-02-2014).
Spinger (24-03-2014).
Spinger (24-03-2014).
Figure 2.2: Source-“Key to metals” Reprinted with permission from European Space
Agency (22-04-2014).
xii
Figure 2.9: Source-“Handbook of Aluminium” Reprinted with permission from
Figure 3.1: Source-“NDT Resource Centre” Reproduced with permission from the
(05-03-2014).
Spinger (24-03-2014).
Spinger (24-03-2014).
xiii
CHAPTER ONE
INTRODUCTION
7xxx series aluminium alloys are high strength, heat treatable alloys containing zinc
and magnesium as the main alloying elements. Similar to all heat treatable aluminium
alloys, 7xxx series alloys rely on precipitation hardening to improve properties [1].
This series of alloys can be divided into Al-Zn-Mg and Al-Zn-Mg-Cu alloys [2]. Al-
Zn-Mg alloys are relatively weldable and are referred to as medium strength alloys
[3]. Al-Zn-Mg-Cu alloys have the highest strength compared to other aluminium
alloys. 7xxx series alloys are often used for high strength applications, predominantly
in compressively loaded airframe structures, as shown in Figure 1.1 [4]. Examples are
upper wing panels, frames, stringers, longerons, extruded parts, etc. Other applications
particular interest for structural applications of 7xxx series alloys are toughness,
fatigue crack growth rate, strength, exfoliation and stress corrosion resistance [3, 5].
Airframe structures are high strength applications. For instance, upper wing structures
are loaded in compression during flight. Hence, materials selection for these parts
considered for materials selection are cost, corrosion resistance and toughness [6].
Application of aluminium alloys in aircraft can be traced back to the engine crankcase
in Wright brothers’ plane in 1903 [7]. A study of the Wright Flyers internal
combustion engine crank case showed a composition of Al-8% copper, about 1.0%
1
Figure 1.1: Typical applications of aluminium alloys and tempers in aircraft
structures, such as the Boeing 777 illustrated [4]
The strength of the alloy, low weight requirements of the aircraft and good casting
The discovery of age hardening of Al-Cu alloys by Alfred Wilm in 1906 led to
research on the mechanism of precipitation hardening [9]. Guinier and Preston’s work
provided evidence that explains the precipitation mechanism in aged Al-Cu alloy [9].
Further studies revealed that GP (Guinier-Preston) zones are formed during nucleation
of strengthening precipitate phases from the solid solution. These studies started the
2
Earliest application of aluminium alloys in aircraft wing structures used alloys based
on the Al-Cu-Mg system (2xxx series alloys), an example being the Junkers F-13 and
DC-3 aircraft. These alloys had the highest yield strength at that time in the range of
275-310 MPa. The need for increased aircraft performance motivated effort to find
other precipitation hardenable alloys [9]. Among the few other alloys that showed
showed that Al-Zn-Mg alloys showed the best response to precipitation hardening
compared to other aluminium alloy compositions. Figure 1.2 shows various materials
used for upper wing skin of aircrafts from 1919-1994 [9]. This shows that continuous
increase in demand for materials with higher strength to weight ratios has enabled the
series) alloys over the years [5]. The broken line in Figure 1.2 shows the transition in
aircraft application in early 1940’s from 2xxx to 7xxx alloys based on higher strength.
In the 1920’s and 30’s, studies were carried out to understand tensile strength and
corrosion resistant properties of Al-Zn-Mg alloys. Part of this was the development of
alloy X74S (5.2% Zn, 2.1% Mg, 1.5% Cu, 0.4% Mn) with a low Zn:Mg ratio in 1938.
7076-T6 alloy (7.5% Zn, 1.6% Mg, 0.7% Cu and 0.6% Mn) with a high Zn:Mg ratio
was developed in 1940 for application as a high strength forging alloy for propeller
blades. However, deformed sheet of this alloy was susceptible to stress corrosion
adjusting the composition of Zn, Mg and Cu for improved strength and the addition of
Cr. First application of 7075-T6 sheet was as skin and stringers in B-29 Fortress
3
Al-Cu Al-Zn-Mg-Cu
Figure 1.2: Materials used for upper wing skin from 1919-1994 [9]
bomber during World War II. Higher strength 7xxx alloy were developed for
In the 1950’s, forgings were used for several aircraft structures. The susceptibility of
7075-T6 to corrosion and high quench sensitivity led to development of another alloy
more suitable for forgings. Hy43 with low copper content (about 0.6% Cu) was
developed as a forging alloy and designed to have good heat treatment properties.
and strength. After successful accelerated stress corrosion time to failure testing was
carried out, Hy43 was commercialized as alloy 7179 and used for a wide range of old
and new designs. However, in the late 1950’s, it was discovered that alloy 7179
exhibited high susceptibility to stress corrosion that was not predicted by the
accelerated corrosion tests. This is due to the slow crack initiation in 7179, but higher
crack growth rate compared to 7075 alloy [10]. The severe corrosion problems of
7179 alloy led to its withdrawal from aerospace applications [11]. Nevertheless,
4
airworthiness issues related to the high stress corrosion cracking susceptibility of
7179/7079 alloy continue today [12]. Tables 1.1 and 1.2 show chemical composition
In the 1960’s, the problem of stress corrosion cracking and requirement for thicker
temper. 7075-T73 forgings were developed for improved corrosion resistance using a
two-step aging heat treatment procedure. After aging to T6 temper at about 120 oC for
24 hours, T7 temper was obtained by overaging above 150 oC for 7-9 hours to
Although, this comes with about 10-15% loss of strength compared to 7075 and 7179-
T6, 7075-T73 was accepted by aircraft designers [10]. One of the first application of
7075-T73 was in DC10. T76 temper was later applied in Lockheed L1011 [7, 11].
The increasing demand for lighter weight, higher strength structures especially for
commercial aircraft led to the development of 7178-T651 alloy with higher Zn, Mg
and Cu content compared to 7075. However, the increasing demand for higher
fracture toughness and damage tolerance limited the use of this alloy [10]. Over the
years, applications of T73 alloys have no record of stress corrosion cracking [10].
In the T6 and T73 tempers, there is an inverse relationship between strength and SCC
resistance as shown in Figure 1.3 [13]. This shows that as aging time and temperature
increases, the strength decreases while resistance to SCC increases. In Figure 1.3,
stage I shows the initial aging step. Stage II can be related to T6 temper and it shows
that higher strength can be obtained but the resistance to SCC is low. Stage III shows
that prolonged aging can increase SCC resistance but there is loss of strength.
5
Table 1.1: Composition (wt.%) of some aluminium alloys used in aircrafts [14, 15]
Alloy Zn Cu Mg Mn Cr Zr Fe Si
6
Table 1.2: Typical mechanical properties of aluminium alloys [13, 15, 16, 17, 18, 19,
20, 21, 22]
Yield Fracture
Year of strength toughness SCC
Alloy introduction Temper (MPa) (MPa√m) resistance
7
Figure 1.3: Variation of SCC resistance and strength due to aging [13]
7050 alloy with about 2.22% copper and use of Zr in place of Cr for improved
strength and less quench sensitivity. Chromium containing dispersoids in 7075 alloy
control grain structure and prevent recrystallization during processing but causes
quench sensitivity, i.e. properties are dependent on the quenching rate. Hence, the
strength of 7075 alloy decreases as the quenching rate decreases. The Zr addition in
7050 alloy reduces the quench sensitivity. Thus, 7050 alloy is more useful for thick
In the 1970’s, Cina developed the Retrogression and Reaging (RRA) heat treatment to
address the trade-off between strength and stress corrosion resistance in the T6 and
T73 tempers. The RRA heat treatment is applied to 7075-T6 and involves
8
very short period of time (for example 200 oC for 2 minutes, 240 oC for 7 seconds).
occur, causing loss of strength as shown in Figure 1.4 [24]. This is followed by
combination of strength and SCC resistance [14, 25]. Figure 1.4 shows the effect of
treatment. It was observed that the strength reaches the lowest minimum after a short
reaging treatment increases the hardness. However, higher strength after reaging is
seconds of retrogression.
Figure 1.4: Changes in hardness during RRA heat treatment [24]. Arrows indicate
change in hardness after reaging
9
A T77 temper designation is used when RRA is applied to 7055 alloy. 7055-T77 is
used for several structural components on the Boeing 777, as shown in Figure 1.1.
However, the short retrogression time required to obtain high strength in RRA
[24].
creates the need to develop a heat treatment procedure that avoids the relatively high
This research aims to study the effect of high temperature pre-precipitation (HTPP)
heat treatment on strength and SCC resistance of 7xxx series alloys. HTPP is a
recently developed heat treatment procedure which involves slow cooling from
quenching, followed by applying T6 aging. The aim of this procedure is to modify the
and achieve higher resistance to stress corrosion cracking [26]. Similar slow cooling
aluminide intermetallics showed that this procedure can modify the grain boundary
microstructure and improve targeted material properties [27]. Previous work on the
effect of HTPP on experimental Al-Zn-Mg-Cu alloys shows that HTPP treatment can
improve SCC resistance in experimental alloys [26, 28, 29]. However, the influence
of HTPP heat treatments applied to commercial 7xxx alloys is not well understood. It
is also important to understand the effect of the intermediate temperature used during
the HTPP process on the properties of Al-Zn-Mg-Cu alloys. Accordingly, the goal of
10
this thesis research is to study the effect of HTPP heat treatments on the electrical
11
CHAPTER TWO
Al-Zn-Mg-Cu ALLOYS
Pure aluminium is well known for its low density and high corrosion resistance.
However, pure aluminum cannot be used for structural applications due to low
applications where high strength to weight ratio is important [2]. Although the
primary effect of alloying is increase in strength, other material properties are affected
by alloying. Aluminium alloys usually contain 90-96% aluminium and about two
manganese, copper and silicon are used as major alloying elements. Although, minor
elements may have low solubility in aluminium, addition of minor elements improves
layer for good corrosion resistance. Generally, corrosion resistance decreases as the
alloying element content increases. Alloying elements may form solid solutions or
phases that sometimes affect the continuity of the protective oxide layer or
12
Zinc and Magnesium
The addition of zinc increases the solution potential of the alloy. However, binary
aluminium-zinc alloys are seldom used due to high susceptibility to SCC and hot
cracking in the wrought and cast alloys respectively. Magnesium and zinc are often
added together to increase strength by increasing the heat treatment response of the
alloy due to formation of MgZn2 precipitate phase. However, there is need for control
Copper
The addition of up to 1% copper in the presence of zinc and magnesium increases the
Chromium/Manganese /Zirconium
Chromium, manganese and zirconium are used as additions in 7xxx alloys to control
grain structure and prevent recrystallization. Chromium can form finely dispersed
phases in these alloys due to its slow rate of diffusion [2]. However, the use of
Iron and silicon are the commonest impurities found in aluminium alloys. Iron has a
high solubility in aluminium in the molten state, but the solubility reduces in solid
state. This enables iron to form intermetallic compounds with aluminium and other
elements [2]. Silicon reduces the melting point, increases the strength and fluidity of
13
aluminium [1]. Both iron and silicon significantly affect properties of aluminium
alloy. Hence, strict limits on the quantity of impurity elements are important to
achieve required material properties. 7050 alloy contains lesser amount of iron and
constituent particles formed in 7050 alloy thereby improving the fracture toughness.
solidification. More information on the types and effect of constituent particles will be
discussed later in this chapter. The effect of this compositional modification on the
microstructure of 7050 and 7075 alloys will be studied later in this thesis.
2.2 7xxx versus 2xxx series aluminium alloys for aircraft structures
Both 2xxx and 7xxx series are heat treatable alloys widely applied as airframe
structures. 2xxx series (Al-Cu) alloys have been widely applied since the discovery of
of 2014 alloy with higher silicon content for higher strength and 2024 alloy with
higher magnesium and lower silicon content for better response to aging at room
temperature. Typical tensile strength of 2014 alloy is 485 MPa. 7xxx alloys have
higher strength in the range of 470-600 MPa [31]. This explains the replacement of
2xxx with 7xxx alloys for upper wing structures shown in Figure 1.2.
A critical property required for upper wings is high compressive strength. This is
necessary since the upper wing is under compression loading during flight [6]. 7xxx
alloys have higher compressive strength compared to 2xxx alloys. However, Figure
1.1 shows that 2xxx series alloys are still applied as structural materials in aircrafts
14
especially for high fracture toughness applications. An example is the lower wing
An important property that differentiates 2xxx and 7xxx alloys is fracture toughness.
Recently, reduction in the level of iron, silicon and copper has achieved an increase in
fracture toughness of 2xxx alloys. Also, high damage tolerance and high resistance to
fatigue crack propagation enables 2xxx alloys to be applied as aircraft fuselage skin
and lower wing skins on commercial aircrafts. Figure 2.1 shows the fracture
7xxx series alloys, higher fracture toughness can be obtained in 2xxx series alloys
[34].
Figure 2.1: Fracture toughness versus yield strength relationship for 2xxx and 7xxx
series alloys [34]
15
2.3 Precipitation hardening in 7xxx alloys
called precipitates in an alloy such that higher strength is achieved. Figure 2.2 shows
the phase diagram of precipitation hardenable alloys [35]. For precipitation hardening
to occur, it is important that the solid solubility limit of the solute in the alloy system
2xxx, 6xxx and 7xxx series alloys (with Cu, Mg-Si and Zn-Mg as main alloying
element respectively) are precipitation hardenable and are also known as heat
treatable alloys [33]. To achieve precipitation hardening in 7xxx alloys, the following
Quenching
Aging
Solution heat treatment (SHT) is the process of dissolving second phase particles in
an alloy to form a single phase. SHT involves heating to a temperature in the single
phase region as shown in Figure 2.2. Figure 2.3 summarizes the heat treatment
procedure for precipitation hardening in 7xxx alloys. The alloy is kept at the SHT
temperature (To) for some time to develop a single phase at equilibrium. Thermal
processes occurring during SHT also allows formation of vacancies in the single
phase. The choice of SHT temperature is determined by the alloy composition. High
SHT temperature is used to achieve high strength after aging. However, in alloys
containing eutectic phases, SHT temperature higher than eutectic temperature can
16
Solution
Figure 2.2: Phase diagram of a typical precipitation hardenable alloy showing heat
treatment processes for precipitation hardening. Broken line indicates decrease in
solubility of solute as temperature decreases [35]
Figure 2.3: Heat treatment process for precipitation hardening in 7xxx alloys
17
This will have a negative effect on the final mechanical properties of the alloy.
aluminium alloy can be obtained by appropriate design of SHT process. For instance,
non-isothermal SHT between the solvus temperature and the eutectic temperature
starting from low SHT temperature allows homogenization of the eutectic phase to
occur and subsequent increase in the temperature will maximize the solute
concentration [27].
Quenching is the process of rapidly cooling the alloy from the SHT (To to T1 as shown
in Figure 2.3) to form a supersaturated solid solution (SSS) of solute and highly
concentrated vacancies. SSS is important for the subsequent nucleation and growth of
precipitates during aging. Optimum strength is often associated with fast quenching
rate [33]. However, fast quenching rate may induce stress and cause distortion in
intricate parts. Slow quenching allows migration of solute and vacancies to grain
boundary regions which may cause a reduction in mechanical properties after aging.
Hence, the choice of quenching medium and temperature are important to determine
the quenching rate. Water is a common medium for quenching aluminium alloys. It is
Aging is the controlled decomposition of the SSS to form second phase particles
unstable and this provides a driving force for precipitation to occur through diffusion
[27, 33]. Aging can occur naturally at room temperature or artificially at temperature
below the equilibrium solvus (T2 in Figure 2.3). During aging, precipitates are formed
with an interface with the matrix which may be coherent (perfect match at the
precipitates formed at the initial stage of precipitation hardening are coherent or semi-
18
coherent with the matrix. However, prolonged aging causes loss of coherency of the
precipitates with the matrix. This is called overaging and it is usually associated with
loss of strength.
7xxx series alloys have good solid solution range that allows formation of
supersaturated solid solution during quenching from SHT temperature [1]. 7xxx series
alloys are highly unstable after quenching from SHT such that natural aging occurs
commonly used in practical applications. During aging, precipitate phases are formed
precipitates causes partial loss of coherency with the matrix. As aging continues,
equilibrium precipitates, η or T phase that are incoherent with the matrix are formed
[1].
zones to intermediate (η′) phase and later equilibrium precipitate phase (η) is given
19
above. Precipitation sequence that follows such decomposition from GP zones to η is
common in alloys with high Zn:Mg ratio like 7075 and 7050 alloys. The composition
of intermediate precipitate (η′) is not so clear. Some studies claim that the
GP zone with Zn:Mg ratio 1:1 [1, 36, 37]. Equilibrium precipitate is hexagonal,
MgZn2 with Zn:Mg ratio 2:1. In alloys with low Zn:Mg ratio, the precipitation
later equilibrium T phase likely composed of cubic, Mg32(Al, Zn)49 [1, 37]. In 7075
and 7050 alloys, optimum strength is obtained from GP zones and intermediate
Precipitation hardening also modifies the grain boundary precipitate structures. Since
7075 and 7050 alloys are susceptible to intergranular corrosion like SCC, heat
treatments are designed to develop precipitate structure that will prevent a continuous
path for corrosion at the grain boundary. As discussed earlier, a coarse, discontinuous
T77 (RRA) tempers. The effect of HTPP on the grain boundary precipitate
Figure 2.4 shows the simplified Al-MgZn2 equilibrium diagram for 7xxx series alloys
broken line. The presence of copper and impurities in commercial 7075 alloys
changes the composition of the equilibrium phase and this will alter the temperatures
given in Figure 2.4. For instance, the given solvus temperature is 420 oC for 7075, but
20
Figure 2.4: The Al-MgZn2 equilibrium diagram for Al-Zn-Mg alloys. Zn and Mg
content in 7075 alloy corresponds to broken line [27]
In 7xxx alloys, strength is increased due to the interaction between dislocation and
is determined by size, spacing and degree of coherency between the precipitate and
the matrix. Depending on the alloy, strength is determined by the ability to resist
Strain fields formed by coherent GP zones: The presence of misfit between the
precipitate and the matrix generates strain fields. This increases the internal stress and
higher stress will be required for dislocation motion thereby increasing strength.
21
Shearing of deformable precipitates: Interaction between small precipitates and
precipitates that allows dislocations to cut through the precipitates. The stress required
to initiate dislocation motion is called critically resolved shear stress (CRSS). At the
initial stage of precipitate growth, the CRSS is low. This enables dislocations to shear
During chemical hardening, changes occur along the slip plane due to formation of an
additional interface. Strength is increased in that more work will be required by the
due to increase in the particle spacing and loss of coherency at the precipitate-matrix
Strengthening is obtained due to work hardening by the debris dislocation left after
looping of particles by dislocation. Figure 2.5 shows that particle size affects the
As shown in the Figure, the critical particle size corresponds to high critically
resolved shear stress. At the critical particle size, high strength can be obtained due to
among others are important features that affect fracture toughness, strength and
22
Figure 2.5: Effect of particle size and CRSS on dislocation-precipitate interaction [1]
The composition, structure and distribution of precipitates in the matrix and grain
boundary region affect the properties of 7xxx alloys. Among other microstructural
factors, matrix precipitates affect strength while the grain boundary precipitates affect
resistance to intergranular corrosion [29, 40]. During aging, coherent precipitates are
the matrix and grain boundary region, causing loss of strength and coherency. Figure
2.6 shows the fine and coarse precipitate morphology in T6 and T7 matrix
the strength, coarsening of the precipitates in T7 temper causes loss of strength [29].
23
Figure 2.6: Distribution of precipitates within the matrix in (a) T6 and (b) T7 temper
respectively [29]
Studies of other heat treatment procedure that have improved the resistance to SCC
like retrogression and reaging shows that coarse precipitates are discontinuously
distributed along the grain boundary (similar to T7 temper shown in Figure 2.7) [29].
Constituent particles
insoluble while those without Fe may be soluble or slightly soluble based on the
solute content in the solid solution [1]. Constituent particles larger than 1 µm in
24
diameter are undesirable in aluminium alloys. Due to incoherency with the matrix,
constituent particles are not effective strengthening particles. Constituent particles can
favour crack growth, reduce fatigue resistance and fracture toughness. In 7075 alloy,
Al7Cu2Fe, SiO2, Al12(Fe, Mn)3Si, Al23CuFe4, Al6(Fe, Mn), Mg2Si, are the common
amounts of iron and silicon in 7050 alloy achieves decrease in the size and number of
constituent particles in 7050 alloy. Al7Cu2Fe, Mg2Si and Al2CuMg are common in
Dispersoids
Dispersoids are small particles that are formed by aluminium and transition metal
alloying elements such as Zr, Cr and Mn during hot rolling. Due to small size and fine
requires small size, small spacing and coherent or semi-coherent interface with the
matrix. However, dispersoids can nucleate microvoids and this is undesirable. In 7075
common in 7050 and other high strength aluminium alloys [1]. The type of
the alloy are dependent on the quench rate. An important factor that contributes to
quenching rate on strength of some aluminium alloys [1]. As the quenching rate is
25
Figure 2.7: Continuous and discontinuous distribution of precipitates along grain
boundary in T6 and T7 temper respectively [29]
Figure 2.8: Dispersoid particles of Al12Mg2Cr (indicated by the arrows) in alloy 7075
[1]
26
However, 7075 alloy exhibits more loss of strength compared to 7050 alloy. 7075 and
7050 alloys show that the type of dispersoid affects quench sensitivity. As shown in
Figure 2.9, 7050 is less quench sensitive compared to 7075 alloy [1]. In 7075 alloy,
during quenching thereby causing reduction in strength called quench sensitivity. The
loss of strength is due to reduction in the concentration of solute atoms available for
600
Tensile strength (MPa)
550
500
7050
7075
450
400
1 10 100 1000
Figure 2.9: Effect of quenching cooling rate on strength of aluminium alloys [adapted
from 1]
27
2.6.2 Electrical conductivity
Electrical conductivity (EC) is used to easily assess the stress corrosion cracking
resistant. It is believed that there is a direct relationship between SCC resistance and
electrical conductivity. This means that as aging increases, EC increases and the SCC
EC for T73 treated 7075 alloy is 38% IACS (International Annealed Copper
Standard) while T6 is 31-33% IACS [42]. Heat treatments are often designed to
tempers can be due to the amount of impurity element and solutes in the solid
increases resistivity and decreases EC. EC can also be related to hardness and
strength. Strength decreases due to loss of strengthening phases to the solid solution
after quenching from SHT. During aging, formation of precipitates increases strength
but decreases the amount of solutes in the matrix. Intermediate precipitates and GP
zones are associated with coherent strain and this induces scattering effect (deviation
from straight trajectory by one or more paths) on electrons thereby decreasing EC.
28
precipitates (as in T7 temper) causing loss of strength. This transformation reduces
Tsai et al. suggested that the correlation between EC and SCC resistance holds in the
near peak aging (T4) and overaged condition (T7) in a particular alloy [44]. For
instance, the EC of 7475-T6 is higher than 7075-T6 (as expected in view of the higher
impurity elements in 7075). However, results of SCC test showed that the average
less than 7475-T6 as expected, but the average time to failure to SCC is longer in as-
quenched state than the T6 [44]. This shows that even though the relationship between
EC and SCC resistance has been established for T6 and T7 temper, there is need to
understand the SCC response of EC values between these two extremes. The effect of
HTPP heat treatment on EC of 7075 and 7050 alloys as it relates to SCC resistance
29
CHAPTER THREE
discrete locations on a component while the other parts of the component corrode at a
much slower rate. Localized corrosion may be due to breakdown of protective oxide
film or the effect of localized condition of the environment [47]. Among different
alloys.
grain boundaries and regions closely adjacent to grain boundaries while the grains
remain unattacked [48]. The selective attack on the grain boundary region is due to
resistance in the alloy [48]. Intergranular corrosion penetrates into the material until
the ease of transportation of corroding species and oxygen through the corrosion path
along the grain boundary. At the limiting depth, intergranular corrosion spreads over
to detect without the help of a microscope. Also, the sharp crack tips serve as stress
raisers making the component more prone to fatigue failure [32, 49].
30
3.2 Exfoliation Corrosion
insoluble corrosion products along the grain boundary. Figure 3.1 shows an example
pressure on the grains causing swelling, leafing or lifting effect as shown by the
arrows in Figure 3.1. Exfoliation corrosion often starts from the sheared edge of the
material and progresses laterally into the material [32, 49, 51].
Exfoliation corrosion is highly deleterious because the corrosion rate is linear. This is
due to continuous splitting action of the grains exposing a fresh, film free surface.
Also, the strength of the material is lost due to the splitting off of uncorroded material
[32, 49].
Figure 3.1: Exfoliation corrosion causing delamination shown by the red arrows [50]
31
Exposure to salt, acidic deposits and high temperature accelerates the delamination of a
corrosion especially in the peak age (T6) condition. The mechanism involves
electrochemical reaction between grain boundary precipitate (anode) and the matrix
Stress corrosion cracking (SCC) is a form of intergranular corrosion that involves the
moisture or aqueous solutions) and a susceptible material [32]. SCC often causes
required for SCC to occur may be externally applied (due to use of the component in
service) or residual (initiated during manufacturing) at stress levels lower than the
yield stress [32]. As indicated by the arrows, Figure 3.2 shows the presence of stress
detect by casual inspection, it causes slight metal loss but higher loss of mechanical
strength. Also, the cracks produced can initiate fast fracture of component as shown in
Figure 3.2 [52]. SCC in aluminium alloys is characterized by the presence of static
tensile stress. Most intergranular cracks are propagated perpendicular to tensile stress
[32, 49]. Fracture mechanics is usually used to evaluate SCC susceptibility. This
involves the use of pre-cracked specimens to relate the plane strain stress intensity at
32
Figure 3.2: Stress corrosion cracking (shown by arrows) in a 7075-T6 wing lock [52]
The actual mechanism of SCC is not fully understood. However, two commonly
accepted theories are stress assisted dissolution and stress sorption cracking
mechanism [33].
Stress assisted dissolution considers that heat treatment develops certain microstructural
features (e.g. grain boundary precipitates, precipitate free zone) with different
with respect to others. This generates a galvanic cell, causing dissolution of the anodic
part leading to crack initiation by formation of pits [33]. Pits serve as stress raisers
such that application of tensile stress causes plastic deformation in the crack tip region
due to high stress concentration. The cold work effect of plastic deformation in this
region increases the local energy level making the material more susceptible to
33
corrosion. Film rupture mechanism proposes that protective film is initiated after
anodic dissolution. However, further application of tensile stress causes rupture of the
passive film, allowing more metal dissolution in the environment and continuous
boundary. This creates the precipitate free zone that is depleted of precipitates
galvanic corrosion cell between the PFZ and the solute rich matrix causing anodic
dissolution [32, 49]. However, experimental results showing that condensation will
not occur at the tip of a propagating crack at relatively low humidity, suggest that
The stress sorption cracking mechanism proposes that SCC occurs due to adsorption
of damaging species into the material causing weakening of atomic bonds. The
presence of the damaging species in the interstitial spacing of the grain boundary
reduces the surface energy and weakens the atomic bonds. Hydrogen is a peculiar
damaging specie causing hydrogen damage or hydrogen induced cracking (HIC) [33].
hydrogen ion. This causes high concentration of hydrogen atoms. The diffusion of the
atomic hydrogen into the grain boundary of the material causes breakdown of atomic
bonds. Also, the atomic hydrogen could migrate to preferred locations like voids and
combine to produce hydrogen gas. This reaction generates high pressure that causes
34
3.4 Effect of slip character on stress corrosion cracking in Al-Zn-Mg-Cu
alloys
Aging heat treatment carried out after quenching develops microstructural features
that influence the SCC behavior of a material. An important effect of aging is the
change in slip character of dislocations in the material. Slip character measures the
Within the underaged to peak age condition, the precipitates are small and deformable.
This causes long dislocation lines and planar slip character. Figure 3.3 shows planar
slip character of dislocations in a nickel based superalloys [56]. In planar slip, a high
coherent or coherent phases like GP zones and intermediate precipitate (η′) structures
motion. Planar slip bands formed due to this interaction impinges on the grain
boundary causing shear stress concentration. Therefore, in planar slip, cracks with
sharp tips are formed, increasing the susceptibility to SCC [40, 53, 57].
Figure 3.4 shows the wavy slip character of dislocations in a nickel based superalloys
[56]. Overaging heat treatment causes precipitate particles to grow and lose coherency
with the matrix. Due to prolonged aging, there is decrease in the concentration of
35
.
Figure 3.3: TEM micrograph showing planar dislocation slip in a nickel based
superalloy [56]
Figure 3.4: TEM micrograph showing dislocations in wavy slip in a nickel based
superalloy [56]
36
3.5 Influence of grain boundary precipitate structure on SCC
The structure of the grain boundary precipitate is largely affected by aging treatment.
(formed during the peak age) to discontinuous distribution in the overaged condition.
In Al-Zn-Mg-Cu alloys, overaging decreases the crack growth rate as the grain
precipitate morphology has been widely used to explain the theory that SCC occurs
SCC is not clear. Decrease in crack growth rate as the size of grain boundary
precipitates increases has been used to explain the decrease in susceptibility of Al-Zn-
Mg-Cu alloy to SCC. One explanation for this is that grain boundary act as internal
sacrificial anode during SCC [40]. This means that in Al-Zn-Mg-Cu alloys, SCC
boundary region. Heat treatment to T7 and RRA temper causes the precipitates to
grow to larger volume such that anodic dissolution does not increase SCC [59].
Higher SCC resistance has also been related to the ability of large grain boundary
precipitates to act as hydrogen discharge sites thereby reducing SCC through HIC [60,
61]. However, other studies have reported that SCC resistance is improved by
37
3.6 Influence of magnesium and copper content
Zn-Mg-Cu alloys. Song et al. showed that the amount of magnesium segregated at the
grain boundary decreases as the aging time increases in 7050 alloy aged at 145 oC
[63]. The decrease in magnesium solute segregated at the grain boundary can be
grain boundary embrittlement [63]. It has been shown that magnesium is important in
on external surface.
[65].
Grain boundary segregation studied by Hepples et al. show that Mg segregated at the
SCC resistance in T7 and RRA compared to T651 temper shows that Mg segregation
in the grain might not be the main factor responsible for SCC in Al-Zn-Mg-Cu alloys.
and 7050 alloy [15]. Research work on the effect of copper on SCC shows that
38
increasing the copper content of alloys decreases crack growth velocity in Al-Zn-Mg-
Cu alloys [66]. The presence of copper modifies the difference between the
electrochemical potential at the matrix and the grain boundary region thereby
reducing SCC through an anodic dissolution mechanism [67]. Also, a high amount of
copper slows down the kinetics of hydrogen evolution [68]. Copper also segregates at
the grain boundary causing toughening of the grain boundary region [64]. It has been
reported that copper content in grain boundary precipitate of 7075 alloy in the
overaged condition is higher compared to peak aged condition. This shows that
changes in the chemistry of grain boundary to increase copper content can improve
The relationship between stress corrosion crack growth velocity (da/dt) and stress
intensity at the crack tip (K) is shown in the stages involved in SCC. Figure 3.5 shows
the V-K (crack growth velocity versus stress intensity) plot established for materials
that are susceptible to SCC [13]. This plot is used to evaluate SCC behavior of
susceptible materials. As shown in the Figure, the upper limit given as stress intensity
factor (KIC) is a design factor of the material [40]. KIC corresponds to the plane strain
crack tip stress intensity that causes unstable fast fracture [40, 69].
Three distinct regions are shown in Figure 3.5 [69]. Region I on the V-K plot shows
the first stage of SCC at low stress levels. In this region, crack growth rate is
below the KISCC, unstable crack growth does not occur. In region I, as the stress
39
KIC
Region II shows the second stage of SCC and the crack growth rate is independent of
stress intensity. As stress intensity increases, the velocity of crack growth remains
constant. This shows the influence of other factors like environment and composition
of materials on crack growth rate [69]. In region III, the crack growth rate is
dependent on stress intensity. As the stress intensity approaches KIC, the crack growth
rate also increases causing fracture of the component. Thus, the stages in crack
growth can be divided into crack initiation (stage I), propagation (stage II) and
fracture (stage III) based on Figure 3.5. KISCC (in region I) and plateau velocity (in
region II) are often used to characterize susceptibility or resistance of alloys to SCC.
Higher KISCC and lower plateau velocity are common in SCC resistant tempers like T7
Although SCC is as a result of several factors, infinite life design can be used to
reduce catastrophic failure due to SCC. This requires that the sum of in-service,
40
residual and fabrication stresses must be below the threshold stress level. However, at
such low stress intensity, the component will be thick and heavy. Conversely,
cracks or flaws within stage I and II such that inspection and repair process would
detect the flaw before it can cause catastrophic failure [70, 71]. Although structures
with thin sections can be designed with this approach, there is higher risk of missing
41
CHAPTER FOUR
The main heat treatments that have achieved better resistance to SCC in Al-Zn-Mg-
4.1 Overaging
Overaging involves prolonged aging of the alloy beyond maximum hardness from T6
to T7 temper. T6 temper is obtained by SHT at about 465 oC for 1-2 hours followed
T6 temper at about 177 oC for 7-8 hours [1]. Overaging heat treatment achieves
A number of factors have been used to explain the improvement in SCC resistance
through overaging heat treatment. It has been reported that overaging causes increase
in size and discontinuity in the distribution of precipitates along the grain boundary as
anodic dissolution and prevents a continuous path for corrosion along the grain
grain boundaries from planar to wavy slip. In wavy slip character, homogenous
distribution of dislocations causes blunting of crack tip and increases SCC resistance
[40]. Large grain boundary precipitates formed during overaging can trap atomic
hydrogen to form bubbles. These bubbles cause blunting of the crack tip thereby
42
requirement for structural parts in aerospace applications. This was the main
The retrogression and reaging heat treatment was developed by Cina based on the
principle that SCC is due to the high dislocation density formed during quenching
from SHT [14]. RRA involves carrying out peak aging heat treatment to achieve T6
hardening temperature but below the SHT temperature. As shown in Figure 4.1, 7075
alloys are usually retrogressed at 200-260 oC for about 5 minutes. The retrogression
step is carried out for a short time to prevent overaging. This is followed by reaging
reoccur [14].
Figure 4.1: Schematic showing retrogression and reaging heat treatment procedure
43
It is believed that the short retrogression step dissolves dislocation network responsible
for SCC [14]. Various works have shown that RRA can achieve high SCC resistance
and high strength and as obtained in T6 and T7 respectively [24, 43, 72]. Figure 4.2
shows the effect of RRA treatment on SCC resistance of 7075 alloy [24]. RRA
T6 temper. Also, high SCC resistance was observed in the sample subjected to only
retrogression heat treatment without reaging. This is shown by the higher KISCC and
lower stage II plateau crack growth rate in T7 and RRA samples compared to T6
temper. Further work done by Cina reaffirmed that RRA improves SCC resistance
through dissolution of dislocation density during the retrogression step [14, 73]. It is
believed that the high temperature involved in retrogression step is just enough to
Figure 4.2: Effect of heat treatment on SCC resistance in 7075 alloy heat treated to
T6, T73 and RRA retrogressed at 220oC for 1and 5 minutes respectively [24]
44
Dislocations can transport hydrogen atoms through the grain boundaries. Also, high
dislocation density provides additional stress field at the grain boundary that can
cause crack initiation. Hence, Cina’s work showed that decrease in dislocation density
Increase in SCC resistance through RRA has also been related to large, discontinuously
distribution of precipitates along the grain boundary of 7075 alloy after RRA
treatment [24, 29, 40]. Since SCC occurs at the grain boundary, discontinuous
for corrosion to occur. As explained in the previous chapter, the size of grain
However, application of RRA to thick sections of materials is difficult due to the short
retrogression time involved. Although Figure 4.2 shows that longer retrogression time
can achieve higher SCC resistance, Figure 1.4 shows that longer retrogression time
causes overaging and loss of strength. In order to achieve a high SCC resistance and
high strength, it is important to use a very short time for the retrogression step.
However, short retrogression time makes it difficult for the heat treatment to achieve
application of RRA heat treatment to thin section of materials. 7075 and 7050 alloys
45
Figure 4.3: Discontinuous grain boundary precipitates in 7075 RRA [29]
Hence, there is need to develop a heat treatment that will achieve a good combination
of strength and SCC resistance without using high temperature involved in retrogression
process.
potential heat treatment procedure that could increase resistance of 7xxx series alloys
to SCC [26, 28]. Figure 4.4 shows the steps involved in HTPP process. HTPP involves
controlled cooling to a temperature in the two phase region and quenching. This is
followed by aging as shown in Figure 4.4. It is believed that due to the controlled
cooling through the solvus, preferential heterogeneous precipitation will occur at the
46
Figure 4.4: High temperature pre-precipitation heat treatment procedure showing
(intermediate) TF/Q temperature
These precipitates serve as nucleation sites for more precipitation to occur during
Huang et al. studied the effect of HTPP heat treatment on experimental 7A52 alloy
(composition is included in Table 1.1) [26]. Stepped SHT was carried out at 465 oC
for 30 minutes, heated to 470 oC for 30 minutes and 475 oC for 1 hour. This was
followed by controlled cooling at 30 oC/h to 400 oC. This temperature was held for 30
minutes followed by quenching and aging at 100 oC for 10 hours and 150 oC for 24
hours. The results showed that HTPP can achieve a combination of increase in
strength and resistance to SCC without significant loss of strength (just about 1.8%
alloy. TEM observation of 7A52 alloy after HTPP showed the presence of finely
47
In another study, Huang et al. carried out HTPP treatment on 7055 alloy using stepped
SHT at 450 oC for 1 h, 470 oC for 1 h and 480 oC for 3 h [28]. This was followed by
The samples were held at this temperature for thirty minutes before quenching. Aging
was carried out at 130 oC for 24 h. The results showed that HTPP can achieve
Further study of 7075 alloy by Li et al. showed that HTPP achieved better SCC
resistance, but loss of strength in the alloy [29]. Figure 4.5 shows TEM micrograph of
7075 matrix after HTPP. Figure 4.5 (a) shows that the loss of strength after HTPP can
in the matrix due to loss of solute element to grain boundary region during heterogeneous
strengthening precipitates in the matrix [29]. The loss of strength can also be due to
formation of coarse precipitates in the matrix as shown in Figure 4.5 (b). Figure 4.6
related to heterogeneous precipitation due to controlled cooling below the solvus [29].
commercial 7xxx alloys in terms of strength and resistance to SCC. This thesis
research will focus on applying HTPP heat treatment to commercial 7050 and 7075
aluminium alloys. Particularly, the effect of the intermediate temperature to which the
sample is cooled before quenching will be studied and related to strength (measured
48
(a) (b)
Figure 4.5: Micrographs of (a) fine and (b) coarse precipitates in the grains of HTPP
temper [29]
Figure 4.6: Discontinuous precipitates at the grain boundary region of HTPP temper
[29]
49
4.4 Effect of heat treatment on grain boundary segregation
Heat treatment affects solute segregation along the grain boundaries. Hepples et al
analyzed the effect of T651, T73 and RRA heat treatment conditions on grain
boundary segregation in 7150 alloy [62]. Figure 4.7 shows that the copper solute
concentration in T651 is high as shown in Figure 4.7 (a). Figure 4.7 (b) and (c) shows
that there is decrease in copper solute concentration at the grain boundary in T73 and
precipitates in T73 and RRA compared to T651 temper. Similar trend was observed
for Zn. Low Mg level was observed in T651 but, this increased in T73 and RRA
conditions [62]. Huang et al. showed that HTPP can increase the copper solute
50
Cu
Mg
Zn
(a)
Mg
Cu
Zn
(b)
Mg
Cu
Zn
(c)
Figure 4.7: Concentration profile of Zn, Mg and Cu solute segregated across the grain
boundary of (a) T651 (b) T73 (c) RRA tempers of 7150 alloy [62]
51
CHAPTER FIVE
EXPERIMENTAL PROCEDURE
The effect of HTPP on properties of 7075 and 7050 commercial aluminium alloys
was determined by carrying out HTPP treatment on the as-received tempers of both
alloys (T651 and T74 respectively). Samples of both materials were subjected to
HTPP treatment and standard heat treatments of peak aging (T6) and overaging (T7)
temper. The effect of the heat treatment on hardness and electrical conductivity were
tested before and after aging. Exfoliation corrosion tests were carried out on selected
heat treated samples. Double beam stress corrosion tests were used to determine SCC
The materials used in this research are rolled plate of 7075-T651and 7050-T74 of
thickness 1 in and 1.5 in respectively. The actual composition (given by suppliers) and
nominal compositions of the alloys are listed in Table 5.1. The longitudinal (L)
direction is parallel to the rolling direction of the plate, transverse (T) direction is
perpendicular to the rolling direction while short (S) direction is parallel to the
The heat treatments applied are standard T6, T7 tempers and ten HTPP treatments.
The heat treatment procedure is listed in Table 5.2. Heat treatments were conducted in
a box furnace shown in Figure 5.1. To achieve the desired sample temperature, a
52
thermocouple located immediately adjacent to the sample was used as an input to the
furnace temperature control. The furnace was heated to 465 oC for about two hours.
Table 5.1: Nominal and actual composition of 7075 and 7050 alloys used*
Composition (wt %)
Alloy Al Zn Mg Cu Fe Si Mn Ti Cr Zr Others
7075 Bal. 5.1- 2.1- 1.2- 0.5 0.4 0.3 0.2 0.2- 0.01 0.5
Nom. 6.1 2.9 2.0 0.3
7075 Bal. 5.6 2.5 1.5 0.2 0.09 0.03 0.03 0.20 0.01 0.03
Act.
7050 Bal. 5.7- 1.9- 2.0- 0.2 0.12 0.1 0.06 0.04 0.08- 0.5
Nom. 6.7 2.6 2.6 0.12
7050 Bal. 6.0 2.2 2.22 0.1 0.04 0.003 0.02 0.004 0.11 0.03
Act.
53
Table 5.2: Analysis of heat treatment procedure
§
SHT-solution heat treatment, WQ-water quench
The samples were then placed in the furnace for SHT. SHT was carried out at 465 oC
and a period of about ten minutes was allowed before starting the solution heat
treatment (SHT) time to allow the sample to reach the solutionizing temperature. For
standard tempers like T6 and T7, SHT was carried out for one and half hours. This
was followed by quenching in cold water at 0 to 2 oC. The time lapse before quenching
did not exceed 15 seconds as specified in the standard [33]. This was followed by
aging at 121 oC for 24 hours using a silicone oil bath shown in Figure 5.2 to obtain T6
temper. T7 temper was obtained by further aging of T6 samples at 177 oC for 7 hours.
54
Figure 5.1: Box furnace used for HTPP treatment
Figure 5.2: Fisher Scientific silicon oil bath used for aging treatment
55
The procedure for HTPP treatment is schematically represented in Figure 5.3. HTPP
samples were first subjected to SHT at 465 oC for one hour followed by slow cooling
intermediate temperature to which the sample was cooled before quenching is referred
shown in Figure 2.4, the choice of TF/Q temperature is based on the solvus temperature
of the alloy. For 7075 alloy, solvus temperature is approximately at 420 oC. It is
believed that appreciable precipitation would occur just below the solvus temperature.
Hence, cooling to temperatures above and below solvus will show the effect of pre-
precipitation on the properties of the alloys. Previous work show that cooling rate of
30 oC/h has been useful in studying the effect of HTPP on Al-Zn-Mg-Cu alloys [26,
Solution heat
o treatment
465 C Controlled cooling
o
(30 C/h)
o
T F/Q = 455-370 C
Water quenching
o Aging
121 C
1h 24 h
56
5.3 Electrical conductivity testing
Following heat treatment, the samples were prepared by polishing to 1200 fine grit on
SiC paper. Electrical conductivity testing was carried out using digital electrical
conductivity tester (EE0021 eddy current device) shown in Figure 5.4. For each
measurement, the meter was first calibrated using standard copper and aluminium
probe of the tester was placed on the polished surface to obtain values of electrical
57
5.4 Hardness testing
Hardness testing was conducted on the same samples used for EC testing using the
Versitron Rockwell tester shown in Figure 5.5. The measurements were taken on
Rockwell scale B recommended for aluminium alloys. Using a standard sample, the
58
5.5 Corrosion tests
Test specimens of 50×100×5 mm (in LS, TL and TS direction respectively) were cut
from the as-received plates. Exfoliation tests were carried out on samples subjected to
selected heat treatments, including T6, T7 and HTPP treated samples of TF/Q = 455,
425, 405 and 370 oC. Figure 5.6 shows front and back view of a sample prepared for
grinding using SiC paper followed by polishing the surface (TL direction) to 6 micron
and 1 micron using diamond solution. The samples were rinsed with water and dried
in air. The other surfaces apart from the one being observed were coated with paraffin
wax. Exfoliation corrosion test was conducted according to ASTM G34 standard [74].
The test solution had a composition of 4.0 M of NaCl, 0.5 M of KNO3 and 0.1 M of
HNO3. The solution was prepared by dissolving 234 g of NaCl, 50 g of KNO3 and 6.3
mL of conc.(70 wt%) HNO3 in 1litre of distilled water. The solution was maintained
at room temperature [74]. The samples were immersed in the test solution in a
direction to prevent loss of exfoliated material. The specimens were exposed for 48
hours followed by visual inspection. The exfoliation corrosion susceptibility was rated
based on Table 5.3. This rating system is a modified version of the ASTM standard to
59
Table 5.3: Modified exfoliation corrosion rating
CORROSION RATING
RESULT
Severe Exco 8
Moderate Exco 7
Mild Exco 6
Light Exco 5
Severe General 4
Moderate Pitting 3
Light Pitting 2
Areas Unattacked 1
(a) (b)
Figure 5.6: Polished plate prepared for exfoliation corrosion test showing (a) polished
surface (b) unexposed parts coated with paraffin
60
5.5.2 Stress corrosion test (Double beam test)
Stress corrosion testing was carried out using the pre-cracked double beam (DB)
included in appendix A) were cut from plates of 7075 and 7050 alloy respectively.
Modification of ASTM standard is in the use of straight notch at 50o angle for easy
machining. Heat treatment was conducted on these samples based on the procedure
given for selected tempers including standard temper T6, T7 and HTPP treated
samples with TF/Q = 455, 425, 405 and 370 oC for both 7075 and 7050 alloys. T74 (as-
received) condition was also tested for the 7050 alloy. Three samples were tested for
each of the conditions of 7050 alloy. For 7075 alloy, two samples were tested for each
HTPP condition and one sample was used for T6 and T7 temper respectively. Final
machining was carried out after heat treatment to get a smooth surface and to create a
notch in the sample. The samples were machined to notch angle 50o to create a sharp
tip such that the direction of crack growth was in SL (short-long) direction. After
machining, the SL surface was ground using 1200 SiC paper to remove scratches.
This was followed by cleaning using ultrasonic bath to remove grease and dirt.
The DB samples were tested in constant displacement condition by using steel bolts
as shown in Figure 5.7. The steel bolts were mechanically loaded to create a pre-
crack. The length of initial crack (ao) was measured from the load line to the root of
the crack. Load line crack opening displacement (Vo) was measured from the
displacement in the crack opening at the load line. A corrosion solution of 3.62%
NaCl was added to the samples in three drops, twice a day. The temperature during
the test period is provided in appendix B. Measurements of crack length were taken as
average of crack length on both sides of the samples at intervals by using a travelling
61
microscope (Model TVM-02 made by Scientific equipment and services) shown in
Figure 5.8. The greatest possible error is 0.05. To get an accurate crack length
reading, build-up of corrosion products were removed using a soft brush [75]. The
time of taking measurements were recorded in hours. The starting stress intensity K I
as a function of crack length was determined using the relationship between stress
intensity obtained from equation 1 and crack length as shown in Figure 5.9. This
relationship shows the effect of the crack growth on stress intensity. The initiation of
crack causes stress concentration at the crack tip. As the crack length increases, stress
KI = (1)
Where:
62
Loading bolt
Pre-crack
63
25
15
10
0
0 20 40 60 80 100
Crack length (mm)
Optical microscopy was used to analyse the as-received materials and the exfoliation
Cutting small blanks of about 5 mm thick from the material using Electrical
Discharge Machining.
Cleaning with soapy water soaked in cotton wool and rinsing in water.
Cleaning using Ultrasonic bath for about 15 minutes followed by rinsing with
64
Metallographic preparation for Transmission Electron Microscope observation
involved cutting of thin foil from heat treated coupons and grinding on both sides to
obtain a smooth surface on samples of about 100 µm thick. Figure 5.10 shows stages
from these samples and dimpled (to reduce the thickness at the center) to depth of
about 50-60 µm (as shown in Figure 5.10 (a)). This was followed by electropolishing
temperature of the electrolyte was cooled to -40 oC using liquid nitrogen. Figure 5.10
(b) shows the hole in an electropolished sample. Two grain boundaries were selected
to analyze the segregation of solute elements across grain boundary regions. Using
DigitalMicrograph software, a line scan was drawn across the grain boundary and
grain boundary was obtained using a beam diameter of 1nm for EDS analysis in
Scanning Transmission Electron Microscope (STEM) mode. The same procedure was
repeated on another grain boundary and compositions obtained were recorded for
each point.
65
(a) 1000 μm (b)
Figure 5.10: Stages of preparation of 3 mm TEM sample showing (a) dimpled surface
(b) polished surface (arrow shows the hole)
66
CHAPTER SIX
EXPERIMENTAL RESULTS
Tables 6.1 and 6.2 show the electrical conductivity (EC) values measured before and
after aging of 7075 and 7050 alloy respectively. EC of as-received material and
standard T6 and T7 tempers are also listed in Table 6.2. Figure 6.1 compares the EC
of 7075 and 7050 alloy (listed in Tables 6.1 and 6.2) in the unaged and aged condition
aging has little effect on EC of HTPP treated samples. This indicates that EC of HTPP
treated samples is determined prior to aging. However, there is gradual increase in the
EC as TF/Q temperature decreases. In fact, 7050 alloy heat treated to HTPP at TF/Q =
370 oC has the same EC as the T7 temper. The results for both alloys shows a sharp
increase in EC for HTPP treated alloys at TF/Q = 445 and 415 oC in both the aged and
67
Table 6.1: Electrical conductivity results of 7075 alloy before and after aging
ELECTRICAL
HEAT CONDUCTIVITY RESULT
TREATMENT (%IACS)
(7075 ALLOY) Before aging After aging
68
Table 6.2: Electrical conductivity results of 7050 alloy before and after aging
ELECTRICAL
HEAT CONDUCTIVITY RESULT
TREATMENT (%IACS)
(7050 ALLOY) Before aging After aging
69
Electrical Conductivity (%IACS)
44
42 T74
40 T7
7050 unaged
T7
38
7075 unaged
36
7050 aged
34
7075 aged
32
30
T651 T6 455 445 435 425 415 405 395 385 375 370
TF/Q (oC)
Figure 6.1: Effect of heat treatment on electrical conductivity of 7075 and 7050
alloys. Green broken lines indicate as-received T74 and standard T7 temper of 7050
alloy. Purple line indicates standard T7 temper of 7075 alloy
Tables 6.3-6.6 list the hardness measurements of 7075 and 7050 alloys before and
after aging. In tables 6.4 and 6.6, hardness of the as-received material and standard
tempers T6 and T7 are also listed. Figure 6.2 and 6.3 shows the effect of HTPP heat
It is evident from these results that there is loss of strength in the alloys before aging
observed in both alloys after aging. This result is comparable to 10-15% loss of yield
strength in T7 temper reported in the literature [10]. The results show that subsequent
70
aging of HTPP treated samples increases the hardness in both alloys. However,
Heat Treatment LT LS TS
71
Table 6.4: Hardness result (HRB) of 7075 alloy after aging
Heat Treatment LT LS TS
Heat Treatment LT LS TS
72
Table 6.6: Hardness result (HRB) of 7050 alloy after aging
Heat treatment LT LS TS
73
100
90
80
T7
70
Hardness (HRB)
60
50
40
30
7075 unaged
20 7075 aged
10
0
T651 T6 455 445 435 425 415 405 395 385 375 370
TF/Q (oC)
Figure 6.2: Effect of HTPP heat treatment on hardness of 7075 alloy. The green
broken line shows hardness obtained for T7 temper
100
90
80 T7/T74
70
Hardness (HRB)
60
50
7050 unaged
40
7050 aged
30
20
10
0
T6 455 445 435 425 415 405 395 385 375 370 T7
TF/Q (oC)
Figure 6.3: Effect of HTPP heat treatment on hardness of 7050 alloy. The red broken
line shows hardness obtained for T74 and T7 temper
74
6.3 Corrosion test results
The samples used for exfoliation corrosion tests are shown in Figures 6.4 and 6.5 for
7075 and 7050 alloy respectively. The results presented in these Figures show one
sample out of the two samples tested for each condition. The extent of exfoliation
corrosion was rated based on the surface appearance of samples after exposure to
It is evident that both alloys are susceptible to exfoliation corrosion in almost all the
conditions. From Figure 6.4 and 6.5 (a) and (b), T6 and TF/Q = 455 oC samples showed
severe exfoliation and loss of material across the entire surface. Both alloys showed
light exfoliation in TF/Q = 425 oC conditions. From Figure 6.4 and 6.5 (d) and (e), it
appears that samples treated to TF/Q = 405 oC were more susceptible to exfoliation
corrosion than TF/Q = 425 oC conditions. The cause of this variation in EXCO
resistance despite lower TF/Q should be further investigated. From Figure 6.4 and 6.5
(e), TF/Q = 370 oC samples showed general pitting across the surface of the samples.
Figure 6.4 and 6.5 (f) shows that T7 temper is highly resistant to exfoliation corrosion.
These results show that, samples treated to HTPP at TF/Q = 425 and 370 oC showed
Although, none of the HTPP treated samples achieved as good corrosion resistance as
resistance to the T7 temper. The TF/Q = 370 oC samples showed pitting corrosion while
few pits were observed in T7 temper. The presence of pits has been related to increase
75
Figure 6.6 shows the optical micrograph of an exfoliated sample. It is evident from
image also shows the leafing effect of corrosion products in exfoliation corrosion. The
pitting corrosion observed in T7 samples and HTPP samples treated to TF/Q = 370 oC
of both alloys show that there is a direct relationship between exfoliation corrosion
and SCC.
T6 32.6 32.5 8 8
TF/Q = 455 oC 32.7 32.6 7 8
TF/Q = 425 oC 35.1 34.0 5 5
o
TF/Q = 405 C 37.2 36.3 6 7
TF/Q = 370 oC 40.1 38.3 4 4
T7 40.2 39.3 1 1
76
10cm
10 cm
Figure 6.4 (a): EXCO sample of 7075 alloy in T6 temper showing severe exfoliation
and disintegration of the sample surface
10 cm
Figure 6.4 (b): EXCO sample of HTPP treated 7075 alloy at TF/Q= 455 oC showing
severe exfoliation and disintegration of sample surface
77
10 cm
Figure 6.4 (c): EXCO sample of HTPP treated 7075 alloy at TF/Q= 425 oC showing
light exfoliation on sample surface
10 cm
Figure 6.4 (d): EXCO sample of HTPP treated 7075 alloy at TF/Q= 405 oC showing
moderate exfoliation on sample surface
78
10 cm
Figure 6.4 (e): EXCO sample of HTPP treated 7075 alloy at TF/Q= 370 oC showing
severe general pitting on sample surface
10 cm
Figure 6.4 (f): EXCO sample of 7075 alloy in T7 temper showing some pitting and
unattacked areas on the sample surface
Figure 6.4: EXCO behaviour of 7075 samples in (a) T6 (b) TF/Q = 455 oC (c) TF/Q =
425 oC (d) TF/Q = 405 oC (e) TF/Q = 370 oC (f) T7 temper
79
10 cm
Figure 6.5 (a): EXCO sample of 7050 alloy inT6 temper showing severe exfoliation
of sample surface
10 cm
Figure 6.5 (b): EXCO sample of HTPP treated 7050 alloy at TF/Q = 455 oC showing
severe exfoliation corrosion on sample surface
80
10 cm
Figure 6.5 (c): EXCO sample of HTPP treated 7050 alloy at TF/Q = 425 oC showing
light exfoliation of sample surface
10 cm
Figure 6.5 (d): EXCO sample of HTPP treated 7050 alloy at TF/Q = 405 oC showing
mild exfoliation of sample surface
81
10 cm
Figure 6.5 (e): EXCO sample of HTPP treated 7050 alloy at TF/Q = 370 oC showing
some pits and areas unattacked on sample surface
10 cm
Figure 6.5 (f): EXCO sample of 7050 alloy in T7 temper showing some pits and areas
unattacked on sample surface
Figure 6.5: EXCO samples of 7050 alloy in (a) T6 (b) TF/Q = 455 oC (c) TF/Q = 425 oC
(d) TF/Q = 405 oC (e) TF/Q = 370 oC (f) T7 temper
82
Figure 6.6: Optical micrograph of a section of an exfoliated sample showing
intergranular corrosion
Tables 6.8 and 6.9 summarize SCC results obtained from double beam samples of
7075 and 7050 alloys respectively. The SCC behaviour of heat treated samples was
measured in terms of crack length versus time. The data for these results are in
appendix C. Since more than one samples were tested, Figure 6.7 compares change in
crack length in each sample of TF/Q = 455 and 370 oC 7075 alloy. This Figure shows
the consistency and similarity in trends for results obtained from samples with the
83
Table 6.8: Summary of results obtained from 7075 double beam samples
Initial Final
Crack Initial Final stress stress
opening crack crack intensity intensity
Heat Time displacement length length KI Kf
Treatment (h) Vo (m) ao (m) af (m) (MPa√m) (MPa√m)
Initial Final
Crack Initial Final stress stress
opening crack crack intensity intensity
Heat Time displacement length length KI Kf
Treatment (h) Vo (m) ao (m) af (m) (MPa√m) (MPa√m)
84
140
120
455 o1C-Sample 1
TF/Q=455-
7075
Crack length (mm)
100
TF/Q455-2 o
= 455 C-Sample 2
80 7075
0
0 200 400 600 800 1000 1200 1400
Time (h)
Figure 6.7: Comparism of crack length with time in two SCC samples for each of
7075 alloy treated at HTPP condition TF/Q = 455 and 370 oC
Figures 6.8 and 6.9 show the effect of heat treatment on SCC resistance (of 7075 and
7050 alloys respectively) measured in terms of the crack length at time intervals. The
results show that T6 temper is very susceptible to SCC while T7 is very resistant. The
results show that HTPP improved the resistance to SCC in all the conditions tested.
This is shown by the gradual decrease in the crack length as TF/Q decreases. It is
evident from these results that HTPP heat treatment affects SCC resistance of both
Figure 6.10 and 6.11 show the results obtained from crack growth rate (da/dt or V)
versus stress intensity (K) for each of the tested condition in 7075 and 7050 alloy
respectively. Data for all the samples and conditions tested are included in appendix
C. The plots show the stages of SCC during the test. Figures 6.12 and 6.13 show the
summary of V-K plot of all the tested conditions for 7075 and 7050 alloy
85
respectively. The results show that the corrosion rate decreased as the TF/Q decreased.
This is shown in the decrease in the plateau velocity and threshold stress intensity as
TF/Q decreases as shown in Figures 6.12 and 6.13. This shows that HTPP can improve
SCC resistance in 7075 and 7050 alloys. In Figure 6.12, it appears that at TF/Q = 370
o
C and T7 conditions, the stress corrosion cracking of 7075 alloy remained in stage II.
This shows that TF/Q = 370 oC and T7 conditions are highly resistant to SCC. Figure
6.13 shows that similar trend of decrease in the plateau velocity and threshold stress
intensity as TF/Q decreases was obtained in 7050 alloy. These results show that
compared to T6 temper HTPP can achieve increase in SCC resistance but, none of the
HTPP conditions achieved better SCC resistance compared to T7 and T74 tempers.
From Figure 6.13, it appears that T74 temper has better SCC resistance compared to
T7. The high SCC resistance in T74 temper can be attributed to the effect of cold
Generally, it is believed that 7050 alloy has higher SCC resistance than 7075 alloy.
This is observed in all the conditions tested except for HTPP treated sample at TF/Q =
370 oC. Figure 6.14 compares V-K plot of 7075 and 7050 alloys at TF/Q = 370 oC
condition. It is noteworthy that at TF/Q = 370 oC, 7050 alloy showed a lesser SCC
Figure 6.8, 6.9, 6.12 and 6.13. By comparing the corrosion results at TF/Q = 370 oC to
EC results in Figure 6.1, 7075 alloy has lesser EC compared to 7050 alloy. This
shows that other factors are involved in determining SCC behaviour of different
The SCC behaviour observed in this research is shows similar trend to previous
studies in the literature. By comparing this result to result obtained by Rajan et al for
86
SCC behaviour of 7075-T651 temper and Huang et al for 7055 at TF/Q = 455 oC,
similar trend of increase in SCC resistance was observed in HTPP treated condition
compared to the T651 temper [24, 28]. However, it appears that results obtained from
this study show that the corrosion rate is faster compared to previous studies. The
faster corrosion rate in the present work can be attributed to higher humidity of the
environment and higher concentration of salt in the solution used in this study.
140
120
Crack length (mm)
100 T6
455
TF/Q= 455 oC
80
425
T = 425 oC
F/Q
60 405
TF/Q= 405 oC
370
T = 370oC
F/Q
40
T7
20
0
0 200 400 600 800 1000 1200 1400 1600
Time (h)
Figure 6.8: Average crack length with time of 7075 double beam samples
87
140
120 T6
455
Crack length (mm)
40 T7
20 T74
0
0 200 400 600 800 1000 1200 1400 1600
Time (h)
Figure 6.9: Average crack length with time of 7050 double beam samples
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.10 (a): Crack growth velocity vs stress intensity of 7075 alloy in T6 temper
88
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.10 (b): Crack growth velocity vs stress intensity of HTPP treated 7075 alloy
at TF/Q = 455 oC
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.10 (c): Crack growth velocity vs stress intensity of HTPP treated 7075 alloy
at TF/Q = 425 oC
89
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.10 (d): Crack growth velocity vs stress intensity of HTPP treated 7075 alloy
at TF/Q = 405 oC
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.10 (e): Crack growth velocity vs stress intensity of HTPP treated 7075 alloy
at TF/Q = 370 oC
90
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.10 (f): Crack growth velocity vs stress intensity of 7075 alloy in T7 temper
Figure 6.10: Crack growth velocity vs stress intensity of 7075 samples showing (a) T6
(b) TF/Q = 455 oC (c) TF/Q = 425 oC (d) TF/Q = 405 oC (e) TF/Q = 370 oC (f) T7
91
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.11 (a): Crack growth velocity vs stress intensity of 7050 alloy in T6 temper
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.11 (b): Crack growth velocity vs stress intensity of HTPP treated 7050 alloy
at TF/Q = 455 oC
92
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Figure 6.11 (c): Crack growth velocity vs stress intensity of HTPP treated 7050 alloy
at TF/Q = 425 oC
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.11 (d): Crack growth velocity vs stress intensity of HTPP treated 7050 alloy
at TF/Q = 405 oC
93
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.11 (e): Crack growth velocity vs stress intensity of HTPP treated 7050 alloy
at TF/Q = 370 oC
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Figure 6.11 (f): Crack growth velocity vs stress intensity of 7050 alloy in T7 temper
94
10
1
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.11 (g): Crack growth velocity vs stress intensity of 7050 alloy in T74
Figure 6.11: Crack growth velocity vs stress intensity of 7050 samples showing (a) T6
(b) TF/Q = 455 oC (c) TF/Q = 425 oC (d) TF/Q = 405 oC (e) TF/Q = 370 oC (f) T7 (g) T74
95
10
T6 & TF/Q = 455 oC
TF/Q = 425, 405 oC
1
TF/Q = 370 oC
da/dt (mm/h)
0.1
0.01
T7
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
T7
da/dt (mm/h)
0.1
T74
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.13: Summary of V-K plot for 7050 alloy
96
10
7050 TF/Q = 370 oC
1
7075 TF/Q = 370 oC
da/dt (mm/h)
0.1
0.01
0.001
0.0001
0 5 10 15 20 25 30
Stress Intensity (MPa√m)
Figure 6.14: Comparism of SCC behaviour in 7050 and 7075 alloy at TF/Q = 370 oC
At the end of the experiment, the samples were broken by mechanical overload.
Figure 6.15 shows the fractured surface of double beam samples of 7050 alloy in T6
and TF/Q = 370 oC condition after SCC test. As shown by the blue arrows in Figure
6.15 (b), the fractured surfaces show the initial crack initiated through mechanical
loading. Addition of corrosive solution to the crack caused stress corrosion crack to
propagate and grow with time. As shown in the TF/Q = 370 oC sample, this is a form of
sample surface. Longer crack length can be observed at the mid-section due to a plane
strain condition at the mid-section versus a plane stress condition at the surface.
97
1 cm
(a)
(b) 1 cm
Figure 6.15: Double beam samples of 7050 alloy in (a) T6 (b) TF/Q = 370 oC
condition after SCC testing. The blue arrows indicate crack growth from right to left.
The red arrows indicate longer crack length in the mid-section compared to the
surface (crack tunneling)
Optical microscopy was used to analyze the as-received material as shown in Figure
6.16. From Figure 6.16 the elongated grains in the alloys are shown. TEM analysis of
both alloys as shown in Figure 6.17 shows the effect of compositional modification on
98
the alloys. Both Figure 6.16 and 6.17 show the effect of compositional modification
observed in 7075 alloy as shown in Figure 6.17 (a). Reducing the composition of iron
and silicon (as shown in Table 5.1) reduced the constituent particles in 7050 alloy
thereby improving the properties of the alloy and homogeneity of the microstructure.
(a) (b)
Figure 6.16: Optical images of as received (a) 7075-T651 and (b) 7050-T74 alloy in
SL direction
(a) (b)
Figure 6.17: Effect of compositional modification on the microstructure of (a) 7075
and (b) 7050 alloy. Red arrows indicate large constituent particles in 7075 alloy
99
6.5 Microstructural analysis of unaged samples using TEM
TEM was used to study grain boundary precipitate morphology of some selected
tempers of 7075 and 7050 alloys in the unaged condition as shown in Figure 6.18 and
6.19 respectively. Red arrows indicate dislocation network while yellow arrows
indicate grain boundary precipitation. Figure 6.18 (a) and (b) shows unaged 7075-T6
sample. In Figure 6.18 (b), the sample orientation shows high density of quenched-in
dislocations. A similar result was obtained for 7050 alloy as shown in Figure 6.19 (b).
High dislocation density is expected in HTPP treated sample of T F/Q = 455 oC due to
quenching from a high TF/Q temperature. Figure 6.18 (c) and (d) shows HTPP treated
sample of TF/Q = 405 and 370 oC respectively. It appears that the density of dislocations
decreases as the TF/Q temperature decreases. This may be due to quenching from a
lower temperature as TF/Q decreases. Also, decreasing TF/Q causes some heterogeneous
precipitation at the grain boundary as shown in Figure 6.18 (c) and (d). A similar
trend was observed in 7050 alloy as shown in Figure 6.19 (c) and (d). The contrast
lines in Figure 6.19 (d) can be attributed to slight changes in thickness and bending of
sample.
100
(a) (b)
(c) (d)
Figure 6.18: TEM analyses of unaged 7075 alloy in (a) and (b) T6 (c) TF/Q= 405 oC
(d) TF/Q= 370 oC. Red arrows indicate dislocation network. Yellow arrows indicate
precipitation along the grain boundary
101
(a) (b)
(c) (d)
Figure 6.19: TEM analyses of unaged 7050 alloy in (a) and (b) T6 (c) TF/Q = 405 oC
(d) TF/Q = 370 oC. Red arrows indicate dislocation network. Yellow arrows indicate
precipitation along the grain boundary
102
6.6 Microstructural analysis of aged samples using TEM
After aging, TEM was used to analyse the precipitate morphology in the grain
boundary region of the alloys. Figure 6.20 and 6.21 shows TEM analyses of the grain
boundary region of 7075 and 7050 respectively. The results presented in this thesis
were obtained after examining minimum of two grain boundaries. The grain
boundaries are shown as either tilted or in planar view to the direction of TEM beam.
As shown in Figure 6.20 (a), tilted view gives a partial plan view of the precipitates in
the grain boundary region to provide more information on the density of precipitates
along the grain boundary region. As shown in Figure 6.20 (f) planar view shows the
In Figure 6.20 and 6.21 (a) small precipitates are continuously distributed along the
grain boundary in T6 treated samples as expected. Figure 6.20 and 6.21 (b)-(e) show
that HTPP heat treatment affects the microstructure of both 7075 and 7050 alloy
respectively. As shown by the yellow arrows, there is gradual increase in the size of
the grain boundary precipitates as TF/Q temperature decreases in both 7075 and 7050
alloy respectively. Although Figure 6.20 (f) is in planar view, it is obvious that there
are discontinuous, large precipitates along the grain boundary. Similar result was
103
(a) (b)
(c) (d)
104
(a) (b)
(c) (d)
105
6.7 Energy Dispersive X-ray Spectrometry (EDS) analysis
Figures 6.22 and 6.23 show the mean solute concentration of Zn, Mg and Cu solutes
segregated across two grain boundaries in 7075 and 7050 alloy respectively. Solute
segregation at the grain boundary has been suggested to have influence on SCC
copper in grain boundary precipitates has been reported in some SCC resistant alloys
[63]. Results obtained in Figures 6.22 and 6.23 provide an overview of the amount of
Zn, Mg and Cu segregated at the grain boundary. Note that some scatters are present
boundaries as shown in Figure 6.24. Variation of about 1nm was also observed in the
position of the beam across the grain boundary. Corresponding data for Figure 6.22
106
(a) (b)
(c) (d)
(e) (f)
Figure 6.22: EDS analysis across grain boundary of 7075 samples showing (a) T6 (b)
TF/Q = 455 oC (c) TF/Q= 425 oC (d) TF/Q = 405 oC (e) TF/Q = 370 oC and (f) T7. As
shown in Figure 6.23 (f) the blue line represents Zn, red represents Mg and green
represents Cu
107
(a) (b)
(c) (d)
(e) (f)
Figure 6.23: EDS analysis across grain boundary of 7050 samples showing (a) T6 (b)
TF/Q = 455 oC (c) TF/Q = 425 oC (d) TF/Q = 405 oC (e) TF/Q = 370 oC and (f) T7. As
shown in Figure 6.24 (f) the blue line represents Zn, red represents Mg and green
represents Cu
108
12
10
Composition (wt%)
8
6 Zn
Mg
4
Cu
2
0
-15 -10 -5 0 5 10 15
Distance from grain boundary (nm)
Figure 6.24: EDS analysis showing the extent of scatter in results for 7075 alloy at
TF/Q = 425 oC
109
CHAPTER SEVEN
DISCUSSION OF RESULTS
7.1 Effect of heat treatment on electrical conductivity of 7075 and 7050 alloys
Figure 7.1 summarizes the effect of standard heat treatments and HTPP process on EC
of aged 7050 and 7075 alloys. The result shows the EC of T6 as the lowest and
T7/T74 temper as the highest. It is evident from this result that HTPP achieved
increased EC in both alloys as TF/Q decreases and this provides a range of EC values
EC. Another explanation for the increase in EC might be due to decrease in strain at
confirm this explanation [77]. The higher EC observed in 7050 compared to 7075
alloy might be due to lower impurity levels in 7050 alloy. The arrows in Figure 7.1
indicates sharp increase in EC observed at about TF/Q = 445 oC and 415 oC.
110
45
44
Electrical conductivity (%IACS) 43
42 T74
41
40 T7
39 T7
38
37
36 7050 aged
35
34 7075 aged
33
32
31
30
T651 T6 455 445 435 425 415 405 395 385 375 370
TF/Q (oC)
Figure 7.1: Effect of heat treatment on electrical conductivity of 7050 and 7075 alloy.
Blue arrows indicate the sharp increase in electrical conductivity
Figure 7.2 compares the effect of standard T6, T7 and HTPP heat treatment
conditions on the hardness of both 7050 and 7075 alloys. Both alloys experienced loss
of strength before aging. This is due to dissolution of strengthening phases and loss of
solute atoms during pre-precipitation. The results show that subsequent aging of
HTPP treated samples increases the hardness in both alloys. The increase in strength
However, strength decreases as the TF/Q temperature decreases. This is likely due to
decrease in the solute atoms available for homogenous precipitation during aging. As
111
However, gradual loss of hardness was observed as TF/Q decreased from 435 oC. This
might be due to the solvus temperature being in that temperature range, causing more
by the arrows in Figure 7.1 can be observed in Figure 7.2. From Figure 7.2, the
hardness result of both alloys in the unaged condition show that significant changes in
the hardness started at 445 oC. Thus, the solvus temperature can be estimated to be at
445-435 oC. Figure 7.3 shows that different phases can be nucleated during cooling
below the solvus. Just below the solvus, the arrow shows that nucleation of η phase
occurs and as the TF/Q temperature decreases, other phases will be formed. Thus, the
It is evident that 7050 alloy can be treated to higher hardness than 7075 through
of Cr with Zr in 7050 to reduce quench sensitivity associated with 7075 alloy. In fact,
112
100
90
80
T7
70
Hardness (HRB)
60 7050 unaged
50
7075 unaged
40
30 7050 aged
20 7075 aged
10
0
T651 T6 455 445 435 425 415 405 395 385 375 370
TF/Q (oC)
Figure 7.2: Effect of heat treatment on hardness of 7050 and 7075 alloys. Purple
broken line indicates standard T7 temper. Blue arrows indicate sharp decrease in
hardness
113
7.3 Exfoliation Corrosion (EXCO) versus Electrical conductivity of 7075 and
7050 alloy
Electrical conductivity is often used to assess and predict corrosion resistance in 7xxx
alloys especially in T6 and T7 tempers. Figure 7.4 relates the exfoliation corrosion
conditions. The general trend observed in this result is that exfoliation corrosion
corrosion.
42 9
8
40
7
38 6
EC (% IACS)
EXCO rating
5 7050 EC
36
4 7075 EC
7050 exco rating
34 3
7075 exco rating
2
32
1
30 0
T6 455 425 405 370 T7
o
TF/Q ( C)
114
7.4 Effect of HTPP on Stress corrosion cracking of 7075 and 7050 alloy
Figure 7.5 relates EC to SCC resistance in both alloys (using crack length measurement
after 257 hours) for T7 and T6 tempers and the tested HTPP conditions. It is evident
decreases. Although the mechanism is not clear, these results show that SCC
shown by decrease in crack length as EC increases. Figures 7.6 and 7.7 relate SCC
resistance (based on the crack growth rate at stress intensity of 3 MPa√m) of 7075 and
7050 alloy in different heat treatment conditions to EC and the approximate time to
is evident from these results that the crack growth rate is inversely proportional to EC
and time to reach stress intensity of 3 MPa√m in stage II of SCC. This confirms that
SCC is directly related to EC. These results also show that each HTTP treatment has
alloys. HTPP heat treatment reduces the crack growth rate, achieves increase in the
EC and time involved in crack propagation and this relates to the observed increase in
115
140
120 425
Crack length (mm) 100 455 &
T6 405
80 370
60
40
T7
20
0 7050
30 31 32 33 34 35 36 37 38 39 40 41
7075
Electrical conductivity (%IACS)
Figure 7.5: Relationship between EC and SCC resistance (using crack length
measured after 257 hours) of 7075 and 7050 alloy
116
0.5 30
102 102
32
0.4 150
34
210
EC (% IACS)
da/dt (mm/h)
0.3
36
˃1446
38
0.2
˃1446 40
0.1 Crack growth
42 velocity
Crack growth
0 44 velocity
T6 455 425 405 370 T7
TF/Q (oC) Electrical
conductivity
0.3 30
150 186 32
0.25
EC (% IACS)
279 34
0.2
da/dt (mm/h)
36
327
0.15
38
Crack growth
0.1 ˃1446 velocity
40
1178
0.05 42 Crack growth
˃1446 velocity
0 44
T6 455 425 405 370 T7 T74 Electrical
Conductivity
TF/Q (oC)
117
7.5 Grain boundary precipitate versus SCC resistance
From Figure 6.20 (a) and 6.21 (a) small, discontinuous grain boundary precipitates in
T6 can be related to poor corrosion resistance while the large grain boundary
precipitates in T7 temper (Figure 6.20 (f) and 6.21 (f)) correlates with high SCC
resistance obtained in both alloys. Figures 6.20 (b-e) and 6.21 (b-e) show that grain
while Figure 7.5 shows that as TF/Q decreased, crack length decreased in both alloys.
Summary of V-K plot of both alloys shown in Figures 6.12 and 6.13 show that HTPP
treatment causes decrease in the plateau velocity as TF/Q decrease. TF/Q = 370 oC
showed the best resistance to SCC of all the HTPP conditions tested. Results shown in
Figures 6.12, 6.13, 7.5, 7.6 and 7.7 correspond to increase in size and discontinuity of
grain boundary precipitates observed in Figure 6.21 and 6.22. These results correlate
with studies by Li et al. (2008) that shows that HTPP can achieve higher SCC
resistance [29]. In terms of the size of the grain boundary precipitates, studies have
shown that large grain boundary precipitates can serve as nucleation site for hydrogen
bubbles thereby reducing SCC by hydrogen embrittlement. Also, large grain boundary
The gradual increase in SCC resistance as TF/Q decreases can also be related to
EDS analysis in Figures 6.22 and 6.23 showing that as TF/Q decreases, there is decrease in
copper solute segregated at the grain boundary. The increase in the potential of the
grain boundary precipitate reduces SCC through anodic dissolution. The increase in
118
decreases can also improve SCC resistance by reducing the formation of local
TEM analysis of the unaged samples in Figure 6.18 and 6.19 shows that dislocations
were present in the unaged samples after quenching. These can be identified as
appears that there is decrease in dislocation density as TF/Q decreases. This shows that
HTPP heat treatment can reduce the dislocation density in 7075 and 7050 alloys.
in all the HTPP conditions observed due to prior slow cooling before quenching. TEM
analysis in Figure 6.20 relates the morphology of grain boundary precipitates in HTPP
6.20 (a). The morphology of precipitates in the grain boundary region of T6 shows
high concentration of small precipitates that are continuously distributed along the
grain boundary. From Figure 6.20 (b)-(e) it is evident that the initial precipitation
during quenching enabled more precipitation to occur at the grain boundary region
after aging. This is evident from the increase in size of grain boundary precipitates as
TF/Q temperature decreases from TF/Q = 455 to 370 oC. The gradual increase in
precipitate size agrees with the literature [26, 28]. This can be explained by increase
cooling from SHT to a lower (TF/Q) temperature. Figure 6.20 (f) shows the coarse
precipitates that are discontinuously distributed along the grain boundary precipitate
treatment. Coarse discontinuous grain boundary precipitates are observed at TF/Q = 370
119
o
C and T7 temper. Large discontinuous grain boundary precipitates has been related to
high SCC resistance of T7 temper [40]. Similar result was observed in 7050 alloy as
By comparison to unaged condition shown in Figure 6.18 and 6.19, it appears that
subsequent aging after quenching of HTPP treated samples reduces the dislocation
density. Thus, this results show that the TF/Q temperature used in HTPP treatment
plays an important role in increasing the size of grain boundary precipitates and
elements segregated across grain boundary was analysed. Figure 6.22 and 6.23 show
the results obtained from 7075 and 7050 alloy respectively. It is evident that decrease
Cu across the grain boundary. This can be related to increase and uniformity in the
diffusion of Zn, Mg and Cu into grain boundary precipitates. This trend is similar to
results reported by Hepples et al. shown in Figure 4.8 [62]. Figure 7.8 shows that
there is decrease in the amount of copper segregated in the HTPP treated samples as
precipitates. This result corresponds with the literature that HTPP can increase in Cu
content at the grain boundary precipitates [26, 28]. Hepples et al. showed that copper
HTPP treated conditions compared to T6. This correlates with literature on grain
120
embrittlement, this result confirms that Mg segregation may not be the dominant
12
10
Composition (wt%)
8 T6
TF/Q= 455 oC
455
6 TF/Q= 425 oC
425
4 405
TF/Q= 405 oC
370
TF/Q= 370 oC
2 T7
0
-15 -10 -5 0 5 10 15
Distance from grain boundary (nm)
(a)
12
10
Composition (wt%)
8
T6
6 TF/Q= 455 oC
455
TF/Q= 425 oC
425
4
TF/Q= 405 oC
405
2 TF/Q= 370 oC
370
T7
0
-15 -10 -5 0 5 10 15
Distance from grain boundary (nm)
(b)
Figure 7.8: Summary of grain boundary copper concentration in (a) 7075 and (b) 7050
alloy
121
CHAPTER EIGHT
CONCLUSIONS
This research has studied HTPP as a potential heat treatment approach to achieve a
combination of high strength and corrosion resistance in 7075 and 7050 commercial
alloys. This was achieved by using experimental procedure that involved electrical
stress corrosion cracking testing and analysis of grain boundary using TEM. The
following conclusions can be made based on the results obtained from the
• The intermediate temperature (TF/Q) used during HTPP has a significant effect
especially at TF/Q= 435 oC. However, 7050 can be heat treated to higher
hardness than 7075 alloy. Zr addition in 7050 reduces the quench sensitivity
temperature decreased.
can thus be used to determine SCC resistance in 7050 and 7075 HTPP treated
alloys.
122
precipitates as TF/Q decreases. Hence, increase in SCC resistance of HTPP
range of TF/Q temperatures between 425 and 405 oC provides the best balance
Based on the results obtained in this research and some of the challenges experienced,
The cause of stepwise changes observed in the hardness and EC results should
be further investigated.
The effect of multistep aging process in HTPP on the properties of 7050 and
To obtain sufficient data for V-K plot of HTPP treated samples, SCC test with
slower rate is suggested using fatigue pre-cracked samples and test solution of
3.5% NaCl.
123
REFERENCES
Metallurgy and Processes, Marcel Dekker, New York, 2003, pp. 103, 106,
[4] B. Smith, “The Boeing 777,” Advanced Materials & Processes, vol. 161, no.
Progress in Aerospace Science, vol. 32, no. 95, pp. 131-172, 1996.
[7] J. Liu, M. Kulak, “A new paradigm in the design of aluminium alloys for
140, 2000.
Aluminum Alloy: The Wright Flyer Crankcase,” Science, vol. 266, pp. 1015-
1017, 1994.
124
[11] J. Liu, F. Froes, “Aluminium alloys for Aerospace Applications: A review,”
Available: http://www.gpo.gov/fdsys/pkg/FR-2012-09-11/html/2012-21533.htm.
1974.
[15] Alcoa Mill Company. 7055 Alloy-T7751 plate and T77511 extrusions technical
data[Online].
Available:http://www.alcoa.com/hard_alloy_extrusions/catalog/7055-
[16] Alcoa Mill Company. Alloy 2024 Sheets and Plates Specifications [Online].
Available:http://www.alcoa.com/mill_products/catalog/pdf/alloy2024techshee
Available:http://asm.matweb.com/search/SpecificMaterial.asp?bassnum=MA2
Available:http://asm.matweb.com/search/SpecificMaterial.asp?bassnum=MA7
125
[19] Aerospace Specification Metals. Alloy 7075-Understanding Cold Finished
Available:http://thebloughs.net/work/wpcontent/uploads/2014/02/Aluminum7
Specifications[Online].
Available:https://www.alcoa.com/hard_alloy_extrusions/catalog/pdf/7055_Te
Available:http://www.alcoa.com/global/en/products/product.asp?prod_id=182
Available:http://asm.matweb.com/search/SpecificMaterial.asp?bassnum=MA2
[23] J. Staley, “Aluminium alloy and process development for aerospace,” Metals
aluminium alloy,” Journal of Materials Science, vol. 17, pp. 2817-2824, 1982.
126
[27] J. Beddoes, “Design of solution heat treatments for aerospace alloys,”
http://www.maneyonline.com/doi/full/10.1179/1879139511Y.0000000004
862-868, 2012.
127
Available:http://www.spaceflight.esa.int/impress/text/education/Mechanical%
strength and toughness of 7xxx series alloy,” Materials Science Forum, vols.
precipitates in an aged Al- 1.2Zn- 1.7Mg at% alloy,” Scripta Materialia, vol.
Engineering - Science, Process, Applications, 6th ed. Elsevier, 1998, pp. 265-
266.
405-414, 2010.
[41] M. Starink, X. Li, “A Model for the Electrical Conductivity of Peak-Aged and
128
[44] T. C. Tsai, T. H. Chuang, “Technical Note : Relationship Between Electrical
Available: http://corrosion-doctors.org/Forms-intergranular/intergranular.htm
Available:http://www.ndted.org/EducationResources/CommunityCollege/M
2013.]
Available:http://www.ndted.org/EducationResources/CommunityCollege/M
2013].
129
[51] D. S. Mackenzie, G. E. Totten, Handbook of Aluminum: Alloy Production and
[52] J. Beddoes, Materials: Strength and Fracture, Fall 2010 course note,
130
[61] G. Scamans, “ Discontinuos propagation of stress corrosion cracks in Al-Zn-
Metals, 1988., Gangloff, R.P and Ives, M.B.,eds., NACE, Houston, pp. 383-
387, 1990.
1985.
[66] B. Sarkar, M. Marek, E. A. Starke, “The effect of copper content and heat
131
[69] W. B. Lisagor, T. W. Crooker, B. N. Leis, Environmentally Assisted Cracking:
aluminium alloys,” Materials and Corrosion, vol. 62, no. 3, pp. 215-233,
2011.
practical solutions, John Wiley &Sons Ltd., West sussex, England, 2007, pp.
449.
[73] M. Talinker, B. Cina, “Retrogression and Reaging and the role of dislocations
34, 2007.
[75] ASTM International, Standard Practice for Making and Using Pre-cracked
[76] M. Hyatt, “Use of pre-cracked specimens in selecting heat treatmens for stress
132
[78] The weather underground. Weather history for Winnipeg [Online]. Available:
133
APPENDIX
134
APPENDIX B: TEMPERATURE MEASUREMENT DURING SCC TESTING
[78]
135
APPENDIX C: SCC DATA
Table 1: Data for crack length vs time for 7075 alloy
136
Table 3: 7075-T6 sample
137
Table 5: 7075-HTPP at TF/Q = 455 oC sample 1
138
Table 7: 7075-HTPP at TF/Q = 425 oC sample 1
139
Table 9: 7075-HTPP at TF/Q = 405 oC sample 1
140
Table 11: 7075-HTPP at TF/Q = 370 oC sample 1
141
Table 13: 7050-T6 sample 1
142
Table 15: 7050-T6 sample 3
143
Table 17: 7050-T7 sample 2
144
Table 19: 7050-HTPP at TF/Q = 455 oC sample 1
145
Table 21: 7050-HTPP at TF/Q = 455 oC sample 3
146
Table 23: 7050-HTPP at TF/Q = 425 oC sample 2
147
Table 25: 7050-HTPP at TF/Q = 405 oC sample 1
148
Table 27: 7050-HTPP at TF/Q = 405 oC sample 3
149
Table 29: 7050-HTPP at TF/Q = 370 oC sample 2
150
Table 31: 7050 T74-1
151
Table 33: 7050-T74 sample 3
152
APPENDIX D: EDS ANALYSIS DATA
Table 1: 7075-T6
Table 2: 7075-T7
153
Table 3: 7075-HTPP at TF/Q = 455 oC
154
Table 5: 7075-HTPP at TF/Q = 405 oC
155
Table 7: 7050-T6
Table 8: 7050-T7
156
Table 9: 7050-HTPP at TF/Q = 455 oC
157
Table 11: 7050-HTPP at TF/Q = 405 oC
158