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Interview Questions-Data Patterns

This document discusses various topics related to printed circuit board (PCB) design including: 1. Calculating currents through resistors and differential pairs in circuit diagrams. 2. Factors that impact signal integrity such as characteristic impedance, trace length, and termination. 3. EMI reduction techniques and units used to measure radiation. 4. PCB design considerations such as materials, vias, DFM/DFT, processor selection, and review process. 5. Electronic components like LDO vs switching regulators, BGA vs QFN packages, and logic families.

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sarav d
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3K views2 pages

Interview Questions-Data Patterns

This document discusses various topics related to printed circuit board (PCB) design including: 1. Calculating currents through resistors and differential pairs in circuit diagrams. 2. Factors that impact signal integrity such as characteristic impedance, trace length, and termination. 3. EMI reduction techniques and units used to measure radiation. 4. PCB design considerations such as materials, vias, DFM/DFT, processor selection, and review process. 5. Electronic components like LDO vs switching regulators, BGA vs QFN packages, and logic families.

Uploaded by

sarav d
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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1.

Calculate the current through the Resistor

2. Calculate the current through R1, R2

3. Calculate the current through the R2

R1 100k

V1 10
R3 100k
R2 100k

4. What is the voltage at J1 and current through R3 if a zener breakdown voltage is 6V?
J1
J1

R1 100
R1 100

V1 10
R3 100

V1 10
R3 1k

Z1
Z1

5. Characteristic Impedance
6. How do you calculate the current through a via(PTH)?
7. How do you route a differential Pair?
8. What is the maximum length of the differential pair?
9. What are the Parameters you see when u select a Component like Resistor and Capacitor?
10. Experience in EMI( Techniques to reduce EMI in board level
11. Unit of Radiation
12. Eye diagram
13. Radiated Emission and Conducted Emission

Round 2:

1. PCB materials Used(FR4), Differences and Advantages


2. Via Current, Via Plating
3. Mil to mm( 39.3701)
4. How do you review PCB
5. DFM/DFT
6. IMX Freescale processor Selection
7. Issues u faced during testing and how did you solve that issue
8. PCB Review
9. LDO vs Switching Regulator
10. BGA vs QFN
11. SPI vs I2C
12. Different Logic Families
13. 4 Main Reasons for Differential pair
Noise Reduction
Low Receiver Voltage Level

14. 4 main reasons for Radiations


High Speed and High Current Traces

15. Thumb rules for PCB Trace width, Inductance, Capacitance,Resistance


16. Resistors have positive coefficient or negative ?
17. All interfaces and its maximum supported Frequencies
18. Why Terminations

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