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Table of Contents
CONTENTS PAGE
Sections
1. Features 1-1
2. Specifications 2-1
3. On Screen Display 3-1
4. Factory Preset Timings 4-1
5. Pin Assignment 5-1
6. BLOCK DIAGRAM 6-1
7. Main Board I/O Connections 7-1
8. Theory of Circuit Operation 8-1
9. Waveforms 9-1
10. Trouble Shooting 10-1
11.Spare Parts List 11-1
12. Complete Parts List 12-1
Appendix
1. Main Board Circuit Diagram
2. Main Board PCB Layout

3. Assembly Explosion Drawing
Block Diagram
VIZIO P42HDTV10A Service Manual
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VINC Service Manual
VIZIO P42HDTV10A
COPYRIGHT © 2000 V, INC. ALL RIGHTS RESERVED.
IBM and IBM products are registered trademarks of International Business Machines
Corporation.
Macintosh and Power Macintosh are registered trademarks of Apple Computer, Inc.
VINC. and VINC. products are registered trademarks of V, Inc.
VESA, EDID, DPMS and DDC are registered trademarks of Video Electronics Standards
Association (VESA).
Energy Star is a registered trademark of the US Environmental Protection Agency (EPA).
No part of this document may be copied, reproduced or transmitted by any means for any
purpose without prior written permission from VINC.
FCC INFORMATION
This equipment has been tested and found to comply with the limits of a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy, and if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that the interference will not occur in a particular installation. If this equipment
does cause unacceptable interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures -- reorient or relocate the receiving
antenna; increase the separation between equipment and receiver; or connect the into an
outlet on a circuit different from that to which the receiver is connected.
FCC WARNING
To assure continued FCC compliance, the user must use a grounded power supply cord and
the provided shielded video interface cable with bonded ferrite cores. Also, any unauthorized
changes or modifications to Amtrak products will void the user’s authority to operate this
device. Thus VINC. Will not be held responsible for the product and its safety.
CE CERTIFICATION
This device complies with the requirements of the EEC directive 89/336/EEC with regard to
“Electromagnetic compatibility.”
SAFETY CAUTION
Use a power cable that is properly grounded. Always use the AC cords as follows – USA (UL);
Canada (CSA); Germany (VDE); Switzerland (SEV); Britain (BASEC/BS); Japan (Electric
Appliance Control Act); or an AC cord that meets the local safety standards.
VIZIO P42HDTV10A Service Manual

Chapter 1 Features
y 1024 x 768 pixel resolution with 16:9 wide screen
y ATSC (Off-air)/QAM (Cable)/NTSC (Antenna/Cable)
y All TV formats supported (480i, 480p, 720p & 1080i)
y PC compatible (RGB) up to 1280 x 1024 WXGA
y High definition digital interface - HDMI
y Multiple-screen display (picture-on-picture/picture-in-picture)
y Selectable picture mode
y Supporting DVI converted to HDMI
y Closed caption
y Gloss front bezel

y Wall-mountable
CONFIDENTIAL – DO NOT COPY Page 1-1

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Chapter 2 Specification
1. General specification
Native Resolution 1024 (H)X768 (V) pixels,
Effective Display Size 921.6 (H) x 519.2 (V) mm
Aspect Ratio 16:9
Color 1,024 (R) x 1,024 (G) x 1,024 (B) colors
Brightness 1200 cd/m2 ( typical, panel spec)
(w/glass filter) Min. 300 cd/ m2
Contrast Ratio 10,000:1 (Typical, panel spec).
TV system NTSC/ATSC/ QAM
PC Inputs 15pins D-sub, HDMI-DVI
Video Inputs 1 x S-Video
3 x AV inputs (CVBS; RCA type)
2 x Component (Y Pb/Pr Cb/Cr)
1 x HDMI
Audio Inputs 6 x Stereo RCA (R/L), 1 x PC Mini-Jack
Audio Outputs Analog - 1 x stereo RCA (R/L)
1 x headphone
Digital – 1 x SPDIF Optical
Audio 10W 6Ω X 2
Power Input 100 to 240 Vac
Power Consumption 380W Max
Preset Modes Primary 1024 x 768 @ 60Hz.

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2. Optical characteristics
Item Specification Remarks
Display Pixels 1,024 (H) x 768 (V) pixels
Display Cells 3,072 (H) x 768 (V) cells
Pixel Pitch 0.9 (H) x0.676 (V) mm
Pixel Type Non-stripe
Color Depth 1,024 (R) x 1,024 (G) x 1,024 (B) colors
Active Display Area 921.6 (H) x 519.2 (V) ±0.5 mm
Brightness Min. 300 cd/ m2
Color coordinates 9300K: x=0.283±0.02, y=0.297±0.02 RGB
6500K: x=0.313±0.02, y=0.329±0.02 RGB /VIDEO
5000K: x=0.346±0.02, y=0.359±0.02 RGB
3. Power Supply
a. Input voltage 100-240Vac, 50/60Hz
b. Input current 4.5A or less (at AC 100V/60Hz)
c. Inrush current 60A at Vac=120V
d. Power consumption 380 W Max

e. Standby/DPMS 3 watts max. (at 120 Vac)
4. Environment
Operating
a. Temperature: 0~40℃
b. Relative humidity: 20%~80% RH
c. Altitude: 0~6,560 ft
Non-operating
a. Temperature: -20~60℃
b. Relative humidity: 10%~90% RH
c. Altitude: 0~9,840 ft

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5. Dimensions
Item W/Stand W/O stand
a. Height 780 mm 755 mm
b. Width 1072mm 1072mm
c. Depth 290 mm 109 mm
6. Weight
a. Net: 38.8 +/- 0.5 kgs
b. Gross: 47.5 +1.5 kgs /- 0.5 kgs

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Chapter 3 On Screen Display
Input Menu
Operation Menu
TV Mode
A. PICTURE ADJUST：
a. PICTURE MODE (USER/ VIVID1 / VIVID2 /
VIVID3)
b. Adjust the BRIGHTNESS (0~100)
c. Adjust the CONTRAST (0~100)
d. Adjust the COLOR (saturation) (0~100)
e. Adjust the TINT (hue) (0~100)
f. Adjust the SHARPNESS (0~100)
g. CLOSED CAPTION
(OFF/CC1/CC2/CC3/CC4/TT1/TT2/TT3/TT4)
B. AUDIO ADJUST：
a. VOLUME (0~100)
b. BASS (-50~50)
c. TREBLE (-50~50)
d. BALANCE (-50~50)
e. SURROUND (ON/OFF)
f. REVERB (OFF, CONCERT, LIVING ROOM,
HALL, ARENA)
g. MUTE (ON/OFF)
h. SPEAKERS (ON/OFF)

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C. TV TUNER SETUP：
a. SOUND (SAP/MONO/STEREO)
b. TV/CABLE (TV/CABLE)
c. CHANNEL SEARCH (RUN)
d. SET CHANNEL
e. SKIP CHANNEL (YES/NO)
D. PARENTAL CONTROL：
a. PARENT LOCK ENABLE (ON/OFF)
b. TV RATING
c. MOVIE RATING
d. ACCESS CODE EDIT
E. PIP SETUP：
a. STYLE (OFF/PIP/POP)
b. Source (AV1、AV2、AV3、ANALOG HD1、
ANALOG HD2、DIGITAL HD、RGB)
c. SIZE (SMALL/MEDIUM/LARGE)
d. POSITION (TOP LEFT/TOP CENTER/TOP
RIGHT/MIDDLE LEFT/MIDDLE
RIGHT/BOTTOM LEFT/BOTTOM
CENTER/BOTTOM RIGHT)
F. SPECIAL FEATURES：
a. LANGUAGE (ENGLISH/FRANÇAIS/
ESPAÑOL)
b. SLEEP TIMER (OFF/30 MIN /60 MIN /90 MIN
/120 MIN)
c. WIDE FORMAT (NORMAL/WIDE/ZOOM、
PANORAMIC)
d. RESET ALL SETTING
e. IMAGE CLEANER

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RGB Mode
a. AUTO ADJUST
c. Adjust the CONTRAST (0~100
d. Adjust the H-SIZE (0~100)
e. Adjust the H-POSITION (0~100)
f. Adjust the V-POSITION (0~100)
g. Adjust the FINETUNE (0~100)
B. COLOR TEMP：
a. COLOR TEMP. (User, 5000K, 6500K, 9300K)
b. RED (0~255)
c. GREEN (0~255)
d. BLUE (0~255)
C. AUDIO ADJUST：
a. VOLUME (0~100)
b. BASS (-50~50)
c. TREBLE (-50~50)
d. BALANCE (-50~50)
HALL, ARENA)
g. MUTE (ON/OFF)
D. PIP SETUP：
b. SOURCE (AV1、AV2、AV3、TV)
c. SIZE (SMALL/MEDIUM /LARGE)
RIGHT/MIDDLE LEFT/MIDDLE
RIGHT/BOTTOM LEFT/BOTTOM
CENTER/BOTTOM RIGHT)

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E. SPECIAL FEATURES：
a. LANGUAGE (ENGLISH/FRANÇAIS/
ESPAÑOL)
b. SLEEP TIMER (OFF/30/60/90/120)
c. WIDE FORMAT (WIDE/NORMAL)
e. IMAGE CLEANER
HDMI Mode
VIVID3)
B. AUDIO ADJUST：
a. VOLUME (0~100)
b. BASS (-50~50)
c. TREBLE (-50~50)
d. BALANCE (-50~50)
HALL, ARENA)
g. MUTE (ON/OFF)
i. AUDIO SOURCE (HDMI/DVII)
NOTE: While main or pip exists HDMI source, audio
option will add an AUDIO SOURCE item.
C. PARENTAL CONTROL：
b. TV RATING
c. MOVIE RATING
d. ACCESS CODE EDIT

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D. PIP SETUP：
b. SOURCE (AV1、AV2、AV3、TV)
c. SIZE (SMALL /MEDIUM/LARGE)
RIGHT/MIDDLE LEFT/MIDDLE RIGHT/BOTTOM
LEFT/BOTTOM CENTER/BOTTOM RIGHT)
a. LANGUAGE (ENGLISH/FRANÇAIS/ ESPAÑOL)
b. SLEEP TIMER (OFF/30/60/90/120)
c. WIDE FORMAT (NORMAL/WIDE/ZOOM)
e. IMAGE CLEANER

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Video Mode -AV1、AV2、AV3、COMPONENT 1、COMPONENT 2
VIVID3)
g. CLOSED CAPTION
(OFF/CC1/CC2/CC3/CC4/TT1/TT2/TT3/TT4)
B. AUDIO ADJUST：
a. VOLUME (0~100)
b. BASS (-50~50)
c. TREBLE (-50~50)
d. BALANCE (-50~50)
f. REVERB (OFF, CONCERT, LIVING ROOM, HALL,
ARENA)
g. MUTE (ON/OFF)
C. PARENTAL CONTROL：
b. TV RATING
c. MOVIE RATING
d. ACCESS CODE EDIT
D. PIP SETUP：
b. SOURCE (AV2, AV3, COMPONENT 1,
COMPONENT 2, HDMI, RGB, TV, DTV)
c. SIZE (SMALL/MEDIUM/LARGE)
RIGHT/MIDDLE LEFT/MIDDLE RIGHT/BOTTOM
LEFT/BOTTOM CENTER/BOTTOM RIGHT)

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a. LANGUAGE (ENGLISH/FRANÇAIS/ ESPAÑOL)
b. SLEEP TIMER (OFF/30 MIN/60 MIN /90 MIN/120
MIN)
c. WIDE FORMAT (NORMAL/WIDE/ZOOM)
e. IMAGE CLEANER
DTV Mode
A. DTV TUNER SETUP
a. TIME ZONE:
1.HAWALL
2.EASTTERN TIME
3.INDIANA
4.CENTRAL TIME
5.MOUNTAIN TIME
6.ARIZONA
7.PACIFIC TIME
8.ALASKA
b. CABLE/AIR/AUTO
c. SCAN
d. MANUAL SCAN
SCAN MODE:
1. ADD-ON MODE
2. RANGE MODE
(1)FROM CHANNEL
(2)TO CHANNEL

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e. CHANNEL SKIP
f. DIGITAL AUDIO OUT

1. PCM
2. DOLBY DIGITAL
3. OFF
B.CLOSED CAPTION:
a. ANALOG CLOSED CAPTION (OFF/YES)
b. DIGITAL CLOSED CAPTION (OFF/YES)
c. DIGITAL CAPTION STYLE

1.AS BROADCASTER
2.CUSTOM
(1) FONT SIZE
α.LARGE
β.SMALL
γ.MEDIUM
(2) FONT COLOR
α.BLACK
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β.WHITE
γ.GREEN
δ.BLUE
ε.RED
ζ.CYAN
η.YELLOW
θ.MAGENTA
(3) FONT OPACITY
α.SOLID
β.TRANSLUCENT
γ.TRANSPARENT
(4)BLACKGROUND COLOR
α.BLACK
β.WHITE
γ.GREEN
δ.BLUE
ε.RED
ζ.CYAN
η.YELLOW
θ.MAGENTA
(5) BLACKGROUND OPACITY
α.SOLID
β.TRANSLUCENT
γ.TRANSPARENT
(6) WINDOW COLOR
α.BLACK
β.WHITE
γ.GREEN
δ.BLUE
ε.RED
ζ.CYAN
η.YELLOW
θ.MAGENTA
(7) WINDOW OPACITY
α.SOLID
β.TRANSLUCENT
γ.TRANSPARENT

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C. PASSWORD
- PRESS<OK> , enter 0000
- get to “CHANNEL BLOCK”, then press <OK>
PIP table
Sub
AV1 AV2 AV3 COMPONENT 1 COMPONENT 2 HDMI* RGB TV DTV
MAIN
AV1 N Y Y Y Y Y Y Y Y
AV2 Y N Y Y Y Y Y Y Y
AV3 Y Y N Y Y Y Y Y Y
COMPONENT 1 Y Y Y N N N N Y N
COMPONENT 2 Y Y Y N N N N Y N
HDMI Y Y Y N N N N Y N
RGB Y Y Y N N N N Y N
TV Y Y Y Y Y Y Y N Y
DTV Y Y Y N N N N Y N
* Sub/HDMI doesn’t support 1080i.

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Chapter4 Factory preset timings
This timing chart is already preset for the analog & digital displays..
1. RGB PC preset modes
Horizontal Vertical
Refresh Horizontal Vertical
Mode Sync Sync Pixel Rate
Resolution Rate Frequency Frequency Remark
No. Polarity Polarity (MHz)
(Hz) (KHz) (Hz)
(TTL) (TTL)
1 640x480 60 31.5 59.94 N N 25.175 Windows
2 640x480 75 37.5 75.00 N N 31.500 Windows
3 720 x 400 70 31.46 70.08 N P 28.320 DOS
4 800x600 60 37.9 60.317 P P 40.000 Windows
5 800x600 75 46.9 75 P P 49.500 Windows
6 800x600 85 53.7 85.06 P P 56.250 Windows
7 1024x768 60 48.4 60.01 N N 65.000 Windows
8 1024x768 70 56.5 70.07 N N 75.000 Windows
9 1024x768 75 60.0 75.03 P P 78.750 Windows
10 1280X1024 60 63.98 60.02 P P 108.000 Windows
Remark: P: positive, N: negative 1024x768 @60 Hz: Primary
2. HDMI video digital preset modes
Mode No. Resolution

1 480i
2 480p
3 720p
4 1080i

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3. HDMI-DVI video preset modes
Mode No. Resolution

1 480i
2 480p
3 720p
4 1080i
4. HDMI-DVI PC preset modes
Horizontal Vertical
Refresh Horizontal Vertical Pixel
Mode Sync Sync
Resolution Rate Frequency Frequency Rate Remark
No. Polarity Polarity
(Hz) (KHz) (Hz) (MHz)
(TTL) (TTL)
1 640x480 60 31.5 59.94 N N 25.175 Windows

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Chapter 5 Pin Assignment
There are analog and digital connectors as video input source in this model.
A. Input signal
1. RGB PC Connector
a. Type: Analog
b. Frequency: H: 30-80KHzV: 60-85Hz
c. Signal level: 0.7Vp-p
d. Impedance: 75Ω
e. Synchronization H/V separate sync:
H/V composite sync: Sync on Green
TTL
TTL
f. Video bandwidth: 135MHz
g. Connector type: 15-pin D-Sub, female
5 1
5 1
10 10 6 6
15 11
15 11
Pin Number Pin Assignment Pin Number Pin Assignment

1 Red video input 9 +5V
2 Green video input 10 Ground
3 Blue video input 11 No connection
4 Ground 12 (SDA)
5 Ground 13 Horizontal sync
(Composite sync)
6 Red video ground 14 Vertical sync
7 Green video 15 (SCL)
ground
8 Blue video ground

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2. HDMI Connector
a. Frequency: H: 15.734KHz V: 60Hz
H: 31KHz V: 60Hz
H: 45KHz V: 60Hz
H: 33KHz V: 60Hz
b. Polarity: Positive or Negative
c. Type: Type A
d. Pin Assignment: Please see below
Pin 19
Pin 1
Pin 2
Pin Signal Assignment Pin Signal Assignment
1 TMDS Data2+ 2 TMDS Data2 Shield

3 TMDS Data2- 4 TMDS Data1+
5 TMDS Data1 Shield 6 TMDS Data1-
7 TMDS Data0+ 8 TMDS Data0 Shield
9 TMDS Data0- 10 TMDS Clock+
11 TMDS Clock Shield 12 TMDS Clock-
13 CEC 14 Reserved (N.C. on device)
15 SCL 16 SDA
17 DDC/CEC Ground 18 +5V Power
19 Hot Plug Detect

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3. AV/Composite Video (CVBS) Connector
a. Frequency: H: 15.734KHz V: 60Hz (NTSC)
b. Signal level: 1Vp-p Sync (H+V):0.3V below Video (Y+C)
c. Impedance: 75Ω
d. Connector type: RCA jack
4. AV/S-Video Connector
4 3 1, 2 = GND
2 1
3 = Luminance (Y)
4 = Chrominance(C)
a. Frequency: H: 15.734KHz V: 60Hz (NTSC)
b. Signal level: Y: 1Vp-p C: 0.286Vp-p
c. Impedance: 75Ω
d. Connector type: 4-pin mini DIN
5. Component video Connector
a. Frequency: H: 15.734KHz V: 60Hz (NTSC-480i)
H: 31KHz V: 60Hz (NTSC-480p)
H: 45KHz V: 60Hz (NTSC-720p)
H: 33KHz V: 60Hz (NTSC-1080i)
b. Signal level: Y: 1Vp-p
Pb: ±0.350Vp-p Pr: ±0.350Vp-p
c. Impedance: 75Ω
d. Connector type: RCA jack

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6. F-type TV RF connector
NTSC system
a. Signal level Analog 1Vp-p typical (45tdB~90dB)
b. Frequency 55~801 MHz
ATSC system
a. IF-output level 1Vp-p minimum
QAM system (supporting clear QAM)
a. IF-output level 1Vp-p minimum
7. PC Stereo audio
a. Signal level: 1Vrms
b. Impedance: 47KΩ
c. Connector type: 3.5 φ mini jack
8. Video Stereo audio
a. Signal level: 0.7Vrms
c. Frequency Response: 250Hz-20KHz
d. Connector type: RCA L/R:
B. Output Signal
Output Connector Type

ANALOG AUDIO OUT Stereo RCA Jack x 2
DIGITAL AUDIO OUT Optical x 1
Headphone Mini jack x 1

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1. Analog Audio out
a. Signal level: 0.7Vrms
c. Frequency Response: 250Hz-20KHz
d. Connector type:RCA L/R
2. Digital audio out

a. Peak emission wave length: 630 – 690 µm
b. Transmission Speed: 13.2M pbs
c. Connector type: Optical fiber transmitter
3. Headphone
a. Signal level: 1Vrms (max.)
b. Impedance: 32Ω
c. Output: 50 mW
d. Connector type: Earphone mini jack

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Chapter 6 Block Diagram
42’’ PDP XGA panel
The TV system block diagram is powered by power board that transforms AC source
of 100V~240V AC +/- 10% @ 50/60 HZ into system request power source. The main
board receives different types of video signal into the MTK8205 Ic. Afterward, the
MTK8205 Ic process the signals control the various functions of the monitor and
outputs control signal, video signal and power to the 42’’PDP XGA panel to be
displayed.

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The analog video signals of S-video, YPbPr, TV, PC and A/V all video signals are
translated from analog signals into MTK8205 generates the vertical and horizontal
timing signals for display device.
The analog audio of s-video, YPbPr, TV, PC and A/V is transmitting to the WM8776
processed. The purpose is process the input audio signal to control volume, bass,
treble, surround, and balance. The HDMI video and audio is must transmitting to
sil9011 processed then TMDS signal to the MTK8205 generates the vertical and
horizontal timing signals for display device.
The DTV signal is processes to the tuner and output to MT5111 who handle ATSC
input to match MPEG-2 package, then transfer to MT5351. After passing through
decoder, the signal will be with the digital signal tri-dtate from HDMI transfer to digital
port of MT8205 . All functions are controllable by the main board. Plus, all functions in
the IC boards are programmable using I2C Bus.

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Main Board Block Diagram

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Video Board Block Diagram
Video Signal
Audio Signal
Communicate Signal
Control Pin
I2C
I2C
PORT SAW AGC
Narrow_IF_OP1&OP2
FILTER Amplifiers
U7 U8 Demodulator
IF AGC MT5111
U9
PHILIPS TD1336
U6
I2C
DDR SDRAM
U12,U13
DTV Backend Decoder FCC
MT5351 50PIN
U10 CON.
J1
IDTQS3VH257
U18
AUD_CTRL
For Main Board
DV33
VOLTAGE
Flash Memory
CONTROL U15
CRYSTAL
OSCILLATOR
X1
Title
<Title>
Size Document Number Rev

B <Doc> <RevCode>
Date: Monday, November 14, 2005 Sheet 1 of 1

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Chapter7 Main Board I/o Connections
J7 CONNECTION (TOP→BOTTOM)
Pin Description
1 “Auto”
2 “Left”
3 “Right”
4 “Down”
5 “Gnd”
6 “Up”
7 “Menu”
8 “Source”
9 “Power”
10 “LED”
11 “IR”
12 “+5V”
Pin Description
1 “POWRSW”
2 “+12V”
3 “+12V”
4 “+12V”
5 “GND”
6 “GND”
7 “GND”
8 “GND”
9 “+5V”
10 “+5V”
11 “+5V”
12 “RLY_ON”
13 “VS_ON”
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Pin Description
1 “SVDET2#”
2 “S1C_GND”
3 “S1C_IN”
4 “S1Y_GND”
5 “S1Y_IN”
6 “AGND”
7 “AV3R”
8 “AV3R GND”
9 “AV3L”
10 “AV3_GND”
11 “AV3_IN”
12 “AV3L GND”
13 “HPL”
14 “HPDET#”
15 “HPR”
16 “GNDV”

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Pin Description Pin Description

1 “GND” 26 “GND”
2 “I2C_SW” 27 “VOG3”
3 “OREQUEST#” 28 “VOG2”
4 “OREADY#” 29 “VOG1”
5 “ORESET#” 30 “VOG0”
6 “GND” 31 “GND”
7 “VOPCLK” 32 “VOB7”
8 “VODE” 33 “VOB6”
9 “VOVSYNC” 34 “VOB5”
10 “VOHSYNC” 35 “VOB4”
11 “GND” 36 “GND”
12 “VOR7” 37 “VOB3”
13 “VOR6” 38 “VOB2”
14 “VOR5” 39 “VOB1”
15 “VOR4” 40 “VOB0”
16 “GND” 41 “GND”
17 “VOR3” 42 “AO1SDATA0”
18 “VOR2” 43 “AO1LRCK”
19 “VOR1” 44 “AO1BCK”
20 “VOR0” 45 “AO1MCLK”
21 “GND” 46 “GND”
22 “VOG7” 47 “U2RX”
23 “VOG6” 48 “U2TX”
24 “VOG5” 49 “U0RX”
25 “VOG4” 50 “U0TX”

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Pin Description
1 “+5V”
2 “GND”
3 “GND”
4 “+12V”
5 “+12V”

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Chapter 8 Theory of Circuit Operation
The operation of D-SUB 15pin route
The D-SUB 15pin is input analog signal to the MTK8205 transfer A/D converter then generates
the vertical and horizontal timing signals for display device.
The operation of HDMII CON route

The HDMI CON is input digital signal the signal is process to the sil9011. Then transfer to the
MTK8205, the MTK8205 generates the vertical and horizontal timing signals for display device.
The operation of HDTV & Component route

HDTV & Component signal is input to switch IDTQS3VH257 (Select Component1 or 2). Then
transfer to the MTK8205 the MTK8205 generates the vertical and horizontal timing signals for
display device.
The operation of Video 1,2,3 & S-Video route

The Video 1,2,3 and S-Video signal is transmission signal to main board MM1492 (Switch) and
output to MTK8205 the MTK8205 generates the vertical and horizontal timing signals for display
device.
The operation of TV route

TV signal is processes to the tuner and output to MM1492 (switch) then transfer to MTK8205 the
MTK8205 generates the vertical and horizontal timing signals for display device. Audio is
processes to the tuner output to SIF circuit and output to MTK8205.Then MTK8205 process to
wm8776 and output to TDA8946J transfer to speaker
The operation of DTV route

DTV signal is processes to the tuner and output to MT5111 who handle ATSC input to match MPEG-2 package,
then transfer to MT5351. After passing through decoder, the signal will be with the digital signal tri-dtate from
HDMI transfer to digital port of MT8205
The operation of keypad

There are 7 keys to control and select the function of P42 and also has one LED to indicate the
status of operation. They are “Power, Menu, CH+,CH-, VOL+ ,VOL -, Input”.

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1. The power key through POW and GND to control MTK8205, MTK8205 will receive a low
signal to turn on or off system while press the power key.
2. The other key the same as power key .
3. The LED is constructed with two separate LED which color is green and orange. The
MTK8205 direct control the LED’s when MTK8205 (OGO5) is low the LED is orange (Close
power) when MTK8205 (OGO5) is high the LED is green (Open power).
MT8205 Application
MT8205 is a highly integrated single chip for PDP TV supporting video input and output format
up to HDTV. It includes 3D comb filter TV Decoder to retrieve the best image from popular
composite signals. On-chip advanced motion adaptive de-interlacer converts accordingly the
interlace video into progressive one with overlay of a 2D Graphic processor. Optional 2nd HDTV
or SDTV inputs allows user to see multi-programs on same screen. Flexible scalar provides wide
adoption to various PDP panel for different video sources. Its on-chip audio processor decodes
analog signals from Tuner with lip sync control, delivering high quality post-processed sound
effect to customers. On-chip microprocessor reduces the system BOM and shortens the
schedule of UI design by high level C program. MT8205 is a cost-effective and high performance
HDTV-ready solution to TV manufactures.

File No. SG-0184

BOLOCK DIAGRAM
1. Video input
a. Input Multiplexing
1.component X2
2.composite X3
3.s-videoX1
4.HDMI X1
5.VGA X1
6.RF X2

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b. Input formats:
1.support HDTV 480i/480p/720p/1080i
2.support Y/C signal 1VP-P/75Ω
3.support Y/C signal 1VP-P/75Ω
4.support 480i/408p/720p/1080i
5.support VGA input up to 1280x1024@60HZ
6.support NTSC system Frequency 55~801MHZ
7. support ATSC system Frequency 57~863MHZ
2. TV Decoder
For pip/pop:
Dual identical TVD on chip
3D-comb for both path
Dual VBI decoders for the application of V-chip
3. Support Formats:
Support NTSC, NTSC-4.43
Support ATSC
Automatic Luma / Chroma gain control
Automatic TV standard detection
NTSC Motion Adaptive 3D comb filter
Motion adaptive 3D Noise Reduction
VBI decoder for closed-caption/XDS/Teletext/WSS/VPS
Macro vision detection

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BOLOCK DIAGRAM
4. 2D-Graphic/OSD processor
Two OSD planes.
Support alpha blending among these two planes and video
Support text/bitmap decoder
Support line/rectangle/gradient fill
Support bitblt
Support color key function
Support clip mask
65535/256/16/4/2-color bitmap format OSD
Automatic vertical scrolling of OSD image
Support OSD mirror and upside down

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5. Microprocessor interface
When power is supplied and power key is pressed then the rest circuit lets Reset to low state
that will reset the MTK8205 to initial state. After that the Reset will transits to high state and the
MTK8205 start to work that microprocessor executes the programs and configures the internal
registers. The execution speed of CPU is 133 MHz.
a. The I/O ports are configured as follows：
Pin name Function Type Description

AF26 VGASCL Input / Output
AE26 VGASDA Input / Output
AB23 REQUEST# Input / Output
AB24 READY# Input / Output
AD22 SCL Input / Output
AC22 SDA Input / Output
OBO0 SOURCE Input Key detection
OBO1 MENU Input Key detection
OBO2 UP Input Key detection
OBO3 DOWN Input Key detection
OBO4 RIGHT Input Key detection
OBO5 LEFT Input Key detection
OBO6 AUTO Input Key detection
OBO7 POWER Input Key detection
OGO5 LED Output
AF24 IR Input / Output
AE23 GPIO Output Power on of TV board and panel
AD23 PWM0 Output Backlight Adjustmance
AC23 PWM1 Output Select mute
AF6 ORO6 Output RCA out mute
AE20 UP1_4 Input S-video Detect
AF20 UP1_3 Output HDMI SCDT
AE19` UP1_2 Output YCBCRSEL
AE21 UP3_0 Output Backlight ON/OFF
AD21 UP3_1 Output HDMI CAB

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b. PIP/POP HARDWARE LIMITION:
Secondary Window Source

Primary Window Source A B C D E F G H I
ATSC Tuner A X 9 9 9 9 X X X X
NTSC Tuner B 9 X 9 9 9 9 9 9 9
A/V1 C 9 9 X 9 9 9 9 9 9
A/V2 D 9 9 9 X 9 9 9 9 9
A/V3 (Side) E 9 9 9 9 X 9 9 9 9
Analog HD1 (480i~1080i) F X 9 9 9 9 X X X X
Analog HD2 (480i~1080i) G X 9 9 9 9 X X X X
Digital HD1 (HDMI) H X 9 9 9 9 X X X X
RGB I X 9 9 9 9 X X X X
Input Matrix for Windowing Functionality
6. Video processor
a. Color management
Flesh tone and multiple-color enhancement
Gamma/anti-Gamma correction
Color Transient Improvement (CTI)
Saturation/hue adjustment
Contrast/Brightness/Sharpness Management
Sharpness and DLTI/DCTI
Brightness and contrast adjustment
Black level extender
White peak level limiter
Adaptive Luma/Chroma Management
b. De-interlacing
Automatic detect film or video source
3:2/2:2 pull down source detection
Advanced Motion adaptive de-interlacing

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c. Scaling
Arbitrary ratio vertical/horizontal scaling of video, from1/32X to 32X
Advanced linear and non-linear Panorama scaling
Programmable Zoom viewer
Picture in picture (PIP)
Picture in picture
d. Display
12/10 10/8 8/6 Dithering processing for PDP display
10bit gamma correction
Support Alpha blending for Video and two OSD panel
Frame rate conversion
7. DRAM Usage
8205,2pcs of 8X16 DDR166 is necessary
Here is a comparison chart between (2XDDR)and(1XDDR)
MTK8205 8MX16 DDRAM test report

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8. Flash Usage
Flash is used to store FW code, fonts, bitmaps, and big tables for VGA, Video, and Gamma
2Mbyte is recommended to build a general TV model
MTK8205 Flash ROM support test report

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DDR SDRAM (M13S128168A-6T) Application
Pin description

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Command Truth Table
1. Power-Up and Initialization Sequence

The following sequence is required for POWER UP and Initialization.
1. Apply power and attempt to maintain CKE at a low state (all other inputs may be undefined.)
- Apply VDD before or at the same time as VDDQ.
- Apply VDDQ before or at the same time as VTT & VREF).
2. Start clock and maintain stable condition for a minimum of 200us.
3. The minimum of 200us after stable power and clock (CLK, CLK), apply NOP & take CKE
high.
4. Issue precharge commands for all banks of the device.
5. Issue EMRS to enable DLL. (To issue “DLL Enable” command, provide “Low” to A0, “High”
to BA0 and “Low” to all of the rest address pins, A1~A11 and BA1)

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6. Issue a mode register set command for “DLL reset”. The additional 200 cycles of clock input
is required to lock the DLL.(To issue DLL reset command, provide “High” to A8 and “Low” to
BA0)
7. Issue precharge commands for all banks of the device.
8. Issue 2 or more auto-refresh commands.
9. Issue a mode register set command with low to A8 to initialize device operation.
2. Mode Register Set (MRS)

The mode register stores the data for controlling the various operating modes of DDR SDRAM.
It programs CAS latency, addressing mode, burst length, test mode, DLL reset and various
vendor specific options to make DDR SDRAM useful for variety of different applications. The
default value of the register is not defined, therefore the mode register must be written after
EMRS setting for proper DDR SDRAM operation. The mode register is written by asserting low
on CS , RAS , CAS , WE and BA0 (The DDR SDRAM should be in all bank recharge with CKE
already high prior to writing into the mode register). The state of address pins A0~A11 in the
same cycle as CS , RAS , CAS , WE and BA0 going low is written in the mode register. Two
clock cycles are requested to complete the write operation in the mode register. The mode
register contents can be changed using the same command and clock cycle requirements
during operation as long as all banks are in the idle state. The mode register is divided into
various fields depending on functionality. The burst length uses A0~A2, addressing mode uses
A3, CAS latency (read latency from column address) uses A4~A6. A7 is used for test mode.
A8 is used for DLL reset. A7 must be set to low for normal MRS operation. Refer to the table
for specific codes for various burst length, addressing modes and CAS latencies.

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3. Precharge
The precharge command is used to precharge or close a bank that has activated. The
precharge command is issued when CS, RAS and WE are low and CAS is high at the rising
edge of the clock. The precharge command can be used to precharge each bank respectively
or all banks simultaneously. The bank select addresses (BA0, BA1) are used to define which
bank is precharged when the command is initiated. For write cycle, tWR(min.) must be
satisfied until the precharge command can be issued. After tRP from the precharge, an active
command to the same bank can be initiated.
Burst Selection for Precharge by Bank address bits

A10/AP BA1 BA0 Precharge
0 0 0 Bank A Only
0 0 1 Bank B Only
0 1 0 Bank C Only
0 1 1 Bank D Only
1 X X All Banks

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4. Row Active
The Bank Activation command is issued by holding CAS and WE high with CS and RAS low at
the rising edge of the clock (CLK). The DDR SDRAM has four independent banks; so two
Bank Select addresses (BA0, BA1) are required. The Bank Activation command to the first
read or write command must meet or exceed the minimum of RAS to CAS delay time (tRCD
min). Once a bank has been activated, it must be precharged before another Bank Activation
command can be applied to the same bank. The minimum time interval between interleaved
Bank Activation command (Bank A to Bank B and vice versa) is the Bank-to-Bank delay time
(tRRD min).
5. Read Bank
This command is used after the row activates command to initiate the burst read of data. The
read command is initiated by activating CS, CAS , and deasserting WE at the same clock
sampling (rising) edge as described in the command truth table. The length of the burst and
the CAS latency time will be determined by the values programmed during the MRS
command.
6. Write Bank
This command is used after the row activates command to initiate the burst write of data. The
write command is initiated by activating CS, CAS, and WE at the same clock sampling (rising)
edge as describe in the command truth table. The length of the burst will be determined by the
values programmed during the MRS command.

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7. Burst Read Operation
Burst Read operation in DDR SDRAM is in the same manner as the current SDRAM such that
the Burst read command is issued by asserting CS and CAS low while holding RAS and WE
high at the rising edge of the clock (CLK) after tRCD from the bank activation. The address
inputs determine the starting address for the Burst, The Mode Register sets type of burst.
(Sequential or interleave) and burst length (2, 4, 8). The first output data is available after the
CAS Latency from the READ command, and the consecutive data are presented on the falling
and rising edge of Data Strobe (DQS) adopted by DDR SDRAM until the burst length is
completed.
8. Burst Write Operation

The Burst Write command is issued by having CS , CAS and WE low while holding RAS high
at the rising edge of the clock (CLK). The address inputs determine the starting column
address. There is no write latency relative to DQS required for burst write cycle. The first data
of a burst write cycle must be applied on the DQ pins tDS (Data-in setup time) prior to data
strobe edge enabled after tDQSS from the rising edge of the clock (CLK) that the write
command is issued. The remaining data inputs must be supplied on each subsequent falling
and rising edge of Data Strobe until the burst length is completed. When the burst has been
finished, any additional data supplied to the DQ pins will be ignored.

File No. SG-0184

MX29LV160BTTC (Flash) Application
The MX29LV800T/B & MX29LV800AT/AB is a 8-mega bit Flash memory organized as 1M bytes
of 8 bits or 512K words of 16 bits. MXIC's Flash memories offer the most cost-effective and
reliable read/write non-volatile random access memory. The MX29LV800T/B &
MX29LV800AT/AB is packaged in 44-pin SOP, 48-pin TSOP, and 48-ball CSP. It is designed to
be reprogrammed and erased in system or in standard EPROM programmers.

File No. SG-0184

BLOCK DIAGRAM
1. COMMAND DEFINITIONS
Device operations are selected by writing specific address and data sequences into the
command register. Writing incorrect address and data values or writing them in the improper
sequence will reset the device to the read mode. Table 5 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are
valid only while the Sector Erase operation is in progress.

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2. WRITE COMMANDS/COMMAND SEQUENCES
To program data to the device or erase sectors of memory, the system must drive WE and CE
to VIL, and OE to VIH. The device features an Unlock Bypass mode to facilitate faster
programming. Once the device enters the Unlock Bypass mode, only two write cycles are
required to program a byte, instead of four. The "byte Program Command Sequence" section
has details on programming data to the device using both standard and Unlock Bypass
command sequences. An erase operation can erase one sector, multiple sectors, or the entire
device. Table indicates the address space that each sector occupies. A "sector address"
consists of the address bits required to uniquely select a sector. The "Writing specific address
and data commands or sequences into the command register initiates device operations.
Figure 1 defines the valid register command sequences. Writing incorrect address and data
values or writing them in the improper sequence resets the device to reading array data.
Section has details on erasing a sector or the entire chip, or suspending/resuming the erase
operation.

File No. SG-0184

After the system writes the auto select command sequence, the device enters the auto select
mode. The system can then read auto select codes from the internal register (which is
separate from the memory array) on Q7-Q0. Standard read cycle timings apply in this mode.
Refer to the Auto select Mode and Auto select Command Sequence section for more
information. ICC2 in the DC Characteristics table represents the active current specification for
the write mode. The "AC Characteristics" section contains timing specification table and timing
diagrams for write operations.
Figure 1
3. READ/RESET COMMAND
The read or reset operation is initiated by writing the read/reset command sequence into the
command register. Microprocessor read cycles retrieve array data. The device remains
enabled for reads until the command register contents are altered. If program-fail or erase-fail
happen, the write of F0H will reset the device to abort the operation. A valid command must
then be written to place the device in the desired state.

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4. READING ARRAY DATA
The device is automatically set to reading array data after device power-up. No commands are
required to retrieve data. The device is also ready to read array data after completing an
Automatic Program or Automatic Erase algorithm. After the device accepts an Erase Suspend
command, the device enters the Erase Suspend mode. The system can read array data using
the standard read timings, except that if it reads at an address within erase suspended sectors,
the device outputs status data. After completing a programming operation in the Erase
Suspend mode, the system may once again read array data with the same exception. See
Erase Suspend/Erase Resume Commands” for more information on this mode. The system
must issue the reset command to re-enable the device for reading array data if Q5 goes high,
or while in the auto select mode. See the "Reset Command" section, next.
5. RESET COMMAND
Writing the reset command to the device resets the device to reading array data. Addresses
bits are don't care for this command. The reset command may be written between the
sequence cycles in an erase command sequence before erasing begins. This resets the
device to reading array data. Once erasure begins, however, the device ignores reset
commands until the operation is complete. The reset command may be written between the
sequence cycles in a program command sequence before programming begins. This resets
the device to reading array data (also applies to programming in Erase Suspend mode). Once
programming begins, however, the device ignores reset commands until the operation is
complete. The reset command may be written between the sequence cycles in an SILICON ID
READ command sequence. Once in the SILICON ID READ mode, the reset command must
be written to return to reading array data (also applies to SILICON ID READ during Erase
Suspend). If Q5 goes high during a program or erase operation, writing the reset command
returns the device to reading array data (also applies during Erase Suspend).

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MT5111 Application:
MT5111 Functional Block Diagram
MT5111 is fully integrated single-chip 8-VSB , designed specifically for the digital terrestrial.
HDTV receivers . The chip is fully compliant with the ATSC A/53 digital TV standard.
MT5111 includes a 10-bit A/D converter , 8-VSB demodulator , TCM(Trellis-Coded Modulation).
Decoder . and Reed-Solomon Forward Error Correction decoder . Moreover , an internal

controller handles the acquisition and tracking to ensure the best receiving performance . The
internal controller communicates with the external host controller via the I2C-compatible
interface , and also provides direct control to the RF tuner via the second I2C-compatible
interface.
MT5111 accepts either the direct IF signals centered at 44MHZ or 43.75MHZ , or the low IF
signal Centered at 5.38MHZ . The center frequency of the incoming IF signal can also be
programmed to other frequencies for Various applications . An On-chip programmable
gain-controlled amplifier is designed to provide sufficient signal amplitude when the received RF
signal is weak . The If signal is first sampled by a 10-bit A/D converter . Afterward , the digitized
samples are further processed for adjacent channel interference rejection.
MT5111 measures the power level of the digitized sequence , and feeds the control voltages
back to the RF tuner and the IF amplifier respectively . The control voltages are converted to
analog signals through the on-chip 1-bit sigma-delta D/A converters plus the off-chip R-C
low-pass filters . The automatic gain control keeps the received power level at a desired level
and maximizes the received SNR .

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The carrier frequency offset and symbol timing offset are both estimated and compensated by a
fully digital synchronizer . The synchronizer also controls the rate conversion in the digital
re-sampling device by estimating the sampling frequency offset . All synchronization in MT5111
are integrated in digital circuits , no external VCXO is required.
The equalizer is adopted to cancel the effect of multi-path fading channel during signal
propagation in the air . The equalizer is not only capable of acquiring correct coefficients
combination by specified adaptive algorithms , but also programmable to different configurations
for various channel conditions.
The following FEC decoder corrects most of the errors by the concatenation of TCM and
Reed-Solomon decoders . The on-chip error rate estimator can simultaneously monitor the
receiving qualities at the three stages: equalizer output , TCM decoder , and transport stream
packets . The chip finally outputs the decoded MPEG-2 packets in either the serial or parallel
transport stream format.
In addition to the demodulation of HDTV signal , MT5111 also provides the capability to remove
the NTSC co-channel interference.To achieve the best reception condition , an antenna interface
compliant with EIA/CEA-909 is designed to control the antenna parameters.
MT5111 is designed with efficient mechanisms of power saving . When configured to enter the
sleep mode by the system host , it can immediately turn off almost all embedded hardware
except the on-chip controller to reduce the power consumption . Resuming form sleep mode is
also triggered by the system host . Upon returning to the operation mode , the chip will try to
re-acquire the DTV signal automatically.
MT5111 Key Features:

1. ATSC compliant 8-VSB demodulator
2. Accepts dirtect IF (44 MHZ or 43.75 MHZ) and low IF (5.38 MHZ)
3. Differential IF input with programmable input signal level : 0.5 Vpp to 2 Vpp
4. NTSC interference rejection capability
5. Compensate echo up to –5 to +47 us range
6. On-chip 10-bit ADC for HDTV demodulator
7. On-chip programmable gain amplifier

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8. 25MHZ crystal for clock generation
9. Full-digital timing recovery , no VCXO is required
10. Full-digital frequency offset recovery with wide acquisition range –1MHZ~+1MHZ
11. Dual digital AGC control for IF and RF respectively
12. MPEG-2 transport stream output in parallel or serial format
13. On-chip error rate estimators for TS packets , TCM decoder , and equalizer
14. EIA/CEA-909 antenna interface
15. Controlled by I2C interface
16. Supports sleep mode to save power consumption
17. Core power supply : 1.8V , peripheral power supply : 3.3V
18.100-LQFP package
MT5351 Application :
MediaTek MT5351 is a DTV Backend Decoder SOC which support flexible transport demux , HD
MPEG-2 video decoder , JPEG decoder , MPEG1,2,MP3,AC3 audio decoder , HDTV encoder .
The MT5351 enables consumer electronics manufactures to build high quality , feature-rich DTV ,
STB or other home entertainment audio/video device.
World-Leading Technology : HW support worldwide major broadcast network and CA standards ,

include ATSC , DVB , OpenCable , DirectTV , MHP.
Rich Feature for high value product : To enrich the feature of DTV , the MT5351 support 1394-5C
component to external DVHS . Dual display , PIP/POP and quad pictures provide user a whole
new viewing experience.
Credible Audio/Video Quality : The MT5351 use advanced motion-adaptive de-interlace

algorithm to achieve the best movie/video playback , The embedded 4X over-sample video DAC
could generate very fine display quality . Also , the audio 3D surround and equalizer provide
professional entertainment.

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General Feature List :
A . Host CPU:
1. ARM 926EJ
2.16K I-Cache and 16K D-Cache
3. 8K Data TCM and 8K instruction
4. JTAG ICE interface
5. Watch Dog timers
B . Transport Demuxer :
1. Support 3 independent transport stream inputs
2. Support serial/parallel interface for each transport stream input
3. Support ATSC , DVB , and MPEG2 transport stream inputs.
4. Programmable sync detection.
5. Support DES/3-DES De-scramble.
6. 96 PID filter and 128 section filters.
7. Support TS recording via IEEE1394 interface.
C . MPEG2 Decoder :
1. Support dual MPEG-2 HD decoder or up to 8 SD decoder.
2. Complaint to MP@ML , MP@HL and MPEG-1 video standards.
D . JPEG Decoder :
1. Decode Base-line or progressive JPEG file.
E . 2D Graphics :
1. Support multiple color modes.
2. Point , horizontal/vertical line primitive drawing.
3. Rectangle fill and gradient fill functions.
4. Bitblt with transparent , alpha blending , alpha composition and stretch.
5. Font rendering by color expansion.
6. Support clip masks.
7. YCrCb to RGB color space transfer.
F . OSD Display :
1. 3 linking list OSDs with multiple color mode.
2. OSD scaling with arbitary ratio from 1/2x to 2x.
3. Square size , 32x32 or 64x64 pixel , hardware cursor.

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G . Video Processing :
1. Advanced Motion adaptive de-interlace on SDTV resolution.
2. Support clip
3. 3:2/2:2 pull down source detection.
4. Arbitrary ratio vertical/horizontal scaling of video , from 1/15X to 16X.
5. Support Edge preserve.
6. Support horizontal edge enhancement.
7. Support Quad-Picture.
H . Main Display :
1. Mixing two video and three OSD and hardware cursor.
2. Contrast/Brightness adjustment.
3. Gamma correction.
4. Picture-in-Picture( PIP ).
5. Picture-Out-Picture( POP ).
6. 480i/576i/480p/576p/720p/1080i output
I . Auxiliary Display :
1. Mixing one video and one OSD.
2. 480i/576i output.
J . TV Encoder :
1. Support NTSC M/N , PAL M/N/B/D/G/H/I
2. Macrovision Rev 7.1.L1
3. CGMS/WSS.
4. Closed Captioning.
5. Six 12-bit video DACs for CVBS , S-video or RGB/YPbPr output.
K . Digital Video Interface :

1. Support SAV/EAV.
2. Support 8/16 for SD/HD digital video input.
3. Support 8/16/24 bits digital output for main display.
4. Support 8 bits digital output for aux display.
L . DRAM Controller :
1. Support 64Mb to 1Gb DDR DRAM devices.
2. Configurable 32/64 bit data bus interface.
3. Support DDR266 , DDR333 , DDR400 , JEDEC specification compliant SDRAM.
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M . Peripheral Bus Interface :
1. Support NOR/NAND flash.
2. Support CableCard host control bus.
N . Audio :
1. Support Dolby Digital AC-3 decoding.
2. MPEG-1 layer I/II , MP3 decoding.
3. Dolby prologic II.
4. Main audio output : 5.1ch + 2ch ( down mix )
5. Auxiliary audio output : 2ch.
6. Pink noise and white noise generator.
7. Equalizer.
8. Bass management.
9. 3D surround processing include virtual surround.
10. Audio and video lip synchronization.
11. Support reverberation.
12. SPDIF out.
13. I2S I/F.
O . Peripherals :
1. Three UARTs with Tx and Rx FIFO , two of them have hardware flow control.
2. Two serial interfaces , one is master only the other can be set to master mode or slave
mode.
3. Two PWMs.
4. IR blaster and receiver.
5. IEEE1394 link controller.
6. IDE bus : ATA/ATAPI7 UDMA mode 5 , 100MB/s.
7. Real-time clock and watchdog controller.
8. Memory card I/F : MS/MS-pro ,SD ,CF ,and MMC
9. PCMCIA/POD/CI interface
P . IC Outline :
1. 471 Pin BGA Package.
2. 3.3V/1.2V dual Voltage.

File No. SG-0184

MX29LV320BTTC (Flash) Application :
The MX29LV320AT/B is a 32-mega bit Flash memory organized as 4M bytes of 8 bits and 2M
words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write
non-volatile random access memory.
The MX29LV320AT/B is packaged in 48-pin TSOP and 48-ball CSP. It is designed to be

reprogrammed and erased in system or in standard EPROM programmers. The standard
MX29LV320AT/B offers access time as fast as 70ns, allowing operation of high-speed
microprocessors without wait states. To eliminate bus contention, the MX29LV320AT/B has
separate chip enable (CE) and output enable (OE) controls.
MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and
programming. The MX29LV320AT/B uses a command register to manage this functionality.
MXIC Flash technology reliably stores memory contents even after 100,000 erase and program
cycles. The MXIC cell is designed to optimize the erase and program mechanisms. In addition,
the combination of advanced tunnel oxide processing and low internal electric fields for erase
and programming operations produces reliable cycling.
The MX29LV320AT/B uses a 2.7V to 3.6V VCC supply to perform the High Reliability Erase and
auto Program/Erase algorithms.
The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100 milliamperes on address and data pin from
-1V to VCC + 1V.

File No. SG-0184

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BLOCK DIAGRAM

File No. SG-0184

BUS OPERATION--1
Legend:
L=Logic LOW=VIL, H=Logic High=VIH, VID=12.0　0.5V, VHH=11.5-12.5V, X=Don't Care,
AIN=Address IN, DIN=Data IN,DOUT=Data OUT
Notes:
1. When the WP/ACC pin is at VHH, the device enters the accelerated program mode. See
"Accelerated Program Operations" for more information.
2.The sector group protect and chip unprotect functions may also be implemented via
programming equipment. See the "Sector Group Protection and Chip Unprotection" section.
3.If WP/ACC=VIL, the two outermost boot sectors remain protected. If WP/ACC=VIH, the two
outermost boot sector protection depends on whether they were last protected or unprotected
using the method described in "Sector/Sector Block Protection and Unprotection". If
WP/ACC=VHH, all sectors will be unprotected.
4.DIN or Dout as required by command sequence, data polling, or sector protection algorithm.
5.Address are A20:A0 in word mode (BYTE=VIH), A20:A-1 in byte mode (BYTE=VIL).

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BUS OPERATION--2
Notes:
1.Code=00h means unprotected, or code=01h protected.
2.Code=99 means factory locked, or code=19h not factory locked.
WRITE COMMANDS/COMMAND SEQUENCES

To program data to the device or erase sectors of memory , the system must drive WE and CE to
VIL, and OE to VIH.
An erase operation can erase one sector, multiple sectors , or the entire device. A "sector
address" consists of the address bits required to uniquely select a sector. Writing specific
address and data commands or sequences into the command register initiates device operations.
Table A defines the valid register command sequences. Writing incorrect address and data
values or writing them in the improper sequence resets the device to reading array data. Section
has details on erasing a sector or the entire chip, or suspending/resuming the erase operation.
After the system writes the Automatic Select command sequence, the device enters the
Automatic Select mode. The system can then read Automatic Select codes from the internal
register (which is separate from the memory array) on Q7-Q0. Standard read cycle timings apply
in this mode. Refer to the Automatic Select Mode and Automatic Select Command Sequence
section for more information.
ICC2 in the DC Characteristics table represents the active current specification for the write
mode. The "AC Characteristics" section contains timing specification table and timing diagrams
for write operations.

File No. SG-0184

TABLE A. MX29LV320AT/B COMMAND DEFINITIONS
Legend:
X=Don't care
RA=Address of the memory location to be read.
RD=Data read from location RA during read operation.
PA=Address of the memory location to be programmed.
Addresses are latched on the falling edge of the WE or CE pulse.
PD=Data to be programmed at location PA. Data is latched on the rising edge of WE or CE
pulse.
SA=Address of the sector to be erased or verified. Address bits A20-A12 uniquely select any
sector.
ID=22A7h(Top), 22A8h(Bottom)
Notes:
1.All values are in hexadecimal.
2.Except when reading array or Automatic Select data, all bus cycles are write operation.
3.The Reset command is required to return to the read mode when the device is in the Automatic
Select mode or if Q5 goes high.
4.The fourth cycle of the Automatic Select command sequence is a read cycle.
5.The data is 99h for factory locked and 19h for not factory locked.
6.The data is 00h for an unprotected sector/sector block and 01h for a protected sector/sector
block. In the third cycle of the command sequence, address bit A20=0 to verify sectors 0~31,
A20=1 to verify sectors 32~70 for Top Boot device.
7.Command is valid when device is ready to read array data or when device is in Automatic
Select mode.
8.The system may read and program functions in non-erasing sectors, or enter the Automatic
Select mode, when in the erase Suspend mode. The Erase Suspend command is valid only
during a sector erase operation.
9.The Erase Resume command is valid only during the Erase Suspend mode.

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STANDBY MODE
MX29LV320AT/B can be set into Standby mode with two different approaches. One is using both
CE and RESET pins and the other one is using RESET pin only.
When using both pins of CE and RESET, a CMOS Standby mode is achieved with both pins held
at Vcc ±0.3V. Under this condition, the current consumed is less than 0.2uA (typ.). If both of the
CE and RESET are held at VIH, but not within the range of VCC ± 0.3V, the device will still be in
the standby mode, but the standby current will be larger. During Auto Algorithm operation, Vcc
active current (ICC2) is required even CE = "H" until the operation is completed. The device can
be read with standard access time (tCE) from either of these standby modes.
When using only RESET, a CMOS standby mode is achieved with RESET input held at Vss

　0.3V, Under this condition the current is consumed less than 1uA (typ.). Once the RESET pin
is taken high, the device is back to active without recovery delay.
In the standby mode the outputs are in the high impedance state, independent of the OE input.
MX29LV320AT/B is capable to provide the Automatic Standby Mode to restrain power
consumption during readout of data. This mode can be used effectively with an application
requested low power consumption such as handy terminals.
To active this mode, MX29LV320AT/B automatically switch themselves to low power mode when
MX29LV320AT/B addresses remain stable during access time of tACC+30ns. It is not necessary
to control CE, WE, and OE on the mode. Under the mode, the current consumed is typically
0.2uA (CMOS level).
RESET OPERATION
01The RESET pin provides a hardware method of resetting the device to reading array data.
When the RESET pin is driven low for at least a period of tRP, the device immediately terminates
any operation in progress, tristates all output pins, and ignores all read/write commands for the
duration of the RESET pulse. The device also resets the internal state machine to reading array
data. The operation that was interrupted should be reinitiated once the device is ready to accept
another command sequence, to ensure data integrity.
Current is reduced for the duration of the RESET pulse. When RESET is held at VSS　0.3V, the
device draws CMOS standby current (ICC4). If RESET is held at VIL but not within VSS　0.3V,
the standby current will be greater.
The RESET pin may be tied to system reset circuitry. A system reset would that also reset the
Flash memory, enabling the system to read the boot-up firm-ware from the Flash memory.
If RESET is asserted during a program or erase operation, the RY/BY pin remains a "0" (busy)
until the internal reset operation is complete, which requires a time of tREADY (during
Embedded Algorithms).

File No. SG-0184

The system can thus monitor RY/BY to determine whether the reset operation is complete. If
RESET is asserted when a program or erase operation is not executing (RY/BY pin is "1"), the
reset operation is completed within a time of tREADY (not during Embedded Algorithms). The
system can read data tRH after the RESET pin returns to VIH. Refer to the AC Characteristics
tables for RESET parameters and to Figure 14 for the timing diagram.
WRITE PROTECT (WP)

The write protect function provides a hardware method to protect boot sectors without using VID.
If the system asserts VIL on the WP/ACC pin, the device disables program and erase functions
in the two "outermost" 8 Kbyte boot sectors independently of whether those sectors were
protected or unprotected using the method described in Sector/Sector Group Protection and
Chip Unprotection". The two outermost 8 Kbyte boot sectors are the two sectors containing the
lowest addresses in a bottom-boot-configured device, or the two sectors containing the highest
addresses in a top-boot-configured device.
If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two outermost
8K Byte boot sectors were last set to be protected or unprotected. That is, sector protection or
unprotection for these two sectors depends on whether they were last protected or unprotected
using the method described in "Sector/Sector Group Protection and Chip Unprotection".
Note that the WP/ACC pin must not be left floating or unconnected; inconsistent behavior of the
device may result.
SOFTWARE COMMAND DEFINITIONS :

Device operations are selected by writing specific address and data sequences into the
command register. Writing incorrect address and data values or writing them in the improper
sequence will reset the device to the read mode. Table 3 defines the valid register command
sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid
only while the Sector Erase operation is in progress. Either of the two reset command sequences
will reset the device (whenapplicable).
All addresses are latched on the falling edge of WE or CE, whichever happens later. All data are
latched on rising edge of WE or CE, whichever happens first.
WRITE OPERATION STATUS

The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7,
and RY/BY.Table B and the following subsections describe the functions of these bits. Q7,
RY/BY, and Q6 each offer a method for determining whether a program or erase operation is
complete or in progress. These three bits are discussed first.

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Table B. Write Operation Status
Notes:
1.Performing successive read operations from the erase-suspended sector will cause Q2 to toggle.
2.Performing successive read operations from any address will cause Q6 to toggle.
3.Reading the byte/word address being programmed while in the erase-suspend program mode will
indicate logic "1" at the Q2 bit.
However, successive reads from the erase-suspended sector will cause Q2 to toggle.
Fig C. COMMAND WRITE OPERATION

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Fig D. READ TIMING WAVEFORMS

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Fig E. RESET TIMING WAVEFORM

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DDR SDRAM (NT5DS16M16CS-5T) Application :
Functional Description
The 256Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory containing
268, 435, 456 bits. The 256Mb DDR SDRAM is internally configured as a quad-bank DRAM.
The 256Mb DDR SDRAM uses a double-data-rate architecture to achieve high-speed operation.
The double-data-rate architecture is essentially a 2n prefetch architecture, with an interface
designed to transfer two data words per clock cycle at the I/O pins. A single read or write access
for the 256Mb DDR SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at the
internal DRAM core and two corresponding n-bit wide, one-half clock cycle data transfers at the
I/O pins.
Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a selected
location and continue for a programmed number of locations in a programmed sequence.
Accesses begin with the registration of an Active command, which is then followed by a Read or
Write command. The address bits registered coincident with the Active command are used to
select the bank and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The
address bits registered coincident with the Read or Write command are used to select the
starting column location for the burst access.
Prior to normal operation, the DDR SDRAM must be initialized. The following sections provide
detailed information covering device initialization, register definition, command descriptions and
device operation.

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Block Diagram (16Mb x 16)
Note: This Functional Block Diagram is intended to facilitate user understanding of the operation
of the device; it does not represent an actual circuit implementation.
Note: DM is a unidirectional signal (input only), but is internally loaded to match the load of the
bidirectional DQ and DQS signals.

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Pin Configuration - 400mil TSOP II (x4 / x8 / x16)

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Mode Register Operation
Operating Mode
The normal operating mode is selected by issuing a Mode Register Set Command with bits
A7-A12 to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by issuing a
Mode Register Set command with bits A7 and A9-A12 each set to zero, bit A8 set to one, and
bits A0-A6 set to the desired values. A Mode Register Set command issued to reset the DLL
should always be followed by a Mode Register Set command to select normal operating mode.
All other combinations of values for A7-A12 are reserved for future use and/or test modes. Test
modes and reserved states should not be used as unknown operation or incompatibility with
future versions may result.

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Extended Mode Register
The Extended Mode Register controls functions beyond those controlled by the Mode Register;
these additional functions include DLL enable/disable, bit A0; output drive strength selection, bit
A1; and QFC output enable/disable, bit A2 (NTC optional). These functions are controlled via the
bit settings shown in the Extended Mode Register Definition. The Extended Mode Register is
programmed via the Mode Register Set command (with BA0 = 1 and BA1 = 0) and retains the
stored information until it is programmed again or the device loses power. The Extended Mode
Register must be loaded when all banks are idle, and the controller must wait the specified time
before initiating any subsequent operation. Violating either of these requirements result in
unspecified operation.
Extended Mode Register Definition

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Truth Table a: Commands
1. CKE is high for all commands shown except Self Refresh.

2. BA0, BA1 select either the Base or the Extended Mode Register (BA0 = 0, BA1 = 0 selects
Mode Register; BA0 = 1, BA1 = 0 selects ,Extended Mode Register; other combinations of
BA0-BA1 are reserved; A0-A12 provide the op-code to be written to the selected Mode
Register.)
3. BA0-BA1 provide bank address and A0-A12 provide row address.
4. BA0, BA1 provide bank address; A0-Ai provide column address (where i = 9 for x8 and 9, 11
for x4); A10 high enables the Auto Precharge feature (non-persistent), A10 low disables the
Auto Precharge feature.
5. A10 LOW: BA0, BA1 determine which bank is precharged.A10 HIGH: all banks are
precharged and BA0, BA1 are “Don’t Care.”
6. This command is auto refresh if CKE is high; Self Refresh if CKE is low.
7. Internal refresh counter controls row and bank addressing; all inputs and I/Os are “Don’t Care”
except for CKE.
8. Applies only to read bursts with Auto Precharge disabled; this command is undefined (and
should not be used) for read bursts with Auto Precharge enabled or for write bursts
9. Deselect and NOP are functionally interchangeable.
Active
The Active command is used to open (or activate) a row in a particular bank for a subsequent
access. The value on the BA0,BA1 inputs selects the bank, and the address provided on inputs
A0-A12 selects the row. This row remains active (or open) for accesses until a Precharge (or
Read or Write with Auto Precharge) is issued to that bank. A Precharge (or Read or Write with
Auto Precharge) command must be issued and completed before opening a different row in the
same bank.
Read
The Read command is used to initiate a burst read access to an active (open) row. The value on
the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9,
j = don’t care] for x8; where [i = 9, j = 11] for x4) selects the starting column location. The value
on input A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected,
the row being accessed is precharged at the end of the Read burst; if Auto Precharge is not
selected, the row remains open for subsequent accesses.

File No. SG-0184

Write
The Write command is used to initiate a burst write access to an active (open) row. The value on
the BA0, BA1 inputs selects the bank, and the address provided on inputs A0-Ai, Aj (where [i = 9,
j = don’t care] for x8; where [i = 9, j = 11] for x4) selects the starting column location. The value
on input A10 determines whether or not Auto Precharge is used. If Auto Precharge is selected,
the row being accessed is precharged at the end of the Write burst; if Auto Precharge is not
selected, the row remains open for subsequent accesses. Input data appearing on the DQs is
written to the memory array subject to the DM input logic level appearing coincident with the data.
If a given DM signal is registered low, the corresponding data is written to memory; if the DM
signal is registered high, the corresponding data inputs are ignored, and a Write is not executed
to that byte/column location.
Auto Refresh
Auto Refresh is used during normal operation of the DDR SDRAM and is analogous to CAS
Before RAS (CBR) Refresh in previous DRAM types. This command is nonpersistent, so it must
be issued each time a refresh is required.
The refresh addressing is generated by the internal refresh controller. This makes the address
bits “Don’t Care” during an Auto Refresh command. The 256Mb DDR SDRAM requires Auto
Refresh cycles at an average periodic interval of 7.8μs (maximum).
Self Refresh
The Self Refresh command can be used to retain data in the DDR SDRAM, even if the rest of the
system is powered down.When in the self refresh mode, the DDR SDRAM retains data without
external clocking. The Self Refresh command is initiated as an Auto Refresh command
coincident with CKE transitioning low. The DLL is automatically disabled upon entering Self
Refresh, and is automatically enabled upon exiting Self Refresh (200 clock cycles must then
occur before a Read command can be issued). Input signals except CKE (low) are “Don’t Care”
during Self Refresh operation.
The procedure for exiting self refresh requires a sequence of commands. CK (and CK) must be
stable prior to CKE returning high. Once CKE is high, the SDRAM must have NOP commands
issued for tXSNR because time is required for the completion of any internal refresh in progress.
A simple algorithm for meeting both refresh and DLL requirements is to apply NOPs for 200 clock
cycles before applying any other command.

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Operations :
Reads
Subsequent to programming the mode register with CAS latency, burst type, and burst length,
Read bursts are initiated with a Read command.
The starting column and bank addresses are provided with the Read command and Auto
Precharge is either enabled or disabled for that burst access. If Auto Precharge is enabled, the
row that is accessed starts precharge at the completion of the burst, provided tRAS has been
satisfied. For the generic Read commands used in the following illustrations, Auto Precharge is
disabled.
During Read bursts, the valid data-out element from the starting column address is available
following the CAS latency after the Read command. Each subsequent data-out element is valid
nominally at the next positive or negative clock edge (i.e. at the next crossing of CK and CK). The
following timing figure entitled “Read Burst: CAS Latencies (Burst Length=4)” illustrates the
general timing for each supported CAS latency setting. DQS is driven by the DDR SDRAM along
with output data. The initial low state on DQS is known as the read preamble; the low state
coincident with the last data-out element is known as the read postamble . Upon completion of a
burst, assuming no other commands have been initiated, the DQs and DQS goes High-Z. Data
from any Read burst may be concatenated with or truncated with data from a subsequent Read
command. In either case, a continuous flow of data can be maintained. The first data element
from the new burst follows either the last element of a completed burst or the last desired data
element of a longer burst which is being truncated. The new Read command should be issued x
cycles after the first Read command, where x equals the number of desired data element pairs
(pairs are required by the 2n prefetch architecture). This is shown in timing figure entitled
“Consecutive Read Bursts: CAS Latencies (Burst Length =4 or 8)”.A Read command can be
initiated on any positive clock cycle following a previous Read command. Nonconsecutive Read
data is shown in timing figure entitled “Non-Consecutive Read Bursts: CAS Latencies (Burst
Length = 4)”. Full-speed Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8)
within a page (or pages) can be performed as shown on following:

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Random Read Accesses: CAS Latencies (Burst Length = 2, 4 or 8)

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Read Command
Writes
Write bursts are initiated with a Write command, as shown in timing figure Write Command on
following: The starting column and bank addresses are provided with the Write command, and
Auto Precharge is either enabled or disabled for that access. If Auto Precharge is enabled, the
row being accessed is precharged at the completion of the burst. For the generic Write
commands used in the following illustrations, Auto Precharge is disabled.
During Write bursts, the first valid data-in element is registered on the first rising edge of DQS
following the write command, and subsequent data elements are registered on successive edges
of DQS. The Low state on DQS between the Write command and the first rising edge is known
as the write preamble; the Low state on DQS following the last data-in element is known as the
write postamble. The time between the Write command and the first corresponding rising edge of
DQS (tDQSS) is specified with a relatively wide range (from 75% to 125% of one clock cycle), so
most of the Write diagrams that follow are drawn for the two extreme cases (i.e. tDQSS(min) and
tDQSS(max)). Timing figure Write Burst (Burst Length = 4) on page 33 shows the two extremes
of tDQSS for a burst of four. Upon completion of a burst, assuming no other commands have
been initiated, the DQs and DQS enters High-Z and any additional input data is ignored.
File No. SG-0184

Data for any Write burst may be concatenated with or truncated with a subsequent Write
command. In either case, a continuous flow of input data can be maintained. The new Write
command can be issued on any positive edge of clock following the previous Write command.
The first data element from the new burst is applied after either the last element of a completed
burst or the last desired data element of a longer burst which is being truncated. The new Write
command should be issued x cycles after the first Write command, where x equals the number of
desired data element pairs (pairs are required by the 2n prefetch architecture).
Write Command

File No. SG-0184

Data Input (Write)
Data Output (Read)
WM8776 Application
The WM8776 is a high performance, stereo audio codec with five channel input selector. The
WM8776 is ideal for surround sound processing applications for home hi-fi, DVD-RW and other
audiovisual equipment. Etch ADC channel has programmable gain control with automatic level
control. Digital audio output word lengths from 16-32 bits and sampling rates from 32kHZ to
96KHZ are supported. The DAC has an input mixer allowing an external analogue signal to be
mixed with the DAC signal. There are also Headphone and line outputs, with control for the
headphone
The WM8776 supports fully independent sample rates for the ADC and DAC. The audio data
interface supports I2S, left justified, right justified and DSP formats.

File No. SG-0184

BLOCK DIAGRAM
1. Audio sample rate

The master clock forWM8776 supports DAC and ADC audio sampling rates 256fs to 768fs,
where fs is the audio sample frequency (DACLRC or ADCLRC) typically 32KHZ, 44.1KHZ,
48KHZ or 96KHZ (the DAC also supports operation at 128fs and 192fs and 192KHZ sample
rate). The master clock is used to operate the digital filters and the noise shaping circuits.
In slave mode the WM8776 has a master detection circuit that automatically determines the
relationship between the master clock frequency and the sampling rate (to within +/- 32 system
clocks) If there is a greater than 32 clocks error the interface is disabled and
ADCLRC/DACLRC for optical performance, although the WM8776 is tolerant of phase
variations or jitter on this clock.
Table shows the typical master clock frequency inputs for the WM8776.

File No. SG-0184

2. DIGITAL AUDIO INTERFACE
a. Slave mode
The audio interfaces operations in either slave mode selectable using the MS control bit. In
slave mode DIN is always an input to the WM8776 and DOUT is always an output. The default
is Slave mode. In slave mode (ms=0) ADCLRC, DACLRC, ADCBCLK, DACBCLK are input to
the WM8776 .
DIN and DACLRC are sampled by the WM8776 on the rising edge of DACBCLK; ADCLRC is
sampled on the rising edge of ADCBCLK. ADC data is output on DOUT and changes on the
falling edge of ADCBCLK. By setting control bit BCLKINV the polarity of ADCBCLK and
DACBCLK may be reversed so that DIN and DACLRC are sample on the falling edge of
DACBCLK, ADCLRC is sampled on the falling edge of ADCBCLK and DOUT changes on the
rising of ADCBCLK Slave mode as shown in the following figure.

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b. 2 Wire serial control mode
The wm8776 supports software control via a 2-wire serial bus. Many devices can be controlled
by the same bus, and each device has a uni ue 7-bit address (this is not the same as the 7-bit
address of each register in the wm8776). The wm8776 operates as a slave device only.
2-wire serial interface as shown in the following figure.
The wm8776 has two possible device addresses, which can be selected using the CE pin
In the L37 LCD TV CE pin is LOW (device address is 34h).
In the L37 wm8776 has 2-wire interface

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Sil9011 Application
The sil9011 provides a complete solution for receiving HDMI compliant digital audio and video.
Specialized audio and video processing is available within the sil9011 to easily and cost
effectively adds HDMI capability to consumer electronics devices such as digital TVs, plasma
displays, LCD TVs and projectors.
BLOCK DIAGRAM

File No. SG-0184

1. TMDS Digital Core
The core performs 10-to-8-bit TMDS decoding on the audio and video received from the three
TMDS differential data lines along with a TMDS differential clock. The TMDS core supports link
clock rates to 165MHZ, including CE modes to 720P/1080I/1080P.
2. Active port detection

The Pane Link core detects an active TMDS clock and actively toggling DE signal. These
states are accessible in register bits, useful for monitoring the status of the HDMI input or for
automatically powering down the receiver. The 5V supply from the HDMI connector is used as
a cable detect indicator. The sil9011 can monitor the presence of this+5V supply and, if and
when necessary, provide a fast audio mute without pops when it senses the HDMI cable pulled.
The microcontroller can also poll registers in the sil9011 to check whether an HDMI cable is
connected.
3. HDCP Decryption engine

The HDCP decryption engine contains all necessary logic to decrypt the incoming audio and
video data. The decryption process is entirely controlled by the host microprocessor through a
set sequence of register reads and wires through the DDC channel. Pre-programmed HDCP
keys and key Selection Vector are used in the decryption process. A resulting calculated to an
XOR mask during each clock cycle to decrypt the audio/video data in sync with the host.
4. Video Data Conversion and Video Output

The Sil9011 can output video in many different formats as shown in the following figure.

File No. SG-0184

The receiver can also process the video data before it is output as show below figure
5. I2c Interface to Display Controller

The Controller I2c interface (CSDA, CSCL) on the sil9011 is a slave interface capable of
running up to 400KHZ. This bus is used to configure the SIL9011 by reading/writing to the
appropriate registers. The SIL9011 is accessible on the local I2c bits at two-device address.
The logic state of the CI2CA pin is latched on the rising edge of REST# providing a choice of
two pairs of device address.
Control of local I2c address with CI2CA pin
MM1942 Application
The MM1942 IC is a 5-input 2-output AV switch controlled by the I2C BUS developed for use in
television.

File No. SG-0184

BLOCK DIAGRAM
1. I2c Bus
I2C BUS is interring bus system controlled by 2 lines (SDA, SCL). Data are transmitted and
received in the units of byte and Acknowledge. It is transmitted by MSB first from the Start
conditions.
The data format is set as shown in the following figure.
In the L32 TV MM1492 slave address, ADR terminal is L, and 90H is selected.
The following figure indicates the control contents of control registers and switches.

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2. Switch control table
a. Video output 1
b. Audio output 1
c. Audio gain

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TDA8946 Application
In L32 TV the TDA8946AJ is a dual-channel audio power amplifier with DC gain control. It has an
output power of 2 　10
 W at an 8 　load
 and a 12 V supply.
Block diagram
1. Input configuration
The TDA8946AJ inputs can be driven symmetrical (floating) as well as asymmetrical. In the
asymmetrical mode one input pin is connected via a capacitor to the signal source and the
other input is connected to the signal ground. The signal ground should be as close as possible
to the SVR (electrolytic) capacitor ground. Note that the DC level of the input pins is half of the
supply voltage VCC, so coupling capacitors for both pins are necessary.

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2. Output power measurement
The output power as a function of the supply voltage is measured on the output pins at THD =
10%,in the L32 LCD TV Vcc=12V so we can see as shown in the following figure output about
7W.

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3. Mode selection
In the L32 LCD TV TDA8946AJ has two functional modes, which can be selected by applying
the proper DC voltage to pin MODE.
a. Mute — In this mode the amplifier is DC-biased but not operational (no audio output).
This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in
mute mode when 3.5 V < VMODE < (VCC 1.5 V).
b. Operating — In this mode the amplifier is operating normally. The operating mode is
activated at VMODE<1.0V.

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Chapter 9 Waveforms
Main Board
1. Voltage Measurement
(1) 12V (DV120B, U6-1)
(2) 9V (AV_V90, U6-3)

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(3) 5V (DV50A, CB15)
(4) 3.3V (DV33A, U5-3)

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(5) 2.5V (DV25, CE42)
(6) 1.8V (DV18A, U5-2)

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2. Clock Timing
(1) MT8205 Clock (Ch1 U9-A15, XTALI / Ch2 U9-B15, XTALO)
(2) Memory Clock (Ch1 U11-45, D_CLK / Ch2 U12-45, D_CLK)

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(3) Sil 9011 Clock (Ch1 U16-85, XTLI / Ch2 U16-84, XTLO)

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3. H-sync & V-sync Timing
(1) PC Mode (1024 x 768 60Hz)
Ch1 H-sync (FB46) / Ch2 V-sync (FB45)

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ATSC Board
1. Voltage Measurement
(1) 12V (+12V, C4)
(2) 5V (+5V, C239)

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(3) 3.3V (DV33, C11)
(4) 2.5V (DV25, C185)

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(5) 1.8V (DV18, C64)
(6) 1.25V (+1V25_DDR, C148)

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(7) 1.2V (DV12, C26)

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2. Clock Timing
(1) MT5351 Clock Timing (U10 B2-OXTALI)
(2) MT5111 Clock Timing (U9 97-XTAL1 / 96-XTAL2) Ch1 – XTAL1 / Ch2 – XTAL2

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(3) Memory Clock Timing (U13-45, MEM_CLKA)
(4) Memory Clock Timing (U12-45, MEM_CLKA)

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Chapter 10 Trouble shooting
MONITOR DISPLAY NOTHING (PC MODE)
Start
N0 1. Is Power board output

LED is lighted +5V?
2. Is J1 connector good?
3. Is DC-DC OK?
4. Is U4 (3.3V) working ok?
Ye
It is in power saving
1. Check video cable
N0
2. Is the timing supported?
LED is lighting? 3. Check sync input
4. Check VGASOG rout if
analog (SOG)
Ye
N0
It means data to LVDS
U9 no data out? 1.Is J6 connecting well?
2.Check J1 +5V&+12V
3.Is panel ok?
Ye
Ye
N0 1.Is U9 working good?
U9 no data in? 2.Is U11&U12 working good?
3.IS U10 working good?
1. Check P3 D-sub Input

correct
END

File No. SG-0184

(TV, COMPOSITE VIDEO1, 2, 3, S-VIDEO) IS NOT DISPLAY CORRECTLY
Start
N0
Input signal 1.Check video
2.Check DVD player
Ye
N0
1.Check P2 signal
2.Check signal between P2
U20 input and U20 (IF AV1/AV2
mode)
3.Check Tuner &U20 (IF TV
Ye mode)
N0
1.Check signal between U20
U20 output and U9
Ye
N0
1.Check signal between U20
LVDS output and U9
2.Check U9 clock (27MHz)
3.Check U9 power
Ye
1.Chcak J6 Connect is
good?
2.Is panel working ok?
END

File No. SG-0184

(COMPONENT1, 2) IS NOT DISPLAY CORRECTLY
Start
N0
1.Check video
Input signal 2.Check host’s setting
Ye
N0
1.Check signal between

U21 input
P8&U21
Ye
N0
U9 input 1.Check signal between
U21&U9
2.Check U9 Clock (27MHZ)
Ye
N0
1.Check U9
LVDS output 2.Check U9 power
3.3V 1.8V
Ye
1.Is J6 connected
good?
END

File No. SG-0184

(HDMI) IS NOT DISPLAY CORRECTLY
Start
N0
1.Check video
Input signal 2.Check host’s setting
Ye
N0
1.Check p1 connect
U16 input 2.Check signal
between P1 and U16
Ye
N0
1.Check U16 power
U16 no data 2.Check between
signal U16 and U9
Ye
1.Is J6 connected good?

2.Is panel working ok?
END

File No. SG-0184

TROUBLE OF DC-DC CONVERTER
Start
The voltage is about + 5V

N0 1.Check power board
J1 PIN 9,10,11 2.Check power cable
connection J1
N0 The voltage is about + 12V

Ye while power switch on
J1 PIN 2,3,4,5 1.J1 connection good
2.Check U9 GPIO Pin
3.Check power board
N0 The voltage is about +5V

Ye
while power switch on
U7 pin 5 6 7 8
1.J1 connection good
2. Check U9 GPIO Pin
N0 The voltage is about +3.3V

Ye
1.J1 to connection good?
U4 pin2
2.Check U4
Ye
N0
The voltage is about +9V
U6 pin 3 1.Check U9 GPIO Pin
2.Check U6
Ye N0
The voltage is about +2.5V
U14 pin2 1.Check U9 GPIO Pin
2.Check U14
Ye
N0
U5 pin2 1.Check J1 Connect
2.Check U5&L5

U13 pin2 1.Check J1 Connect
2.Check U13
END

File No. SG-0184

TROUBLE OF DDC READING
Start
N0 Support DDC1/2B
1.Analog cable ok?
2.Check signal (U18 to P3)
Analog DDC
3.Check U18 Voltage
4.Is compliant protocol?
Ye
N0 Support DDC1/2B
1.Analog cable ok?
2.Check signal (U17 to P1)
HDMIDDC
3.Check U17 Voltage
4.Is compliant protocol?
Ye
END

File No. SG-0184


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3. On Screen Display 3-1

4. Factory Preset Timings 4-1

5. Pin Assignment 5-1

6. BLOCK DIAGRAM 6-1

7. Main Board I/O Connections 7-1

8. Theory of Circuit Operation 8-1

10. Trouble Shooting 10-1

11.Spare Parts List 11-1

12. Complete Parts List 12-1

2. Main Board PCB Layout

VIZIO P42HDTV10A Service Manual

Downloaded from www.Manualslib.com manuals search engine

COPYRIGHT © 2000 V, INC. ALL RIGHTS RESERVED.

VINC. and VINC. products are registered trademarks of V, Inc.

Energy Star is a registered trademark of the US Environmental Protection Agency (EPA).

VIZIO P42HDTV10A Service Manual

Downloaded from www.Manualslib.com manuals search engine

y 1024 x 768 pixel resolution with 16:9 wide screen

y ATSC (Off-air)/QAM (Cable)/NTSC (Antenna/Cable)

y All TV formats supported (480i, 480p, 720p & 1080i)

y PC compatible (RGB) up to 1280 x 1024 WXGA

y High definition digital interface - HDMI

y Multiple-screen display (picture-on-picture/picture-in-picture)

y Selectable picture mode

y Supporting DVI converted to HDMI

y Gloss front bezel

CONFIDENTIAL – DO NOT COPY Page 1-1

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Native Resolution 1024 (H)X768 (V) pixels,

Effective Display Size 921.6 (H) x 519.2 (V) mm

Aspect Ratio 16:9

Color 1,024 (R) x 1,024 (G) x 1,024 (B) colors

Brightness 1200 cd/m2 ( typical, panel spec)

(w/glass filter) Min. 300 cd/ m2

Contrast Ratio 10,000:1 (Typical, panel spec).

TV system NTSC/ATSC/ QAM

PC Inputs 15pins D-sub, HDMI-DVI

Video Inputs 1 x S-Video

3 x AV inputs (CVBS; RCA type)

2 x Component (Y Pb/Pr Cb/Cr)

Audio Inputs 6 x Stereo RCA (R/L), 1 x PC Mini-Jack

Audio Outputs Analog - 1 x stereo RCA (R/L)

Digital – 1 x SPDIF Optical

Power Input 100 to 240 Vac

Power Consumption 380W Max

Preset Modes Primary 1024 x 768 @ 60Hz.

CONFIDENTIAL – DO NOT COPY Page 2-1

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Item Specification Remarks

Display Pixels 1,024 (H) x 768 (V) pixels

Display Cells 3,072 (H) x 768 (V) cells

Pixel Pitch 0.9 (H) x0.676 (V) mm

Pixel Type Non-stripe

Color Depth 1,024 (R) x 1,024 (G) x 1,024 (B) colors

Active Display Area 921.6 (H) x 519.2 (V) ±0.5 mm

Brightness Min. 300 cd/ m2

Color coordinates 9300K: x=0.283±0.02, y=0.297±0.02 RGB

7 1024x768 60 48.4 60.01 N N 65.000 Windows

Remark: P: positive, N: negative 1024x768 @60 Hz: Primary