Internal Use Only

Website:http://biz.LGservice.com
E-mail:http://www.LGEservice.com/techsup.html

COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM92C
MODEL: W1643C(W1643C-**V)
( ) **Same model for Service

CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
 CONTENTS
SPECIFICATIONS ................................................... 2 ADJUSTMENT ...................................................... 13
PRECAUTIONS ....................................................... 4 TROUBLESHOOTING GUIDE .............................. 15
TIMING CHART ....................................................... 8 WIRING DIAGRAM ............................................... 19
DISASSEMBLY ....................................................... 9 EXPLODED VIEW...................................................20
BLOCK DIAGRAM ................................................. 10 REPLACEMENT PARTS LIST ...............................22
DESCRIPTION OF BLOCK DIAGRAM...................12 SCHEMATIC DIAGRAM ......................................... 26

SPECIFICATIONS
1. LCD CHARACTERISTICS 4. MAX. RESOLUTION
Type : TFT Color LCD Module Analog : 1360 x 768@60Hz
Active Display Area : 15.6 inch diagonal
Pixel Pitch : 0.252 (H) x 0.252 (V)
Size : 363.8(H) x 215.9(V) x 12.0(D) 5. POWER SUPPLY
Color Depth : 16.7M(8bit + FRC) colors 5-1. Power Adaptor(Built-in Power)
Electrical Interface : LVDS Input : 12V = 2,0A
Surface Treatment : Anti-Glare, Hard Coating(3H)
Operating Mode : Transmissive mode,Normally White 5-2. Power Consumption
Backlight Unit : 2 CCFL
MODE H/V SYNC VIDEO POWER CONSUMPTION LED COLOR
2. OPTICAL CHARACTERISTICS less than 24 W(max)
2-1. Viewing Angle by Contrast Ratio ≥ 10 POWER ON (NORMAL) ON/ON ACTIVE RED
less than 21 W(typ)

Left : -45°(Typ) Right : +45°(Typ) STAND BY OFF/ON OFF less than 1 W FLCKER
Top : +15°(Typ) Bottom : +35°(Typ) SUSPEND ON/OFF OFF less than 1 W FLCKER
DPMS OFF OFF/OFF OFF less than 1 W FLCKER
2-2. Luminance : 100(Typ) (Typ. 30)-SRGB
: 120(min), 200(Typ)-6500K POWER S/W OFF - - less than 1 W OFF
: 90(min)-9300K

2-3. Contrast Ratio : 8000(min) 6. ENVIRONMENT

DFC -> 30000 : 1(Typ)
6-1. Operating Temperature : 10°C~35°C (50°F~95°F)
3. SIGNAL (Refer to the Timing Chart) 6-2. Relative Humidity : 10%~80% (Non-condensing)
3-1. Sync Signal 6-3. MTBF : 50,000 HRS with 90%
• Type : Separate Sync, SOG, Digital Confidence level
Lamp Life : 40,000 Hours (Min)
3-2. Video Input Signal
1) Type : R, G, B Analog 7. DIMENSIONS (with TILT/SWIVEL)
2) Voltage Level : 0~0.71 V
a) Color 0, 0 : 0 Vp-p Width : 385.4 mm (15.17'')
b) Color 7, 0 : 0.467 Vp-p Depth : 183.0 mm (7.20'')
c) Color 15, 0 : 0.714 Vp-p Height : 320.3 mm (12.61'')
3) Input Impedance : 75 Ω
8. WEIGHT (with TILT/SWIVEL)
3-3. Operating Frequency
Horizontal : 30 ~ 50kHz Net. Weight : 1.7 kg (3.97 lbs)
Vertical : 57 ~ 63Hz Gross Weight : 3.02 kg (6.71 lbs)

Copyright 2007 LG Electronics. Inc. All right reserved.

-2- LGE Internal Use Only
Only for training and service purposes
 PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT. WARNING
• There are some special components used in LCD BE CAREFUL ELECTRIC SHOCK !
monitor that are important for safety. These parts are
• If you want to replace with the new backlight (CCFL) or
marked on the schematic diagram and the
inverter circuit, must disconnect the AC adapter
replacement parts list. It is essential that these critical
because high voltage appears at inverter circuit about
parts should be replaced with the manufacturer’s
650Vrms.
specified parts to prevent electric shock, fire or other
hazard.
• Handle with care wires or connectors of the inverter
• Do not modify original design without obtaining written circuit. If the wires are pressed cause short and may
permission from manufacturer or you will void the burn or take fire.
original parts and labor guarantee.
Leakage Current Hot Check Circuit

AC Volt-meter
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners. Good Earth Ground
such as WATER PIPE,
• Do not press on the panel, edge of the frame strongly CONDUIT etc.
To Instrument's
or electric shock as this will result in damage to the exposed
screen. METALLIC PARTS

• Do not scratch or press on the panel with any sharp

objects, such as pencil or pen as this may result in 1.5 Kohm/10W
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)

CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

Copyright 2007 LG Electronics. Inc. All right reserved.

-3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this 9. Use with this receiver only the test fixtures specified in
service manual and its supplements and addenda, read this service manual.
and follow the SAFETY PRECAUTIONS on page 3 of this CAUTION: Do not connect the test fixture ground strap
publication. to any heat sink in this receiver.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the Electrostatically Sensitive (ES) Devices
safety precautions on page 3 of this publication, always Some semiconductor (solid-state) devices can be
follow the safety precautions. Remember: Safety First. damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
General Servicing Precautions Devices. Examples of typical ES devices are integrated
1. Always unplug the receiver AC power cord from the AC circuits and some field-effect transistors and
power source before; semiconductor "chip" components. The following
a. Removing or reinstalling any component, circuit techniques should be used to help reduce the incidence of
board module or any other receiver assembly. component damage caused by static by static electricity.
b. Disconnecting or reconnecting any receiver electrical 1. Immediately before handling any semiconductor
plug or other electrical connection. component or semiconductor-equipped assembly, drain
c. Connecting a test substitute in parallel with an off any electrostatic charge on your body by touching a
electrolytic capacitor in the receiver. known earth ground. Alternatively, obtain and wear a
CAUTION: A wrong part substitution or incorrect commercially available discharging wrist strap device,
polarity installation of electrolytic capacitors may which should be removed to prevent potential shock
result in an explosion hazard. reasons prior to applying power to the unit under test.
d. Discharging the picture tube anode. 2. After removing an electrical assembly equipped with
2. Test high voltage only by measuring it with an ES devices, place the assembly on a conductive
appropriate high voltage meter or other voltage surface such as aluminum foil, to prevent electrostatic
measuring device (DVM, FETVOM, etc) equipped with charge buildup or exposure of the assembly.
a suitable high voltage probe. 3. Use only a grounded-tip soldering iron to solder or
Do not test high voltage by "drawing an arc". unsolder ES devices.
3. Discharge the picture tube anode only by (a) first 4. Use only an anti-static type solder removal device.
connecting one end of an insulated clip lead to the Some solder removal devices not classified as "anti-
degaussing or kine aquadag grounding system shield static" can generate electrical charges sufficient to
at the point where the picture tube socket ground lead damage ES devices.
is connected, and then (b) touch the other end of the 5. Do not use freon-propelled chemicals. These can
insulated clip lead to the picture tube anode button, generate electrical charges sufficient to damage ES
using an insulating handle to avoid personal contact devices.
with high voltage. 6. Do not remove a replacement ES device from its
4. Do not spray chemicals on or near this receiver or any protective package until immediately before you are
of its assemblies. ready to install it. (Most replacement ES devices are
5. Unless specified otherwise in this service manual, packaged with leads electrically shorted together by
clean electrical contacts only by applying the following conductive foam, aluminum foil or comparable
mixture to the contacts with a pipe cleaner, cotton- conductive material).
tipped stick or comparable non-abrasive applicator; 7. Immediately before removing the protective material
10% (by volume) Acetone and 90% (by volume) from the leads of a replacement ES device, touch the
isopropyl alcohol (90%-99% strength) protective material to the chassis or circuit assembly
CAUTION: This is a flammable mixture. into which the device will be installed.
Unless specified otherwise in this service manual, CAUTION: Be sure no power is applied to the chassis
lubrication of contacts in not required. or circuit, and observe all other safety precautions.
6. Do not defeat any plug/socket B+ voltage interlocks 8. Minimize bodily motions when handling unpackaged
with which receivers covered by this service manual replacement ES devices. (Otherwise harmless motion
might be equipped. such as the brushing together of your clothes fabric or
7. Do not apply AC power to this instrument and/or any of the lifting of your foot from a carpeted floor can
its electrical assemblies unless all solid-state device generate static electricity sufficient to damage an ES
heat sinks are correctly installed. device.)
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.

Copyright 2007 LG Electronics. Inc. All right reserved.

-4- LGE Internal Use Only
Only for training and service purposes
General Soldering Guidelines Replacement
1. Use a grounded-tip, low-wattage soldering iron and 1. Carefully insert the replacement IC in the circuit board.
appropriate tip size and shape that will maintain tip 2. Carefully bend each IC lead against the circuit foil pad
temperature within the range or 500 F to 600 F. and solder it.
2. Use an appropriate gauge of RMA resin-core solder 3. Clean the soldered areas with a small wire-bristle
composed of 60 parts tin/40 parts lead. brush. (It is not necessary to reapply acrylic coating to
3. Keep the soldering iron tip clean and well tinned. the areas).
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a "Small-Signal" Discrete Transistor
metal handle. Removal/Replacement
Do not use freon-propelled spray-on cleaners. 1. Remove the defective transistor by clipping its leads as
5. Use the following unsoldering technique close as possible to the component body.
a. Allow the soldering iron tip to reach normal 2. Bend into a "U" shape the end of each of three leads
temperature. remaining on the circuit board.
(500 F to 600 F) 3. Bend into a "U" shape the replacement transistor leads.
b. Heat the component lead until the solder melts. 4. Connect the replacement transistor leads to the
c. Quickly draw the melted solder with an anti-static, corresponding leads extending from the circuit board
suction-type solder removal device or with solder and crimp the "U" with long nose pliers to insure metal
braid. to metal contact then solder each connection.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil. Power Output, Transistor Device
6. Use the following soldering technique. Removal/Replacement
a. Allow the soldering iron tip to reach a normal 1. Heat and remove all solder from around the transistor
temperature (500 F to 600 F) leads.
b. First, hold the soldering iron tip and solder the strand 2. Remove the heat sink mounting screw (if so equipped).
against the component lead until the solder melts. 3. Carefully remove the transistor from the heat sink of the
circuit board.
c. Quickly move the soldering iron tip to the junction of 4. Insert new transistor in the circuit board.
the component lead and the printed circuit foil, and 5. Solder each transistor lead, and clip off excess lead.
hold it there only until the solder flows onto and 6. Replace heat sink.
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the Diode Removal/Replacement
circuit board printed foil. 1. Remove defective diode by clipping its leads as close
d. Closely inspect the solder area and remove any as possible to diode body.
excess or splashed solder with a small wire-bristle 2. Bend the two remaining leads perpendicular y to the
brush. circuit board.
3. Observing diode polarity, wrap each lead of the new
IC Remove/Replacement diode around the corresponding lead on the circuit
Some chassis circuit boards have slotted holes (oblong) board.
through which the IC leads are inserted and then bent flat 4. Securely crimp each connection and solder it.
against the circuit foil. When holes are the slotted type, 5. Inspect (on the circuit board copper side) the solder
the following technique should be used to remove and joints of the two "original" leads. If they are not shiny,
replace the IC. When working with boards using the reheat them and if necessary, apply additional solder.
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above. Fuse and Conventional Resistor
Removal/Replacement
Removal 1. Clip each fuse or resistor lead at top of the circuit board
1. Desolder and straighten each IC lead in one operation hollow stake.
by gently prying up on the lead with the soldering iron 2. Securely crimp the leads of replacement component
tip as the solder melts. around notch at stake top.
2. Draw away the melted solder with an anti-static 3. Solder the connections.
suction-type solder removal device (or with solder CAUTION: Maintain original spacing between the
braid) before removing the IC. replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.

Copyright 2007 LG Electronics. Inc. All right reserved.

-5- LGE Internal Use Only
Only for training and service purposes
Circuit Board Foil Repair At Other Connections
Excessive heat applied to the copper foil of any printed Use the following technique to repair the defective copper
circuit board will weaken the adhesive that bonds the foil pattern at connections other than IC Pins. This technique
to the circuit board causing the foil to separate from or involves the installation of a jumper wire on the
"lift-off" the board. The following guidelines and component side of the circuit board.
procedures should be followed whenever this condition is 1. Remove the defective copper pattern with a sharp
encountered. knife.
Remove at least 1/4 inch of copper, to ensure that a
At IC Connections hazardous condition will not exist if the jumper wire
To repair a defective copper pattern at IC connections use opens.
the following procedure to install a jumper wire on the 2. Trace along the copper pattern from both sides of the
copper pattern side of the circuit board. (Use this pattern break and locate the nearest component that is
technique only on IC connections). directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
1. Carefully remove the damaged copper pattern with a of the nearest component on one side of the pattern
sharp knife. (Remove only as much copper as break to the lead of the nearest component on the
absolutely necessary). other side.
2. carefully scratch away the solder resist and acrylic Carefully crimp and solder the connections.
coating (if used) from the end of the remaining copper CAUTION: Be sure the insulated jumper wire is
pattern. dressed so the it does not touch components or sharp
3. Bend a small "U" in one end of a small gauge jumper edges.
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.

Copyright 2007 LG Electronics. Inc. All right reserved.

-6- LGE Internal Use Only
Only for training and service purposes
 TIMING CHART

VIDEO A
E
D B
SYNC
C

DOT Front Back Resol-

mode section polarity CLOCK Frequency Total Display Porch Sync
. Porch ution
[MHz] [kHz]/[Hz] Period(E) (A) (D) (C) (B)

H(Pixels) - 31.469 800 640 16 96 48 640x480

1 25.175
V(Lines) - 59.94 525 480 10 2 33
H(Pixels) + 37.879 1056 800 40 128 88 800x600
2 40.0
V(Lines) + 60.317 628 600 1 4 23
H(Pixels) - 48.363 1344 1024 24 136 160 1024x768
3 65.0
V(Lines) - 60.0 806 768 3 6 29
H(Pixels) + 47.712 1792 1360 64 112 256 1360x768
4 85.5
V(Lines) + 60.015 795 768 3 6 18

Copyright 2007 LG Electronics. Inc. All right reserved.

-7- LGE Internal Use Only
Only for training and service purposes
 DISASSEMBLY-Set

#1 #2

Change your lock on the product as it follows and turn

it in the arrow direction. (#1~2)

#3 #4

1. Pull the front cover upward. Disassemble back cover.

2. Then, let the all latches are separated.
3. Put the front face down.

Copyright 2007 LG Electronics. Inc. All right reserved. -8-

LGE Internal Use Only
Only for training and service purposes
 BLOCK DIAGRAM

Copyright 2007 LG Electronics. Inc. All right reserved.

-9- LGE Internal Use Only
Only for training and service purposes
 DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 86MHz in W1643C case.
This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1360 X
768 resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.
This part consists of the one 5V, and one 3.3V regulators to convert power which is provided 5V in Adapter.
18V is provided for inverter, 5V is provided for LCD panel and micom in W1643C case .
Also, 5V is converted 3.3V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC18V to AC 700Vrms and operates back-light lamps of module in W1643C case.

3. MICOM Part.
This part is include video controller part. And this part consists of Flash memory IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in Flash memory.

Copyright 2007 LG Electronics. Inc. All right reserved.

- 10 - LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT
Windows EDID V1.0 User Manual 2. EDID Read & Write
1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP
Port Setup: Windows 98 => Doesn’t need setup
Windows 2000, XP => Need to Port Setup.
This program is available for LCD Monitor only.

1. Port Setup
a) Copy “UserPort.sys” file to
“c:\WINNT\system32\drivers” folder
b) Run Userport.exe

2) Edit Week of Manufacture, Year of Manufacture,

Serial Number
a) Input User Info Data
b) Click “Update” button
c) Click “ Write” button

c) Remove all default number

d) Add 300-3FF

e) Click Start button.

f) Click Exit button.

Copyright 2007 LG Electronics. Inc. All right reserved.

- 11 - LGE Internal Use Only
Only for training and service purposes
 SERVICE OSD
1) Turn off the power switch at the right side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch for 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) CLEAR ETI : To initialize using time.

c) Auto Color : W/B balance and Automatically sets the gain and offset value.
(press key for over 3 sec)
d) AGING : Select Aging mode(on/off).
b) Module : To select applied module.
d) NVRAM INIT : EEPROM initialize.(24C16, press key for over 3 sec)
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)

IBM 9 6
Video Signal 5 1
Compatible PC 15 11
Generator 10 6
5 1
C
PARALLEL PORT
d

13
se

1
tu

2C

25
No

14
23
RS

OFF ON
5V
EL
Control Line

F
LL

C
RA
PA

Power inlet (required) 5V

220
4.7K
Power Select Switch 4.7K
R

VG ON
WE

S 5V
(110V/220V)
PO

E 74LS06
A
T

MO Power LED
CS

NI OFF 4.7K
YN

TO
V-S

R
74LS06

E ST Switch
B
B
F V-Sync On/Off Switch
(Switch must be ON.)

Figure 1. Cable Connection

Copyright 2007 LG Electronics. Inc. All right reserved.

- 12 - LGE Internal Use Only
Only for training and service purposes
 TROUBLESHOOTING GUIDE
1. NO POWER

NO POWER
(POWER INDICATOR OFF)

CHECK ADAPTER,
CHECK J300 VOLTAGE NO AND FIND OUT A SHORT
1
PIN3 (12V)? POINT AS OPENING
EACH POWER LINE

YES

2 NO
IS IC304 PIN3(5V) CHECK IC304(5V) LINE
3
1

YES

CHECK IC304 PIN2 NO

4
1 CHECK IC304(3.3V) LINE
(3.3V)

YES

NO
CHECK U201 PIN63,64 CHECK CRYSTAL(X501)
PULSE

YES

CHECK U201

Waveforms
1 J300-#3 2 IC304-#3 3 IC304-#3 4 IC304-#2

Copyright 2007 LG Electronics. Inc. All right reserved.

- 13 - LGE Internal Use Only
Only for training and service purposes
 2. NO RASTER (OSD IS NOT DISPLAYED) – ADAPTER

NO RASTER
(OSD IS NOT DISPLAYED)

NO CHECK ADAPTER,
CHECK J300 AND FIND OUT A SHORT
1 VOLTAGE PIN3 POINT AS OPENING
(12V)? EACH POWER LINE
YES

NO
2 CHECK IC304 PIN3(5V)? CHECK IC304(5V) LINE

YES

NO
3 CHECK Q501 PINC(3.8V)? CHECK U201 PIN 56

YES

1. CONFIRM BRIGHTNESS
CHECK U201 NO
OSD CONTRL STATUS
4
PIN29 WAVE FORM 2. CHECK MICOM DIM-ADJ
PORT

YES

CHECK
PULSE AS
CONTACTING PROBE NO
5 TO THE LAMP ADAPTER
WIRE OF THE
5 LAMP CURRENT
LCD MODULE

YES

REPLACE LCD MODULE

Waveforms

1 J300-#3 2 IC304-#3 3 Q501-#C 4 U201-#29

Copyright 2007 LG Electronics. Inc. All right reserved.

- 14 - LGE Internal Use Only
Only for training and service purposes
 3. NO RASTER (OSD IS NOT DISPLAYED) - MAIN

NO RASTER
(OSD IS NOT DISPLAYED)

NO
CHECK IC304
CHECK IC304 PIN2(3.3V)
PIN2(3.3V)

YES

NO 1. CHECK PIN 63,64

U201
SOLDERING CONDITION
1 PIN 63,64
2. CHECK X501
14.3MHZ?
3. TROUBLE IN U201

YES

CHECK U201
PIN14(H-SYNC) AND NO
CHECK CONNECTION LINE
PIN15(V-SYNC).
FROM D-SUB TO U201
IS PULSE APPEARED AT
SIGNAL PINS?

YES

TROUBLE IN CABLE
OR LCD MODULE

Waveforms
1 U201-#63

Copyright 2007 LG Electronics. Inc. All right reserved.

- 15 - LGE Internal Use Only
Only for training and service purposes
 4. TROUBLE IN DPM

TROUBLE IN DPM

CHECK R730 AND NO CHECK PC

R731, SYNC PC IS GOING
APPEARED? INTO DPM MODE

YES

1 CHECK NO
U201 PIN14,15 CHECK H/V SYNC LINE
2 SYNC PULSE

YES

TROUBLE IN U201

Waveforms
1 H-SYNC 2 V-SYNC

Copyright 2007 LG Electronics. Inc. All right reserved.

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 WIRING DIAGRAM

30P

EAD57734001

6P

ADAPTER MAIN BORAD

6631P00011L

Copyright 2007 LG Electronics. Inc. All right reserved.

- 17 - LGE Internal Use Only
Only for training and service purposes
 400
200
300

410
450

- 18 -
910
EXPLODED VIEW

320 310 330

440

920
 APRIL. 2009
P/NO : MFL61926845 Printed in China