Detection & Prevention of Solder Joint Failure - Rush PCB

09/02/22, 11:01 Detection & Prevention of Solder Joint Failure - Rush PCB
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DETECTIO N & P REVE N TIO N O F S O LDER J O I N T FAILU RE

DET ECT IO N & PR EVE NT ION OF S OL D ER J OI NT F A IL UR E
DETECTION & PREVENTION OF SOLDER JOINT

FAILURE
Electronic systems use solder joints in multiple locations including connectors, components, and
mechanical support points interconnecting printed circuit boards (PCBs). Rush PCB identifies system-level
reliability as the dominant failure mode and isolates the critical location on the PCB as the most
susceptible to failure. Accordingly, we list failure mechanisms in solder joints as occurring due to:
Mechanical Loading—Overstress and Mechanical Fatigue

Electrical Loading—Void formation in solder and Stress due to Current Flow
Chemical Loading—Corrosion and Electro-Chemical Migration
Thermal Loading—Overheating and Thermal Fatigue
FREQUENT CAUSE OF SOLDER JOINT FAILURE

According to Rush PCB, the most frequent cause of solder joint failure is thermo-mechanical fatigue, where
mechanical loading along with thermal cycling leads to a synergetic damage process causing joint failure.
The damage process may cause thermally induced mechanical strains in the joint or the solder alloy may
undergo microstructural changes.
The industry uses different solder alloys, including Leaded and Lead-free ones, and these alloys have
different microstructures responding in various ways to thermal loading. For instance, the industry’s most
popular alloy group for board level reflow applications is the SnAgCu alloy, where the presence of Ag
content in the alloy benefits shock/vibration durability and thermal cycling performance.
LOW SILVER AND LOW-MELT LEAD-FREE ALLOYS

The industry also uses low Silver and low-melt Lead-free alloys. These are cheaper than SnAgCu alloys,
and the low Silver presence allows the joint to be more robust to drops. Manufacturers often tailor such
alloys by doping with Nickel and Bismuth to improve thermal cycling and drop reliability.
https://rushpcb.com/detection-prevention-of-solder-joint-failure/ 1/4
WHY GOOD SOLDER JOINTS FAIL

In general, the soft solder alloys that the electronic industry uses are rather weak, especially as joints
operate at high temperatures relative to their melting point. However, the situation is more complicated,
as information of shear and tensile strengths of solder alloys is not appropriate under real situations since
creep and fatigue will influence the performance of the solder joint under actual loading conditions.
Moreover, the presence of material defects also acts as a stress-raiser. That means, the printed circuit
board with a normal solder joint cannot withstand a permanent mechanical load.
Solder alloys are sensitive to cyclic stress, while their capacity for load-carrying is low. This implies solder
joints in the electronics industry have a finite life, leading to a finite life of the electronic equipment. Rush
PCB recommends ensuring soldered joints have an appropriate lifetime for the application.
CORROSION: A MAIN CAUSE OF JOINT FAILURE

Although joints with proper soldering are adequately reliable for must purposes, the PCB may have several
joints as potential failure sources due to inadequate design or doubtful processing. According to Rush PCB,
there are three main causes for solder joints to fail:
Fracture—tensile rupture from overloading

Creep—long-lasting and permanent loading
Fatigue—from cyclic loading
For most occasions, the above mechanisms work simultaneously, and there could be other causes as well,
such as corrosion.
JOINT FRACTURE FROM SHORT-TERM LOADING

Harsh treatment of PCBs or accidents often cause overloading leading to cracks developing in solder joints.
For instance, when mounting a soldered assembly in position in its enclosure, the operator may use too
much force, or when a user drops their mobile phone. In such cases, the shear stress on the solder joint
exceeds its limit, resulting in a fracture of the joint.
JOINT FRACTURE FROM CREEP
Operating temperatures of the PCB higher than room temperature often cause creep, leading to solder
joint fractures. For instance, a PCB after assembly and reflow soldering may have a rather large
permanent warp, but its joints are relatively stress-free. When an operator mounts the PCB inside an
enclosure and forces it to remain flat, the joints are subject to very large forces, eventually leading to
cracks.
JOINT FRACTURE FROM FATIGUE

Temperature excursions accompanied by CTE mismatch is a major cause of joint fracture from fatigue.
With typical cycle times measured in hours, the movements may be slow, but the deformation of the
solder in the joint is rather large. Initial good joints may also succumb to this type of deformation and
eventually crack.
Read About: MANUFACTURING PCBS FOR INDUSTRIAL BUSINESSES
DEFECTIVE SOLDER JOINTS

Solder joints may also be defective due to inadequate process care. These may appear as:
Disturbed joints
Cold Joints
Overheated Joints
Joints with Insufficient Wetting
Solder Starved Joints
Solder Bridges
Lifted Pads
Stray Solder Splatters
Disturbed joints are those subjected to movement as the solder was solidifying. The surface of the solder
may appear to be rough, crystalline, or frosted. If one of the two surfaces was cold during soldering, the
joint will not form and the result will be a cold and unreliable joint characterized by a lumpy and rough
surface. Temperature plays a crucial part during soldering, and if the temperature is very high, the flux
may vaporize before the solder has properly spread.
Read About: WHAT IS VAPOR PHASE REFLOW SOLDERING?
WHAT CAUSES OLDER WICKING DOWN

Inadequate amount of solder present during soldering may not spread all over the surfaces totally,
resulting in joints with insufficient wetting. Presence of an untented via or a through-hole very close to pad
may result in solder wicking down the via and leaving very little for covering the pad, resulting in a solder
starved joint. Excess solder present during soldering may result in solder bridges shorting neighboring
pads. Other process related solder problems may cause lifted pads and stray solder splatters.
PREVENTION
As solder melts within a narrow specific temperature range, it is important to maintain this temperature in
the oven for proper soldering. Cleaning the board and pre-heating it before the actual soldering helps to
keep all surfaces at the right temperature for soldering.
Additionally, Adequate amount of solder deposit requires the use of a proper stencil. This ensures the pad
has just the amount of solder it requires for complete wetting, but not enough to flow over to the next pad
to cause a solder bridge.
Rush PCB has more than two decades of experience and expertise in manufacturing PCBs and assembling
them. With sophisticated machinery at our disposal, we handle all types of PCBs with complete satisfaction
of our customers. So, you can contact us for further queries.

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09/02/22, 11:01 Detection & Prevention of Solder Joint Failure - Rush PCB

DETECTIO N & P REVE N TIO N O F S O LDER J O I N T FAILU RE

DETECTION & PREVENTION OF SOLDER JOINT

Mechanical Loading—Overstress and Mechanical Fatigue

FREQUENT CAUSE OF SOLDER JOINT FAILURE

LOW SILVER AND LOW-MELT LEAD-FREE ALLOYS

WHY GOOD SOLDER JOINTS FAIL

CORROSION: A MAIN CAUSE OF JOINT FAILURE

Fracture—tensile rupture from overloading

JOINT FRACTURE FROM SHORT-TERM LOADING

JOINT FRACTURE FROM CREEP

JOINT FRACTURE FROM FATIGUE

Read About: MANUFACTURING PCBS FOR INDUSTRIAL BUSINESSES

DEFECTIVE SOLDER JOINTS

Read About: WHAT IS VAPOR PHASE REFLOW SOLDERING?

WHAT CAUSES OLDER WICKING DOWN

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