ECEG-4281-MDC-Lec 01 Fundamentals of Microelectronics
ECEG-4281-MDC-Lec 01 Fundamentals of Microelectronics
ECEG-4281-MDC-Lec 01 Fundamentals of Microelectronics
Difference Engine I
25,000 Mechanical parts
Cost £17,470 (in 1834)!
ENIAC (1946)
18,000 tubes
25 meters long
3 meters high
Requires own
power plant
S G D S G D
SiO2 SiO2
n n n n n
p-substrate p-substrate
Why integrated?
Placing many components and electronic devices
on the same substrate. (millions and billions of
electrical components in a single simple chip)
Saves power consumption, Greater mobility,
minimizes size, possibility of batch fabrication,
reduced silicon area usage, lower price/cost,
reduced leakage, reduced noise ++++
Intel 4004
10 μm Si gate PMOS process
Clock speed:
0.108 MHz
Die size ~ 13.5 mm2
~ 2300 transistors
Intel 80286
1.5 μm Si gate NMOS
Process
Clock speed:
6 ~ 12 MHz
Die size ~ 68.7 mm2
~ 134,000 transistors
Pentium IV
0.18 μm Si gate CMOS
process
Clock speed:
1,400 ~ 1,500 MHz
Die size ~ 224 mm2
~ 42,000,000 transistors
Core i7 (Quad)
45 nm Si gate CMOS
process
Clock speed:
2.4 GHz
Die size ~ 263 mm²
~ 731,000,000 transistors
Reading assignment
Read about Energy bands, Carrier concentrations, and
carrier transport phenomenon on, “Semiconductor
devices physics and technology”, Chapter 1 and 2. S.
M. Sze and M. K. Lee