PCB Design Guidelines for EMI and

EMC
Electromagnetic interference (EMI) is associated with every electronic device
we use nowadays. If you turn on your radio set and TV simultaneously, you
will experience the noisy disturbance from TV interfering with the radio
signal and vice-versa. We can also experience this when we board a plane
and are asked to switch off the electronic devices by the crew. This is to
avoid interference of mobile and electronic device signals with the plane’s
navigational signals. As consumer electronics is on high demand, the effects
of EMI must be taken into consideration. It would be very irking if a person
walking down the sidewalk talking on their cell phone caused interference to
someone else’s audio device. It is not possible to get rid of EMI/EMC
completely, but we can surely curate our PCB design services to make them
less vulnerable to EMI/EMC effects.
An electronic system consists of printed circuit boards (PCBs), integrated
chips, interconnect, and I/O cables. At high frequencies depending on the
length of the interconnects and the current carried by the conductors, the
interconnects tend to act as antennas, resulting in EMI. These EMI radiations
interfere with other devices present in the vicinity. There are international
standards that limit the level of emissions. Thus, it is highly important to
measure electromagnetic radiation and control these radiations.
So, any product having wires/traces and operating at high -frequency has the
tendency to radiate radio waves. This is the reason why EMI/EMC study and
analysis is important. Does your product’s radiation disturb other devices
present nearby? Whether it is within the set standards? Are the relevant EMI
standards such as IPC CISPR standards achieved? In this article, we will
cover the PCB design guidelines using which EMI and EMC can be
controlled/avoided.
1. What are EMI and EMC in a PCB?
2. EMC compliant PCB design
3. What are the Sources of EMI?
4. Design guidelines for EMI and EMC reduction in a PCB
5. Testing EMI/EMC in a PCB design
6. What are the EMI/EMC Standards? (CISPR)
 7. Conclusion

What are EMI and EMC in a PCB?

Electromagnetic compatibility (EMC) is the ability of an electronic system to
operate within an electromagnetic environment satisfactorily without
generating intolerable EMI (electromagneti c interference) in nearby
devices/systems. EMC ensures that the system must perform as intended
under the defined safety measures.
EMI is an electromagnetic disturbance, where energy is transmitted through
radiation/conduction from one electronic device to another and corrupts the
signal quality causing malfunctioning. EMI focuses on the testing
requirements and interference between the neighbouring equipment. It can
occur in any frequency range, say anything more than DC. Typically, it
happens above 50MHz.
Whenever a device deviates from the defined standards, EMC/EMI dominates
the system performance. So, it is vital to control EMI during the initial phase
of the PCB design. Controlling EMI in later production stages can be risky in
cost terms. For EMC-friendly board designing, your primary concern should
be on component selection, circuit design, and PCB layout design. To be
market-ready, your product has to pass the prescribed EMI/EMC standards.

EMC compliant PCB design

Applying the best EMC practices to PCB design helps to achieve compliance
with EMC standards at a much lower rate than alternate EMC measures at a
higher integration level. When can you call a PCB design EMC
compliant? Well, EMC compatibility depends upon three perspectives:
1. It should not interfere with other systems.
2. It should not show sensitivity to emissions from other systems.
3. And, most importantly, it should not cause interference with itself.
What are the sources of EMI?

EMI constitutes both common and differential mode radiations.

There are two types of electromagnetic emission; conducted and radiated

emission. Conducted emission enters the system through power input lines
and cables. While, the radiated emission happens due to electromagnetic
waves from power and communication lines, switching devices, and
electrostatic discharges. It propagates through the air from electronic
devices and traces, to interfere with other electronic systems. Examples are
mobile and laptops interfering with aircraft electronics. Conducted
interference can be mitigated by introducing line filters connected close to
the power input or near the connectors. Another effective method for
reducing conducted interference is using a ferrite core/ferrite ring. Ferrite
core employs high-frequency current dissipation in a ferrite ceramic to build
high-frequency noise suppression devices.
 Conducted interference can be reduced us ing a ferrite core/ferrite ring.

Electromagnetic emissions may also occur from high -frequency traces.

Similarly, they can generate from power and ground planes, due to poor
decoupling practices. This also results in unintentional currents, such as
common-mode (CM) and differential-mode (DM) currents.

Poor decoupling practices result in unintentional common -mode (CM) and differential -mode (DM)

currents.
Can you recall Faraday’s law from your previous classes? Faraday’s law
states that the magnetic field generated by a coil is directly proportional to
the area of the coil and the current.
E = di/dt ∝ Coil Area ∝ Current going through the coil
Now, the first thing, which becomes critical is, reducing the coil/loop area.
When this loop area decreases, the magnetic flux will also reduce. Now, the
question is, how we can do it? Let’s say, we have a trace on the top PCB
layer, we can reduce the loop by placing a ground plane directly under the
trace/signal. So, when we do this, the current goes through the trace
following the device and returns through the ground plane. The thickness of
the PCB is around 3 mils (3000th part of an inch), and thus the area becomes
very small. This is how placing the ground plane exactly below the trace
reduces EMI because it reduces the overall area to be traversed.
The second thing is minimizing the rate of change of current since higher
current causes more emissions. So, if you reduce the current, EMI can also
be reduced. Maintaining low rise times, even if your PCB is operating at
high-frequency, can also be helpful for EMI reduction.
Avoid Impedance mismatching: A properly designed system always comes
with matched impedances from the source, to the transmission line, and the
load. It provides maximum power transfer and minimizes reflections.
Reflections on the transmission line increase harmonics, which increases
radiated emissions. Unmatched impedances cause ringing and overshoot in
digital signals, resulting in more radiated emissions. Properly matched
impedances are required because they reduce the radiated emissions from
the device. Want to learn more why impedance contro lling/matching is vital?
Read Why controlled impedance really matters.
Design guidelines for EMI and EMC reduction in a
PCB
How to design a board with low or absolutely zero electromagnetic
interference? Well, it isn’t impossible. The below design practices will make
sure you do not create antennas, which will emit electromagnetic energy.
These best design practices will reduce the length and area of the potential
signal return paths that may increase unwanted EM emissions. The
multi-layers stack-up will play a critical role, particularly in high -power and
digital applications. Signal traces from components to the processor shou ld
be properly routed to avoid any return path, which could lead to
common-mode signal generation.
The use of surface-mount devices (SMD) instead of leaded devices will
further reduce EMI/EMC issues. Surface-mount devices (SMD) offer lower
inductances in comparison with RF energy. Additionally, SMDs offer higher
density due to closer component placements. This is particularly critical in a
two-layer or four-layer circuit boards. However, the rising complexity in the
PCB design will create more problems asso ciated with line spacing or trace
spacing. The dense physical dimensions of SMDs will offer more effective
noise-control. Collect more information on surface -mount devices in this
article The Advantages and Disadvantages of Surface Mount Technology
(SMT).
Leaded components with higher inductances will generate a resonant
frequency of more than 100MHz. Therefore, the adoption of a large number
of through-hole components is not recommended as they generate excessive
noise. There are no hard and fast rules for PCB design. Some design rules
apply to a certain type of board but not feasible for other types. Nonetheless,
at Sierra Circuits, we have curated some gener al PCB design rules, common
to all board types.
1. Trace spacing and layout
Traces are the conductive paths that carry current from the driver to the
receiver on the PCB. When these traces come across any bend or cross, they
form a fully radiating antenna. Some common trace design rules are:
1.1 Trace separation: All signals (clocks, video, audio, reset, etc.) must be
separated from other traces. the general rule says that the separation
between the traces should be 3W, where ‘W’ is the width of the trace. This
practice helps to reduce crosstalk and coupling between adjacent traces on
the same PCB layer. Differential traces are an exception to this rule.

Adjacent traces on the same PCB layer should be separated by 3W.

1.2 Avoid right-angle and adopt 45° turn: When a trace encounters a 90°
bend, the capacitance increases, resulting in the change of characteristic
impedance value, which leads to reflections. It can be avoided by replacing
sharp bends with 45° turns.
 Reflections can be avoided by replacing sharp bends with 45° turns.

1.3 Route differential traces closely: It increases the coupling factor and
keeps the noise in common mode. For example, let us assume two wires,
which are placed close to each other. Any external noise intervening with
these two traces will add the same amount of disturbance in both the traces.
If trace 1 has 1 V and trace 2 has 1.5 V then the difference would be 0.5 V.
Since, the external noise is same on both the traces, say 0.1 V. Because of
this, trace 1 will become 1.1 V and trace 2 will become 1.6 V. And when you
calculate the difference, it is still the same that is 0.5 V. So, the noise will
actually cancel out. That is why high-speed signals are preferably routed as
differential pairs. Need more insights on high -speed PCB routing? Go through
our post on 11 best high-speed PCB routing practices.
1.4 Use vias like a pro: Vias are used in multi-layer PCBs for signal routing
purposes. A good designer must know that each via comes with its
capacitance and inductance effect. So, vias should be avo ided as far as
possible and critical traces should be routed on the same layer. Because of
the parasitic capacitance and inductance in the vias, there is an impedance
mismatch between via and trace, which creates reflections. When vias
cannot be avoided, it should be ensured that ground vias should be placed
close to the signal vias. This will ensure that the signals are referenced to
connected grounds and this reduces the change in the characteristic
impedance value and thus reflections. In differential pa irs, when vias cannot
be avoided, the same number of vias should be put in both traces.
Tip: Avoid vias in differential traces. If you have to then use anti -pad shared
by two vias to minimize parasitic capacitance.
1.5 Avoid stubs in sensitive and high-frequency traces: Stubs produce
reflections as well as the potential of adding fractional wavelength antenna
to the circuit. To understand how via stubs add to reflections, check this
post on via stubs and their effects.
1.6 Use guard and shunt traces for clock lines: In clock circuits, decoupling
capacitors are very important for suppressing noise propagating along the
supply rails. Guard and shunt traces are used to protect clock lines from EMI
sources, otherwise, such clock signals will create problems elsewhere in t he
circuit.

Guard and shunt traces are used to prote ct clock lines from EMI sources.
2. Ground planes
A ground with low inductance value is a crucial element during PCB
designing for mitigating EMC problems. Increasing the ground area on a PCB
reduces the ground inductance in the system, hence EM emissio n and
crosstalk too. Several approaches are available when we need to connect the
signals to the ground, but what is best? Before jumping to the best PCB
design approach, let us discuss what is not at all acceptable? Never connect
the PCB components randomly to the ground points. So, what is the
recommended design approach?
2.1 Use full ground plane and ground grids: Use the entire ground plane
since it offers the least inductance value when the signal returns to the
source from the load. Although a ground requires a dedicated PCB layer, this
may not always be possible in a two-layer PCB. In such scenarios, designers
use ground grids, where the inductance of a ground grid depends upon the
distance between the grids.

Ground grids are used when a dedicated PCB layer is not available.

2.2 Avoid long return paths: As per Faraday’s law, how a signal returns
through the system ground makes all the difference. When a signal takes a
longer path, it creates a ground loop that forms a radiating antenna. A short
return path has a lower impedance, which gives better EMC performance.
Long return paths are responsible for greater mutual coupling resulting in
crosstalk. Therefore, keep the return paths as short as possible and the loop
area as small as possible. The current return path should be handled
precisely. To understand more about this read How To Handle Current Return
Path for Better Signal Integrity.

A short return path has a lower impedance, which gives better EMC performanc e.

It is recommended to connect the device grounds directly to the ground

plane. This will reduce the ground loops.
 Always connect the device grounds directly to the ground plane.

2.3 Use Faraday’s cage/guard ring to isolate the noisy environment: A

Faraday cage is created by adding the ground on the edge of the PCB. The
purpose is not to route any signal outside this boundary. This technique
restricts the emission/interference within the defined limit.
Faraday’s cage restricts the emission/interference within the defined area.

2.4 Place high-speed circuits closer to the ground and low -speed circuits
closer to the power plane.
2.5 Always ground the copper fill areas: Floating copper areas should
always be grounded. Otherwise, it may act as an antenna, causing EMC
issues.
2.6 Check for multi-power requirements: When a circuit requires more than
one power supply, then it is the best idea to keep them separated by a
ground plane. But multi-ground planes cannot be realized in single -layer
PCBs. This problem can be solved by running power and ground tracks for
one supply separated from the others. It will also avoid noise coupling from
one power source to the other.
2.7 Be careful with split apertures: Split apertures that are long holes and
wide vias in power and ground planes create a non -uniform area. This
non-uniformity increases the impedance in power and ground planes.
3. Shielding
Shielding is a mechanical technique that uses conductive/magnetic (or both)
materials to prevent EMI in the system. A mechanical shield is a closed
conductive container connected to the ground, which effectively reduces the
size of loop antennas by absorbing and reflecting a part of their radiation. It
can be used either to cover the whole system or a part of it, based upon the
requirement. EMI/EMC shielding protects the signal transmis sion from
external noise and prevents information loss.

EMI/EMC shielding protects the signal from external noise.

3.1 Cable shielding: Cables that carry analog and digital signals create
serious EMI issues. Their parasitic capacitance and inductance factors are
responsible for this. EMI can be prevented by shielding these cables and
connecting them to the ground at the front and back.
4. Arrangement of PCB layers:
EMC performance of a PCB also depends upon the arrangement of its layers.
In the case of two or more than a two-layer board, one entire layer should be
used as a ground plane. For a four-layer board, the layer below the ground
layer should be used as a power plane. The preferred layer stack for the
four-layer board is signal1, ground, power, and signal 2. The
impedance-matched traces should be on signal1 as far as possible.
4.1 If a two-layer board is used and an entire layer of ground is not possible,
then ground grids should be used.
4.2 If a separate power plane is not used, then ground traces should run in
parallel with power traces to keep the supply clean.
4.3 When there are more than four layers, it is recommended to use PCB
layers’ arrangement like signal layer→ ground/power layer → signal layer →
ground/power layer → signal layer → ground/power layer → signal layer.
That is to use alternate signal and ground layers. And, the number of layers
should be even.

EMC performance of a PCB also depends upon the arrange ment of its layers.
5. Segregate sensitive components
For an EMC-friendly design, PCB components need to be grouped according
to the signals they are operating on, such as analog, digital, power supply,
low-speed, high-speed signals, etc. The signal tracks for each component
group should stay in their defined area. It is good to use a filter, whenever a
signal has to flow from one subsystem to another.

PCB components need to be grouped according to the signals they are operating on.

6. Decoupling capacitor
When ICs are operating, they switch current at high -frequency, which results
in switching noise in the power rails/traces connected to the IC. This noise if
not controlled, will result in radiated emissions and thus EMI. The methods
to reduce power rail noise is to place the decoupling capacitors close to the
IC power pins. And, grounding the capacitors directly to the ground planes.
The use of power planes instead of power traces will also reduce power
noise.

Power rail noise is reduced by placing the decoupling capacitors close to the IC power pins.
7. Controlled impedance for transmission line design
When a circuit operates at a high-speed, the impedance matching between
the source and destination becomes critical. If the impedance is not matched
and controlled properly then it will cause signal reflection and high -frequency
ringing. The excess RF ener gy generated due to ringing and reflection, will
radiate/couple to other parts of the circuit, creating EMI problems. Signal
termination strategies help to reduce these undesirable effects. Termination
not only mitigates signal reflection and ringing by co ntrolled impedance
measures but can also slow down the fast -rising and falling edges of the
signals. The impedance of traces also depends on the PCB materials used on
the board.

Adequate termination strategy helps in ringing reduction.

Testing EMI/EMC in a PCB design
The electromagnetic emissions in an electronic system are measured by
implementing various modeling techniques. The computer simulation is often
regarded as the fundamental approach in EMC analysis. The computer
simulation is performed via an integration t echnique to get an accurate
measurement of essential parameters. Several steps are followed to test
electromagnetic emission in an electronic system:
• The finite difference time domain modeling is implemented to measure
the frequency response of the common-mode current during the high
voltage applications.
• The common-mode current is evaluated by considering factors such as
current-mode antenna impedance, and the distributed circuit constant.
• The electric coupling between the power plane and the ground plane
will also impact the common-mode current.
Sierra Circuits measures the frequency response of electromagnetic
emission from the stripline structure with the help of a high -end tool and our
own proposed model. We understand the importance of keeping EMI out,
thus we offer physical insights and design guidelines to keep your circuit
safe and sound.