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    Defaults Wave Soldering

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    TAN
    This document lists and defines common types of defects that can occur during the wave soldering process, including non-wetting, dewetting, pin holes, webbing, white haze, solder balls, icycling, bridging, excess solder, dull/grainy joints, and cold/disturbed joints. For each defect, it identifies possible causes and recommended remedies to investigate and correct the problem. The goal is to restore solderability and eliminate defects one potential cause at a time.

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    © All Rights Reserved
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    Defaults Wave Soldering

    Uploaded by

    TAN
    67 views8 pages
    This document lists and defines common types of defects that can occur during the wave soldering process, including non-wetting, dewetting, pin holes, webbing, white haze, solder balls, icycling, bridging, excess solder, dull/grainy joints, and cold/disturbed joints. For each defect, it identifies possible causes and recommended remedies to investigate and correct the problem. The goal is to restore solderability and eliminate defects one potential cause at a time.

    Original Title

    DEFAULTS WAVE SOLDERING

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    This document lists and defines common types of defects that can occur during the wave soldering process, including non-wetting, dewetting, pin holes, webbing, white haze, solder balls, icycling, bridging, excess solder, dull/grainy joints, and cold/disturbed joints. For each defect, it identifies possible causes and recommended remedies to investigate and correct the problem. The goal is to restore solderability and eliminate defects one potential cause at a time.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    67 views8 pages

    Defaults Wave Soldering

    Uploaded by

    TAN
    This document lists and defines common types of defects that can occur during the wave soldering process, including non-wetting, dewetting, pin holes, webbing, white haze, solder balls, icycling, bridging, excess solder, dull/grainy joints, and cold/disturbed joints. For each defect, it identifies possible causes and recommended remedies to investigate and correct the problem. The goal is to restore solderability and eliminate defects one potential cause at a time.

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    © All Rights Reserved
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    Types of Wave Solder Defects

     Non Wetting
     Dewetting
     Pin Holes
     Webbing
     White Haze
     Solder Balls
     Icycling
     Bridging
     Excess Solder
     Dull/Grainy Joints
     Cold/Disturbed Joints

    Non Wetting
    Recognized by pull back of solder to expose the surface to be soldered

    Non Wetting - Possible Causes:


    Grease, oil or dirt on the pre-soldered surface
    Bleeding or misregistered soldered mask
    Low temperature solder
    Contaminated solder
    Surfaces too heavily oxidized for flux being used
    Contaminated flux
    Poor application of flux

    Remedy
    Investigate each possible cause and correct suspected discrepancies one at a time until solderability
    is restored
    Dewetting
    Recognized by metal wetting initially, then pulling back to form droplets of solder on the surface.

    Dewetting - possible Causes:


    Contamination of surface by abrasives
    Poor plating
    Poor hot air solder leveling during PCB manufacture

    Remedy
    Restore solderability of the surface
    Pin Holes
    Recognized by small holes or eruptions in the solder fillet.

    Pin Holes - possible Causes:


    Moisture or plating solution in the PCB laminate
    Inadequate preheat to evaporate flux solvent
    Flux has absorbed water
    Physical blockage due to foreign body in hole
    Top of Plated Through Hole prematurely solidifying

    Remedy
    Increase preheat to see if it eliminates problem
    Put in new flux to see if it eliminates problem
    Increase topside preheat and/or solder temperature to correct premature topside Plated Through
    Hole freezing
    If all of these fail to correct the problem, have the PCBs baked and cross sectioned.
    Webbing
    Recognized by a spider web like extension of solder across the non conductive portion of the PCB.

    Possible Causes:
    Improper curing of the laminate or solder mask
    Inadequate flux (when accompanied by bridging or icycling)
    Dross in the solder wave

    Remedy
    Baking the PCB will sometimes correct the improperly cured mask or laminate condition
    Substituting a more viscous flux or increasing the quantity of flux put on the PCB
    Correcting the drossing problem in the wave
    White Haze on Solder Mask
    Recognized by a white haze on the non-conductive portion of the PCB that cannot be removed by
    washing.

    White Haze on Solder Mask


    Possible Causes:
    Improper curing of the laminate or solder mask

    Remedy
    Baking the PCB will sometimes correct the improperly cured mask or laminate condition

    Solder Balls
    Recognized by tiny spherical shapes of solder dispersed over the surface of the PCB

    Possible Causes:
    Insufficient preheat
    Plated Through Hole conditions that create pin holes, resulting in Solder Balls
    High humidity in the manufacturing area
    Moisture in the flux

    Remedy:
    Investigate each possible cause, correcting suspect causes one at a time until the problem is
    corrected.
    Icycling
    Recognized by conical or flag shaped extensions of the solder fillet

    Possible Causes:
    Any condition that causes the solder to solidify while in the process of draining, such as:
    inadequate flux to promote quick drainage
    pot temperature too low
    soldering surface unusually heat absorbent
    leads picking up dross in the wave
    wrong Plated Through Hole to wire ratio

    Remedy:

    Investigate each possible cause and correct the suspect conditions one at a time until the problem is
    eliminated

    Bridging
    Recognized by solder extending from one lead to an adjacent lead, causing a short circuit

    Possible Causes:
    Component leads that are bent or too closely spaced
    Excess solder
    Inadequate flux remains to promote drainage
    Board immersed too deep in the wave
    Leads picking up dross in the wave
    Contaminated solder
    Poor component solderability

    Remedy:
    Investigate each possible cause and correct suspect conditions one at a time until the condition is
    eliminated
    Excess Solder
    Recognized by:
    Bulbous appearance of fillet.
    Unable to see contours of lead and land.

    Possible Causes :
    Any condition that contributes to poor drainage of the solder
    Low temperature of solder or preheat
    Contamination of solder
    Insufficient flux to promote drainage
    Incorrect wave exit angle or speed

    Remedy:
    ß
    Investigate suspected causes and correct them one at a time until the problem is corrected
    Dull or Grainy Joints
    ß
    Recognized by dark, non reflective, rough surfaces from an alloy that is normally bright and shiny.

    Remedies:
    Determine that the alloy is normally a shiny alloy
    Examine a recent pot analysis or get one done
    Conduct electrical and mechanical evaluation to see if rework is necessary
    If solder meets J-STD-006 Purity Standards and joints are mechanically sound, there is no reason
    for rejection or touch up
    If solder does not meet standard, it is a cold jointand should be replaced
    Cold/Disturbed Solder Joints
    Recognized by rough and dull finish on the fillets in conjunction with unacceptable mechanical
    strength of the joint

    Possible Causes:
    Movement while joint is still molten caused by:
    Conveyor mechanism erratic
    Solder Temperature too high

    Remedy:
    Look for causes of vibration being transmitted to the PCB and correct them
    Insure that solder reaches solidus temperature immediately after joint is completed

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