Lenovo Thinkserver Rd550: Lenovo Press Product Guide
Lenovo Thinkserver Rd550: Lenovo Press Product Guide
Lenovo Thinkserver Rd550: Lenovo Press Product Guide
The Lenovo® ThinkServer® RD550 blends outstanding flexibility and expandability and is the ideal choice
for:
Server consolidation/virtualization
Heavy web traffic workloads
Data analytics
Line-of-business applications
The enterprise class, 1U ThinkServer RD550 is a two-socket server that features Intel ®Xeon® E5-2600 v3
processors and supports up to 768 GB of DDR4 memory, 18 cores, and 36 threads per socket. With the
capability to support mix and match internal hard disk drive (HDD) and solid-state drive (SSD) storage
with up to 12 2.5-inch drive bays, 140 GbE networking capability, up to 8 hot-swap dual rotor fans, hot-
swap redundant power supplies, and a dedicated Gigabit Ethernet out-of-band management port, the
ThinkServer RD550 provides leading features and capabilities in a dense 1U design.
Up to five I/O slots provide room to expand, and Lenovo’s distinctive AnyFabric® design provides an
array of powerful HBA, CNA and 1 Gbps and 10 Gbps Ethernet choices to address growing network
bandwidth requirements without the use of a PCIe slot. This storage-rich server provides up to 26 TB of
storage capacity and features an Industry-unique Lenovo AnyBay® design that allows multiple storage
types in the same drive bay. M.2
and SD card options are available,
which enable flexible boot-drive
choices.
The RD550 provides Lenovo AnyRAID® technology, a midplane RAID adapter design that connects
directly to the drive backplane without using a PCIe slot. A comprehensive portfolio of AnyRAID
controllers is available for various applications, which include software, IO Controller, and RAID on Chip-
based controllers.
The RD550 delivers impressive compute power per watt, featuring 80 PLUS Titanium and Platinum
redundant power supplies. This server is designed to meet ASHRAE A4 standards, which enable
customers to lower energy costs.
System Specifications
The technical specifications for the ThinkServer RD550 system are listed in Table 1. For more
information, see the following sections.
Feature Specification
Form Factor 1U Rack
Processor Support Up to two Intel Xeon E5-2600 v3 Series CPUs, with up to 145 W SKUs and up
to 18 cores per CPU
Chipset Intel C610 series chipset
Memory Up to 24 DDR4 DIMM sockets (12 DIMMs per processor). RDIMMs and Load
Reduced (LR)-DIMMs are supported. Memory speed up to 2133 MT/s.
Maximum Capacities Maximum Capacity (LR-DIMM): 768 GB (24x 32 GB)
Maximum Capacity (RDIMM): 38 4GB (24x 16 GB)
Memory RAS ECC, Patrol Scrubbing, Demand Scrubbing, Sparing, Mirroring, and Lockstep
Mode
Storage Options 12x front 2.5-inch drive bays with up to 16 TB storage capacity
1
4x front 3.5-inch drive bays + 2 rear 2.5-inch drive bays with up to
26 TB storage capacity
Supported Technologies: SATA HDD, SAS HDD (7.2 K, 10 K, 15 K), SATA
2 3
SSD, SAS SSD, PCIe SSD , Dual Internal M.2 Flash and SD card
Media Bays Slim optical drive in select 3.5-inch HDD chassis configurations
Storage Controllers RAID110i 6 GB SATA RAID 0/1/10 w/ optional RAID 5
RAID510i 6 GB SAS & SATA RAID 0/1/10 w/ optional RAID 5/50
RAID720i 12Gb RAID 0/1/5/6/10/50/60 w/ optional 1 GB read-only
cache; optional 1 GB, 2 GB or 4 GB R/W cache includes CacheVault /
CacheCade / FastPath
RAID720ix 12 GB RAID 0/1/5/6/10/50/60 with optional 1 GB read-only
cache; optional 1 GB, 2GB or 4GB R/W cache includes CacheVault /
CacheCade / FastPath
I/O Expansion Slots Up to three PCIe slots and two AnyFabric mezzanine slots
Network Interfaces One 1 Gb/s Ethernet dedicated for remote management
AnyFabric Options:
o 1 GbE mezzanine, quad-port, Base-T NIC
o 10 GbE mezzanine, dual-port, Base-T NIC
o 10 GbE mezzanine, dual-port, SFP+ CNA
o 10 GbE mezzanine, quad-port, SFP+ CNA
o 8 Gb mezzanine, quad-port FC HBA
o 16 Gb mezzanine, dual-port FC HBA
I/O Connectors USB ports: 2x v2.0 front, 2x v3.0 rear
4
Display Port: 1 front , 1 rear
Serial port: 1 rear
System Cooling With 1x CPU: 6 system fans, Hot Swap Redundant
With 2x CPUs: 8 system fans, Hot Swap Redundant
1
Rear drives are SATA only.
2
Coming soon.
3
M.2 internal drives not supported with rear drive configuration.
4
No front panel display port on 12x 2.5-inch HDD configuration.
Figure 2 shows the locations of key components of the 3.5-inch chassis; including the AnyFabric
mezzanine card slot and the optional 2.5-inch hard disk drive bays in the rear of the system.
The locations of key components of the 2.5-inch chassis; including the three PCIe slots and two
AnyFabric mezzanine card slots in the rear of the system, are shown in Figure 3.
Figure 3 – RD550 2.5-inch Chassis Rear View with Three PCIe Slots and Two AnyFabric Slots
ID Description ID Description
1 PCIe slot 2 (3.5-inch chassis) 10 Power cord connector 2
2 PCIe slot 1 (3.5-inch chassis) 11 Power cord connector 1
3 2.5-inch disk drive bays (SATA only) 12 PCIe slot 3 (2.5-inch chassis)
4 Display port connector 13 PCIe slot 2 (2.5-inch chassis)
5 RJ45 connector for system management 14 PCIe slot 1 (2.5-inch chassis)
6 USB connectors (2) 15 AnyFabric slot 1 (2.5-inch chassis)
7 ID LED 16 AnyFabric slot s (2.5-inch chassis)
8 AnyFabric Slot 1 (3.5-inch chassis) 17 Network Status LED
9 Serial port connector 18 NIC activity LED
Looking inside the RD550, customer field replaceable components have blue touch points and hot
swappable components have orange touch points. The location of internal components is shown in
Figure 4.
The key features of the RD550, including AnyFabric and AnyRAID adapters, hot swap redundant power
supplies, and cooling fans, are listed in Table 3.
ID Description ID Description
1 One or two hot-swap redundant power supplies 10 Right rack handle
2 SD module (available on some models) 11 2.5-inch drive area
3 M.2 storage module (available on some models) 12 Left rack handle
DIMMs (installed memory modules vary by
4 13 System fans
model)
5 System board 14 Heat sink(2) with CPU
6 Cooling shroud 15 AnyFabric slot 2 (available on some models)
7 AnyRAID adapter 16 AnyFabric slot 1 (available on some models)
8 Front backplane for 2.5-inch drives 17 Riser card 1
ThinkServer RAID Super Capacitor module
9 18 Riser card 2
(available on some models)
ID Description ID Description
1 Rear backplane power connector 21 TSM Module Premium connector
2 SATA connector for Optical Disk Drive 22 Power supply connector 2
3 AnyRAID connector 1 (PCIe lanes) 23 CPU socket 2
4 AnyRAID connector 2 (PCIe lanes) 24 Power supply connector 1
Processor Support
The RD550 supports up to two Intel® Xeon® E5-2600 v3 series of processors. Xeon E5-2600 v3 improves
on the older generation of processors in the following ways:
The supported processor options and ordering information is listed in Table 5. Up to two processors are
supported by the system.
Memory Options
The ThinkServer RD550 supports DDR4 memory. DDR4 memory offers many benefits over older
generation DDR3 memory. DDR4 operates at a lower voltage than DDR3L (1.2V vs. 1.5V) and as a result,
offers significant power savings. In addition, DDR4 memory has higher memory transfer speeds of up to
2133 MT/s, depending on the memory configuration.
Lenovo offers Registered DIMMs (RDIMM) and Load Reduced DIMMs (LR-DIMM) that use a buffer to
reduce memory bus loading, which enables greater memory capacities to be achieved.
The server supports up to 12 DIMMs when one processor is installed and up to 24 DIMMs when two
processors are installed. Each processor has four memory channels, and there are three DIMMs
supported per channel. The RD550 supports up to 768 GB of memory at speeds up to 1866 MT/s when
fully populated. The actual memory speed in the system is determined as the lowest of the memory
speed that is supported by the specific CPU or the maximum operating speeds for the memory
configuration that is based on the number of DIMMs per channel.
ThinkServer engineering tested and validated system designs that support memory speeds beyond
Intel’s original plan, which provides benefits for workloads that require memory speed and density.
Lenovo ThinkServer memory is fully supported up to the rated speeds that are listed in Table 6.
Protection against data loss is provided through the following memory reliability, availability and
serviceability (RAS) features: ECC, Patrol and Demand Scrubbing, Sparing, Mirroring and Lockstep Mode.
When populating for the various RAS modes, the following rules apply:
If memory mirroring or lockstep is used, DIMMs must be installed in pairs (minimum of one pair
per each CPU), and both DIMMs in a pair must be identical in type, size, and rank.
If memory sparing is used, one rank of a DIMM in each populated channel is reserved as spare
memory, and therefore, Single Rank DIMMs cannot be used. DIMMs in a pair must be identical
in type, size, and rank.
Memory Optimization
The memory subsystem can be optimized for various factors, including performance, capacity, or power
consumption. Refer to the following guidelines when selecting memory options.
Use all available memory channels (4 per processor, 8 total per system).
Use identical DIMM populations in size and speed across channels.
Populate both processors with equal amounts of memory.
Use the same number of ranks populated per channel.
Have at least two ranks available on each channel.
Use fewer, higher capacity DIMMs. For example, 8 16 GB DIMMs generally have lower power
requirements than 16 8 GB DIMMs.
Populating more DIMMs per channel and using less channels (which is the opposite of the
guidance for maximum memory performance) reduces overall system power, but at the cost of
significant performance reduction.
Guidelines for selecting memory configurations that are based on performance or capacity are listed in
Table 7. For example, to achieve optimal 2133 MHz performance at a specific capacity, populate up to
16 DIMMs (up to 8 per CPU). To achieve the maximum memory capacity with the highest performance,
populate up to 24 sockets with LRDIMMs.
Desired Operating
# of Number of Number of Recommended
System Frequency Comments
CPUs DIMMs & Size Channels Used DIMM type
Capacity (MT/s)
4GB 1 CPU 1x 4 GB 1 Channel RDIMM 2133 Minimum configuration for 1 CPU
The RD550 DDR4 memory options and ordering information are listed in Table 8.
DIMM
Type Ranking Voltage Part Number
Capacity
Internal Storage
The ThinkServer RD550 implements a new chassis design that allows a greater number of drive bays,
which supports increased internal storage capacity. The system can be configured to meet exact
workload requirements.
5
Coming soon
Both chassis types also support enterprise M.2 SSD and SD memory cards, which can be used as boot
drives. M.2 is a form factor of SSD with a small footprint. The RD550 supports two M.2 SSDs that can be
configured as RAID-1 with the AnyRAID 110i or 720ix controllers. The RD550 supports two SD memory
cards via an optional module that is connected to USB ports on the system board. SD cards can be
configured redundantly by using the operating system. The SD cards are enabled via a USB port from the
system board Platform Controller Hub (PCH), and do not require a RAID controller.
This section describes the base chassis configurations with varying numbers of drive bays and the key
features of each.
2.5-inch Chassis
The 2.5-inch chassis supports configurations with up to 8 or 12 hot-swap small form factor HDDs, or
SSDs. The 12-drive bay configuration can also be configured to support two AnyBay drive bays that can
support SATA or SAS HDDs, SSDs, and PCIe SSDs. The RD550 2.5-inch chassis supporting 12 drives is
shown in Figure 6.
3.5-inch Chassis
The 3.5-inch chassis supports configurations with up to four HDDs in the front and optionally two 2.5-
inch SATA HDDs or SSDs in the rear. One slim Optical Disk Drive is available for the 3.5-inch chassis with
up to four drives. The RD550 3.5-inch drive bay chassis is shown in Figure 7.
Available option kits can be purchased to upgrade to a four drive front backplane or a rear drive
backplane. The ordering information for RD550 backplane option kits is listed in Table 9.
Drive Options
The ThinkServer RD550 supports drive types that include choices for higher performing SSDs and high
capacity HDDs. The ordering information for supported drive options is listed in Table 10.
Along with a broad RAID controller selection, Lenovo offers options, such as upgrade keys for software
and IOC-based controllers, read-only and protected cache options, and advanced caching and SSD
acceleration software. To ensure investment protection, RAID configurations, data, and most options
can transfer intact when upgrading to a more advanced controller. ThinkServer AnyRAID options are
common across the Lenovo ThinkServer next-generation portfolio.
Lenovo offers the following ThinkServer AnyRAID controllers to provide coverage for various business
and technical requirements:
Lenovo ThinkServer AnyRAID 110i is a software RAID controller that offers a low-cost solution
for light workloads with limited users.
Lenovo ThinkServer AnyRAID 510i is an IOC-based RAID card that offers an affordable hardware
controller that delivers performance and reliability.
Lenovo ThinkServer AnyRAID 720i is a RoC-based controller that offers advanced RAID
configurations, protection and software.
Lenovo ThinkServer AnyRAID 720ix is similar to the AnyRAID 720i, but contains an onboard SAS
expander to support up to 26 drives.
110i AnyRAID 510i AnyRAID RAID 720i AnyRAID RAID 720ix AnyRAID
Maximum Device 26 SATA, SAS, SSD,
6 SATA 8 SATA, SAS, SSD 8 SATA, SAS, SSD
Support PCIe SSD
Supports M.2 SSD No No No Yes
Data Transfer Rate Up to 6 Gbps Up to 6 Gbps Up to 12 Gbps Up to 12 Gbps
0/1/10 0/1/10
RAID Levels 0/1/10/5/50/6/60 0/1/10/5/50/6/60
Optional 5 Optional 5
Yes (only without
JBOD Mode Yes Yes Yes
Cache installed)
Online Capacity
Yes Yes Yes Yes
Expansion
RAID Level
Yes Yes Yes Yes
Migration
Global Hot Spare Yes Yes Yes Yes
1 GB Read only 1 GB Read only
1/2/4 Read-Write 1/2/4 Read-Write
Cache Protection N/A N/A
Flash/Supercap Flash/Supercap
protected cache protected cache
RAID FastPath and Yes (included with Yes (included with
N/A N/A
CacheCADE Pro 2.0 cache modules) cache modules)
SED Support No No Yes Yes
Yes (up to 26 SAS
SAS Expander No No No
drives)
AnyBay PCIe SSD
No No No Yes
Support
Chassis Type RAID 110i RAID 510i RAID 720i RAID 720ix
2.5-inch 4 bay n/a
2.5-inch 8 bay n/a n/a n/a
2.5-inch 12 bay n/a n/a n/a
2.5-inch 12 bay (with AnyBay support) n/a n/a n/a
3.5-inch 4 bay
The ordering information for AnyRAID adapters and upgrade options is listed in Table 13.
AnyFabric NICs
Lenovo offers AnyFabric NICs that are based on Intel technology. Intel NIC technology has a long history
of outstanding support in the data center and is recognized as a leader in the industry for enterprise
applications.
A summary and ordering information for AnyFabric NICs that are supported by the RD550 are provided
in Table 14.
AnyFabric CNA
Lenovo ThinkServer AnyFabric CNA cards are based on technology by Emulex. Emulex is acknowledged
as a leader in the CNA product category and provides reliable and innovative technologies.
A summary and ordering information for AnyFabric CNAs that are supported by the RD550 are provided
in Table 15.
AnyFabric HBA
As with the AnyFabric CNAs, Emulex is the technology behind the Lenovo ThinkServer HBA adapters.
Bringing the same high quality and industry reputation to HBAs, Emulex is recognized as a leader in the
industry.
A summary and ordering information for AnyFabric HBAs that are supported by the RD550 is provided in
Table 16.
The 2.5-inch chassis supports three PCIe slots and two AnyFabric slots. The 2.5-inch chassis PCIe I/O
expansion slots and AnyFabric mezzanine options as seen from the rear of the server are shown in
Figure 8.
Figure 8 – RD550 2.5-inch Chassis Riser Card Expansion Slots and AnyFabric Slots
The supported PCIe slots and ordering information for the 2.5-inch chassis are listed in Table 17.
Table 17 – 2.5-inch RD550 Chassis PCIe Slots
The 3.5-inch chassis supports two PCIe slots, one AnyFabric slot, and two optional 2.5-inch disk drive
bays in the rear of the server. The 3.5-inch chassis expansion options as seen from the rear of the
system are shown in Figure 9.
Figure 9 – RD550 3.5-inch Chassis Riser Card Expansion Slots and AnyFabric Slots
The supported PCIe slots and ordering information for the 3.5-inch chassis is listed in Table 18.
Table 18 – 3.5-inch RD550 Chassis PCIe Slots
A summary and ordering information for the Lenovo PCIe NIC portfolio are provided in Table 19.
A summary and ordering information for the Lenovo PCIe HBA portfolio are provided in Table 21.
A summary and ordering information for the Lenovo SAS HBA portfolio are provided in Table 22.
Systems Management
A significant factor in the total cost of a server’s ownership is the processes that are used for
administering the system hardware, software, and support over the life of the server. Lenovo’s
ThinkServer system management offerings are based on industry standards that enable integration into
existing IT environments. Lenovo’s tools emphasize provisioning and operational management, which
are a large portion of the system cost. Optional upgrades provide more management capabilities to
optimize performance and usage of the servers.
Deployment
Embedded within every Lenovo next-generation ThinkServer system, ThinkServer Deployment Manager
is a tools suite that provides a complete set of provisioning capabilities from a single interface.
ThinkServer Deployment Manager automates many of the tasks that are associated with server
provisioning, including hardware configuration, operating system deployment, device driver (for OS
installation) and firmware updates, and server cloning. Because ThinkServer Deployment Manager is
integrated into the UEFI pre-boot environment, the tools operate independently of the server and are
available regardless of system’s operational state. Formatting a system drive or reinstalling the
operating system does not remove the tools. Also, there are no CDs or DVDs to retrieve or store, which
can affect the user experience or productivity.
TSM is a fully featured management solution that is built on open industry standards that can help
reduce related IT expenses by increasing a server administrator’s productivity. TSM provides important
health and status information to systems administrators, and enables administrators to remotely
perform most functions that otherwise require a visit to the server.
TSM can be used as part of any server systems management infrastructure and is well-suited for
customers who are deploying servers in remote branches, limited-access data centers, and where one-
on one remote-control capability is required. Lenovo’s design advancements address key system
Available as an optional hardware upgrade key, TSM Premium enables the following advanced features:
A remote console that provides complete remote control of the server. A video viewer enables
graphical console, keyboard, and mouse redirection of the server.
Remote media capability that enables the attachment of local CD-ROMs, DVD-ROMs, USB mass
storage devices, ISO images, and IMG images (created from local folders) to the remote server.
Support for power monitoring and management with the separately available ThinkServer
Energy Manager tool. Energy Manager is a stand-alone, web-based, power management console
that enables you to observe, plan, and manage server power usage to decrease power and
cooling needs, which helps to lower your total cost of ownership. Energy Manager uses TSM to
capture real-time power and temperature data from the ThinkServer system, analyzes the data
to optimize server power consumption and workload placement, and provides controls to limit
maximum server power consumed.
TEM is an agent-less, web-based console that tracks and analyzes real-time power consumption and
thermal data for servers and other supported devices in the data center. With this data, administrators
can plan and manage server power and cooling. By using built-in intelligence, TEM identifies power
consumption trends, ideal power settings, and cooling analysis so that you can develop power-saving
usage policies that adjust server power caps that are based on server usage, business conditions, and
power consumption trends. When a user-defined power or temperature threshold is reached, an alert
can be generated to inform you of the event. An emergency feature can automatically help maintain
business continuity; when power outages or temperature events occur, TEM can dynamically cap power
to shed load and distribute remaining power to servers that are prioritizing business-critical workloads.
With the ability to monitor, analyze, and control the power and cooling of Lenovo and non-Lenovo
servers, TEM enables you to take control of power management and reduce operational costs.
A single TEM license is included with all next-generation servers with TSM Premium. Licenses are
available for next-generation servers without TSM, selected 4th generation ThinkServer systems, and
third-party servers6 via Node License Packs, as shown in Table 24. Users of Lenovo Smart Grid can
upgrade to TEM at no charge.
Maximum
Description Part Number
Supported
Lenovo ThinkServer Energy Manager Node License 4L40E51621 Single Node
Lenovo ThinkServer Energy Manager Node License Pack 4L40E51622 5 Nodes
Lenovo ThinkServer Energy Manager Node License Pack 4L40E51623 50 Nodes
6
For more information about supported non-Lenovo platforms, see ThinkServer Energy Manager User’s Guide.
Unlike options from other server providers, the Lenovo Partner Pack integrates into vCenter and does
not require the installation of extra consoles or software.
Implemented as a Management Pack for SCOM, the Partner Pack is integrated into SCOM by using the
existing Management Pack interface, which allows IT administrators to manage ThinkServer systems by
using familiar tools and “one pane of glass” management.
The Lenovo Partner Pack for SCOM automatically discovers and provides detailed system information
about the Lenovo ThinkServer managed servers, including component inventory, and component and
sensor status. The Partner Pack also enables actions, such as restarting or powering off the ThinkServer,
accessing the Remote Desktop Console via RDP, and accessing the TMM interface.
The Partner Pack uses “In-Band” management to manage ThinkServer systems that are running
Microsoft Windows Operating Systems with the System Center Agent installed.
Unlike options from other server providers, the Lenovo Partner Pack integrates into SCOM and does not
require the installation of extra consoles or software.
The RD550 uses low-power components, including DDR4 memory and low power CPU options.
Power supply choices that can be selected based on system configuration, which enables
greater power supply efficiency in use.
The server can be configured with 80 Plus Platinum or Titanium rated power supplies and is
compliant with Energy Star 2.0 when these power supplies are used. Titanium rated supplies are
up to 96% efficient at high loads.
System power profiles can be configured in BIOS to optimize usage for maximum performance
or energy efficiency.
Lenovo Energy Manager provides system level power monitoring and management, which
enables user- defined power capping.
The available power supply options for RD550, including their operating characteristics, efficiency
ratings, and ordering information are listed in Table 25.
Supported Configurations
The RD550 supports several configurations that can be selected based on the wanted server
configuration, workload, or reliability requirements.
The server can be ordered with a single power supply or with two power supplies for 1 + 1 redundancy
in the unlikely event of a power supply failure. Both active-active and active-passive forms of
redundancy are supported and they are configurable through IPMI (command-line interface).
Installing two different wattage power supplies is not supported; the lower wattage power supply is
disabled, which eliminates redundancy.
The size of the power supply should be chosen based on the system configuration, as shown in Table 26.
If an installed power supply is smaller than the demand placed on it, power consumption is capped with
a potential impact on system performance.
If Uninterruptable Power Supplies (UPS) are used with the RD550, the output of the UPS should be of a
pure sine wave.
Thermal
The RD550 can run at 45o C continuously without time restrictions, which is an industry first. This ability
provides value in data centers that can (or intend to) use new energy efficient cooling technologies, and
in organizations who install their servers in segregated or less-controlled environments.
Lenovo carefully designed and tested the RD550 to address concerns about long-term reliability.
Specifically, the following measures were taken:
Very stringent component temperature and voltage de-rating requirements were adopted to
insure reliable operation across all supported environments.
Components are placed in the system for optimal airflow. With advanced thermal control,
temperatures of critical components are often lower at higher ambient temperatures than in
normal environments.
The system design was thoroughly tested across the entire A4 temperature range.
The system environmental specifications for the RD550 are shown in Table 27.
Specification
Operating ambient temperature 5°C - 45°C 41°F - 113°F
Transit ambient temperature -40°C - +60°C -40°F - 140°F
Operating Humidity 8 % - 90% RH, non-condensing
Transit humidity 8 % - 90% RH, non-condensing
Operating altitude 0 - 3048 m 0 - 10,000 ft
Transit altitude 7620 m 25,000 ft
Maximum allowable ambient temperatures must be derated at altitudes above 950 m (3100 ft), as
shown in Figure 10. Allowable ambient temperatures 35°C - 40°C are reduced 1°C for every 175 m
(575 ft) above 950 m, and 1°C for every 125 m (410 ft) above 950 m for ambient temperatures 40°C -
45°C.
Acoustics
The sound pressure levels for idle and operational modes are listed in Table 28.
Product Value
Configuration Description LWAd (bels) <LpA>m (dB)
Idle Oper Idle Oper
4x 3.5-inch HDD Chassis
1x 85W 6C E5-2609 v3 CPU
1x 8GB DIMM
Minimum Intel 4x 1GbE AnyFabric Card 3.8 3.8 21.6 21.7
No PCIe Adapters installed
1x 550 W PSU
1x 3.5-inch 7.2K SATA HDD
12x 2.5-inch HDD Chassis
2x 105W E5-2660 v3 CPU
8x 8GB DIMMs
R720i AnyRAID Adapter
Typical 4.1 4.2 33.2 34.3
Intel 10GbE RJ45 AnyFabric Card
Intel 1GbE 4- port PCIe Adapter installed
2x 550W PSUs
4x 2.5-inch 7.2K SATA HDDs
Listed are the declared A-Weighted sound power levels (LWAd), declared average bystander position A-
Weighted sound pressure levels (LpAm), and declared operator position A-Weighted sound pressure
levels (<LpAm >) when the product is operating in a 23° ± 2°C ambient environment.
Noise emissions measurements are made in accordance with ISO 7779 (Acoustics-Measurement of
Airborne Noise Emitted by Computer and Business Equipment – EECMA 074), and are reported in
conformance with ISO 9296 (Acoustics-Declared Noise Emission Values of Computer and Business
Equipment – ECMA 109). The declared sound power levels indicate an upper limit below which a larger
proportion of machines operate as determined according to ISO 9296.
Sound pressure levels are reference quantities that might exceed the stated values in customer
locations because of room reflections and other nearby noise. The listed sound levels apply only to the
configuration that is described. Other options can result in increased sound levels.
Security
The RD550 provides a hardware security module (optional), TSM hardware security, an optional chassis
intrusion lock and server cover lock.
TPM
The RD550 provides an optional Trusted Platform Module (TPM) to securely store the passwords,
certificates, and encryption keys that might be used to authenticate the platform. TPM is a hardware-
based system security feature that supports Trusted Computing Group (TCG) 1.2.
TSM Security
TSM provides the following security features:
User authentication through LDAP/Active Directory or local hardware-stored user accounts and
passwords
Role-based authorization: Enables administrators to configure specific privileges for each user
Interface Security:
o Session time-out: Provides automatic session time-out for inactivity (Web, Telnet, SSH,
and KVM)
o Firewall that is configurable to block network traffic based on IP address or network port
Configurable Network Service ports: Allows customization of ports that are used by TSM services
Security settings that are configurable through the Web interface, PowerShell CLI, and IPMI
Encryption secured with 256-bit Secure Sockets Layer (SSL):
o Secure Web-server (HTTPS)
o Secure LDAP (LDAPS)
o Supports Virtual Console and Virtual Media encryption
TSM supports terminal connections to clients using SSH version 2.0: SSH uses user ID and
password pairs that are stored in local user accounts or AD/LDAP server
VLAN support:
o Enables management traffic to be in a private “management VLAN” in dedicated and
shared network modes
o VLAN groups can be used to limit network access to devices that are subscribed to the
VLAN group
Warranty options
The Lenovo ThinkServer 550 features a one year or three-year next business day onsite warranty
coverage, depending on the server model.
The warranty can be extended to three, four, or five years, up to a maximum coverage period of five
years. If Lenovo determines that the product problem is covered by the product warranty and cannot be
resolved over the telephone, a technician is dispatched to arrive on-site (typically the next business day)
in major metropolitan areas. Calls that are received after 4:00 p.m. local time require an extra business
day for service dispatch. On-site service is available only in metropolitan areas and next business day
service is not guaranteed.
The warranty extension offerings that are available for the RD550 are shown in Table 31.
Offering Description
Upgrades standard warranty response time to the same day
the initial service call is placed.
Service includes:
4 hour - 9x5
4-hour onsite response time
9x5 service window
Technician Installed CRUs
Extends 4-hour response time window to around the clock.
4 hour - 24x7
Service also includes Technician Installed CRUs.
Offers an 8-hour response time window 24 hours a day, 365
8 hour - 24x7 days per year; ensures excellent same day response at a
lower cost than higher response 4-hour offerings.
All Lenovo four- and eight-hour service offerings require Customer Server Location Activation. For more
information about this process, see this website:
www.lenovo.com/activation
If the customer fails to complete ThinkServer location activation, the SLA that is provided might be
affected. To perform the necessary inspection and activation procedures for the ThinkServer customer’s
machine location for four- and eight-hour response service, Lenovo reserves the right to automatically
downgrade the service to NBD Onsite service for the initiation period of up to 30 days following the
successful location activation.
Regulatory Compliance
The RD550 conforms to the following standards: