c06969231 PDF
c06969231 PDF
c06969231 PDF
Overview
HP EliteBook x360 1040 G8 Notebook PC
Left
1. Internal Microphones 6. Nano Security lock slot (Lock sold separately)
2. IR Camera LEDs 7. WWAN SIM (Nano)
3. Webcam and IR Camera 8. Audio Combo Jack
4. Webcam LED 9. SuperSpeed USB Type-A 5Gbps signaling rate (Charging port) (USB
3.2 Gen 1)
5. Glass Clickpad
Overview
Right
1. Power button 4. Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate
(USB Power Delivery, DisplayPort™ 1.4)1
2. SuperSpeed USB Type-A 5Gbps signaling rate 5. Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate
(Charging port) (USB 3.2 Gen 1) (USB Power Delivery, DisplayPort™ 1.4)1
3. HDMI 2.0 port (Cable not included) 6. Battery LED
Overview
AT A GLANCE
• Windows 11 Pro, other Windows OS or FreeDOS preinstalled
• An all metal CNC Aluminum chassis that is .6 inches (1.66 cm) thin (at front) and with a starting weight of 2.9 lbs. (1.31
Kg)
• A 360° convertible notebook with 4 usage modes: Laptop mode, Tablet mode, Tent mode, and Media mode
• Choice of 11th Generation Intel® Core™ i5, i7 Processors with integrated Intel® Iris® Xe Graphics supporting dual channel
LP DDR4X memory up to 32 GB and solid state storage up to 2 TB
• Intel® EVO configurations available
• Touch display choices include 35.56 cm (14.0") diagonal IPS FHD displays and stunning UHD HDR-400 display. Optional
Anti-glare screen available on FHD panels. Get added protection in open or public places with the optional HP Sure View
Reflect integrated privacy screen
• Ultimate connectivity with dual Thunderbolt™ 42 with USB4 support ports, dual USB 3.1 Gen1 charging ports, and HDMI
2.0. Stay connected where you need to with additional choices of 5G or 4G/LTE WWAN, WLAN and optional Thunderbolt™
Docking (Sold separately)
• Featuring HP Quiet Keyboard with the HP Programmable key. The power button, HP Sure Shutter and the fingerprint
sensor are also located on the keyboard
• An optional HP Rechargeable Active Pen 31 with Magnetic Attach and 4096 Levels of pressure
• Never forget your password with your choice of simple authentication methods, including the IR camera for face
recognition and Touch Fingerprint Sensor for Windows Hello
• Enterprise grade security with HP Sure Sense, HP Sure Start, HP Sure Shutter, HP Sure View Reflect (optional), HP Sure
Run, HP Sure Recover with Embedded Reimaging, HP Sure Click, HP Tamper Lock and Touch Fingerprint sensor
• HP Sure Shutter - industry’s 1st camera with an electric shutter. The on/off button for this shutter is located on the
function row of the keyboard.
• Two choices for the system battery: a 54.5 Wh battery for lighter configurations and a 78.5 Wh battery for the longest
battery life. Battery Life up to 14 hours 45 minutes (54 Wh battery) (MobileMark2018) and up to 22 hours (78 Wh battery)
(MobileMark2018).
• AI based HP Context Aware to maximize performance when working at a table, comfort when working from your lap, and
responsiveness when working on the go.
• Auto Lock and Awake (prev. Presence Aware) automatically locks your system when you leave and seamlessly
authenticates with Window’s Hello
• HP Dynamic Audio, a new AI-based audio experience, tunes output to speech, music, and movies all while suppressing
background noise. (Planned to be available March 2021)
• HP Sound Calibration to uniquely tune end user headphone audio. (Planned to be available March 2021)
• Passed 19 MIL-STD 810H tests1
1. MIL-STD 810H is not intended to demonstrate fitness of U.S. Department of Defense contract requirements or for
military use. Test results are not a guarantee of future performance under these test conditions. Accidental damage
requires an optional HP Accidental Damage Protection Care Pack.
2. SuperSpeed USB 20Gbps is not available with Thunderbolt™ 4.
NOTE: See important legal disclosures for all listed specs in their respective features sections.
Technical Specifications
PRODUCT NAME
HP EliteBook x360 1040 G8 Notebook PC
OPERATING SYSTEM
Preinstalled Windows 11 Pro 2
Windows 11 Pro Education 2
Windows 11 Home – HP recommends Windows 11 Pro for business 2
Windows 11 Home Single Language – HP recommends Windows 11 Pro for business 2
Windows 11 Pro (Windows 11 Enterprise or Windows 10 Enterprise available with a Volume
Licensing Agreement) 1
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade) 1,2
FreeDOS
1. Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may
vary by device. Features and app availability may vary by region. Certain features require specific hardware (see Windows 11
Specifications).
2. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows is
automatically updated and enabled. High speed internet and Microsoft account required. ISP fees may apply and additional
requirements may apply over time for updates. See http://www.windows.com.
PROCESSORS
Intel® Core™ i7-1185G7 (3.0 GHz base frequency, up to 4.8 GHz frequency with Intel® Turbo Boost Technology,
12 MB L3 cache, 4 cores) supports Intel® vPro® Technology 3,4 5,6
Intel® Core™ i7-1165G7 ((2.8 GHz base frequency, up to 4.7 GHz with Intel® Turbo Boost Technology, 12 MB L3 cache,
4 cores) 3,4 5,6
Intel® Core™ i5-1145G7 (2.6 GHz base frequency, up to 4.4 GHz frequency with Intel® Turbo Boost Technology,
8 MB L3 cache, 4 cores) supports Intel® vPro® Technology 3,4 5,6
Intel® Core™ i5-1135G7 (2.4 GHz base frequency, up to 4.2 GHz with Intel® Turbo Boost Technology, 8 MB L3 cache,
4 cores) 3,4 5,6
Processor Family
11th Generation Intel® Core™ i7 processor (i7-1185G7 and 1165G7) 6
11th Generation Intel® Core™ i5 processor (i5-1145G7 and 1135G7) 6
3. Multicore is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload
and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher
performance.
4. Processor speed denotes maximum performance mode; processors will run at lower speeds in battery optimization mode.
5. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
6. In accordance with Microsoft’s support policy, HP does not support the Windows 8 or Windows 7 operating system on products
configured with Intel and AMD 7th generation and forward processors or provide any Windows 8 or Windows 7 drivers on
http://www.support.hp.com.
Technical Specifications
CHIPSET
Chipset is integrated with processor
GRAPHICS
Integrated
Intel® Iris® Xᵉ Graphics
Supports
Support HD decode DX12 HDMI 2.0 7
DISPLAY
Touch
35.6 cm (14") diagonal FHD IPS Ultraslim 2.0mm eDP + PSR2 BrightView touch screen with 0.4mm Gorilla® Glass 5, 400 nits,
72% NTSC (1920 x 1080) 9,10,11
35.6 cm (14") diagonal FHD IPS Ultraslim 2.0mm eDP + PSR2 Anti-Glare touch screen with 0.4mm Gorilla® Glass 5, 400 nits,
72% NTSC (1920 x 1080) 9,10,11
35.6 cm (14") diagonal UHD HDR400 IPS Ultraslim 2.0mm eDP + PSR BrightView touch screen with 0.4mm Gorilla® Glass 5,
550 nits, 72% NTSC (3840 x 2160) 9,10,11
HP Sure View Reflect Integrated Privacy Screen 35.6 cm (14") diagonal FHD IPS Ultraslim 2.0mm eDP + PSR BrightView touch
screen with 0.4mm Gorilla® Glass 5, 1000 nits, 72% NTSC (1920 x 1080) 9,10,11,12
HP Sure View Reflect Integrated Privacy Screen 35.6 cm (14") diagonal FHD IPS Ultraslim 2.0mm eDP + PSR Anti-Glare touch
screen with 0.4mm Gorilla® Glass 5, 1000 nits, 72% NTSC (1920 x 1080) 9,10,11,12
HDMI 2.08
Supports resolutions up to 4K@60Hz
Technical Specifications
512 Intel® PCIe® NVMe™ QLC M.2 SSD with 32 GB Intel® Optane™ memory H1013,14
13. For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows 10 and
11) is reserved for system recovery software
14. Intel® Optane™ H10 memory system acceleration does not replace or increase the DRAM in your system. Requires 8th Gen or
higher Intel® Core™ processor, BIOS version with Intel® Optane™ supported, Windows 10 64-bit, and an Intel® Rapid Storage
Technology (Intel® RST) driver.
MEMORY
Maximum Memory
32 GB LPDDR4X-4266 SDRAM
Memory
32 GB LPDDR4X-4266 SDRAM 15
16 GB LPDDR4X-4266 SDRAM 15
8 GB LPDDR4X-4266 SDRAM 15
Memory Slots
Memory soldered down
LPDDR4X, System runs at: 4266
Supports Dual Channel Memory
Technical Specifications
NETWORKING/COMMUNICATIONS
WLAN
Intel® Dual Band Wireless-AX201 802.11a/b/g/n/ac/ax (2x2) Wi-Fi® 6 and Bluetooth® 5.2, vPro® Wireless Card16
Intel® Dual Band Wireless-AX201 802.11a/b/g/n/ac/ax (2x2) Wi-Fi® 6 and Bluetooth® 5.2, non-vPro® Wireless Card 16
WWAN
Intel® XMM™ 7360 LTE-Advanced Cat 9 18
Qualcomm® Snapdragon™ X55 5G Modem (5G + LTE CAT 20)19
NFC
NPC300 Near Field Communication Module 20
Miracast
Native Miracast Support 21
16. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited.
Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
18. WWAN module is an optional feature, requires factory configuration and requires separately purchased service contract. Check
with service provider for coverage and availability in your area. Connection speeds will vary due to location, environment, network
conditions, and other factors. LTE not available on all products, in all regions.
19. 5G module is an optional feature that must be configured at purchase. AT&T and T-Mobile networks supported in the U.S.
Module designed for 5G networks as carriers deploy Evolved-Universal Terrestrial Radio Access New Radio Dual Connectivity
(ENDC) with both 100Mhz of 5G NR and LTE channel bandwidth, using 256QAM 4x4 as defined by 3GPP, requires activation and
separately purchased service contract. Check with service provider for coverage and availability in your area. Connection, upload
and download speeds will vary due to network, location, environment, network conditions, and other factors. 5G not available on
all products, in all regions. Backwards compatible to 4G LTE and 3G HSPA technologies. 5G module planned to be available in
select countries, where carrier supported. US Configurations: Verizon mobile broadband service is not supported with this
module.
20. Sold separately or as an optional feature.
21. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming.
AUDIO/MULTIMEDIA
Audio
Audio by Bang & Olufsen
4 Premium stereo speakers
Microphones (Multi Array including two user facing and two world-facing microphones)
Camera
Hybrid 720p HD camera with integrated electronic privacy shutter, HP Sure Shutter 22
NOTE: The on/off button for this shutter is located on the function row of the keyboard.
Sensors
Accelerometer
Magnetometer
Gyroscope
Ambient light sensor
Hall sensor
Technical Specifications
KEYBOARDS/POINTING DEVICES/BUTTONS & FUNCTION KEYS
Keyboard
HP Quiet Keyboard, spill resistant, Backlit keyboard and Durakeys
HP Quiet Keyboard, spill resistant, Backlit keyboard and Durakeys, privacy
Pointing Device
Glass ClickPad with multi-touch gesture support
Function Keys
F1 - Display Switching
F2 – Blank or Sure View
F3 - Brightness Down
F4 - Brightness up
F5 - Audio Mute
F6 - Volume Down
F7 - Volume Up
F8 - Mic Mute
F9 - Keyboard Backlight
F10 - Insert
F11 - Airplane Mode
F12 - Programmable Key
Non-Function Keys
HP Sure Shutter
Power Key
Delete Key
Technical Specifications
SOFTWARE AND SECURITY
Preinstalled Software
BIOS
HP BIOSphere Gen6 23
HP Drive Lock & Automatic Drive Lock
BIOS Update via Network
HP Secure Erase 24
Absolute Persistence Module 25
HP LAN-Wireless Protection
USB enable/disable (via BIOS)
Software
HP Connection Optimizer 26
HP Hotkey Support
myHP
HP Support Assistant 27
HP QuickDrop 17
HP Noise Cancellation Software
Touchpoint Customizer for Commercial
HP Notifications
HP Privacy Settings
HP Wireless Button Driver
HP Power Manager
HP PC Hardware Diagnostics Windows
Buy Microsoft Office (sold separately)
Microsoft Defender 31
HP Smart Support 53
Manageability Features
HP Driver Packs (download) 28
HP Manageability Integration Kit Gen4 (download) 29
HP Client Catalog (download)
HP Client Management Script Library (download)
HP Image Assistant (download)
Security Management
HP Client Security Manager Gen7 30
HP Fingerprint Sensor
HP Wolf Pro Security Edition33
HP Sure Click 34
HP Sure Sense 35
HP Sure Start Gen6 36
HP Sure Admin 37
HP Sure Recover Gen4 38
HP Sure Run Gen4 39
TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified) 40
17. HP Quick Drop requires Internet access and Windows 10 PC preinstalled with HP QuickDrop app and either an Android
device (phone or tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or
tablet) running iOS 12 or higher with the iOS HP QuickDrop app.
23. HP BIOSphere Gen6 is available on select HP Pro and Elite PCs. Features may vary depending on the platform and
configurations.
24. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-
88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
25. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and
full activation of the software agent. License subscriptions can be purchased for terms ranging multiple years. Service is
Technical Specifications
limited, check with Absolute for availability outside the U.S. Certain conditions apply. For full details visit:
https://www.absolute.com/about/legal/agreements/absolute/
26. HP Connection Optimizer requires Windows 10.
27. HP Support Assistant requires Windows and Internet access.
28. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
29. HP Manageability Integration Kit can be downloaded from
http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
30. HP Client Security Manager Gen7 requires Windows and is available on the select HP Elite and Pro PCs.
31. Windows Defender Opt in and internet connection required for updates.
33. HP Wolf Pro Security Edition (including HP Sure Click Pro and HP Sure Sense Pro) is available preloaded on select SKUs
and, depending on the HP product purchased, includes a paid 1-year or 3-year license. The HP Wolf Pro Security Edition
software is licensed under the license terms of the HP Wolf Security Software - End-User license Agreement (EULA) that can
be found at: https://support.hp.com/us-en/document/ish_3875769-3873014-16 as that EULA is modified by the following:
“7. Term. Unless otherwise terminated earlier pursuant to the terms contained in this EULA, the license for the HP Wolf Pro
Security Edition (HP Sure Sense Pro and HP Sure Click Pro) is effective upon activation and will continue for either a twelve
(12) month or thirty-six (36) month license term (“Initial Term”). At the end of the Initial Term you may either (a) purchase a
renewal license for the HP Wolf Pro Security Edition from HP.com, HP Sales or an HP Channel Partner, or (b) continue using
the standard versions of HP Sure Click and HP Sure Sense at no additional cost with no future software updates or HP
Support.
34. HP Sure Click requires Windows 10 Pro or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
35. HP Sure Sense is available on select HP PCs and is not available with Windows10 Home.
36. HP Sure Start Gen6 is available on select HP PCs.
37. HP Sure Admin requires Windows 10, HP BIOS, HP Manageability Integration Kit from
http://www.hp.com/go/clientmanagement and HP Sure Admin Local Access Authenticator smartphone app from the Android
or Apple store.
38. HP Sure Recover Gen4 is available on select HP PCs and requires an open network connection. You must back up
important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data.
39. HP Sure Run Gen4 is available on select Windows 10 based HP Pro, Elite and Workstation PCs with select Intel® or AMD
processors.
40. Firmware TPM is version 2.0.
53. HP Smart Support is available to commercial customers through your HP Service Representative and HP Factory
Configuration Services; or it can be downloaded at: http://www.hp.com/smart-support. HP Smart Support automatically
collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and health
insights.
Technical Specifications
POWER
Power Supply
HP Smart 65 W USB Type-C® adapter 41
HP Smart 65 W Slim USB Type-C® adapter 41
Primary Battery
HP Long Life 4-cell, 54 Wh Li-ion polymer 42,43
HP Long Life 4-cell, 78.5 Wh Li-ion polymer 42,43
Power Cord
Premium 1m C5 power cord
Conventional 1m C5 power cord
Battery life 44
Up to 14 hours 45 minutes (54 Wh battery) (MobileMark2018).
Up to 22 hours (78 Wh battery) (MobileMark2018)
Product Dimensions (w x d x h)
12.57 x 7.98 x 0.65 in
31.93 x 20.26 x 1.66 cm
45. Weight will vary by configuration.
Technical Specifications
PORTS/SLOTS
Ports
2 Thunderbolt™ 4 with USB4™ Type-C® 40Gbps signaling rate (USB Power Delivery, DisplayPort™ 1.4)52
2 SuperSpeed USB Type-A 5Gbps signaling rate includes two charging port (USB 3.2 Gen 1)
1 HDMI 2.046
1 External Nano SIM Slot for WWAN 47
1 Headphone/Microphone Combo
48. HP Care Packs are sold separately. Service levels and response times for HP Care Packs may vary depending on your
geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit
http://www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or indicated
to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such
rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP
Product.
Technical Specifications
SYSTEM UNIT
Stand-Alone Power Nominal Operating AC 15V
Requirements (AC Power) Voltage
Average Operating Power
Integrated Graphics Yes
Discrete Graphics N/A
Max Operating Power UMA<65W
Temperature Operating 32° to 95° F (0° to 35° C) (not writing optical)
Non-operating 41° to 95° F (5° to 35° C) (writing optical)
Relative Humidity Operating 10% to 90%. (Non-Condensing)
Non-operating 5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock Operating 40 G, 2 ms, half-sine
Non-operating 200 G, 2 ms, half-sine
Random Vibration Operating 1.043 grms
Non-operating 3.5 grms
Altitude (unpressurized) Operating -50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating -50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry Standard UL Yes
Certifications CSA Yes
FCC Compliance Yes
ENERGY STAR® Yes
EPEAT Yes
ICES Yes
Australia Yes
NZ A-Tick Compliance Yes
CCC Yes
Japan VCCI Compliance Yes
KC Yes
BSMI Yes
CE Marking Compliance Yes
BNCI or BELUS Yes
CIT Yes
GOST Yes
Saudi Arabian Compliance Yes
(ICCP)
SABS Yes
UKRSERTCOMPUTER Yes
Technical Specifications
DISPLAYS
1. Actual brightness will be lower with touchscreen or Sure View.
NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may
vary either higher or lower.
Panel LCD 14 inch FHD Outline Dimensions (W x H x D) 313.67 X 184.17 mm (max)
(1920.x.1080) Anti-Glare Active Area 309.37 X 174.02 mm (typ.)
WLED UWVA sRGB 100% cg
400nits eDP 1.4+PSR2 bent LP Weight 200 g (max)
Diagonal Size 14.0 inch
Thickness 2.0 mm/3.8 mm (w/PCB) (max)
Interface eDP 1.4
Surface Treatment Anti-Glare
Touch Enabled Yes
Contrast Ratio 1200:1 (typ.)
Refresh Rate 60 Hz
Brightness 400 nits1
Pixel Resolution 1920 x 1080 (FHD)
Format RGB Stripe
Backlight LED
Color Gamut Coverage sRGB 100% (NTSC 72%)
Color Depth 8 bits
Viewing Angle UWVA 85/85/85/85
Panel LCD 14 inch FHD (1920 x Outline Dimensions (W x H x D) 313.67 X 184.17 mm (max)
1080) BrightView WLED UWVA Active Area 309.37 X 174.02 mm (typ.)
sRGB 100% cg 400nits eDP
Weight 200 g (max)
1.4+PSR2 bent LP
Diagonal Size 14.0 inch
Thickness 2.0 mm/3.8 mm (w/PCB) (max)
Interface eDP 1.4
Surface Treatment BrightView
Touch Enabled Yes
Contrast Ratio 1200:1 (typ.)
Refresh Rate 60 Hz
Brightness 400 nits 1
Technical Specifications
Panel LCD 14 inch UHD (3840 x Outline Dimensions (W x H x D) 313.61 X 184.74 mm (max)
2160) BrightView WLED UWVA
HDR-400 sRGB 95% cg 550nits Active Area 309.31 X 173.98 mm (typ.)
eDP 1.4+PSR2 bent
Weight 200 g (max)
Diagonal Size 14.0 inch
Thickness 2.0 mm/3.8 mm (w/PCB) (max)
Interface eDP 1.4
Surface Treatment BrightView
Touch Enabled Yes
Contrast Ratio 1400:1 (typ.)
Refresh Rate 60 Hz
Brightness 550 nits1
Panel LCD 14-in FHD (1920 x Outline Dimensions (W x H x D) 314.612 x 185.33 mm (max.)
1080) Anti-Glare WLED UWVA
72% cg 1000nits eDP 1.4+PSR Active Area 309.312 x 173.99 mm
PrivacyG4 NB2Y Weight 230 g (max.)
Diagonal Size 14.0”
Thickness 3.9 mm (max.)
Interface eDP
Surface Treatment Anti-glare
Touch Enabled Yes
Contrast Ratio 1500:1 (typ.)
Refresh Rate 60 Hz
Brightness 1000 nits1
Technical Specifications
Color Gamut Coverage 72% of NTSC
Color Depth 8 bits
Viewing Angle UWVA 85/85/85/85
Panel LCD 14-in FHD (1920 x Outline Dimensions (W x H x D) 314.612 x 185.33 mm (max.)
1080) BrightView WLED UWVA
72% cg 1000nits eDP 1.4+PSR Active Area 309.312 x 173.99 mm
PrivacyG4 NB2Y Weight 230 g (max.)
Diagonal Size 14.0”
Thickness 3.9 mm (max.)
Interface eDP
Surface Treatment BrightView
Touch Enabled Yes
Contrast Ratio 1500:1 (typ.)
Refresh Rate 60 Hz
Brightness 1000 nits1
Technical Specifications
STORAGE
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for windows 10
and 11) is reserved for system recovery software.
SSD 128GB 2280 PCIe-3x2 Form Factor M.2 2280
Three Layer Cell
Capacity 128 GB
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe Gen3X2
Maximum Sequential Read 1300 ~ 2047 MB/s
Maximum Sequential Write 630 ~ 800 MB/s
Logical Blocks 250,069,680
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security; DIPM; TRIM; DEVSLP
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
Technical Specifications
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software.
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
Technical Specifications
SSD 256GB 2280 PCIe-3x4 Form Factor M.2 2280
NVMe Self Encrypted OPAL2 Capacity 256 GB
Three Layer Cell
NAND Type TLC
Height 0.09 in (2.3 mm)
Width 0.87 in (22 mm)
Weight 0.02 lb (10 g)
Interface PCIe NVMe Gen3X4
Maximum Sequential Read 2800 ~ 3500 MB/s
Maximum Sequential Write 1663 ~ 2200 MB/s
Logical Blocks 500,118,192
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security (Option); TCG Opal 2.0; TRIM; L1.2
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
Technical Specifications
Maximum Sequential Read 1500 ~ 3500 MB/s
Maximum Sequential Write 1000 ~ 1600 MB/s
Logical Blocks 1,000,215,215
Operating Temperature 32° to 158°F (0° to 70°C) [ambient temp]
Features ATA Security (optional); TRIM; L1.2
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
Technical Specifications
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 30 GB (for Windows
10 and 11) is reserved for system recovery software
Technical Specifications
NETWORKING/COMMUNICATIONS
Intel® Wi-Fi1 6 AX201 and Wireless LAN Standards IEEE 802.11a
Bluetooth® 5.2 Wireless IEEE 802.11b
Card (802.11ax 2x2, IEEE 802.11g
vPro®, supporting
IEEE 802.11n
gigabit file transfer
speeds) vPro® IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Features Wi-Fi 6 technology
Frequency Band 802.11b/g/n/ax
•2.402 – 2.482 GHz
802.11a/n/ac/ax
•4.9 – 4.95 GHz (Japan)
•5.15 – 5.25 GHz
•5.25 – 5.35 GHz
•5.47 – 5.725 GHz
•5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac : 1733Mbps
• 802.11ax : max 2.4Gbps
Modulation Direct Sequence Spread Spectrum
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security3 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• WPA3 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
2
Output Power • 802.11b : +17dBm minimum
• 802.11g : +16dBm minimum
• 802.11a : +17dBm minimum
• 802.11n HT20(2.4GHz) : +14dBm minimum
• 802.11n HT40(2.4GHz) : +13dBm minimum
• 802.11n HT20(5GHz) : +14dBm minimum
Technical Specifications
• 802.11n HT40(5GHz) : +13dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
• 802.11ac VHT160(5GHz) : +10dBm minimum
• 802.11ax HE40(2.4GHz) : +12dBm minimum
• 802.11ax HE80(5GHz) : +10dBm minimum
• 802.11ax HE160(5GHz) : +10dBm minimum
Power Consumption •Transmit mode:2.0 W
•Receive mode:1.6 W
•Idle mode (PSP)180 mW (WLAN Associated)
•Idle mode:50 mW (WLAN unassociated)
•Connected Standby/Modern Standby: 10mW
•Radio disabled:8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 •802.11b, 1Mbps : -93.5dBm maximum
•802.11b, 11Mbps : -84dBm maximum
• 802.11a/g, 6Mbps : -86dBm maximum
• 802.11a/g, 54Mbps : -72dBm maximum
• 802.11n, MCS07 : -67dBm maximum
• 802.11n, MCS15 : -64dBm maximum
• 802.11ac, MCS0(VHT80) : -84dBm maximum
• 802.11ac, MCS9(VHT80) : -59dBm maximum
• 802.11ac, MCS9(VHT160) : -58.5dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
Technical Specifications
Frequency Band 2402 to 2480 MHz
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Data Rates and Legacy: 3 Mbps data rate1; throughput up to 2.17 Mbps
Throughput BLE: 1 Mbps data rate1; throughput up to 0.2 Mbps
1. Actual throughput may vary.
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
Technical Specifications
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi
6 (802.11ax) is backwards compatible with prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
5. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels.
Technical Specifications
Technical Specifications
• 802.11n HT40(5GHz) : +13dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
• 802.11ac VHT160(5GHz) : +10dBm minimum
• 802.11ax HE40(2.4GHz) : +12dBm minimum
• 802.11ax HE80(5GHz) : +10dBm minimum
• 802.11ax HE160(5GHz) : +10dBm minimum
Power Consumption •Transmit mode 2.0 W
•Receive mode 1.6 W
•Idle mode (PSP) 180 mW (WLAN Associated)
•Idle mode 50 mW (WLAN unassociated)
•Connected Standby 10mW
•Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 •802.11b, 1Mbps : -93.5dBm maximum
•802.11b, 11Mbps : -84dBm maximum
• 802.11a/g, 6Mbps : -86dBm maximum
• 802.11a/g, 54Mbps : -72dBm maximum
• 802.11n, MCS07 : -67dBm maximum
• 802.11n, MCS15 : -64dBm maximum
• 802.11ac, MCS0(VHT80) : -84dBm maximum
• 802.11ac, MCS9(VHT80) : -59dBm maximum
• 802.11ac, MCS9(VHT160) : -58.5dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
•802.11ax, MCS11(HE80): -54dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display
enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to
support WLAN MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 Mini Card with CNVi Interface
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED Off – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Card
Bluetooth Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant
Frequency Band 2402 to 2480 MHz
Technical Specifications
Number of Available Legacy: 0~79 (1 MHz/CH)
Channels BLE: 0~39 (2 MHz/CH)
Data Rates and Legacy: 3 Mbps data rate1; throughput up to 2.17 Mbps
Throughput BLE: 1 Mbps data rate1; throughput up to 0.2 Mbps
1. Actual throughput may vary.
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with
a maximum transmit power of + 9.5 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth Software Microsoft Windows Bluetooth Software
Supported
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles BT4.1-ESR 5/6/7 Compliance
Supported LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.2
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
Technical Specifications
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi
6 (802.11ax) is backwards compatible with prior 802.11 specs.
2. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
3. Check latest software/driver release for updates on supported security features.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
5. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels.
Technical Specifications
NXP NPC300 Near Field Dimensions (L x W x H) Module 17 mm by 10 mm by 2.0 mm
Communication Module
Chipset NPC300
System interface I2C
NFC RF standards ISO/IEC 14443 A
ISO/IEC 14443 B
ISO/IEC 15693
ISO/IEC 18092
ECMA-340 NFCIP-1 Target and Initiator
ECMA-320 NFCIP-2
NFC Forum Support Tag Type 1, Type 2, Type3 and Type 4, NFCIP-1 and NFCIP-2
Reader (PCD-VCD) ISO/IEC 14443 A
Mode(1) ISO/IEC 14443 B
ISO/IEC 15693
MIFARE 1K
MIFARE 4K
MIFARE DESFire
FeliCa
Jewel and Topaz cards
Card Emulation (PICC- ISO/IEC 14443 A
VICC) Mode(1) ISO/IEC 14443 B and B’
MIFARE
FeliCa
Frequency 13.56 MHz
NFC Modes Supported Reader/Writer, Peer-to-Peer
Raw RF Data Rates 106, 212, 424, 848 kbps
Operating temperature 0°C to 70°C
Storage temperature -20°C to 125°C
Humidity 10-90% operating
5-95% non-operating
Supply Operating 2.97 to 5.5 Volts
voltage
I/O Voltage 1.8V or 3.3V
Power Consumption
(Booster enable, VBAT=
3.3V, VCC_BOOST = 5V)
Mode Power Consumption, Typical (2)
Polling 7.3 mA
Detected Test Tag Type 1 32.9 mA
Detected Test Tag Type 2 70.7 mA
Detected Test Tag Type 3 79.2 mA
Detected Test Tag Type 4 64.9 mA
Antenna Antenna connector, 0.5mm pitch, 7 connector FPC. Antenna matching is
external to module.
Technical Specifications
1. With application or UICC support
2. Actual Power Consumption is dependent on NFC antenna and matching circuit and on the particular polling sequence and period
configured.
Technical Specifications
POWER
AC Adapter 65 Watt nPFC Dimensions 88 x 53.5 x 21mm
Slim USB type C Straight Weight unit: 220g +/- 10g
1.0 m
Input 100 to 240 VAC
Input Efficiency 81.5% min at 115 Vac/ 230Vac @ 5V/3A
86.7% min at 115 Vac/ 230Vac @ 9V/3A
88% min at 115 Vac/ 230Vac @ 12V/5A
89% min at 115 Vac/ 230Vac @ 15V/4.33A
89% min at 115 Vac/ 230Vac @ 20V/3.25A
Input frequency range 47 ~ 63 Hz
Input AC current 1.7 A at 90 VAC and maximum load
Output Output power 65W
DC output 5V/9V/12V/15V/20V
Hold-up time 5ms at 115 Vac input
Output current limit < 8.0A
Connector USB Type C
Environmental Design Operating temperature 32oFto 95oF (0oto 35oC)
Non-operating (storage) -4oFto 185oF (-20oto 85oC)
temperature
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 5% to 95%
Storage Humidity 5% to 95%
EMI and Safety Eg:
Certifications - CE Mark - full compliance with LVD and EMC directives
- Worldwide safety standards - IEC60950-1 and/or IEC62368-1, EN60950-
1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
- MTBF - over 200,000 hours at 25°C ambient condition.
Technical Specifications
Altitude 0 to 16,400 ft (0 to 5000m)
Humidity 20% to 95%
Storage Humidity 10% to 95%
EMI and Safety Eg:
Certifications - CE Mark - full compliance with LVD and EMC directives
- Worldwide safety standards - IEC60950-1 and/or IEC62368-1, EN60950-
1 and/or EN62368-1, UL60950-1 and/or UL62368-1 , Class1, SELV;
Agency approvals - C-UL-US, NORDICS, DENAN, EN55032 Class B, FCC
Class B, CISPR32 Class B, CCC, NOM-001 NYCE.
- MTBF - over 200,000 hours at 25°C ambient condition
Technical Specifications
FINGERPRINT Model:
Synaptics Validity VFS7604 touch sensor
READER
Mobile Voltage Operation:
3.0V to 3.6V
Operating Temperature:
0~60°C
Current Consumption Image:
100mA Max
Low Latency Wait For Finger:
260 uA
Capture Rate:
<30msec per image
ESD Resistance:
IEC 61000-4-2 4B (+/-15KV)
Detection Matrix:
363 dpi / 7.4x6mm sensor area
FRR (False Reject Rate) / FAR (False Acceptance Rate):
FRR <1% @ 1:50K FAR
Technical Specifications
ENVIRONMENTAL DATA
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be
& declarations labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
• TCO 8.0
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label*
Sustainable Impact • Ocean-bound plastic in Speaker Enclosure
Specifications • 23.88% post-consumer recycled plastic
• External Power Supply 90% Efficiency
• Low halogen
• Outside Box and corrugated cushions are 100% sustainably sourced and recyclable
• Molded Paper Pulp Cushion inside box is 100% sustainably sourced and recyclable
• Bulk packaging available
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Notebook model is based on a “Typically Configured Notebook”.
Energy Consumption
(in accordance with US
ENERGY STAR® test
method) 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Sort 6.90 W 7.08 W 6.97 W
idle)
Normal Operation (Long 0.77 W 0.83 W 0.76 W
idle)
Sleep 0.77 W 0.83 W 0.76 W
Off 0.35 W 0.31 W 0.29 W
NOTE:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is
for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.
Technical Specifications
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS)
directive - 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• This product is in compliance with the IEEE 1680 (EPEAT) standard at the Gold level, see
www.epeat.net
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product is 23.88% recycle-able when properly disposed of at end of life.
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to
Technical Specifications
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Bis(2-Ethylhexyl) phthalate (DEHP)
• Benzyl butyl phthalate (BBP)
• Dibutyl phthalate (DBP)
• Diisobutyl phthalate (DIBP)
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP offers end-of-life HP product return and recycling programs in many geographic areas. To recycle
and Recycling your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales
office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
Technical Specifications
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://h20195.www2.hp.com/V2/GetDocument.aspx?docname=c04755842
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
COUNTRY OF ORIGIN
China
Options and Accessories (sold separately and availability may vary by country)
Type Description Part #
Cases HP Business Slim 14.1 Top Load 2SC65AA, 2SC65UT, 2SC65ET
HP Executive 15.6 Backpack 6KD07AA, 6KD07UT, 6KD07ET
HP Executive Slim 14.1 Top Load 6KD04AA, 6KD04UT, 6KD04ET
Options and Accessories (sold separately and availability may vary by country)
Power HP USB Power Bank N9F71AA, N9F71UT
HP USB-C Essential Power Bank 3TB55AA, 3TB55UT
Summary of Changes
Copyright © 2022 HP Development Company, L.P. The only warranties for HP products are set forth in the express limited
warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Intel, Core and Intel vPro are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries. USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. ENERGY STAR is a registered
trademark of the U.S. Environmental Protection Agency. All other trademarks are the property of their respective owners.