SLOS074 − D2785, OCTOBER 1983 — REVISED JUNE 1988

• Matched Gain and Offset Between D OR P PACKAGE

Amplifiers (TOP VIEW)

• Unity-Gain Bandwidth . . . 3 MHz Min

OUT 1 8 VCC +
• Slew Rate . . . 1.5 V/ns Min AMP # 1 IN − 2 7 OUT
• Low Equivalent Input Noise Voltage IN + 3 6 IN − AMP # 2
VCC − 4 5 IN +
2 µV/Hz Max (20 Hz to 20 kHz)
• No Frequency Compensation Required
• No Latch Up symbol (each amplifier)
• Wide Common-Mode Voltage Range
•
+
Low Power Consumption IN+
OUT
•
−
IN−
Designed to be Interchangeable with
Raytheon RC4559

AVAILABLE OPTIONS
SYMBOLIZATION OPERATING
DEVICE PACKAGE TEMPERATURE VIO max
SUFFIX RANGE at 25°C

RC4559 D, P −0°C to 70°C 6 mV

The D packages are available taped and reeled. Add the suffix R to
the device type when ordering. (i.e.,RC4559DR)

description
The RC4559 is a dual high-performance operational amplifier. The high common-mode input voltage and the
absence of latch-up make this amplifier ideal for low-noise signal applications such as audio preamplifiers and
signal conditioners. This amplifier features a guaranteed dynamic performance and output drive capability that
far exceeds that of the general-purpose type amplifiers.
The RC4559 is characterized for operation from 0°C to 70°C.

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage VCC+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Supply voltage VCC − (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −18 V
Differential input voltage (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 30 V
Input voltage (any input, see Notes 1 and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 15 V
Duration of output short-circuit to ground, one amplifier at a time (see Note 4) . . . . . . . . . . . . . . . . . unlimited
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mW
Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 125°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the zero reference level (ground) of the supply voltages where the zero
reference level is the midpoint between VCC+ and VCC−.
2. Differential voltages are at the noninverting input terminal with respect to the inverting input terminal.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 volts, whichever is less.
4. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded.

Copyright  1991, Texas Instruments Incorporated

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1







 
  

electrical characteristics at specified free-air temperature, VCC+ = 15 V, VCC− = −15 V

PARAMETER TEST CONDITIONS† TA‡ MIN TYP MAX UNIT
25°C 2 6
VIO Input offset voltage VO = 0 mV
Full Range 7.5
25°C 5 100
IIO Input offset current VO = 0 nA
Full range 200
25°C 40 250
IIBI nput bias current VO = 0 nA
Full range 500
VI Input voltage range 25°C ± 12 ± 13 V
RL ≥ 3 kΩ 25°C ± 12 ± 13
VOM Maximum peak output voltlage swing RL = 600 Ω 25°C ± 9.5 ± 10 V
RL ≥ 2 kΩ Full range ± 10
VO = ± 10 V, 25°C 20 300
VI Input voltage range V/mV
RL = 2 kΩ Full range 15
VOPP = 20 V,
BOM Maximum output-swing bandwidth 25°C 24 32 kHz
RL = 2 kΩ
B1 Unity-gain bandwidth 25°C 3 4 MHz
ri Input resistance 25°C 0.3 1 MΩ
CMRR Common-mode rejection ratio VO = 0 25°C 80 100 dB
kSVS Supply voltage sensitivity (∆VIO/∆VCC) VO = 0 25°C 10 75 µV/V
AVD = 100,
Vn Equivalent input noise voltage (closed loop) RS = 1 kΩ, 25°C 1.4 2 µV
f = 20 Hz to 20 kHz
In Equivalent input noise current f = 20 Hz to 20 kHz 25°C 25 pA
25°C 3.3 5.6
ICC Supply current (both amplifiers) No load, No signal 0°C 4 6.6 mA
70°C 3 5
AVD = 100,
Vo1/Vo2 Crosstalk attentuation RS = 1 kΩ, 25°C 90 dB
f = 10 kHz
† All characteristics are specified under open-loop operation, unless otherwise noted.
‡ Full range operating free-air temperature range is 0°C to 70°C.

matching characteristics at VCC+ = 15 V, VCC− = −15 V, TA = 25°C

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIO Input offset voltage VO = 0 ± 0.2 mV
IIO Input offset current VO = 0 ± 7.5 nA
IIB Input bias current VO = 0 ± 15 nA
AVD Large-signal differential voltage amplification VO = ± 10 V, RL = 2 kΩ ±1 dB

operating characteristics, VCC+ = 15 V, VCC− = −15 V, TA = 25°C

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tr Rise time VI = 20 mV, RL = 2 kΩ, CL = 100 pF 80 µs
Overshoot 18%
SR Slew rate at unity gain VI = 10 mV, RL = 2 kΩ, CL = 100 pF 1.5 2 V/µs

2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

 PACKAGE OPTION ADDENDUM

www.ti.com 14-Aug-2021

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

RC4559D ACTIVE SOIC D 8 75 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 RC4559

RC4559DR ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 RC4559

RC4559P ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 RC4559P

RC4559PE4 ACTIVE PDIP P 8 50 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 RC4559P

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 14-Aug-2021

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
RC4559DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
RC4559DR SOIC D 8 2500 340.5 336.1 25.0

Pack Materials-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

TUBE

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
RC4559D D SOIC 8 75 507 8 3940 4.32
RC4559P P PDIP 8 50 506 13.97 11230 4.32
RC4559PE4 P PDIP 8 50 506 13.97 11230 4.32

Pack Materials-Page 3
 PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1

.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]

4X (0 -15 )

4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4

.005-.010 TYP
[0.13-0.25]

4X (0 -15 )

SEE DETAIL A
.010
[0.25]

.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]

4214825/C 02/2019

NOTES:

1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.

www.ti.com
 EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:8X

SOLDER MASK SOLDER MASK

METAL METAL UNDER
OPENING OPENING SOLDER MASK

EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND

NON SOLDER MASK SOLDER MASK

DEFINED DEFINED

SOLDER MASK DETAILS

4214825/C 02/2019

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com
 EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT

8X (.061 )
[1.55] SYMM

1
8

8X (.024)
[0.6] SYMM

(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]

SOLDER PASTE EXAMPLE

BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X

4214825/C 02/2019

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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