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The document discusses Mitsubishi's 3rd generation Dual-in-line Package Intelligent Power Modules (DIP-IPM) and Mini-DIP-IPM product lines. It provides details on their features such as chip and package technologies, voltage and current ratings, electrical and thermal specifications, and available package options.

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Datasheet

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Luz Del Alba Luciano
73 views2 pages
The document discusses Mitsubishi's 3rd generation Dual-in-line Package Intelligent Power Modules (DIP-IPM) and Mini-DIP-IPM product lines. It provides details on their features such as chip and package technologies, voltage and current ratings, electrical and thermal specifications, and available package options.

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The document discusses Mitsubishi's 3rd generation Dual-in-line Package Intelligent Power Modules (DIP-IPM) and Mini-DIP-IPM product lines. It provides details on their features such as chip and package technologies, voltage and current ratings, electrical and thermal specifications, and available package options.

Copyright:

© All Rights Reserved
Download as PDF, TXT or read online from Scribd
Download as pdf or txt
73 views2 pages

Datasheet

Uploaded by

Luz Del Alba Luciano
The document discusses Mitsubishi's 3rd generation Dual-in-line Package Intelligent Power Modules (DIP-IPM) and Mini-DIP-IPM product lines. It provides details on their features such as chip and package technologies, voltage and current ratings, electrical and thermal specifications, and available package options.

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2.

10 3rd Generation DIP and Mini-DIP-IPM (Dual-in-line Package Intelligent Power Modules)

Features:

• Employing 5th generation planar IGBT chips with 0.6µm design rule
or CSTBT™ technology with superior loss performance
• Ultra compact dual or single-in-line transfer mold package
(compatible with 2nd generation)
• Including driver and protection circuitry (UV, SC)
• DIP-IPM with reduction of thermal resistance by 20%
• 2500Vrms isolation voltage
• High-active interface logic for direct connection to a 3V or 5V MCU
• Highest reliability and optimised EMI performance
• Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW
• Optional with open emitter topology for vector control
• All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals
• From January 2006 onwards, all DIP and Mini-DIP-IPMs will
be supplied with completely lead-free technology

Line-up DIP, Mini-DIP & SIP-IPM


Motor Rating (kW)
2. Type Isolation Voltage
(V)
VCES
(V)
0.1 0.2 0.4 0.75 1.5 2.2 3.7

Super-DIP PS21065 PS21067 PS21069

DIP PS21864-P PS21865-P PS21867-P PS21869-P


2500 600
PS21562-P PS21563-P PS21564-P
Mini-DIP
PS21562-SP* PS21563-SP* PS21564-SP*

PS21661-FR
SIP
PS21661-RZ

* Open Emitter Topology

Thermal & Mechanical


Electrical Characteristics Characteristics
Applicable Isolation VCE(sat) Typical Switching Times IGBT Diode Package-
Type Number VCES IC fC @ Tj=25°C
Motor Ratings Voltage ton trr tc(on) toff tc(off) Rth(j-f) Rth(j-f) No.
(V) (A) (kHz) (V)
(kW) (V) Typ. Max. (µs) (µs) (µs) (µs) (µs) (°C/W) (°C/W)
Mini-DIP-IPM 600 Volt
PS21562-P 600 0.2 5 20 2500 1.6 2.1 1.20 0.30 0.40 1.30 0.50 6.0 6.5 D4
PS21563-P 600 0.4 10 20 2500 1.6 2.1 1.20 0.30 0.40 1.40 0.50 5.0 6.5 D4
PS21564-P 600 0.75 15 20 2500 1.45 1.95 1.20 0.30 0.40 1.50 0.50 4.5 6.5 D4
DIP-IPM 600 Volt
PS21864-P 600 0.75 15 20 2500 1.7 2.2 1.50 0.30 0.50 1.40 0.50 2.30 3.2 D3
PS21865-P 600 1.5 20 20 2500 1.6 2.1 1.30 0.30 0.40 1.60 0.50 1.90 3.0 D3
PS21867-P 600 2.2 30 20 2500 1.6 2.1 1.30 0.30 0.40 1.70 0.50 1.65 3.0 D3
PS21869-P 600 3.7 50 20 2500 1.5 2.0 1.30 0.30 0.40 2.00 0.65 1.42 2.0 D3
Mini-DIP-IPM 600 Volt With Open Emitter Topology
PS21562-SP 600 0.2 5 20 2500 1.6 2.1 1.20 0.30 0.40 1.30 0.50 6.0 6.5 D5
PS21563-SP 600 0.4 10 20 2500 1.6 2.1 1.20 0.30 0.40 1.40 0.50 5.0 6.5 D5
PS21564-SP 600 0.75 15 20 2500 1.45 1.95 1.20 0.30 0.40 1.50 0.50 4.5 6.5 D5
Super-DIP-IPM 600 Volt With Open Emitter TopologySIP-IPM 600 Volt
PS21065 600 1.5 20 20 2500 1.6 2.1 1.30 0.30 0.40 1.60 0.50 1.90 2.85 D6*
PS21067 600 2.2 30 20 2500 1.6 2.1 1.30 0.30 0.40 1.70 0.50 1.65 2.55 D6*
PS21069 600 3.7 50 20 2500 1.5 2.0 1.30 0.30 0.40 2.00 0.65 1.42 2.30 D6*
SIP-IPM 600 Volt
PS21661-RZ/-FR 600 0.1 3 15 2500 1.6 2.15 0.85 0.20 0.35 1.00 0.55 9.0 9.0 SIP1
* Package drawing D6 see under 2.8. 1200V DIP-IPM, p. 50

54 Power Devices General Catalogue 2005


2.10 3rd Generation DIP and Mini-DIP-IPM

Package D3 Package D4

2.

Package D5 Package SIP1

Dimensions in mm

www.mitsubishichips.com · www. mitsubishielectric.de 55

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