Number

2.1.1.2
ASSOCIATION CONNECTING Subject
ELECTRONICS INDUSTRIES Microsectioning—Semi or Automatic Technique
2215 Sanders Road Microsection Equipment (Alternate)
Northbrook, IL 60062-6135
Date Revision
05/04 A
Originating Task Group
IPC-TM-650 Rigid Printed Board Performance Task Group
TEST METHODS MANUAL (D-33a)

1 Scope This procedure is an alternate method for prepar- 4.8 Explosion proof fume hood for mounting material.
ing multiple metallographic specimen(s) using microsection
equipment. The specimen(s) is(are) for evaluation for quality of 4.9 Microsection equipment (see IPC-MS-810 for purchas-
the laminate system, plated-through holes (PTHs), the copper ing guidelines).
foils, platings, and/or coatings. The same basic procedure
may be used for examination of other areas on the product. 4.10 Metricated abrasive paper P100–P1200 (American grit
range: 100–600).
Note: This microsection technique is a process and not a test
method. 4.11 Polishing cloths.
Note: SAFETY The use of the materials listed in Section 4
may be limited or forbidden in some environments. Please 4.12 Diamond abrasive (1.0 µm - 9.0 µm [39.4 µin -
review the Material Safety Data Sheet (MSDS) for the materi- 354 µin]) or oxide abrasive (3.0 µm - 0.1 µm [118 µm -
als being used. 3.94 µin].

2 Applicable Documents 4.13 Polishing lubricant.

IPC-MS-810 Guidelines for Semi-Automatic Microsection 4.14 Micro-etch solution.

IPC-6012 Qualification and Performance Specification for
4.15 Micro-etch applicator (optional).
Rigid Printed Boards

4.16 Engraver (optional).

3 Test Specimens Remove the required specimen(s) from
the product to be tested. Allow sufficient clearance to prevent
5 Procedure and Evaluation
damage to the area and PTHs to be examined. The recom-
mended clearance from the pad edge to the cut surface is
5.1 Procedure
2.54 mm [0.100 in]. Abrasive cut-off wheels can cut closer to
the sample without damaging the area to be examined.
5.1.1 The semi or automatic microsection technique is a
process and not a test method. Microsectioning needs to be
4 Apparatus
viewed as a process with quality criteria as each major step is
completed. This procedure specifies the quality criteria that
4.1 Sample removal method (see IPC-MS-810 for best
must be met to make microsections that can consistently find
method).
the defects (or anomalies) of concern. The customer should
not specify the process steps and materials but the quality
4.2 Sample alignment tools.
criteria for surface preparation of the specimen.

4.3 Mount molds.

5.1.2 Preparation of Specimen(s) Remove the specimen
from the PCB or panel such that the tooling pin holes or tar-
4.4 Mounting surface. get PTHs are not damaged. Complete any thermal testing
required by the customer.
4.5 Vacuum/pressure system (optional).
5.1.3 Inspect Tooling Pin System Inspect the tooling pin
4.6 Release agent (optional). holes or slots to verify they are not plugged or damaged. Clear
plugged tooling pin holes with a tool that will not change its
4.7 Potting material (recommended maximum cure tem- dimensional location or enlarge the hole. A drill bit of the same
perature is 93 °C [200 °F]). hole diameter is recommended.

Material in this Test Methods Manual was voluntarily established by Technical Committees of IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this Page 1 of 4
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by IPC.
 IPC-TM-650
Number Subject Date
2.1.1.2 Microsectioning—Semi or Automatic Technique Microsection 05/04
Equipment (Alternate)
Revision
A

Inspect the tooling pins for foreign material adhering to them. the mounts being processed. See IPC-MS-810 for a detailed
Clean the pin surface as required. Discard any pins that are discussion and examples.
bent or the surface scarred.
The recommended pressure setting for six mounts at
38.1 mm [1.5 in] diameter is 351.5 g/sq. cm (5.0 psi) with the
5.1.4 Load Specimen On Tooling Pins The pins align the
wheel RPMs between 300–600.
target PTHs on a common plane. This common plane assures
all the PTHs will grind to the center of the hole at the same
5.1.8.3 Other Variables Recommended variables to be
instance.
familiar with are length of time the abrasive paper removes
Push the tooling pins into the tooling holes or slots. The pins material efficiently, scratch size the abrasive paper causes on
must fit snugly. the specimen(s) surface, and water quality (undissolved par-
ticles that can cause scratches; i.e., calcium deposits).
5.1.5 Potting the Specimen(s) The potting material must
have a low shrink rate, and the cure temperature must be less 5.1.9 Grind the Mounts Be liberal with the amount of
than 93 °C [200 °F] at the center of the mount to prevent false water used to promote efficient removal of material by the
failures. Mold release may be applied to the mount to permit abrasive paper. The hardness of the specimen will dictate the
easy removal of the cured mounting material (optional). Thor- number of rough and fine grind steps needed to reach near
oughly mix the potting material without trapping air and pour the center of the hole. The rough grind grits P180-P240
into the mold. Assure the tooling pins do not shift position or (American 180-240) are used to enter the edge of the PTH,
rise up while pouring and/or curing of the potting material. If and the fine grind grits P800-P1200 (American 400-600) are
necessary to avoid voids in the finished mount and to insure used to grind near the center of the hole. The distance to stop
adequate hole filling, evacuate the mount before cure using a short of the center is determined by the scratch size of the last
vacuum system. Allow the potting material to cure and return grind step used.
to ambient temperature before removing from the mount.
A recommended grinding process from which to start devel-
Remove the hardened mounts from their molds (as appli-
opment is:
cable).

5.1.6 Traceability The mount/specimen must be perma- Step 1 Step 2 Step 3

nently marked in such a manner to ensure traceability back to Abrasive grit size P180 P 400(opt) P1000
the PCB or panel. If the mounts are cured within the mount RPM 200–300 200–300 200–300
holder, traceability is not required until the mounts are Pressure (g/sq.cm) 351.5 351.5 351.5
removed from the holder. Time 15 seconds after the stops touch

5.1.7 Mount Quality The minimum qualities the mount

must exhibit are no gaps between the potting material and the 5.1.9.1 Clean the Mounts Clean the mount surface with a
specimen, the PTHs filled with material, and no bubbles in the mild hand soap to remove the abrasive grit. This is especially
potting material in the areas of examination. important when the same mount holder is used for grinding
and polishing. Be careful not to scratch the surfaces to be
5.1.8 Grind Process Set-Up evaluated while cleaning.

5.1.8.1 Tooling Stops The mount holder has tooling stops 5.1.10 Grind Quality The minimum qualities the mount
to allow the equipment to grind a set distance. These stops must exhibit are:
must be calibrated for each abrasive paper grit to assure the 1) The target PTHs are ground to the center of the PTHs as
scratches from the previous step are removed. See IPC-MS- defined by the customer’s specification.
810 for a detailed discussion and examples. 2) Only fine grind scratches apparent on the mount when
viewed at 100X magnification.
5.1.8.2 Grind Pressure The equipment’s pressure setting 3) No gap between the potting material and the specimen(s).
is the direct force on a load cell. To determine the pressure on 4) No residual abrasive paper grit material on the mount sur-
each mount, divide the pressure setting by the surface area of face.

Page 2 of 4
 IPC-TM-650
Number Subject Date
2.1.1.2 Microsectioning—Semi or Automatic Technique Microsection 05/04
Equipment (Alternate)
Revision
A

5) The ground surface has only one plane of material removal. setting for the same surface areas as 5.1.12 are a medium to
If the mount has several planes of material removal, por- soft polish cloth, low wheel RPM (100-200), and low pressure
tions of the sample will not polish since the odd surface setting 351.5 g/sq. cm (5.0 psi) or less. Additional variables
never touches the polishing cloth. that must be considered are volume of lubricant, type of nap
surface on polish cloth, and process times. The type of abra-
5.1.11 Polish Process Setup The tooling stops are sive used must be diamond (maximum rated size: 1.0 µm
recessed or removed from the mount holder during polishing. [39.4 µin]) or colloidal silica.
The reason is the polish process removes a negligible amount
Warning
of material and will not change the flatness of the surface. The
number of polish steps is determined by the hardness of the If a high nap polish cloth is used too long in the final pol-
specimen(s), distance to the center of the hole, and scratch ish, the inspectors ability to see defects can be hampered.
size of the last fine grind step. There may be multiple interme- This step must be engineered for short process times (30
diate polish steps but only one final polish step. seconds or less) with a careful balance of lubricant to pre-
vent copper rounding.
5.1.12 Intermediate Polish Steps The intermediate steps
must remove the fine grind scratches and prepare the surface 5.1.13.1 Clean the Mount This last clean step must
for the final polish step. The recommended process settings remove all the contaminants as described in 5.1.12.1 and the
for six mounts at 38.1 mm [1.5 in] diameter is less than polish lubricant. The lubricant film will prevent even microetch-
351.5 g/sq. cm (5.0 psi), a medium to hard polish cloth, short ing of the specimen(s).
nap surface, and low wheel RPM (100–200). Additional vari-
ables that must be considered are volume of lubricant, lubri- 5.1.14 Traceability If the mounts are cured in the mount
cant types, abrasive size, abrasive type (diamond or oxide), holder, remove the mounts. The mount/specimen must be
and process time. permanently marked in such a manner to ensure traceability
back to the PCB or panel.
A recommended polish process from which to start develop-
ment is: 5.1.15 Polish Quality The surface qualities of a properly
prepared microsection mount are:
Step 1 Step 2 Step 3
1. The target PTHs are ground to the center of the PTH as
Type of cloth Napless Napless Nap
defined by the customer’s specifications.
Type of polish abrasive Diamond Diamond Diamond
2. No scratches larger than 1.0 µm [39.4 µm] on the metal
Polish abrasive size 6.0 µm 1.0 µm 1.0 µm
[236 µin] [39.4 µin] [39.4 µin] surface to be examined (i.e., copper).
Time — — 30 sec 3. No smear of metals (i.e., copper, tin/lead, nickel) over other
max. metals, board base material, and/or potting material.
Pressure (g/sq. cm) 351.5 or 351.5 or 351.5 or
4. No rounding of metal surfaces (i.e., copper) in the PTH.
less less less
5. No gaps between the specimen(s) and potting material.
5.1.12.1 Clean the Mount(s) The mounts must be Rounding of metal surfaces is apparent as the material edge
cleaned between each polish step. The reason is to prevent being out of focus at 100X magnification on the metallograph
contaminating the next polish step with the current grit size. If or shaded a charcoal black color.
the polish step is contaminated, the step will produce unde-
sirable scratches. Clean the mounts with mild hand soap, 5.2 Evaluation Method
rinse with water, and dry. Do not scratch the surface to be
evaluated when cleaning. 5.2.1 Separation Evaluation Evaluate the PTHs for inner-
layer separation prior to microetch. Any observations need to
5.1.13 Final Polish the Mounts The final polish step be reinspected after etch. The separations noted in the
removes the scratches from intermediate polishing and pre- unetched and microetched conditions will not necessarily cor-
pares the surface for evaluation. The recommended process relate one to one.

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 IPC-TM-650
Number Subject Date
2.1.1.2 Microsectioning—Semi or Automatic Technique Microsection 05/04
Equipment (Alternate)
Revision
A

5.2.2 Microetch the Specimen Swab or dip the speci-

men into a suitable microetching solution and rinse with run-
U.S.A. EUROPEAN
ning water. The recommended etching solutions and formula- CAMI NEW "P"
tions are listed in IPC-MS-810. The etch time will vary with the GRADE GRADE Excerpt from Struers Catalog
600 ration Europeenne des
type of etchant chosen to microetch the sample. P1200 Fabri-cants des Produits
500 P1000 Abrasifs (FEPA) and gives the
400 P800 grain sizes in µm.
5.2.3 Evaluation Evaluate the average thickness of the 360
P600 The silicon carbide powders of
P500 STRUERS wet-grinding papers
plated metals and determine PTH quality per the customer’s 320 P400 are classified to FEPA grades,
specifications. 280 P360 and specifically to the P-series.
P320
240 P280
P240
220 P220
6 Notes
180 P180
150 P150
6.1 Diamond Polish The diamond polish media is pre- 120
P120
ferred over alumina for PCBs being evaluated to IPC-6012 100
P100
80
Class 2 and 3 products. Diamond media substantially reduces P80
60 P60
the risk of metal smear and rounding. Diamonds provide a P50
50
sharper definition of copper surfaces to evaluate for separa- 40 P40

tion of conductive surfaces. 36 P36

30 P30

24
6.2 Etchants The two most common microetchants for P24
20 P20
copper are ammonium hydroxide/hydrogen peroxide and
16 P16
sodium dichromate etchant. Both have benefits and draw- 12 P12

backs that must considered when making a choice (see IPC- IPC-2112-1
MS-810).
Figure 1 Abrasive paper grit size (American vs.
European)
6.3 Abrasive Paper The abrasive grit size has different
designators (Metricated versus American). Figure 1 tabulates
the correlation between grades.

6.4 See IPC-MS-810 for photomicrographs illustrating

acceptable and unacceptable polish quality.

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