IEC61158-2 Physical Layer Specification
IEC61158-2 Physical Layer Specification
IEC61158-2 Physical Layer Specification
STANDARD 61158-2
Third edition
2003-05
Part 2:
Physical layer specification
and service definition
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CONTENTS
FOREWORD......................................................................................................................... 12
Introduction........................................................................................................................... 15
1 Scope ............................................................................................................................. 19
2 Normative references ...................................................................................................... 20
3 Terms and definitions ...................................................................................................... 22
3.1 Common terms and definitions............................................................................ 22
3.2 Type 1: Terms and definitions ............................................................................. 26
3.3 Type 2: Terms and definitions ............................................................................. 27
3.4 Type 3: Terms and definitions ............................................................................. 30
3.5 Type 4: Terms and definitions ............................................................................. 31
3.6 Type 6: Terms and definitions ............................................................................. 31
3.7 Type 8: Terms and definitions ............................................................................. 32
4 Symbols and abbreviations ............................................................................................. 35
4.1 Symbols ............................................................................................................. 35
4.2 Abbreviations...................................................................................................... 37
5 DLL – PhL interface ........................................................................................................ 44
5.1 General .............................................................................................................. 44
5.2 Type 1: Required services .................................................................................. 44
5.3 Type 2: Required services .................................................................................. 46
5.4 Type 3: Required services .................................................................................. 49
5.5 Type 4: Required services .................................................................................. 50
5.6 Type 6: Required services .................................................................................. 52
5.7 Type 8: Required services .................................................................................. 54
6 Systems management – PhL interface ............................................................................ 62
6.1 General .............................................................................................................. 62
6.2 Type 1: Systems management – PhL interface ................................................... 62
6.3 Type 3: Systems management – PhL interface ................................................... 64
6.4 Type 4: Systems management – PhL interface ................................................... 69
6.5 Type 6: Systems management – PhL interface ................................................... 70
6.6 Type 8: Systems management – PhL interface ................................................... 71
7 DCE Independent Sublayer (DIS) .................................................................................... 76
7.1 General .............................................................................................................. 76
7.2 Type 1: DIS ........................................................................................................ 76
7.3 Type 3: DIS ........................................................................................................ 76
7.4 Type 6: DIS ........................................................................................................ 76
7.5 Type 8: DIS ........................................................................................................ 77
8 DTE – DCE interface and MIS-specific functions ............................................................. 79
8.1 General .............................................................................................................. 79
8.2 Type 1: DTE – DCE interface.............................................................................. 79
8.3 Type 3: DTE – DCE interface.............................................................................. 89
8.4 Type 8: MIS – MDS Interface .............................................................................. 90
9 Medium Dependent Sublayer (MDS) ............................................................................. 100
9.1 General ............................................................................................................ 100
9.2 Type 1: MDS: Wire and optical media ............................................................... 100
9.3 Type 1: MDS: Low speed radio medium ............................................................ 104
61158-2 IEC:2003(E) –3 –
Figure 69 – Test circuit for power distribution through an IS barrier .................................... 161
Figure 70 – Test circuit for multiple output supplies with signal coupling ............................. 162
Figure 71 – Fieldbus coupler............................................................................................... 164
Figure 72 – Protection resistors .......................................................................................... 165
Figure 73 – Test configuration for current-mode MAU ......................................................... 171
Figure 74 – Transmitted and received bit cell jitter (zero crossing point deviation) .............. 172
Figure 75 – Noise test circuit for current-mode MAU ........................................................... 174
Figure 76 – Transmitted and received bit cell jitter (zero crossing point deviation) .............. 183
Figure 77 – Power supply harmonic distortion and noise ..................................................... 185
Figure 78 – Optical wave shape template............................................................................ 190
Figure 79 – Cellular radio topology and reuse of frequencies .............................................. 199
Figure 80 – Radio segment between wired segments topology............................................ 200
Figure 81 – Mixed wired and radio medium fieldbus topology.............................................. 201
Figure 82 – Gaussian Minimum Shift Keying modulation with Bn = 0,41 .............................. 203
Figure 83 – Radio envelope using GMSK ............................................................................ 203
Figure 84 – Components of 5 Mbit/s, voltage-mode, coaxial wire PhL variant...................... 207
Figure 85 – Coaxial wire MAU block diagram ...................................................................... 208
Figure 86 – Coaxial wire MAU transmitter ........................................................................... 208
Figure 87 – Coaxial wire MAU receiver operation................................................................ 209
Figure 88 – Coaxial wire MAU transmit mask ...................................................................... 210
Figure 89 – Coaxial wire MAU receive mask ....................................................................... 211
Figure 90 – Transformer symbol ......................................................................................... 212
Figure 91 – 5Mbit/s, voltage-mode, coaxial wire topology example ..................................... 214
Figure 92 – Coaxial wire medium topology limits ................................................................. 215
Figure 93 – Coaxial wire medium tap electrical characteristics ............................................ 216
Figure 94 – MAU block diagram 5 Mbit/s, optical fibre medium ........................................... 219
Figure 95 – NAP reference model ....................................................................................... 223
Figure 96 – Example of transient and permanent nodes ...................................................... 224
Figure 97 – NAP transceiver ............................................................................................... 225
Figure 98 – NAP cable ........................................................................................................ 226
Figure 99 – Power supply ripple and noise.......................................................................... 232
Figure 100 – Repeater in linear bus topology ...................................................................... 237
Figure 101 – Repeater in tree topology ............................................................................... 237
Figure 102 – Example for a connector with integrated inductance ....................................... 239
Figure 103 – Interconnecting wiring .................................................................................... 239
Figure 104 – Bus Terminator............................................................................................... 240
Figure 105 – Connection to the optical network................................................................... 242
Figure 106 – Principle structure of optical networking ......................................................... 243
Figure 107 – Definition of the standard optical link .............................................................. 244
Figure 108 – Signal template for the optical transmitter....................................................... 249
Figure 109 – Recommended interface circuit ...................................................................... 253
Figure 110 – Minimum interconnecting wiring...................................................................... 256
Figure 111 – RS-485 Phsegment termination network ..................................................... 257
Figure 112 – Example for a connector with integrated inductance ....................................... 258
Figure 113 – Maximum single Ph-segment bus topology ..................................................... 259
Figure 114 – Example maximum linear bus topology with four Ph-segments ....................... 260
61158-2 IEC:2003(E) –7 –
Figure 115 – Example star topology with six Ph-segments .................................................. 260
Figure 116 – MAU of an outgoing interface ......................................................................... 261
Figure 117 – MAU of an incoming interface......................................................................... 261
Figure 118 – Remote bus link ............................................................................................. 262
Figure 119 – Interface to the transmission medium ............................................................. 262
Figure 120 – Wiring ............................................................................................................ 265
Figure 121 – Terminal resistor network ............................................................................... 265
Figure 122 – Fibre optic remote bus cable .......................................................................... 266
Figure 123 – Optical fibre remote bus link ........................................................................... 267
Figure 124 – Optical wave shape template optical MAU ...................................................... 268
Figure A.1 – Internal fieldbus connector .............................................................................. 273
Figure A.2 – Contact designations for the external connector for harsh industrial environments 275
Figure A.3 – External fieldbus connector keyways, keys, and bayonet pins and grooves ..... 275
Figure A.4 – External fieldbus connector intermateability dimensions.................................. 276
Figure A.5 – External fieldbus connector contact arrangement ............................................ 277
Figure A.6 – Contact designations for the external connector for typical industrial
environments ...................................................................................................................... 278
Figure A.7 – External fixed (device) side connector for typical industrial environments:
dimensions ...................................................................................................................... 278
Figure A.8 – External free (cable) side connector for typical industrial environments:
dimensions ...................................................................................................................... 279
Figure A.9 – Optical connector for typical industrial environments (FC connector) .............. 279
Figure A.10 – Optical connector for typical industrial environments (ST connector)............. 280
Figure C.1 – Example of an optical passive reflective star................................................... 283
Figure C.2 – Example of an optical passive transmitive star ................................................ 283
Figure D.1 – Example of star topology with 31,25 kbit/s, single fibre mode, optical MAU ..... 284
Figure D.2 – Multi-star topology with an optical MAU .......................................................... 284
Figure D.3 – Example of mixture between wire and optical media for a 31,25 kbit/s bit rate 286
Figure D.4 – Example of mixture between wire and optical media ....................................... 287
Figure F.1 – Pin connector for short range optical medium.................................................. 290
Figure F.2 – Crimp ring for short range optical medium ....................................................... 290
Figure G.1 – PhL repeater device reference model ............................................................. 293
Figure G.2 – Reference model for redundancy .................................................................... 295
Figure G.3 – Block diagram showing redundant coaxial medium and NAP .......................... 296
Figure G.4 – Block diagram showing ring repeaters ............................................................ 297
Figure G.5 – Segmentation query ....................................................................................... 298
Figure G.6 – Segmentation response .................................................................................. 298
Figure G.7 – Main switch state machine.............................................................................. 300
Figure G.8 – Port 1 sees network activity first ..................................................................... 301
Figure G.9 – Port 2 sees network activity first ..................................................................... 302
Figure H.1 – Coaxial wire MAU R XD ATA detector ................................................................ 304
Figure H.2 – Coaxial wire MAU R XC ARRIER detection .......................................................... 305
Figure H.3 – Redundant coaxial wire MAU transceiver ........................................................ 305
Figure H.4 – Single channel coaxial wire MAU transceiver .................................................. 306
Figure H.5 – Coaxial wire medium tap................................................................................. 307
Figure H.6 – Non-isolated NAP transceiver ......................................................................... 308
Figure H.7 – Isolated NAP transceiver ................................................................................ 308
–8– 61158-2 IEC:2003(E)
Table 78 – Transmit and receive level and spectral specifications for an optical active star 194
Table 79 – Timing characteristics of an optical active star................................................... 194
Table 80 – Transmit level and spectral specification summary ............................................ 196
Table 81 – Transmit and receive level and spectral specifications for an optical active star 197
Table 82 – Interfering frequencies for testing receiver performance .................................... 206
Table 83 – Transmit control line definitions 5 Mbit/s, voltage-mode, coaxial wire ................ 208
Table 84 – Receiver data output definitions: 5 Mbit/s, voltage-mode, coaxial wire ............... 209
Table 85 – Receiver carrier output definitions: 5 Mbit/s, voltage-mode, coaxial wire............ 209
Table 86 – Coaxial wire medium interface – transmit specifications .................................... 210
Table 87 – Coaxial wire medium interface – receive............................................................ 211
Table 88 – Coaxial wire medium interface – general ........................................................... 212
Table 89 – 5 Mbit/s, voltage-mode, coaxial wire transformer electrical specifications .......... 213
Table 90 – Coaxial spur cable specifications....................................................................... 217
Table 91 – Coaxial trunk cable specifications...................................................................... 218
Table 92 – Transmit control line definitions 5 Mbit/s, optical fibre medium .......................... 220
Table 93 – Fibre medium interface 5,0 Mbit/s, optical ......................................................... 220
Table 94 – Fibre signal specification 5 Mbit/s, optical medium, short range......................... 221
Table 95 – Fibre signal specification 5 Mbit/s, optical medium, medium range .................... 221
Table 96 – Fibre signal specification 5 Mbit/s, optical medium, long range .......................... 222
Table 97 – NAP requirements ............................................................................................. 224
Table 98 – Network powered device characteristics for the 31,25 kbit/s voltage-mode
MAU ................................................................................................................................... 230
Table 99 – Network power supply requirements for the 31,25 kbit/s voltage-mode MAU..... 231
Table 100 – Cable specifications ........................................................................................ 238
Table 101 – Maximum cable length for the different transmission speeds ........................... 238
Table 102 – Characteristic Features ................................................................................... 242
Table 103 – Characteristics of optical transmitters for multi-mode glass fibre...................... 245
Table 104 – Characteristics of optical transmitters for single-mode glass fibre .................... 246
Table 105 – Characteristics of optical transmitters for plastic fibre ...................................... 246
Table 106 – Characteristics of optical transmitters for 200/230 glass fibre .......................... 246
Table 107 – Characteristics of optical receivers for multi-mode glass fibre.......................... 247
Table 108 – Characteristics of optical receivers for single-mode glass fibre ........................ 247
Table 109 – Characteristics of optical receivers for plastic fibre .......................................... 247
Table 110 – Characteristics of optical receivers for 200/230 glass fibre .............................. 248
Table 111 – Permissible signal distortion at the electrical input of the optical transmitter .... 248
Table 112 – Permissible signal distortion due to the optical transmitter ............................... 249
Table 113 – Permissible signal distortion due to the optical receiver ................................... 250
Table 114 – Permissible signal influence due to internal electronic circuits of a coupling
component ...................................................................................................................... 250
Table 115 – Maximum chaining of standard optical links without retiming ........................... 251
Table 116 – Services of the MDS-MAU interface, RS-485, Type 4 ...................................... 252
Table 117 – Services of the MDS-MAU interface, RS-232, Type 4 ...................................... 254
Table 118 – Minimum setting of the InterFrameGap parameter for RS-485 wire PhL ........... 256
Table 119 – Maximum stub capacitance per Ph-segment versus bus data rate ................... 258
Table 120 – Maximum cable length per Ph-segment versus bus data rate........................... 259
Table 121 – Bit rate dependent quantities twisted pair wire medium MAU ........................... 261
Table 122 – Incoming interface signals ............................................................................... 263
Table 123 – Outgoing interface signals ............................................................................... 263
Table 124 – Remote bus cable characteristics .................................................................... 264
61158-2 IEC:2003(E) – 11 –
Table 125 – Bit rate dependent quantities optical MAU ....................................................... 266
Table 126 – Remote bus fibre optic cable length ................................................................. 267
Table 127 – Encoding rules ................................................................................................ 267
Table 128 – Transmit level and spectral specification summary for an optical MAU............. 268
Table 129 – Optical MAU receive circuit specification summary .......................................... 269
Table 130 – Specification of the fibre optic waveguide ........................................................ 269
Table 131 – Specification of the single fibre ........................................................................ 270
Table 132 – Specification of the cable sheath and mechanical properties of the cable ........ 270
Table 133 – Recommended further material properties of the cable .................................... 270
Table 134 – Specification of the fibre optic waveguide ........................................................ 271
Table 135 – Specification of the single fibre ........................................................................ 271
Table 136 – Specification of the cable sheath and mechanical properties of the cable ........ 272
Table 137 – Specification of the standard test fibre for an optical MAU ............................... 272
Table A.1 – Internal connector dimensions.......................................................................... 273
Table A.2 – Contact assignments for the external connector for harsh industrial
environments ...................................................................................................................... 274
Table A.3 – Contact assignments for the external connector for typical industrial
environments ...................................................................................................................... 278
Table A.4 – Fixed (device) side connector dimensions ........................................................ 278
Table A.5 – Free (cable) side connector dimensions ........................................................... 279
Table A.6 – Connector dimensions...................................................................................... 280
Table B.1 – Typical cable specifications.............................................................................. 281
Table B.2 – Recommended maximum spur lengths versus number of communication
elements ............................................................................................................................. 282
Table C.1 – Optical passive star specification summary: example ....................................... 283
Table D.1 – Passive star topology....................................................................................... 285
Table D.2 – Active star topology ......................................................................................... 286
Table E.1 – Alternate fibres for dual-fibre mode .................................................................. 288
Table E.2 – Alternate fibres for single-fibre mode ............................................................... 288
Table F.1 – Connector requirements ................................................................................... 289
Table F.2 – NAP connector pin definition ............................................................................ 291
Table H.1 – 5 Mbit/s, voltage-mode, coaxial wire receiver output definitions ....................... 304
Table H.2 – Coaxial wire medium toroid specification.......................................................... 306
Table I.1– Contact assignments for the external connector for harsh industrial
environments ...................................................................................................................... 309
Table I.2 – Contact designations ......................................................................................... 310
Table K.1 – Example of a level budget calculation for multi-mode glass fibre 62,5/125 µm .. 320
Table K.2 – Example of a level budget calculation for single mode glass fibre 9/125 µm ..... 320
Table K.3 – Example of a level budget calculation for multi-mode plastic fibre 980/1000 µm321
Table K.4 – Example of a level budget calculation for multi-mode glass fibre 200/230 µm
fibre .................................................................................................................................... 321
Table L.1 – Pin assignments for the 9-pin subminiature-D connector .................................. 322
Table M.1 – Pin assignment of the 9-position subminiature D connector ............................. 324
Table M.2 – Pin assignment of the terminal connector ........................................................ 325
– 12 – 61158-2 IEC:2003(E)
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. The IEC collaborates closely with the International
Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed that compliance
with this International Standard may involve the use of patents as follows, where the [xx] notation indicates the
holder of the patent right:
Type 2 (subclauses 5.3, 9.4, 10.4, Clauses 18 through 20, Annex F through Annex H):
5,396,197 [AB] Network Node TAP
The IEC takes no position concerning the evidence, validity and scope of these patent rights.
The holders of these patent rights have assured the IEC that they are willing to negotiate licences under
reasonable and non-discriminatory terms and conditions with applicants throughout the world. In this respect, the
statements of the holders of these patent rights are registered with the IEC. Information may be obtained from:
[AB]: Rockwell Technologies, LLC
Allen-Bradley Co, LLC
1201 So. Second Street
Milwaukee, WI 53204
USA
Attention: Intellectual Property Dept.
Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of
patent rights other than those identified above. IEC shall not be held responsible for identifying any or all such
patent rights.
International Standard IEC 61158-2 has been prepared by subcommittee 65C: Digital
communications, of IEC technical committee 65: Industrial-process measurement and control.
The third edition cancels and replaces the second edition published in 2000 and its
amendment. This third edition constitutes a technical revision.
61158-2 IEC:2003(E) – 13 –
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This edition includes the following significant changes from the prior edition:
a) specifications for Types 2, 4, 6 and 8 fieldbusses;
b) specifications for asynchronous operation of Type 3 fieldbusses;
c) specifications for increased data rates for Types 1 and 7 fieldbusses;
d) reorganisation and consolidation of Clauses 11 and following of the prior editions
– to coalesce those common clauses or subclauses whose primary difference was due
to data rate, and
– to eliminate redundant figures and tables from within the clauses.
The following table attempts to correlate the content of the clauses of Edition 1 and its
amendments, and of Edition 2 and its amendment, with the clauses and subclauses of this
edition:
Edition 1 and amendments Edition 2 Edition 3
1 1 1
2 2 2
3 3 3.1, 3.2
4 4 4.1.1, 4.2.1, 4.2.2
5 5 5.1, 5.2
6 6 6.1, 6.2
7 7 7.1, 7.2
8 8 8.1, 8.2
9 9 9.1, 9.2
10 10 10.1, 10.2
11 11 21
12 12 11
13 13 13
14 14 11
Amendment 3: 15 15 16
Amendment 3: 16 16 15
Amendment 3: 17 17 15
Amendment 3: 18 18 15
Amendment 1: 18 19 9.3
Amendment 1: 19 20 10.3
Amendment 1: 20 21 17
Amendment 2: 21 23 14
Amendment 4: 22 22 12
Annex A: Bibliography Bibliography Bibliography
Annex B Annex A Annex A
Annex C Annex B Annex B
– Annex C Annex B
Amendment 3: Annex D Annex D Annex C
Amendment 3: Annex E Annex E Annex D
Amendment 3: Annex F Annex F Annex E
This publication has been drafted in accordance with ISO/IEC Directives, Part 2.
The committee has decided that the contents of this publication will remain unchanged until
2007. At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
– 14 – 61158-2 IEC:2003(E)
IEC 61158 consists of the following parts, under the general title Digital data communications
for measurement and control – Fieldbus for use in industrial control systems:
Part 1: Overview and guidance for the IEC 61158 series
Part 2: Physical Layer specification and service definition
Part 3: Data Link Service definition
Part 4: Data Link Protocol specification
Part 5: Application Layer Service definition
Part 6: Application Layer protocol specification
61158-2 IEC:2003(E) – 15 –
0 Introduction
0.1 General
This part of IEC 61158 is one of a series produced to facilitate the interconnection of
automation system components by fieldbus networks. It is related to other parts in the set as
defined by the fieldbus Reference Model, which is based in principle on the Reference Model
for Open Systems Interconnection. Both Reference Models subdivide the area of
standardization for interconnection into a series of layers of specification, each of
manageable size.
A fieldbus is a digital, serial, multidrop, data bus for communication with industrial control and
instrumentation devices such as -– but not limited to - transducers, actuators and local
controllers. The Physical Layer specified in this International Standard provides for
transparent transmission of data units between Data Link Layer entities across physical
connections. The PhL provides services used by Data Link Protocol and Systems
Management. The relationship between the fieldbus Data Link Layer standard, fieldbus
Physical Service standard and Systems Management application is illustrated in Figure 1.
NOTE Systems Management, as used in this standard, is a local mechanism for managing the layer protocols.
Medium
The primary aim of this International Standard is to provide a set of rules for communication
expressed in terms of the procedures to be carried out by peer Ph-entities at the time of
communication.
The Physical Layer receives data units from the Data Link Layer, encodes them, if necessary
by adding communications framing information, and transmits the resulting physical signals to
the transmission medium at one node. Signals are then received at one or more other
node(s), decoded, if necessary by removing the communications framing information, before
the data units are passed to the Data Link Layer of the receiving device.
NOTE 1 The protocol type numbers used are consistent throughout the IEC 61158 parts.
NOTE 2 Specifications for Types 1, 2, 3, 4, 6 and 8 are included. Type 5 does not use any of the specifications
given in this standard. Type 7 uses Type 1 specifications.
NOTE 3 For ease of reference type numbers are given in clause names. This means that the specification given
therein applies to this type, but does not exclude its use for other types.
NOTE 4 It is up to the user of this International Standard to select for interworking sets of provisions. Refer to
IEC 61784 for standardized communication profiles based on IEC 61158.
DLL
DTE
DL-Ph Interface
MIS
–Ph interface
Physical Layer
Ph MDS
Medium Dependent Sublayer
DCE
MDS -MAU Interface
Alternative
Ph MAU variant
Alternative
PH MAU variant
MDS
Alternative
Ph MAU variant
Ph MAU variant
Ph MAU
Alternative
Medium Interface
Medium
NOTE 6 Since Type 8 uses a more complex DIS than the other types, it uses the term MIS to differentiate.
The common characteristics for all variants and types are as follows:
0.5 Major Physical Layer variations specified in this part of IEC 61158
For twisted-pair wire media, Type 1 specifies two modes of coupling and different signalling
speeds as follows:
a) voltage mode (parallel coupling), 150 :, data rates from 31,25 kbit/s to 25 Mbit/s;
b) voltage mode (parallel coupling), 100 :, 31,25 kbit/s;
c) current mode (serial coupling), 1,0 Mbit/s including two current options.
The voltage mode variations may be implemented with inductive coupling using transformers.
This is not mandatory if the isolation requirements of this part of IEC 61158 are met by other
means.
The Type 1 twisted-pair (or untwisted-pair) wire medium Physical Layer provides the options:
The major variations of the Type 1 optic fibre media are as follows:
The Type 1 radio medium specification provides a 4,8 kbit/s bit rate.
a) twisted-pair wire medium, 31,25 kbit/s, voltage mode (parallel coupling) with the options:
– power via the bus conductors: not intrinsically safe
– power via the bus conductors: intrinsically safe
The Physical Layer also allows transmitting data units that have been received through a
medium access by the transmission medium directly through another medium access and its
transmission protocol to another device.
– full-duplex transmission
– Non Return to Zero (NRZ) coding
1 Scope
This part of IEC 61158 specifies the requirements for fieldbus component parts. It also
specifies the media and network configuration requirements necessary to ensure agreed
levels of
The fieldbus Physical Layer conforms to layer 1 of the OSI 7-layer model as defined by
ISO 7498 with the exception that, for some types, frame delimiters are in the Physical Layer
while for other types they are in the Data Link Layer .
– 20 – 61158-2 IEC:2003(E)
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60079-11, Electrical apparatus for explosive gas atmospheres – Part 11: Intrinsic
safety “i”
IEC 60079-27, Electrical apparatus for explosive gas atmospheres – Part 27: Fieldbus
intrinsically safe concept (FISCO)
IEC 60096-1, Radio-frequency cables – Part 1: General requirements and measuring methods
IEC 60169-8, Radio-frequency connectors – Part 8: RF coaxial connectors with inner diameter
of outer conductor 6,5 mm (0,256 in) with bayonet lock – Characteristic impedance 50 ohms
(Type BNC)
IEC 60189-1:1986, Low-frequency cables and wires with PVC insulation and PVC sheath –
Part 1: General test and measuring methods
IEC 60255-22-1:1988, Electrical relays – Part 22-1: Electrical disturbance tests for measuring
relays and protection equipment – 1 MHz burst disturbance tests
IEC 60364-4-41, Electrical installations of buildings – Part 4-41: Protection for safety –
Protection against electric shock
IEC 60364-5-54, Electrical installations of buildings – Part 5-54: Selection and erection of
electrical equipment – Earthing arrangements and protective conductors
IEC 60603-7, Connectors for frequencies below 3 MHz for use with printed boards – Part 7:
Detail specification for connectors, 8-way, including fixed and free connectors with common
mating features, with assessed quality
IEC 60807-3, Rectangular connectors for frequencies below 3 MHz – Part 3: Detail
specification for a range of connectors with trapezoidal shaped metal shells and round
contacts – Removable crimp contact types with closed crimp barrels, rear insertion/rear
extraction
IEC 60874-2, Connectors for optical fibres and cables — Part 2: Sectional specification
for fibre optic connector – Type F-SMA
61158-2 IEC:2003(E) – 21 –
IEC 60874-7, Connectors for optical fibres and cables — Part 7: Sectional specification
for fibre optic connector - Type FC
IEC 60874-10-1, Connectors for optical fibres and cables — Part 10-1: Detail
specification for fibre optic connector type BFOC/2,5 terminated to multimode fibre type
A1
IEC 60947-5-2, Low-voltage switchgear and controlgear – Part 5-2: Control circuit devices
and switching elements – Proximity switches
IEC 61156-1:1994, Multicore and symmetrical pair/quad cables for digital communications –
Part 1: Generic specification
IEC 61158, Digital data communications for measurement and control – Fieldbus for use
in industrial control systems
IEC 61158-3:2003, Digital data communications for measurement and control – Fieldbus
for use in industrial control systems — Part 3: Data Link Service definition
IEC 61158-4:2003, Digital data communications for measurement and control – Fieldbus
for use in industrial control systems — Part 4: Data Link protocol specification
IEC 61300-34:2001, Fibre optic interconnecting devices and passive components – Basic test
and measurement procedures – Part 3-4: Examinations and measurements – Attenuation
IEC 61754-2, Fibre optic connector interfaces – Part 2: Type BFOC/2,5 connector family
ISO/IEC 7498 (all parts), Information technology – Open Systems Interconnection – Basic
Reference Model
ANSI TIA/EIA-232-F, Interface Between Data Terminal Equipment and Data Circuit –
Terminating Equipment Employing Serial Binary Data Interchange
IEEE Std 100:1996, The IEEE Standard Dictionary of Electrical and Electronics Terms