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LM5007
SNVS252G – SEPTEMBER 2003 – REVISED NOVEMBER 2015

LM5007 High Voltage 80-V Step Down Switching Regulator

1 Features 3 Description
•
1 Integrated 80-V, 0.7-A N-Channel Buck Switch The LM5007 Step Down Switching Regulator features
all of the functions needed to implement low cost,
• Internal HV VCC Regulator efficient, Buck bias regulators. This high voltage
• No Control Loop Compensation Required regulator contains an 80-V, 0.7-A N-Channel Buck
• Ultra-Fast Transient Response Switch. The device is easy to apply and is provided in
• On Time Varies Inversely with Line Voltage the VSSOP-8 and the thermally enhanced WSON-8
packages. The regulator is based on a hysteretic
• Operating Frequency Nearly Constant with control scheme using an on time inversely
Varying Line Voltage proportional to VIN. This feature allows the operating
• Adjustable Output Voltage frequency to remain relatively constant with load and
• Highly Efficient Operation input voltage variations. The hysteretic control
requires no control loop compensation, while
• Precision Reference providing very fast load transient response. An
• Low Bias Current intelligent current limit is implemented in the LM5007
• Intelligent Current Limit Protection with forced off time that is inversely proportional to
VOUT. This current limiting scheme reduces load
• Thermal Shutdown current foldback. Additional protection features
• External Shutdown Control include: Thermal Shutdown, VCC undervoltage
• VSSOP-8 and WSON-8 Packages lockout, gate drive undervoltage lockout, and Max
Duty Cycle limiter.
2 Applications
Device Information(1)
• Non-Isolated Buck Regulator PART NUMBER PACKAGE BODY SIZE (NOM)
• Secondary High Voltage Post Regulator VSSOP (8) 3.00 mm × 3.00 mm
LM5007
• 42-V Automotive Systems WSON (8) 4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.

Typical Application Schematic

9V-75V LM5007
VIN
8 VIN BST 2 CBST
CIN RON L1 VOUT
6 RON 1
SW
Shutdown

7 D1 Rr
VCC
CVCC RFB2
COUT
3
RCL FB 5
RTN
RCL 4 RFB1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features .................................................................. 1 7.4 Device Functional Modes........................................ 12
2 Applications ........................................................... 1 8 Application and Implementation ........................ 13
3 Description ............................................................. 1 8.1 Application Information............................................ 13
4 Revision History..................................................... 2 8.2 Typical Application ................................................. 13
5 Pin Configuration and Functions ......................... 3 9 Power Supply Recommendations...................... 16
6 Specifications......................................................... 4 10 Layout................................................................... 16
6.1 Absolute Maximum Ratings ..................................... 4 10.1 Layout Guidelines ................................................. 16
6.2 ESD Ratings.............................................................. 4 10.2 Layout Example .................................................... 16
6.3 Recommended Operating Conditions ...................... 4 11 Device and Documentation Support ................. 17
6.4 Thermal Information .................................................. 4 11.1 Documentation Support ........................................ 17
6.5 Electrical Characteristics........................................... 5 11.2 Community Resources.......................................... 17
6.6 Typical Characteristics .............................................. 6 11.3 Trademarks ........................................................... 17
7 Detailed Description .............................................. 7 11.4 Electrostatic Discharge Caution ............................ 17
7.1 Overview ................................................................... 7 11.5 Glossary ................................................................ 17
7.2 Functional Block Diagram ......................................... 7 12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................... 7 Information ........................................................... 17

4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision F (March 2013) to Revision G Page

• Added Device Information table, ESD Ratings table, Thermal Information table, Application Information, Design
Requirements, Application Curves, Power Supply Recommendations, Layout, and Community Resources. ..................... 1
• Added Typical Application Schematic ................................................................................................................................... 1
• Updated pinout drawing description ...................................................................................................................................... 3

Changes from Revision E (March 2013) to Revision F Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 11

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5 Pin Configuration and Functions

DGK Package and NGT Package

8-Pin VSSOP and 8-Pin WSON
Top View

1 8
SW VIN
2 7
BST VCC

3 6
RCL RON

4 5
RTN FB

Pin Functions
PIN
TYPE DESCRIPTION APPLICATION INFORMATION
NO. NAME
1 SW O Switching Node Power switching node. Connect to the LC output filter.
2 BST I Boost Boot–strap capacitor input An external capacitor is required between the BST and
the SW pins. A 0.01-µF ceramic capacitor is
recommended. An internal diode between VCC and
BST completes the Buck gate drive bias network.
3 RCL I Current Limit OFF time programming pin A resistor between this pin and RTN determines the
Toff = 10-5 / (0.59 + (FB / 7.22 x 10− 6 x RCL)) variation of off time, along with the FB pin voltage, per
cycle while in current limit. The off time is preset to 17
µS if FB =0 V and decreases as the FB pin voltage
increases.
4 RTN — Circuit Ground
5 FB I Feedback Signal from Regulated Output This pin is connected to the inverting input of the
internal regulation comparator. The regulation
threshold is 2.5 V.
6 RON I On time set pin A resistor between this pin and VIN sets the switch on
Ton = 1.42 x 10-10 RON / VIN time as a function of VIN. The minimum recommended
on time is 300 ns at the maximum input voltage.
7 VCC O Output from the internal high voltage bias If an auxiliary voltage is available to raise the voltage
regulator. VCC is nominally regulated to 7 V. on this pin, above the regulation set point (7V), the
internal series pass regulator will shutdown, reducing
the IC power dissipation. Do not exceed 14V. This
output provides gate drive power for the internal Buck
switch. An internal diode is provided between this pin
and the BST pin. A local 0.1uF decoupling capacitor is
recommended. Series pass regulator is current limited
to 10mA.
8 VIN I Input supply voltage Recommended operating range: 9V to 75V.
— EP — Exposed PAD, underside of the WSON Internally bonded to the die substrate. Connect to
package option GND potential for low thermal impedance.

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6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN to GND 80 V
BST to GND 94 V
SW to GND (Steady State) –1 V
BST to VCC 80 V
BST to SW 14 V
VCC to GND 14 V
All other inputs to GND –0.3 7 V
Lead temperature (Soldering 4 sec) 260 °C
Tstg Storage temperature –55 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2) ±2000
V(ESD) Electrostatic discharge V
Machine model (MM) ±200

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model is a 100-pF capacitor discharge through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin. The machine model ESD compliance level for Pin 5 is 150 V. The human body ESD
compliance level for Pin 7 and 8 is 1000 V.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input Voltage 9 75 V
TJ Junction temperature −40 125 °C

6.4 Thermal Information

LM5007
(1)
THERMAL METRIC DGK (VSSOP) NGT (WSON) UNIT
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 158.3 38.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.3 27.8 °C/W
RθJB Junction-to-board thermal resistance 78.5 15.1 °C/W
ψJT Junction-to-top characterization parameter 4.9 0.2 °C/W
ψJB Junction-to-board characterization parameter 77.2 15.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 4.5 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).

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6.5 Electrical Characteristics

(1)
at TJ = 25°C, VIN = 48 V (unless otherwise noted) .
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STARTUP REGULATOR
VCC Reg VCC Regulator Output 6.6 7 7.4 V
VCC Current Limit (2) 11 mA
VCC SUPPLY
VCC undervoltage Lockout Voltage 6.3 V
(VCC increasing)
VCC Undervoltage Hysteresis 206 mV
VCC UVLO Delay (filter) 3 µs
Operating Current (ICC) Non-Switching, FB = 3 V 500 675 µA
Shutdown/Standby Current RON = 0 V 100 200 µA
SWITCH CHARACTERISTICS
Buck Switch Rds(on) ITEST = 200 mA, 0.74 1.34 Ω
VBST −VSW = 6.3 V (3)
Gate Drive UVLO (VBST – VSW) Rising 3.4 4.5 5.5 V
Gate Drive UVLO Hysteresis 400 mV
Breakdown voltage, TJ = 25°C 80 V
VIN to ground
TJ = -40°C to 125°C 76 V
Breakdown voltage, TJ = 25°C 80 V
BST to VCC
TJ = -40°C to 125°C 76 V
CURRENT LIMIT
Current limit threshold 535 725 900 mA
Current Limit Response Time Iswitch Overdrive = 0.1 A Time to Switch Off 225 ns
OFF time generator (test 1) FB=0V, RCL = 100K 17 µs
OFF time generator (test 2) FB=2.3V, RCL = 100K 2.65 µs
ON TIME GENERATOR
TON -1 VIN = 10 V, RON = 200K 2.15 2.77 3.5 µs
TON -2 VIN = 75V, RON = 200K 290 390 490 ns
Remote Shutdown Threshold Rising 0.45 0.7 1.1 V
Remote Shutdown Hysteresis 40 mV
MINIMUM OFF TIME
Minimum Off Timer FB = 0V 300 ns
REGULATION AND OV COMPARATORS
FB Reference Threshold Internal reference, Trip point for switch ON 2.445 2.5 2.550 V
FB Over-Voltage Threshold Trip point for switch OFF 2.875 V
FB Bias Current 100 nA
THERMAL SHUTDOWN
Tsd Thermal Shutdown Temp. 165 °C
Thermal Shutdown Hysteresis 25 °C

(1) All electrical characteristics having room temperature limits are tested during production with TA = TJ = 25°C. All hot and cold limits are
specified by correlating the electrical characteristics to process and temperature variations and applying statistical process control.
(2) The VCC output is intended as a self bias for the internal gate drive power and control circuits. Device thermal limitations limit external
loading.
(3) For devices in the WSON-8 package, the Rds(on) limits are specified by design characterization data only.

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6.6 Typical Characteristics

100 20

95 18
VIN = 15V
16 600k
90
14 400k
EFFICIENCY (%)

200k
85 12

(Ps)
80 10

OFF
VIN = 30V
VIN = 50V 8

T
75
VIN = 70V 6
70
4
65 2
100k 50k
60 0
0 0.1 0.2 0.3 0.4 0.5 0 0.5 1 1.5 2 2.5

LOAD (A) V (V)

FB
RCL = 50k -600k

Figure 1. LM5007 10-V Output Efficiency Figure 2. Current Limit VFB vs TOFF

5
4.5
4
3.5
3
(us)

2.5
300k
ON

2
T

200k
1.5 100k
1
0.5
0
0 10 20 30 40 50 60 70 80

V (V)
IN
RON = 100k, 200k, 300k

Figure 3. VIN vs TON

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7 Detailed Description

7.1 Overview
The LM5007 Step Down Switching Regulator features all of the functions needed to implement low cost, efficient,
Buck bias regulators. This high voltage regulator contains an 80-V, 0.7-A N-Channel Buck Switch. The device is
easy to apply and is provided in the VSSOP-8 and the thermally enhanced WSON-8 packages. The regulator is
based on a hysteretic control scheme using an on time inversely proportional to VIN. This feature allows the
operating frequency to remain relatively constant with load and input voltage variations. The hysteretic control
requires no control loop compensation, while providing very fast load transient response. An intelligent current
limit scheme is implemented in the LM5007 with forced off time, after current limit detection, which is inversely
proportional to VOUT. This current limiting scheme reduces load current foldback. Additional protection features
include: Thermal Shutdown, VCC undervoltage lockout, Gate drive undervoltage lockout and Max Duty Cycle
limiter. The LM5007 can be applied in numerous applications to efficiently regulate step down higher voltage
inputs. This regulator is well suited for 48-V Telcom and the new 42-V Automotive power bus ranges.

7.2 Functional Block Diagram

7V SERIES LM5007
REGULATOR
VCC

VIN
SD

THERMAL
UVLO
SHUTDOWN
ON TIMER
START
COMPLETE
Ron BST
SD /
RON START
OVER-VOLTAGE SD VIN
COMPARATOR 300nS MIN OFF UVLO
TIMER
+ DRIVER
2.875V - COMPLETE
LEVEL
2.5V SHIFT
SW
SET
+ S Q
-
FB
REGULATION R Q
CLR
COMPARATOR
FB COMPLETE
RCL BUCK
RCL START + SWITCH
- CURRENT
CURRENT LIMIT SENSE
OFF TIMER 0.725A

RTN

7.3 Feature Description

7.3.1 Hysteretic Control Circuit Overview
The LM5007 is a Buck DC-DC regulator that uses an on time control scheme. The on time is programmed by an
external resistor and varies inversely with line input voltage (VIN). The core regulation elements of the LM5007
are the feedback comparator and the on time one-shot. The regulator output voltage is sensed at the feedback
pin (FB) and is compared to an internal reference voltage (2.5 V). If the FB signal is below the reference voltage,
the buck switch is turned on for a fixed time pulse determined by the line voltage and a programming resistor
(RON). Following the on period the switch will remain off for at least the minimum off timer period of 300 ns. If the
FB pin voltage is still below the reference after the 300-ns off time, the switch will turn on again for another on
time period. This switching behavior will continue until the FB pin voltage reaches the reference voltage level.

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Feature Description (continued)

The LM5007 operates in discontinuous conduction mode at light load currents or continuous conduction mode at
heavier load currents. In discontinuous conduction mode, current through the output inductor starts at zero and
ramps up to a peak value during the buck switch on time and then back to zero during the off time. The inductor
current remains at zero until the next on time period starts when FB falls below the internal reference. In
discontinuous mode the operating frequency can be relatively low and will vary with load. Therefore at light loads
the conversion efficiency is maintained, since the switching losses decrease with the reduction in load current
and switching frequency. The approximate discontinuous mode operating frequency can be calculated as follows:
VOUT2 x L
F=
1 x 10-20 x RLoad x (RON)2
(1)
In continuous conduction mode, current flows continuously through the inductor and never ramps down to zero.
In this mode the operating frequency is greater than the discontinuous mode frequency and remains relatively
constant with load and line variations. The approximate continuous mode operating frequency can be calculated
as follows:
VOUT
F=
1.42 x 10-10 x RON
(2)
The output voltage (VOUT) can be programmed by two external resistors as shown in Figure 4. The regulation
point can be calculated as follows:
VOUT = 2.5 x (R1 + R2) / R2 (3)
The feedback comparator in hysteretic regulators depend upon the output ripple voltage to switch the output
transistor on and off at regular intervals. In order for the internal comparator to respond quickly to changes in
output voltage, proportional to inductor current, a minimum amount of capacitor Equivalent Series Resistance
(ESR) is required. A ripple voltage of 25 mV to 50 mV is recommended at the feedback pin (FB) for stable
operation. In cases where the intrinsic capacitor ESR is too small, additional series resistance may be added.
For applications where lower output voltage ripple is required the load can be connected directly to the low ESR
output capacitor, as shown in Figure 4. The series resistor (R) will degrade the load regulation. Another
technique for enhancing the ripple voltage at the FB pin is to place a capacitor in parallel with the feedback
divider resistor R1. The addition of the capacitor reduces the attenuation of the ripple voltage from the feedback
divider

7.3.2 High Voltage Bias Regulator

The LM5007 contains an internal high voltage bias regulator. The input pin (VIN) can be connected directly to line
voltages from 9 V to 75 V. To avoid supply voltage transients due to long lead inductances on the input pin (VIN
Pin 8), it is always recommended to connect low ESR ceramic chip capacitor (≊ 0.1 µF) between VIN pin and
RTN pin (pin 4), located close to LM5007. The regulator is internally current limited to 10 mA. Upon power up,
the regulator is enabled and sources current into an external capacitor connected to the VCC pin. When the
voltage on the VCC pin reaches the regulation point of 7 V, the controller output is enabled.
An external auxiliary supply voltage can be applied to the VCC pin. If the auxiliary voltage is greater than 7 V, the
internal regulator will essentially shutoff, thus reducing internal power dissipation.

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Feature Description (continued)

VIN

L
SW

R1 R
+ FB
- VOUT
+
COUT
R2
REF
2.5V

LM5007

Figure 4. Low Ripple Output Configuration

7V SERIES REGULATOR

VCC

+
0.1PF

SELF-BIAS
DIODE

BST
VIN

+
0.01PF

SW
LM5007 10V

30k +

10k

Figure 5. Self Biased Configuration

7.3.3 Over-Voltage Comparator

The over-voltage comparator is provided to protect the output from overvoltage conditions due to sudden input
line voltage changes or output loading changes. The over-voltage comparator monitors the FB pin versus an
internal 2.875V reference (OV_REF). If the voltage at FB rises above OV_REF the comparator immediately
terminates the buck switch on time pulse.

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Feature Description (continued)

7.3.4 ON Time Generator and Shutdown
The on time of the LM5007 is set inversely proportional to the input voltage by an external resistor connected
between RON and VIN. The RON terminal is a low impedance input biased at approximately 1.5 V. Thus the
current through the resistor and into the RON terminal is approximately proportional to VIN and used internally to
control the on timer. This scheme of input voltage feed-forward hysteretic operation achieves nearly constant
operational frequency over varying line and load conditions. The on time equation for the LM5007 is:
Ton = 1.42 x 10-10 x RON / VIN (4)
The RON pin of the LM5007 also provides a shutdown function which disables the regulator and significantly
decreases quiescent power dissipation. By pulling the RON pin to below 0.7V logic threshold activates the low
power shutdown mode. The VIN quiescent current in the shutdown mode is approximately 100µA internal to the
LM5007 plus the current in the RON resistor.

7V SERIES
REGULATOR
VIN VIN

ON TIMER
RON VIN

START
RON
RON COMPLETE
STOP
RUN
LM5007

Figure 6. Shutdown Implementation

7.3.5 Current Limit

The LM5007 contains an intelligent current limit off timer intended to reduce the foldback characteristic inherent
with fixed off-time over-current protection. If the current in the Buck switch exceeds 725 mA the present cycle on
time is immediately terminated (cycle by cycle current limit). Following the termination of the cycle a non-
resetable current limit off timer is initiated. The duration of the off time is a function of the external resistor (RCL)
and the FB pin voltage. When the FB pin voltage equals zero, the current limit off time is internally preset to 17
uS. This condition occurs in short circuit operation when a maximum amount of off time is required.
In cases of overload (not complete short circuit) the current limit off time can be reduced as a function of the
output voltage (measured at the FB pin). Reducing the off time with smaller overloads reduces the amount of
foldback and also reduces the initial start-up time. The current limit off time for a given FB pin voltage and RCI
resistor can be calculated by the following equation:

(5)
Applications utilizing low resistance inductors and/or a low voltage drop rectifier may require special evaluation at
high line, short circuit conditions. In this special case the preset 17µs (FB = 0V) off time may be insufficient to
balance the inductor volt*time product. Additional inductor resistance, output resistance or a larger voltage drop
rectifier may be necessary to balance the inductor cycle volt*time product and limit the short circuit current.

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Feature Description (continued)

7.3.6 N-Channel Buck Switch and Driver
The LM5007 integrates an N-Channel Buck switch and associated floating high voltage gate driver. This gate
driver circuit works in conjunction with an external bootstrap capacitor and an internal high voltage diode. The
bootstrap capacitor is charged by VCC through the internal high voltage diode. A 0.01-µF ceramic capacitor
connected between the BST pin and SW pin is recommended.
During each cycle when the Buck switch turns off, the SW pin is approximately 0 V. When the SW pin voltage is
low, the bootstrap capacitor will be charged from VCC through the internal diode. The minimum off timer, set to
300 ns, ensures that there will be a minimum interval every cycle to recharge the bootstrap capacitor.
An external re-circulating diode from the SW pin to ground is necessary to carry the inductor current after the
internal Buck switch turns off. This external diode must be of the Ultra-fast or Schottky type to reduce turn-on
losses and current over-shoot. The reverse voltage rating of the re-circulating diode must be greater than the
maximum line input voltage.

7.3.7 Thermal Protection

Internal Thermal Shutdown circuitry is provided to protect the integrated circuit in the event the maximum junction
temperature is exceeded. When thermal protection is activated, typically at 165 degrees Celsius, the controller is
forced into a low power reset state, disabling the output driver. This feature is provided to prevent catastrophic
failures from accidental device overheating.

7.3.8 Minimum Load Current

A minimum load current of 1 mA is required to maintain proper operation. If the load current falls below that level,
the bootstrap capacitor may discharge during the long off-time, and the circuit will either shutdown, or cycle on
and off at a low frequency. If the load current is expected to drop below 1 mA in the application, the feedback
resistors should be chosen low enough in value so they provide the minimum required current at nominal Vout.

7.3.9 Ripple Configuration

LM5007 uses Constant-On-Time (COT) control in which the on-time is terminated by an on-timer and the off-time
is terminated by the feedback voltage (VFB) falling below the reference voltage (VREF). Therefore, for stable
operation, the feedback voltage must decrease monotonically, in phase with the inductor current during the off-
time. Furthermore, this change in feedback voltage (VFB) during off-time must be larger than any noise
component present at the feedback node.
Table 1 shows three different methods for generating appropriate voltage ripple at the feedback node. Type 1
and Type 2 ripple circuits couple the ripple at the output of the converter to the feedback node (FB). The output
voltage ripple has two components:
1. Capacitive ripple caused by the inductor current ripple charging/discharging the output capacitor.
2. Resistive ripple caused by the inductor current ripple flowing through the ESR of the output capacitor.
The capacitive ripple is not in phase with the inductor current. As a result, the capacitive ripple does not
decrease monotonically during the off-time. The resistive ripple is in phase with the inductor current and
decreases monotonically during the off-time. The resistive ripple must exceed the capacitive ripple at the output
node (VOUT) for stable operation. If this condition is not satisfied unstable switching behavior is observed in COT
converters, with multiple on-time bursts in close succession followed by a long off-time.
Type 3 ripple method uses Rr and Cr and the switch node (SW) voltage to generate a triangular ramp. This
triangular ramp is ac coupled using Cac to the feedback node (FB). Since this circuit does not use the output
voltage ripple, it is ideally suited for applications where low output voltage ripple is required. See AN-1481
Controlling Output Ripple and Achieving ESR Independence in Constant On-Time (COT) Regulator Designs
(SNVA166) for more details for each ripple generation method.

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Feature Description (continued)

Table 1. Ripple Configuration
TYPE 1 TYPE 2 TYPE 3
LOWEST COST CONFIGURATION REDUCED RIPPLE CONFIGURATION MINIMUM RIPPLE CONFIGURATION

VOUT VOUT
L1
VOUT
L1
L1
Cac Rr COUT
R FB2 RC R FB2 RC Cr
R FB2

Cac
To FB To FB
GND
C OUT C OUT To FB
R FB1 R FB1
R FB1

GND GND

25 mV VOUT 5 Cr = 3300 pF
RC > x C>
ûIL(MIN) VREF gsw (RFB2||RFB1) Cac = 100 nF
(6)
25 mV (VIN(MIN) - VOUT) x TON
RC > RrCr <
ûIL(MIN) (7) 25 mV (8)

7.4 Device Functional Modes

7.4.1 Standby Mode with VIN
The LM5007 is intended to operate with input voltages above 9 V. The minimum operating input voltage is
determined by the VCC undervoltage lockout threshold of 6.3 V (typ). If VIN is too low to support a VCC voltage
greater than the VCC UVLO threshold, the controller switches to the standby mode with the buck switch in the off
state.

7.4.2 RT Shutdown Mode

The LM5007 is in shutdown mode when the RON pin is pulled below 0.7 V (typ). In this mode, the buck FET is
held off and the VCC regulator is disabled.

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8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM5007 is a step down converter DC-DC converter. The LM5007 device is step-down DC-DC converter.
The device is typically used to convert a higher DC voltage to a lower DC voltage with a maximum available
output current of 500 mA. Use the following design procedure to select component values for the LM5007 device.
Alternately, use the WEBENCH® software to generate a complete design. The WEBENCH software uses an
iterative design procedure and accesses a comprehensive database of components when generating a design.
This section presents a simplified discussion of the design process.

8.2 Typical Application

The application schematic of an LM5007 based buck converter is shown in Figure 7. For an output voltage
(VOUT) above the maximum regulation threshold of VCC (see Electrical Characteristics), the VCC pin can be
supplied from VOUT through a diode for higher efficiency and lower power dissipation in the IC.

12V-75V LM5007
VIN
8 VIN BST 2 0.01µF
CBST
RON L1
CIN CBYP 200NŸ VOUT
1µF 0.1µF 6 RON 1 100µH
SW
Shutdown

7 D1 Rr
VCC 1Ÿ
CVCC RFB2
3.01NŸ COUT
3
0.1µF RCL FB 5 15µF
RTN
RCL 4 RFB1
100NŸ 1NŸ

Figure 7. 12-V to 75-V Input and 10-V, 400-mA Output Buck Converter

8.2.1 Design Requirements

For this design example, use the parameters listed in Table 2 as the input parameters.

Table 2. Design Parameters

DESIGN PARAMETERS VALUE
Input Voltage 15 V to 75 V
Output Voltage 10 V
Maximum Output Current 400 mA
Nominal Switching Frequency 380 kHz

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8.2.2 Detailed Design Procedure

8.2.2.1 RFB2 and RFB1

VOUT=VFB x (RFB2/RFB1+1), and since VFB=2.5 V in regulation, ratio of RFB2 to RFB1 is 3:1. Select standard values
of RFB1=1 kΩ and RFB2=3.01 kΩ. Other values can be chosen as long as the 3:1 ratio is maintained.

8.2.2.2 Frequency Selection

The switching frequency is set by RON resistor using Equation 9.
VOUT
RON =
1.42 ´ 10-10 ´ fsw (9)
Selecting fsw = 380 kHz results in RON=185 kΩ. A standard value of 200 kΩ is selected for this design.

8.2.2.3 Inductor Selection

The inductor is selected to provide a current ripple of 40-50% of the full load current. In addition, the peak
inductor current at maximum load must be smaller than the minimum current limit threshold provided in Electrical
Characteristics. The inductor current ripple is given by Equation 10.
V - VOUT VOUT
DIL = IN ´
L1´ fSW VIN (10)
The maximum ripple is observed at the maximum input voltage. Using VIN=75 V and ΔIL=50% x IOUT(max) results
in L1=114 µH. A standard value of 100 µH is chosen. With this L1, the inductor current ripple ranges from 88 mA
to 228 mA. The peak inductor and switch current at full load is given by Equation 11.
DI
IL1 = IOUT + L
2 (11)
At maximum VIN, the peak inductor current is 514 mA, which is lower than the minimum current limit threshold of
535 mA. The selected inductor should be able to operate at the maximum current limit of 900 mA during startup
and overload conditions without saturating.

8.2.2.4 Output Capacitator

The output capacitor is selected to minimize the capacitive ripple. The maximum ripple is observed at the
maximum input voltage and is given by:
DIL
COUT =
8 ´ fsw ´ DVCOUT (12)
Where, ΔVCOUT is the voltage ripple across the capacitor and ΔIL is the peak-to-peak inductor current ripple.
Substituting VIN=75 V and targeting ΔVCOUT=10 mV gives COUT=7.5 µF. A standard 15-µF value is selected for
COUT. An X5R or X7R type capacitor with a voltage rating of 16 V or higher should be selected.

8.2.2.5 Type I Ripple Circuit

Type I ripple circuit, as described in ripple configuration, is chosen for this example. For a constant on time
converter to be stable, the injected in-phase ripple must be larger than the capacitive ripple on COUT.
Using type I ripple circuit equations with minimum FB pin ripple of 25 mV, the values of series resistor RC is
calculated using Equation 13:
25 mV æ RFB2 ö
RC = ´ ç1 + ÷
DIL(MIN) è RFB1 ø (13)
to be 1.1 Ω. A standard value of 1 Ω is selected.

8.2.2.6 Input Capacitator

Input capacitor should be large enough to limit the input voltage ripple which can be calculated using the
Equation 14.

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IOUT(MAX) ´ D ´ (1 - D)
CIN =
fSW ´ DVCIN (14)
The input ripple reaches its maximum at D=0.5. Targeting a ΔVCIN = 0.5 V at using a duty cycle of D=0.5 results
in CIN=0.526 µF. A standard value of 1µF is selected. The input capacitor should be rated for the maximum input
voltage under all conditions. A 100-V, X7R type capacitor is selected for this design. The input capacitor should
be placed close to the VIN pin and the anode of the diode (D1) as it supplies high frequency switching current.
A 0.1-µF bypass capacitor (CBYP) should be placed very close to VIN and RTN pins of ICs of the IC to avoid the
supply voltage transients and ringing between VIN and RTN.

8.2.2.7 RCL
The current limit off-time is set by RCL according to Equation 5. The usable values tend to be in the range of
100k Ω to 1 MΩ. The off time required for volt-second balance on the inductor in current limit is given by
Equation 15.
VIN(MAX) ´ 225 ns
TOFF(ILIM) =
VF + VOUT + ILIM ´ rL (15)
where 225 ns is the current limit response time, VF is the forward voltage drop of the rectifier diode. VOUT is the
output voltage, ILIM is the current limit, and rL is the inductor resistance.
The programmed current limit off-time should be higher than the off-time needed for voltage second balance on
the inductor. For a short at the output (VOUT=0 V), and VF=0.7 V, an inductor DCR of 390 mΩ or higher is needed
to achieve volt-second balance in the maximum programmed current limit off-time of 17 µs. Using Equation 5 an
RCL of greater than 10 kΩ can be used. A conservative value of 100 kΩ is selected in this design.

8.2.3 Application Curves

VOUT = 10 V VIN = 20 V IOUT = 250 mA VOUT = 10 V VIN = 75 V IOUT = 250 mA

CH1: Switch Node CH2: VOUT (AC) CH4: Inductor CH1: Switch Node CH2: VOUT (AC) CH4: Inductor
Current Current

Figure 8. Operational Waveforms: Figure 9. Operational Waveforms:

LM5007 Operation LM5007 Operation

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9 Power Supply Recommendations

The devices are designed to operate from an input voltage supply range between 9 V and 75 V. This input
supply must be well regulated. If the input supply is located more than a few inches from the device, additional
bulk capacitance may be required at the input terminals of the converter in addition to the calculated values to
limit the inductive spikes due to the input cables or wires.

10 Layout

10.1 Layout Guidelines

Layout considerations are critical for optimum performance:
• FB node trace should be away from noise sources and inductors. The lower feedback resistor should connect
to ground close to the IC RTN.
• SW pin copper area should be minimize to reduce dv/dt noise.
• The area of the high di/dt loop consisting of VIN bypass capacitor, SW node, and diode rectifier should be
minimized.
• The VIN-RTN bypass capacitor and the VCC-TRN bypass capacitors should be as close to the IC as possible.
If the internal dissipation of the LM5007 produces excessive junction temperatures during normal operation, good
use of the PC board’s ground plane can help considerably to dissipate heat. The exposed pad on the bottom of
the WSON-8 package can be soldered to a ground plane on the PC board, and that plane should extend out
from beneath the IC to help dissipate the heat. Additionally, the use of wide PC board traces, where possible,
can also help conduct heat away from the IC. Judicious positioning of the PC board within the end product, along
with use of any available air flow (forced or natural convection) can help reduce the junction temperatures.

10.2 Layout Example

CA VOUT
COUT

LIND GND
Cbyp
RA
CIN

SW
SW VIN VLINE
CBST
BST LM5007 VCC
RON CVCC
RCL RON
RFB2
RTN FB
CB
GND
RFB1

Via to Ground Plane

Figure 10. Layout Example

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation
For related documentation see the following:
• AN-1481 Controlling Output Ripple and Achieving ESR Independence in Constant On-Time (COT) Regulator
Designs (SNVA166)

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.

11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Copyright © 2003–2015, Texas Instruments Incorporated Submit Documentation Feedback 17

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 PACKAGE OPTION ADDENDUM

www.ti.com 11-Mar-2016

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

LM5007MM NRND VSSOP DGK 8 1000 TBD Call TI Call TI -40 to 125 S81B
LM5007MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 S81B
& no Sb/Br)
LM5007MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 S81B
& no Sb/Br)
LM5007SD NRND WSON NGT 8 1000 TBD Call TI Call TI -40 to 125 L00031B
LM5007SD/NOPB ACTIVE WSON NGT 8 1000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L00031B
& no Sb/Br)
LM5007SDX/NOPB ACTIVE WSON NGT 8 4500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L00031B
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 11-Mar-2016

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM5007MM VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5007MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5007MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5007SD WSON NGT 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM5007SD/NOPB WSON NGT 8 1000 180.0 12.4 4.3 4.3 1.1 8.0 12.0 Q1
LM5007SDX/NOPB WSON NGT 8 4500 330.0 12.4 4.3 4.3 1.1 8.0 12.0 Q1

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5007MM VSSOP DGK 8 1000 210.0 185.0 35.0
LM5007MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LM5007MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LM5007SD WSON NGT 8 1000 210.0 185.0 35.0
LM5007SD/NOPB WSON NGT 8 1000 203.0 203.0 35.0
LM5007SDX/NOPB WSON NGT 8 4500 346.0 346.0 35.0

Pack Materials-Page 2
 MECHANICAL DATA
NGT0008A

SDC08A (Rev A)

www.ti.com
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