UTC-1000 2nd Step Manual

WIRE BONDER
Second Step Guide
We would like to express our deeply gratitude for your selection and installation of the “UTC-1000 Fully
Automatic Wire Bonder”.
As the first automatic wire bonder in the world, Shinkawa have been developed and distributed the
automatic wire bonder with microprocessor since 1973.
We always continue to serve for our customer as policy to ‘Improve the precision and reliability of the
equipment, provide complete and excellent technical service after customer purchasing of the equip-
ment.’
The manual donates the settings and configurations for the looping and the bonding. For the safety and
the proper machine running, you are required to refer the manual.
Regarding the preparation, installing, warnings and cautions for the equipment running, general de-
scriptions, operation and running of the equipment, refer to “ First Step Guide of UTC-1000 ”.
Furthermore, if you have any unclear items and/or descriptions in the manual, please consult Shinkawa
ES Dept.
General Notice
a. All rights reserved. No part of this publication may be reproduced, transmitted, transcribed, stored
in a retrieval system, or translated into any language in any means without the permission of
Shinkawa.
b. If you find any unclear description, wrong and lacking description and/or page, please kindly
inform Shinkawa ES Dept.
c. You shall not operate the machine with any procedures that are not specified in the manual. Such
operation may cause unexpected breakdown and/or incident. Please understand if such un-speci-
fied operation caused the breakdown and/or incident, Shinkawa should not take any responsibility.
d. Please understand Shinkawa shall not take any responsibility for directly and/or indirect damage
owing to the manual and the machine and the software problem.
e. After reading the manual, you are required to keep it in custody carefully to can use it any time.
Whenever you cannot understand the machine operation and/or feel any abnormality during the
machine running, please read the manual again.
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CONTENTS
Chapter 1 Wire Bonding Process 5

1-1 Wire Bonding......................................................................................... 6
1-2 Elements of the Wire Bonding............................................................. 9
Chapter 2 Wire Bonding Sequence 11

2-1 Bonding Cycle......................................................................................... 12
2-2 Description of Character.......................................................................... 13
2-3 Wire Bonding Sequence.......................................................................... 14
Chapter 3 Menu Tree 19

3-1 Table of Top Menu Mode................................................................. 20
3-2 File.................................................................................................... 21
3-3 Edit.................................................................................................... 22
3-4 View.................................................................................................. 25
3-5 Tool................................................................................................... 26
3-6 Product Management........................................................................ 28
3-7 Machine Management...................................................................... 29
3-8 Window............................................................................................. 32
3-9 Help................................................................................................... 34
Chapter 4 Bond Parameter 35

4-1 Description of Monitor Screen.......................................................... 36
4-2 Description of Setting Range.............................................................. 39
4-3 Description of 1st Bond Parameter..................................................... 41
4-4 Description of 2nd Bond Parameter..................................................... 56
4-5 Description of Spark Parameter........................................................... 65
4-6 Description of Bump Spark Parameter............................................... 68
4-7 Description of Bump Bond Parameter................................................... 70
4-8 Description of Cut Action Parameter.................................................. 74
4-9 Selection of Capillary......................................................................... 82
4-10 Adjust to improve the bondability.......................................................... 85
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Chapter 5 Loop Parameter 87
5-1 Kind of Loop Mode............................................................................ 88
5-2 Selective Method of Loop Mode........................................................ 90
5-3 Description of Loop Mode................................................................. 94
5-3-1 Description of STD Loop Mode....................................................... 94
5-3-2 Description of SQR Loop Mode....................................................... 102
5-3-3 Description of SQR2 Loop Mode..................................................... 110
5-3-4 Description of M Loop Mode........................................................... 116
5-4 Description of Improved Loop Mode (a-series)................................. 119
5-4-1 Description of STD Improved Loop Mode (a-series)....................... 119
5-4-2 Description of SQR Improved Loop Mode (a-series)....................... 129
5-4-3 Description of SQR2 Improved Loop Mode (a-series)..................... 138
5-4-4 Description of M Improved Loop Mode (a-series)........................... 146
5-5 Description of Low2 Loop Mode...................................................... 151
Chapter 6 Reference Data 159
6-1 Stack Bonding................................................................................... 160
6-2 Stack Reverse Bonding..................................................................... 162
6-3 35µm Pad Pitch Bonding................................................................... 165
6-4 High Speed Bonding......................................................................... 167
6-5 Thin Die Reverse Bonding................................................................ 171
6-6 Setting Table...................................................................................... 174
6-7 Comparable Table with UTC-400 Series.............................................. 176
6-8 Comparable Table of Performance....................................................... 177
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For Safety
You are required to obey the cautions and warnings for the machine safety operation.
Data such as product data, frame data, magazine data and conflation machine data
shall be often stored with CD-RW or Floppy disk and another media. Please understand
Shinkawa shall not take any responsibility for the damaged information and contents in
the hard disk caused by Hard disk error and/or breakdown can not recover.
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Chapter 1 Wire Bonding Process
C.1 Contents
1-1 Wire Bonding .............................................................................. 6
C.2 Contents
1. What is the Wire Bonding ................................................................ 6
2. Chip Electrode (Pad) ........................................................................ 6
3. Lead Electrode (Lead) ...................................................................... 6
4. Metal Thin Wire .............................................................................. 7
1-2 Elements of the Wire Bonding....................................................... 9
C.3 Contents
1. Bonding Process .............................................................................. 9
2. 3 Elements of the Bonding .............................................................. 9
3. Bonding Force ................................................................................. 10
4. Output Ultrasonic Generating Power ............................................... 10
C.4 Contents
5. Ultrasonic Time ................................................................................ 10
6. Capillary .......................................................................................... 10
C.5 Contents
C.6 Contents
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< Chapter 1 Wire Bonding Process >
1–1 Wire Bonding

Process
C.1 Wire Bonding
Bonding Concept fig.1-1

(1) What is the Wire Bonding
Generally, the wire bonding is commonly known
as operation with the narrow metallic wire
connections. Between the IC or LSI (a wafer chip
printed the integrated circuit: it also called as a

Sequence
C.2 Wire Bonding
Silicon chip or Die embodied in the IC) chip
electrode, and the external electrode in the
leadframe is connected by the wire bonding.
According to a multi-pin development and a fine-

Menu Tree
C.3
pitch pad development of the bonding device,
except for “Wire bonding”, demand of “Tape
(TAB) bonding” and “Flip chip bonding” method
is increasing.
However, by the profitable reasons such as “Easy

Bond Parameter
C.4
parts exchange” and “Cost performance”, the wire
bonding is the predominant system in the semicon-
ductor assembly industry.
Bonding Systems
Loop Parameter
C.5
(2) Chip Electrode (Pad)

Aluminum (Al) is mainly applied to
the material as the chip electrode.
Currently, copper (Cu) begins to be
applied to the material.

Reference Data
C.6
(3) Lead Frame Electrode (Lead)

In the lead frame type, the vacuum
evaporation (The thin copper film

deposition method by the heat
evaporating in the vacuum phase) of
the silver to copper mainly
applied to the material as the lead

fig.1-2
frame electrode. Recently, the bare

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copper without the silver vacuum
1-1
BGA Frame
evaporation is mainly applied to
the material.
1-2
(4) Metal Thin Wire
Generally, the gold wire or alumi-
num wire or copper wire is applied
as the material for the wire bond-

Alloy Frame
ing.
fig.1-3
The equipment ‘UTC- 1000’ ap-
plies the gold wire (ø 15 to 38µm). There are some kinds of the gold wire according to its diameter and/or
dopant. The gold wire is a high purity of more than 99.99%. The micro quantity of the dopant effects and
changes the loop deformation character in the bonding.
The tip of the wire is passed through the capillary. The tip of the wire is fused by the electric spark from the
torch electrode. The fused tip of the wire is a ball form as sphere with the surface tension.
In the reaction, not only the ball but also the wire (gold wire) connecting with the ball has been annealed
(heat and allow metal to cool
slowly). So that, the dopant have ef- Aluminum Wire Gold Wire
fected the crystals-again region of
the wire during its crystals-again.
The loop (Curve between the pad
and lead) has not been annealed. So
that, in the standing up of pad re-
gion, the character of the wire and
the loop deformation shall be dif-

fig.1-4
ferent. It effects to the loop height.
The figure (see next page) shows an example for the loop height changing by the effect of the annealing
region. For selection of the wire, you are required to compare and understand the technical data of the gold
wire described in the catalogues and/or information provided from the wire maker. And then, please select
and adopt the appropriate wire for target.
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Starting up on Bonded Ball

Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
fig.1-5
Menu Tree
C.3
Crystal-again by Anneal*
Bond Parameter
C.4
fig.1-6
Loop Parameter
C.5
It is the A • B • C • D of the above figure [Starting up on Bonded Ball].
*Anneal : Heat and allow metal to cool slowly.

Reference Data
C.6
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1–2 Elements of the wire bonding

Elements of the Wire Bonding
1-1
(1) Bonding process
The equipment “UTC-1000” make the bonds
between the wire and the electrode by the US
1-2
vibration (approximate 120KHz) form the
capillary and thermal force from the heater
block.
The equipment press the ball and the wire
(gold wire as wire material) passing through
the capillary located in the tip of the trans-
ducer, put the US energy horizontally (front
and/or back) toward the pad or lead surface,
and heat the gold wire and the aluminum or

fig.1-7
copper (Pad) and silver or copper (Lead) to
produce a metallurgical bond by the heating from the heater block located on the pad and the contacting
surface under the lead.
By the heater block, BGA substrate is heated to be 150 degC (approximate), Lead frame is heated to be
230 degC (approximate).
(2) 3 Elements of the Bonding
fig.1-8
As above figure “3 elements of the bonding”, the bonding process can be realized on the balance between
combinations of [Heat (Heater block temperature)], [Force], [US energy] (3 elements) and “Time” to
control them.
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(3) Bonding Force

Process
C.1 Wire Bonding
The force to press the pad and lead in the contact. In a standard fine-pitch (Wire diameter : ø 20µm,
Bonded ball diameter : ø 40µm), 10 to 15gf on the pad side, 20 to 30gf on the lead side.
(4) Output Ultrasonic Generating Power
US energy provided volume during the wire contacting with the pad or lead. In a standard fine-pitch (Wire
Sequence
C.2 Wire Bonding
diameter : ø 20µm, Bonded ball diameter :ø 40µm), 200 to 300 bit on the pad side, 200 to 300 bit on the
lead side.
(5) Ultrasonic Time
US energy providing time during the wire contacting with the pad or lead. In a standard fine-pitch (Wire
diameter : ø 20µm, Bonded ball diameter : ø 40µm ), 5 to 10 sec on the pad side, 5 to10 sec on the lead side.
Menu Tree
C.3
(6) Capillary
In the bonding process, the capillary has much important
action to transfer the US energy to the ball contacting the

Capillary
capillary. In the chapter, we describe a general explana-
tion of the capillary. Regarding the details of the capil-

Bond Parameter
C.4
Ceramics
lary, refer to [Selection of Capillary] (page 82) in the
“Chapter-4 Bond Parameter”.
Capillary is equipped on the tip of the transducer. The

Ruby
fig.1-9
wire is passing through the capillary from upper to lower.
Loop Parameter
C.5
Purpose of the capillary is to contact between the wire or
the ball and the pad or lead. Ceramic (Alumina) or Ruby is applied to the material of the capillary. For the
fine-pitch development, a narrow tip shape capillary such as [Bottle neck type] is mainly adopted.
Reference Data
C.6
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Chapter 2 Wire Bonding Sequence
C.1 Contents
2-1 Bonding Cycle .......................................................................12
C.2 Contents
2-2 Description of Character ......................................................13
a. Capillary ........................................................................................13
b. Wire Clamper ............................................................................... 13
c. Wire .............................................................................................. 13
d. Torch Electrode ............................................................................ 13
C.3 Contents
e. Pad ................................................................................................ 13
f. Lead .............................................................................................13
g. Ball ............................................................................................... 13
h. Heater Block ................................................................................13
C.4 Contents
i. Ultrasonic Vibration ..................................................................... 13
2-3 Wire Bonding Sequence .........................................................14
(1) Start ...........................................................................................14
(2) Capillary Lift Down ............................................................. 14
(3) 1st Bonding ...............................................................................15
C.5 Contents
(4) Reverse ......................................................................................15
(5) Peak Height ..................................................................................16
(6) 2nd Bonding ..............................................................................16
(7) Tail Length ..................................................................................17
(8) Wire Cut ....................................................................................17

C.6 Contents
(9) Ball Formation ..........................................................................18
(10) 1 Cycle Finish ............................................................................18
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< Chapter 2 Wire Bonding Sequence >
Refer to an another pdf. file [2 – 1 Bonding Cycle].
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2–2 Description of Character
2-1
c
2-2
b
2-3
a
i
d
g
e f
h
fig.2-2
a. Capillary
It is a tool equipped on the tip of the transducer (US vibrator). Purpose is to contact and transfer the US energy to the wire.
b. Wire Clamper
According to the condition, open or close to control the wire providing.
c. Wire
The wiring material is for bonding a lead and a pad. The equipment [UTC-1000] is applied the gold wire.
d. Torch Electrode
To deform the ball on the top of the wire, arising the electric spark.
e. Pad
Wire bonding region in the integrated circuit (IC • LSI) side.
f. Lead
Wire bonding region in the lead frame side.
g. Ball
Sphere form on the wire top, to bond between the wire tip and the pad.
h. Heater block
During the bonding between the ball and the pad or the lead, heat the pad and the lead from bottom side.
i. Ultrasonic vibration
During the bonding between the ball and the pad or the lead, provide the ultrasonic vibration.
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2–3 Wire Bonding Sequence

Process
C.1 Wire Bonding
(1) Start
The tip of the wire is positioned on the tip of the
capillary (chamfer area). The tip of the wire formed
spherically is in the held state, and maintains a
spark level. The clamper has closed.

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
fig.2-3
(2) Capillary Lift Down

The clamper opens and capillary lift down. It slows
down at search speed from a search level, and de-

Loop Parameter
C.5
scends to the pad surface, and a ball and a pad
side contact. After impact force starts, force shifts.

Reference Data
C.6
fig.2-4
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(3) 1 st Bonding
The ball have contacted with the pad surface, pro-
2-1
viding the 3 bonding element [Heat (heater block
temperate)], [Force], [US vibration] during the
2-2
specified time.
The ball is mashed, and the metallurgical bond has
been taken place between the contact region (Au-
2-3
Al), and then the pad and the wire have been
bonded. The clamper is open.
fig.2-5
(4) Reverse
To deform the appropriate loop, the capillary is
lifting up and moving the reverse action. The ac-
tion has been controlled by the selected mode that
have already inputted in the loop mode.
From the tip of the capillary, a wire required in
order to form a loop is sent out. The clamper keep
opening without sets [YES] on the [Reverse
clamper].
fig.2-6
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(5) Peak Height

Process
C.1 Wire Bonding
The capillary is positioned to the peak height, and
then the clamper shall close without you sets [0]
on the [Clamper open/close]. X-axis table, Y-axis
table, Z-axis of Bonding head shall move in the
same time to forward the capillary toward the lead

Sequence
C.2 Wire Bonding
position.
Menu Tree
C.3
Bond Parameter
C.4
fig.2-7
(6) 2nd Bonding
The wire have contacted with the pad surface, pro-

Loop Parameter
C.5
viding the 3 bonding elements [Heat (heater block
temperate)], [Force], and the amplitude of the cap-
illary tip [US vibration], during the specified time.
Wire is mashed, and the metallurgical bond has been
taken place between the contact region (Au-Al),

Reference Data
C.6
and then the pad and the wire have been bonded.
The clamper is open.
fig.2-8
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16
(7) Tail Length
2-1
The capillary is lift up. The capillary have risen to
the [Tail length] that have already inputted, and
then the clamper shall close.
2-2
2-3
fig.2-9
(8) Wire Cut

Since the capillary is lift up more with the clamper
closing, the wire has been cut by the lead-bonded
position.
fig.2-10
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(9) Ball Formation

Process
C.1 Wire Bonding
The capillary is lift up more. [Spark gap] position
that have already inputted, and then the torch elec-
trode is sparked and heat melted the tip of the wire.
The melting tip of the wire shall deform the ball

Sequence
C.2 Wire Bonding
from as the sphere with the surface tension.

Menu Tree
C.3
Bond Parameter
C.4
fig.2-11
(10)1 Cycle Finish
During the continuous running of the equipment,
X-axis table and Y-axis table move to stop on the

Loop Parameter
C.5
next pad position.
Above actions are the steps of a cycle of the bond-
ing.
Reference Data
C.6
fig.2-12
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Chapter 3 Menu Tree
C.1 Contents
3-1 Table of Top Menu Mode ........................................................ 20
C.2 Contents
3-2 File ......................................................................................... 21
3-3 Edit ......................................................................................... 22
3-4 View ....................................................................................... 25
3-5 Tool ........................................................................................ 26
3-6 Product Management ............................................................ 29
C.3 Contents
3-7 Machine Management ........................................................... 30
3-8 Window .................................................................................. 33
3-9 Help ........................................................................................ 34
C.4 Contents
C.5 Contents
C.6 Contents
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< Chapter 3 Menu Tree >
20
fig.3-1
Table of Top Mode Menu
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3–1
C.1 Wire Bonding C.2 Wire Bonding C.3 C.4 C.5 C.6
Process Sequence Menu Tree Bond Parameter Loop Parameter Reference Data
In this chapter, description about the top menu of a monitor screen is given.
3-1
Regarding the details of the how to use the each window, control, and the descriptions of each terms, refer to
[Chapter-4 Window operation & Technical Terms] in the First Step Guide.
3-2
3 – 2 File
Contains operations in general concerning various files.
3-3
3-4
3-5
3-6
fig.3-2
(1) Create New [File]
3-7
Create new data (product type, lead frame, magazine).
(2) Open [File]
The existing date file is searched and opened.
3-8
(3) Close [File]
The data file currently opened is closed. Normally, it does not display. 3-9
(4) Save [File]
Overwrites the selected data and stores it.
(5) Save As [File]
Stores the selected data under a different name.
(6) Import [File]
The existing CAD data file (* .wcd) is read and set as coordinate data of the product type data.
(7) Export [File]
A function to output the CAD data of the current product type data, bond parameters, production
status, and error status in the file format.
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(8) Upload [File]

Process
C.1 Wire Bonding
<Option> Sends product type data to the host computer.
(9) Download [File]
<Option> Reads product type data from the host computer.
(10) Utility [File]

Sequence
C.2 Wire Bonding
Movement and the copy of bonding program data are made.
(11) File Property [File]
The contents of the chosen file can be checked. [Tab]
• General The details of a file can be checked.

• Product The details of a product type (the name of the unit, which consisted of a setting of the
Menu Tree
C.3
order of a device and a device, a frame, and magazine data) can be checked.
• Security A setting can be checked.
(12) Eject CD [File]
CD-R or CD-RW is taken out from a CD-RW drive.
(13) Shut Down [File]

Bond Parameter
C.4
Activates the shutdown dialog to shut down the UTC-1000 program.
3 – 3 Edit
Contains operations in general concerning data edit.

Loop Parameter
C.5
Reference Data
C.6
fig.3-3
(1) Del [Edit]
When coordinate (position) is displayed by edit screen (setting various data, background/orange),
specified bonding coordinate (position) is deleted.
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(2) Copy [Edit]
3-1
specified at the time of multi-bond creation bonding coordinate (position) is copied.
(3) Move [Edit]
3-2
specified bonding coordinate (position) is moved.
(4) Rotate [Edit]
3-3
When malti-chips edit is displayed, at the time of multi-bond creation specified bonding coordinate
(position) is rotated.
(5) Inline [Edit]
3-4
Bonding coordinates (position) are made located inline. It is displayed when two or more bonding
coordinates (position) are specified.
3-5
(6) Wire Shift Mode [Edit]
One position of pad or lead can be deleted and the interval of a bond position can be contracted.
(7) Ringbond Set
3-6
The position of a ring bond can be specified.
(8) Select [Edit]
3-7
When coordinate (position) is displayed by edit screen (setting various data, background/orange), the
bond position and wire to specify are selected. [Select ]
All Pad All the bonding coordinates points by the side of a pad are specified.
3-8
All Lead All the bonding coordinates points by the side of a lead are specified.
All Wire All of the bonding coordinates point of both pad and lead are specified.
All Bump All Bump bond coordinates points are specified.
3-9
All Pin Not displayed.

Wire length Bonding wire length is specified and a position is selected.
(9) Coordinate Input [Edit]
The coordinate of the new bond point can be input (addition). Initial setting is pad & lead. [Select ]
Wire (Pad) The mode is manual and inputs only a pad point into coordinate.
Wire (Lead) The mode is manual and inputs only a lead point into coordinate.
Wire The mode inputs a pad point and a leading point manually by turn.
Bump The mode inputs only a bump point.
Pin Not displayed.

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Bump Wire (P L) The mode inputted a pad of a bump and is inputted in order of a lead point.
Process
C.1 Wire Bonding
Bump Wire (L P) The mode input a lead of a bump and is inputted in order of a pad point.
Bump Wire (P P) The mode inputted into a pad point from the pad point which a bump has.
Automatic input wizard Inputting into coordinates follows a wizard.
(10) Centering [Edit]
Centering processing is performed at the bond point (multiple objects selectable) chosen. [Select ]
Sequence
C.2 Wire Bonding
Pad Processing of centering is performed with pad side coordinates (position).

Lead Processing of centering is performed with lead side coordinates (position).
Pad and Lead Processing of centering is performed with the coordinates (position) of both of pad
and lead.
Menu Tree
C.3
Bump Processing of centering is performed with bump coordinates (position).

Pin Not displayed.
(11) Lead Training [Edit]
The detection data of the lead locater (a function to correct the lead side bond points before bonding)
is restarted.
Bond Parameter
C.4
(12) Shift Control [Edit]
The range of shift control is in a selection chip at the time of coordinates edit, and a bond point and
alignment point is a movable object. Shift control operates in order of a move mode bond point, a
wire, and an alignment according to the candidate for selection. [Tab]
• Shift Shift control chooses a shift unit (bond point, wire, chip), and operates.
Loop Parameter
C.5
• Jump After movement determines a position and determines a movement place, it pushes
a button.
(13) Live Image Set [Edit]
Bond area, illumination, and camera magnification are set up.

Reference Data
C.6
(14) Running Condition (Product Data) [Edit]
Data is set up with the alignment detection, the lead locater, the reject chip, indexer 1, indexer 2, In-
dexer 3, and the teaching tab. [Tab]
• Alignment detection Detection conditions can be set up.
• Lead locater Each correction conditions of a lead can be set up.

• Reject chip Reject chip detection of a chip can be set up.
• Indexer 1 Frame detection conditions of a lead can be set up.
• Indexer 2 Indexer operation conditions can be set up.
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24
• Indexer 3 The transportation speed can be set up.
• Teaching Automatic detection conditions after teaching can be set up.
3-1
• Other Image display after bonding can be set up.
(15) Product Resource Set [Edit]
3-2
The form of a wire and a capillary can be inputted.
(16) Device Offset Set [Edit]
Parallel translation of bonding coordinates (position) can be performed.
3-3
(17) Bond Level Set [Edit]
Set the bond level to each bond point.
3-4
3 – 4 View
Contains operations in general concerning display on the machine screen.
3-5
3-6
3-7
3-8
fig.3-4
(1) Main image Zoom [View]
The main image can be made larger or smaller. [Select ]

3-9
x1 – x10 Select a magnification from x1 to x10. The screen size in the initial state is x1.
(2) Sub image Zoom [View]
The sub image can be made larger or smaller. [Select ]
x1 – x10 Select a magnification from x1 to x10. The screen size in the initial state is x1.
(3) Change Image [View]
The display is switched over between the main image and the sub image.
(4) Toolbar Position Change [View]
You can set whether the custom toolbar being used is to be placed at the top or the bottom.
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(5) Show Graphic [View]

Process
C.1 Wire Bonding
Select items, which are to be displayed on the live image and the static image. [Select ]
All On both the live image and static image, all graphic display is set to no-display.
Pad Shows the pad point.
Lead Shows the lead point.
Wire Shows the wire.

Sequence
C.2 Wire Bonding
Wire No. Shows the wire No.
Caliper window Shows the caliper window.
Bump Shows the bump point.
Pin Not displayed.

Menu Tree
C.3
Virtual point of ring bond Shows the virtual point of a ring bond.
(6) Property [View]
The property dialog will be activated. The contents to be shown depend on what is selected such as a
bond point, alignment point and chip when the dialog is activated.
(7) Coordinate List [View]

Bond Parameter
C.4
When the edit screen (setting various data, background/orange) is displayed, the bonding coordinates
(position) used and wire length can look through.
3 – 5 Tool
Contains tools useful for equipment operation.

Loop Parameter
C.5
Reference Data
C.6
fig.3-5
(1) XY Measurement [Tool]
When the running screen (production status, information about product types, and etc. are displayed.
background/blue) is setting, the object to measure can be taken as a live image and a distance
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26
< Chapter 3 Men Tree >
between two points and X and Y distances can be measured.

(2) Wire Curl Check [Tool]
3-1
background/blue) is setting, curl (sway) of the bonded wires can be measured on the screen.
3-2
(3) Bonded Ball Diameter [Tool]
background/blue) is setting, the ball diameter of the bonded wires can be checked.
3-3
(4) Change Utility [Tool]
Change the capillary installed on the equipment. [Select ]
Change Capillary Change the capillary installed on the equipment. Use the capillary replacement
3-4
jig and follow the instructions on the replacement wizard screen.
Change Capillary Expert Shows the icon for replacing process of capillary.
3-5
(5) Manual Bond [Tool]
This is used to perform bonding by specifying the 1st bond point and the 2nd bond point manually.
(6) Rework Bond [Tool]
3-6
After bonding, the place by which wire is not connected by nonstricking etc. is re-bonding.
(7) Preliminary Bond [Tool]
Perform preliminary bonding to form ball at the tip of a wires.
3-7
(8) Input Check [Tool]
You can check the on/off status of the sensors used by individual units of the equipment. [Tab]
3-8
• XY The sensors for the X-axis motor and the Y-axis motor can be checked.
• Z The sensor installed around the Z-motor can be checked.
• Spool The sensors installed around the spool unit can be checked.
3-9
• Loader The sensors installed around the loader unit can be checked.
• Indexer The sensors installed around the indexer can be checked.
• Unloader The sensors installed around the unloader unit can be checked.
• Operation Panel The switches on the operation panel can be checked.
(9) Output Check [Tool]
The output units of the equipment can be checked. The contents set in the dialog will be reflected on
the actual equipment. [Tab]
• Signal Tower On, off and flicker of each color used on the signal tower can be checked and on/
off of the buzzer can be checked.

NE00039-00
27
• Bond Head Open/close of the wire clamper can be checked.

Process
C.1 Wire Bonding
• Loader On/off of the loader magazine clamper can be checked.
• Indexer On/off of the indexer clamper can be checked.
• Unloader On/off of the unloader magazine clamper can be checked.
• Operation Panel The on/off operation of the [Start/Stop] button LED lamps can be checked.
Sequence
C.2 Wire Bonding
• Other The on/off operation of the wire tension can be checked.
(10) US Power Monitor [Tool]
This shows the pad and lead US power waveforms. The US power waveforms can be checked while
changing the equipment parameters.
(11) Spark Monitor [Tool]

Menu Tree
C.3
The waveform information of spark can be monitored. When the electrode is caused to spark with
the dialog activated, waveforms when it sparks can be checked in real time.
(12) Indexer unit op move... [Tool]

The origin point of each unit of the Indexer, the loader, and the unloader is moved.
(13) Frame Clear [Tool]

Bond Parameter
C.4
A function to inform the machine that no lead frames is present on the indexer.
(14) Drive ON/OFF [Tool]
Set ON/OFF of the power line of each unit.
(15) Message Transmit [Tool]

Loop Parameter
C.5
<Option> The dialog to transmit text messages to the host computer will be activated.
(16) Receive Text [Tool]
<Option> A text message receive from the host computer will be displayed.
Reference Data
C.6
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28
3 – 6 Product Management
3-1
Contains operations concerning production management.
3-2
3-3
3-4
fig.3-6
3-5
(1) Production Target [Product Management]
Set the number of target production. Specification of the unit at the time of production (device, IC,
frame, magazine) and operation when production attains can be set up.
3-6
(2) Machine State [Product Management]
The dialog displays the information on machine status. [Tab]
3-7
• Production Status Total of MTBA (the mean time between machine assists), the display of
the output in the specified unit, and the count clear by the reset button that
it can do.
3-8
• Resource Management Set of the number of times of use of a resource (spool, capillary, electrode,
clamper), and the remaining number of times is displayed.

• Error Management The dialog which displays an error count is a unit exception. A push on a
3-9
[reset] button clears the count of each unit.
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29
3 – 7 Machine Management
Process
C.1 Wire Bonding
Contains operations concerning equipment management.

Sequence
C.2 Wire Bonding
Menu Tree
C.3
fig.3-7
(1) Log Viewer [Machine Management]
The event log can be viewed. A log file can be stored and a comment about each event can be added.
(2) Machine Specific [Machine Management]
Set of each unit, and correction are performed. [Select ]

Bond Parameter
C.4
XY limit Set the software limit values of the XY table.
Indexer adjustment Indexer and stacker adjustment are performed as transportation related
equipment specific data (machine data).
• Indexer adjustment A setup and installation of guidance can be set up.

Loop Parameter
C.5
• Heater block A height correction of a heater block can be set up.
Z calibration Set the Z motion ratio, Z origin correct, Z force fine and Z force correction.
US calibration Set a tuning frequency and a calibration value.
Camera calibration Calibrate a ratio using the XY table move amount and the camera move
distance.
Reference Data
C.6
Torch level Set a torch level. For setting, use the jig and follow the instructions of the
wizard.
Camera offset Set and finely adjust the camera-tool offset value.
PRS The reference system (RPS) is an automatic calibration function by
detecting an image of the capillary-to-camera offset.
RPS offset set Calibration of bond position gap is performed after RPS direction.
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Wire clamper calibration The wire clamper motion is corrected.
3-1
Heater Tuning Meter parameter A Heater temperature can be set up.
(3) Machine Composition [Machine Management]
Set a equipment composition. [Select ]
3-2
Hardware Composition The composition of hardware can be set up.
Signal tower composition Set the signal tower of equipment.
(4) Environment [Machine Management]
3-3
Make settings related to environment data for the equipment management. [Tab]
• Machine Name/Language A setting tab of the equipment name and the language to use.
3-4
• View A setting tab related to screen display.
• Folder A setting tab related to the data folders.
• File/History A setting tab related to the history of file edits.
3-5
• Start A setting tab related to equipment activation.
• Edit condition A setting tab related to edit of product type data.
• Color A setting tab related to colors used on the screen.
3-6
(5) Tool Bar Customize [Machine Management]
The custom tool buttons can be set (group add/delete, command store/delete).
3-7
(6) Operator Access [Machine Management]
Set the access right to the setting items (window, dialog, file) of the equipment.
(7) SECS [Machine Management]
3-8
<Option> Not displayed.
(8) Time Set [Machine Management]
Set the time of the equipment.

3-9
(9) Running Condition [Machine Management]
Each data of bond control, indexer control, error detect condition, resource warning
condition, and capillary auto calibration tab can be set up. [Tab]
• Bond control Bonding operation at the time of running can be set up.
• Indexer control Indexer state at the time of running can be set up.
• Error detect condition Error detection can be set up.
• Resource warning condition The display warning in the production status tab window of a
running screen (production status, information about product
types, and etc. are displayed. background/blue) can be set up.

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31
• Capillary Auto Calibration Detection timing of RPS can be set up.

Process
C.1 Wire Bonding
(10) Input Limit [Machine Management]
The input setting range can be set up. [Tab]
Bond parameter Setting change range of the can be set up.
Coordinate correction area Bonding coordinate correction range can be set up.
Sequence
C.2 Wire Bonding
(11) Signal Tower Set [Machine Management]
The lighting state of the signal tower can be set up.
(12) Bondhead Wait Position [Machine Management]
Set a position which the bond head escapes to. The bonding head escape position can be set in two
places of the rear side and the front side. Use either the rear side or the front side according to your
Menu Tree
C.3
applications.
(13) Clamper Rise Wait Position [Machine Management]

The position at the time of a clamper rise for which it waits can be set up.
(14) Operator Registration [Machine Management]
Set of operator name of equipment.

Bond Parameter
C.4
(15) Resource Store [Machine Management]
A use wire type and capillary type, the details of resource are set up. [Tab]
Wire Store The wire can be added, corrected, stored and deleted in wire
database.
Loop Parameter
C.5
Capillary Store The capillary type can be added, corrected, stored and deleted
in capillary database.
Reference Data
C.6
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3 – 8 Window
Contains move between the running screen and the edit screen.
3-1
3-2
3-3
3-4
fig.3-8
3-5
(1) Main [Window]
If it selects from a menu, the Main tab of a edit screen will open.
(2) Production [Window]
3-6
If it selects from a menu, the Production tab of a edit screen (the screen which sets up various data,
background/blue) will open.
(3) Error [Window]
3-7
If it selects from a menu, the Error tab of a edit screen (the screen which sets up various data,
3-8
(4) Inspection [Window]
If it selects from a menu, the Inspection tab of a edit screen (the screen which sets up various data,

3-9
(5) Measurement [Window]
If it selects from a menu, the Measurement tab of an edit screen (production status, information
about product types, and etc. are displayed. background/blue) will open.
(6) Coordinate Edit [Window]
If it selects from a menu, the Coordinate Edit tab of an edit screen (the screen which sets up various
data, background/orange) will open.
(7) Bond Parameter [Window]
If it selects from a menu, the Bond Parameter tab of an edit screen (the screen which sets up various

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33
(8) Base Parameter [Window]

Process
C.1 Wire Bonding
If it selects from a menu, the Base Parameter tab of an edit screen (the screen which sets up various
(9) Order Set [Window]
If it selects from a menu, Order Set tab of a edit screen (the screen which sets up various data,
Sequence
C.2 Wire Bonding
background/orange) will open.
(10) BI [Window]
If it selects from a menu, the BI tab of an edit screen (the screen which sets up various data, back-
ground/orange) will open.
(11) Frame [Window]

Menu Tree
C.3
If it selects from a menu, the Frame tab of an edit screen (the screen which sets up various data,
(12) Magazine [Window]
If it selects from a menu, the Magazine tab of an edit screen (the screen which sets up various data,

Bond Parameter
C.4
3 – 9 Help
Contains online helps and version information.

Loop Parameter
C.5
Reference Data
C.6
fig.3-9
(1) Contents [Help]
This equipment has an online help in case you need information about equipment operation.
(2) About… [Help]
The version information dialog of the equipment's application will be activated.
NE00039-00
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Chapter 4 Bond Parameter
C.1 Contents
4-1 Description of Monitor Screen.................................. 36
C.2 Contents
(1) Bond Parameter Screen.............................................. 36
(2) Classification.............................................................. 36
(3) Object......................................................................... 36
4-2 Description of Setting Range.................................... 39
(1) Classification Wire Setting......................................... 39
C.3 Contents
(2) Classification Bump Wire Setting.............................. 39
4-3 Description of 1st Bond Parameter........................... 41
4-4 Description of 2nd Bond Parameter.......................... 56
4-5 Description of Spark Parameter................................ 65
C.4 Contents
4-6 Description of Bump Spark Parameter...................... 68
4-7 Description of Bump Bond Parameter.......................... 70
4-8 Description of Cut Action Parameter.......................... 74
4-9 Selection of Capillary................................................. 82
4-10 Adjust to improve the bondability................................ 85
C.5 Contents
C.6 Contents
NE00039-00
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< Chapter 4 Bond Parameter >
4 – 1 Description of Monitor Screen

Process
C.1 Wire Bonding
(1) Bond parameter screen
The [Window] is displayed on a monitor from the top menu, and edit screen [Bond Parameter] screen is
selected.
Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
fig.4-1
The classification and object setting are displayed in the bond parameter screen.
Reference Data
C.6
(2) Classification
Wire : Normally, it adopt the wire setting (Default value).
Bump Wire : Display for the bump and wire bonding setting.
Bump : Display for the bump bonding setting.
(3) Object
Select the Classification from dialogue in the parameter screen and select the object.
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36
A. Classification [Wire]
4-1
Select the Classification Wire, 4 items are displayed as the object.
a. 1st Bond
Set the 1st bond point condition.
4-2
b. Loop
Set the wire loop form condition.
c. 2nd Bond
4-3
Set the 2nd bond point condition.
d. Spark
4-4
Set the tail cut and the spark condition
(Initial bonded ball deforming) after
finishing the 2nd bond point. fig.4-2
4-5
B. Classification [Bump Wire]
Select the Classification Bump Wire, 7 items are displayed as the object.
a. Bump Bond
4-6
Deform a convex connection electrode
(Bump) and then wiring.
b. Cut Action
4-7
Set the wire cut condition on the bump tail.
c. Spark
4-8
Set the spark condition for the ball of wire
(Deforming the initial ball).
d. 1st Bond
4-9
Set the 1st bond point condition.
e. Loop

4 - 10
f. 2nd Bond
g. Bump Spark
Set the spark condition (Initial ball deforming) of the bump . fig.4-3
NE00039-00
37
C. Classification [Bump]
Process
C.1 Wire Bonding
Select the Classification Bump, 3 items are displayed as the object.
a. Bump Bond
Deform a convex connection electrode (Bump).
b. Cut Action
Sequence
C.2 Wire Bonding
Set the wire cut condition on the bump tail.
c. Bump Spark
Set the spark condition (Initial ball deforming) of the
bump .
Menu Tree
C.3
fig.4-4
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
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38
4 – 2 Description of Setting Range
4-1
Describe of the classification and setting range with the timing chart.
(1) Classification [Wire] setting

Timing Chart
4-2
4-3
4-4
4-5
4-6
fig.4-5
A. 1st Bond : Set the 1st bond point condition.
4-7
B. Loop : Set the wire loop form condition.
C. 2nd Bond : Set the 2nd bond point condition.
4-8
D. Spark : Set the tail cut and the spark condition (initial ball deforming) after finishing the 2nd bond
point.
• In the displayed top menu [Window] - [BaseParameter], you can adjust the Z axis (UP / DOWN)
4-9
motion speed.
• In the displayed top menu [Window] - [Base Parameter], you can change the spark timing to deform
the initial ball (initially ball form).

4 - 10
• The spark height change by settings of the height and tail length and the spark gap in the tab [Torch
Level Wizard] in the displayed top menu [Machine Management] - [Machine Specific] - [Torch
Level].
NE00039-00
39
(2) Classification [Bump Wire] setting

Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
Menu Tree
C.3
fig.4-6
Bond Parameter
C.4
A. Bump Wire : Set the Bump bond condition
B. Cut Action : Set the wire cut condition of the Bump.
C. Bump spark : Set the spark condition in the Bump.
• Timing of the bump bond change by the Bump Wire setting P L, L P, P P.

Loop Parameter
C.5
• Other settings are same as the wire setting.
. Unless the parameter creation, [Classification Bump Wire] and [Bump Parameter]
can not be displayed.

Reference Data
C.6
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40
4 – 3 Description of 1st Bond Parameter
4-1
(1) Mode setting
• Set item : PAD-STD or PDA-3STEP
• There are 2 mode [PAD-STD], [PAD-3STEP] as the 1st bond parameter.
4-2
• By the PAD-STD, you can set only one step in parameter [US time], [US power], [Bond force],
[Force time]. But you can set 3 steps by the PAD-3STD.
4-3
PAD-STD PAD-3STEP
4-4
4-5
4-6
4-7
fig.4-7 fog.4-8
(2) Search level setting
Set range : 0.0 to 1000.0µm Set step : 0.1µm/ step
4-8
By the menu, you set the slowdown height position of falling down speed from the spark level.
By the setting in [Search level], [Search speed], [Search force], you can control the impact force onto
the pad surface.

4-9
Refer to “6-7 Comparable Table with UTC-400 Series” (page 176) about set value.
4 - 10
• Select PAD-3STEP, the bond time is to be the sum of the setting 1, 2, 3.
The bond time shall be longer than PAD-STD selecting.
• If the search level setting is low, capillary is possible to clash against the die.
Because the die is possible to be higher with the adhesive agent thickness chang-
ing.
• If the search level setting is high, the bond speed shall be slow.
NE00039-00
41
Process
C.1 Wire Bonding
Each Setting Timing Chart

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
fig.4-9
(3) Search Speed setting
• Set range : 1.0 to 80.0mm/s Set step : 0.1mm/s /step
• Set the capillary fall speed from the search level.
• If the speed setting is slow, the impact force shall be light.

Loop Parameter
C.5
• Refer to “6-7 Comparable Table with UTC-400 series” (page 176) about set value.
(4) US time setting
• Set range : 0 to 150.0ms Set step : 0.1ms/step
• Set the US vibration time after the capillary attaching the bond point.
Reference Data
C.6
(5) US power setting
• Set range : 0 to 999 Set step : 1/step
• Set the US power.
• Comparing with the UTC-400 series, the UTC-1000 set value is 4 times large as the UTC-400 series
set value.
(6) Bond force setting
• Set range : 3.0 to 300.0gf Set step : 0.1gf/step

• Set the compressing force in the bonding
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42
• If the compressing force is large, US vibration is repressed.
• If the compressing force is small, US vibration may not transmit to the bonding
4-1
surface between the ball and the pad.
(7) Force time setting
4-2
• Set range : 0.0 to 50.0ms Set step : 0.1ms/step
• Set the compressing force time in the bonding.
• To stabilize the bonding force, to damp US vibration, set the US output time by 2ms longer. If you
4-3
set the time shorter, it takes same force time as the US output time.
(8) Bond level setting
• Display the 1st bond height.
4-4
• It automatically move to the [Edit] dialogue in the displayed top menu [Bond Level Set], and you
can measure the bond level.
4-5
4-6
Bond Level Figure
4-7
4-8
4-9
4 - 10
fig.4-10
• Largest value point means the higher position. (Reverse relation against UTC-400 series)
NE00039-00
43
(9) Alignment setting

Process
C.1 Wire Bonding
• Set item : PAD
• Specify the alignment on the bond point.
• By the window [Alignment select], you can select the alignment that you take.
• You can confirm the alignment position that currently you take.
Sequence
C.2 Wire Bonding
(10) US mode setting
• Set range : -5 to 0 to +5 Set step : 1/step
• Adjust the start-up time in the US oscillation.
• Strongly output US for [+] direction so that it is effective for a short time bonding.
• Gradually output US for [-] direction so that it is effective when the damage happens under the pad.
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
fig.4-11
Reference Data
C.6
NE00039-00
44
(11) Search force setting
4-1
• Set the force from the search level to the attaching.
• According to the force setting, the impact force onto the bonding surface is changed.
4-2
• You can control the bonded ball diameter and thickness.
• Refer to the setting details figure “1st Bonding Timing Chart” (fig.4-12).
4-3
1st Bonding Timing Chart
4-4
4-5
4-6
4-7
4-8
4-9
4 - 10
fig.4-12
NE00039-00
45
Pre US Power Mode Timing

Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
Menu Tree
C.3
fig.4-13
Bond Parameter
C.4
(12) Pre US mode setting
• Set item : Yes or No
• Set whether you specify to apply US vibration from the search level to the attaching, or not.
• When the nonsticking easily happens with the dart or oxidation on the bonding surface, you can get
the effect by selecting [Yes].

Loop Parameter
C.5
(13) Pre US power setting
• Set the US power from the search level to the attaching.
• It can only set the output, you can not set the time.
Reference Data
C.6
• Oscillation have been continued from the search level to the attaching.
• After the attaching, US outputs according to the US power and time setting.
(14) US change mode setting
• Set whether you change the US oscillating method after the capillary attaches onto the bond point,
or not.
• Set the US power and time after the attaching onto the bond point.
NE00039-00
46
(15) US pre-change power setting
4-1
(16) US pre-change time setting
4-2
• Set US oscillating output and time after attaching onto the bond point.
• Refer to “US Change Mode Timing Chart” (fig.4-14).
(17) US change power setting
4-3
(18) US change time setting
4-4
• Set US power and US power after [US pre-change time].
• After [US pre-change power] time finished, the US power gradually changes to the [US power]
4-5
time output.
• Unless the setting, the US power changes to the [US power] output after [US pre-change power]
time finished.
4-6
• Refer to “US Change Mode Timing Chart” (fig.4-14).
US Change Mode Timing Chart
4-7
4-8
4-9
4 - 10
fig.4-14
According to the pad surface condition, the bondability turn good. (Setting with the pad material
condition.)
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47
(19) Change mode setting

Process
C.1 Wire Bonding
• Set the force application method after the capillary attaching onto the bond point.
• You can set [Pre-change force] and [Force pre-change time], [Force change time].
(20) Pre-change force setting

Sequence
C.2 Wire Bonding
(21) Force pre-change time setting
(22) Force change time setting

Menu Tree
C.3
• After the capillary attaching onto the bond point, the force changes from [Search force] to [Pre-
change force]. And gradually it changes in the time zone [Force change time] to the bond force.
Force Change Mode Timing Chart

Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.4-15
• You can set the compressing force independently. Because the force itself have
not linked with the US change mode.
• Total time is the sum of [Force pre-change time], [Force change time], [Force
time]. If you set the total time, bonding time shall be slow.
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48
(23) Bond start delay time setting
4-1
• Set the delaying time of US oscillation after the capillary attaching onto the pad surface.
• In case that vibration happens when the capillary attaching onto the bond surface, to oscillate US
4-2
after the vibration stop, you set the delaying time.
• Set is a same as delaying timer setting for “UTC-400 Bond Parameter”.
4-3
Bond Delay Timing Chart
4-4
4-5
4-6
4-7
4-8
4-9
fig.4-16
(24) Scrub times setting

4 - 10
• Set range : 0 to 10time Set step : 1time/step
• Scrub times is to be the amplitude time setting.
• After the scrub motion have finished the specified time, capillary absolutely move back to the bond
position (center position).
NE00039-00
49
(25) Scrub width setting

Process
C.1 Wire Bonding
• Set range : 0.1 to 40.0µm Set step : 0.1µm/ step
• Actual amplitude is 2 times as the set value of the scrub width.
(26) Scrub direction setting
• Set item : X or Y
Sequence
C.2 Wire Bonding
• Regardless the bonding direction, it scrubs to X and Y axis direction.
< The example of setting >

Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
fig.4-17
• Unless all parameter for scrub inputting, the scrub can not move.
Reference Data
C.6
• Normally, it set as TC (Thermo Compression bonding). Instead of US vibration,
mechanical vibration (XY table motion to XY direction) provide the bonding.
• It is effective for oxide film.
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50
(27) SPC type setting
4-1
• Set item : No or SPC1
• If you set [No], SPC do not work.
• If you set SPC1, a motion as same as the scrub have provided. The different point from the scrub is
4-2
to provide the scrub motion with US vibration.
(28) SPC data setting
• Set range : 0.1 to 40.0µm Set step : 0.1µm/step
4-3
• Actual amplitude is 2 times width as the SPC data.
(29) SPC times setting
4-4
• Set range : 0 to 10 time Set step : 1time/step
• SPC times is to be the setting of amplitude counts.
• After the SPC motion have finished the specified time, capillary absolutely move back to the bond
4-5
position (center position).
(30) SPC direction setting

4-6
• Regardless the bonding, it move to X and Y axis direction.
4-7
< The example of setting >
4-8
4-9
4 - 10
fig.4-18
• Bonding condition (shear-strength) turn to be strong, but damage easily rise
under the pad. Set after fully confirming.

NE00039-00
51
• Refer to “1st Bonding Timing Chart” about the timing between the scrub and the
Process
C.1 Wire Bonding
SPC motion.
1st Bonding Timing Chart

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.4-19
(31) NSOP mode setting

• Set item : No or POS or NEG or SET
• NSOP mode is the method to judge the bonding result with turning and checking the electricity on
the wire when the loop is deforming between 1st bond point and 2nd bond point.
• If the bonding finished successfully, the wire conduct the electricity. Unless the bonding finished
successfully, the wire do not conduct the electricity so that the nonsticking detector can detect.
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52
• Detection condition
4-1
Below conditions are required for the nonsticking detection.
A. Object is an application proof device against the detection voltage and current applied (conducting)
in the wire.
4-2
a. Application current Maximum is 0.2µA (with resistivity between the pad and the die pad is 0Ω)
b. Application voltage Maximum is ±1.0V (with resistivity between the pad and the die pad is
infinity <∞>)
4-3
B. More than ± 0.04µm current need to turn from the pad to the GND (equipment itself).
a. Epoxy-glass substrate and such may not be applied.
4-4
C. Wire length on the device need to be more than 0.8mm.
a. According to the chip condition (step between 1st and 2nd bond, etc.).
• Setting method
4-5
A. No Do not detect the nonsticking.
B. POS Detect if the diode character of the pad is positive [+].
C. NEG Detect if the diode character of the pad is negative [-].
4-6
(In case of a different polarity, miss-detection happen.)
D. SET Detect the diode character and bonding pad by pad, setting the detection character auto-
nautically.
4-7
4-8
NSOP mode (The example of POS setting)
4-9
4 - 10
fig.4-20 fig.4-21
NE00039-00
53
(32) NSOP threshold setting

Process
C.1 Wire Bonding
• Set range : 100 to 800mV Set step : 1mV/step
• Set the standard voltage (threshold) to judge whether the normal bonding or the nonstick bonding.
• The method is to measure the voltage applied (conducting) in the wire. Unless the electricity is not
conducting the wire, the voltage can not be measured.

Sequence
C.2 Wire Bonding
• In case that device character and/or resistivity reduce the voltage, (according to the device character,
the applied 1mV is reduced and measured less than 1mV), you can judge the successful bonding
result with raising the standard voltage (threshold).
• For the large resistivity device measuring, let down the standard voltage (threshold) for the NSOP
mode.
Menu Tree
C.3
(33) Lead locating mode setting
• Set whether to apply the correction lead by lead, or not.
• Do not apply for the pad detection.
(34) Bond level tracking setting

Bond Parameter
C.4
• During the bonding, measuring the bond levels by every bond point, and correcting the next bond
level.
Loop Parameter
C.5
• By measuring the bond level by every bond point, it realizes the stable bonding.
But, do not apply the bond level tracking function when you process the die
such as extremely varied height.

Reference Data
C.6
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(35) Follow search level setting
4-1
• With tracking the bond, the height is fixed by the corrected base bond level.
In case of the conditions in the next page, the tracking function do not work. It work by the bond
4-2
level that initially measured.
A. The initial wire of the continuous bonding.
B. 1 wire bonding
4-3
C. Pause bonding
D. Manual bonding
4-4
E. Preliminary bonding
F. In case of the specials is set in the base level.
4-5
Every Time Revising the Search Time
4-6
4-7
4-8
fig.4-22
4-9
4 - 10
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4 – 4 Description of 2nd Bond Parameter

Process
C.1 Wire Bonding
2nd Bond Timing Chart

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
(1) Mode setting fig.4-23
• Set item : LEAD-STD or LEAD-3STEP

Reference Data
C.6
(3) Search Speed setting
• Set range : 1 to 80mm/s Set step : 0.1mm/s /step
(4) US time setting

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4-1
(8) Bond level setting
(9) Alignment setting
4-2
• Set item : LEAD
(10) US mode setting
4-3
4-4
• Set the lead bond level as 900 ±50µm in the page-43 state as shown in a bond
level figure (fig.4-10).
4-5
• Above are same details as setting in the “1st Bond parameter”.
• Refer to “2nd Bond Setting Timing Chart” (fig.4-23).
• Unless the bond level is within the specified range, adjust the bond level to be
4-6
absolutely within the range by the setting in the wizard [Machine Specific] -
[Indexer Adjust] - [Heater Block ] in the displayed top menu [Machine Manage-
ment].
4-7
• In the 2nd bond, the wire have been compressed and bonded by the capillary.
• Therefore, to control the bond variation with the bonding direction, the capillary
4-8
set to attach vertically and to make the tool imprints in average.

4-9

4 - 10
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Process
C.1 Wire Bonding

Sequence
C.2 Wire Bonding

Menu Tree
C.3

• Above are same details as setting in the “1st Bond parameter”.

Bond Parameter
C.4
• Refer to “ Setting Timing Chart” (page 61).
(24) US REV direction setting
• Set item : No or XY or Quadrant

Loop Parameter
C.5
• By the character of the bonding equipment, the difference may happen between X axis and Y axis
with the tool imprints in the 2nd bond (lead side). In such case, the setting to control the US power
to make the tool imprints as even.
• The rev range is ±45 deg.

Reference Data
C.6
• Setting method
A. No Do not set the rev in the US power.
B. XY You can set the US power in US X adjust and US Y adjust.
C. Quadrant You can set the rev in the US power 1-3 and the US power 2-4.
a. US X adjust/1-3 Set range : 50 to 200%
b. US Y adjust/2-4 Set range : 50 to 200%
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(25) US X adjust/1-3 setting

US Y adjust/2-4 setting
4-1
4-2
4-3
4-4
4-5
4-6
fig.4-24
4-7
4-8
< Example >
• US power setting : 100 US REV direction setting : Example in 200% case.
In X axis, if the bond direction is horizontal (side line), US power maximum is 200%.
4-9
In Y axis, if the bond direction is vertical (front and back line), US power maximum is 200%.
According to the angle, US power set automatically.
• US power : 1-3, 2-4 setting

4 - 10
In case of 1-3, if the bond direction is 45deg or 225deg, US power maximum is 200%.
In case of 2-4, if the bond direction is 315deg or 105deg, US power maximum is 200%.
Against the horizontal and vertical direction, 45deg position is maximum.
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US Power 1-3 • 2-4 setting

Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
Menu Tree
C.3
fig.4-25
• US power 1-3 The rev position are 1st and 3rd quadrant
Bond Parameter
C.4
• US power 2-4 The rev position are 2nd and 4th quadrant
(26) Force REV direction setting

Loop Parameter
C.5
• US vibration generally amplitudes in Y axis direction so that the lead in Y axis direction can not
control tool imprints in the leadflame type such as QFP and others. It can set the rev for US and the
application force. (Refer to the page-61 “Setting Timing Chart”.)
• It cause the tool imprints difference between X and Y axis. In such case, you set the “Force rev
direction”. (Refer to the page-58 “(24) US rev direction setting”.)

Reference Data
C.6
• The rev range is ±45 deg.
• Setting method
A. No Do not set the rev in the bond force.
B. XY You can set the Bond force in Bond force X-DIR and Bond force Y-DIR.
C. Quadrant You can set the rev in the Bond force 1-3 and the Bond force 2-4 .
a. Bond force X-DIR/1-3 Set range : 50 to 200%
b. Bond force Y-DIR/2-4 Set range : 50 to 200%
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4-1
Setting Timing Chart
4-2
4-3
4-4
4-5
4-6
4-7
4-8
4-9
fug.4-26
4 - 10
• Set range : 0 to 10 time Set step : 1time/step
• Set range : 0.1 to 40.0 µm Set step : 0.1µm/ step
• Set item : XY or Wire+ or Wire-

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Process
C.1 Wire Bonding
Scrub Direction Setting

Sequence
C.2 Wire Bonding
fig.4-27
Menu Tree
C.3
• Set item : No or SPC1 or SPC2 or SPC3
• “SPC type” setting in 1st Bond is the setting of the scrub motion (mechanical vibration). But “SPC
type” setting in 2nd Bond is the setting of the rubbing motion.
• If you set “No”, SPC do not work.

Bond Parameter
C.4
• If you set SPC1, SPC (rubbing) motion start simultaneously as US oscillation beginning.
• If you set SPC2, SPC (rubbing) motion start after US oscillation finishing.
• If you set SPC3, SPC (rubbing) motion start before US oscillation beginning.
• Different from the '”SPC setting” in the 1st Bond, the XY table stop position is
Loop Parameter
C.5
different by the SPC data as you set.

• Set range : 0.1 to 40.0µm Set step : 0.1µm/ step

SPC Setting
Reference Data
C.6
• Set item : Wire
fig.4-28
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(33) NSOL mode setting
4-1
• Set item : No or Yes
• After the lead bonding and the wire cut motion finished, NSOL detect the nonsticking in the lead
side with conducting the electricity on the wire.
4-2
• If the bonding is achieved, the wire do not conduct the electricity. In case of the nonsticking, it
conduct the electricity so that the nonstick can be detected.
4-3
NSOL mode
4-4
4-5
4-6
fig.4-29 fig.4-30
4-7
(34) NSOL timing setting
• Set range : -1.00 to 100.00ms Set step : 0.01ms/step
4-8
• Set the conduction timing after the wire cut.
(35) Lead locating mode setting

4-9
• If you want to detect the bond position in the lead side, you set 'Yes'.
• Unless inputting the individual detected data of the lead, it does not work.

4 - 10
• During the bonding, it measure the bond levels by every bond point, and correct the next bond level.
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Process
C.1 Wire Bonding
• During the bond level tracking, it track the search level height as same as the corrected bond level
height.
• The search level setting is fixed the height as same as the setting height by the base bond level.
Sequence
C.2 Wire Bonding
Follow Search Level

Menu Tree
C.3
fig.4-31
Bond Parameter
C.4
(38) Scale lead setting
• The equipment memorize the bond position with the lead centering function, the center of the lead
Loop Parameter
C.5
width is on the bonding position. But if the lead width is narrow, the lead bond position is miss-
aligned by the capillary radius and bonded so that the
Scale Lead
lead bond position is not on the center.
• According to the lead form, the bond strength may be
weak in such as the round edge. In such case, you need

Reference Data
C.6
to relocate the bond point and set the bonding surface in
the lead center.
fig.4-32
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4 – 5 Desription of Spark Paremeter
4-1
(1) Mode [SPARK-STD] setting
• Unless the data, it display [SPARK-STD] only.
(2) Tail length setting
4-2
• Set range : 20 to 1800µm Set step : 0.1 µm/step
• Set the tail cut length in the sparking.
• When Z axis is lifting up to the speci-
4-3
fied tail length after 2nd Bond, the wire
clamper close and cut the wire.
(3) Tail cut mode setting
4-4
• Set value : SLOW or FAST
• Set the upper speed during the wire cut.
4-5
• FAST Bonding speed shall be fast. fig.4-33
• SLOW You can set the tail cut speed,

US power, XY move-distance. If you set the parameters in FAST, they are not applied.
4-6
(4) Tail cut speed setting
• Set value : 10 to 100% Set step : 1%/step
• Change the upper speed during the wire cut.
4-7
• If you set 100%, it rise as same speed as [Setting FAST] in the tail cut mode.
(5) Us power setting
4-8
• Set value : 0 to 999 Set step : 1/step
• During the tail cut, it oscillate US to cut the tail easily.
• For the lead peel off and the S shape loop.

4-9
4 - 10
fog.4-34
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(6) XY move-distance setting

Process
C.1 Wire Bonding
• Set value : 0.0 to 50.0µm Set step : 0.1µm/step
• During the tail cut, XY table move toward the wire direction to
cut the tail easily.
• For the lead peel off and the S shape loop.

Sequence
C.2 Wire Bonding
Menu Tree
C.3
fig.4-35
(7) Spark gap setting
• Set range : 0 to 1100µm Set step : 1µm/step

Bond Parameter
C.4
• Set the distance between the tail tip and the torch tip before
the spark.
• You can set the actual spark height with the torch level, the
tail length, the spark gap.

Loop Parameter
C.5
• The spark height is same as the standard Z axis stop height.
(8) Spark setting
• Set value : Default fig.4-36
• You can change the mode by [Spark group set].
• Unless the data, it display [Default] only.

Reference Data
C.6
• By clicking [Spark set], [ Spark group set] (dialogue) is
displayed.
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4-1
4-2
4-3
fig.4-37
4-4
(9) Spark group setting
• Set if you want to change the initial ball size.
4-5
• Normally, it does not set.
(10) Time setting

4-6
• Set the spark time.
(11) Current setting
• Set range : 10.0 to 70.0mA Set step : 0.1mA/step
4-7
• Set the spark current.
4-8
• Generally, the short time sparking prevent the anneal arising and make the
initial ball form to be the sphere.
• If the sparking time is longer, the ball temperature shall be high, and the initial
4-9
ball form turn to be the pear shape (narrow at the bottom and wider towards the
tip).
• Refer to “6-6 Setting table” [(1) EFU-23 The recommendable setting table]
4 - 10
(page 174) about setting.
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4– 6 Description of Bump Spark Paremeter

Process
C.1 Wire Bonding
The setting of the bump spark is the setting before the bump bonding.
Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
fig.4-38
Details settings in following (1) to (11) are same settings as “4-5 Description of Spark Paremeter”
(page 65).
(1) Mode [SPARK-STD] setting
• Set item : SPARK STD

Loop Parameter
C.5
(2) Tail length setting
(3) Tail cut mode setting
• Set item : SLOW or FAST

Reference Data
C.6
(4) Tail cut speed setting
• Set range : 10 to 100% Set step : 1%/step
(5) Us power setting
(6) XY move-distance setting
• Set range : 0.0 to 50.0µm Set step : 0.1µm /step
(7) Spark gap setting

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(8) Spark setting
4-1
• Set item : Default (Standard)
4-2
4-3
4-4
fig.4-39
4-5
(9) Spark group setting
• Set if you want to change the initial ball size.
• Normally, it does not set.
4-6
(10) Time setting
(11) Current setting
4-7
• Set range : 10.0 to 70.0mA Set step : 0.1mA/step
• The spark setting for the bump need to make the wire neck region harder
4-8
(weaker) than the spark for the wire bonding. Because the wire is required to be
cut from the ball and neck region.
• To weaken the wire neck region, anneal(*1) need to be prolonged.

4-9
• In the crystal-again region, crystal structure shall be large and hard and easily
broken.
4 - 10
• To prolong the spark time, the crystal-again structure shall be large. Therefore,
you set the spark time to prolong and reduce the current to meet the ball size.
• According to the wire diameter, the setting time is 0.60 to 1.20ms as a standard.
• The current setting is adjusted with the initial ball diameter.
*1)Crystal-again region : Refer to "1-1 Wire Bonding Process "[(4) Metal Thin Wire] (page 7).
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4 – 7 Description of Bump Bond Paremeter

Process
C.1 Wire Bonding
Bump Bond Setting Time Chart

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
fig.4-40
Details settings in following (1) to (9) are same settings as “4-5 Description of Spark Paremeter”
(page 41).
Reference Data
C.6
(1) Mode setting
• Set item : PAD-STD or PAD-3STEP
(3) Search speed setting
• Set range : 1.0 to 80.0mm/s Set step : 0.1mm/s/step
(4) US time setting

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4-1
4-2

(8) Us mode setting
4-3
4-4
• Set range : 3.0 to 300.0 Set step : 0.1/step
• None the bond level setting. With the Bump bond setting, the bond level is auto-
matically set.
4-5
• None the alignment setting. The alignment is automatically set as same as the
bond level.
4-6
Bump Bond Setting
Bump Wire (P L) After the Bump bond in the lead side, it operate the bond.
Bump Wire (L P) After the Bump bond in the pad side, it operate the Reverse bond.
4-7
Bump Wire (P P) After the Bump bond (2nd pad), it bond from 1st pad to 2nd pad.
4-8
Details settings in following (10) to (15) are same settings as “4-4 Description of 2nd Bond Paremeter”
(page 58).
(10) US REV direction setting

4-9
(11) US X adjust/1-3 setting
• Set range : 50 to 200%

4 - 10
(12) US Y adjust/2-4 setting
(13) Force REV direction setting
(14) Bond force X-DIR 1/3 setting

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(15) Bond force Y-DIR 2/4 setting

Process
C.1 Wire Bonding
Details settings in following (16) to (36) are same settings as “4-3 Description of 1st Bond Parameter”
(page 46). None the Nonsticking detection.

Sequence
C.2 Wire Bonding


Menu Tree
C.3

Bond Parameter
C.4


Loop Parameter
C.5



Reference Data
C.6


• Set range : 0 to 10time Set step : 1time/step

• Set range : 0.1 to 40.0µm Set step: 0.1µm/step

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72
4-1
• Set item : No or SPC1
4-2
4-3
(34) SPC times setting
4-4
• Set item : 0 to 10time Set step : 1time/step
4-5
Details settings in following (37) is same settings as “4-4 Description of 2nd Bond Parameter”
4-6
(page 64).
(37) Scale lead setting
4-7
4-8
4-9
4 - 10
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4 – 8 Description of [Cut Action] Parameter

Process
C.1 Wire Bonding
(1) Mode
• Set item : CUT-STD or CUT-REV or CUT-T or CUT-PREV
(2) Selection of mode
The equipment have 2 mode (A • B) for the wire cut.

Sequence
C.2 Wire Bonding
A. Pull cut mode Bump Bond of Pull Cut Mode

After the ball bonded, the capillary lift up directly above
and cut the tail.
• Setting : CUT-STD
• The bump speed is most appropriate in the Cut Action

Menu Tree
C.3
setting. fig.4-41
• The bump tail (whisker shape) remains so that the total height can not set to below.
• The wire bonding onto the Bump is not appropriate, because the Bump tail remain.
B. Reverse mode
Bump Bond of Reverse Mode
After the ball bonded, the capillary take the reverse motion to
Bond Parameter
C.4
make the neck region (the root region between the ball and the
wire) for easily cutting. And then, the capillary lift up and cut
the tail.
fig.4-42
• Setting : CUT-REV or CUT-T or CUT-PREV
Loop Parameter
C.5
• It makes the bump that remains little bump tail (whisker shape)
• According to the reverse motion, 3 setting (CUT-REV or CUT-T or CUT-PREV) is available.
• Normally, [CUT-REV] is selected. The reverse setting is changed with the considering for the bump
tail form and the tail length and stability in the sparking.
• CUT-REV provide quickest bump speed, CUT-PREV provide lowest bump speed.
Reference Data
C.6
(3) Description of each mode
A. CUT-STD setting
After the ball bonded, the capillary lift up directly above by the
specified tail length, and then the wire clamper close and cut
the wire. Therefor, none the setting. According to the wire type
and the anneal condition, the bump tail length change.
fig.4-43
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• In case you bond the wire onto the bump, CUT-STD mode remains the bump tail so that it is not
4-1
appropriate for the wire bonding after the bumping. In the case, set the reverse method without
the CUT-STD setting.
• In case you bond only the bump bond, the tail cut timing is the setting as object: bump spark.
4-2
• In case of the bump wire, the tail cut timing is the setting as object : Spark.
B. CUT-REV setting (Refer to the fig.4-45 to fig.4-47.)
4-3
After the ball bonded, it set the specified direction of the capillary reverse motion.
a. Reverse mode setting
4-4
• The reverse motion speed change.
• If you set SLOW, the wire is easily deformed (scratched).
4-5
b. Reverse height setting
• Set the vertical motion length of the capillary lifting up.
4-6
• If the set value is small, the bonded ball hit the capillary so that the ball is distorted.
c. Reverse length setting
4-7
• Set the horizontal motion length after the capillary vertical lifting.
• Set almost half-length of the bonded ball diameter.
4-8
d. Reverse direction setting
• Set range : ±X or ±Y or ±Wire or ±X±Y
• Set the horizontal motion direction after the capillary vertical lifting up.
4-9
• It set the direction of the bump tail falling down.
e. Front buried setting

4 - 10
• Set the capillary lift down length from the horizontal moved point after the vertical lifting up.
• It is setting to easily deform (make scratches) to the wire.
• If the set value is large, the capillary crush the bonded ball.
f. Tail form height setting
• Set range : 0.0 to 500.0µmm Set step : 0.1µm/step
• If the tail curve, the distance between the wire tip and the torch electrode change so that the
NE00039-00
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initial ball size is changed. To prevent the tail from curving in the sparking, you need to adjust and
Process
C.1 Wire Bonding
set the tail form height and length. The setting of the tail forming height and length is to straighten
the wire that have been deformed (scratched) by the [Reverse] setting and the [Front buried]
setting.
g. Tail form length setting

Sequence
C.2 Wire Bonding
• Setting the Reverse length in the tail form.
h. Motion steps
Reverse Mode
Menu Tree
C.3
Bond Parameter
C.4
fig.4-44 fig.4-45
Loop Parameter
C.5
i. Setting position
Reference Data
C.6
fig.4-46
fig.4-47
C. CUT-T setting
Set the capillary reverse motion to the specified direction (T shape) after the ball bonded.
You need to set it, when the tail lengths have not stabilized by the CUT-REV setting.
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76
Details settings in following a, b, c, e and f. are same settings as CUT-REV setting.
4-1
4-2
4-3
d. Back reverse length setting
e. Reverse direction setting
4-4
• Set item : ±X or ±Y or ±Wire or ±X±Y
f. Front buried setting
4-5
• Set item : 0.0 to 300.0µm Set step: 0.1µm/step
g. Rear buried setting
4-6
• On the reverse direction, it set the length that the capillary move against the reverse direction from
the reverse motioned point.
Details settings in following h. to i. are same settings as CUT-REV setting.
4-7
h. Tail form height setting
4-8
i. Tail form length setting
• Set range : 0.0 to 500.0µm Set step : 0.1µm/step Reverse Mode

j. Motion steps
4-9
4 - 10
fig.4-48 fig.4-49
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77
k. Setting position
Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
fig.4-50
Menu Tree
C.3
• The reverse direction is same as the CUT-REV.
• The backward reverse direction is opposite direction to the reverse direction.
D. CUT-PREV setting. (Refer to the fig.4-51 to fig.4-53)
It is setting to oscillate US, when the capillary have taken twice of the reverse motion to the specified
Bond Parameter
C.4
direction after the ball bonded. It is setting when you apply such a wire so as difficult for the tail cutting
by the wire classification and/or diameter.
By the setting, the bump bond time shall be longer.
Details settings in following a. to d. are same settings as CUT-REV setting.

Loop Parameter
C.5
• Set range : SLOW or FAST

Reference Data
C.6
d. Reverse direction setting
• Set item : ±X or ±Y or ±Wire or ±X±Y
e. Reverse US output setting
• Apply the US during the reverse motion.
f. Post Reverse US output setting

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78
• After the reverse motion, apply the US on the reverse end point.
4-1
• Set the US power.
g. Post Reverse US time setting
4-2
• After the reverse motion, apply the US on the reverse end point.
• Set the US time.
h. Pre-Reverse1 length setting
4-3
• Set the initial reverse length in the capillary lifting up.
4-4
• It is reciprocate motion.
i. Pre-Reverse1 direction setting
• Set item : ±X or ±Y or ±Wire ±X±Y
4-5
• Set the reverse direction in the beginning of the capillary lifting up.
j. Pre-Reverse1 US output setting
4-6
• Set the US power in the pre-reverse 1 motion.
k. Pre-Reverse2 length setting
4-7
• Set the 2nd reverse length.
l. Pre-Reverse2 US direction setting
4-8
• Set range : ±X or ±Y or ±Wire or ±X±Y
• Set the 2nd reverse direction.
m. Pre-Reverse2 US output setting

4-9
• Set the US power in the pre-reverse2 motion.
Details settings in following n. to o. are same settings as CUT-REV setting.

4 - 10
n. Tail form height setting
o. Tail form length setting
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79
p. Motion sequence
Process
C.1 Wire Bonding
Reverse Mode
Sequence
C.2 Wire Bonding
fig.4-51
fig.4-52
q. Setting position
Menu Tree
C.3
Bond Parameter
C.4
fig.4-53
• The reverse direction is same as CUT-REV.
• It can take different direction in pre-reverse 1 and pre-reverse2 motion.

Loop Parameter
C.5
• Pre-reverse US power is US power working in pre-reverse 1 and pre-reverse2
length.
Reference Data
C.6
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(4) Bump recommendable parameter
4-1
A. Mode setting
• Setting : CUT-REV
• Selected by the most appropriate balance between
4-2
the speed and quality.
B. Reverse mode setting
• Setting : FAST
4-3
• Selected by the quick speed.
C. Reverse height setting
4-4
• Setting : Start the setting from twice as the ball fig.4-54
thickness.
• If the reverse height is high, the bump tail shall be longer.
4-5
D. Reverse length setting
• Setting : Start the setting from almost half as the ball diameter.
• If the value is large, the wire is cut so that it can not spark.
4-6
E. Reverse direction setting
• Setting : Wire-
• If you set the parameter except for the wire, it causes the loop sway and the wire sagging in the
4-7
wire bonding after the bump.
F. Front buried setting
4-8
• It set for the wire less deformed (scratched).
• According to the reverse height and the wire diameter, it set so as not to contact between the ball
and the capillary.

4-9
G. Tail form height setting
• Setting : It set when the tail have been curved in the wire cut.
H. Tail from length setting

4 - 10
• Setting : Confirm by the step bond and set it.
• Before your setting, consider the balance of the speed and quality and above
specified standards. You decide the capillary form with the decision of the
each parameter size.
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4 – 9 Selection of Capillary
Process
C.1 Wire Bonding
You decide the capillary form with the decision of the each parameter size.
T : Tip size
CD : Chamfer diameter
H : Hole diameter
Sequence
C.2 Wire Bonding
IC : Inner Chamfer diameter
FA : Face Angle
OR : Outer Radius
fig.4-55
• How to call each size is common to each capillary makers.Examine details by

Menu Tree
C.3
capillary maker's catalog.
(1) Decide T (Tip) size
It effect the bond character of the 2nd bond.

Bond Parameter
C.4
As larger T size, the 2nd bondability is better. But the larger bond is possible to contact with the next
ball or loop. You must carefully decide T size.

Loop Parameter
C.5
Reference Data
C.6
fig.4-57
fig.4-56
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82
(2) Decide D (Bonded ball diameter) size
4-1
The bonded ball diameter is decided by the pad opening size.
The bonded ball must not stick over the pad. To prevent the stick over, you need to consider all related
accuracy for with the deviation of the initial ball
4-2
size and the bonded ball size, and the bonding
position.
In the UTC-1000 operation, if the condition such
4-3
as
• bonding position accuracy : ±2.5µm (3 )
4-4
• bonded ball size : 2.4µm (3 )
• self teaching accuracy :more than 0.1µm
the deviation of can be assumed as
4-5
5µm.
fig.4-58
D(x) = PO (x) - ( ) = PO (x) - (5+5) = PO (x) - 10
4-6
D(y) = PO (y) - ( ) = PO (y) - (5+5) = PO (y) - 10
The less of D (x), D(y) is the ball size you require.
(3) Decide CD (Chamfer diameter) size
4-7
Calculating it with the ball diameter (D) figured by “(2) Decide D (Bonded ball diameter) size”.
• Ball diameter 50 to 70µm : CD = (0.83 to 0.87) D
4-8
• Ball diameter 30 to 50µm : CD = (0.87 to 0.91) D
(4) Decide H (Hole diameter) size
Calculate it with the wire diameter you apply.

4-9
• Wire diameter 25 to 38µm : H = d[Wire diameter](µm) + (8 to 12µm)
• Wire diameter 15 to 25µm : H = d[Wire diameter](µm) + (5 to 8µm)
(5) Decide IC (Inner Chamfer) size

4 - 10
• Angle
Generally, there are 2 kinds of capillary. One is the inner chamfer (IC) angle 90deg. , other is the inner
chamfer (IC) angle 120deg. Each capillary have the character described as follows. select for your
purpose.
A. 90deg. : Pad bond character is better in the fine pitch bonding.
B. 120deg. : Looping character is better.

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• IC size
Process
C.1 Wire Bonding
According to the material of the 2nd bonding surface, the size is changed. Generally, the size is
follow described value.
A. The soft alloy(42) or the steel flame or etc. : 4 to 5µm
B. The hard BGA substrate or etc. : 3 to 4µm

Sequence
C.2 Wire Bonding
(6) Decide FA (Face Angle) size
• Generally, the face angle 4 to 15deg products are mainly distributed.
• According to the angle, it have the character as follows.
A. Small angle (4 to 8 deg.)
a. 2nd bondability is better.

Menu Tree
C.3
B. Large angle (11 to 15deg.)
a. The tail cut form is better.
b. Less the heel crack damage.
* Region between 2nd (stitch) bond point
and the wire is called as the heel. fig.4-59

Bond Parameter
C.4
• According to the material, decide the angle as follows.

It is called “Heel clack” that damage
A. Alloy and the steel flame except for the gold. : 4 to 8 deg
comes out here and wire is cut.
B. The BGA substrate (Gold). : 8 to 15deg
C. Unknown materials. : 8 deg

Loop Parameter
C.5
(7) Decide OR (Outer Radius) size
As same as “(6) Decide FA (Face Angle) size”, it cause the heel crack damage. Decide more than the
wire diameter.
OR ≥ d (wire diameter)
(8) Set the initial ball and the bond diameter

Reference Data
C.6
Set the initial ball size as same as the Chamfer Diameter (CD).By the setting, the bonding diameter is
1.2 times as large as the Chamfer Diameter (CD), the bond height is almost fifth (0.2) of the bond
diameter. After that, adjust the size as your purpose.
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4 – 10 Adjust to improve the bondability
4-1
(1) General adjusting
• Use most appropriate capillary.
Refer to [4-9 Selection of Capillary](page 82), select most appropriate capillary and use.
4-2
• Adjust the 3 elements of the bonding + time.
Adjust [1-2 (2) 3 Elements of the Bonding (Heat and Force and US)](page 9) and the bonding
time for best balance.
4-3
(2) Adjusting mode for the fine pitch bonding
• Special mode for the pad side
4-4
Not only the fine pitch bonding, the region direct under the wire
is difficult to apply the force so that the metal ally character is
worse than the round region.
4-5
If the bonded ball diameter is large, the round region is large so
that it is not a problem. But if the bonded ball diameter is small,
area ratio of the region is higher so that the metal alloy character
4-6
of the center region is an important factor. To strength the weak
metal alloy character of the center region, you need to apply the
following 2 mode.
4-7
fig.4-60
a. Pre US power 4-8

Before the capillary touch down, the pre US power is applied to
4-9
prepare the metal alloy seed in the direct under the wire.
It is applied to strength the metal alloy character of the region
direct under the wire.

4 - 10
Use it with the set value less than 100.
• If the bond have been complete during the motion,
the post US power peal the wire so that it cause the
cratering.
fig.4-61
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b. Simultaneous Scrub [Refer to “4-4 Description of 2nd Bond Parameter” [(30) SPC type]
Process
C.1 Wire Bonding
(page 62).]
After the capillary attaching, scrub is moving (XY
table motion) in same time with US power. By the
motion, the capillary move to the direct under the

Sequence
C.2 Wire Bonding
wire and apply force so that the metal alloy charac-
ter is stronger.
Move almost 5µm to X direction.

Menu Tree
C.3
fig.4-62
• Special mode for the lead side[Refer to “4-4 Description of 2nd Bond Parameter” [(30) SPC
type] (page 62).]
As description in [4-9 Selection of Capillary] (page 82),

Bond Parameter
C.4
the lead bonding is better as larger T size of the capil-
lary. But the T size is small in the fine pitch bonding.
Also, according to the relation with the wire, CD size
can not be small.

T-CD
Loop Parameter
C.5
Therefore, the lead bond length( 2

) is small so that
the lead bond character is worse.
To complement such condition, [SPC2] setting is equipped. fig.4-63
By pulling it to the wire direction (opposite to the ball direction)
after US output, the lead bond length (area) is

Reference Data
C.6
increase.
With the microscope, set the pull motion that the
bonded area is not to be thinner. Because the bonded
area is under the capillary when it attach the lead.
fig.4-64
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Chapter 5 Loop Parameter
C.1 Contents
5-1 Kind of Loop Mode............................................................... 88
(1) STD Loop Mode...................................................................... 88
(2) SQR Loop Mode and Low2 Loop Mode................................. 88
(3) SQR2 Loop Mode.................................................................... 89
(4) M Loop Mode.......................................................................... 89
C.2 Contents
5-2 Selective Method of Loop Mode.......................................... 90
(1) Selective Conditions................................................................ 90
(2) Selective Method..................................................................... 90
5-3 Description of Loop Mode.................................................... 94
C.3 Contents
5-3-1 Description of STD Loop Mode........................................ 94
--- Setting Method of STD Loop Mode................................ 101
5-3-2 Description of SQR Loop Mode........................................ 102
--- Setting Method of SQR Loop Mode............................... 108
5-3-3 Description of SQR2 Loop Mode...................................... 110
C.4 Contents
--- Setting Method of SQR2 Loop Mode............................. 113
5-3-4 Description of M Loop Mode............................................. 116
--- Setting Method of M Loop Mode.................................... 117
5-4 Description of Improved Loop Mode (a-series)................... 119
C.5 Contents
5-4-1 Description of STD Improved Loop Mode (a-series)........ 119
--- Setting Method of Improved STD Loop Mode................ 126
5-4-2 Description of SQR Improved Loop Mode (a-series)........ 129
---- Setting Method of Improved SQR Loop Mode.............. 134
5-4-3 Description of SQR2 Improved Loop Mode (a-series)...... 138

C.6 Contents
---Setting Method of Improved SQR2 Loop Mode............... 142
5-4-4 Description of M Improved Loop Mode (a-series)............ 146
---Setting Method of Improved M Loop Mode...................... 147
5-5 Description of Low2 Loop Mode.......................................... 151
--- Setting Method of Low2 Loop Mode................................ 155
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< Chapter 5 Loop Parameter >
5 – 1 Kind of Loop Mode

Process
C.1 Wire Bonding
According to the conditions such as [Wire length], select one from 5 loop modes in UTC-1000.
(1) STD Loop Mode
• STD loop mode is applied when you use short [Wire length] 4mm or less.
Sequence
C.2 Wire Bonding
• The form is a triangle shape composed with the start up and the slope side.
• Comparing with the loop mode in (2) to (4), STD loop mode can process quicker so that it is firstly
applied when you use short [Wire length] 4mm or less.

Menu Tree
C.3
Bond Parameter
C.4
fig.5-1
(2) SQR Loop Mode / Low2 Loop Mode

• SQR loop mode and Low2 loop mode make the slope side in STD loop to be angled once, and raise
Loop Parameter
C.5
the slope side and make the trapezoid (trapezium) form.

• Comparing with the loop mode in (3) to (4), SQR loop mode can process quicker so that select this
mode when you can not select [STD mode] according to the conditions.
• The bent position and the bent degree are the important points in SQR and Low2 mode.
Reference Data
C.6
fig.5-2
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(3) SQR2 Loop Mode
5-1
• SQR2 loop mode takes 4 times the reverse motion, and raises the final bent point and makes the
hexagon shape.
• Select if you need to take away from the obstacle close to the 2nd point, or take the stack bond (the
5-2
reverse bond : bonding from the lead side to pad side).
5-3
5-4
5-5
fig.5-3
(4) M Loop Mode

• M loop mode take the 1st bent point in SQR loop to be concave downward, and make M shape.
• Select the M loop mode when you use long [Wire length] such as 5 to 8mm or shortest [Wire
length] 1mm or less.
• The concave downward shape is the important point in M loop mode.
fig.5-4
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5 – 2 Selective method of Loop Mode

Process
C.1 Wire Bonding
(1) Selective conditions
• Select the loop mode according to following conditions.
A. Wire length
B. Step
Sequence
C.2 Wire Bonding
C. Chip layout
D. Obstacle
E. How to select [SQR], and [SQR2], [M]
(2) Selective method
A. Wire length
Menu Tree
C.3
Most effective condition for the loop mode selection.
• Unless the problem that described in following, select [STD] loop.
• [SQR] loop, and [SQR2] loop, and [M] loop processing speed is slower than [STD] loop.
• Select the Wire length and mode
A. Wire length: 0 to 1 mm Loop mode: Select one from STD, SQR, M, Low2.
Bond Parameter
C.4
B. Wire length: 0 to 4 mm Loop mode: Select the STD.
C. Wire length: 4 to 8 mm Loop mode: Select one from SQR, SQR2, M.
B. Step
Loop Parameter
C.5
If the Chip have the step such as below figure described, you sometimes are limited to select [STD]
loop mode.
In such case, if the wire length is within [STD] range, select the loop mode from [SQR], [SQR2], [M],
[Low2].
Reference Data
C.6
fig.5-5
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C. Chip layout
.
5-1
If the chip have the step such as below figure described, [STD] loop mode is limited.
. In such case, select the Loop mode from [SQR], [SQR2], [M].
5-2
5-3
5-4
fig.5-6
5-5
fig.5-7
D. Obstacle
• If the obstacle is located such as below figure described, you can not select [STD] loop mode.
• In such case, select the loop mode from [SQR], [SQR2], [M].
fig.5-8
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Process
C.1 Wire Bonding
fig.5-9
Sequence
C.2 Wire Bonding
E. How to select [SQR], and [SQR2], [M]
• Select [SQR], and [SQR2].
In case that the obstacle is close to the lead, and you need to take away from the obstacle, select
[SQR2] loop (do not select [SQR] loop).

Menu Tree
C.3
Bond Parameter
C.4
fig.5-10
Loop Parameter
C.5
• Select [SQR] and [M].
In case the [SQR] loop is difficult, select [M] loop.
a. [Loop length] is more than 5mm.
b. In the stack bond, you need to be longer the top side.

Reference Data
C.6
fig.5-11
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5-1
5-2
fig.5-12
5-3
c. Select the low loop (200µm or less) with the condition such as [Loop length] or more 4mm, and none
5-4
of the step.
5-5
fig.5-13
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5 – 3 Description of Loop Mode

Process
C.1 Wire Bonding
5 – 3 – 1 Description of STD Loop Mode
Motion of [STD] loop (Reverse mode: FAST)

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
fig.5-14
Description of setting mode

Loop Parameter
C.5
(1) Reverse mode setting
Refer to next page [Motion of Reverse Mode].
A. ARC mode
. The processing speed is slow, but the mode provides the perfect motion.
Reference Data
C.6
B. FAST mode
. The mode provides the motion intermediate between the ARC and FAST2.
. It slightly link XY and Z in the corner.
. Comparing with FAST2 mode, it provide same processing speed in Z direction, but the processing speed
in horizontal (X) direction is slower.
C. FAST2 mode
. It link XY and Z in the corner.
. It is the speed priority mode to be faster processing speed.
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(2) Loop height setting

. Set range : 50 to 1000µm
5-1
. Set the height of starting up part.
. Input the object height as the set value.
5-2
5-3
5-4
5-5
fig.5-15
(3) Wire index amount setting

. Set range : -1000 to +1000µm
. It is the mode of the wire height offset on the peak height of the looping.
Motion of Reverse Mode fig.5-16
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Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
fig.5-17
(4) Neck height setting
• Set range : 30 to 2000µm

Menu Tree
C.3
• Set, if the target loop height is more than 200µm.
• It can avoid the contact with the next wire happened with
the neck falling.

Bond Parameter
C.4
(5) Neck angle setting
• Set range : -60 to +60 deg

Loop Parameter
C.5
• It set in combination with the [Neck height setting].

fig.5-18
• Set the angle of neck height.
• If you set the neck angle as '0 (Zero)', do not use
the setting [Neck height] and [Neck angle].

Reference Data
C.6
(6) 1st Reverse angle setting
• Set range : 0 to 90 deg
• As same as the aforesaid [Neck angle], the [1st Reverse
angle] is moving close to the ball neck. If the angle is
large, it damage onto the ball neck.
fig.5-19
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• Normally, take 45deg as maximum angle. If it does not damage onto the ball neck, the angle more
5-1
than 45deg can be set.
(7) 1st Hook Dir setting
5-2
• It set the falling angle (left / right) of the looping direction.
• It set when the wire possibly contacts with forbidden parts in the bonding.
5-3
• Refer to “6-4 High speed bonding” [(1) High speed bonding photo] (page 167).
5-4
5-5
fig.5-20
(8) Loop rise position setting
• Set item : Above pad or Above reverse
• Specified parameters of the loop rise position to the loop top.
• Normally, select the above pad.
• In case that the loop height is varied, select [Above reverse] regardless the processing speed is
slower.
fig.5-21
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(9) Y offset setting

Process
C.1 Wire Bonding
• Set range : -30 to +30µm
• The wire height offset, when the wire height is varied in the front/back position from the operator side.
• [+] offset : From the operator side, offset to lower the front side, and to higher the back side.
• [–] offset : From the operator side, offset to higher the front side, and to lower the back side.
Sequence
C.2 Wire Bonding
• By the Shinkawa confirming data, set [+] 6µm firstly. If the wire height (front / back) can not be same
height by the setting (+6µm), offset it by the set value.

Menu Tree
C.3
fig.5-22
(10) Clamper open/close setting

Bond Parameter
C.4
• Set whether the clamper will close or not, when
the capillary is moving from the loop top position
to the search level in the lead side.

Loop Parameter
C.5
• Normally, it set as 100%. In case that short loop
and taking loose in the wire, set as 0 (Zero)%.
fig.5-23
(11) Stretch length setting

Reference Data
C.6
• From the search level in front of the 2nd Bond,
the capillary touch down with dragging the wire
by the set value.
• For the wire straight processing, set the stretch
length.
fig.5-24
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• Against the setting value in [Search speed], Search Speed (mm/sec) Search Level (µm)
64 250
5-1
the [Search level] value is set absolutely
50 180
larger than the right table indicated value. 37 130
If you set it smaller than the right table 29 100
5-2
23 70
indicated value, the capillary possibly touch 15 60
down before the stretch motion finish, and is 10 40
5 30
dragging the wire.
5-3
3 20
5-4
(12) Arc correct amount setting
• Set range : -20 to +20
5-5
* More than 17 in the set value, you can increase
the value but the motion does not change.
• Motion path offset mode from the loop top to
the 2nd search level.
fig.5-25
fig.5-26
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Process
C.1 Wire Bonding
(13) Arc partial position setting
• Set range : -20 to +20
• Set Arc shape during the Arc motion.
• The center of Arc is 0 (Zero) point, and the loop
top side is [-], and the lead level side is [+].

Sequence
C.2 Wire Bonding
• Increasing each set value, the set point in the
[-] side is close to the loop top, and the set point
in the [+] side is close to the lead level.
• The loop form is changed as same as aforesaid
[Arc correct amount].

Menu Tree
C.3
fig.5-27
(14) Arc end pos adjust setting

• Set range : 0 to 100
• In the looping, it set the synchronized

Bond Parameter
C.4
position of the XYZ axis to be upper
position than the search level.
• It set when the loop height is varied in
the short loop less than 1mm.

Loop Parameter
C.5
fig.5-28
Reference Data
C.6
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--- STD Loop Setting Method ---
5-1
A Start Parameter
Parameter Set value

Reverse mode FAST2
5-2
Loop height Target value (µm)
Wire index amount *1
Neck height *2
5-3
Neck angle *2
1st Reverse angle 45deg
1st Hook Dir 0
5-4
Loop rise position Above pad
Y offset 6
5-5
Clamper open/close 100%
Stretch length 50µm
Arc correct amount *3
Arc partial position 0
Arc end pos adjust 0
*1 : Wire index amount Wire length (Average) Ratio to [Loop height] setting
As the right description, according to the 0.5 to 1.0 mm 100%
1.0 to 2.0 mm 90%
wire length, the ratio against [Loop height] 2.0 to 3.0 mm 80%
setting is changed. 3.0 to 4.0 mm 70%
4.0 to 5.0 mm 60%
The value to input is calculated by follow-
5.0mm or more 50%
ing steps.
Confirm the wire length (indicated in [View] – [Coordinate List]). From the table, select the ratio
corresponding with the loop height. Do multiplication the ratio with [Loop height] value.
*2 : Neck height / Neck angle
Loop height of 200µm within ......... Neck height : 0 Neck angle : 0
Loop height of 200µm or more ......... Neck height : 80 to 100 Neck angle : 30 to 45
*3 : Arc correct amount

Wire length (Average) Set value
0.5 to 2.0 mm 15
2.0mm or more 5 to10

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5 – 3 – 2 Description of SQR Loop Mode (Loop-SQR)

Process
C.1 Wire Bonding
Motion of [SQR] loop (Reverse mode: FAST)

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.5-29
• Before the 1st reverse finish and in the looping, it takes same motion as [STD
Loop Mode] so that description is omitted. Refer to “5-3-1 Description of STD
Loop Mode” (page 94).
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(1) Direction top side1 setting
• Set item : Ratio pad or Length pad or Length lead
5-1
• It set with correspondent the next [(2) Loop top side1 length].
(2) Loop top side length setting
5-2
• Ratio pad
Decide the bent point (A) position according to the Ratio (%) against the full length from the pad.
Normally, select this method.
5-3
• Length pad
Decide the bent point (A) position according the size (µm) from the pad. If the obstacle is located in
the same distance from the pad and the wire need to take away from the obstacle, set it with inputting
5-4
the distance.
• Length lead
5-5
Decide the bent point (A) position according the size (µm) from the lead. If the obstacle is located in
the same distance from the lead and the wire need to take away from the obstacle, set it with inputting
the distance.
Ratio top side1 length
(3) Reverse clamper setting fig.5-30
By setting [Yes], you can make steady the deformation on the bent point (A) with the wire clamper
closing in the 2nd reverse motion.
• In case the setting is wrong, the wire is possibly cut from the neck.
• Normally, use with the setting [No].
• In case that the 1st reverse motion in the FAST2 or FAST, the clamper does not
move (close).
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(4) 2nd Reverse angle

.
Process
C.1 Wire Bonding
Set range : 1 to 80 deg

. Calculate the 2nd reverse angle value with inputting the necessary condition values into the following
[2nd Reverse angle formula].

. If the calculated 2nd reverse angle value is less than 15deg, you need to take the [Top side1] (flat
Sequence
C.2 Wire Bonding
length) to be longer (in case of the lead standard, decrease the set value).
Set 2nd Reverse angle value to be more than 15deg.

. To make steady deformation on the bent point (A), you need to set it or more 25deg. In case you set
or more 15deg but the angle is weak, add the [top side1] (flat length) to be more.
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.5-31
• In case it can not meet the calculation : As figure 5-32 (page 105), it is unstable
when the bent angle is larger, or smaller.
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5-1
5-2
5-3
fig.5-32
5-4
• If the 2nd Bond (lead) position is higher than 1st Bond (pad) position, set the angle
with the calculation from the peak height of the loop. In that case, the calculation
scheme is applied as same as in page 104.
5-5
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105
(5) 2nd Rev revision1 setting

.
Process
C.1 Wire Bonding
Set range : -2000 to +2000µm

. Set when you can not fully make the bent between the top side1 and
the slope side.

. After moving to the 2nd reverse angle, it move with the clamper
Sequence
C.2 Wire Bonding
closing by the length set.
(6) 2nd Rev revision2 setting

. Set range : 20 to 90 deg
fig.5-33
. As same as [(5) 2nd Rev revision1], set when you can not fully make the bent between the top side 1
Menu Tree
C.3
and the slope side.

. Set when the 2nd reverse angle is 20deg or less.
. After the 2nd reverse angle (2nd Rev angle revision1) setting finish, if the set value of the [2nd Rev
angle revision 2] is larger than the 2nd reverse angle [+] (2nd Rev angle revision1), the capillary take
the reciprocate motion by set angle value. During the motion, the clamper is opened.
Bond Parameter
C.4
(7) 2nd Hook Dir setting

. Set range : -90 to +90 deg
Loop Parameter
C.5
Reference Data
C.6
fig.5-34 fig.5-35
. It is the mode that make the horizontal bent on the angled position that located between the top side1
and the slope side. By the angled value, the loop totally changes to be lower.
. It is applied when you need to take away from the obstacle.
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(8) Rise pos correct1 setting
5-1
• It is rising angle after the 1st reverse finish.
• It define the vertical rising angle is [0 (Zero)], to the
5-2
reverse side is [+], to the 2nd Bond side is [-].
• Set when the capillary internal diameter is almost same
as the wire diameter and the contact resistance is large.
5-3
5-4
5-5
fig.5-36
• Set value : -70 to +70 deg
• It is rising angle to the loop top from the 2nd reverse finish point.
• Set as same as [(8) Rise pos correct1].
fig.5-37
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--- SQR Loop Setting Method ---

Process
C.1 Wire Bonding
A Start Parameter
Parameter Set value

Reverse mode FAST2
Sequence
C.2 Wire Bonding

Direction top side1 Ratio pad
Ratio top side1(length) 35% *3
Reverse clamper No
Neck height 0 *2
Menu Tree
C.3
Neck angle 0 *2
2nd Reverse angle *3
2nd Rev revision1 0 µm
2nd Rev revision2 0 deg
Bond Parameter
C.4
2nd Rev Down Start Pos 0%

1st Hook Dir 0 deg
2nd Hook Dir 0 deg
Loop rise position Above pad
Pad right over correct 0 µm
Loop Parameter
C.5
Rise pos correct1 0 deg

Wire height offset 0
Y offset 6 µm
Reference Data
C.6
Stretch length 50 µm
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*1 : Wire index amount
5-1
As the right description, according Wire length (Average) Ratio to [Loop height] setting
0.5 to 1.0 mm 100%
to the wire length, the ratio against 1.0 to 2.0 mm 90%
[Loop height] setting is changed. 2.0 to 3.0 mm 80%
5-2
3.0 to 4.0 mm 70%
The value to input is calculated by
4.0 to 5.0 mm 60%
following steps. 5.0mm or more 50%
Confirm the wire length (indicated in [View] – [Coordinate List]),
5-3
From the table, select the ratio corresponding with the loop height,
Do multiplication the ratio with [Loop height] value.
5-4
Loop height of 200µm within ......... Neck height : 0 Neck angle : 0
5-5
Loop height of 200µm or more ......... Neck height : 80 to 100 Neck angle : 30 to 45
*3 : 2nd Reverse angle
• For details, refer to [(4) 2nd Reverse angle setting] (page 104).
• If the calculated value is less than 15deg, increase [Ratio top side1 length] value to be
more than 15deg.
*4 : Arc end pos adjust
Wire length (Average) Set value

0.5 to 2.0 mm 15
2.0mm or more 5 to 10
In case the position of
2nd Bond (Lead) is higher -10
than 1st Bond (Pad)
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5 – 3 – 3 Description of SQR2 Loop Mode (Pentagon)

Process
C.1 Wire Bonding
Motion of [SQR2] loop (Reverse mode: FAST)

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.5-38
• Before the 2nd reverse finish and in the looping, it takes same motion as [STD
Loop Mode] or [SQR Loop Mode] so that description is omitted.
• Refer to “5-3-1 Description of STD Loop Mode” (page 94) or “5-3-2 Description
of SQR Loop Mode” (page 102).
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5-1
• Set item : Ratio pad or Length pad or length lead
It set with correspondent the next [(2) Loop top side2 length].
5-2
Ratio top side2 length fig.5-39
• Ratio pad
Decide the bent point (B) position
5-3
according to the Ratio (%) against
the wire length from the pad.
Normally, select this mode.
5-4
• Length pad
Decide the bent point (B) position
5-5
according the size (µm) from the pad. Set the top side2 length from point(A) to to point(B).
If the obstacle is located in the same
distance from the pad and the wire need to take away from the obstacle, set it with inputting the
distance.
• Length lead
Decide the bent point (B) position according the size (µm) from the lead. If the obstacle is located
in the same distance from the lead and the wire need to take away from the obstacle, set it with
inputting the distance.
Normally, [SQR2] loop is frequently applied when the obstacle is located close to the lead and the
wire need to avoid. If you have the obstacle to be avoided, apply this mode. The distance setting is
horizontal but set the value by 20 to 30% more. Because you need to consider the wire is slope.
(3) 3rd Reverse angle setting
• Set the deformation position on the bent point (B).
• Select the loop mode when you need to make the
deformation on the bent point (B) close to the
obstacle near the lead.
fig.5-40
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• In this case, you need to make the deformation in the higher position so that small set value can not
Process
C.1 Wire Bonding
make the deformation.
• The motion is taken in the higher space so that the neck is not damaged.
• Set the bent point (B) as almost 45deg.
(4) 3rd Rev revision1 setting

Sequence
C.2 Wire Bonding
• Strength the deformation on the bent point (B). It set when
you can not fully make the deformation on the bent point (B).
Menu Tree
C.3
fig.5-41
(5) 3rd Rev revision2 setting
• After the 3rd reverse angle (3rd Rev revision1) finish, if the set
value of the [3rd Rev revision3] is larger than the 3rd reverse angle
Bond Parameter
C.4
[+] (3rd Rev revision), the capillary take the reciprocate motion by
set angle value.
During the motion, the clamper is opened.
fig.5-42
Loop Parameter
C.5
(6) 3rd Hook Dir setting
Set range : -90 to +90 deg

Reference Data
C.6
fig.5-43 fig.5-44
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. It is the mode that make the horizontal bent the angled position that located between the top side2
5-1
and the slope side. By the angled value, the loop totally changes to be lower.
. It is applied when you need to take away from the obstacle.
5-2
. It is rising angle after the 2nd reverse finish.
. It define the vertical rising angle is [0 (Zero)], to the
5-3
reverse side is [+], to the 2nd Bond side is [-].
. Set when the capillary internal diameter is almost same
as the wire diameter and the contact resistance is large.
5-4
5-5
fig.5-45
--- SQR2 Loop Setting Method ---
A Start Parameter
Parameter Set value

Reverse mode FAST2
Direction top side1 Ratio pad
Ratio top side1 (length) 35%
Direction top side2 Length lead
Ratio top side2 (length) 1000µm *2
Reverse clamper No
Neck height 100 *3
Neck angle 1 *3
2nd Reverse angle 30deg
3rd Reverse angle 30deg
3rd Rev revision1 0 µm
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Parameter Set value

Process
C.1 Wire Bonding
3rd Rev revision2 0 deg

3rd Rev Down Start Pos 0%
1st Hook Dir 0 deg
Sequence
C.2 Wire Bonding
2nd Hook Dir 0 deg

3rd Hook Dir 0 deg
Loop rise position Above reverse
Pad right over correct 50µm
Menu Tree
C.3

Y offset 6 µm
Bond Parameter
C.4

Loop Parameter
C.5
As the right description, according Wire length (Average) Ratio to [Loop height] setting
to the wire length, the ratio against 2.0 to 3.0 mm 100%
Reference Data
C.6
3.0 to 4.0 mm 90%

[Loop height] setting is changed.
4.0 to 5.0 mm 80%
The value to input is calculated by 5.0mm or more 70%
following steps.
Confirm the wire length (indicated in [View] – [Coordinate List]),
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*2
5-1
5-2
5-3
fig.5-46
5-4
*3 : Neck height or Neck angle
• Loop height of 200µm within ......... Neck height : 100 Neck angle : 1
5-5
• Loop height of 200µm or more ......... Neck height : 100 Neck angle : 45
*4 : Arc end pos adjust
• In case the position of 1st Bond (Pad) is higher than 2nd Bond (Lead) ....... 10
• In case the position of 2nd Bond (Lead) is higher than 1st Bond (Pad) ....... - 10
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5 – 3 – 4 Description of M Loop Mode (Loop M)

Process
C.1 Wire Bonding
Motion of [M] loop (Reverse mode: FAST)

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.5-47
• This mode takes same motion as [STD Loop Mode] or [SQR Loop Mode] or
[SQR2 Loop Mode] so that description is omitted. Refer to “5-3-1 Description of
STD Loop Mode” (page 94) or “5-3-2 Description of SQR Loop Mode” (page 102) or
“5-3-3 Description of SQR2 Loop Mode” (page 110).
• The numbers in [M Loop] figure is same as the description numbers in [SQR2
Loop].
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--- M Loop Setting Method ---
5-1
A Start Parameter
Parameter Set value

Reverse mode FAST2
5-2
Direction top side1 Ratio pad *2
5-3
Ratio top side1 (length) 25% *2
Direction top side2 Ratio pad *2
Ratio top side2 (length) 50% *2
5-4
Reverse clamper NO
Neck height *3
5-5
Neck angle *3
2nd Reverse angle 45deg
3rd Reverse angle 45deg
3rd Rev revision1 0 µm
3rd Rev revision2 0 deg
3rd Rev Down Start Pos 0%
1st Hook Dir 0 deg
2nd Hook Dir 0 deg
3rd Hook Dir 0 deg
Loop rise position Above reverse
Pad right over correct 50µm
Y offset 6 µm
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Parameter Set value

Process
C.1 Wire Bonding

Arc correct amount 10
Sequence
C.2 Wire Bonding
As the right description, according to Wire length (Average) Ratio to [Loop height] setting
the wire length, the ratio against [Loop 0.5 to 1.0 mm 100%
1.0 to 4.0 mm 80%
height] setting is changed.
4.0mm or more 60%
Menu Tree
C.3
The value to input is calculated by

following steps. Confirm the wire length (indicated in [View] – [Coordinate List]),

Bond Parameter
C.4
*2: Direction top side1 / Ratio top side1 length
Direction top side2 / Ratio top side2 length

Loop Parameter
C.5
fig.5-48
Reference Data
C.6
In case the obstacle is located, set the top side1 and the top side2 to be equal, and make the
angled point on the edge of the obstacle.
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5 – 4 Description of Improved Loop Mode (a-series)

It describe [a-series]. Comparing with the post loop mode group, [a-series] is strengthen the fine adjustment
5-1
for the loop height control and the loop form.
5 – 4 – 1 Description of Improved STD Loop Mode (a-series)
Motion of [Improved STDa] loop (Reverse mode: SLOW)
5-2
5-3
5-4
5-5
fig.5-49
Description of setting mode
(1) Reverse mode setting
Refer to next page [Motion of Reverse Mode].
A. SLOW mode
. Without linking XY and Z, it take the bent in the corner. Except for the ARC, it is most easy mode to
take the sway.
B. MIDDLE mode
. It is the mode to take the intermediate motion between SLOW and FAST.
. It slightly links XY and Z in the corner.
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. It takes the horizontal direction (X) motion (without Z axis falling down).
Process
C.1 Wire Bonding
C. FAST mode
. The mode provides the motion intermediate between the MIDDLE and FAST2.
. It links XY and Z in the corner. The linkage value is more than MIDDLE takes. It takes the horizontal
direction (X) motion (without Z axis falling down).

Sequence
C.2 Wire Bonding
D. ARC mode
. The processing speed is slow, but the mode provides the perfect motion.
E. FAST2 mode
. With linking XY and Z in the corner, it is the speed priority mode.
Menu Tree
C.3
• If it can not make the deformation, set in order of FAST MIDDLE SLOW
ARC. Set the object height as the set value.
Motion of Reverse Mode

Bond Parameter
C.4
fig.5-50
Loop Parameter
C.5
Reference Data
C.6
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(2) Loop height setting
5-1
• Set the height of starting up part.
• Input the object height as the set value.
5-2
5-3
5-4
fig.5-51
5-5
• It is the mode of the wire height offset on the peak height of the looping.
Wire index amount setting
fig.5-52
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Process
C.1 Wire Bonding
• Set the angle of loop height.
• It is mode that take the wire height offset on the highest point
in the looping.
Sequence
C.2 Wire Bonding
With the neck angle and the 1st reverse angle, it is moving
close to the ball neck. If the angle is large, it damage onto
the ball neck.
Normally, take 45deg as maximum angle. If it does not dam-
age onto the ball neck, you can set the angle more than 45deg.
Menu Tree
C.3
fig.5-53
• Set when the target loop height is more than 200µm.
• It can avoid the contact with the next wire by the neck
Bond Parameter
C.4
falling.
• In case the neck height is higher than the
loop height, and the neck angle is ‘ (Zero)’
deg, it does not move.

Loop Parameter
C.5
fig.5-54

Reference Data
C.6
• It set in combination with the [Neck height ].
• If you set the value to be larger to [+] direction, it go ahead to
the front (opposite of the lead side) direction.
• If you set the value to be larger to [-] direction, it pull back to
the back (the lead side) direction. fig.5-55
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(7) Top upper mode setting
5-1
• Set range : Mode1 or Mode2 or Mode3 or Mode4
• Set the upper position when the capillary rise to the loop top.
• Normally, set it as [Mode1]. In case of the reverse bond, set it as [Mode3].
5-2
• Refer to [The Characteristic table in the Upper Mode] as follow. If you set [FAST2] in the reverse mode,
it is automatically set as [Mode1] regardless you set [Mode2] [Mode3] [Mode4].
5-3
• Refer to [SQR2] (page 129) about [SQRa], [SQR2a] and [Ma].
fig.5-56
5-4
5-5
The Characteristic Table in the Upper Mode
Upper Mode Stability Speed Reverse Bond Rem ark
Mode1 Shape regard / Not suited of Reverse Bond
Mode2 Not suited of Reverse Bond
Mode3 Shape regard
Mode4
( : Better : Good : No good )
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(8) Supply offset setting

Process
C.1 Wire Bonding
• Set range : -50 to +50 %
• It offset the wire height according to the ratio against
the slope length.
• After the rising to the loop top, the offset is taken as

Sequence
C.2 Wire Bonding
same time as the wire index amount.
• Set it when the loop height is varied by the wire
length. fig.5-57
• If long loop is varied in lower, set it to the
[+] direction. If long loop is varied in higher, set it to the [-] direction.
Menu Tree
C.3
• Set range : -200 to +500
• [0 (Zero)] setting is standard. If you set
[+] direction, it go outer than the standard Arc.

Bond Parameter
C.4
If you set [-] direction, it go inner than the
standard Arc.
• In case the step between the 1st Bond and 2nd Bond
is more than 400µm, set it as “5-5 Low2 Loop

fig.5-58
Loop Parameter
C.5
Mode” (page 151) described later.
• Set whether the clamper will open/close, when the capillary is moving from the loop top position to
the search level in the lead side.

Reference Data
C.6
• Normally, it set as 100%. In case that short
loop and taking loose in the wire, set as
0 (Zero)%.
fig.5-59
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124
5-1
• Refer to “5-3-1 STD Loop Mode” [(11) Stretch length setting] (page 98) .
5-2
• Refer to “5-3-1 STD Loop Mode” [(12) Y offset setting] (page 99) .
• Refer to “5-3-1 STD Loop Mode” [(13) Arc correct amount setting] (page 99) .
5-3
• Refer to “5-3-1 STD Loop Mode” [(14) Arc partial position setting] (page 100) .
(15) 1st Reverse sharp2 setting
5-4
• Not used
(16) 1st Reverse adjust setting
5-5
• Not used
• Refer to “5-3-1 STD Loop Mode” [(7) 1st Hook Dir setting] (page 97) .
• The loop from is same as the outside wire as “6-4 High Speed Bonding” [(1) High Speed Bonding
Photo] (page 167) described.
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--- Improved STD Loop (a-series) Setting Method ---

Process
C.1 Wire Bonding
A Start Parameter
Mode Set value Reference value

(The change point from STD to STDa)
1st Reverse mode FAST same

Loop height Target value (µm) same
Wire index amount Add 150
Sequence
C.2 Wire Bonding
*1
1st Reverse angle 45deg same
Neck height 100 same
Neck angle 45deg Add 10
Top upper mode Mode1 same
Menu Tree
C.3
Supply offset 0 same

Arc end pos adjust 0 same
Clamper open/close 100% same
Stretch length 50µm same
Y offset 6 µm same
Bond Parameter
C.4
Arc correct amount 0 same

Arc partial position 0 same
1st Reverse sharp2 – –
1st Reverse adjust – –
1st Hook Dir 0 same
Loop Parameter
C.5
As the right description, according to Wire length (Average) Ratio to [Loop height] setting
the wire length, the ratio against [Loop 0.5 to 1.0 mm 50%
1.0 to 5.0 mm 0
Reference Data
C.6
height] setting is changed.

5.0 to 8.0 mm - 50%
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Countermeasure method of the [A Start Parameter]
In the aforesaid [A Start Parameter] (page 126) setting, in case the bonding is unstable or the object is
5-1
wrong, take countermeasure actions as following. The countermeasure method is taken the set value as the
standard. The standard is the [Bond] that have the higher 1st Bond position than the 2nd Bond.
.
5-2
The following problem is not only happened alone, some problems are happened
and they are complicated with each other. When the problem is happened, you
need to solve the problem with deleting the conflicting issues.

.
5-3
The countermeasure method is corresponding with the order of the step a. to e. in
the next clauses. After you have realized the best condition in each step, you can
go the next step.
5-4
A. Bonding speed is slow.
5-5
a. Change the Reverse mode FAST FAST2.
Confirm you can make the start up form. In case the forms are wrong (strange form), return the settings
to be original.
b. Set the Stretch length to be [0 (Zero)].
Confirm the loop do not have the sway. In case the loop have the sway, return the settings to be
original.
c. Set the Neck angle to be [0 (Zero)].
If you need the neck, do not set it.
B. It can not fully make the deformation in the start up, and the loop height is varied.
a. Change the Reverse mode in order of FAST MIDDLE SLOW ARC.
According to the order, the processing speed is slower. If you do not fully need, do not set ARC.
b. Slightly increase the 1st Reverse angle set value from [45deg] to [60deg].
In case the loop height is less than 200µm, it possibly make the neck damage so that you do not set it.
C. Happen the strange loop sway. (When the loop sway is fluffy and not steady.)
The strange loop sway is phenomenon that wire height toward left or right is more than necessary. To
solve the problem, reduce the wire height volume. After the following described countermeasures, the
start up from is changed. Absolutely confirm the start up form after the countermeasure is taken.
a. Increase the Stretch length from [50µm] to [100µm].

NE00039-00
127
b. Decrease the Arc end pos adjust from [0] to [-50] by 5 degree.
Process
C.1 Wire Bonding
c. Decrease the Arc correct amount from [0] to [-15] by 5 degree.
d. Decrease the Supply offset from [0] to [-5] by 1 degree.
e. Change the Top upper mode from [Mode1] to [Mode3].

Sequence
C.2 Wire Bonding
D. The neck is dragged. (The neck damage is happened.)
In case the total wire index amount is small, the phenomenon is happened.
a. Increase the Wire index amount.
b. Increase the Arc end pos adjust from [0] to [+50] by 5 degree.
c. Increase the Arc correct amount from [0] to [+15] by 5 degree.

Menu Tree
C.3
d. Increase the Supply offset from [0] to [+5] by 1 degree.
E. The neck is inclined to front.
The deformation in the start up is strong so that the phenomenon is happened.
To solve the problem, decrease the deformation.

Bond Parameter
C.4
a. Decrease the Neck angle from [45deg] to [30deg] by 5 degree.
b. Decrease the 1st Reverse angle from [45deg] to [30deg] by 5 degree.

Loop Parameter
C.5
Reference Data
C.6
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5 – 4 – 2 Description of Improved SQR Loop Mode (a-series)
5-1
Motion of [Improved SQRa] loop (Reverse mode: SLOW)
5-2
5-3
5-4
5-5
fig.5-60
• Description of the same contents as [5-4-1 Improved STDa Loop Mode] is
omitted.
Refer to “5-4-1 Description of Improved STDa Loop Mode” (page 119).
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Description of Setting Mode

Process
C.1 Wire Bonding
• Refer to “5-3-2 SQR Loop Mode” [(1) Direction top side1 setting] (page 103).
(2) Top side1 length setting

Sequence
C.2 Wire Bonding
Ratio top side1 length setting
• Refer to “5-3-2 SQR Loop Mode” [(2) Top side1 length setting / Ratio top side1 length
setting] (page 103).
(3) 2nd Reverse angle setting

Menu Tree
C.3
• Refer to “5-3-2 SQR Loop Mode” [(4) 2nd Reverse angle setting] (page 104).
• After the final reverse finish (In case the SQRa mode, after the 2nd reverse finish. In case the SQR2
mode, after the 3rd reverse finish.), set the rise position when the capillary lift up to the loop top.
Bond Parameter
C.4
• Normally, it set as [Mode1]. In case the reverse bond, set as [Mode3].
• Refer to the characteristic table of “5-4-1 Improved SQR Loop Mode” [(7) Top upper mode
setting] (page 123).

Loop Parameter
C.5
Reference Data
C.6
fig.5-61
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(5) Reverse clamper setting
5-1
• If you set [Yes], the clamper close in the 2nd reverse
so that it can fully make deformation on the bent
5-2
point (A).
• If the setting is not adequate, the wire possibly cut
from the neck. You need to be careful.
5-3
fig.5-62
(6) Top position offset setting
5-4
• In case you set [Mode1] in the [(4) Top upper mode], it is Z
5-5
direction offset value when it move from the above reverse to the
above 1st reverse.
• In case the loop is crushed, set it to [+] direction.
If the offset value is large, the wire possibly cut from the neck.
fig.5-63
fig.5-64
(7) Wire height offset setting
• Set range : 0 to 100
• It is mode to strength the deformation on the bent point (A). If you set it, the bent point (A) is
slightly raised. Refer to figure 5-65 of next page (page 132).
NE00039-00
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Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
fig.5-65
• Normally, it is not used.
• Set it when the long wire (more than 4mm) is applied.
• It is not corresponded with the reverse step such as the 2nd Bond is higher
Menu Tree
C.3
than the 1st Bond.
(8) 1st Reverse adjust setting
• It is mode to strength the deformation on top of loop height

Bond Parameter
C.4
point.
• After the 1st reverse finish, the top point is down by the set
value. In the time, the clamper is open.
• Set it when the deformation is weak and the height is varied.

Loop Parameter
C.5
• In case you select [Reverse mode / FAST],
it is effective. It is not corresponded with
other loop mode. fig.5-66
(9) 2nd Reverse sharp1 setting

Reference Data
C.6
• Set it when you can not fully make the deformation on the bent
point (A) that located between the top side1 and the slope side.
• The motion take in [1 ] area. After the 2nd reverse angle motion,
it move to horizontal by the set value.
• The clamper takes same action as [(5) Reverse clamper] (page
131) described. fig.5-67
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132
(10) 2nd Reverse sharp2 setting
5-1
• As [(9) 2nd Reverse sharp1], set it when you can not fully make the deformation on the bent point
(A). Set it when the 2nd reverse angle is less than 20deg.
5-2
• The motion take in the former figured [2 ]. After the 2nd reverse angle finish, when the 2nd
reverse sharp2 set value is larger than the 2nd reverse angle [+] (2nd Reverse sharp1), it take the
reciprocate Arc motion. The reciprocate Arc motion path length is a difference between the 2nd
5-3
reverse sharp 2 and the 2nd reverse angle [+] (2nd Reverse sharp1).
• The clamper is same motion [(5) Reverse clamper setting] (page 131).
5-4
(11) 2nd Reverse upper angle setting fig.5-68
5-5
• Adjust the upper angle after the 2nd reverse
finish.
• It define the rise to vertical above is [0 (Zero)],
to the reverse direction is [+], to the 2nd Bond
direction is [-].
• In case that the capillary inner diameter is
small and the distance between the capillary inner and the wire is narrow, the frictional resistance is
happened. You set it to decrease the frictional resistance.

• If the set value is large, it increase the frictional resistance so that set it as [0(Zero)] normally. If you
need to change it, set it less than 5deg.
(12) 2nd Hook Dir setting
• Refer to "5-3-2 Description of SQR Loop Mode" [(7) 2nd Hook Dir setting] (page 106).
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--- Improved SQR Loop (a-series) Setting Method ---

Process
C.1 Wire Bonding
A Start Parameter

(The change point from SQR to SQRa)

Wire index amount
Sequence
C.2 Wire Bonding
0 Set 0(Zero)
Direction top side1 length Ratio pad same
Top side1 length (Ratio) 35% *1 same
2nd Reverse angle *1 Decrease 5
Menu Tree
C.3

Neck angle 45deg Add 5
Reverse clamper No same
Supply offset 0 same
Bond Parameter
C.4

Clamper open/close 100 same
Stretch length 50 same
Y offset 6 same
Top position offset 0 same
Loop Parameter
C.5
Arc correct amount -10 same

Wire height offset 0 same
1st Reverse adjust 0 same
2nd Reverse sharp1 0 same
Reference Data
C.6
2nd Reverse sharp2 0 same

2nd Reverse upper angle 0 same
1st Hook Dir 0 same
2nd Hook Dir 0 same
*1 : Top side1 length / 2nd Reverse angle
For details, refer to “5-3-2 Description of SQR Loop Mode” [(4) 2nd Reverse angle setting]
(page 104).
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134
5-1
* If the calculated value is less than 15deg, increase [Ratio top side1 length] value to be more
5-2
than 15deg.
5-3
5-4
. The following problem is not only happened alone, some problems are happened
5-5
. The countermeasure method is corresponding with the order of the step a. to e. in
go the next step.
Confirm you can make the start up form and the bent point (A). In case the forms are wrong (strange
form), return the settings to be original.
Confirm the loop do not have the sway. In case the loop have the sway, return the settings to be
original.
d. Change the Top upper mode [Mode1] to [Mode2].
a. Increase the Reverse adjust from [0] to [20] by 5 degree.
b. Change the reverse mode in order of FAST MIDDLE SLOW ARC.
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c. Slightly increase the 1st Reverse angle set value from [45deg] to [60deg].
Process
C.1 Wire Bonding
C. Happen the strange loop sway. (When the loop sway is fluffy and not steady.)
The strange loop sway is phenomenon that wire toward left or right is more than necessary. To solve the
Sequence
C.2 Wire Bonding
problem, reduce the wire height volume. After the following described countermeasures, the start up
from is changed. Absolutely confirm the start up form after the countermeasure is taken. If the calcu-
lated value of the 2nd Reverse angle is wrong, the phenomenon is happened. Calculate again.
Menu Tree
C.3
d. Decrease the wire height offset from [0] to [-5] by 1 degree.

Bond Parameter
C.4

Loop Parameter
C.5
d. Increase the Supply offset from [0] to [+5] by 1 degree.

Reference Data
C.6
F. The bent point (A) height is higher than the start up height.
If the 2nd reverse angle is larger than the calculated value, the phenomenon is happened. Calculate
again.
a. Decrease the Supply offset from [0] to [-30]by 5 degree.
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136
c. Decrease the Arc correct amount from [-10] to [-15] by 1 degree.
5-1
G. The bent point (A) height is lower than the start up height.
If the 2nd reverse angle is smaller than the calculated value, the phenomenon is happened. Calculate
5-2
again.
a. Increase the Supply offset from [0] to [30] by 5 degree.
b. Increase the Arc end pos adjust from [0] to [50] by 5 degree.
5-3
c. Increase the Arc correct amount from [-10] to [+15] by 3 degree.
H. The deformation on the bent point (A) is weak.
5-4
The phenomenon is happened when the calculated value of the 2nd reverse angle is less than 15deg.
Increase the top side1 length .
5-5
a. Increase the 2nd Reverse sharp 1 from [0] to [200] by 50 degree.
b. Change the Reverse clamper from [Off] to [On].
c. Increase the 2nd Reverse sharp 2 from [0] to [Reverse angle + 10].
The calculated value of the 2nd Reverse angle is larger so that you set the 2nd Reverse angle to be [the
calculated value -5].
I. The wire is sagging in the air.
a. Increase the Top position offset from [0] by 5 degree.
In case the set value is larger, the neck is cut so that you need to increase the set value slightly.
b. Change the Top upper mode from [Mode1] to [Mode3].
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5 – 4 – 3 Description of Improved SQR2 Loop Mode (a-series)

Process
C.1 Wire Bonding
Motion of [Improved SQR2a] loop (Reverse mode: SLOW)

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.5-69
• Description of the same contents as [5-4-1 Improved STDa Loop Mode], [5-4-2
Improved SQRa Loop Mode] is omitted.
Refer to “5-4-1 Description of Improved STDa Loop Mode” (page 119), “5-4-2
Description of Improved SQRa Loop Mode” (page 129).

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5-1
• Set item : Ratio pad or Length pad or length lead
• It set with correspondent the next [(2) Top side2 length / Ratio top side2 length].
5-2
Ratio top side2 length setting
• Set the distance from bent point (A) to bent
5-3
point (B).
• Ratio pad
5-4
Decide the bent point (B) position according to
the Ratio (%) against the wire length from the
pad. Normally, select this mode without notice
5-5
(following CAUTION) .
• Length pad
fig.5-70
Decide the bent point (B) position according
the size (µm) from the pad. If the obstacle is
located in the same distance from the pad and
the wire need to take away from the obstacle,
set it with inputting the distance.
• Length lead
Decide the bent point (B) position according
the size (µm) from the lead. If the obstacle is
located in the same distance from the lead and

fig.5-71
the wire need to take away from the obstacle, set
it with inputting the distance.
• Normally, [Improved SQR2a loop mode] is frequently applied when the obstacle
is located close to the lead and the wire need to avoid. If you have the obstacle
to be avoided, apply [Length lead].
• The distance setting is horizontal but set the value by 20 to 30% more. Because
you need to consider the wire is slope.
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(3) 3rd Reverse angle setting

Process
C.1 Wire Bonding
• Set the deformation position on the bent
point (B).
• Set it almost 45deg as the figure [Motion of
Improved SQR2a Loop ](page 138).

Sequence
C.2 Wire Bonding
Because it need to make deformation in the
position where Z is highly risen, and can not

fig.5-72
make the small angle deformation in it.
• In the space, Z is high so that it does not worry for the neck damage.
Menu Tree
C.3
• Refer to “5-4-2 Improved SQR Loop Mode (a-series)” [(4) Top upper mode setting] (page 130).
(5) Reverse clamper setting
• If you set [Yes], the clamper close in the 2nd reverse and 3rd reverse so that it can fully make defor-
Bond Parameter
C.4
mation on the bent point (A) and the bent point (B).
• If the setting is not adequate, the wire possibly cut from the neck. You need to be careful.
• The setting is also applied to aforesaid [(7) 3rd Reverse sharp1 setting] and [(8) 3rd Reverse
sharp1 setting].

Loop Parameter
C.5
• Refer to “5-4-2 Improved SQR Loop Mode (a-series)” [(6) Top position offset setting] (page
131).
(7) 3rd Reverse sharp1 setting

fig.5-73
Reference Data
C.6
• Set it when you can not fully make the deformation on the
bent point (B) that located between the top side2 and the
slope side.
• The motion take in [1 ] area. After the 3rd reverse angle
motion, it move to horizontal by the set value.
• The clamper takes same action as [(5) Reverse clamper]
described.
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(8) 3rd Reverse sharp2 setting
5-1
• As [(7) 3rd Reverse sharp1], set it when you can not fully make the deformation on the bent point
(B).
5-2
• Set it when the 3rd reverse angle is less than 25deg.
• The motion take in the former fig.5-73 (page 140) [2 ]. After the 3rd reverse angle finish, when the
3rd reverse sharp2 set value is larger than the 3rd reverse angle [+] (3rd Reverse sharp1), it take the
5-3
reciprocate Arc motion. The reciprocate Arc motion path length is a difference between the 3rd
reverse sharp2 and the 3rd reverse angle [+] (3rd Reverse sharp1).
• The clamper is same motion [(5) Reverse clamper setting] .
5-4
(9) 3rd Reverse upper angle setting
5-5
• Adjust the upper angle after the 3rd reverse
finish.
• It define the rise to vertical above is
[0 (Zero)], to the reverse direction is [+], to the
2nd Bond direction is [-].
• In case that the capillary inner diameter is small
and the distance between the capillary inner and

fig.5-74
the wire is narrow, the frictional resistance is
happened. You set it to decrease the frictional resistance.
• If the set value is large, it increase the frictional resistance so that set it as [0(Zero)] normally. If you
need to change it, set it less than 5deg.
(10) 3rd Hook Dir setting
• Refer to "5-3-3 Description of SQR Loop Mode" [(6) 3rd Hook Dir setting] (page 112).
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--- Improved SQR2 Loop (a-series) Setting Method ---

Process
C.1 Wire Bonding
A Start Parameter

(The change point from SQR2 to SQR2a)

Set 0(Zero)
Sequence
C.2 Wire Bonding
Wire index amount 0

Direction top side1 length Ratio pad same
Top side1 length (Ratio) 35% same
Direction top side2 length Length lead *1 same
Top side2 length (Ratio) 1000µm same
Menu Tree
C.3

2nd Reverse angle 30deg same
3rd Reverse angle 30deg same
Neck angle 45 same
Bond Parameter
C.4

Supply offset 0% same
Loop Parameter
C.5

Y offset 6 same
Arc correct amount 0 Set between 5 and 10
Reference Data
C.6

1st Reverse sharp2 – same
1st Reverse adjust – same
2nd Reverse sharp1 0 µm same
2nd Reverse sharp2 0 deg same
2nd Reverse upper angle 0 deg same
3rd Reverse sharp1 0 µm same
3rd Reverse sharp2 0 deg same
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(The change point from SQR2 to SQR2a)
5-1
3rd Reverse upper angle 0 deg same
1st Hook Dir 0 deg same
2nd Hook Dir 0 deg same
5-2
3rd Hook Dir 0 deg same
*1 :
5-3
5-4
fig.5-75
5-5

go the next step.
Confirm you can make the start up form, the bent point (A), the bent point (B). In case the forms are
wrong (strange form), return the settings to be original.
b. Set the Stretch length to be [0 (Zero)]. Confirm the loop do not have the sway. In case the loop have
the sway, return the settings to be original.
c. Set the Neck angle to be [0 (Zero)]. If you need the neck, do not set it.
d. Change the Top upper mode from [Mode1] to [Mode2]. Confirm you can take the start up form. In case
the form is wrong (strange form), return the setting to be original.
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a. Change the Reverse mode in order of FAST MIDDLE SLOW ARC.

Process
C.1 Wire Bonding
C. Happen the loop sway. (When the loop sway is fluffy and not steady.)
The reason of the loop sway is phenomenon that wire to left or right is more than necessary. To solve the
Sequence
C.2 Wire Bonding
problem, you need to reduce the wire volume.
If you take the following described countermeasures, the start up from is changed. Absolutely confirm
the start up form after the countermeasure taken.
If the 2nd reverse angle and the 3rd reverse angle set value is small, the phenomenon is happened.
Menu Tree
C.3

Bond Parameter
C.4

Loop Parameter
C.5
d. Increase the Supply offset from [0] to [5] by 1 degree.
The deformation in the start up is strong so that the phenomenon is happened. To solve the problem,
decrease the deformation.

Reference Data
C.6
a. Decrease the 2nd Reverse angle from [30] by 3 degree.
b. Decrease the Supply offset from [0] to [-10] by 1 degree.
c. Decrease the Arc end pos adjust from [0] to [-50] by 5 degree.
d. Decrease the Arc correct amount from [-10] to [-15] by 1 degree.
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5-1
H. The deformation on the bent point (B) is weak.
5-2
The phenomenon is happened when the calculated value of the 2nd reverse angle is less than 15deg. To
solve the problem, increase the set value more than 15deg.
a. Increase the 2nd Reverse sharp1 from [0] to [200] by 50 degree.
5-3
c. Increase the 2nd Reverse sharp2 from [0] to [Reverse angle + 10].
5-4
I. The bent point (B) height is higher than the start up height.
5-5
a. Decrease the 1st Reverse angle from [30] by 3 degree.
J. The bent point (B) height is lower than the start up height.
K. The deformation on the bent point (B) is weak.
The phenomenon is happened when the calculated value of the 3rd reverse angle is less than 15deg. To
a. Increase the 3rd Reverse sharp1 from [0] to [200] by 50 degree.
c. Increase the 3rd Reverse sharp2 from [0] to [Reverse angle +10].
The calculated value of the 3rd Reverse angle is larger so that you set the 3rd Reverse angle to be [the
L. The wire is sagging in the air.

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5 – 4 – 4 Description of Improved M Loop Mode (a-series)

Process
C.1 Wire Bonding
Motion of [Improved M] loop (Reverse mode: SLOW)

Sequence
C.2 Wire Bonding
Menu Tree
C.3
Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
fig.5-76
• Description of the same contents as [Improved STDa Loop Mode], [Improved
SQRa Loop Mode] and [Improved SQR2a Loop Mode]is omitted.
Refer to [Improved STDa Loop Mode] (page 119), [Improved SQRa Loop Mode]
(page 129) and [Improved SQR2a Loop Mode] (page 138).

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--- Improved M Loop (a-series) Setting Method ---
5-1
A Start Parameter

(The change point from M to Ma)
5-2
Wire index amount 0 Decrease 50
Direction top side1 length Ratio pad *1 same
5-3
Direction top side2 length Ratio pad *1 same
5-4
2nd Reverse angle 45deg Add 5
5-5
3rd Reverse angle 45deg Add 5
Neck angle 45 same
Supply offset 0% same
Y offset 6 same
Arc correct amount 0 same
1st Reverse sharp2 – same
1st Reverse adjust – same
2nd Reverse sharp1 0µm same
2nd Reverse sharp2 0 deg same
2nd Reverse upper angle 0 deg same
3rd Reverse sharp1 0µm same
3rd Reverse sharp2 0 deg same

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(The change point from M to Ma)
Process
C.1 Wire Bonding
3rd Reverse upper angle 0 deg same

1st Hook Dir 0 deg same
2nd Hook Dir 0 deg same
3rd Hook Dir 0 deg same
Sequence
C.2 Wire Bonding
*1 :
Menu Tree
C.3
fig.5-77
Bond Parameter
C.4
Loop Parameter
C.5

go the next step.

Reference Data
C.6
Confirm you can make the start up form, the bent point (A), the bent point (B). In case the forms are
wrong (strange form), return the settings to be original.
Confirm the loop do not have the sway. In case the loop have the sway, return the settings to be original.
d. Change the Top upper mode from [Mode1] to [Mode2].

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Confirm you can take the start up form. In case the form is wrong (strange form), return the setting to be
5-1
original.
a. Change the reverse mode in order of FAST MIDDLE SLOW ARC.
5-2
5-3
problem, you need to reduce the wire volume. If you take the following described countermeasures, the
5-4
start up from is changed. Absolutely confirm the start up form after the countermeasure taken.
If the 2nd Reverse angle and the 3rd Reverse angle set value is small, the phenomenon is happened.
5-5
d. Increase the Supply offset from [0] to [20] by 1 degree.
F. The bent point (A) height is quite low.
a. Decrease the 2nd Reverse angle from [45deg] to [30deg] by 5 degree.
b. Shorten the Top side2 length [distance between the bent point (A) and the bent point (B)] to the bent
point (B) side.

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G. The deformation on the bent point (A) is weak.

Process
C.1 Wire Bonding
The phenomenon is happened when the calculated value of the 2nd reverse angle is less than 15deg. To
a. Increase the 2nd Reverse sharp1 from [0] to [200] by 50 degree.

Sequence
C.2 Wire Bonding
c. Increase the 2nd Reverse sharp2 from [0] to [Reverse angle + 10].
H. The bent point (B) height is higher than the start up height.
a. Decrease the 2nd Reverse angle from [45] by 3 degree.

Menu Tree
C.3
I. The bent point (B) height is lower than the start up height.

Bond Parameter
C.4
J. The deformation on the bent point (B) is weak.
The phenomenon is happened when the calculated value of the 3rd reverse angle is less than 15deg. To
Loop Parameter
C.5
a. Increase the 3rd Reverse sharp1 from [0] to [200] by 50 degree.
c. Increase the 3rd Reverse sharp2 from [0] to [Reverse angle + 10].
The calculated value of the 3rd Reverse angle is larger so that you set the 3rd Reverse angle to be [the
Reference Data
C.6
K. The wire is sagging in the air.
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5 – 5 Description of Low2 Loop Mode
5-1
The [Low2 Mode] added newly is described.
5 – 5 – 1 Description of Low2 Loop Mode
[Motion of Low2 Loop] (Reverse mode: SLOW)
5-2
5-3
5-4
5-5
fig.5-78
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Form the Low2 Loop

.
Process
C.1 Wire Bonding
In the [Improved STDa Loop], [Improved SQRa Loop], [Improved SQR2a Loop], the reverse in each
steps is the bent point as it is. In the [Low2 Loop], there is no reverse in the 1st step.
. As described in the “Chapter-1 Wire Bonding Process” [(4) Metal Thin Wire] (page 7), the 1st step
in the [Low2 Loop] is a natural Loop after the annealed (heat and allow metal to cool slowly).
Sequence
C.2 Wire Bonding
Therefore, the wire height is decided by the effect of the [Tail length] and [Spark time] so that you can
not control the wire height compulsively.

. Parameters are the mixture [Improved STDa Loop] with [Improved SQRa Loop].
Menu Tree
C.3
Bond Parameter
C.4

fig.5-79
Refer to the page which has appeared for description of each parameter.
(1) 1st Reverse mode setting

.
Loop Parameter
C.5
Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(1) 1st Reverse Mode setting] (page
119).

. Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(3) Wire index amount setting] (page
121).
Reference Data
C.6

. Refer to "5-3-2 SQR Loop Mode " [(1) Direction top side1 setting] (page 103).
(4) [Ratio] Top side1 length setting

. Refer to "5-3-2 SQR Loop Mode " [(2) Top side1 length setting] (page 103).

. Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(4) 1st Reverse angle setting] (page
122).
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.
5-1
Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(5) Neck height setting] (page 122).

. Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(6) Neck angle setting] (page 122).
5-2
. Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(7) Top upper mode setting] (page 123).
5-3
. Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(9) Arc end pos adjust setting] (page
124).
5-4
. Refer to "5-4-1 Improved STD Loop Mode (a-series)" [(10) Clamper open/close setting] (page
124).
5-5
. Refer to "5-3-1 STD Loop Mode " [(11) Stretch length setting] (page 98).

. Refer to "5-3-1 STD Loop Mode " [(9) Y offset setting] (page 98).

. Refer to "5-4-2 Improved SQR Loop Mode (a-series)" [(6) Top position offset setting] (page
131).

. Refer to "5-3-1 STD Loop Mode " [(12) Arc correct amount setting] (page 99).

. Refer to "5-3-1 STD Loop Mode " [(13) Arc partial position setting] (page 100).
(16) 1st Reverse sharp2 setting

. It is setting to strength the deformation on the bent point (A).
. After the 1st reverse finish, when the 1st reverse sharp 2 set value is larger than the 1st reverse
angle, it take the reciprocate Arc motion. The reciprocate Arc motion path length is a difference
between the 1st reverse sharp 2 and the 1st reverse angle.
. The clamper is opened during the motion.
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Process
C.1 Wire Bonding
Sequence
C.2 Wire Bonding
fig.5-80
fig.5-81
(17) Loop top upper angle setting

.
Menu Tree
C.3
It is upper angle setting after the 1st reverse finish.

. It define the vertical lifting angle is [0 (Zero)], to the reverse side is
[+], to the 2nd Bond side is [-].

. In case that the capillary inner diameter is small and the distance be-
tween the capillary inner and the wire is narrow, the frictional resistance
Bond Parameter
C.4
is happened. You set it to decrease the frictional resistance.

. If the set value is large, it increase the frictional resistance so that set it as
[0(Zero)] normally. If you need to change it, set it less than 5deg.

.
Loop Parameter
C.5
Set range : -90 to +90 deg

. It is setting to make the bent point (A) to the horizontal. The point (A)
is located between the top side1 and the slope side.

. It set when you need to avoid the obstacle or the next wire.
fig.5-82
Reference Data
C.6
fig.5-83 fig.5-84
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--- Low2 Loop Setting Method ---
5-1
A Start Parameter
Mode Set value

1st Reverse mode FAST
5-2
Wire index amount 0
Direction top side1 length Length pad *1
Top side1 length (Ratio) *1
5-3
1st Reverse angle *1
Neck height *2
Neck angle *2
5-4
Top upper mode Mode1
5-5
Clamper open/close 0
Stretch length 0
Y offset 6
Top position offset 0
Arc correct amount -10
1st Reverse sharp2 0
Loop top upper angle 0
1st Hook Dir 0
*1 : Top side1 length / 1st Reverse angle
For details, refer to “5-3-2 Description of SQR Loop Mode” [(4) 2nd Reverse angle setting]
(page 104).
fig.5-85
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Process
C.1 Wire Bonding
* If the calculated value is less than 15deg, increase [Top side1 length (Ratio)] value to be
more than 15deg.

Sequence
C.2 Wire Bonding

Menu Tree
C.3
Bond Parameter
C.4

go the next step.

Loop Parameter
C.5
Confirm you can make the start up form, the bent point (A). In case the forms are wrong (strange form),
return the settings to be original.

Reference Data
C.6
b. Set the Neck angle to be [0 (Zero)].
c. Change the Top upper mode from [Mode1] to [Mode2].
The wire character by the annealing (heat and allow metal to cool slowly) effect make a natural bent so
that it does not make the bent consciously. In case you can not fully take the deformation on the start
up, and the loop height is varied, check the torch environment firstly.
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a. A wire is made to deformation using the Neck height and the Neck angle.
5-1
Set the Neck angle to be [45deg] the target Neck height.
5-2
problem, you need to reduce the wire volume. If you take the following described countermeasures, the
start up from is changed. Absolutely confirm the start up form after the countermeasure taken.
5-3
If the calculated value of the 1st reverse angle is wrong, the phenomenon is happened. Calculate again.
a. Increase the Stretch length from [0] to [50µm].
5-4
d. Decrease the Supply offset from [0] to [-10] by 0.5 degree.
5-5
d. Increase the Supply offset from [0] to [10] by 0.1 degree.
The deformation in the start up is strong so that the phenomenon is happened. To solve the problem,
decrease the deformation.
If the 1st reverse angle is larger than the calculated value, the phenomenon is happened. Calculate
again.
a. Decrease the Supply offset from [0] to [-30] by 5 degree.
c. Decrease the Arc correct amount from [-10] to [-15] by 1 degree.

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Process
C.1 Wire Bonding
If the 1st reverse angle is smaller than the calculated value, the phenomenon is happened. Calculate
again.
Sequence
C.2 Wire Bonding
H. The deformation on the bent point (A) is weak.
The phenomenon is happened when the calculated value of the 1st reverse angle is less than 15deg. To
solve the problem, increase the top side1 length.

Menu Tree
C.3
a. Increase 1st Reverse sharp2 from [0] to the [Reverse angle +10].
I. The wire is sagging in the air.

Bond Parameter
C.4

Loop Parameter
C.5
Reference Data
C.6
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Chapter 6 Reference Data
C.1 Contents
6-1 Stack Bonding..................................................................... 160
C.2 Contents
6-2 Stack Reverse Bonding...................................................... 162
6-3 35µm Pad Pitch Bonding.................................................... 165
6-4 High Speed Bonding........................................................... 167
6-5 Thin Die Reverse Bonding.................................................. 171
6-6 Setting Table....................................................................... 174
C.3 Contents
(1) EFU23 Setting Table.............................................................. 174
(2) EFU35A Setting Table ........................................................... 175
6-7 Comparable Table with UTC-400 Series............................. 176
(1) Search Speed.......................................................................... 176
C.4 Contents
(2) Search Level........................................................................... 176
(3) US power................................................................................ 176
6-8 Comparable Table of Performance...................................... 177
(1) UTC-200BI • UTC-300BI • UTC-400BI • UTC-1000
Comparable Table....................................... 177
C.5 Contents
C.6 Contents
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< Chapter 6 Reference Data >
6 – 1 Stack bonding
Process
C.1 Wire Bonding
(1) Stack Bonding Photo
[Stack Bonding] – [Base]

• Device name : Stack
Base Parameter
Clamp force 50
Spark position
Sequence
C.2 Wire Bonding
Move
Spark timing After B’g
Pre heater 150
Pre heater tolerance 10
Main heater 150
Main heater tolerance 10
After heater 120
After heater tolerance 10
Stack-3 Pre Heater offset _
Menu Tree
C.3
(2) [Stack Bonding] – [Loop] Main heater offset _

• Device name : Stack After heater offset _
• Device type : BGA-80
Pad fall speed 100%
• Wire length : Upper 3mm / Lower 1.35mm Loop speed 100%
• Gold wire : 25µm GLD
• Capillary : SBNE-33BC
• Loop height : Upper185µm / Lower125µm
Bond Parameter
C.4
• Lower Loop • Upper Loop

Loop Loop
Bond mode LOOP-SQR Bond mode LOOP-SQR
Reverse mode FAST Reverse mode FAST
Loop height 150 Loop height 200
Wire index amount 120 Wire index amount 180
Direction top side1 Ratio pad Direction top side1 Ratio pad
Loop Parameter
C.5
Ratio top side1(length) 20% Ratio top side1(length) 60%

Reverse clamper No Reverse clamper No
Neck height 100 Neck height 100
Neck angle – Neck angle 30
1st Reverse angle 45 1st Reverse angle 45
2nd Reverse angle 35 2nd Reverse angle 40
2nd Rev revision1 – 2nd Rev revision1 –
2nd Rev revision2 – 2nd Rev revision2 50
2nd Rev Down Start Pos – 2nd Rev Down Start Pos –
Reference Data
C.6
1st Hook Dir – 1st Hook Dir –

2nd Hook Dir – 2nd Hook Dir –
Loop rise position Above pad Loop rise position Above pad
Pad right over correct – Pad right over correct –
Rise pos correct1 – Rise pos correct1 –
Wire height offset – Wire height offset –
Y offset – Y offset –
Clamper open/close 100 Clamper open/close 100
Stretch length – Stretch length –
Arc correct amount 5 Arc correct amount 5
Arc partial position – Arc partial position –
Arc end pos adjust – Arc end pos adjust –
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(3) [Stack Bonding] – [Bonding]

• Device name : Stack
6-1
• Device type : BGA-80
• Pad pitch : 60µm
• Pad size : 57µm
• Gold wire : ø25µm GLD
6-2
• Capillary : SBNE-33BC
• Ball dia. : Upper/Lower 54µm
• ball dia. : Upper/11µm Lower/10µm
• Lower Loop • Upper Loop
6-3
1st Bond 1st Bond
Bond Mode PAD-STD Bond Mode PAD-STD
Search level 70 Search level 70
Search speed 15 Search speed 15
6-4
US time 6 US time 6
US power 230 US power 230
Bond force 20 Bond force 20
Bond time 8 Bond time 8
Bond level 1119 Bond level 1346
6-5
US mode 5 US mode 5
Search force 30 Search force 30
SPC type SPC1 SPC type SPC1
SPC data 0.8 SPC data 0.8
SPC times 1 SPC times 1
6-6
SPC direction X SPC direction X
2nd Bond 2nd Bond

Bond mode LEAD-STD Bond mode LEAD-STD
6-7
US time 5 US time 5
Force time 7 Force time 7
6-8
US mode 4 US mode 4
US rev direction XY US rev direction XY
US X adjust / 1-3 150% US X adjust / 1-3 150%
US Y adjust / 2-4 100% US Y adjust / 2-4 100%
Force rev direction No Force rev direction No
Bond force X-DIR /1-3 – Bond force X-DIR /1-3 –
Bond force Y-DIR /2-4 – Bond force Y-DIR /2-4 –
Spark Spark
Bond mode Spark Bond mode Spark
Tail length 400 Tail length 400
Tail cut mode SLOW Tail cut mode SLOW
Tail cut speed 100% Tail cut speed 100%
XY move-distance 0 XY move-distance 0
Spark gap 800 Spark gap 800
Torch time 0.42 Torch time 0.42
Torch power 43 Torch power 43
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6 – 2 Stack Reverse Bonding

Process
C.1 Wire Bonding
(1) Stack Reverse Bonding Photo

Sequence
C.2 Wire Bonding
Stack
Menu Tree
C.3
(2) [Stack Reverse Bonding] – [Loop]

• Device name : Stack • Capillary : SBNE-33BC
• Device type : BGA-80 • Loop height : Upper 180µm / Lower 96µm
• Wire length : Upper 3.1mm / Lower 1.4mm • Clearance from Chip : Upper 57µm / Lower 53µm
• Gold wire : ø 25µm GLD
Bond Parameter
C.4
• Lower Loop (Stack) • Upper Loop (Stack)

Loop Loop
Bond mode LOOP-SQR Bond mode LOOP-SQR
Reverse mode FAST Reverse mode FAST
Direction top side1 Ratio pad Direction top side1 Ratio pad
Loop Parameter
C.5
Ratio top side1(length) 35% Ratio top side1(length) 25%

Reverse clamper No Reverse clamper No
Neck height 85 Neck height 200
Neck angle 30 Neck angle 40
1st Reverse angle 45 1st Reverse angle 48
2nd Reverse angle 28 2nd Reverse angle 24
2nd Rev Down Start Pos – 2nd Rev Down Start Pos –
Reference Data
C.6
1st Hook Dir – 1st Hook Dir –

2nd Hook Dir – 2nd Hook Dir –
Loop rise position Above pad Loop rise position Above pad
Pad right over correct – Pad right over correct –
Wire height offset – Wire height offset –
Y offset – Y offset –
Clamper open/close 100 Clamper open/close 100
Stretch length 50 Stretch length 50
Arc correct amount -10 Arc correct amount -10
Arc partial position – Arc partial position –
Arc end pos adjust – Arc end pos adjust –
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Cut Action Cut Action

Bond Mode CUT -T Bond Mode CUT -T
6-1
Reverse mode SLOW Reverse mode SLOW
Reverse height 32.1 Reverse height 32.1
Reverse length 35 Reverse length 35
Back reverse length 60 Back reverse length 60
Reverse direction Wire + Reverse direction WireÅ{
6-2
Front buried 15 Front buried 15
Back buried 32 Back buried 32
Tail form height 0 Tail form height 0
Tail form length 0 Tail form length 0
6-3
(3) [Stack Bonding] – [Bonding (Reverse)]
• Device name : Stack • Gold wire : ø 25µm GLD
• Device type : BGA-80 • Capillary : SBNE-33BC
• Pad pitch : 60µm • Ball dia. : Upper/Lower 75µm
6-4
• Lower Stack • Lower Stack

1st Bond 1st Bond
6-5
Bond Mode PAD-STD Bond Mode PAD-STD
US time 8 US time 6
6-6
Bond time 9 Bond time 8
US mode 5 US mode 5
6-7
SPC type SPC1
2nd Bond SPC data 0.8
Bond Mode LEAD-STD SPC times 1
Search level 80 SPC direction X
Search speed 15
6-8
US time 0 2nd Bond
US power 0 Bond mode LEAD-STD
Bond force 40 Search level 60
Bond time 8 Search speed 17
Bond level 1128 US time 5
US mode 0 US power 270
Search force 40 Bond force 90
SPC type SPC1 Force time 7
SPC data 4 Bond level 875
SPC times – US mode 4
SPC direction wire Search force 90
Scale lead 40 US rev direction XY
US X adjust / 1-3 150%
US Y adjust / 2-4 100%
Force rev direction No
Bond force X-DIR /1-3 –
Bond force Y-DIR /2-4 –
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Bump Bond Spark

Process
C.1 Wire Bonding
Bond Mode PAD-STD Bond mode Spark

Search level 70 Tail length 400
Search speed 15 Tail cut mode 0
US time 8 Tail cut speed 100%
Bond force 25 XY move-distance 0
Bond time 10 Spark gap 800
Bond level 0 Torch time 0.42
5
Sequence
C.2 Wire Bonding
US mode Torch power 43

Search force 30
SPC type 1 Bump Bond
SPC data 0.8 Bond Mode PAD-STD
SPC times 1 Search level 70
SPC direction X Search speed 15
US time 8
Spark US power 305
Bond mode Spark Bond force 25
Menu Tree
C.3
Tail length 400 Bond time 10

Tail cut mode SLOW Bond level 0
Tail cut speed 80% US mode 5
US power 0 Search force 30
XY move-distance 0 SPC type SPC1
Spark gap 800 SPC data 0.8
Torch time 0.42 SPC times 1
Torch power 43 SPC direction X
Bond Parameter
C.4
Bump Spark
Bond mode Bump spark
Tail length 400
Tail cut mode SLOW
Tail cut speed 80%
US power 0
XY move-distance 40
Loop Parameter
C.5
Spark gap 300

Torch time 0.44
Torch power 45.5
Reference Data
C.6
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6 – 3 35µm Pad Pitch Bonding
6-1
(1) 35µm Pad Pitch Bonding Photo
6-2
6-3
6-4
35µm P-P2 35µm P-P3
(2) [35µm Bond Parameter for SEMICON 2002 (Japan)]
6-5
• Title name : 35µm pad pitch bonding • Bonding speed : 0.141sec/wire
• Device name : BGA-256 (STD Chip) • Gold wire : ø 15µm GLF
• Pad pitch : 35µm • Capillary : TO-07 Special
• Pad size : 35µm • Loop height : 130µm
6-6
• Wire length : Average 3.1mm
1st Bond Base Parameter

Bond mode PAD-STD Clamp force 1
Search level Spark position Move
6-7
100
Search speed 3 Spark timing After B’g
US time 5 Pre heater 130
US power 80 Pre heater tolerance 10
Bond force 4 Main heater 180
6-8
Force time 8 Main heater tolerance 10
Bond level 1222 After heater 100
US mode 3 After heater tolerance 10
Search force 8 Pre heater offset 15
Pre US mode 1 Main heater offset 15
Pre US power 30 After heater offset 15
Bond delay time 5 Heat at each pitch Indexing No
up to bond stage
Heater time –
Heat before clamping lead frame No
Heater time –
Timer at space detect No
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2nd Bond Loop

Bond mode LOOP-SQR
Process
C.1 Wire Bonding
Bond mode LEAD-STD

Search level 50 1st Reverse mode SLOW
Search speed 8 Loop height 140
US time 7 Wire index amount 0
US power 80 Direction top side1 Ratio pad
Bond force 90 Top side1 length 30%
Force time 9 1st Reverse angle 48
Bond level 891 2nd Reverse angle 21
Neck height –
Sequence
C.2 Wire Bonding
US mode 3
Search force 10 Neck angle –
US rev direction XY Top upper mode Above pad
US X adjust /1-3 120% Reverse clamper –
US Y adjust /2-4 100% Supply offset –
Force rev direction No Arc end pos adjust –
Bond force X-DIR/1-3 – Clamper open/close 100
Bond force Y-DIR/2-4 – Stretch length 50
Pre US mode Yes Y offset 15
Menu Tree
C.3
Pre US power 40 Top position offset –

SPC type SPC1 Arc correct amount –
SPC data 1.5 Arc partial position –
SPC times – Wire height offset –
SPC direction Wire 1st Reverse sharp2 –
2nd Reverse sharp1 –
2nd Reverse sharp2 –
2nd Reverse upper angle –
Bond Parameter
C.4
1st Hook Dir –

2nd Hook Dir –
Spark
Bond Mode Spark
Tail length 300
Tail cut mode FAST
Loop Parameter
C.5
Tail cut speed –

US power 200
XY move-distance –
Spark gap 800
Torch electrode 0.1ms
Torch power 35mA
Heat before start of bonding Yes
Heater timer 3sec
Cool after completion of bonding No
Reference Data
C.6
Cool timer –
Cool before unloading to unloader No
Cool timer –
Frame overheat prevention at machine stop No
Time before descent of Heat block after stop –
Heat time before start of bonding after reset –
Pad fall speed 100%
Loop speed 100%
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6 – 4 High Speed Bonding
(1) High Speed Bonding Photo
6-1
6-2
6-3
6-4
UTC-1000 high speed-4 UTC-1000 hifh speed-1
(2) [Bond Parameter] – [Loop1]

• Title name : High speed bonding • Bonding speed : 0.070sec/wire
6-5
• Device name : QFP-160 (STD-3 Chip) • Gold wire : ø 30µm GLD
• Wire length : 2mm (In side) • Capillary : SBNS-41DH
• Step : 470µm (in) – 120µm (out) • Loop height : 120µm (in) 280µm (out)
6-6
High Speed Hook
Bond mode LOOP-STD Bond mode LOOP-STD
Reverse mode FAST2 Reverse mode FAST2
6-7
1st Reverse angle 55 Direction top side1 0
Neck height 100 Top side1 length 1600
Neck angle 0 1st Reverse angle 45
Arc end pos adjust 0 2nd Reverse angle 24
6-8
Clamper open/close 100 Neck height 100
Stretch length 0 Neck angle 0
Y offset 0 Reverse clamper 1
Top position offset Above reverse Arc end pos adjust 0
Arc correct amount 5 Clamper open/close 100
Arc partial position 0 Stretch length 50
Wire height offset 0 Y offset 6
1st Hook Dir 0 Loop rise position Above pad
Top position offset 0
Arc correct amount -5
2nd Rev revision1 0
2nd Rev revision2 0
2nd Rev Down Start Pos 0
2nd Reverse upper angle 0
3rd Reverse upper angle -70
1st Hook Dir 30 (-30)
2nd Hook Dir 45 (-45)
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(3) [Bond Parameter] – [Bonding1]

Process
C.1 Wire Bonding
• Title name : High speed bonding

• Device name : QFP-160 (STD-3 Chip)
• Pad pitch : 150µm
• Bonding speed : 0.070sec/wire
• Gold wire : ø 30µm GLD
• Capillary : SBNS-41DH
Sequence
C.2 Wire Bonding
• Bonded ball dia. : 85µm (in) 83µm (out)

• Bonded ball height : 16µm (in) 18µm (out)
High Speed Hook

Bond mode PAD-STD Bond mode PAD-STD
US time 3 US time 3
Menu Tree
C.3

Alignment Pad Alignment Lead
US mode 4 US mode 5
Pre US mode 0 Pre US mode 0
Pre Us power 40 Pre Us power 50
Bond Parameter
C.4
US change mode 0 US change mode 0

US pre-change mode 3 US pre-change mode 0
US pre-change time 50 US pre-change time 0
US change power 0 US change power 0
US change time 0 US change time 0
Change mode 0 Change mode 0
Pre-change force 12 Pre-change force 50
Force pre-change time 50 Force pre-change time 0
Loop Parameter
C.5
Force change time 0 Force change time 12

Bond delay time 0 Bond delay time 0
Scrub times 0 Scrub times 0
Scrub width 5 Scrub width 5
Scrub direction XY Scrub direction XY
SPC type 0 SPC type 0
SPC data 1 SPC data 1
Reference Data
C.6
SPC direction 1 SPC direction 0

NSOP No NSOP No
NSOP threshold 770 NSOP threshold 800
Lead locating mode 1 Lead locating mode 1
Bond level tracking 0 Bond level tracking 0
Follow search level 150 Follow search level 150
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2nd Bond 2nd Bond

Bond mode LEAD-STD Bond mode LEAD-STD
6-1
US time 4 US time 4
6-2
Alignment Pad Alignment Lead
US mode 4 US mode 5
6-3
US rev direction 1 US rev direction 1
US X adjust/1-3 100 US X adjust/1-3 130
US Y adjust/2-4 100 US Y adjust/2-4 100
Force rev direction 1 Force rev direction 0
Bond force X-DIR/1-3 100 Bond force X-DIR/1-3 100
6-4
Bond force Y-DIR/2-4 100 Bond force Y-DIR/2-4 100
Pre-change force 13 Pre-change force 50
Force pre-change time 50 Force pre-change time 0
Force change time 0 Force change time 12
6-5
Bond delay time 0 Bond delay time 0
Scrub times 0 Scrub times 0
Scrub width 5 Scrub width 5
Scrub direction Y Scrub direction Y
SPC type No SPC type No
6-6
SPC data 20 SPC data 5
SPC direction Wire SPC direction Wire
NSOL No NSOL No
NSOL threshold 0 NSOL threshold 0
6-7
Lead locating mode 0 Lead locating mode 1
Bond level tracking 0 Bond level tracking 0
Follow search level 100 Follow search level 100
Scale lead 0 Scale lead 0
Spark Spark 6-8

Bond mode Spark Bond mode Spark
Tail length 400 Tail length 400
Tail cut mode FAST Tail cut mode SLOW
Tail cut speed 100% Tail cut speed 100%
XY move-distance 0 XY move-distance 0
Spark gap 300 Spark gap 300
Spark Default Spark Default
time 0.74 time 0.74
current 59 current 59
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(3) [Bond Parameter] – [Base Paremeter]

Process
C.1 Wire Bonding
Base Paremeter
Spark position Move
Spark timing After Bond
Pad fall speed 100%
Loop speed 100%
1st Bond Us Pwr Rate 100%
Tail CutClamp Force 50
Loop Clamp Force 50
Sequence
C.2 Wire Bonding
Pre heater 170 degC

Pre heater tolerance 10 degC
Main heater 250 degC
Main heater tolerance 10 degC
After heater 180 degC
After heater tolerance 10 degC
Pre heater offset 20 degC
Main heater offset 50 degC
Menu Tree
C.3
After heater offset 0 degC

Bond Parameter
C.4
Loop Parameter
C.5
Reference Data
C.6
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6 – 5 Thin Die Reverse Bonding
6-1
(1) [Thin Die Reverse Bonding] – [Loop]
Loop
Bond mode LOOP-SQR
6-2
Reverse mode FAST
Loop height 530
Wire index amount 750
Direction top side1 0
Top side1 length 400
6-3
1st Reverse angle 50
2nd Reverse angle 35
Neck height 150
Neck angle 45
Reverse clamper 0
6-4
Clamper open/close 100
Stretch length 50 Die thickness : 50µm
Y offset 0
Loop rise position 0
6-5
Top position offset 0 Cut Action
Arc correct amount 10 Bond Mode CUT-T
Arc partial position 0 Reverse mode 0
Wire height offset 0 Reverse height 40
6-6
2nd Rev revision1 0 Reverse length 40
2nd Rev revision2 34 Back reverse length 27
2nd Rev Down Start Pos 0 Reverse direction 5
2nd Reverse upper angle 0 Front buried 25
3rd Reverse upper angle 0 Back buried 10
6-7
1st Hook Dir 0 Tail form height 0
2nd Hook Dir 0 Tail form length 0
6-8
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(2) [Thin Die Reverse Bonding] – [Bonding]

Process
C.1 Wire Bonding
1st Bond 2nd Bond

Bond mode PAD-STD Bond force Y-DIR/2-4 100
Search level 100 Pre US mode 0
Search speed 15 Pre Us power 0
US time 7 US change mode 0
US power 250 US pre-change mode 0
Bond force 33 US pre-change time 0
Force time 9 US change power 0
Sequence
C.2 Wire Bonding
Bond level 902 US change time 0

Alignment Lead Change mode 0
US mode 4 Pre-change force 50
Search force 33 Force pre-change time 0
Pre US mode 0 Force change time 12
Pre Us power 0 Bond delay time 0
US change mode 0 Scrub times 0
US pre-change mode 0 Scrub width 5
Menu Tree
C.3
US pre-change time 0 Scrub direction Y

US change power 0 SPC type SPC1
US change time 0 SPC data 5
Change mode 0 SPC times 1
Pre-change force 50 SPC direction Wire
Force pre-change time 0 NSOL No
Force change time 12 NSOL threshold 0
Bond delay time 0 Lead locating mode 0
Bond Parameter
C.4
Scrub times 0 Bond level tracking 0

Scrub width 5 Follow search level 100
Scrub direction X Scale lead 48
SPC type No
Bump Bond
SPC data 1
Bond mode PAD-STD
SPC times 1
Search level 150
SPC direction Y
Search speed 7
NSOP No
Loop Parameter
C.5
US time 14
NSOP threshold 800
US power 240
Lead locating mode 0
Bond force 33
Bond level tracking 0
Force time 15
Follow search level 150
Bond level 0
2nd Bond Alignment LEAD
Bond mode LEAD-STD US mode 4
Search level 150 Search force 33
Search speed 15 US rev direction 0
Reference Data
C.6
US time 5 US X adjust/1-3 100%

US power 0 US Y adjust/2-4 100%
Bond force 48 Force rev direction 0
Force time 6 Bond force X-DIR/1-3 100
Bond level 1300 Bond force Y-DIR/2-4 100
Alignment Pad Pre US mode 1
US mode 0 Pre Us power 100
Search force 48 US change mode 0
US rev direction 0 US pre-change mode 0
US X adjust/1-3 100% US pre-change time 0
US Y adjust/2-4 100% US change power 0
Force rev direction 0 US change time 0
Bond force X-DIR/1-3 100 Change mode 0
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Bump Bond Spark

Pre-change force 50 Bond mode Spark
Tail length 550
6-1
Force pre-change time 0
Force change time 12 Tail cut mode 0
Bond delay time 0 Tail cut speed 30
Scrub times 0 US power 500
Scrub width 5 XY move-distance 0
6-2
Scrub direction X Spark gap 700
SPC type SPC1 Spark DEF
SPC data 2 time 0.6
SPC times 1 current 45
SPC direction X
6-3
Bond level tracking 0 Bump Spark
Follow search level 150 Bond mode Bump spark
Scale lead 0 Tail length 550
Tail cut mode 0
Tail cut speed 60
6-4
US power 500
XY move-distance 0
Spark gap 700
Spark DEF
6-5
time 0.6
current 45
6-6
(3) [Thin Die Reverse Bonding] – [Base]
Base Parameter
Spark position Before move
Spark timing Before bond
6-7
Pad fall speed 100%
Loop speed 100%
1st Bond Us Pwr Rate 100%
Tail CutClamp Force 1
Loop Clamp Force 1
6-8
Pre heater 180 degC
Pre heater tolerance 10 degC
Main heater 180 degC
Main heater tolerance 10 degC
After heater 160 degC
After heater tolerance 10 degC
Pre heater offset 0 degC
Main heater offset 0 degC
After heater offset 0 degC
NE00039-00
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6 – 6 Setting
Process
C.1 Wire Bonding
(1) EFU23 Recommendable setting table

Process : 1. Select a diameter of a initial ball and a gold wire from the following tables and set it according suitable time and a current
value.
2. Depending on the kind of gold wire, it may offset a little. If the desired initial ball diameter can not be obtained, change the
setting of the current value 0.1mA step.
Note : Electric discharge time range : 0.1 to 3.0ms Electric discharge current range : 10 to 70mA
Sequence
C.2 Wire Bonding
EFU23 Initial Ball Diameter Setting
Gold wire Dia. (µm)

ø20µm ø23µm ø25µm ø30µm
Menu Tree
C.3
Initial Ball Dia.

Set Current (mA)
(µm) 30mA 40mA 50mA 60mA
Set Time (ms)
26 0.18 – – –
28 0.2 0.18 _ –
30 0.22 0.2 0.2 –
Bond Parameter
C.4
32 0.24 0.22 0.22 –

34 0.26 0.24 0.24 –
36 0.28 0.26 0.26 –
38 0.32 0.28 0.28 –
40 0.34 0.32 0.3 0.34
42 0.38 0.34 0.32 0.36
44 0.4 0.36 0.34 0.38
Loop Parameter
C.5
46 0.44 0.4 0.36 0.4

48 0.48 0.42 0.38 0.42
50 0.52 0.46 0.4 0.44
52 0.56 0.5 0.44 0.48
54 0.62 0.54 0.48 0.5
56 0.66 0.6 0.5 0.54
Reference Data
C.6
58 0.72 0.64 0.54 0.58

60 0.78 0.7 0.58 0.6
62 – 0.76 0.62 0.64
64 – 0.82 0.66 0.68
66 – 0.88 0.72 0.72
68 – 0.96 0.76 0.76
70 – – 0.82 0.8
72 – – 0.88 0.84
74 – – 0.94 0.9
76 – – 1 0.96
78 – – – 1
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(2) EFU35A Recommendable setting table

Process : 1. Select a diameter of a initial ball and a gold wire from the following tables and set it according suitable time and a current
6-1
value.
2. Depending on the kind of gold wire, it may offset a little. If the desired initial ball diameter can not be obtained, change the
setting of the current value 0.1mA step.
Note : Electric discharge time range : 0.05 to 1.0ms Electric discharge current range : 22 to 80mA
EFU35A Initial Ball Diameter Setting
6-2
Gold wire Dia. (µm)
ø15µm ø18µm ø20µm ø23µm ø25µm ø30µm
Initial Ball Dia.
Set Current (mA)
(µm) 35mA 40mA 40mA 48mA 48mA 55mA
6-3
Set Time (ms)
15 – – – – – –
16 – – – – – –
6-4
18 0.06 – – – – –
20 0.07 0.11 – – – –
22 0.08 0.12 0.18 – – –
24 0.09 0.13 0.19 0.18 – –
6-5
26 0.1 0.14 0.2 0.2 – –
28 0.11 0.15 0.2 0.22 0.27 –
30 0.13 0.16 0.21 0.23 0.28 –
32 0.15 0.18 0.22 0.24 0.29 0.31
6-6
34 0.16 0.2 0.24 0.25 0.31 0.33
36 0.19 0.21 0.25 0.27 0.32 0.34
38 0.21 0.22 0.26 0.28 0.33 0.35
40 0.24 0.24 0.28 0.3 0.34 0.36
6-7
42 0.26 0.26 0.29 0.32 0.36 0.39
44 – 0.28 0.32 0.33 0.37 0.41
46 – 0.29 0.35 0.36 0.39 0.43
– 0.38 0.46
6-8
48 0.32 0.38 0.42
50 – 0.35 0.4 0.4 0.44 0.49
52 – 0.4 0.42 0.43 0.47 0.51
54 – – 0.45 0.46 0.49 0.54
56 – – 0.49 0.49 0.52 0.57
58 – – 0.53 0.53 0.56 0.6
60 – – 0.58 0.56 0.6 0.64
62 – – 0.63 0.6 0.63 0.68
64 – – 0.69 0.63 0.66 0.72
66 – – – 0.66 0.71 0.76
68 – – – 0.69 0.76 0.8
70 – – – 0.75 0.82 0.85
72 – – – 0.82 0.88 0.9
74 – – – – 0.94 0.95
76 – – – – 1 0.97
78 – – – – – 1
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6 – 7 Comparable Table with UTC-400 Series

Process
C.1 Wire Bonding
(1) Conversion table of search speed

UTC-400 series UTC-1000 UTC-400 series UTC-1000
Set value Recommendable value (mm/s) Set value Recommendable value (mm/s)
S0 4 5 19
0 5 S6 23
S1 6 6 28
1 7 S7 32
S2 8 36
Sequence
C.2 Wire Bonding
7
2 9 S8 40
S3 10 8 45
3 11 S9 53
S4 12 9 61
4 13 S10 69
S5 16 10 78
(2) Conversion table of search level

Menu Tree
C.3
UTC-400 series UTC-1000

Set value Recommendable value (mm/s)
1 10
5 36
10 72
15 108
20 144
Bond Parameter
C.4
25 180
30 216
(3) Conversion table of US power

UTC-400 series UTC-1000
Set Set
0 to 255 0 to 999
Loop Parameter
C.5
• Set the US power of UTC-1000 by about 4 times of UTC-400 series US power
setting.
Reference Data
C.6
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Refer to an another pdf. file [6 – 8 Comparable Table of Performance].
NE00039-00
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WIRE BONDER
This Book is printed

Second Step Guide on the 100% recyclable clean paper.
The Date of Publication : 28/ 3/2003 Not For Sale

The First Edition First Printing
The Publication : Shinkawa Engineering Service Dept.
Editor : Masao Ogawa
Toshiyuki Gomi
Super visor : Kazuhiro Arai
2-51-1 Inadaira Musashimurayama-shi,Tokyo 208-8585,Japan

PHONE+81-42-560-1231
©2003 SHINKAWA LTD. All rights reserved.
NE00039-00
178

UTC-1000 2nd Step Manual

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WIRE BONDER

Second Step Guide

Automatic Wire Bonder”.

automatic wire bonder with microprocessor since 1973.

Chapter 1 Wire Bonding Process 5

1-2 Elements of the Wire Bonding............................................................. 9

Chapter 2 Wire Bonding Sequence 11

2-2 Description of Character.......................................................................... 13

2-3 Wire Bonding Sequence.......................................................................... 14

Chapter 3 Menu Tree 19

3-6 Product Management........................................................................ 28

3-7 Machine Management...................................................................... 29

Chapter 4 Bond Parameter 35

4-2 Description of Setting Range.............................................................. 39

4-3 Description of 1st Bond Parameter..................................................... 41

4-4 Description of 2nd Bond Parameter..................................................... 56

4-5 Description of Spark Parameter........................................................... 65

4-6 Description of Bump Spark Parameter............................................... 68

4-7 Description of Bump Bond Parameter................................................... 70

4-8 Description of Cut Action Parameter.................................................. 74

4-9 Selection of Capillary......................................................................... 82

4-10 Adjust to improve the bondability.......................................................... 85

5-1 Kind of Loop Mode............................................................................ 88

5-2 Selective Method of Loop Mode........................................................ 90

5-3 Description of Loop Mode................................................................. 94

5-3-1 Description of STD Loop Mode....................................................... 94

5-3-2 Description of SQR Loop Mode....................................................... 102

5-3-3 Description of SQR2 Loop Mode..................................................... 110

5-3-4 Description of M Loop Mode........................................................... 116

5-4 Description of Improved Loop Mode (a-series)................................. 119

5-4-1 Description of STD Improved Loop Mode (a-series)....................... 119

5-4-2 Description of SQR Improved Loop Mode (a-series)....................... 129

5-4-3 Description of SQR2 Improved Loop Mode (a-series)..................... 138

5-4-4 Description of M Improved Loop Mode (a-series)........................... 146

5-5 Description of Low2 Loop Mode...................................................... 151

Chapter 6 Reference Data 159

6-1 Stack Bonding................................................................................... 160

6-2 Stack Reverse Bonding..................................................................... 162

6-3 35µm Pad Pitch Bonding................................................................... 165

6-4 High Speed Bonding......................................................................... 167

6-5 Thin Die Reverse Bonding................................................................ 171

6-6 Setting Table...................................................................................... 174

6-7 Comparable Table with UTC-400 Series.............................................. 176

6-8 Comparable Table of Performance....................................................... 177

2. Chip Electrode (Pad) ........................................................................ 6

3. Lead Electrode (Lead) ...................................................................... 6

4. Metal Thin Wire .............................................................................. 7

1-2 Elements of the Wire Bonding....................................................... 9

2. 3 Elements of the Bonding .............................................................. 9

3. Bonding Force ................................................................................. 10

4. Output Ultrasonic Generating Power ............................................... 10

1–1 Wire Bonding

Bonding Concept fig.1-1

as operation with the narrow metallic wire

connections. Between the IC or LSI (a wafer chip

printed the integrated circuit: it also called as a

Silicon chip or Die embodied in the IC) chip

electrode, and the external electrode in the

leadframe is connected by the wire bonding.